EP3768521B1 - Procédé de fabrication d'un matériau de transfert à élément de sécurité - Google Patents

Procédé de fabrication d'un matériau de transfert à élément de sécurité Download PDF

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Publication number
EP3768521B1
EP3768521B1 EP19712684.0A EP19712684A EP3768521B1 EP 3768521 B1 EP3768521 B1 EP 3768521B1 EP 19712684 A EP19712684 A EP 19712684A EP 3768521 B1 EP3768521 B1 EP 3768521B1
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EP
European Patent Office
Prior art keywords
security element
film
recess
masking film
layers
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EP19712684.0A
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German (de)
English (en)
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EP3768521A1 (fr
Inventor
Christian Fuhse
Josef Schinabeck
Björn Teufel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient Currency Technology GmbH
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Giesecke and Devrient Currency Technology GmbH
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/455—Associating two or more layers using heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/46—Associating two or more layers using pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • B42D25/465—Associating two or more layers using chemicals or adhesives
    • B42D25/47—Associating two or more layers using chemicals or adhesives using adhesives

Definitions

  • Valuables such as branded items or documents of value, in particular banknotes, are often equipped with security elements which allow the authenticity of the valuable object to be checked and which at the same time serve as protection against unauthorized reproduction.
  • the security elements used for this are often not provided individually, but in the form of transfer tapes with a large number of security elements designed as transfer elements. It is characteristic of transfer tapes that the security elements are prepared on a carrier layer, with the order of the layers of the transfer elements having to be reversed as they are later on protective object should be present. During the transfer, the carrier layer is typically peeled off from the layer structure of the security elements.
  • the transfer tapes On the side opposite the carrier layer, the transfer tapes have an adhesive layer, usually made of a heat-sealing adhesive or heat-sealing lacquer, which melts when the security elements are transferred and bonds the security elements to the object to be secured.
  • the transfer tape with the heat-sealing adhesive layer is placed on the object and pressed on by means of a heated transfer stamp or a transfer roller and transferred to the object in the shape of the heated transfer stamp.
  • Transfer elements, transfer belts and the transfer of transfer elements to target substrates are for example in the EP 0 420 261 B1 and the WO 2005/108108 A2 described.
  • transfer elements e.g. transfer patches
  • transfer elements do not tear off cleanly at the border of the heated area. This leads to unclean edges and possibly also to the fact that remnants of the film composite that were torn from the layer composite in the non-bonded area stick to the transferred patches. These residues are undesirable because they later loosen and, in the form of impurities, impair subsequent processing steps, e.g. printing processes.
  • the individual transfer elements can also already be present on the transfer belt in the desired outline shape.
  • the prefabrication of separate individual security elements is useful, for example, when the security elements have a layer structure that allows an exact severing of the entire layer structure during the Makes the transfer process difficult. This is the case, for example, when the layer structure of the security element to be transferred contains a permanent carrier substrate, for example a plastic film.
  • Carrier substrates within the layer structure of security elements are useful if the security elements have to be made particularly stable, for example if they have to be self-supporting because they are to be used to close a through opening in the object to be secured.
  • Security elements the layer structure of which comprises a stable carrier substrate, typically a plastic film, must be present on a transfer material as prefabricated individual elements, which means that the outline of the security elements must be precut in the security element material.
  • the pre-cutting can be carried out, for example, by means of a laser.
  • the problem arises that the depth of cut has to be controlled very precisely in order, on the one hand, to cut through the entire layer structure of the security element, but, on the other hand, not to damage the carrier material that is separated during the transfer.
  • Plastic films are usually used as carrier materials. Plastic films have a high tear resistance, but a low one Tear propagation resistance.
  • the security element transfer material present as a continuous material tears in some places in the course of the process of transferring the security elements to objects of value. It must also be taken into account that the layer structures to be cut or the carrier foils that are not to be cut are materials with thicknesses in the micrometer range.
  • the security element layer structures typically have thicknesses in the range from about 20 ⁇ m to 30 ⁇ m, and the carrier films typically have thicknesses in the range from 10 ⁇ m to 20 ⁇ m.
  • the security element transfer material is an endless material, in particular a tape with a length of several hundred meters and a width of a few millimeters / centimeters up to several meters.
  • the security element transfer material has a security element layer composite, ie the actual security element material, and a temporary carrier, ie the material on which the security elements are "stored" on.
  • the temporary carrier is based on a carrier layer composite, consisting of a first and a second temporary carrier substrate, which are permanently bonded by means of an adhesive layer.
  • the security element layer composite is connected to a temporary carrier either directly or by means of a release layer.
  • the release layer is of a conventional type and facilitates the detachment of the security elements from the temporary carrier during the transfer process to an object of value.
  • the temporary carrier is located on the side of the security element layer composite which, after the transfer of the security elements, faces a viewer.
  • temporary carrier substrates expresses that, in contrast to the “permanent” carrier substrate, these carrier substrates are not part of the security elements.
  • the formation of the temporary carrier as a carrier layer composite prevents the stability of the temporary carrier from being impaired by cutting the temporary carrier when the contour shapes of the security elements are cut. A comparable result cannot simply be achieved by making a single temporary carrier film correspondingly thicker, since plastic films have a low tear resistance, i.e.
  • the carrier layer composite consisting of a first and a second temporary carrier substrate, which are permanently bonded by means of an adhesive layer: even if one of the temporary carrier substrates is completely severed, the further temporary carrier substrate (or possibly the further temporary carrier substrates) generally remains undamaged and accordingly stable.
  • the adhesive also forms an additional "buffer zone" between the temporary carrier substrates.
  • the one in the WO 2010/031543 A1 The method described consists of weeding the patch film before application.
  • the shapes of the patch are punched into the layers to be transferred with a punch, ie the layers are broken through with the punch.
  • these layers are then peeled off in the areas outside the patch, while they remain on the carrier film in the patch areas. This ensures that the patches have clean edges after application.
  • a disadvantage of this method is that the layer structure must have sufficient stability for weeding, which can be done, for example, by introducing a stabilizing film layer. However, this is again associated with an increase in the thickness of the finished patch, which is undesirable in practice.
  • DE 10 2015 121849 A1 discloses a method for producing a security element transfer material with a security element provided on a carrier substrate and configured as a transfer element, comprising the provision of a carrier substrate which is provided in the sequence with a security element layer composite, the security element layer composite being detachably connected to the carrier substrate , a feature layer developing an optically variable effect which, after a security element has been transferred to a value document substrate, faces a viewer, and has an adhesive layer, a security element layer composite provided with punched lines being formed to be transferred to a value document substrate, the detachment of the existing security element Layer composite from the carrier substrate.
  • the invention is based on the object of providing a method for producing a transfer element, for example a transfer patch, which is improved over the prior art.
  • a transfer element for example a transfer patch
  • viewing in incident light is illuminating the document of value from one side and viewing the document of value from the same side. Viewing in incident light lies thus, for example, when the front of the document of value is illuminated and also viewed.
  • viewing in transmitted light is illuminating a document of value from one side and viewing the document of value from another side, in particular the opposite side. Viewing in transmitted light is thus present, for example, when the back of the document of value is illuminated and the front of the document of value is viewed. The light thus shines through the value document.
  • a value document within the meaning of the invention can be, for example, bank notes or identity documents, but also shares, certificates, postage stamps, checks, admission tickets, tickets, flight tickets, ID cards, visa stickers or the like, as well as labels, seals, packaging or other elements.
  • the simplifying term “document of value” therefore always includes documents of the type mentioned in the following.
  • the term value document also includes security paper for the production of bank notes.
  • bank note includes in particular a paper bank note, a polymer bank note or a film composite bank note.
  • the transfer element ie the security element to be transferred
  • the invention is described in the following detailed description using the example of a transfer patch, and is therefore not to be construed as being restricted to a patch.
  • the functional layer can be a single (functional) layer or several (functional) layers.
  • a transfer material can be implemented according to the following preferred embodiment:
  • the starting point is a normal transfer film structure, such as is also used for the application of transfer strips.
  • a structure is based on a carrier film, one or more functional layers on it and a heat-sealing lacquer layer.
  • the functional layers provide optically variable security features, e.g. embossed holograms, micromirror elements, sub-wavelength structures and the like.
  • the optically variable security features are usually given by an embossed lacquer, e.g. a UV embossed lacquer, with microstructures embossed therein and a metallization present at least in some areas.
  • additional layers e.g. protective varnishes or primers, which are then followed by the heat-sealing varnish at the end.
  • the heat-sealing lacquer layer can actually consist of several layers of different lacquers.
  • the functional layers have only weak adhesion to the carrier film, which can be achieved, for example, by poor adhesion of the embossing lacquer to the carrier film or by introducing a special separating layer.
  • a perforated mask is applied to the above-mentioned transfer film structure.
  • the perforated mask can in particular be provided by a perforated film from which the shapes of the desired patches are punched out.
  • a perforated film is advantageously laminated or glued onto the transfer film structure. This can be done with a laminating adhesive or simply by using the adhesive strength of the heat seal lacquer that is already present.
  • the side facing the heat-sealing lacquer can advantageously be provided with a primer beforehand, which enables the perforated film and functional layers to be bonded better. Perforated film and functional layers can also only be glued in areas.
  • the perforated film can only stick to the functional layers when the heat-sealing lacquer is melted on during application. In practice, however, it is advantageous to prevent the perforated film from slipping by gluing at least in certain areas.
  • punching lines are introduced by means of a punching tool or a cutting tool in order to punch the patch shapes to be produced in this way, i.e. punch the outlines of the patches into the transfer composite.
  • the punched shape is advantageously somewhat smaller than the holes in the shadow mask.
  • the perforated mask or perforated film is then peeled off from the carrier film together with the heat-sealing lacquer layer covered by the perforated film and the functional layers in the weeding step.
  • the patches thus remain on the carrier film and a weed transfer patch film is obtained.
  • the patch is heated as usual, the heat-sealing lacquer melting on and glued to the (value document) substrate.
  • the (value document) substrate can be, for example, a paper or polymer substrate or a paper / polymer composite substrate. The heating can be done in areas (ie in an area that slightly larger than the patch itself) or over the entire surface. If the carrier film is then separated from the (value document) substrate, the functional layers remain in the patch area on the (value document) substrate, since the heat-sealing lacquer to the paper ensures stronger adhesion than the adhesion between carrier film and functional layers.
  • a transfer material can be implemented as follows:
  • the starting point is again a normal transfer film structure, such as that used, for example, for the application of transfer strips.
  • a structure is based on a carrier film, one or more functional layers on it and a heat-sealing lacquer layer.
  • the functional layers provide optically variable security features, e.g. embossed holograms, micromirror elements, sub-wavelength structures and the like.
  • the optically variable security features are usually given by an embossed lacquer, e.g. a UV embossed lacquer, with microstructures embossed therein and a metallization present at least in some areas.
  • additional layers e.g. protective varnishes or primers, which are then followed by the heat-sealing varnish at the end.
  • the heat-sealing lacquer layer can actually also consist of several layers of different lacquers.
  • the functional layers have only weak adhesion to the carrier film, which can be achieved, for example, by poor adhesion of the embossing lacquer to the carrier film or by introducing a special separating layer.
  • An initially unperforated film is applied to the above-mentioned transfer film structure, in particular by means of an adhesive layer ("laminating adhesive") that is present in some areas.
  • punching lines are introduced by means of a punching tool or a cutting tool in order to punch the patch shapes to be produced in this way, i.e. punch the outlines of the patches into the transfer composite.
  • holes are created in the initially unperforated film and the stabilizing film is removed in the perforated areas, e.g. by suction or blowing.
  • the perforated mask or perforated film is then peeled off from the carrier film together with the heat-sealing lacquer layer covered by the perforated film and the functional layers in the weeding step.
  • the patches thus remain on the carrier film and a weed transfer patch film is obtained.
  • step 2 Due to the positioning tolerances of the gluing and die cut, it is advantageous to end the gluing in step 2 above with a sufficient distance from the patch.
  • the patch shapes are then punched out and the film removed in the areas of the holes, e.g. by means of compressed air or by pulling over a sharp edge.
  • Another advantage of the method according to the invention is that the patches do not have to be torn out of a functional layer composite in the step of application to the (value document) substrate (i.e. a break has to occur within the functional layers), but rather the functional layers already through at the edge of the patch the punching are cleanly cut. This results in very clean patch edges.
  • micromirrors, hologram structures, subwavelength structures or (for example embedded) microlenses can be incorporated in the functional layers.
  • Microlenses can in particular be present in combination with microimages formed in a separate plane and in this way generate optically variable security features in the form of so-called moiré magnifiers, modulo mappers, tilt images and the like.
  • Security features based on microlenses in combination with microimages are, for example, from WO 2006/087138 A1 known.
  • Micromirrors, hologram structures, etc. are usually coated with a metallization that is present at least in some areas, which can consist of a metal, e.g. A1 or Ag, a high-index coating, e.g. ZnS or TiO 2 , or a color-changing three-layer reflector / dielectric / absorber system (e.g. a Al / SiO 2 / Cr structure).
  • a metal e.g. A1 or Ag
  • a high-index coating e.g. ZnS or TiO 2
  • a color-changing three-layer reflector / dielectric / absorber system e.g. a Al / SiO 2 / Cr structure
  • heat-sealing gel lacquer It is essential for the heat-sealing gel lacquer that at the end of the application it ensures the desired adhesion through pressure and possibly increased temperature.
  • the heat can melt it and / or activate it. It is also possible to post-treat the heat-sealing lacquer afterwards, e.g. by means of UV radiation (post-crosslinking).
  • the perforated film is preferably as thin as possible. Films with thicknesses in a range from 4.5 ⁇ m to 19 ⁇ m can be used with advantage.
  • a polyethylene terephthalate (PET) film is preferably used as the film.
  • Carrier substrate or carrier film
  • Thicker films are preferably used as carrier films, for example a 19 ⁇ m thick PET film.
  • the functional layers are punched into by means of punching, something is generally also punched into the carrier film. It must be ensured here that the carrier film does not tear after the patch has been applied to the (value document) substrate.
  • a laminating composite consisting of two films, as is the case with the WO 2010/031543 A1 is known (e.g. a 12 ⁇ m thick film and a 19 ⁇ m thick film that are glued together): then only one of the two films is punched out during punching, while the second film remains undamaged.
  • a single punched film tears more easily than a laminated composite, since the "tear" of a film requires more force than tearing it further.
  • embossed structure that can be used according to the invention is in particular embossed into an embossed lacquer.
  • optically variable effect includes not only holograms but also hologram-like diffraction structures, that is to say, for example, structures that do not produce a defined image but rather a blurred colored impression.
  • optical variable effect also subsumes diffraction patterns, structures with color-shifting effects, cinema forms, structures with a microlens effect, structures with isotropic or anisotropic scattering effects or with other interference effects, sub-wavelength structures, moth-eye structures, microlens structures and microstructures for moire mapper or modulus mapper , Micromirror structures and microprismatic structures.
  • the multilayer structure capable of interference when viewing the front side in reflected light and a second appearance of the multilayer structure capable of interference when viewing the front side in transmitted light, e.g. through cutouts in the reflective layer and / or the semitransparent layer Layer.
  • a film security element with different reflected-light / transmitted-light appearances is from WO 2009/149831 A2 known.
  • the semitransparent layer can have a multiplicity of cutouts arranged in the manner of a grid, which in their entirety result in a character, an image or a pattern. The pattern created in this way is visible in incident light and disappears in transmitted light.
  • a different reflected-light / transmitted-light appearance of the multilayer structure can be achieved by combining the structure with a relief structure, in particular a diffractive relief structure, a micro-optical relief structure or a sublambda structure.
  • Further preferred reflective embossed structures contain, for example, a liquid crystal layer which shows a different color when viewed in incident light than when viewed in transmitted light.
  • a different reflected-light / transmitted-light appearance can be achieved by combining the liquid crystal layer with a relief structure, in particular a diffractive relief structure, a micro-optical relief structure or a sublambda structure.
  • Further preferred reflective embossed structures contain, for example, a printed layer with an effect pigment composition which when viewed in reflected light shows a different color than when viewed in transmitted light, in particular a gold / blue color change, a gold / violet color change, a green-gold / Magenta color change, a purple / green color change or a silver / opaque color change.
  • Such printing inks are, for example, in the WO 2011/064162 A2 described.
  • a different reflected-light / transmitted-light appearance can be achieved by combining the printing layer with a relief structure, in particular a diffractive relief structure, a micro-optical relief structure or a sublambda structure.
  • the relief structure forming a diffractive structure is in particular a hologram structure.
  • the dimensions of the structural elements of the diffractive structure are preferably in the order of magnitude of the light wavelength, more preferably in a range that is greater than 100 nm and less than 1 ⁇ m, a range greater than 300 nm and less than 1 ⁇ m being particularly preferred.
  • the relief structure forming a micromirror arrangement is also referred to herein as a micro-optical relief structure.
  • the production of a micro-optical relief structure is known in the prior art (see e.g. WO 2014/060089 A2 ).
  • the dimensions of the structural elements of the micromirror arrangement are preferably in a range that is greater than 1 ⁇ m and less than 40 ⁇ m, a range greater than 1 ⁇ m and less than 30 ⁇ m being particularly preferred.
  • the dimensions of the structural elements of the micromirror arrangement have, for example, a height of up to 15 ⁇ m and a lateral extent of up to 30 ⁇ m. Included Both the height and the lateral extent of the structural elements of the micromirror arrangement are preferably greater than 1 ⁇ m.
  • micro-optical relief structures are, for example, from WO 2007/079857 A1 known.
  • the reflective microstructure has the form of a mosaic made up of a large number of reflective mosaic elements, which are characterized by the parameters size, outline shape, relief shape, reflectivity and spatial orientation and which form a predetermined motif by different groups of mosaic elements with different characteristic parameters incident light in reflect different spatial areas, and in which the mosaic elements have a lateral dimension below the resolution limit of the eye.
  • Figures 1 to 4 illustrate the production of a transfer material according to the invention according to a first embodiment.
  • a transfer film structure is first provided.
  • the transfer film structure is based on a carrier film 1, one or more functional layers 2 located thereon and a heat-sealing lacquer layer 3.
  • the functional layers 2 provide optically variable security features, for example embossed holograms, micromirror elements, subwavelength structures and the like.
  • the optically variable security features are generally provided by an embossed lacquer, for example a UV embossed lacquer, with microstructures embossed therein and a metallization that is present at least in some areas.
  • the functional layers 2 have only weak adhesion to the carrier film 1, which can be achieved, for example, by poor adhesion of the embossing lacquer to the carrier film 1 or by introducing a special separating layer.
  • a perforated mask 4 is applied to the transfer film structure shown.
  • the perforated mask 4 can in particular be provided by a perforated film from which the shapes of the desired patches are punched out.
  • a perforated film 4 is advantageously laminated onto the transfer film structure. This can be done with an additional laminating adhesive (in the Figure 2 not shown) or simply by using the adhesive strength of the heat seal lacquer 3 which is already present.
  • Perforated film 4 and functional layers 2 can also only be glued in areas.
  • the patch shapes are then punched (the broken lines 5 illustrate the punched lines). Because of the positioning tolerances, it is advantageous that the punching lines 5 are somewhat spaced from the edges of the perforated film 4.
  • the perforated film 4 is then separated from the carrier film 1 together with the heat-sealing lacquer layer 3 and the functional layers 2 present in the region of the perforated film 4 (ie outside the hole) in the weeding step.
  • the heat seal lacquer layer 3 and the functional layers 2 therefore remain in the patch area on the carrier film 1, since the heat seal lacquer 3 to the perforated mask 4 ensures stronger adhesion than the adhesion between carrier film 1 and functional layers 2.
  • the transfer patch obtained can then be applied or applied to a value document substrate, for example a security paper for the production of bank notes.
  • a value document substrate for example a security paper for the production of bank notes.
  • the patch is heated as usual, the heat-sealing lacquer 3 melting on and glued to the paper substrate.
  • the heating can take place in areas (ie in an area that is slightly larger than the patch itself) or over the entire area.
  • the carrier film 1 is then detached from the remaining layers of the patch applied to the paper substrate.
  • the functional layers 2 therefore remain in the patch area on the paper substrate, since the heat-sealing lacquer 3 ensures stronger adhesion to the paper than the adhesion between the carrier film 1 and the functional layers 2.
  • Figures 5 to 8 illustrate the production of a transfer material according to the invention according to a second embodiment.
  • a transfer film structure is first provided.
  • the transfer film structure is based on a carrier film 7, one or more functional layers 8 thereon and a heat-sealing lacquer layer 9.
  • the functional layers 8 provide optically variable security features, for example embossed holograms, micromirror elements, subwavelength structures and the like.
  • the optically variable security features are generally provided by an embossed lacquer, for example a UV embossed lacquer, with microstructures embossed therein and a metallization that is present at least in some areas.
  • the functional layers 8 have only weak adhesion to the carrier film 7, which can be achieved, for example, by poor adhesion of the embossing lacquer to the carrier film 7 or by introducing a special separating layer.
  • the transfer composite shown is provided with a laminating adhesive 10 in the areas outside of the later patch (the laminating adhesive 10 is, however, not absolutely necessary; alternatively, the existing heat-sealing lacquer 9 could be melted or activated in areas) and then glued with a film 11. Due to the positioning tolerances of the gluing and die cut, it is advantageous to let the gluing end at a sufficient distance from the patch.
  • the patch shapes are then punched in (the solid lines 12 illustrate the punching tool) and the film 11 is removed in the areas of the holes, for example by means of compressed air or by pulling over a sharp edge.
  • the Figure 8 illustrates the layer structure obtained, provided with cut lines 13 (shown in the figure in the form of broken lines).
  • the perforated film 11 is then separated from the carrier film 7 together with the laminating adhesive layer 10 present in the region of the perforated film 11, the heat-sealing lacquer layer 9 and the functional layers 8 in the weeding step.
  • the heat seal lacquer layer 9 and the functional layers 8 therefore remain in the patch area on the carrier film 7, since the heat seal lacquer 9 to the perforated mask 11 ensures stronger adhesion than the adhesion between carrier film 7 and functional layers 8.
  • the transfer patch obtained can then be applied or applied to a value document substrate, for example a security paper for the production of bank notes.
  • a value document substrate for example a security paper for the production of bank notes.
  • the patch is heated as usual, the heat-sealing lacquer 9 melting on and glued to the paper substrate.
  • the heating can take place in areas (ie in an area that is slightly larger than the patch itself) or over the entire area.
  • the carrier film 7 is then detached from the remaining layers of the patch applied to the paper substrate.
  • the functional layers 8 thus remain in the patch area on the paper substrate, since the heat-sealing lacquer 9 ensures stronger adhesion to the paper than the adhesion between the carrier film 7 and the functional layers 8.

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Claims (7)

  1. Procédé de fabrication d'un matériau de transfert d'élément de sécurité ayant un élément de sécurité mis à disposition sur un substrat porteur et réalisé sous forme d'élément de transfert, comprenant :
    a) la mise à disposition d'un substrat porteur (1, 7) pourvu, dans l'ordre, d'un composite multicouche d'élément de sécurité, et d'une feuille de masquage (4, 11) comportant au moins un évidement, cependant que le matériau de transfert d'élément de sécurité comporte une couche caractéristique (2, 8) jointe de manière détachable au substrat porteur et déployant un effet optiquement variable, laquelle, après un transfert d'un élément de sécurité sur un substrat pour document de valeur, est tournée vers un observateur, et une couche de colle (3, 9, 10), cependant que, le long de l'évidement de la feuille de masquage, un composite multicouche d'élément de sécurité à transférer sur un substrat pour document de valeur et pourvu de lignes de découpe (5, 13) est constitué,
    b) le détachement de la feuille de masquage conjointement avec le composite multicouche d'élément de sécurité masqué par la feuille de masquage et se trouvant à l'extérieur de l'évidement de la feuille de masquage, du substrat porteur.
  2. Procédé selon la revendication 1, cependant que l'étape a) de la mise à disposition d'un substrat porteur pourvu, dans l'ordre, d'un composite multicouche d'élément de sécurité et d'une feuille de masquage comportant au moins un évidement a lieu de telle façon que, tout d'abord, une feuille de masquage (4) pourvue d'au moins un évidement est appliquée sur le composite multicouche d'élément de sécurité, puis des lignes de découpe (5) sont engendrées le long de l'évidement dans le composite multicouche d'élément de sécurité.
  3. Procédé selon la revendication 1, cependant que l'étape a) de la mise à disposition d'un substrat porteur pourvu, dans l'ordre, d'un composite multicouche d'élément de sécurité et d'une feuille de masquage comportant au moins un évidement a lieu de telle façon que, tout d'abord, des lignes de découpe sont engendrées dans le composite multicouche d'élément de sécurité, puis une feuille de masquage pourvue d'au moins un évidement est appliquée en parfait repérage sur le composite multicouche d'élément de sécurité pourvu des lignes de découpe.
  4. Procédé selon la revendication 1, cependant que l'étape a) de la mise à disposition d'un substrat porteur pourvu, dans l'ordre, d'un composite multicouche d'élément de sécurité et d'une feuille de masquage (11) comportant au moins un évidement a lieu de telle façon que, tout d'abord, une feuille de masquage (11) à pleine surface est appliquée au moyen d'une autre couche de colle (10) sur le composite multicouche d'élément de sécurité, cependant que l'autre couche de colle est prévue seulement dans la zone à l'extérieur de l'évidement à générer dans la feuille de masquage, puis un évidement est généré le long de l'autre couche de colle dans la feuille de masquage à pleine surface par découpage (12).et le matériau de feuille de masquage découpé est enlevé, cependant que, à l'étape du découpage, simultanément les lignes de découpe (13) sont engendrées dans le composite multicouche d'élément de sécurité.
  5. Procédé selon une des revendications de 1 à 4, cependant que la couche caractéristique déployant un effet optiquement variable est basée sur une structure gaufrée réfléchissante.
  6. Procédé selon la revendication 5, cependant que la structure gaufrée réfléchissante consiste en ce qui suit : (a) une structure diffractive réfléchissante ou (b) une microstructure réfléchissante sous forme d'une mosaïque en une pluralité d'éléments réfléchissants de mosaïque qui sont caractérisés par les paramètres grandeur, forme de contour, forme de relief, réflectance et orientation spatiale et qui constituent un motif prédéterminé, ce qui a lieu en ce que différents groupes d'éléments de mosaïque à paramètres caractéristiques différents réfléchissent dans différentes zones spatiales de la lumière incidente, et dans lequel les éléments de mosaïque présentent une dimension latérale inférieure à la limite de résolution de l'œil humain.
  7. Procédé selon la revendication 5 ou 6, cependant que la structure gaufrée réfléchissante (i) comporte en tant que couches de réflexion des couches métalliques opaques, ou (ii) comporte en tant que couches de réflexion des couches transparentes à indice de réfraction élevé, ou (iii) comporte en tant que couches de réflexion des éléments en couche mince à effet de changement des couleurs par basculement, en particulier ayant une couche réfléchissante et une couche semi-transparente et une couche diélectrique agencée entre ces dernières, ou (iv) comporte en tant que couches de réflexion des couches en matériau cristaux liquides, en particulier en matériau cristaux liquides cholestérique, ou comporte (v) en tant que couches de réflexion des couches imprimées sur la base de compositions de pigments à effets ayant un effet dépendant de l'angle d'observation ou ayant différentes couleurs lors d'une observation en lumière incidente et lors d'une observation en lumière transmise, ou comporte (vi) en tant que couches de réflexion la disposition multicouche suivante : deux couches semi-transparentes et une couche diélectrique agencée entre les deux couches semi-transparentes, cependant que la disposition multicouche présente différentes teintes lors d'une observation en lumière incidente d'une part, et lors d'une observation en lumière transmise d'autre part.
EP19712684.0A 2018-03-21 2019-03-14 Procédé de fabrication d'un matériau de transfert à élément de sécurité Active EP3768521B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018002306.1A DE102018002306A1 (de) 2018-03-21 2018-03-21 Verfahren zum Herstellen eines Sicherheitselement-Transfermaterials und Sicherheitselement-Transfermaterial
PCT/EP2019/000081 WO2019179654A1 (fr) 2018-03-21 2019-03-14 Procédé de fabrication d'un matériau de transfert à élément de sécurité et matériau de transfert à élément de sécurité

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EP3768521B1 true EP3768521B1 (fr) 2022-01-05

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GB2587806B (en) * 2019-09-30 2022-12-21 De La Rue Int Ltd A method for manufacturing a security substrate

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Publication number Priority date Publication date Assignee Title
DE3932505C2 (de) 1989-09-28 2001-03-15 Gao Ges Automation Org Datenträger mit einem optisch variablen Element
CN1367087A (zh) * 2001-01-21 2002-09-04 深圳市纬连科实业有限公司 层压式纸质防透光防伪造卡片及其制造方法
WO2005108108A2 (fr) 2004-04-30 2005-11-17 Giesecke & Devrient Gmbh Element de securite et son procede de production
DE102005028162A1 (de) 2005-02-18 2006-12-28 Giesecke & Devrient Gmbh Sicherheitselement und Verfahren zu seiner Herstellung
DE102005062648A1 (de) 2005-12-23 2007-06-28 Henkel Kgaa Duftstofffixierung aus Wasch- und Reinigungsmitteln an harten und weichen Oberflächen
DE102008028187A1 (de) 2008-06-12 2009-12-17 Giesecke & Devrient Gmbh Sicherheitselement mit optisch variablem Element.
DE102008036481A1 (de) * 2008-08-05 2010-02-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Sicherheitselementen mit zueinander gepasserten Motiven
DE102008047641A1 (de) * 2008-09-17 2010-04-15 Giesecke & Devrient Gmbh Sicherheitselement-Transfermaterial mit mehrschichtigem Träger
US9453132B2 (en) 2009-11-27 2016-09-27 Basf Se Coating compositions for security elements and holograms
DE102009058243A1 (de) 2009-12-14 2011-06-16 Giesecke & Devrient Gmbh Dünnschichtelement mit Mehrschichtstruktur
DE102012020257A1 (de) 2012-10-16 2014-04-17 Giesecke & Devrient Gmbh Optisch variables Flächenmuster
GB2539390B (en) * 2015-06-10 2018-07-25 De La Rue Int Ltd Security devices and methods of manufacture thereof
DE102015121849A1 (de) * 2015-12-15 2017-06-22 Ovd Kinegram Ag Verfahren zur Herstellung eines Sicherheitselements sowie Transferfolie

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EP3768521A1 (fr) 2021-01-27
CN111788075A (zh) 2020-10-16
DE102018002306A1 (de) 2019-09-26
CN111788075B (zh) 2022-03-01
WO2019179654A1 (fr) 2019-09-26

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