EP3765428A1 - Particule de céramique de diamant reliée à du sic, module poreux qui est constitué de particules de diamant reliées à du sic, leur procédé de fabrication et leur utilisation - Google Patents

Particule de céramique de diamant reliée à du sic, module poreux qui est constitué de particules de diamant reliées à du sic, leur procédé de fabrication et leur utilisation

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Publication number
EP3765428A1
EP3765428A1 EP19713380.4A EP19713380A EP3765428A1 EP 3765428 A1 EP3765428 A1 EP 3765428A1 EP 19713380 A EP19713380 A EP 19713380A EP 3765428 A1 EP3765428 A1 EP 3765428A1
Authority
EP
European Patent Office
Prior art keywords
particles
diamond
sic
volume
particle size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19713380.4A
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German (de)
English (en)
Inventor
Björn Matthey
Steffen Kunze
Mathias Herrmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Publication of EP3765428A1 publication Critical patent/EP3765428A1/fr
Pending legal-status Critical Current

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    • C04B35/628—Coating the powders or the macroscopic reinforcing agents
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    • C09K3/00—Materials not provided for elsewhere
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    • C04B2235/42—Non metallic elements added as constituents or additives, e.g. sulfur, phosphor, selenium or tellurium
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    • C04B2235/54—Particle size related information
    • C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
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    • C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron

Definitions

  • the invention relates to SiC-bonded diamond hard particles, porous construction formed with SiC-bonded diamond particles, process for their preparation as well as their use.
  • the most diverse hard material particles are embedded alone or in the form of granules or in a material matrix, used for under different applications, in particular for a machining in the form of loops.
  • diamond particles which are known to have a very high hardness are used as the hard material particles. Dia mant alone but may have disadvantages in various applications, which may be disadvantageous, for example, in thermal cycling or binding behavior in a matrix material.
  • diamond particles can also chemically under certain environmental conditions decompose or dissolve from a matrix or a composite material.
  • the hard material particles according to the invention are formed from SiC bonded diamond and can be obtained in particle sizes between 20 pm and 5 mm.
  • the hard material particles are formed with 30% by volume - 65% by volume of diamond, 70% by volume - 35% by volume of SiC and 0% by volume to 30% by volume of Si.
  • Preferred are 40% by volume - 60% by volume of diamond 60% by volume - 40% by volume of SiC and 2% by volume to 20% by volume of Si.
  • the particle size distribution of the diamond particles may be multimodal to increase the packing density of interconnected diamond particles in hard particles.
  • a fine fraction which is 0.1 to 0.3 times the size of the diameter of a coarse diamond particle fraction and has a content of 5% by volume to 50% by volume of the coarse particle size fraction.
  • 5% by volume to 30% by volume of the coarse particle size fraction should be used in a multimodal particle size fraction.
  • the average particle size d 50 of diamond particles in the material should be kept in the range 5 pm to 500 pm, preferably 5 pm-100 pm.
  • the particle size distribution of the diamond particles in a hard material particle may be multimodal to increase the packing density. It is thus possible to use at least two different particle size fractions.
  • the finer particle size fraction should have 0.1 to 0.3 times the size of the diameter of the coarse particle size fraction and with a share of 5 vol .-% - 50 vol .-% of coarse
  • Particle size fraction may be contained in a hard material particles. Very particular advantageous are 5 vol .-% - 30 vol .-% of the coarse particle size fraction complied with.
  • the procedure is that a suspension in which diamond particles and an organic binder are contained, or Dia mantp appeal which are used with a suspension or a dispersion in which a orgasmic African binder is used.
  • a suspension in which diamond particles and an organic binder are contained or Dia mantp
  • a siliconization is carried out.
  • the addition of the powdered silicon can be done before the siliconization.
  • silicon carbide is formed by chemical reaction, so that hard material particles containing 30% by volume - 65% by volume of diamond, 70% by volume - 35% by volume of SiC and 0 to 30 Vol .-% Si are formed can be obtained.
  • the resulting diamond granules should be mixed with powdered silicon and, if appropriate, in addition with particulate spacers so that the granules are not or only minimally destroyed and they at least partially separate the diamond particles. This simplifies or allows a separation of the resulting SiC-bonded diamond hard particles without intensive grinding or the like, which would lead to strong wear on aggregates.
  • the organic binder and / or its amount to which the diamond particles are coated or contained in the suspension should be selected so that the organic binder is used as carbon source in a proportion of between 1.5% by mass and 20% by mass Relative to the total mass of a set diamond particles is used.
  • the SiC used for the binding of the diamond particles is obtained essentially from the chemical reaction of the carbon released during the pyrolysis with silicon. This improves the properties of the hard material particles thus obtained, as follows:
  • the incorporation of the diamond particles in the SiC matrix can be influenced. Higher temperatures for longer times lead to faster break-out of the diamond particles under severe tribological stress.
  • siliconizing at 1650 ° C and 20 min holding time interfaces of non-diamond carbon are formed in a thickness of> 50 nm. This causes the diamond particles are released when the SiC bond is partially worn.
  • the associated reduced strength of the bond between the diamond particles and the SiC and the Si sometimes has a positive effect when the hard material particles are used in a grinding process.
  • the diamond particles in hard-material particles may additionally be bonded to Si in a material-bonded manner, which has not been reacted in a reactive manner.
  • this free Si is typically separated from the diamond by an SiC layer thick to nm.
  • a maximum of 90%, more preferably 80% maximum of the surfaces of the diamond particles should be materially bonded to SiC and Si.
  • the added amount and type of organic binder and silicon can be selected accordingly.
  • the organic binder forms the main source of carbon for the reactive in situ formation of SiC.
  • a superficial reaction of the diamond particles with the Si occurs during the infiltration to SiC. This ensures the solid chemical bonding of the diamond particles to the SiC.
  • the carbon from the binder reduces the amount of reactive diamond and thus allows higher diamond contents to be achieved.
  • the reaction preferably leads to the formation of ⁇ -SiC.
  • a granulate possibly mixed SiC (usually the low-cost a-SiC) can also be incorporated into the formed SiC matrix / network.
  • this reduces the density of the diamond particles so that, as a rule, it does not bring any advantage over them. For special applications, in particular to reduce the price but you could add a-SiC.
  • the preparation of the hard material particles can by granulation with minimal amounts of organic binder and solvent content means
  • Dish granulator or e.g. in an Eirich mixer or by fluidized bed or spray granulation. It is also a pressing of the granules and then subsequent crushing possible. This can be higher
  • the organic binder which is pyrolyzed in an inert atmosphere at 400 ° C - 1400 ° C, may result in a non-diamond content of 1.5% by mass to 20% by mass, based on the diamond content in the pyrolyzed state.
  • the particle size distribution of the individual silicided hard material particles can be determined by means of classification / comminution, e.g. refined by screening and adapted to the needs. Before classification, a mechanical separation can be carried out, for example with a jaw crusher.
  • organic binder which can be used in the invention may be an organic chemical compound or a mixture selected from polyvinyl alcohol, acetate, polyethylene glycol, a sugar, cellulose, and phenolic resins.
  • binder is here used as a collective term for the ge used organic components, since the bond between the diamond particles in the granulated state is the main function.
  • the organic components can also be found next to the actual binder,
  • Dispersing agents wetting agents, plasticizers (e.g., PEG), defoaming agents.
  • plasticizers e.g., PEG
  • Hard material particles are infiltrated with silicon.
  • the granules with ore particles and the organic binder formed granules before or preferred after pyrolysis in the thermal treatment with Si powder having an average particle size d 50 in the range of 5 pm - 1000 pm, preferably in the range 10 pm - 150 pm and in this range with a volume of 10 vol .-% - 200 vol. -% preferably 20 vol .-% - 100 vol.% Of the content of Dia mantpumblen be added and mixed.
  • the silicon powder should have a particle size which is between 5 pm and twice the particle size of the granules of the granules formed with diamond particles and the organic binder in order to ensure sufficient spacing between the individual granules.
  • the distances are conducive to easy comminution after siliciding.
  • the content of silicon should not exceed twice that which is necessary to carry out the reactive bond. Better is 1.5 times or even only 1.1 times.
  • the infiltration can be carried out in the thermal treatment, in which the Pyroly se is carried out, but also in a second subsequently performed th thermal treatment.
  • a maximum temperature of 1650 ° C and FITS preferred should vacuum conditions are met.
  • a particle size fraction of fine silicon powder should be used in the range 5 pm - 20 pm with a volume of 10 vol .-% - 30 vol .-% of the SiC diamond granules. This finer fraction makes it possible, by the remaining porous oxide / SiC surface layers of the original Si grains, to easily singulate the SiC-bonded diamond hard-material particles.
  • components can be admixed before the siliconization or pyrolysis as spacers, which are difficult to wet by Si, do not form an alloy with Si and do not react with Si.
  • Such chemical elements or compounds can be used for coating in order to minimize a firm connection (sticking) of the granules to one another.
  • chemical elements or compounds can be preferably selected from BN, Si 3 N 4 , AlN, Al 2 0 3 , Si0 2 , Zr0 2 and a nitride, carbide of the transition metals, in particular groups 4 and 5 of the periodic table (in particular of Ti, Zr, Hf, V, Nb).
  • This route is particularly effective when the Si necessary for the reaction bonding has already been added to the granules and does not have to be supplied from the outside to the granules during the siliconization.
  • the silicated granulate streams can easily be comminuted and then classified (eg, jaw crusher, sieve, air classifier, etc.) when the Si particles have been mixed into the granules ,
  • the obtained SiC bonded hard material particles may still be agglomerated after the siliconization. Therefore, they should usually be mechanically comminuted and then classified (e.g., jaw crusher, ball mill, sieve,
  • Air classifier, etc. By the measures described above, this goes without great abrasion and wear on the units.
  • excess Si can be partially or completely dissolved out with alkaline solutions (e.g., 20% NaOH) at room temperature or elevated temperatures in the range of 60 ° C to boiling point. This too can be used to separate the hard material particles.
  • alkaline solutions e.g., 20% NaOH
  • the resulting hard particles can be used as abrasives, but they can also be introduced as a hard material particles in other matrix materials and so novel with plastic, metal or ceramic gebun dene grinding wheels / discs are produced.
  • the SiC-bonded diamond hard material particles can be processed into grinding wheels, for example with a glass matrix or metal matrix.
  • the hard materials according to the invention have, in addition to the advantage of better grinding behavior, the advantage of greater thermal stability in comparison to pure diamond.
  • SiC bonded diamond hard material particles into a mat Rixwerkstoff can be done according to typical ceramic technologies. These hard material particles can also be added separately to a dried granulate before molding. However, they can also be supplied to the starting composition and then further processed with correspondingly common ceramic molding technologies, such as, for example, by granulation, pressing, slip casting, extrusion, injection molding, hot casting or by means of additive manufacturing processes.
  • the SiC bonded diamond hard material particles essentially consist of diamond and SiC, they have a different fracture behavior than pure diamond granules. Thereby, the grinding wheels, which can be formed with a fiction, contemporary granules, under certain conditions more effective than those formed with pure diamond.
  • the fracture behavior of the SiC bonded diamond hard material particles can be adjusted.
  • different diamond qualities can be set to also adjust the fracture behavior of the hard particles.
  • the bond between diamond particles and SiC can be adjusted.
  • diamond particles containing larger residuals of catalyst Fe, Ni
  • they can be internally reduced and, by varying the siliciding temperature between 1425 ° C and 1650 ° C, breaking the diamonds under application conditions controlled (higher temperatures lead to breaking under a lower load).
  • SiC bonded diamond hard particles of defined shape are advantageous.
  • the particles can be brought into any desired shape, preferably spherical, cylindrical, prismatic, pyramidal, in particular by extrusion or by casting prior to siliconizing.
  • the hard material particles can also be used as an additive to other materials to increase the stiffness, hardness or wear resistance who the. This can e.g. in metals as particle reinforcement or in other materials intended to have anti-burglary function (e.g., concrete) or to provide extremely durable rough surfaces, for example to prevent wet slides in safety-related areas.
  • an agglomerate formed with diamond particles can be enclosed with SiC.
  • an abrasive grain has a higher thermal stability or is much more stable when interacting with oxydic or metallic matrices. This improves the incorporation of hard particles in critical matrix materials, such as carbide, Al 2 0 3 , etc ..
  • inside hollow hard material particles can by application of a suspension, in addition to diamond particles also an organic binder is contained, on silicon particles with a particle size in the range 50 pm - 150 pm or the use of a suspension in addition to diamond particles, organic binder also in the thermal treatment decomposing powdered poly merer material, preferably polyurethane is included and subsequent thermal treatment in which a pyrolysis and a reactive formation of SiC takes place, are produced.
  • organic binder also in the thermal treatment decomposing powdered poly merer material, preferably polyurethane is included and subsequent thermal treatment in which a pyrolysis and a reactive formation of SiC takes place, are produced.
  • Polystyrene, polymethyl methacrylate, polyethylene or polypropylene or starch may also be added as a preferred polymeric material.
  • Polymeric material should have a medium
  • Particle size d 50 are added in the range 30 pm to 100 pm before thermal treatment and pyrolyzed during the thermal treatment. Also, this form of hard material particles has advantageous properties in an application for grinding processing, as well as the strength of the cohesive connection between diamond particles and in particular the SiC and optionally with the Si is reduced. As a result, an improved erosion of diamond particles during grinding can be achieved, which is beneficial because of the formation of new cutting.
  • the effect is similar to the use of reduced surface areas where cohesive connections have been formed, as already described.
  • Such components have a porosity in the range 10% to 40%, preferably between 10% and 30%, an average Po renificat between 10 pm - 100 pm, preferably between 20 pm - 50pm. They consist of 30% by volume - 65% by volume of diamond 70% by volume - 35% by volume of SiC and 1% by volume to 30% by volume of Si, preferably 40% by volume - 60 % By volume of diamond, 60% by volume
  • the diamond particles contained have an average particle size in the range from 5 ⁇ m to 500 ⁇ m, preferably in the range from 30 ⁇ m to 100 ⁇ m, particularly preferably > 50 pm - 200 pm.
  • a material formed with the SiC bonded diamond particles may contain, for example, 20 vol .-% - 50 vol .-% of at least one soft phase, which primarily wears at tribological or abrasive stress and thus creates pores in the material can with a mean particle size of 10 pm
  • a porosity can be considered as it can lead to the same result in the product.
  • this phase (s) (apart from diamond, SiC and Si) can be contained in one material.
  • the production of a component can also be carried out so that diamond particles with SiC, an organic binder and particles of an organic material, be preferentially powdered plastic as pore formers, in particular polystyrene, polymethyl methacrylate, polyurethane, polyethylene or polypropylene or starch preferably having an average particle size d 50 be mixed in the range 30 pm to 100 pm before the thermal treatment and formed by a molding process.
  • This shaped body is then subjected to a thermal treatment in an oxygen-free atmosphere in which a pyrolysis of the organic constituents takes place and in the pyrolysis of the organic binder formed in situ carbon deposits in a glassy form on surfaces of diamond particles.
  • a siliconization is carried out.
  • the carbon deposited on surfaces of diamond particles and the diamond by chemical reaction silicon carbide is formed, so that
  • the component material has a composition of 30% by volume - 65% by volume of diamond, 70% by volume - 35% by volume of SiC and 0 to 30% by volume of Si and a porosity in the range from 10% to 40% having.
  • Particles of an organic material, in particular powdered plastic should be te with a share in the range 20 vol .-% to 40 vol .-% who added the.
  • the starting material for the production of the components can be admixed with silica powder with a mean particle size d 50 between 20 pm and 100 pm before the shaping, the particle size of which is retained during the shaping and can thus be formed during the siliconization of pores. Otherwise, the same parameters and procedures can be selected in the manufacture of components, as they can be used for the production of hard material particles, which in particular features of claims 5 to 7, in part from claim 8 to 11 and 13 concerns.
  • the granules should preferably be subjected to a shaping process prior to siliconization prior to pyrolysis, e.g. Pressing, isostatic pressing, extruding or molding subjected to the who.
  • siliconization which leads to a three-dimensional Bin tion of diamond particles in a SiC matrix / scaffold, as in the above-described hard material particles within the particles.
  • the granules formed at least with diamond particles and organic binder can be silicon or silicide particles supplied in a number and size, which corresponds to the number of desired pores.
  • the pores or the faster-wearing particles replacing them can be generated as follows:
  • Pore formers organic particles such as PMMA, starch, polypropylene, polystyrene may be added which may pyrolyze and form dense surface layers during siliconization, which may cause the formation of a
  • the granules may be supplied with Si or silicide particles in a number and size corresponding to the number of pores. Capillary forces are then used to in situ infiltrate the workpiece during a heat treatment, preferably in a vacuum, and no Si need be added from the outside. the.
  • faster-wearing particles in the component material can be done according to typical ceramic technologies. These particles can be mixed in between the granulated diamond granules or hard material particles, for example dry, or the starting suspension can be added. This is followed by shaping and further processing by means of pyrolysis / siliconization.
  • SiC bonded diamond hard material particles according to the invention in the finished form with diamond particles and binder and then to shape these and then pyrolyzed according to and silicify accordingly.
  • the necessary Si can be supplied either from the outside, or even directly in the diamond particle binder mixture, suspension are introduced. In the latter case, the Si particle sizes should approximate the desired pore size.
  • excess Si can be partially or completely dissolved out with alkaline solutions (e.g., 20% NaOH) at room temperature or elevated temperatures (60 ° C - boiling temperature) so as to clear the pores.
  • alkaline solutions e.g., 20% NaOH
  • the SiC bound diamond granules and porous construction parts according to the invention may also be used in multiple layers on / in one component.
  • a substrate made of SSiC or SiSiC or also short or long fiber reinforced SiC ceramic to achieve a higher rigidity or better connection to tools, can thereby form a base on which hard material particles can be arranged and fixed.
  • SiC bonded hard particles or components can be advantageously used as abrasive grains, for the production of abrasive articles, with hard material particles Verstärkk th components for protection and applications for wear protection, as an abrasive, grinding pin or for protection and applications for wear protection.
  • the invention will be explained in more detail by way of examples.
  • FIG 1 in schematic form possibilities for the production of SiC bound diamond hard particles
  • Figure 2 in schematic form possibilities for producing a
  • a shaped body is made of a mixture consisting of diamond particles which have a glass-like carbon layer on their surface by means of pyrolyzed binder.
  • particles P of polyurethane are included as pore formers.
  • the state after a siliconization is shown.
  • the diamond particles are embedded in a matrix formed with reactively formed SiC.
  • islands of Si and pores are contained.
  • Si and the pores Po form quasi "predetermined breaking points", so that with a mechanical and / or tribological stress diamond particles break out together with SiC residues from the component material and can be achieved by adapting to abrasive or tribological requirements during use
  • the pores may serve as reservoirs for abrasion or cooling or additional abrasives.
  • example 1 For the production of diamond powder with an average particle size d 50 of 50 pm is granulated together with an organic binder.
  • the Diamantpul ver is thereby mixed aqueous or in a solvent with the organic Bin and agglomerated via a Granulationstechnologie (eg Sprühgranulie tion, fluidized bed granulation, build-up granulation, etc.).
  • the granules thus obtained have an average particle size of 500 pm.
  • the granules produced are then pyrolyzed under Ar atmosphere at 800 ° C, wherein the organic constituents of the binder are converted into a glasarti gene carbon.
  • This vitreous carbon acts as a binder phase between the diamond granules in the agglomerates or a bed thereof and reacts further to silicon carbide during the reactive silicon infiltration.
  • the siliconization is carried out under vacuum conditions at 1550 ° C as bulk material.
  • the carbon-coated diamond granules produced are mixed with a mixture of coarse silicon powder having an average particle size d 50 of about 200 ⁇ m and a further fine fraction of powdered silicon having an average particle size d 50 of 10 ⁇ m.
  • the fine fraction of the silicon powder acts primarily as a spacer to prevent bridge formation between the individual granules formed with crystallized silicon and SiC.
  • the SiC bonded diamond hard particles can be easily singled in the jaw crusher and then classified by sieving again.
  • a narrow grain band can be produced, for example with particle sizes between 450 pm and 550 pm.
  • the SiC bound diamond hard particles consist of diamond and reactively formed silicon carbide and residual silicon not reacting with silicon carbide.
  • a build-up granulation should be used.
  • diamond powder with an average particle size d 50 of 50 ⁇ m is dispersed with an organic binder in a suspension for the production.
  • a two-component agglomerate is obtained, wherein the suspension containing diamond particles during the granulation on coarse silicon particles with a average particle size d 50 of 100 miti sprayed during the granulation (fluidized bed granulation).
  • the granules obtained had an average particle size d 50 of 500 pm.
  • the granules thus prepared are then pyrolyzed under non-oxidizing atmosphere at 800 ° C, wherein the organic constituents of the binder Be are converted into a glassy carbon.
  • This glassy carbon acts as a binder phase between the diamond particles on the surfaces of which a coating of this glassy carbon has formed and this carbon reacts during the reak tive silicon infiltration on to silicon carbide.
  • the resulting granules are silicided from the inside out.
  • a further fine fraction of pulverförmi gem silicon having an average particle size of 10 pm, added to who.
  • the fine fraction of the silicon powder primarily acts as a spacer to prevent bridging between granules consisting of diamond, crystallized silicon and SiC.
  • silicization results in the formation of hollow granules from the inside.
  • the granules produced consist of diamond and reactive silicon silicon carbide and possibly, remaining unreacted silicon. They can be classified and applied after siliciding.
  • Residual adherent unreacted Si could be dissolved in 20% NaOH at 60 ° C. within 1 h with stirring.
  • porous diamond abrasive bodies is based on a diamond-containing suspension. In this will be a bimodal
  • Diamond particle size fraction consisting of mean particle sizes d 50 of 50 pm and 5 pm used. Furthermore, as a further solid material component is a silicon powder having an average particle size d 50 of 100 pm in the suspension. As a placeholder is a polystyrene powder with a average particle size d 50 used by 200 pm. The ratios of the solids diamond to silicon to polystyrene amount to 2 to 2 to 1 volume. As binder in the aqueous suspension comes an aqueous
  • the processing and shaping of the suspension takes place by slip casting.
  • the diamond-containing molding is pyrolyzed under non-oxidizing atmosphere at 800 ° C and then reaction-bonded under vacuum conditions at 1550 ° C.
  • the organic binder transforms into a glassy carbon with the outgassing of volatile constituents. This glassy carbon acts as a binder phase between the diamond particles in the agglomerates and reacts during the subsequent reactive
  • Silicon infiltration on to silicon carbide The polystyrene spacers are almost completely broken down into volatiles so that they are present as pores in an abrasive article formed with the granules.
  • the silicon present in the material melts and reacts with the existing carbon formed from the pyrolyzed organic binder and settles on diamond particle surfaces. This forms a porous diamond SiC-Si-containing composite material, which can be used as an abrasive body.
  • porous diamond abrasive bodies takes place on the basis of a diamond-containing suspension. This is a bimodal diamond particle size fraction with diamond particles of a middle
  • Particle size d 50 of 50 pm and 5 pm used. Furthermore, a silicon powder having an average particle size d 50 of 100 ⁇ m is in the suspension as the second solid component.
  • the mass ratios of the solids diamond to silicon are 2 to 1.
  • Polyvinyl acetate dispersion which crosslinks on drying used.
  • the Sus pension is further added a surfactant as a foaming agent.
  • the suspension is foamed by means of a high-speed stirrer and then poured into a non-sucking mold and freeze-dried net. After removal from the mold, the heat treatment steps follow.
  • the diamond-containing molded part is pyrolyzed under non-oxidizing atmosphere at 800 ° C and then reaction bonded under vacuum conditions at 1550 ° C.
  • the organic constituents of the binder transform under gasification of volatiles into a glassy carbon coated with the surfaces of the diamond particles who the.
  • the present silicon melts and reacts with the existing carbon of the pyrolyzed binder and the diamond particle surfaces. This forms a porous diamond SiC-Si-containing composite material.
  • porous diamond abrasive bodies is based on a diamond-containing granules.
  • the granules are agglomerated by conventional granulation technology (e.g., spray granulation, fluid bed granulation, granulation, etc.) and have an average size of 200 ⁇ m-1000 ⁇ m.
  • the produced granules include a
  • the granules are bound by an organic sugar-based binder in aqueous suspension.
  • the ratios of the solids diamond to silicon to polystyrene amount to 1 to 1 to 1 volume.
  • the granules produced are then formed by a pressing process (eg by isostatic pressing or uniaxial pressing) to a Formkör by. Subsequently, the pyrolysis takes place under non-oxidative atmosphere at 800 ° C. In this case, organic constituents of the bin are converted to a vitreous carbon with the outgassing of volatile constituents, with which surfaces of diamond particles are coated. The polystyrene particles as placeholders are almost completely split into volatile components, so that they are present as pores in the finished product. at In the following reaction bonding, the silicon present in the material melts and reacts with the existing carbon obtained from the pyrolyzed binder, and diamond particle surfaces are coated with silicon carbide. This forms a porous diamond SiC-Si-containing composite material.
  • a pressing process eg by isostatic pressing or uniaxial pressing

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Composite Materials (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Ceramic Products (AREA)

Abstract

L'invention concerne une particule de céramique de diamant reliée à du SiC, un module poreux qui est constitué de particules de diamant reliées à du SiC, leur procédé de fabrication ainsi que leur utilisation. Les particules de céramique de diamant et les modules présentent une composition de 30 % en volume à 65 % en volume de diamant, de 70 % en volume à 35 % en volume de SiC et de 0 % en volume à 30 % en volume de Si, et un module présente une porosité comprise dans la plage entre 10 % et 40 %.
EP19713380.4A 2018-03-14 2019-03-14 Particule de céramique de diamant reliée à du sic, module poreux qui est constitué de particules de diamant reliées à du sic, leur procédé de fabrication et leur utilisation Pending EP3765428A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018203882.1A DE102018203882A1 (de) 2018-03-14 2018-03-14 Verfahren zur Herstellung von Hartstoffpartikeln aus SiC-gebundenem Diamant, mit dem Verfahren hergestellte Hartstoffpartikel, mit den Hartstoffpartikeln hergestellte poröse Bauteile sowie deren Verwendung
PCT/EP2019/056457 WO2019175333A1 (fr) 2018-03-14 2019-03-14 Particule de céramique de diamant reliée à du sic, module poreux qui est constitué de particules de diamant reliées à du sic, leur procédé de fabrication et leur utilisation

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JP (1) JP7335885B2 (fr)
KR (1) KR20200143390A (fr)
CN (1) CN112119051A (fr)
BR (1) BR112020018495A2 (fr)
DE (1) DE102018203882A1 (fr)
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US20210331985A1 (en) * 2020-04-28 2021-10-28 Ii-Vi Delaware, Inc. Ceramic substate with reaction-bonded silicon carbide having diamond particles
US11584694B2 (en) 2021-01-19 2023-02-21 Ii-Vi Delaware, Inc. Silicon carbide body with localized diamond reinforcement
CN113831129B (zh) * 2021-10-13 2023-06-02 富耐克超硬材料股份有限公司 一种超硬刀具的制备方法
CN113735583A (zh) * 2021-10-27 2021-12-03 河南联合精密材料股份有限公司 一种新型金刚石/碳化硅复合陶瓷及其制备方法

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AU583299B1 (en) * 1984-08-24 1989-04-27 Australian National University, The Diamond compacts and process for making same
JP3119098B2 (ja) * 1994-10-17 2000-12-18 株式会社ティ・ケー・エックス ダイヤモンド砥粒、砥石及びそれらの製造方法
JP4225684B2 (ja) * 1997-09-05 2009-02-18 エレメント シックス リミテッド ダイヤモンド−炭化ケイ素−ケイ素複合材料の製造法
ES2190814T3 (es) * 1997-09-05 2003-08-16 Frenton Ltd Procedimiento que sirve para producir granos abrasivos y granos abrasivos producidos por medio de este procedimiento.
DE19844397A1 (de) * 1998-09-28 2000-03-30 Hilti Ag Abrasive Schneidkörper enthaltend Diamantpartikel und Verfahren zur Herstellung der Schneidkörper
US7810588B2 (en) * 2007-02-23 2010-10-12 Baker Hughes Incorporated Multi-layer encapsulation of diamond grit for use in earth-boring bits
EP2176191B1 (fr) 2007-07-23 2013-01-16 Element Six Abrasives S.A. Procédé de fabrication d'un corps abrasif comprimé
US20090120009A1 (en) * 2007-11-08 2009-05-14 Chien-Min Sung Polycrystalline Grits and Associated Methods
CA2800328A1 (fr) * 2010-05-19 2011-11-24 Diamond Innovations, Inc. Comprimes de diamant-sic de haute resistance et leur procede de fabrication
DE102011109573B3 (de) * 2011-08-04 2012-10-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung von Verbundbauteilen und ein mit dem Verfahren hergestelltes Verbundbauteil
IN2014KN01373A (fr) * 2011-12-30 2015-10-16 Diamond Innovations Inc
GB201423409D0 (en) * 2014-12-31 2015-02-11 Element Six Abrasives Sa Superhard constructions & methods of making same
CN107405756B (zh) * 2015-01-28 2019-11-15 戴蒙得创新股份有限公司 易碎的陶瓷结合的金刚石复合粒子以及其制造方法
DE102015206241B4 (de) * 2015-04-08 2018-10-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. SiC-Diamant-Kompositwerkstoff und Verfahren zu seiner Herstellung
CN108025421A (zh) * 2015-09-08 2018-05-11 3M创新有限公司 具有磨料团聚体的研磨旋转工具

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US20210002534A1 (en) 2021-01-07
JP7335885B2 (ja) 2023-08-30
RU2020132167A (ru) 2022-04-14
KR20200143390A (ko) 2020-12-23
JP2021517546A (ja) 2021-07-26
WO2019175333A1 (fr) 2019-09-19
CN112119051A (zh) 2020-12-22
BR112020018495A2 (pt) 2020-12-29

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