EP3647461A4 - Procédé de dépôt autocatalytique - Google Patents
Procédé de dépôt autocatalytique Download PDFInfo
- Publication number
- EP3647461A4 EP3647461A4 EP18824025.3A EP18824025A EP3647461A4 EP 3647461 A4 EP3647461 A4 EP 3647461A4 EP 18824025 A EP18824025 A EP 18824025A EP 3647461 A4 EP3647461 A4 EP 3647461A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- electroless plating
- plating process
- electroless
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
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- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017126052A JP6466521B2 (ja) | 2017-06-28 | 2017-06-28 | 無電解めっきプロセス |
PCT/JP2018/023630 WO2019004056A1 (fr) | 2017-06-28 | 2018-06-21 | Procédé de dépôt autocatalytique |
Publications (2)
Publication Number | Publication Date |
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EP3647461A1 EP3647461A1 (fr) | 2020-05-06 |
EP3647461A4 true EP3647461A4 (fr) | 2021-05-05 |
Family
ID=64740676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP18824025.3A Pending EP3647461A4 (fr) | 2017-06-28 | 2018-06-21 | Procédé de dépôt autocatalytique |
Country Status (8)
Country | Link |
---|---|
US (1) | US20200048773A1 (fr) |
EP (1) | EP3647461A4 (fr) |
JP (1) | JP6466521B2 (fr) |
KR (1) | KR102084905B1 (fr) |
CN (1) | CN110325665B (fr) |
SG (1) | SG11201909369RA (fr) |
TW (1) | TWI668330B (fr) |
WO (1) | WO2019004056A1 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6474860B2 (ja) * | 2017-06-28 | 2019-02-27 | 小島化学薬品株式会社 | 無電解ニッケルストライクめっき液及びニッケルめっき皮膜の成膜方法 |
US20220389588A1 (en) * | 2019-11-20 | 2022-12-08 | Atotech Deutschland GmbH & Co. KG | Electroless nickel alloy plating baths, a method for deposition of nickel alloys, nickel alloy deposits and uses of such formed nickel alloy deposits |
JP2021110009A (ja) * | 2020-01-14 | 2021-08-02 | 小島化学薬品株式会社 | 無電解めっきプロセス及び二層めっき皮膜 |
EP3922753A1 (fr) * | 2020-06-10 | 2021-12-15 | ATOTECH Deutschland GmbH | Solution de placage de nickel ou de cobalt chimique |
JP6841462B1 (ja) * | 2020-07-03 | 2021-03-10 | 奥野製薬工業株式会社 | 無電解めっき用触媒付与液 |
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US20130003332A1 (en) * | 2011-06-28 | 2013-01-03 | Samsung Electro-Mechanics Co., Ltd. | Electroless surface treatment plated layers of printed circuit board and method for preparing the same |
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JP3035676B2 (ja) * | 1991-10-08 | 2000-04-24 | 奥野製薬工業株式会社 | 亜鉛−アルミニウム合金への無電解ニッケルめっき方法、触媒化処理用組成物、活性化処理用組成物及び無電解ニッケルストライクめっき用組成物 |
CN101151399B (zh) * | 2005-04-01 | 2010-12-29 | 日矿金属株式会社 | 镀覆基材 |
EP2873752B1 (fr) * | 2012-07-13 | 2020-05-20 | Toyo Kohan Co., Ltd. | Procédé de dépôt d'or sans courant et matériau revêtu d'un placage d'or |
JP2015110821A (ja) * | 2013-12-06 | 2015-06-18 | 学校法人関東学院 | アルミニウム材の表面にニッケル層を形成する方法、その形成方法を用いた半導体ウエハのアルミニウム電極表面へのニッケル層の形成方法及びその形成方法を用いて得られる半導体ウエハ基板 |
US20160230287A1 (en) * | 2014-08-25 | 2016-08-11 | Kojima Chemicals Co., Ltd. | Reductive electroless gold plating solution, and electroless gold plating method using the plating solution |
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- 2018-06-21 CN CN201880012615.2A patent/CN110325665B/zh active Active
- 2018-06-21 US US16/485,543 patent/US20200048773A1/en active Pending
- 2018-06-21 EP EP18824025.3A patent/EP3647461A4/fr active Pending
- 2018-06-21 WO PCT/JP2018/023630 patent/WO2019004056A1/fr unknown
- 2018-06-21 SG SG11201909369R patent/SG11201909369RA/en unknown
- 2018-06-21 KR KR1020197024866A patent/KR102084905B1/ko active IP Right Grant
- 2018-06-27 TW TW107122017A patent/TWI668330B/zh active
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JP2000239852A (ja) * | 1999-02-22 | 2000-09-05 | Hideo Honma | 銅パターンの選択的活性化方法およびこれに用いる活性化剤 |
JP2007031826A (ja) * | 2005-06-23 | 2007-02-08 | Hitachi Chem Co Ltd | 接続用端子、およびこれを有する半導体搭載用基板 |
JP2008174774A (ja) * | 2007-01-17 | 2008-07-31 | Okuno Chem Ind Co Ltd | パラジウム皮膜用還元析出型無電解金めっき液 |
US20110051387A1 (en) * | 2009-08-10 | 2011-03-03 | Sumitomo Bakelite Company, Ltd. | Method for electroless nickel-palladium-gold plating, plated product, printed wiring board, interposer and semiconductor apparatus |
US20130003332A1 (en) * | 2011-06-28 | 2013-01-03 | Samsung Electro-Mechanics Co., Ltd. | Electroless surface treatment plated layers of printed circuit board and method for preparing the same |
US20140076618A1 (en) * | 2012-09-14 | 2014-03-20 | Research & Business Foundation Sungkyunkwan University | Method of forming gold thin film and printed circuit board |
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Also Published As
Publication number | Publication date |
---|---|
KR20190102097A (ko) | 2019-09-02 |
SG11201909369RA (en) | 2019-11-28 |
CN110325665B (zh) | 2021-02-12 |
EP3647461A1 (fr) | 2020-05-06 |
WO2019004056A1 (fr) | 2019-01-03 |
TWI668330B (zh) | 2019-08-11 |
JP2019007067A (ja) | 2019-01-17 |
CN110325665A (zh) | 2019-10-11 |
JP6466521B2 (ja) | 2019-02-06 |
US20200048773A1 (en) | 2020-02-13 |
KR102084905B1 (ko) | 2020-03-04 |
TW201905239A (zh) | 2019-02-01 |
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