EP3841153A1 - Précurseur de composition, composition, procédé de production d'un précurseur de composition, procédé de production d'une composition, utilisation d'une composition et composant - Google Patents

Précurseur de composition, composition, procédé de production d'un précurseur de composition, procédé de production d'une composition, utilisation d'une composition et composant

Info

Publication number
EP3841153A1
EP3841153A1 EP19753402.7A EP19753402A EP3841153A1 EP 3841153 A1 EP3841153 A1 EP 3841153A1 EP 19753402 A EP19753402 A EP 19753402A EP 3841153 A1 EP3841153 A1 EP 3841153A1
Authority
EP
European Patent Office
Prior art keywords
composition
precursor
composition precursor
polysiloxane
alkoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19753402.7A
Other languages
German (de)
English (en)
Inventor
Guido KICKELBICK
Nils Steinbrück
Svenja Pohl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universitaet des Saarlandes
Original Assignee
Universitaet des Saarlandes
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universitaet des Saarlandes filed Critical Universitaet des Saarlandes
Publication of EP3841153A1 publication Critical patent/EP3841153A1/fr
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups

Definitions

  • composition precursor composition, method for producing a composition precursor, method for producing a composition, use of a
  • the application relates to a composition precursor, a composition, a method for producing a
  • composition precursors a method for producing a composition, a use of the composition and a component.
  • Polysiloxanes are used in many areas. There are increasing demands on these materials, so that commercially available systems have to be improved.
  • a possible application of polysiloxanes is, for example, the encapsulation of optoelectronic components.
  • the working conditions of light emitting diodes (LEDs) require, for example, high photophysical and thermal stability, high transparency, a high refractive index and good processability
  • Encapsulation materials are used, which are based on two-component elastomer systems and are thermally curable using a platinum catalyst. For ecological and economic reasons, however, the use of non-recyclable precious metals such as platinum should be avoided.
  • the object of at least one embodiment of the invention is to provide a composition precursor which has improved properties. Another object of the invention is to provide a composition which has improved properties. Other tasks are to provide a method of making a composition precursor with improved ones
  • Another object of the invention is to use the
  • composition precursor is specified, which is a three-dimensional network partially with each other
  • composition precursor is here and in
  • the external influences initiate chemical reactions in the composition precursor which change the chemical structure of the composition precursor in such a way that it is converted to the composition.
  • Properties caused by the material of the composition can be adjusted by adjusting the properties of the
  • Composition precursors can be achieved.
  • composition precursor can be a polymeric material that has the three-dimensional network. It should be noted that not all components of the
  • composition precursors must be networked, but can also be available individually. Thus, the
  • alkoxy-terminated oligo- or polysiloxane as well as monomer units connected by chemical bonds as well as monomer units and alkoxy-terminated oligo- or polysiloxane which are linked by chemical bonds.
  • the monomer units comprise at least one trialkoxysilane and at least one dialkoxysilane.
  • the monomer units have at least one trialkoxysilane (hereinafter also referred to as TAS) and at least one
  • TAS trialkoxysilane
  • DAS dialkoxysilane
  • Composition precursors can be present.
  • crosslinked composition precursors can be gel-like
  • Composition precursors can be selected by selecting the
  • Ratio of the proportions of the respective starting materials can be set. For example, these properties are directly related to the ratio of TAS to DAS used and the proportion of certain groups,
  • the hardness and the refractive index of a composition produced from the composition precursor can also be influenced and thus adjusted depending on the desired application.
  • a composition produced from the composition precursor can also be influenced and thus adjusted depending on the desired application.
  • composition precursor specified the one of
  • oligosiloxane or polysiloxane has crosslinked monomer units and an alkoxy-terminated oligosiloxane or polysiloxane, the monomer units having at least one trialkoxysilane and at least one dialkoxysilane.
  • composition precursor the general structural formula
  • R 1 , R 2 , R 3 and R 4 can be selected independently of one another from aryl, alkyl, alkenyl, allyl,
  • substituted aryl substituted alkenyl, substituted alkyl and vinyl, preferably from phenyl and methyl, where u + v + w is the number of Si atoms used and u, v and w are independently selected from the range 1 to 20,000.
  • phenyltrimethoxysilane PhSi (OMe) 3 and methyltrimethoxysilane MeSi (OMe) 3 which are partially crosslinked or not crosslinked as trialkoxysilanes, dimethyldimethoxysilane can thus be used in the composition precursor
  • Me 2 Si (OMe) 2 as dialkoxysilane and methoxy-terminated polydimethylsiloxane
  • PDMSin (OMe) 2 as alkoxy-terminated oligosiloxane or polysiloxane.
  • composition precursor and thus also that of it is expanded and less cross-linked resulting composition what the viscosity of the
  • the refractive index can increase due to the larger ratio of, for example, phenyl to methyl groups.
  • the proportion of alkoxy-terminated oligo- or polysiloxane is in the
  • Composition precursor from a range of> 0% to 10% of the sum of the amounts of trialkoxysilane and
  • Composition precursor has a viscosity at 23 ° C, which is in a range from 1000000 mPas to 100 mPas,
  • a viscosity at 110 ° C which is in a range from 10000 mPas to 50 mPas.
  • These viscosities enable the composition precursor to be easily processed. In addition, they require a hardness from the
  • composition precursor manufactured composition that has a desired flexibility and elasticity
  • composition precursor thermally or photochemically curable. This means that the composition precursor can harden completely by thermal or photochemical effects, so that all or at least largely all
  • Polysiloxanes together to form a three-dimensional network are networked. This hardening process can be done here and in
  • consolidation Also referred to below as consolidation.
  • composition is also specified which is thermally or photochemically cured
  • composition precursor according to one of the above-mentioned embodiments. All features that in
  • composition has a thermally or photochemically hardened composition precursor
  • Composition precursor but fixed. Due to the
  • composition precursor show the properties of the composition precursor.
  • the composition has a sufficiently high elasticity so that it can be used well in many applications, for example as an encapsulation in optoelectronic components.
  • Composition has a Shore A hardness of 40 to ⁇ 99.
  • the composition can continue to have a high refractive index
  • the composition is free of a noble metal catalyst.
  • the composition is free of a platinum catalyst.
  • the composition can thus be produced in a cost and process-optimized manner. Based on a composition
  • composition precursor the phenyltrimethoxysilane
  • Dialkoxysilane and methoxy-terminated polydimethylsiloxane, PDMSin (OMe) 2 as alkoxy-terminated oligo- or polysiloxane, the cured or consolidated structure can have the following schematic formula in an exemplary section:
  • This formula shows the TAS and DAS groups as well as the PDMS groups that expand the network.
  • the procedure has the steps
  • process step B) can be carried out after process step A) or simultaneously with the
  • Process step A) are carried out.
  • Condensation here and below means a reaction of the monomer units with one another or with the alkoxy-terminated oligo- or polysiloxane, in which the monomer units and the alkoxy-terminated
  • At least two different trialkoxysilanes and / or at least two different ones can also be used in the process
  • the alkoxy-terminated oligo- or polysiloxane ensures that an expanded network of mutually condensed monomer units is formed.
  • process steps A) and B) are carried out at a temperature selected from the range from 20 ° C. to 60 ° C., and / or process step C) is carried out at a temperature consisting of the
  • Range 70 ° C to 150 ° C is selected.
  • Process step A) carried out with the addition of an acid or a base for example, HCl, H 2 SO 4 ,
  • Vinegar or formic acid can be used.
  • Exemplary bases are NaOH, KOH, NH 4 OH or NH 3 .
  • the acids or bases used are water-soluble. If an acid is added, protonation of the alkoxy groups and thus an increase in electrophilicity at the silicon atom can be produced. This allows water, alkoxysilane and
  • the gel-like composition precursor is cured thermally or photochemically. Due to the action of heat or light, the gel-like composition precursor can become a solid composition
  • Methods for producing a composition precursor thus also apply to the method for producing the composition and vice versa.
  • the thermal curing is carried out at a temperature in the range from 150 ° C. to 250 ° C. and / or for a period in the range from 8 h to 72 h.
  • Photochemical curing can be carried out in the presence of a photochemically activatable group in a monomer
  • Photoacids that release protons on exposure can be used to activate curing.
  • a base or acid can be added as a catalyst to the composition precursor. If, for example, a base is added, the curing time and curing temperature can be considerably reduced.
  • a base for example, KOH or DABCO
  • Triethylenediamine can be used.
  • the proportion of base can be, for example, ⁇ 10 mmol / g.
  • composition obtained by the process is free from cracks, depending on the composition precursor used
  • composition includes use as
  • Encapsulation material of optoelectronic components as matrix material of conversion layers, as
  • Lens material as corrosion protection material, as a component in composite materials, in lithography processes and in printing technology.
  • the composition can be used as a positive in an embossing lithography process in which a stamp is placed. Furthermore, the composition
  • the composition can serve as a matrix for dyes, for example in solar cells or luminescence solar concentrators, with the materials being deposited in thin films using an inkjet process. Because of the possibility in the composition of the
  • the composition can be used advantageously in many areas.
  • Component specified that contains a composition according to the above statements.
  • the component can according to one
  • Embodiment be an optoelectronic component and contain an encapsulation comprising the composition and / or a conversion layer having the composition.
  • the optoelectronic component can be any optical component.
  • LED light emitting diode
  • An LED can have a conversion layer that is in the beam path of the
  • Primary radiation is arranged and for converting the
  • Primary radiation is set up in secondary radiation.
  • the encapsulation can be arranged in the component such that it surrounds the semiconductor layer sequence.
  • composition is well suited as an encapsulation material for LEDs due to its high refractive index, its high transparency and its stability to radiation and heat.
  • the composition in the conversion layer can be a matrix material for a dye which converts the primary radiation into secondary radiation.
  • the composition can be used advantageously, since it is light and heat stable and thus a long one Lifetime and reliability of the component can contribute.
  • the conversion layer can be formed as a plate or as a potting. In the case of encapsulation, the conversion layer can completely surround the semiconductor layer sequence.
  • composition precursor in which further substances such as, for example, are added, is first used
  • composition wherein the hardness of the composition can be adjusted by suitable adjustment of the composition precursor.
  • FIG. 1 shows a schematic view of the methods for producing a composition precursor
  • FIG. 2 shows a graphical representation of the proportions of starting materials used to produce the Composition precursors according to various
  • Embodiments of the composition precursor using a block diagram Embodiments of the composition precursor using a block diagram.
  • FIG. 4 shows a representation of the refractive indices and the content of phenyl groups of exemplary embodiments of the composition precursor.
  • FIG. 5 shows a representation of the Shore A hardness of
  • Embodiments of the composition based on a block diagram.
  • Figure 6 shows images of platelets according to
  • FIGS 7a to 7f show lead frames with and without
  • composition precursors and compositions according to exemplary embodiments.
  • FIG. 8 shows the thermogravimetric mass loss (a) and T95 values (b) of exemplary embodiments of the composition.
  • FIG. 9 shows the absolute viscosity as a function of time from exemplary embodiments of the
  • composition precursors are Composition precursors.
  • FIG. 10 shows FTIR spectra of exemplary embodiments of the composition precursor.
  • FIGS. 11 to 14 show 2 H and 29 Si NMR spectra of
  • composition precursors are Composition precursors.
  • Figures 15 to 20, 25 and 26 show ! H-NMR spectra and 29 Si- 1 H HMBC 2D NMR spectra of exemplary embodiments of the composition precursor during and after it
  • Figures 21 to 24 show 2 H-NMR spectra of
  • composition precursors Embodiments of composition precursors.
  • Figure 27 shows the schematic side view of a
  • identical, similar or identically acting elements can each be provided with the same reference symbols.
  • the elements shown and their proportions are not to scale. Rather, individual elements such as layers, components, components and areas can be shown in an exaggerated manner for better representation and / or for better understanding.
  • composition precursors and compositions can be used, for example, the following starting materials and auxiliaries: dimethyldimethoxysilane (97%, ABCR GmbH), methyltrimethoxysilane (97%, ABCR GmbH),
  • Phenyltrimethoxysilane (97%, ABCR GmbH), methoxy-terminated polydimethylsiloxane (5 to 12 cst., ABCR GmbH), 1,4-diazabicyclo [2.2.2] octane (98% Alpha Aesar, Germany), hydrochloric acid (Bernd Kraft GmbH) and potassium hydroxide (85%, Grüssing GmbH Analytica).
  • the hydrochloric acid is in
  • FIGS. 11 to 14 The purity of the starting materials and the average chain length of the methoxy-terminated polydimethylsiloxane are determined by means of 2 H and 29 Si NMR spectroscopy (see FIGS. 11 to 14: FIG. 11 shows the spectra of
  • Dimethyldimethoxysilane and Figure 14 shows the spectra of methoxy-terminated polydimethylsiloxane).
  • the NMR spectra were recorded with an Avance III 300 MHz spectrometer and an Avance III HD 400 MHz spectrometer (Bruker Corp., USA) at 300.13 / 400.13 MHz for 1 H-NMR spectra and 59.63 / 79 , 49 MHz for 29 Si NMR spectra.
  • FIG. 1 shows a schematic view of the methods for producing a composition precursor
  • composition based on an embodiment.
  • hydrochloric acid with a pH of 2.5 is added to PhSi (OMe) 3 as TAS, MeSi (OMe) 3 as TAS and Me2Si (OMe) 2 as DAS.
  • PhSi (OMe) 3 as TAS
  • MeSi (OMe) 3 as TAS
  • Me2Si (OMe) 2 as DAS.
  • Hydrochloric acid is added in a proportion of 1.5 times the amount of alkoxysilanes. This mixture is stirred in a closed vessel at 45 ° C. for 3 hours and at 320 rpm. This is identified in FIG. 1 as method step A). In process step B)
  • PDMSin (MeO) 2 methoxy-terminated polydimethylsiloxane PDMSin (MeO) 2 was added in a proportion of 0.7% of the amount of the alkoxysilanes and further stirred at 45 ° C. for 18 hours at 320 rpm.
  • the PDMSin (MeO) 2 can also be added simultaneously with process step A) (not shown here).
  • the mixture is transferred to a beaker and stirred at 25 ° C for 0.5 to 1 hour at 150 rpm.
  • This gelation step is optional and therefore marked with dashed lines. The gelation can be recognized by the fact that homogeneously distributed gas bubbles form in the material and the viscosity increases significantly.
  • process step C the cleaning step, the beaker is transferred to a drying cabinet and water, hydrochloric acid and methanol are removed there at 110 ° C. for one hour. Finally, the transparent, gel-like
  • Composition precursor G isolated and cooled to room temperature.
  • a composition precursor obtained as described above can be consolidated or hardened by transferring it into a mold or cavity and hardening it there at 150 to 200 ° C. for 8 to 72 hours.
  • the curing time is related to the proportions of the respective starting materials of the composition precursor and the thickness of the sample to be cured.
  • a small proportion of base or acid can be added to the composition precursor before the start of hardening in order to achieve the
  • the hardened composition CM is free of cracks and, depending on the selected viscosity of the composition precursor, is flexible and elastic.
  • the trialkoxysilanes and dialkoxysilanes are hydrolyzed and form an oligomer and polymer chains and, in some cases, crosslinked structures.
  • a step by step Substitution of MeSi (OMe) 3 by Me2Si (OMe) 2 leads to a more chain-like and less cross-linked structure.
  • composition precursors The polydimethylsiloxane added in process step B) leads to an additional expansion of the network. If the temperature is increased during these steps, the viscosity increases at the same time, which simplifies the manufacturing process.
  • composition precursors now form a solid but elastic polymer, the composition CM.
  • composition precursor Components needed to harden the composition precursor. However, it is possible to add small amounts of base or acid to the process
  • composition precursors To catalyze composition precursors.
  • Consolidation time or hardening time and the temperature can be determined by the pH dependence of the
  • composition precursors G for hardness tests can be placed in PTFE molds of size 30x10x1 mm and films of size 13x0.12 mm can be produced on glass plates for transmission measurements. Examples 1 and 2, which are specified in more detail below, were heated to 110 ° C. for better handling.
  • the Quadrupel Film Applicator Model-360 (Erichsen GmbH & Co. KG) can be used for film production.
  • the thickness of the films can be measured with an FMD12TB precision dial gauge (Käfer Messuhrenfabrik GmbH & Co. KG) with an accuracy of 1 ym.
  • the samples prepared in this way can, for example, at 200 ° C. be cured in a drying cabinet for 72 hours.
  • the transparent compositions CM are then on
  • Cooled and insulated at room temperature Cooled and insulated at room temperature.
  • Table 1 shows the exact proportions of the starting materials of the composition precursors according to Examples 1 to 8:
  • composition precursors and thus also the hardened composition (CM).
  • CM hardened composition
  • Figure 2 shows the substance amounts n in mmol of the starting materials used in Examples 1 to 8 (x-axis).
  • PhSi (OMe) 3 and PDMSin (MeO) 2 were kept constant in all examples (square and downward triangle), while the proportions of MeSi (OMe) 3 (circle) and Me2Si (OMe) 2 (upward-looking triangle) have been changed. In particular, the substitution of MeSi (OMe) 3 by Me2Si (OMe) 2 can be seen.
  • FIG. 3 shows the averaged absolute values of the viscosity of samples 1 to 8, which were measured isothermally at 23 ° C. and at 110 ° C. for 10 minutes each.
  • @ 110 ° C in mPas) can be determined directly after the synthesis of the composition precursors. It decreases from Examples 1 to 8, that is to say with an increase in the substituted content of MeSi (OMe) 3 by Me2Si (OMe) 2, as shown in FIG. 3. The viscosity of Examples 1 and 2 is too high to be measured at room temperature. When the samples are heated to 110 ° C, the absolute value of the viscosity decreases significantly. All examples can easily be processed at 110 ° C. Due to their viscosity, samples 3 to 8 can also be processed at room temperature, which makes the materials suitable, for example, as curable encapsulation material for optoelectronic components.
  • composition precursors are stored and thus subjected to an aging process, their viscosity can increase with the storage time at room temperature. Become
  • the aged composition precursors can still
  • composition precursors can be processed because they soften at temperatures above 23 ° C. If the composition precursors are used to be used in encapsulations of optoelectronic components, it is important that they have a defined and preferably high refractive index. Height
  • Refractive indices in composition precursors can be favored by the presence of mono- or polycyclic aromatic side groups.
  • the proportion of phenyl groups changes from 37% to 32%, as shown in FIG. 4 (left y-axis).
  • the refractive index n D 20 changes from 1.505 to 1.494 (right y-axis).
  • the refractive index can be measured, for example, with an AR4 Abbe refractometer with a PT31 Peltier thermostat (A. Krüss Optronic GmbH) at 20 ° C and 590 nm LED radiation.
  • Viscosity cannot be determined at 20 ° C.
  • composition precursors the hardness of the associated compositions can be adjusted, which may have different requirements depending on the application.
  • the hardness of the consolidated compositions can be measured at room temperature using a Shore A durometer become. You can do this with individual sample plates
  • FIG. 5 shows the hardness H in Shore-A for Examples 1 CM to 6 CM, which decreases with increasing proportion of Me2Si (OMe) 2 and with increasing temperature.
  • the encapsulation material is highly transparent
  • the entire visible spectrum of light is emitted in white LEDs.
  • Drying cabinet hardened at 200 ° C for 72 hours. The samples shrink due to the consolidation process.
  • the film thickness for the 1 CM sample is 81 ⁇ 1 ⁇ m, for the sample
  • Encapsulation materials for optoelectronic components must be pourable, hardenable and leakproof. Becomes a
  • composition precursor arranged as encapsulation material in a component and then to one
  • Hardened composition it must be free of cracks and bubbles and have a certain elasticity. To determine the applicability of the composition precusors in
  • samples 4 and 6 were cast on a polyphtalamide LED lead frame (1.4 x 0.7 x 0.4 mm) and the lead frame for curing the composition precursors at 160 ° C for 20 hours
  • Figures 7a to f show images of the empty lead frame ( Figures 7a and b), the lead frame with a
  • Composition 4 CM ( Figures 7c and d) and one
  • Example 6 and a composition 6 CM ( Figures 7e and f).
  • the picture in Figure 7a is on the metallic background focused, in Figure 7b on the upper edge of the
  • compositions 4 CM and 6 CM are measured. Using the side edges of the lead frames as a reference before and after curing, a shrinkage of the materials can be recognized. Overall, the composition precursors and thus the compositions are well suited for
  • compositions are a high temperature stability of the material.
  • the hardening process can be any hardening process. As already mentioned above, the hardening process can be any hardening process.
  • Preparation of the composition can be catalyzed by the addition of small amounts of a base or acid to the composition precursor.
  • the base can, for example, be added directly before the heat treatment of the composition precursors.
  • KOH and DABCO can be used as bases
  • Example 4 (0.2 g) and mixed.
  • the formation of bubbles can also be avoided or reduced.
  • FIG. 10b shows an enlarged section of the FTIR spectrum of Examples 1 to 8, which shows the decrease in the vibration band at 1269 cm -1 , which is caused by the decreasing proportion of MeSi (OMe) 3 in the examples. Furthermore, the increase in Vibration band shown at 1259 cm -1 , which is caused by an increasing content of Me2Si (OMe) 2.
  • condensation behavior of various monomer units used in the synthesis of the composition precursor can be determined using two-dimensional 29 Si- 1 H
  • Composition precursors 1, 2, 3 and 8 are shown in Table 2 below. To carry out the experiment, small amounts of the samples of the respective reaction mixture were obtained after 3 hours of hydrolysis (before the addition of the
  • Figure 15 Sample 1 after 3h
  • Figure 16 Sample 1 after the
  • Molecules were hydrolyzed before reacting with other molecules.
  • the D ! Signals can be divided into D 3 o and D 2 i signals.
  • the indexed numbers indicate the proportion of hydroxyl groups attached to a molecule.
  • a D 3 o signal is generated by a monomer with none
  • a D ⁇ signal is generated by a monomer with a hydroxyl group.
  • the additional D ⁇ signal can be separated by the chemical shift and is measurable since there is no coupling with the methoxy groups
  • Figure 27 shows the schematic side view of a
  • the component for example an LED, comprises a substrate 10 on which one
  • Semiconductor layer sequence 20 is arranged.
  • Semiconductor layer sequence 20 is for the emission of
  • Primary radiation for example short-wave light with a wavelength maximum of about 450 nm, set up.
  • Conversion layer 30 arranged. This envelops the
  • Semiconductor layer sequence 20 completely, that is to say materially and positively, and is thus introduced as a potting in a recess in the housing 40. So that serves
  • Conversion layer 20 on the one hand as an encapsulation of the
  • Conversion layer contains a dye that is in a Matrix, which is formed from a composition, is embedded.
  • the conversion layer 30 can be arranged at a distance from the semiconductor layer sequence 20 (not shown here). In this case, you can choose between the
  • Semiconductor layer sequence 20 and the conversion layer 30 an encapsulation, which is formed from the composition, may be arranged.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Silicon Polymers (AREA)

Abstract

L'invention concerne un précurseur de composition, comprenant un réseau tridimensionnel de motifs monomères partiellement réticulés entre eux et d'un oligo- ou polysiloxane à termination alcoxy, les motifs monomères présentant au moins un trialkoxysilane et au moins un dialkoxysilane. L'invention a également pour objet une composition, un procédé de production d'un précurseur de composition ainsi que d'une composition, une utilisation d'une composition ainsi qu'un composant.
EP19753402.7A 2018-08-23 2019-08-20 Précurseur de composition, composition, procédé de production d'un précurseur de composition, procédé de production d'une composition, utilisation d'une composition et composant Pending EP3841153A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP18190475.6A EP3613793A1 (fr) 2018-08-23 2018-08-23 Précurseur de composition, composition, procédé de production d'un précurseur de composition, procédé de production d'une composition, utilisation d'une composition et composant
PCT/EP2019/072254 WO2020038935A1 (fr) 2018-08-23 2019-08-20 Précurseur de composition, composition, procédé de production d'un précurseur de composition, procédé de production d'une composition, utilisation d'une composition et composant

Publications (1)

Publication Number Publication Date
EP3841153A1 true EP3841153A1 (fr) 2021-06-30

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EP18190475.6A Withdrawn EP3613793A1 (fr) 2018-08-23 2018-08-23 Précurseur de composition, composition, procédé de production d'un précurseur de composition, procédé de production d'une composition, utilisation d'une composition et composant
EP19753402.7A Pending EP3841153A1 (fr) 2018-08-23 2019-08-20 Précurseur de composition, composition, procédé de production d'un précurseur de composition, procédé de production d'une composition, utilisation d'une composition et composant

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EP3928860A1 (fr) 2020-06-24 2021-12-29 Universität des Saarlandes Procédé de fabrication de microparticules, microparticules, utilisation des microparticules et composant

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US5948854A (en) * 1997-09-25 1999-09-07 Dow Corning S.A. Alkoxy-functional RTV compositions with increased green strength and increased storage stability
US6008284A (en) * 1997-12-23 1999-12-28 Dow Corning Corporation Fast curing alkoxy-functional RTV compositions
US6472451B2 (en) * 1998-03-27 2002-10-29 Dsm N.V. Radiation curable adhesive for digital versatile disc
JP4494543B2 (ja) * 1998-11-20 2010-06-30 東レ・ダウコーニング株式会社 室温硬化性シリコーンゴム組成物
JP2007106944A (ja) * 2005-10-17 2007-04-26 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
TWI398489B (zh) * 2010-08-31 2013-06-11 Chi Mei Corp 光硬化性聚矽氧烷組成物及其所形成之基材保護膜

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EP3613793A1 (fr) 2020-02-26
US20210317271A1 (en) 2021-10-14

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