EP3852199B1 - Borne hermétique - Google Patents

Borne hermétique Download PDF

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Publication number
EP3852199B1
EP3852199B1 EP19861121.2A EP19861121A EP3852199B1 EP 3852199 B1 EP3852199 B1 EP 3852199B1 EP 19861121 A EP19861121 A EP 19861121A EP 3852199 B1 EP3852199 B1 EP 3852199B1
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EP
European Patent Office
Prior art keywords
tube body
ceramic substrate
hermetic terminal
terminal according
alloy
Prior art date
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Application number
EP19861121.2A
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German (de)
English (en)
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EP3852199A1 (fr
EP3852199A4 (fr
Inventor
Haruka OOMURA
Koichi IWAMOTO
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Kyocera Corp
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Kyocera Corp
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Publication of EP3852199A4 publication Critical patent/EP3852199A4/fr
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/53—Bases or cases for heavy duty; Bases or cases for high voltage with means for preventing corona or arcing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/73—Means for mounting coupling parts to apparatus or structures, e.g. to a wall
    • H01R13/74—Means for mounting coupling parts in openings of a panel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/504—Bases; Cases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together

Definitions

  • the present disclosure relates to a hermetic terminal.
  • hermetic terminals used in a vacuum equipment, a nuclear equipment, or the like a contact pin 21, a heat-resistant insulator 22, and a pipe flange (tube body) 23 are hermetically connected to each other as a hermetic terminal 30 shown in Fig. 5 to obtain a high leakage resistance, and the connecting is performed by brazing or the like, and it is required to have a necessary mechanical strength, and withstand impact and high temperature sufficiently.
  • alumina is used as the heat-resistant insulator 22, its surface is metallized, it is hermetically connected to the contact pin 21 and the pipe flange 23 by brazing, and to reduce difference of thermal expansion coefficients of the contact pin 21 and the pipe flange 23 with respect to the alumina, the contact pin 22 and the pipe flange 23 are normally formed by an iron-nickel alloy or an iron-nickel cobalt alloy.
  • Non-Patent Document 1 a multi-pole terminal is used as a hermetic terminal for extracting signal of a liquid hydrogen tank of a rocket.
  • Patent Document 1 Japanese Patent Publication No. 2519642
  • JP2005235577A discloses a hermetic terminal according to the preamble of claim 1.
  • Non-Patent Document 1 Hajime Ishimaru, Hermetic Seal for Low Temperature, TEION KOGAKU 17(1), pp. 61-62 (1982 )
  • a hermetic terminal of the present disclosure includes a plate-shaped ceramic substrate in a plate shape provided with a through hole for inserting a columnar conductive member in a thickness direction, a first tube body surrounding the ceramic substrate, and a second tube body coaxially connected with the first tube body , and the first tube body includes a fernico-type alloy, an Fe-Ni alloy, an Fe-Ni-Cr-Ti-Al alloy, an Fe-Cr-Al alloy or an Fe-Co-Cr alloy, and the second tube body includes an austenitic stainless steel with a nickel content of 10.4 mass% or more.
  • FIG. 1(a) is a perspective view at a side of a first tube body
  • FIG. 1(b) is a perspective view at a side of a second tube body, illustrating one embodiment of a hermetic terminal of the present disclosure.
  • FIG. 2(a) is a drawing illustrating one embodiment of a sectional view along an axis direction of the first tube body and the second tube body
  • FIG. 2(b) is a side view of FIG. 2(a)
  • FIG. 2(c) is a sectional view illustrating one embodiment enlarging the part A shown in FIG. 2(a)
  • FIG. 2(d) is a sectional view illustrating another embodiment enlarging the part A shown in FIG. 2(a)
  • FIG. 2(e) is a sectional view illustrating one embodiment enlarging the part B shown in FIG. 2(a) , illustrating the hermetic terminal of FIG. 1 .
  • a hermetic terminal 20 illustrated in FIGs. 1 and 2 includes a plate shape ceramic substrate 3 provided with a through hole 2 for inserting a columnar conductive member 1 in a thickness direction, a first tube body 4 surrounding the ceramic substrate 3, and a second tube body 5 coaxially connected with the first tube body 4.
  • the conductive member 1 includes a columnar base part 1a inserted into the through hole 2, and a collar part 1b opposing to the ceramic substrate 3 on the midway in an axis direction of the columnar base part 1a.
  • the conductive member 1 includes a fernico-type alloy, an Fe-Ni alloy, an Fe-Ni-Cr-Ti-Al alloy, an Fe-Co-Cr alloy or an Fe-Cr-Al alloy
  • the ceramic substrate 3 includes ceramics including aluminum oxide as a main component
  • the conductive member 1 is supported by the ceramic substrate 3 provided with a metallized layer 10 formed on the surface by a brazing material including silver such as BAg-8, BAg-8A, BAg-8B or the like as a main component.
  • main component in the ceramics denotes a component of 85 mass% or more in 100 mass% of the components constituting the ceramics
  • main component in the brazing material denotes a component of 60 mass% or more in 100 mass% of the components constituting the brazing material.
  • the ceramics may include at least one of silicon, calcium and magnesium as an oxide in addition to aluminum oxide which is a main component.
  • the components constituting the ceramics may be identified by using an X-ray diffractometer (XRD), and then the content of components may be determined by using an X-ray fluorescent analyzer (XRF) or an ICP emission spectrometer (ICP), and converted it into the content of the identified components.
  • XRD X-ray diffractometer
  • XRF X-ray fluorescent analyzer
  • ICP ICP emission spectrometer
  • the content of the components constituting the brazing material may be determined by using an X-ray fluorescent analyzer (XRF) or an ICP emission spectrometer (ICP).
  • XRF X-ray fluorescent analyzer
  • ICP ICP emission spectrometer
  • the first tube body 4 includes a shaft part 4a and a head part 4b having an outer diameter larger than the outer diameter of the shaft part 4a.
  • the second tube body 5 includes a shaft part 5a and a head part 5b having an outer diameter larger than the outer diameter of the shaft part 5a.
  • the hermetic terminal 20 includes a flange 6 provided with a plurality of through holes 6a for inserting the second tube body 5, and a plurality of through holes 6b for inserting fastening members such as bolts or the like on the outer peripheral side to fix a storage container for low temperature liquid or the like (not shown).
  • the flange 6, for example, includes an austenitic stainless steel.
  • the flange 6 surrounds the shaft part 4a of the first tube body 4 and the shaft part 5a of the second tube body 5, and separates an environment different on the left and right sides with the flange 6 as a boundary.
  • the side of the head part 4b of the head part 4b and the shaft part 4a of the first tube body 4 located on the left side of the ceramic substrate 3 is used in an environment exposed to the atmosphere
  • the second tube body 5 located on the right side of the ceramic substrate 3 is used in an environment exposed to liquid hydrogen.
  • the shaft part 4a of the first tube body 4 located on the right side of the ceramic substrate 3 is configured not to be directly exposed to the liquid hydrogen by the second tube body 5.
  • the first tube body 4 includes a fernico alloy, an Fe-Ni alloy, an Fe-Ni-Cr-Ti-Al alloy, an Fe-Cr-Al alloy or an Fe-Co-Cr alloy
  • the second tube body 5 includes an austenitic stainless steel with a nickel content of 10.4 mass% or more.
  • the first tube body 4 includes the above-described alloys, even if heating and cooling are repeated, linear expansion coefficients of these alloys have a small difference from a linear expansion coefficient of aluminum oxide, so residual stress is less likely to accumulate in the ceramic substrate 3, and thus cracks are less likely to occur in the ceramic substrate 3. Additionally, if the second tube body 5 includes the austenitic stainless steel with the nickel content of 10.4 mass% or more, it is less likely to be embrittled by hydrogen and can therefore be used for a long period of time.
  • the second tube body 5 includes, for example, SUS310S, SUS316L, SUS316LN, SUS316J1L or SUS317L.
  • the first tube body 4 and the second tube body 5 are both circular cylindrical bodies, and the ceramic substrate 3 is a disk, but the first tube body 4 and the second tube body 5 may be both square cylindrical bodies, and the ceramic substrate 3 may be a square plate.
  • an end of the second tube body 5 on the side of the first tube body 4 includes a step surface 5c.
  • an end of the first tube body 4 on the side of the second tube body 5 includes a step surface 4c.
  • At least one of the end of the second tube body 5 on the side of the first tube body 4 and the end of the first tube body 4 on the side of the second tube body 5 may include the step surfaces 4c and 5c.
  • the step surface 5c is included on the outer peripheral surface of the second tube body 5, but the step surface may be included on the inner peripheral surface of the second tube body 5.
  • the step surface 4c is included on the outer peripheral surface of the first tube body 4, but the step surface may be included on the inner peripheral surface of the first tube body 4.
  • FIG. 3 is a sectional view illustrating another embodiment enlarging the part A of the hermetic terminal shown in FIG. 2 .
  • the second tube body 5 may include a coating layer 5d composed of nickel, copper or a copper-nickel alloy as a main component at least on a connecting part with the first tube body 4.
  • the first tube body 4 and the second tube body 5 can be connected firmly by a connecting layer 7 including a brazing material, and thus reliability is improved.
  • the second tube body 5 may include the coating layer 5d composed of nickel, copper or a copper-nickel alloy as a main component on at least one of the surfaces exposed to the liquid hydrogen such as the inner peripheral surface, the outer peripheral surface, and the end surface in addition to the connecting part.
  • embrittlement due to hydrogen of the austenitic stainless steel constituting the second tube body 5 can be delayed, so that it can be used for a longer period of time.
  • the second tube body 5 shown in FIG. 3 includes the coating layer 5d on the inner peripheral surface, the outer peripheral surface, and the end surface.
  • the first tube body 4 may include a coating layer 4d composed of nickel, copper or a copper-nickel alloy as a main component at least on a connecting part with the second tube body 5.
  • the first tube body 4 and the second tube body 5 can be connected firmly by a brazing material, and thus reliability is improved.
  • the inner peripheral surface of the first tube body 4 may be located outward rather than the outer peripheral surface of the second tube body 5.
  • the first tube body 4 has a linear expansion coefficient smaller than the second tube body 5, so the gap is less likely to expand even if heating and cooling are repeated, and thus the volatilized hydrogen is less likely to leak to the outside through the internal space of the first tube body 4.
  • the second tube body 5 includes the step surface 5c on the end of the second tube body 5 on the side of the first tube body 4, the outer peripheral surface corresponds to the step surface 5c.
  • the flange 6 connected to the outer peripheral surface of the second tube body 5 and surrounding the second tube body 5 may be further included.
  • the flange 6 includes a second recessed part 6d at the side of the second tube body 5, a collar part 8 having a U-shaped cross section along an axial direction of the second tube body 5 is attached to the second recessed part 6d, and the second tube body 5 and the flange 6 are connected via the collar part 8.
  • the collar part 8 may include a coating layer (not shown) including nickel, copper or a copper-nickel alloy as a main component at least on the connecting part with the second tube body 5, and the coating layer (not shown) may be included on entire surface of the collar part 8.
  • a coating layer including nickel, copper or a copper-nickel alloy as a main component at least on the connecting part with the second tube body 5, and the coating layer (not shown) may be included on entire surface of the collar part 8.
  • main component in the coating layer denotes a component of 88 mass% or more in 100 mass% of the components constituting the coating layer, and may include phosphorus or the like in addition to the main component. If the coating layer including the copper-nickel alloy as a main component, the total content of copper and nickel is the content of the main component.
  • the content of the components in the coating layer may be determined by using an X-ray fluorescent analyzer (XRF) or an ICP emission spectrometer (ICP).
  • XRF X-ray fluorescent analyzer
  • ICP ICP emission spectrometer
  • the collar part 8 and the second tube body 5 are connected by the brazing material including silver such as BAg-8, BAg-8A, BAg-8B or the like as a main component, and the flange 6 and the collar part 8 are welded by a TIG (Tungsten Inert Gas) welding method, and this welding is performed after each member is connected with the brazing material.
  • the brazing material including silver such as BAg-8, BAg-8A, BAg-8B or the like as a main component
  • the flange 6 includes a first recessed part 6c at the side of the first tube body 4, and it is preferable that the connecting part between the ceramic substrate 3 and the first tube body 4 is located away from the second tube body 5 than a bottom surface 6c1 of the first recessed part 6c (that is, in FIG. 2(a) , it is preferable that the connecting part between the ceramic substrate 3 and the first tube body 4 is located on the left side of the drawing with respect to a virtual plane where the bottom surface 6c1 of the first recessed part 6c is located, and the second tube body 5 is located on the right side of the drawing with respect to the virtual plane).
  • the connecting part between the ceramic substrate 3 and the first tube body 4 is at this position, the heat generated by welding is less likely to be transferred to the ceramic substrate 3, so that residual stress is less likely to be generated in the ceramic substrate 3, and cracks are less likely to occur in the ceramic substrate 3.
  • the first recessed part 6c is a counterbore for facilitating the attachment of the first tube body 4.
  • the collar part 8 may include the austenitic stainless steel with the nickel content of 10.4 mass% or more. If the collar part 8 has such a configuration, it is less likely to be embrittled by hydrogen and can therefore be used for a long period of time.
  • the collar part 8 includes, for example, SUS310S, SUS316L, SUS316LN, SUS316J1L or SUS317L.
  • the nickel content in the second tube body 5 and the collar part 8 can be measured by using an ICP (Inductively Coupled Plasma) emission spectrometer or an X-ray fluorescent analyzer (XRF).
  • ICP Inductively Coupled Plasma
  • XRF X-ray fluorescent analyzer
  • FIG. 4(a) is a drawing illustrating another embodiment of a sectional view along the axis direction of the first tube body and the second tube body
  • FIG. 4(b) is a side view of FIG. 4(a)
  • FIG. 4(c) is a sectional view illustrating one embodiment enlarging the part A shown in FIG. 4(a)
  • FIG. 4(d) is a sectional view illustrating another embodiment enlarging the part A shown in FIG. 4(a)
  • FIG. 4(e) is a sectional view illustrating one embodiment enlarging the part B shown in FIG. 4(a) , illustrating the hermetic terminal of FIG. 1 .
  • a plurality of conductive members 1 are individually inserted into a plurality of through holes 2, and the ceramic substrate 3 includes step parts 9 (9a, 9b) recessed from at least one of the main surfaces 3b, 3c around the through holes 2.
  • the ceramic substrate 3 includes the step parts 9 recessed from both of the main surfaces 3b, 3c around the through holes 2, and one of the step parts 9a further includes a metallized layer 10 on the step surface, and the step part 9a on the side provided with the metallized layer 10 may be deeper than the step part 9b on the side not provided with the metallized layer 10.
  • the metallized layer 10 is for fixing the conductive member 1 to the ceramic substrate 3 by brazing, and the thickness thereof is, for example, 5 um or more and 55 um or less.
  • the step part 9a on the side provided with the metallized layer 10 is deeper than the step part 9b on the side provided with the metallized layer 10, the creepage distance between the columnar base parts 1a of the conductive members 1 adjacent to each other can be lengthened, so that even if the metallized layer 10 is made thicker, generation of creepage discharge between the conductive members 1 can be suppressed.
  • the depth of the step part 9a is a distance from the main surface to the step surface, and it does not include the thickness of the metallized layer 10.
  • the depth of the step part 9a on the side provided with the metallized layer 10 may be 45% or less of the thickness of the ceramic substrate 3. If the depth of the step part 9a is in this range, mechanical strength of the ceramic substrate 3 around the through holes 2 can be ensured.
  • the thickness of the ceramic substrate 3 is a distance between both main surfaces 3b, 3c of the ceramic substrate 3.
  • the plurality of conductive members 1 are individually inserted into the plurality of through holes 2, and the ceramic substrate 3 includes a protrusion part 3a extending from at least one of the main surfaces (the main surface 3c in the example shown in FIG. 2 ) around the through holes 2.
  • the metallized layer 10 opposing to the conductive member 1 can be lengthened, so that reliability of the connecting of the conductive member 1 to the ceramic substrate 3 can be increased.
  • the ceramic substrate 3 includes a plurality of open pores on the step surface where the metallized layer 10 is included or the tip end surface of the protrusion part 3a, and the value obtained by subtracting an average value of the equivalent circle diameters of the open pores from the distance between the centers of gravity of the open pores may be 20 um or more and 50 um or less.
  • the value obtained by subtracting the average value of the equivalent circle diameters of the open pores from the distance between the centers of gravity of the open pores is 20 um or more, it becomes difficult for the open pores to communicate with each other even if used in an environment where heating and cooling are repeated, so that the mechanical strength can be maintained, and cracks are less likely to occur in the metallized layer 10. Further, if the value obtained by subtracting the average value of the equivalent circle diameters of the open pores from the distance between the centers of gravity of the open pores is 50 um or less, the density of the open pores is increased, so that an anchor effect of the metallized layer 10 to the ceramic substrate 3 is improved, and adhesion strength of the metallized layer 10 is increased.
  • the mechanical strength of the ceramic substrate 3 can be maintained, cracks can be suppressed in the metallized layer 10, and the adhesion strength of the metallized layer 10 can be improved.
  • the step surface of the ceramic substrate 3 or the tip end surface of the protrusion part 3a is polished with diamond abrasive grains to obtain a mirror surface.
  • an arithmetic mean roughness Ra of the mirror surface is set to 0.2 um or less by using a measurement method in accordance with JIS B 0601: 2013.
  • a part where the size and distribution of the open pores are observed on average is selected from the mirror surface, and an optical microscope is used with a magnification of 200 times to measure an area of, for example, 1.5 ⁇ 10 5 ⁇ m 2 as a measurement area.
  • a method called a distance between centers of gravity of an image analysis software "A-ZOKUN (ver 2.52)" (registered trademark, produced by Asahi Kasei Engineering Corporation, and hereinafter, indicated by the image analysis software) is applied, and the distance between the centers of gravity of the open pores adjacent to each other can be obtained.
  • the distance between the centers of gravity of the open pores in the present disclosure is a linear distance connecting the centers of gravity of the open pores.
  • a threshold value should be set in such a way that a marker appearing on the screen matches the shape of the open pore.
  • the threshold value is, for example, 155.
  • a first tube body, a second tube body, and a ceramic substrate in which a conductive member is inserted into a through hole are prepared.
  • the ceramic substrate can be obtained by the following manufacturing method.
  • aluminum oxide powder which is the main component, magnesium hydroxide, silicon oxide, calcium carbonate, and zirconium oxide powders, a dispersant to disperse the aluminum oxide powder as needed, and an organic binder are wet-mixed by a ball mill, a bead mill, or a vibration mill to obtain a slurry.
  • the mean particle size (D 50 ) of the aluminum oxide powder is 3 um or less, preferably 1 um or less, and in a total of 100 mass% of the above-described powders, the content of the magnesium hydroxide powder is 0.87 mass% to 1.07 mass%, the content of the silicon oxide powder is 6.1 mass% to 7.5 mass%, the content of the calcium carbonate powder is 2.5 mass% to 3.1 mass%, and the content of the zirconium oxide is 1.0 mass% to 1.3 mass%.
  • the time for wet mixing is, for example, 40 to 50 hours.
  • the organic binder include paraffin wax, wax emulsion (wax and emulsifier), PVA (polyvinyl alcohol), PEG (polyethylene glycol), and PEO (polyethylene oxide).
  • the slurry obtained by the above-described method is spray-granulated to obtain granules, and then the granules are molded by a powder press molding method or a cold isostatic pressing method to obtain a molded body in a disk shape.
  • a ceramic substrate can be obtained by forming a through hole and step parts or a protrusion part by a cutting process, and sintering the molded body in which the through holes and the like are formed at a temperature of 1550°C or more and 1750°C or less.
  • a molded body is manufactured by the cold isostatic pressing method with a molding pressure of 98 MPa or more and 147 MPa or less, and sintered at a temperature of 1580°C or more and 1750°C or less.
  • a coating layer composed of nickel, copper, or a copper-nickel alloy as a main component may be formed in advance on at least one of the connecting part of the conductive member with the ceramic substrate, the connecting part of the first tube body with the second tube body, the connecting part of the first tube body with the ceramic substrate, the connecting part of the second tube body with the first tube body, and the connecting part of the ceramic substrate with the first tube body by a plating method.
  • the above-described coating layer may be formed on the entire surface of each of the conductive member, the first tube body, and the second tube body.
  • the above-described coating layer may be formed on the step surface.
  • the metallized layer may be formed in advance by a Mo-Mn method, and then a coating layer composed of nickel, copper or the copper-nickel alloy as a main component by the plating method.
  • the above-described coating layer may be formed on the entire outer peripheral surface of the ceramic substrate.
  • the appropriate temperature is the brazing temperature described in JIS Z 3281: 1998.
  • a hermetic terminal provided with a flange, a first tube body, a ceramic substrate in which a conductive member is inserted into a through hole, and a second tube body to which a collar part is attached are prepared.
  • the flange is attached to the outer peripheral side of the collar part, and the hermetic terminal of the present disclosure can be obtained by welding and fixing by the TIG (Tungsten Inert Gas) welding method.
  • TIG Tungsten Inert Gas
  • the hermetic terminals of the present disclosure obtained by the above-mentioned manufacturing method have high embrittlement to hydrogen, and can therefore be used for a long period of time.
  • the present invention is not limited to the foregoing embodiment.
  • the second tube body 5 is connected to the flange 6 via the collar part 8 is shown, but the second tube body 5 may be directly connected to the flange 6.
  • the collar part 8 has a U-shaped cross section is shown, but the collar part 8 may have another shape such as an L-shaped cross section or the like. If the collar part 8 has a U-shape, an L-shape, or the like, the bent part may be curved.
  • the collar part 8 is connected to the second recessed part 6d of the flange 6 is shown, but the flange 6 may not include the second recessed part 6d, and the collar part 8 may be connected to the inner peripheral surface of the flange 6 or the main surface at the side of the second tube body 5.

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  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Ceramic Products (AREA)
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Claims (12)

  1. Borne hermétique (20) comprenant un substrat céramique (3) en forme de plaque pourvu d'un trou de passage (2) pour l'insertion d'un élément conducteur (1) en forme de colonne dans un sens d'épaisseur, un premier corps de tube (4) entourant le substrat céramique, le premier corps de tube comprenant un alliage de type fernico, un alliage Fe-Ni, un alliage Fe-Ni-Cr-Ti-Al, un alliage Fe-Cr-Al ou un alliage Fe-Co-Cr, et caractérisée en outre en comprenant un deuxième corps de tube (5) connecté coaxialement au premier corps de tube, le deuxième corps de tube comprenant un acier inoxydable austénitique avec une teneur en nickel de 10,4 % en masse ou plus.
  2. Borne hermétique selon la revendication 1, dans laquelle au moins l'une parmi l'extrémité du deuxième corps de tube sur le côté du premier corps de tube et l'extrémité du premier corps de tube sur le côté du deuxième corps de tube a une surface en gradin (4c, 5c).
  3. Borne hermétique selon la revendication 1 ou 2, dans laquelle le deuxième corps de tube est pourvu d'une couche de revêtement (5d) composée de nickel, de cuivre ou d'un alliage cuivre-nickel comme composant principal au moins sur une partie de connexion avec le premier corps de tube.
  4. Borne hermétique selon l'une quelconque des revendications 1 à 3, dans laquelle une surface périphérique intérieure du premier corps de tube est située vers l'extérieur plutôt qu'une surface périphérique extérieure du deuxième corps de tube.
  5. Borne hermétique selon l'une quelconque des revendications 1 à 4, comprenant en outre une bride (6) reliée à la surface périphérique extérieure du deuxième corps de tube et entourant le deuxième corps de tube.
  6. Borne hermétique selon la revendication 5, dans laquelle la bride est pourvue d'une deuxième partie en retrait (6d) sur le côté du deuxième corps de tube, une partie de col (8) ayant une section transversale en forme de U le long d'une direction axiale du deuxième corps de tube est fixée à la deuxième partie en retrait, et le deuxième corps de tube et la bride sont connectés l'un à l'autre par l'intermédiaire de la partie de col, et dans laquelle la bride est pourvue d'une première partie en retrait (6c) sur le côté du premier corps de tube, et une partie de connexion entre le substrat céramique et le premier corps de tube est située plus loin du deuxième corps de tube qu'une surface inférieure (6c1) de la première partie en retrait.
  7. Borne hermétique selon la revendication 6, dans laquelle la partie de col comprend un acier inoxydable austénitique avec une teneur en nickel de 10,4 % en masse ou plus.
  8. Borne hermétique selon l'une quelconque des revendications 1 à 7, dans laquelle une pluralité des éléments conducteurs sont insérés individuellement dans une pluralité des trous de passage, et le substrat céramique est pourvu de parties en gradin (9) en retrait d'au moins une des surfaces principales autour des trous de passage.
  9. Borne hermétique selon la revendication 8, dans laquelle le substrat céramique comprend les parties en gradin en retrait des deux surfaces principales autour des trous de passage, l'une des parties en gradin est en outre pourvue d'une couche métallisée (10) sur la surface en gradin, et la partie en gradin sur le côté pourvu de la couche métallisée est plus profonde que la partie en gradin sur le côté qui n'est pas pourvu de la couche métallisée.
  10. Borne hermétique selon la revendication 9, dans laquelle une profondeur de la partie en gradin (9a) sur le côté pourvu de la couche métallisée est 45% ou moins d'une épaisseur du substrat céramique.
  11. Borne hermétique selon l'une quelconque des revendications 1 à 7, dans laquelle la pluralité d'éléments conducteurs sont insérés individuellement dans la pluralité de trous de passage, et le substrat céramique est pourvu d'une partie saillante (3a) s'étendant à partir d'au moins l'une des surfaces principales autour des trous de passage.
  12. Borne hermétique selon l'une quelconque des revendications 9 à 11, dans laquelle le substrat céramique est pourvu d'une pluralité de pores ouverts sur la surface en gradin pourvue de la couche métallisée ou une surface d'extrémité de pointe de la partie saillante, et une valeur obtenue en soustrayant une valeur moyenne de diamètres de cercle équivalents des pores ouverts d'une distance entre des centres de gravité des pores ouverts est de 20 um ou plus et de 50 um ou moins.
EP19861121.2A 2018-09-11 2019-09-10 Borne hermétique Active EP3852199B1 (fr)

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PCT/JP2019/035503 WO2020054703A1 (fr) 2018-09-11 2019-09-10 Borne hermétique

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JPS6074479U (ja) * 1983-10-28 1985-05-25 京セラ株式会社 真空端子
JPH0212682A (ja) * 1988-06-30 1990-01-17 Canon Inc 記憶媒体
JP2543759Y2 (ja) * 1991-04-10 1997-08-13 京セラ株式会社 真空端子
JP2519642B2 (ja) 1992-11-24 1996-07-31 日立原町電子工業株式会社 気密用コネクタの製造方法
JPH07282621A (ja) * 1994-04-06 1995-10-27 Rohm Co Ltd 電極材料及びこれを用いたチップ状電子部品、並びに電極層の表面処理方法
JP2005235577A (ja) * 2004-02-19 2005-09-02 Kyocera Corp 気密端子
JP2005235576A (ja) * 2004-02-19 2005-09-02 Kyocera Corp 気密端子
JP4439389B2 (ja) * 2004-12-22 2010-03-24 京セラ株式会社 気密端子
JP4614905B2 (ja) * 2005-04-18 2011-01-19 京セラ株式会社 気密端子
JP4684110B2 (ja) * 2006-01-30 2011-05-18 京セラ株式会社 気密端子
WO2011096592A1 (fr) * 2010-02-04 2011-08-11 小田産業株式会社 Tuyau en acier inoxydable a haute teneur en azote a resistance elevee, a ductilite elevee et a excellente resistance a la corrosion et a la chaleur et procede pour sa production

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EP3852199A1 (fr) 2021-07-21
JP7037662B2 (ja) 2022-03-16
WO2020054703A1 (fr) 2020-03-19
EP3852199A4 (fr) 2022-06-08

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