FR3087369B1 - SOLDERING ALLOY AND USE OF SUCH ALLOY - Google Patents

SOLDERING ALLOY AND USE OF SUCH ALLOY Download PDF

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Publication number
FR3087369B1
FR3087369B1 FR1859694A FR1859694A FR3087369B1 FR 3087369 B1 FR3087369 B1 FR 3087369B1 FR 1859694 A FR1859694 A FR 1859694A FR 1859694 A FR1859694 A FR 1859694A FR 3087369 B1 FR3087369 B1 FR 3087369B1
Authority
FR
France
Prior art keywords
alloy
weight
soldering
bismuth
wetting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1859694A
Other languages
French (fr)
Other versions
FR3087369A1 (en
Inventor
Anne Marie Laugt
Aurelie Ducolombier
Marc Wary
Raphael Pesci
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dehon SA
Original Assignee
Dehon SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dehon SA filed Critical Dehon SA
Priority to FR1859694A priority Critical patent/FR3087369B1/en
Priority to PCT/EP2019/078217 priority patent/WO2020079151A1/en
Priority to EP19797183.1A priority patent/EP3867006A1/en
Priority to CN201980068588.5A priority patent/CN112867582A/en
Publication of FR3087369A1 publication Critical patent/FR3087369A1/en
Application granted granted Critical
Publication of FR3087369B1 publication Critical patent/FR3087369B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)

Abstract

Un alliage de brasure sans plomb ayant une composition comprenant 93%-98% en poids de bismuth (Bi), 1,5%-7% en poids d'argent (Ag) et 0,1-0,6% en poids de nickel (Ni). Un tel alliage présentant de bonne propriétés mécaniques, électriques ainsi que pour le mouillage.A lead-free solder alloy having a composition comprising 93% -98% by weight of bismuth (Bi), 1.5% -7% by weight of silver (Ag) and 0.1-0.6% by weight of nickel (Ni). Such an alloy having good mechanical and electrical properties as well as for wetting.

FR1859694A 2018-10-19 2018-10-19 SOLDERING ALLOY AND USE OF SUCH ALLOY Active FR3087369B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR1859694A FR3087369B1 (en) 2018-10-19 2018-10-19 SOLDERING ALLOY AND USE OF SUCH ALLOY
PCT/EP2019/078217 WO2020079151A1 (en) 2018-10-19 2019-10-17 Composite alloy for solder and use of such an alloy
EP19797183.1A EP3867006A1 (en) 2018-10-19 2019-10-17 Composite alloy for solder and use of such an alloy
CN201980068588.5A CN112867582A (en) 2018-10-19 2019-10-17 Composite solder alloy and use thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1859694A FR3087369B1 (en) 2018-10-19 2018-10-19 SOLDERING ALLOY AND USE OF SUCH ALLOY
FR1859694 2018-10-19

Publications (2)

Publication Number Publication Date
FR3087369A1 FR3087369A1 (en) 2020-04-24
FR3087369B1 true FR3087369B1 (en) 2021-06-04

Family

ID=65494361

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1859694A Active FR3087369B1 (en) 2018-10-19 2018-10-19 SOLDERING ALLOY AND USE OF SUCH ALLOY

Country Status (4)

Country Link
EP (1) EP3867006A1 (en)
CN (1) CN112867582A (en)
FR (1) FR3087369B1 (en)
WO (1) WO2020079151A1 (en)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000288772A (en) * 1999-02-02 2000-10-17 Nippon Genma:Kk Lead-free solder
JP3671815B2 (en) * 2000-06-12 2005-07-13 株式会社村田製作所 Solder composition and soldered article
EP1399600B1 (en) * 2001-05-28 2007-01-17 Honeywell International Inc. Compositions, methods and devices for high temperature lead-free solder
TW504427B (en) * 2001-09-25 2002-10-01 Honeywell Int Inc Composition, methods and devices for high temperature lead-free solder
CN101537545A (en) * 2008-03-21 2009-09-23 喜星素材株式会社 Lead-free alloy for low-temperature welding welder
CN101332544A (en) * 2008-05-28 2008-12-31 广州瀚源电子科技有限公司 High-melting point lead-free solder and production technique thereof
CN102233488A (en) * 2010-05-07 2011-11-09 宁波卓诚焊锡科技有限公司 Lead-free solder
KR20140063662A (en) * 2011-08-02 2014-05-27 알파 메탈즈, 인코포레이티드 Solder compositions
CN106392366B (en) * 2016-12-02 2019-07-19 北京康普锡威科技有限公司 A kind of BiSbAg system high temperature lead-free solder and preparation method thereof

Also Published As

Publication number Publication date
FR3087369A1 (en) 2020-04-24
CN112867582A (en) 2021-05-28
EP3867006A1 (en) 2021-08-25
WO2020079151A1 (en) 2020-04-23

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