EP3768521A1 - Procédé de fabrication d'un matériau de transfert à élément de sécurité et matériau de transfert à élément de sécurité - Google Patents

Procédé de fabrication d'un matériau de transfert à élément de sécurité et matériau de transfert à élément de sécurité

Info

Publication number
EP3768521A1
EP3768521A1 EP19712684.0A EP19712684A EP3768521A1 EP 3768521 A1 EP3768521 A1 EP 3768521A1 EP 19712684 A EP19712684 A EP 19712684A EP 3768521 A1 EP3768521 A1 EP 3768521A1
Authority
EP
European Patent Office
Prior art keywords
security element
layers
film
recess
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19712684.0A
Other languages
German (de)
English (en)
Other versions
EP3768521B1 (fr
Inventor
Christian Fuhse
Josef Schinabeck
Björn Teufel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient Currency Technology GmbH
Original Assignee
Giesecke and Devrient Currency Technology GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient Currency Technology GmbH filed Critical Giesecke and Devrient Currency Technology GmbH
Publication of EP3768521A1 publication Critical patent/EP3768521A1/fr
Application granted granted Critical
Publication of EP3768521B1 publication Critical patent/EP3768521B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/455—Associating two or more layers using heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/46—Associating two or more layers using pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/465—Associating two or more layers using chemicals or adhesives
    • B42D25/47—Associating two or more layers using chemicals or adhesives using adhesives

Definitions

  • the invention relates to a method for producing a
  • Security element transfer material having a provided on a carrier substrate, designed as a transfer element security element comprising
  • the security element layer composite has a feature layer depicting the optically variable effect dependency on the carrier substrate which faces a viewer after a security element has been transferred to a value document substrate, and an adhesive layer, along the recess of the mask foil formed on a value document substrate to be transferred, stamped security element layer composite is formed,
  • the invention further relates to a security element transfer material obtainable by the method.
  • Valuables such as branded or value documents
  • Banknotes in particular, are often equipped with security features that allow verification of the authenticity of the object of value and at the same time serve as protection against unauthorized reproduction.
  • the security elements used for this purpose are not individual but in shape of transfer belts with a variety of as a transfer element
  • Characteristic of Transf erb is that the security elements are prepared on a carrier layer, the order of the layers of the
  • the carrier layer is at
  • the Transf erb On the opposite side of the carrier layer, the Transf erb may have an adhesive layer, usually from a heat-sealing adhesive or heat-sealing lacquer, which melts in the transfer of security elements and glued the security elements with the object to be secured.
  • the transfer tape is placed on the article with the heat seal adhesive layer and pressed by means of a heated transfer punch or a transfer roller and in the outline of the heated
  • Target substrates are described for example in EP 0 420 261 B1 and WO
  • the prefabrication of separate individual security elements is useful, for example, if the security elements have a layer structure which makes exact separation of the entire layer structure during the transfer process difficult. This is the case, for example, when the layer structure of the security element to be transferred contains a permanent carrier substrate, for example a plastic film. Carrier substrates within the layer structure of security elements are useful if the security elements must be made very stable, for example, if they must be self-supporting because they are for
  • Security elements whose layer structure comprises a stable carrier substrate, typically a plastic film, must be on a
  • Safety element material must be pre-cut in advance.
  • the pre-cutting can be carried out for example by means of a laser. This results in the problem that the depth of cut must be controlled very precisely, on the one hand the complete layer structure of
  • plastic films are used as support materials. Although plastic films have a high tear resistance, but a low
  • Security element laminates typically have thicknesses in the
  • a security element transfer material in the form of a continuous material, pre-cut in the security elements in the desired outline shapes, and then the precut elements without risk of tearing the Carrier material can be transferred to products to be secured, is known from WO 2010/031543 Al.
  • the security element transfer material is a continuous material, in particular a band with several hundred meters in length and a width of a few
  • the security element transfer material has a security element layer composite, i. the actual security element material, and a temporary carrier, i. the material on which the security elements are "stored" on.
  • the temporary carrier is based on a carrier layer composite, consisting of a first and a second temporary carrier substrate, which are permanently bonded by means of an adhesive layer.
  • the security element layer composite is connected to a temporary carrier either directly or by means of a release layer.
  • the release layer is from
  • the temporary carrier is at the side of the
  • temporary carrier substrates expresses that these carriers are substrates in the
  • Security elements are.
  • the formation of the temporary carrier as a carrier layer composite avoids that, when cutting the outline shapes of the security elements, the stability of the temporary carrier
  • Plastic films have a low tear propagation resistance, ie if a film is cut even slightly, it easily tears further and possibly completely.
  • the carrier layer composite consisting of a first and a second temporary carrier substrate, which are permanently bonded by means of an adhesive layer: even if one of the temporary carrier substrates is completely severed, remains the other temporary carrier substrate (or possibly the other temporary carrier substrates) usually undamaged and
  • the adhesive also forms an additional "buffer zone" between the temporary carrier substrates.
  • the method described in WO 2010/031543 A1 consists in de-patching patch films before application.
  • the forms of the patch are punched with a punch into the layers to be transferred, i. the layers with the punch pierced.
  • these layers are then peeled off in the areas outside the patch, while remaining in the patch areas on the carrier film. This ensures that the patches have clean edges after application.
  • a disadvantage of this method is that the layer structure must have sufficient stability for weeding, which may be e.g. can be done by introducing a stabilizing film layer. However, this is again associated with a thickness increase of the finished patch, which is undesirable in practice.
  • the invention has for its object to provide a comparison with the prior art improved method for producing a transfer element, such as a transfer patch.
  • a transfer element such as a transfer patch.
  • a small thickness of the finished patch and on the other hand a reliable transfer of the patch with clean edges are to be achieved. This task is by the main claim as well as in the
  • a security element transfer material having a security element provided on a carrier substrate and designed as a transfer element
  • the adhesive layer of the security element layer composite does not necessarily have to be present over the entire surface along the entire security element layer composite, but according to a variant can only be formed in the region of the transfer element which is to be produced Security elements are present.
  • the production can be carried out, for example:
  • a masking film, wherein the security element layer composite has a feature layer which can be detachably connected to the carrier substrate and unfolds an optically variable effect
  • security element layer composite is formed
  • Recess of the masking film wherein optionally the part of the masking foil adjoining the recess may likewise be provided with adhesive;
  • Security element layer composite is applied, followed by an introduction of punching lines in the security element layer composite along the recess.
  • step a) of providing a carrier substrate, which is provided in the order with a security element layer composite and a mask foil having at least one recess takes place such that initially punched lines in the security element Layered layer can be introduced, followed by a register accurate applying a provided with at least one recess masking film on the punched lines
  • Mosaic elements have a lateral dimension below the resolution limit of the eye.
  • metal layers or (ii) as transparent reflective layers, high refractive index layers, or (iii) as reflective layers
  • viewing in incident light is an illumination of the value document from one side and a viewing of the object
  • a reflection in incident light is therefore present, for example, when the front of the document of value is illuminated and also viewed.
  • a reflection in transmitted light is in the sense of this invention
  • a reflection in transmitted light is thus present, for example, when the back of the document of value is illuminated and the front side of the document of value is viewed. The light thus shines through the document of value.
  • value document therefore always includes documents of the type mentioned in the following:
  • value document also includes security paper for the production of banknotes
  • Paper banknote a polymer banknote or a film composite banknote.
  • the security element to be transferred can in particular be a transfer patch or transfer label or a transfer strip or transfer thread.
  • the functional layer can be a single (functional) layer or multiple (functional) layers.
  • Security element transfer material is used in the step of weeding a shadow mask.
  • the shadow mask is applied before application, i. the end use, the transfer patch to be produced by the
  • a smaller layer thickness after application or end use of the transfer patch is advantageous for processing in banknote printing, e.g.
  • the starting point is an ordinary transfer film structure, as e.g. also for the application of transfer strip is used.
  • a transfer film structure as e.g. also for the application of transfer strip is used.
  • Construction is based on a carrier foil, one or more on it
  • the functional layers provide optically variable security features, eg embossed holograms, micromirror elements, subwavelength structures and the same.
  • the optically variable security features are generally provided by an embossing lacquer, for example a UV embossing lacquer, with microstructures embossed therein and at least in regions
  • the heat sealing lacquer layer may actually consist of several layers of different lacquers.
  • the functional layers have only weak adhesion to the carrier film, which is e.g. by a poor adhesion of the embossing lacquer to the carrier foil or by the
  • a shadow mask is applied according to the invention.
  • the shadow mask can in particular be given by a perforated foil from which the shapes of the desired patches are punched out.
  • a perforated film is advantageously laminated or adhered to the transfer film structure. This can be done with a laminating adhesive or simply by utilizing the adhesive power of the anyway
  • the side facing the heat sealing lacquer may be provided beforehand with a primer which allows a better bonding of perforated foil and functional layers.
  • Perforated film and functional layers can also be bonded only in certain areas.
  • the perforated film can only be glued to the functional layers by the melting of the heat-sealing lacquer during application.
  • punching lines are introduced by means of a punching tool or a cutting tool to thereby punch the patch shapes to be formed, ie, the outlines of the patches in the patches Transf he verbünde to dance.
  • the stamped shape is advantageously slightly smaller than the holes in the shadow mask.
  • the perforated mask or perforated foil is subsequently removed from the carrier foil together with the heat sealing lacquer layer covered by the perforated foil and the functional layers in the step of de-icing. This leaves the patches on the carrier film and you get a weed-off
  • the patch is heated as usual, with the heat-sealing lacquer melting and with the
  • the (value document) substrate may e.g. a paper or polymer substrate or a paper / polymer composite substrate.
  • the heating may be carried out in regions (i.e., in an area slightly larger than the patch itself) or over the entire area. If one then separates the carrier film from the (value-document) substrate, the functional layers remain in the patch area on the (value-document) substrate, since the heat-sealing lacquer to the paper provides greater adhesion than the adhesion between the carrier film and functional layers.
  • Transfer material can be realized as follows:
  • the starting point is again an ordinary transfer film structure, as it is also used, for example, for the application of transfer stripes.
  • a construction is based on a carrier film, one or more functional layers located thereon, and a heat sealing lacquer layer.
  • the functional layers provide optically variable security features, ie eg embossed holograms, micromirror elements, subwavelength structures and the like.
  • the optically variable security features are generally provided by an embossing lacquer, for example a UV embossing lacquer, with microstructures embossed therein and at least in regions
  • the heat sealing lacquer layer may actually consist of several layers of different lacquers.
  • the functional layers have only weak adhesion to the carrier film, which is e.g. by a poor adhesion of the embossing lacquer to the carrier foil or by the
  • unperforated film applied, in particular by means of an area wise existing adhesive layer ("laminating adhesive").
  • punching lines are inserted by means of a punching tool or a cutting tool to thereby punch in the patch shapes to be formed, i. to dance the outlines of the patches into the transfer network.
  • holes are made in the initially unperforated sheet and the stabilizing sheet in the hole areas removed, e.g. by suction or by blowing off.
  • the perforated mask or perforated foil is subsequently removed from the carrier foil together with the heat sealing lacquer layer covered by the perforated foil and the functional layers in the step of de-icing. This leaves the patches on the carrier film and you get a weed-off
  • the patch shapes are then punched out and the foil in the areas of the holes e.g. removed by compressed air or by pulling over a sharp edge.
  • Another advantage of the method according to the invention is that the patches need not be torn out of a functional layer composite in the step of application to the (value document) substrate (ie a break must be made within the functional layers), but the functional layers at the patch edge already the punching are cut clean. This leads to very clean patch edges.
  • Microlenses can be present in particular in combination with microimages formed in a separate plane and in this way generate optically variable security features in the form of so-called moiré magnifiers, modulo mapper, tilt images and the like.
  • Safety features based on microlenses in combination with microimages are e.g. from WO 2006/087138 Al known.
  • Micromirrors, hologram structures, etc. are generally coated with an at least partially present metallization, which consists of a metal, eg Al or Ag, a high refractive index coating, eg ZnS or ⁇ 1O2, or a color-shifting three-layer system Reflector / dielectric / absorber may exist (eg an AI / S1O2 / Cr structure).
  • a metal eg Al or Ag
  • a high refractive index coating eg ZnS or ⁇ 1O2
  • a color-shifting three-layer system Reflector / dielectric / absorber may exist (eg an AI / S1O2 / Cr structure).
  • Essential for the heat-sealing gel lacquer is that it ensures the desired adhesion at the end by the application by pressure and possibly elevated temperature. Due to the heat, it can melt and / or be activated. It may also be provided to subsequently heat seal the enamel, e.g. to be further treated by means of UV radiation (post-crosslinking).
  • the perforated foil is preferably as thin as possible. It is advantageous to use films with thicknesses in a range from 4.5 gm to 19 gm.
  • the film used is preferably a polyethylene terephthalate (PET) film.
  • Carrier substrate or carrier film
  • the carrier films used are preferably rather thicker films, for example a 19 gm thick PET film.
  • something is usually also punched into the carrier film. It must be ensured that the carrier film does not tear after application of the patch to the (value-document) substrate.
  • the carrier film used is not a single carrier film, but a laminating composite consisting of two films, as known from WO 2010/031543 A1 (eg a 12 gm thick film and a 19 gm thick film glued together are): then only one of the two foils is punched while punching, while the second foil remains undamaged.
  • the carrier film may be advantageous to pull the carrier film over a sharp edge (or a wedge) from the rest of the layer composite.
  • the functional layers preferably contain embossing lacquers which
  • the total thickness of the patch without carrier film is preferably below 50 ⁇ m, more preferably below 30 ⁇ m and particularly preferably below 20 ⁇ m.
  • Typical patch dimensions are at a width of e.g. 5 mm to 35 mm and heights of e.g. 5 mm to 70 mm.
  • the patch shape can be chosen arbitrarily. Oval shapes are generally easier to apply than e.g. rectangular shapes. Under
  • a jagged edge can be an advantage.
  • the variant of punching the functional layers also allows the application of patches with complex outline shapes, which are difficult to apply under normal conditions.
  • embossed structure which can be used according to the invention is embossed in particular into an embossing lacquer.
  • the term "optically variable effect" in addition to holograms also includes
  • Hologram-like diffraction structures ie, for example, structures that are not a defined image, but a blurry colored impression produce.
  • optical variable effect ie, for example, structures that are not a defined image, but a blurry colored impression produce.
  • Diffraction patterns structures with a color shift effect, kinoforms, structures with a microlens effect, structures with isotropic or anisotropic scattering effects or with others are subsumed
  • Preferred reflective embossed structures contain e.g. one
  • a reflective layer in particular a metallic
  • a semitransparent (mirror) layer selected in particular from the group consisting of Al, Ag, Ni, Cr, Cu, Au and an alloy of one or more of the aforementioned elements
  • a dielectric layer disposed between the reflective layer and the semitransparent (mirror) layer
  • the interference-capable, multi-layered structure may be seen when viewing the front side in reflected light and a second appearance of the interference-capable, multilayered structure that can be seen when viewed from the front side in transmitted light, for example by recesses in the reflective layer and / or the semi transparent layer.
  • a film security element with different on light / transmitted light appearance is known from WO 2009/149831 A2.
  • the semi-transparent layer may comprise a plurality of grid-like recesses, which in their entirety result in a character, a picture or a pattern. That on this The generated pattern is visible in the reflected light and disappears in the
  • a different incident light / transmitted-light appearance of the multilayer structure can be accomplished by using a
  • Relief structure combined, in particular a diffractive relief structure, a micro-optical relief structure or a sublambda structure.
  • Other preferred reflective embossing structures include e.g. a multilayer structure with two semitransparent layers and one arranged between the two semitransparent layers
  • Shades are in particular complementary colors.
  • a multilayer structure is based on two semitransparent mirror layers and one between the two semitransparent ones
  • a mirror layer is a metal selected from the group consisting of Al, Ag, Ni, Cr, Cu, Au and an alloy of one or more of the aforementioned elements, with Al or Ag being preferred as the semitransparent mirror layer, and Al being particularly preferred becomes.
  • semitransparent mirror layers and one between the two Semitransparent mirror layers arranged dielectric layer preferably have the following physical nature:
  • the two semitransparent mirror layers are preferably selected from Al or Ag; the dielectric layer is in particular a SiCh layer;
  • the respective preferred layer thickness is in a range of 5 nm to 20 nm, particularly preferably in a range of 10 nm to 14 nm;
  • the SiCh dielectric layer preferably has a layer thickness in a range of 50 nm to 450 nm, more preferably in a range of 80 nm to 260 nm, the ranges from 80 nm to 100 nm and from 220 nm to 240 nm specifically for the provision of gold. Blue color change are particularly preferred;
  • the respective preferred layer thickness is in a range of 15 nm to 25 nm; the SiCh dielectric layer preferably has one
  • Layer thickness in a range of 50 nm to 450 nm, more preferably in a range of 80 nm to 260 nm, the ranges from 80 nm to 100 nm and from 220 nm to 240 nm specifically for the provision of a
  • Gold / blue color change are particularly preferred.
  • the multilayered layer structures mentioned not only enable the production of a semitransparent functional layer which, when viewed in reflected light, appears golden in color and exhibits a blue hue when viewed in transmitted light, but further color changes can be produced depending on the choice of the layer thickness, in particular of the dielectric layer, e.g.
  • Further preferred reflective embossing structures contain, for example, a liquid crystal layer which, when viewed in incident light, displays a different color than when viewed in transmitted light.
  • a different incident light / transmitted light appearance can be accomplished by adding the liquid crystal layer with a
  • Relief structure combined, in particular a diffractive relief structure, a micro-optical relief structure or a sublambda structure.
  • Other preferred reflective embossing structures include e.g. a printing layer having an effect pigment composition which, when viewed in incident light, exhibits a different color than when viewed in transmitted light, in particular a gold / blue color change
  • Gold / violet color change a green-gold / magenta color change, a violet / green color change or a silver / opaque color change shows.
  • Such inks are e.g. in WO 2011/064162 A2.
  • a different reflected-light / transmitted-light appearance can be achieved by combining the printed layer with a relief structure, in particular a diffractive relief structure, a microoptical relief structure or a sublambda structure.
  • the relief structure forming a diffractive structure is in particular a hologram structure.
  • diffractive structure are preferably of the order of magnitude
  • Wavelength of light more preferably in a range greater than 100 nm and less than 1 pm, with a range greater than 300 nm and less than 1 ⁇ m being particularly preferred.
  • the relief structure forming a micromirror arrangement is also referred to herein as a micro-optical relief structure.
  • Micro-optic relief structure is known in the art (see for example WO 2014/060089 A2).
  • the dimensions of the structural elements of the micromirror arrangement are preferably in a range that is greater than lpm and less than 40 pm, with a range greater than lpm and less than 30 pm being particularly preferred.
  • Structural elements of the micromirror arrangement have, for example, a height of up to 15 gm and a lateral extent of up to 30 gm. Both the height and the lateral extent of the micromirror arrangement
  • Structural elements of the micromirror arrangement preferably greater than 1 gm.
  • the reflective microstructure is in the form of a mosaic of a plurality of reflective mosaic elements characterized by the parameters of size, outline, relief, reflectivity, and spatial orientation, and which form a predetermined motif by exposing incident light to various groups of mosaic elements having different characteristic parameters reflect different areas of space, and in which the
  • Mosaic elements have a lateral dimension below the resolution limit of the eye.
  • FIGS. 5 to 9 show the production of a device according to the invention
  • Figures 1 to 4 illustrate the preparation of a transfer material according to the invention according to a first embodiment.
  • the transfer film structure is based on a carrier film 1, one or more functional layers 2 located thereon, and a heat sealing lacquer layer 3.
  • the functional layers 2 provide optically variable security features, e.g. Embossed holograms, micromirror elements,
  • an embossing lacquer e.g. a UV embossing lacquer, with microstructures embossed therein and a metallization present at least in some areas.
  • the functional layers 2 have only a weak adhesion to the carrier foil 1, which is e.g. can be achieved by poor adhesion of the embossing lacquer to the carrier film 1 or by the introduction of a special separating layer.
  • the shadow mask 4 can be given in particular by a perforated foil from which the shapes of the desired patches are punched out. Such a perforated film 4 is laminated on the transfer film structure with advantage. This can be done with an additional laminating adhesive (not shown in Figure 2) or simply by using the adhesive force of the already existing
  • Heat sealing lacquer 3 the side facing the heat sealing lacquer 3 may be provided in advance with a primer which enables better bonding of perforated foil 4 and functional layers 2.
  • Functional layers 2 can also be glued only area wise.
  • the patch shapes are then punched in (the broken lines 5 illustrate the punched lines). Due to the positioning tolerances, it is advantageous that the punching lines 5 have some distance from the edges of the perforated film 4.
  • the hole foil 4 is then separated together with the heat sealing lacquer layer 3 present in the area of the perforated foil 4 (i.e., outside the hole)
  • the transfer patch obtained in FIG. 4 can then be transferred to a
  • Value document substrate e.g. a security paper for the production of banknotes, applied or applied.
  • a security paper for the production of banknotes, applied or applied.
  • the patch is heated as usual, with the heat-sealing lacquer 3 melts and glued to the paper substrate.
  • the heating can range wise (ie in an area that is slightly larger than the patch itself) or over the entire surface.
  • the support film 1 is detached from the remaining layers of the patch applied to the paper substrate.
  • the functional layers 2 remain in the patch area on
  • Figures 5 to 8 illustrate the preparation of a transfer material according to the invention according to a second embodiment.
  • the transfer film structure is based on a carrier film 7, one or more functional layers 8 located thereon, and a heat sealing lacquer layer 9.
  • the functional layers 8 provide optically variable security features, e.g. Embossed holograms, micromirror elements,
  • an embossing lacquer e.g. a UV embossing lacquer, with microstructures embossed therein and a metallization present at least in some areas.
  • the functional layers 8 have only a weak adhesion to the carrier foil 7, which is e.g. can be achieved by poor adhesion of the embossing lacquer to the carrier film 7 or by the introduction of a special separating layer.
  • the transfer composite shown in FIG. 5 is provided with a laminating adhesive 10 in the regions outside of the later patch (however, the laminating adhesive 10 is not absolutely necessary, alternatively the already existing hot sealing lacquer 9 could be melted or activated in certain areas) and subsequently glued with a film 11. Due to the positioning tolerances of bonding and Punching cut, it is advantageous to end the bond with sufficient distance from the patch.
  • solid lines 12 illustrate the punching tool) and the film 11 in the areas of the holes e.g. removed by compressed air or by pulling over a sharp edge.
  • Figure 8 illustrates the resulting, provided with punching lines 13 (in the figure in the form of broken lines represents) provided layer structure.
  • the perforated foil 11 is then separated in the step of weeding off, together with the laminating adhesive layer 10 present in the area of the perforated foil 11, the diluting sealant layer 9 and the
  • the transfer patch obtained in FIG. 9 can then be transferred to a
  • Value document substrate e.g. a security paper for the production of banknotes, applied or applied.
  • a security paper for the production of banknotes, applied or applied.
  • the patch is heated as usual, with the heat-sealing lacquer 9 melts and glued to the paper substrate.
  • the heating can be carried out in regions (ie in an area which is slightly larger than the patch itself) or over the entire area.
  • the support film 7 is detached from the remaining layers of the patch applied to the paper substrate.
  • the functional layers 8 remain in the patch area on Paper substrate, since the heat-sealing lacquer 9 to the paper for a stronger adhesion than the adhesion between the carrier film 7 and functional layers. 8
  • the adhesive layer of the security element layer composite does not necessarily have to be present over the entire surface along the entire security element layer composite, but according to the variant can only be formed in the area of the transfer element which is to be produced
  • the production may be e.g. as follows:
  • the security element layer composite is a substrate detachably connected to the carrier, an optically variable effect unfolding feature layer, which after transfer of a
  • security element layer composite is formed
  • Recess of the masking film wherein optionally the part of the masking foil adjoining the recess may likewise be provided with adhesive; - The detachment of the mask film together with the masks masked, outside of the recess of the masking film present security element layer composite from the carrier substrate.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
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  • Laminated Bodies (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un matériau de transfert à élément de sécurité comportant un élément de sécurité conçu sous forme d'élément de transfert, agencé sur un substrat support. Ledit procédé comprend les étapes suivantes : a) disposer d'un substrat support (1) qui comporte dans l'ordre suivant un composite stratifié à élément de sécurité et un film de masquage (4) présentant au moins un évidement, le matériau stratifié à élément de sécurité présentant une couche de caractéristiques (2) qui est reliée de manière détachable au substrat support et déploie un effet optiquement variable, ladite couche de caractéristiques faisant face à un observateur après une transmission d'un élément de sécurité sur un substrat de document de valeur, et une couche d'adhésif (3), un composite stratifié à élément de sécurité, muni de lignes de découpage, et à transférer sur un substrat de document de valeur étant réalisé le long de l'évidement ménagé dans le film de masquage; b) détacher du substrat support le film de masquage conjointement avec le composite stratifié à élément de sécurité masqué par le film de masquage et situé en dehors de l'évidement du film de masquage.
EP19712684.0A 2018-03-21 2019-03-14 Procédé de fabrication d'un matériau de transfert à élément de sécurité Active EP3768521B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018002306.1A DE102018002306A1 (de) 2018-03-21 2018-03-21 Verfahren zum Herstellen eines Sicherheitselement-Transfermaterials und Sicherheitselement-Transfermaterial
PCT/EP2019/000081 WO2019179654A1 (fr) 2018-03-21 2019-03-14 Procédé de fabrication d'un matériau de transfert à élément de sécurité et matériau de transfert à élément de sécurité

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EP3768521A1 true EP3768521A1 (fr) 2021-01-27
EP3768521B1 EP3768521B1 (fr) 2022-01-05

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EP19712684.0A Active EP3768521B1 (fr) 2018-03-21 2019-03-14 Procédé de fabrication d'un matériau de transfert à élément de sécurité

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EP (1) EP3768521B1 (fr)
CN (1) CN111788075B (fr)
DE (1) DE102018002306A1 (fr)
WO (1) WO2019179654A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2587806B (en) * 2019-09-30 2022-12-21 De La Rue Int Ltd A method for manufacturing a security substrate

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3932505C2 (de) 1989-09-28 2001-03-15 Gao Ges Automation Org Datenträger mit einem optisch variablen Element
CN1367087A (zh) * 2001-01-21 2002-09-04 深圳市纬连科实业有限公司 层压式纸质防透光防伪造卡片及其制造方法
WO2005108108A2 (fr) 2004-04-30 2005-11-17 Giesecke & Devrient Gmbh Element de securite et son procede de production
DE102005028162A1 (de) 2005-02-18 2006-12-28 Giesecke & Devrient Gmbh Sicherheitselement und Verfahren zu seiner Herstellung
DE102005062648A1 (de) 2005-12-23 2007-06-28 Henkel Kgaa Duftstofffixierung aus Wasch- und Reinigungsmitteln an harten und weichen Oberflächen
DE102008028187A1 (de) 2008-06-12 2009-12-17 Giesecke & Devrient Gmbh Sicherheitselement mit optisch variablem Element.
DE102008036481A1 (de) * 2008-08-05 2010-02-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Sicherheitselementen mit zueinander gepasserten Motiven
DE102008047641A1 (de) * 2008-09-17 2010-04-15 Giesecke & Devrient Gmbh Sicherheitselement-Transfermaterial mit mehrschichtigem Träger
CN102639651B (zh) 2009-11-27 2016-03-16 巴斯夫欧洲公司 用于加密元件和全息图的涂料组合物
DE102009058243A1 (de) 2009-12-14 2011-06-16 Giesecke & Devrient Gmbh Dünnschichtelement mit Mehrschichtstruktur
DE102012020257A1 (de) 2012-10-16 2014-04-17 Giesecke & Devrient Gmbh Optisch variables Flächenmuster
GB2549215B (en) * 2015-06-10 2018-07-25 De La Rue Int Ltd Security devices and methods of manufacture thereof
DE102015121849A1 (de) * 2015-12-15 2017-06-22 Ovd Kinegram Ag Verfahren zur Herstellung eines Sicherheitselements sowie Transferfolie

Also Published As

Publication number Publication date
EP3768521B1 (fr) 2022-01-05
DE102018002306A1 (de) 2019-09-26
CN111788075B (zh) 2022-03-01
CN111788075A (zh) 2020-10-16
WO2019179654A1 (fr) 2019-09-26

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