FR3087369A1 - SOLDERING ALLOY AND USE OF SUCH AN ALLOY - Google Patents
SOLDERING ALLOY AND USE OF SUCH AN ALLOY Download PDFInfo
- Publication number
- FR3087369A1 FR3087369A1 FR1859694A FR1859694A FR3087369A1 FR 3087369 A1 FR3087369 A1 FR 3087369A1 FR 1859694 A FR1859694 A FR 1859694A FR 1859694 A FR1859694 A FR 1859694A FR 3087369 A1 FR3087369 A1 FR 3087369A1
- Authority
- FR
- France
- Prior art keywords
- weight
- alloy
- silver
- bismuth
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 90
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 71
- 239000000956 alloy Substances 0.000 claims abstract description 71
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052709 silver Inorganic materials 0.000 claims abstract description 38
- 239000004332 silver Substances 0.000 claims abstract description 38
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 30
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 30
- 229910000679 solder Inorganic materials 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims abstract description 6
- 238000005476 soldering Methods 0.000 claims description 16
- 238000005219 brazing Methods 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 238000009736 wetting Methods 0.000 abstract description 3
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
Abstract
Un alliage de brasure sans plomb ayant une composition comprenant 93%-98% en poids de bismuth (Bi), 1,5%-7% en poids d'argent (Ag) et 0,1-0,6% en poids de nickel (Ni). Un tel alliage présentant de bonne propriétés mécaniques, électriques ainsi que pour le mouillage. A lead-free solder alloy having a composition comprising 93% -98% by weight of bismuth (Bi), 1.5% -7% by weight of silver (Ag) and 0.1-0.6% by weight of nickel (Ni). Such an alloy having good mechanical and electrical properties as well as for wetting.
Description
ALLIAGE DE BRASURE ET UTILISATION D’UN TEL ALLIAGEBRAZING ALLOY AND USE OF SUCH AN ALLOY
DOMAINE TECHNIQUE GENERAL ET ART ANTERIEURGENERAL TECHNICAL AREA AND PRIOR ART
La présente invention concerne une composition d’alliage de brasure qui soit dépourvu de plomb.The present invention relates to a solder alloy composition which is free of lead.
De manière connue, pour fabriquer ou connecter des composants électroniques entre eux ou à une carte électronique, il est connu d’utiliser un alliage de brasure comportant du plomb et étain, qui a un haut point de fusion d'environ 300°C. Un tel alliage de brasure, par exemple Pb92.5Sn5Ag2.5, permet de réaliser des assemblages multiples et rapides. En particulier, un tel alliage permet de fabriquer des composants ou des premiers circuits imprimés qui seront ensuite eux-mêmes assemblés avec un alliage sans plomb avec une température de refusion plus basse.In known manner, to manufacture or connect electronic components to each other or to an electronic card, it is known to use a solder alloy comprising lead and tin, which has a high melting point of approximately 300 ° C. Such a brazing alloy, for example Pb92.5Sn5Ag2.5, makes it possible to produce multiple and rapid assemblies. In particular, such an alloy makes it possible to manufacture components or first printed circuits which will then themselves be assembled with a lead-free alloy with a lower reflow temperature.
Dans le domaine pétrolier, aéronautique, automobile ou autre, cet alliage ou les composants issus de cet alliage sont utilisés pour les applications à plus de 200°C On recherche donc un alliage ou un procédé ne refondant pas en-dessous de 230°C ou idéalement de 270°C et aussi fiable en termes de cyclages thermiques, de conductivité électrique et thermique et de résistance mécanique que l’alliage plombé.In the petroleum, aeronautic, automotive or other fields, this alloy or the components derived from this alloy are used for applications above 200 ° C. We are therefore looking for an alloy or a process that does not melt below 230 ° C or ideally 270 ° C and as reliable in terms of thermal cycling, electrical and thermal conductivity and mechanical resistance as the lead alloy.
Un but de l'invention est donc de fournir un alliage de brasure dont la température de fusion est supérieure à 230°C, de préférence à 270°C avec une bonne fiabilité pour une utilisation dans une variété de procédés de soudage, tels que brasage à la vague, brasage par refusion, brasage au trempé, brasage de fil et brasage sélectif.An object of the invention is therefore to provide a brazing alloy whose melting temperature is above 230 ° C, preferably 270 ° C with good reliability for use in a variety of welding processes, such as brazing wave soldering, reflow soldering, dip soldering, wire soldering and selective soldering.
PRESENTATION GENERALE DE L’INVENTIONGENERAL PRESENTATION OF THE INVENTION
A cet effet, l’invention concerne un alliage de brasure sans plomb ayant une composition comprenant :To this end, the invention relates to a lead-free solder alloy having a composition comprising:
93%-98% en poids de bismuth (Bi),93% -98% by weight of bismuth (Bi),
1,5%-7% en poids d'argent (Ag) et1.5% -7% by weight of silver (Ag) and
0,1 %-0,6% en poids de nickel (Ni).0.1% -0.6% by weight of nickel (Ni).
Un tel alliage est avantageux étant donné qu’il possède une température de fusion comprise entre 250°C et 280°C. En outre, l’alliage possède de très bonnes propriétés mécaniques et de mouillage.Such an alloy is advantageous since it has a melting temperature between 250 ° C and 280 ° C. In addition, the alloy has very good mechanical and wetting properties.
De manière préférée, l’alliage comprend uniquement du bismuth (Bi), de l'argent (Ag) et du nickel (Ni).Preferably, the alloy comprises only bismuth (Bi), silver (Ag) and nickel (Ni).
De préférence encore, l’alliage comprend 94%-96% en poids de bismuth (Bi), 3%-6% en poids d'argent (Ag) et 0,2%-0,5% en poids de nickel (Ni).More preferably, the alloy comprises 94% -96% by weight of bismuth (Bi), 3% -6% by weight of silver (Ag) and 0.2% -0.5% by weight of nickel (Ni ).
De manière préférée, l’alliage comprend 94%-96% en poids de bismuth (Bi).Preferably, the alloy comprises 94% -96% by weight of bismuth (Bi).
De préférence, l’alliage comprend 3%-6% en poids d'argent (Ag).Preferably, the alloy comprises 3% -6% by weight of silver (Ag).
De préférence, l’alliage comprend 0,2%-0,5% en poids de nickel (Ni).Preferably, the alloy comprises 0.2% -0.5% by weight of nickel (Ni).
Selon un aspect de l’invention, l’alliage comprend :According to one aspect of the invention, the alloy comprises:
95%-97% en poids de bismuth (Bi),95% -97% by weight of bismuth (Bi),
3%-4% en poids d'argent (Ag), et3% -4% by weight of silver (Ag), and
0,1 %-0,3% en poids de nickel (Ni).0.1% -0.3% by weight of nickel (Ni).
De manière préférée, l’alliage est constitué de :Preferably, the alloy consists of:
96% en poids de bismuth (Bi),96% by weight of bismuth (Bi),
3,8% en poids d'argent (Ag) et de3.8% by weight of silver (Ag) and
0,2% en poids de nickel (Ni).0.2% by weight of nickel (Ni).
Selon un aspect de l’invention, l’alliage comprend :According to one aspect of the invention, the alloy comprises:
95%-97% en poids de bismuth (Bi),95% -97% by weight of bismuth (Bi),
3%-4% en poids d'argent (Ag),3% -4% by weight of silver (Ag),
0,4%-0,6% en poids de nickel (Ni).0.4% -0.6% by weight of nickel (Ni).
De manière préférée, l’alliage est constitué dePreferably, the alloy consists of
96% en poids de bismuth (Bi),96% by weight of bismuth (Bi),
3,5% en poids d'argent (Ag) et de3.5% by weight of silver (Ag) and
0,5% en poids de nickel (Ni).0.5% by weight of nickel (Ni).
Selon un aspect de l’invention, l’alliage comprend :According to one aspect of the invention, the alloy comprises:
93%-95% en poids de bismuth (Bi),93% -95% by weight of bismuth (Bi),
5%-6% en poids d'argent (Ag) et5% -6% by weight of silver (Ag) and
0,1-0,3% en poids de nickel (Ni).0.1-0.3% by weight of nickel (Ni).
De manière préférée, l’alliage est constitué de :Preferably, the alloy consists of:
94% en poids de bismuth (Bi),94% by weight of bismuth (Bi),
5,8% en poids d'argent (Ag) et de5.8% by weight of silver (Ag) and
0,2% en poids de nickel (Ni).0.2% by weight of nickel (Ni).
Selon un aspect de l’invention, l’alliage comprend :According to one aspect of the invention, the alloy comprises:
94%-96% en poids de bismuth (Bi),94% -96% by weight of bismuth (Bi),
4%-5% en poids d'argent (Ag),4% -5% by weight of silver (Ag),
0,4%-0,6% en poids de nickel (Ni).0.4% -0.6% by weight of nickel (Ni).
De manière préférée, l’alliage est constitué dePreferably, the alloy consists of
95% en poids de bismuth (Bi),95% by weight of bismuth (Bi),
4,5% en poids d'argent (Ag) et de4.5% by weight of silver (Ag) and
0,5% en poids de nickel (Ni).0.5% by weight of nickel (Ni).
L’invention concerne aussi un alliage composite pour brasure comprenant un alliage de brasure tel que présenté précédemment et 5%-25% en poids de particules d’argent ou de cuivre. De manière préférée, l’alliage composite pour brasure est constitué uniquement d’un alliage de brasure et de particules d’argent ou de cuivre. Un tel alliage composite de brasure permet d’améliorer la conductivité thermique et électrique.The invention also relates to a composite alloy for brazing comprising a brazing alloy as presented above and 5% -25% by weight of silver or copper particles. Preferably, the composite alloy for brazing consists only of an alloy of brazing and particles of silver or copper. Such a composite alloy of solder improves the thermal and electrical conductivity.
De manière préférée, les particules d’argent ou de cuivre possèdent des dimensions comprises entre 1 et 30 micromètres.Preferably, the silver or copper particles have dimensions between 1 and 30 micrometers.
L’invention concerne en outre l’utilisation d'un alliage tel que présenté précédemment pour souder un boîtier de composants électroniques et / ou un dispositif de montage en surface (SMD) à un substrat, l'alliage étant appliqué au moyen de soudage à la vague ou brasage sélectif.The invention further relates to the use of an alloy as presented above for soldering a housing of electronic components and / or a surface mounting device (SMD) to a substrate, the alloy being applied by means of soldering. wave or selective soldering.
L’invention concerne en outre l’utilisation d'un alliage tel que présenté précédemment pour souder un boîtier de composants électroniques et / ou un dispositif de montage en surface (SMD) à un substrat, l'alliage étant appliqué sous forme de pâte.The invention further relates to the use of an alloy as presented above for soldering an electronic component box and / or a surface mounting device (SMD) to a substrate, the alloy being applied in the form of a paste.
L’invention concerne en outre l’utilisation d'un alliage tel que présenté précédemment pour un procédé de refusion de composants électroniques.The invention further relates to the use of an alloy as presented above for a process for remelting electronic components.
DESCRIPTION D’UN OU PLUSIEURS MODES DE REALISATION ET DE MISE EN OEUVREDESCRIPTION OF ONE OR MORE MODES OF IMPLEMENTATION AND IMPLEMENTATION
Il est proposé un alliage de brasure pour le brasage à la vague, pour le brasage sélectif et notamment pour un procédé de brasage de composants électroniques par refusion. Un tel alliage peut également être utilisé pour la fabrication ou la connexion de composants électroniques, notamment, des semiconducteurs.A brazing alloy is proposed for wave soldering, for selective soldering and in particular for a method of soldering electronic components by reflow. Such an alloy can also be used for the manufacture or connection of electronic components, in particular, semiconductors.
Selon l’invention, il est proposé un alliage de brasure sans plomb ayant une composition comprenant :According to the invention, there is provided a lead-free solder alloy having a composition comprising:
93%-98% en poids de bismuth (Bi),93% -98% by weight of bismuth (Bi),
1,5%-7% en poids d'argent (Ag) et1.5% -7% by weight of silver (Ag) and
0,1 %-0,6% en poids de nickel (Ni).0.1% -0.6% by weight of nickel (Ni).
Un tel alliage de brasure présente un point de fusion qui se situe entre 260°C et 275°C et présente des très bonnes propriétés dans les domaines mécaniques, électrique et de mouillage. En outre, l’absence de plomb permet de respecter les nouvelles normes environnementales.Such a brazing alloy has a melting point which is between 260 ° C and 275 ° C and has very good properties in the mechanical, electrical and wetting fields. In addition, the absence of lead makes it possible to comply with the new environmental standards.
Après une phase de test, quatre alliages de brasure particuliers ont été sélectionnés :After a test phase, four particular brazing alloys were selected:
- Bi96Ag3,8NiO,2- Bi96Ag3,8NiO, 2
- Bi96Ag3,5NiO,5- Bi96Ag3,5NiO, 5
- Bi94Ag5,8NiO,2- Bi94Ag5,8NiO, 2
- Bi95Ag4,5NiO,5.- Bi95Ag4,5NiO, 5.
Ces alliages de brasure possèdent des températures de fusion et des diagrammes de phase qui sont optimaux pour mettre en œuvre un procédé de refusion.These brazing alloys have melting temperatures and phase diagrams which are optimal for implementing a reflow process.
L’alliage Bi96Ag3,8NiO,2 est constitué de :The Bi96Ag3,8NiO, 2 alloy consists of:
96% en poids de bismuth (Bi),96% by weight of bismuth (Bi),
3,8% en poids d'argent (Ag) et de3.8% by weight of silver (Ag) and
0,2% en poids de nickel (Ni).0.2% by weight of nickel (Ni).
L’alliage Bi96Ag3,5NiO,5 est constitué deThe alloy Bi96Ag3,5NiO, 5 consists of
96% en poids de bismuth (Bi),96% by weight of bismuth (Bi),
3,5% en poids d'argent (Ag) et de3.5% by weight of silver (Ag) and
0,5% en poids de nickel (Ni).0.5% by weight of nickel (Ni).
L’alliage Bi94Ag5,8NiO,2 est constitué de :The Bi94Ag5,8NiO, 2 alloy consists of:
94% en poids de bismuth (Bi),94% by weight of bismuth (Bi),
5,8% en poids d'argent (Ag) et de5.8% by weight of silver (Ag) and
0,2% en poids de nickel (Ni).0.2% by weight of nickel (Ni).
L’alliage Bi95Ag4,5NiO,5 est constitué deThe alloy Bi95Ag4,5NiO, 5 consists of
95% en poids de bismuth (Bi),95% by weight of bismuth (Bi),
4,5% en poids d'argent (Ag) et de4.5% by weight of silver (Ag) and
0,5% en poids de nickel (Ni).0.5% by weight of nickel (Ni).
Bien que l'utilisation en tant que pâte à braser soit particulièrement préférée, l'alliage peut être utilisé en soudage à la vague, brasage sélectif, brasage au trempé, en tant que partie de fil, pour le placement de CMS et pour des applications pâte-en-pâte.Although use as solder paste is particularly preferred, the alloy can be used in wave soldering, selective soldering, dip soldering, as part of wire, for placement of CMS and for applications dough-in-dough.
De manière préférée, l’alliage est conditionné sous forme de barres, de préformes, de lingots, de poudre, de pâte à braser ou de crème à braser.Preferably, the alloy is packaged in the form of bars, preforms, ingots, powder, solder paste or solder cream.
De manière optionnelle, pour rendre une brasure plus conductrice thermiquement et électriquement, afin de faciliter notamment la dissipation de chaleur au niveau de la jonction, il est proposé de mélanger à l’alliage selon l’invention avec des particules d’argent ou de cuivre ayant une dimension comprise entre 1 et 30 micromètres afin de former un alliage composite. De préférence, des particules d’argent ou de cuivre sont ajoutées à hauteur de 5 à 25% en poids du mélange. Ces particules d’argent ou de cuivre contribuent à augmenter la conductivité thermique et électrique afin de faciliter notamment la dissipation de chaleur au niveau de la jonction avec des composants électroniques.Optionally, to make a solder more thermally and electrically conductive, in order to facilitate in particular the dissipation of heat at the junction, it is proposed to mix the alloy according to the invention with silver or copper particles having a dimension between 1 and 30 micrometers in order to form a composite alloy. Preferably, silver or copper particles are added in an amount of 5 to 25% by weight of the mixture. These silver or copper particles help to increase thermal and electrical conductivity, in particular to facilitate heat dissipation at the junction with electronic components.
Claims (18)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1859694A FR3087369B1 (en) | 2018-10-19 | 2018-10-19 | SOLDERING ALLOY AND USE OF SUCH ALLOY |
| EP19797183.1A EP3867006A1 (en) | 2018-10-19 | 2019-10-17 | Composite alloy for solder and use of such an alloy |
| CN201980068588.5A CN112867582A (en) | 2018-10-19 | 2019-10-17 | Composite solder alloy and use thereof |
| PCT/EP2019/078217 WO2020079151A1 (en) | 2018-10-19 | 2019-10-17 | Composite alloy for solder and use of such an alloy |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1859694A FR3087369B1 (en) | 2018-10-19 | 2018-10-19 | SOLDERING ALLOY AND USE OF SUCH ALLOY |
| FR1859694 | 2018-10-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR3087369A1 true FR3087369A1 (en) | 2020-04-24 |
| FR3087369B1 FR3087369B1 (en) | 2021-06-04 |
Family
ID=65494361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1859694A Active FR3087369B1 (en) | 2018-10-19 | 2018-10-19 | SOLDERING ALLOY AND USE OF SUCH ALLOY |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3867006A1 (en) |
| CN (1) | CN112867582A (en) |
| FR (1) | FR3087369B1 (en) |
| WO (1) | WO2020079151A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2810051A1 (en) * | 2000-06-12 | 2001-12-14 | Murata Manufacturing Co | Leadless solder composition with a bismuth base and the addition of two other metal elements to provide solder for use on fragile substrates such as glass |
| EP1429884B1 (en) * | 2001-09-25 | 2006-06-21 | Honeywell International, Inc. | Improved compositions, methods and devices for high temperature lead-free solder |
| EP1705258A2 (en) * | 2001-05-28 | 2006-09-27 | Honeywell International, Inc. | Composition, methods and devices for high temperature lead-free solder |
| WO2009143677A1 (en) * | 2008-05-28 | 2009-12-03 | 广州瀚源电子科技有限公司 | High melting point lead-free solder and production process thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000288772A (en) * | 1999-02-02 | 2000-10-17 | Nippon Genma:Kk | Lead-free solder |
| CN101537545A (en) * | 2008-03-21 | 2009-09-23 | 喜星素材株式会社 | Lead-free alloy for low-temperature welding welder |
| CN102233488A (en) * | 2010-05-07 | 2011-11-09 | 宁波卓诚焊锡科技有限公司 | Lead-free solder |
| WO2013017885A2 (en) * | 2011-08-02 | 2013-02-07 | Fry's Metals, Inc. | Solder compositions |
| CN106392366B (en) * | 2016-12-02 | 2019-07-19 | 北京康普锡威科技有限公司 | A kind of BiSbAg system high temperature lead-free solder and preparation method thereof |
-
2018
- 2018-10-19 FR FR1859694A patent/FR3087369B1/en active Active
-
2019
- 2019-10-17 EP EP19797183.1A patent/EP3867006A1/en active Pending
- 2019-10-17 WO PCT/EP2019/078217 patent/WO2020079151A1/en unknown
- 2019-10-17 CN CN201980068588.5A patent/CN112867582A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2810051A1 (en) * | 2000-06-12 | 2001-12-14 | Murata Manufacturing Co | Leadless solder composition with a bismuth base and the addition of two other metal elements to provide solder for use on fragile substrates such as glass |
| EP1705258A2 (en) * | 2001-05-28 | 2006-09-27 | Honeywell International, Inc. | Composition, methods and devices for high temperature lead-free solder |
| EP1429884B1 (en) * | 2001-09-25 | 2006-06-21 | Honeywell International, Inc. | Improved compositions, methods and devices for high temperature lead-free solder |
| WO2009143677A1 (en) * | 2008-05-28 | 2009-12-03 | 广州瀚源电子科技有限公司 | High melting point lead-free solder and production process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3867006A1 (en) | 2021-08-25 |
| FR3087369B1 (en) | 2021-06-04 |
| CN112867582A (en) | 2021-05-28 |
| WO2020079151A1 (en) | 2020-04-23 |
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