EP3643798B1 - Titankupfer, verfahren zur herstellung von titankupfer und elektronische komponente - Google Patents

Titankupfer, verfahren zur herstellung von titankupfer und elektronische komponente Download PDF

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EP3643798B1
EP3643798B1 EP19202326.5A EP19202326A EP3643798B1 EP 3643798 B1 EP3643798 B1 EP 3643798B1 EP 19202326 A EP19202326 A EP 19202326A EP 3643798 B1 EP3643798 B1 EP 3643798B1
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mass
titanium copper
copper
pole
stress relaxation
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French (fr)
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EP3643798A1 (de
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Hiroyasu Horie
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JX Nippon Mining and Metals Corp
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JX Nippon Mining and Metals Corp
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

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  • the present invention relates to titanium copper, a method for producing titanium copper, and an electronic component.
  • the present invention relates to titanium copper, a method for producing the titanium copper and an electronic component using the titanium copper, which are suitable for use in electronic components such as connectors, battery terminals, jacks, relays, switches, autofocus camera modules, and lead frames.
  • titanium copper has a relatively high strength and the best stress relaxation resistance among copper alloys. Therefore, the titanium copper has been traditionally used as a signal system terminal member.
  • the titanium copper is an age-hardening copper alloy, which has a good balance between strength and bending workability, and additionally exhibits particularly improved characteristics among various copper alloys in terms of stress relaxation resistance. Therefore, developments have been made to improve properties such as strength and bending workability while maintaining the stress relaxation resistance of the titanium copper.
  • Patent Document 1 describes a Cu-Ti-based copper alloy sheet having improved bending workability while maintaining high strength and having improved fatigue resistance while maintaining good stress relaxation resistance, wherein the copper alloy has a composition of 2.0 to 5.0% by mass of Ti, 0 to 1.5% by mass of Ni, 0 to 1.0% by mass of Co, 0 to 0.5% by mass of Fe, 0 to 1.2% by mass of Sn, 0 to 2.0% by mass of Zn, 0 to 1.0% by mass of Mg, 0 to 1.0% by mass of Zr, 0 to 1.0% by mass of Al, 0 to 1.0% by mass of Si, 0 to 0.1% by mass of P, 0 to 0.05% by mass of B, 0 to 1.0% by mass of Cr, 0 to 1.0% by mass of Mn, and 0 to 1.0% by mass of V, the total content of Sn, Zn, Mg, Zr, Al, Si, P, B, Cr, Mn and V among these elements being 3.0% or
  • Patent Document 2 describes a copper alloy sheet having improved bending workability while maintaining high strength, wherein the copper alloy sheet has a composition of 1.2 to 5.0% by mass of Ti, the balance being Cu and inevitable impurities, wherein an average crystal grain size is from 5 to 25 ⁇ m, and a ratio (maximum crystal grain size - minimum crystal grain size) / average crystal grain size is 0.20 or less, in which the maximum crystal grain size is a maximum value of average values of the crystal grain sizes in the respective regions of a plurality of regions having the same shape and sizes, which are randomly selected on the sheet surface, the minimum crystal grain size is a minimum value among average values of crystal grain sizes in the respective regions, and the average crystal grain size is an average value of the average values of the crystal grains in the respective regions, and wherein the copper alloy sheet has a crystal orientation satisfying I ⁇ 420 ⁇ / I 0 ⁇ 420 ⁇ > 1.0, in which the I ⁇ 420 ⁇ is an X-ray diffraction intensity of a
  • Patent Document 3 describes a copper alloy sheet material having improved bending workability and improved stress relaxation resistance, as well as improved spring back, wherein the copper alloy sheet has a composition of 1.0 to 5.0% by mass of Ti, the balance being Cu and inevitable impurities, and wherein the copper alloy sheet has a crystal orientation satisfying I ⁇ 420 ⁇ / I 0 ⁇ 420 ⁇ > 1.0, and has an average crystal grain size of 10 to 60 ⁇ m.
  • Patent Document 4 describes a method for producing a high-strength copper alloy having improved strength and improved bending workability by adjusting production steps from a solutionizing treatment to a cold rolling step, wherein the method comprises subjecting to a copper alloy containing 0.01 to 4.0% of Ti, the balance being Cu and inevitable impurities (1) a first solutionizing treatment carried out under heat treatment conditions of a temperature of 800 °C or higher within 240 seconds and an average crystal grain size of not more than 20 ⁇ m; (2) a first cold rolling carried out at a working ratio of less than 80%; (3) a second solutionizing treatment carried out under heat treatment conditions of a temperature of 800 °C or higher within 240 seconds and an average grain size of from 1 to 20 ⁇ m or less; (4) a second cold rolling carried out at a working ratio of 50% or less; and (5) an aging treatment at a temperature of from 300 to 700 °C for 1 hour to less than 15 hours in this order.
  • Titanium copper is known to have relatively better stress relaxation resistance.
  • the titanium copper alloys disclosed in Patent Documents 1 to 4 still cannot provide sufficient stress relaxation resistance, and so there is a need for further improvement of stress relaxation resistance.
  • the present disclosure provides titanium copper having improved stress relaxation resistance, a method for producing the titanium copper, and an electronic component using the titanium copper.
  • a titanium copper having a certain relationship among pole densities of ⁇ 111>, ⁇ 101> and ⁇ 001> in an inverse pole figure in a rolling direction (RD) has improved stress relaxation resistance.
  • a titanium copper according to an embodiment of the present invention contains from 2.0 to 4.5% by mass of Ti, and a total amount of from 0 to 0.5% by mass of at least one selected from the group consisting of Fe, Co, Ni, Cr, Zn, Zr, P, B, Mo, V, Nb, Mn, Mg, and Si as a third element, the balance being copper and inevitable impurities, wherein a pole density of ⁇ 111> is from 2.5 to 4.5, and a pole density of ⁇ 001> is higher than that of ⁇ 101>, in an inverse pole figure in a rolling direction.
  • a method for producing titanium copper comprises casting a titanium copper ingot containing from 2.0 to 4.5% by mass of Ti, and a total amount of from 0 to 0.5% by mass of at least one selected from the group consisting of Fe, Co, Ni, Cr, Zn, Zr, P, B, Mo, V, Nb, Mn, Mg, and Si as a third element, the balance being copper and inevitable impurities, and subjecting the cast ingot to hot rolling; and then carrying out a cold rolling step and a subsequent final solutionizing treatment step, wherein the hot rolling step comprises treating the ingot such that a compressive strain per pass is from 0.05 to 0.15 and a strain rate of a final pass is from 15.0 to 25.0, and wherein the final solutionizing treatment step comprises carrying out a treatment at a heating temperature (°C) of from 52 ⁇ X + 610 to 52 ⁇ X + 680 in which X is an addition amount (% by mass) of Ti, for a residence time of from 50
  • titanium copper having improved stress relaxation resistance
  • a method for producing the titanium copper and an electronic component using the titanium copper.
  • Titanium copper according to an embodiment of the present invention has a Ti concentration of from 2.0 to 4.5% by mass.
  • the titanium copper has increased strength and increased electrical conductivity by dissolution of Ti in a Cu matrix with a solutionizing treatment and by dispersion of fine precipitates in the alloy with an aging treatment.
  • Ti concentration is less than 2.0% by mass, deposition of precipitates is not sufficient and any desired strength cannot be obtained. If the Ti concentration is more than 4.5% by mass, workability is deteriorated and the material is easily cracked during rolling. In terms of a balance between strength and workability, a preferable Ti concentration is from 2.5 to 3.5% by mass.
  • the titanium copper according to an embodiment of the present invention contains at least one of third elements selected from the group consisting of Fe, Co, Ni, Cr, Zn, Zr, P, B, Mo, V, Nb, Mn, Mg, and Si, whereby the strength can be further improved.
  • third elements selected from the group consisting of Fe, Co, Ni, Cr, Zn, Zr, P, B, Mo, V, Nb, Mn, Mg, and Si, whereby the strength can be further improved.
  • these third elements can be contained in a total amount of from 0 to 0.5% by mass, and in view of the balance between strength and workability, the titanium copper preferably contains one or more of the above elements in a total amount of from 0.1 to 0.4% by mass.
  • the titanium copper contains from 0.01 to 0.15% by mass of each of Zr, P, B, V, Mg, and Si, and from 0.01 to 0. 3% by mass of each of Fe, Co, Ni, Cr, Mo, Nb and Mn, and from 0.1 to 0.5% by mass of Zn.
  • the titanium copper according to an embodiment of the present invention is characterized that a pole density of ⁇ 111> is controlled within a certain range in an inverse pole figure in a RD direction, and a relationship between pole densities of ⁇ 101 > and ⁇ 001> is constant. More particularly, the pole density of ⁇ 111> is from 2.5 to 4.5, and the pole density of ⁇ 001> is higher than the pole density of ⁇ 101>. If both of these conditions are satisfied, the stress relaxation resistance can be further improved.
  • the pole density of ⁇ 111> lower than 2.5 or higher than 4.5 cannot improve the stress relaxation resistance.
  • the pole density of ⁇ 001> lower than that of ⁇ 101> cannot improve the stress relaxation resistance.
  • the pole density of ⁇ 111> is from 2.5 to 4.5, the pole density of ⁇ 001> lower than that of ⁇ 101> cannot improve the stress relaxation resistance, or even if the pole density of ⁇ 001> is higher than that of ⁇ 101>, the pole density of ⁇ 111> lower than 2.5 or higher than 4.5 cannot improve the stress relaxation resistance.
  • the pole density of ⁇ 111> is preferably from 2.7 to 4.3, and more preferably from 2.9 to 4.1.
  • the pole density of ⁇ 101> is typically from 0 to 2.5, and the pole density of ⁇ 001> is typically from 0.5 to 3.5.
  • the "inverse pole figure in RD direction” refers to a measurement result of the inverse pole figure in the RD direction in crystal orientation analysis in EBSD (Electron Back Scatter Diffraction) measurement on a rolled surface using an analysis software (for example, OIM Analysis available from TSL Solutions, Inc.) attached to the EBSD.
  • the Inverse pole figures can be obtained for the ND direction, the RD direction, and the TD direction.
  • the inverse pole figure in the RD direction is used in view of a stress axis applied when evaluating the stress relaxation resistance. It should be noted that the pole density in a state where the crystal orientation is random is 1.
  • the titanium copper according to an embodiment of the present invention can have improved stress relaxation resistance. In one Embodiment, it has a feature that a stress relaxation rate is 10% or less after maintaining the titanium copper at 300 °C for 10 hours.
  • an average crystal grain size on the rolled surface to a range of from 2 to 30 ⁇ m, more preferably to a range of from 2 to 15 ⁇ m, and even more preferably a range of from 2 to 10 ⁇ m, from the viewpoint of improving the strength, bending workability and fatigue characteristics with a good balance.
  • the average crystal grain size refers to an average crystal grain size in a case where an orientation difference of 5° or more is regarded as a crystal grain boundary by a crystal orientation analysis in EBSD (Electron Back Scattering Diffraction) measurement on the rolled surface using an analysis software (e.g.,, OIM Analysis available from TSL Solutions) attached to the EBSD, as with the average crystal grain size used for calculating the coefficient of variation of the crystal grain size as described above.
  • EBSD Electro Back Scattering Diffraction
  • the titanium copper according to the embodiment of the present invention can achieve a 0.2% yield strength of 800 MPa or more in a direction parallel to the rolling direction.
  • the 0.2% yield strength of the titanium copper according to the present invention is 850 MPa or more in a preferred embodiment, 900 MPa or more in a more preferred embodiment, and 950 MPa or more in an even more preferred embodiment.
  • the upper limit value of the 0.2% yield strength is not particularly limited from the viewpoint of the intended strength of the present invention. However, in terms of labors and costs, the upper limit is typically 1200 MPa or less, and more typically 1100 MPa or less.
  • the 0.2% yield strength of titanium copper in the direction parallel to the rolling direction is measured in accordance with JIS-Z2241 (2011) (Metal Material Tensile Test Method).
  • the titanium copper according to the present invention can have a thickness of 1.0 mm or less, and in a typical embodiment, it can have a thickness of from 0.02 to 0.8 mm, and in a more typical embodiment, it can have a thickness of from 0.05 to 0.5 mm.
  • the titanium copper according to the present invention can be processed into various copper products, such as plates, strips, tubes, bars and wires.
  • the titanium copper according to the present invention can preferably be used as a conductive material or a spring material in electronic parts including, but not limited to, switches, connectors, autofocus camera modules, jacks, terminals (particularly battery terminals), and relays. These electronic components can be used, for example, as on-board components or components for electric/electronic devices.
  • the method for producing the titanium copper according to an embodiment of the present invention includes casting an titanium copper ingot containing from 2.0 to 4.5% by mass of Ti, a total amount of from 0 to 0.5% by mass of at least one selected from the group consisting of Fe, Co, Ni, Cr, Zn, Zr, P, B, Mo, V, Nb, Mn, Mg, and Si as a third element, the balance being copper and inevitable impurities, and subjecting the cast ingot to hot rolling, and then carrying out a cold rolling step and a subsequent final solutionizing treatment step.
  • a suitable production example of the titanium copper according to this embodiment is sequentially described for each step.
  • Production of the ingot by melting and casting is basically carried out in a vacuum or in an inert gas atmosphere. If the additive element remains un-melted during melting, it does not effectively act on improvement of strength. Therefore, in order to eliminate un-melted residue, a high melting point third element such as Fe and Cr should be sufficiently agitated after being added, and then maintained for a certain period of time. On the other hand, since Ti is relatively easily dissolved in Cu, it may be added after the third element is melted. Therefore, to Cu is added at least one selected from the group consisting of Fe, Co, Ni, Cr, Zn, Zr, P, B, Mo, V, Nb, Mn, Mg, and Si so as to contain them in a total amount of from 0 to 0. 5% by mass and then added Ti so as to contain it in an amount of from 2.0 to 4.5% by mass to produce the ingot.
  • homogenized annealing is preferably carried out by heating at 900 to 970 °C for 3 to 24 hours, and the hot rolling is then preferably carried out.
  • a temperature before and during the hot rolling is preferably 960 °C or less, and that a temperature is preferably 700 °C or more for a pass from an original thickness to an entire working ratio of 80%.
  • a compressive strain per pass is from 0.05 to 0.15, and a strain rate of a final pass is from 15.0 to 25.0/s, and in a preferred embodiment, from 18.0 to 22.0/s.
  • the working ratio of the cold rolling is typically 60% or more.
  • the working ratio per pass can be obtained according to the following Equation (2), where T 0 is a thickness of the ingot before rolling by the pass and T is a thickness of the ingot at the end of rolling by the pass:
  • Working Ratio % T 0 ⁇ T / T 0 ⁇ 100
  • Annealing can be then carried out.
  • the annealing is typically carried out at 900 °C for 1 to 5 minutes.
  • the cold rolling and annealing can be repeated as needed.
  • a first solutionizing treatment is preferably carried out after repeating the cold rolling and annealing as needed.
  • the reason why the solutionizing treatment is carried out in advance is to reduce burdens in a final solutionizing treatment. That is, in the final solutionizing treatment, it is not a heat treatment for dissolving second phase grains and solutionizing is already achieved, so it is sufficient to cause recrystallization while maintaining that state and thus to be a light heat treatment.
  • the first solutionizing treatment may be carried out at a heating temperature of from 850 to 900 °C for 2 to 10 minutes. In this case, it is preferable to increase the heating rate and the cooling rate as much as possible so that the second phase grains do not precipitate. It should be noted that the first solutionizing treatment may not be carried out.
  • the working ratio of the intermediate rolling is typically 60% or more.
  • the heating temperature is near a solid solution limit of the second phase grain composition. More particularly, the heating temperature (°C) is in a range of from 52 ⁇ X + 610 to 52 ⁇ X + 680 where X is an addition amount (% by mass) of Ti.
  • the heating temperature is lower than 52 ⁇ X + 610 °C, it causes non-recrystallization, and in a case where the heating temperature is higher than 52 ⁇ X + 680, the crystal grain size becomes coarse. In both cases, the strength of titanium copper finally obtained is decreased.
  • the pole density of ⁇ 111> and the relationship between the pole densities of ⁇ 101> and ⁇ 001> in the inverse pole figure in the RD direction can be controlled by adjusting a heating time in the final solutionizing treatment.
  • the heating time can be, for example, from 50 to 200 seconds, and typically from 90 to 180 seconds.
  • Final cold rolling is carried out following the final solutionizing treatment.
  • the final cold rolling can increase the strength.
  • the working ratio is preferably from 5 to 50%, and more preferably from 20 to 40%.
  • An aging treatment is carried out following the final cold rolling. Preferably, it is carried out by heating at a material temperature of from 300 to 500 °C for 1 to 50 hours, and more preferably heating at a material temperature of from 350 to 450 °C for 10 to 30 hours.
  • the aging treatment is preferably carried out in an inert atmosphere such as Ar, N 2 and H 2 in order to suppress generation of an oxide film.
  • the method for producing the titanium copper according to the embodiment of the present invention includes:
  • steps such as grinding, polishing, and shot blast pickling for removing oxide scales on the surface may be carried out between the above steps.
  • the ingot was subjected to homogenized annealing at 950 °C for 5 hours, followed by hot rolling at 900 to 950 °C to obtain a hot rolled sheet having a thickness of 10 mm. After descaling by chamfering, cold rolling and annealing were repeated to obtain a raw strip thickness (1.5 mm), and a first solutionizing treatment was carried out for the raw strip. The first solutionizing treatment was carried out by heating at 850 °C for 8 minutes, and then cooling in water. The intermediate cold rolling was then carried out, followed by the final solution treatment, and followed by cooling in water.
  • Each JIS 13B sample was prepared, and the 0.2% yield strength in the direction parallel to the rolling direction was measured using a tensile tester according to the measurement method as described above.
  • each sample was measured for an average crystal grain size in the case where an orientation difference of 5° or more was regarded as a crystal grain boundary, by crystal orientation analysis in EBSD (Electron Back Scatter Diffraction) measurement (e.g., OSL Analysis available from TSL Solutions) using an analysis software attached to the EBSD.
  • EBSD Electro Back Scatter Diffraction
  • An inverse pole figure in the RD direction was measured by crystal orientation analysis in an EBSD (Electron Back Scatter Diffraction) measurement on a rolled surface using an analysis software attached to the EBSD (for example, OIM Analysis available from TSL Solutions), and pole densities of ⁇ 111>, ⁇ 101>, ⁇ 001> were evaluated.
  • EBSD Electro Back Scatter Diffraction
  • OIM Analysis available from TSL Solutions
  • the stress relaxation rate after maintaining each sample at 300 °C for 10 hours was measured.
  • Each strip-shaped sample having a width of 10 mm and a length of 100 mm was collected such that a longitudinal direction of the sample was parallel to the rolling direction.
  • the load was removed after heating at 300 °C for 10 hours, and an amount of permanent deformation (height) y was measured as shown in FIG. 2 to calculate the stress relaxation rate ⁇ [y (mm) / y 0 (mm)] ⁇ 100 (%) ⁇ .
  • Comparative Example 1 the compressive strain per pass was too low and thus the pole density of ⁇ 111> was lower than 2.5, so that an improved stress relaxation resistance as compared with Examples 1 to 18 could not be obtained.
  • Comparative Example 2 the compressive strain per pass was too high, and thus the pole density of ⁇ 111> was too much higher than 4.5, so that an improved stress relaxation resistance as compared with Invention Examples 1 to 18 could not be obtained.
  • Comparative Example 5 the temperature of the final solutionizing treatment was too low, and thus the pole density of ⁇ 111> was higher than 4.5, so that an improved stress relaxation resistance as compared with Examples 1 to 18 could not be obtained.
  • Comparative Example 6 the temperature of the final solutionizing treatment was too high, and thus the pole density of ⁇ 111> was lower than 2.5, so that an improved stress relaxation resistance as compared with Examples 1 to 18 could not be obtained.
  • Comparative Example 7 the retention time of the final solutionizing treatment was too short, so that the crystal grain size was of mixed grain type, and the pole density of ⁇ 001> was lower than that of ⁇ 101 >, whereby an improved stress relaxation resistance as compared with Examples 1 to 18 could not be obtained.
  • Comparative Example 8 the retention time of the final solutionizing treatment was too long, the crystal grain size was coarsened, and the pole density of ⁇ 001> was lower than that of ⁇ 101 >, whereby an improved stress relaxation resistance as compared with Examples 1 to 18 could not be obtained.
  • Comparative Examples 9 to 11 show cases where the addition amount of titanium or the third element was not appropriate.
  • the amounts of the additive element and titanium were too high, respectively, so that cracking occurred during hot rolling, and production was thus impossible.
  • Comparative Example 10 the addition amount of Ti was too low, so that the pole density of ⁇ 111> was lower than 2.5 and the pole density of ⁇ 001> was lower than that of ⁇ 101>, whereby an improved stress relaxation resistance as compared with Examples 1 to 18 could not be obtained.

Claims (4)

  1. Titankupfer, das 2,0 bis 4,5 Massen-% Ti und eine Gesamtmenge von 0 bis 0,5 Massen-% von zumindest einem Element ausgewählt aus der aus Fe, Co, Ni, Cr, Zn, Zr, P, B, Mo, V, Nb, Mn, Mg und Si bestehenden Gruppe als drittem Element enthält, wobei der Rest Kupfer und unvermeidbare Verunreinigungen sind, wobei in einer umgekehrten Polfigur in einer Walzrichtung eine Poldichte von <111> 2,5 bis 4,5 beträgt und eine Poldichte von <001> höher als jene von <101> ist.
  2. Titankupfer nach Anspruch 1, wobei in einer Kristallausrichtungsanalyse in der EBSD-Messung auf einer gewalzten Oberfläche eine mittlere Kristallkorngröße 2 bis 30 µm beträgt, wenn eine Ausrichtungsdifferenz von 5° oder mehr als Korngrenze betrachtet wird.
  3. Elektronische Komponente, die ein Titankupfer nach Anspruch 1 oder Anspruch 2 umfasst.
  4. Verfahren zur Herstellung von Titankupfer, wobei das Verfahren das Gießen eines Titankupferblocks, der 2,0 bis 4,5 Massen-% Ti und eine Gesamtmenge von 0 bis 0,5 Massen-% von zumindest einem Element ausgewählt aus der aus Fe, Co, Ni, Cr, Zn, Zr, P, B, Mo, V, Nb, Mn, Mg und Si bestehenden Gruppe als drittem Element enthält, wobei der Rest Kupfer und unvermeidbare Verunreinigungen sind, und das Aussetzen des Gussblocks gegenüber Heißwalzen und das anschließende Durchführen eines Kaltwalzschritts und eines anschließenden finalen Lösungsbehandlungsschritts umfasst,
    wobei der Heißwalzschritt das Behandeln des Blocks umfasst, sodass eine Druckbelastung pro Durchlauf 0,05 bis 0,15 beträgt und eine Belastungsrate eines finalen Durchlaufs 15,0 bis 25,0/s beträgt, und
    wobei der finale Lösungsbehandlungsschritt das Durchführen einer Behandlung bei einer Erhitzungstemperatur (°C) von 52 x X + 610 bis 52 x X + 680, wobei X eine zugesetzte Menge (Massen-%) von Ti ist, für eine Verweildauer von 50 bis 200 s umfasst.
EP19202326.5A 2018-10-22 2019-10-09 Titankupfer, verfahren zur herstellung von titankupfer und elektronische komponente Active EP3643798B1 (de)

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JP2790238B2 (ja) 1994-03-23 1998-08-27 日鉱金属株式会社 曲げ性および応力緩和特性に優れたチタン銅合金の製造方法
JP4357548B2 (ja) 2007-06-14 2009-11-04 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｔｉ系銅合金板材およびその製造法
JP4563480B2 (ja) 2008-11-28 2010-10-13 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
EP2196548B1 (de) * 2008-12-02 2012-05-16 Dowa Metaltech Co., Ltd. Cu-Ti-basiertes Kupferlegierungsfolienmaterial und Herstellungsverfahren dafür
US8097102B2 (en) * 2008-12-08 2012-01-17 Dowa Metaltech Co., Ltd. Cu-Ti-based copper alloy sheet material and method of manufacturing same
JP6263333B2 (ja) 2013-03-25 2018-01-17 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｔｉ系銅合金板材およびその製造方法並びに通電部品

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