EP3637030A1 - Procédé et installation de fabrication d'entretoises - Google Patents

Procédé et installation de fabrication d'entretoises Download PDF

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Publication number
EP3637030A1
EP3637030A1 EP19202016.2A EP19202016A EP3637030A1 EP 3637030 A1 EP3637030 A1 EP 3637030A1 EP 19202016 A EP19202016 A EP 19202016A EP 3637030 A1 EP3637030 A1 EP 3637030A1
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EP
European Patent Office
Prior art keywords
chip
chip material
dry air
air flow
dryer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19202016.2A
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German (de)
English (en)
Inventor
Clemens Pfeifer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pfeifer Holz GmbH
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Pfeifer Holz GmbH
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Filing date
Publication date
Application filed by Pfeifer Holz GmbH filed Critical Pfeifer Holz GmbH
Publication of EP3637030A1 publication Critical patent/EP3637030A1/fr
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F26B3/02—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air
    • F26B3/06—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air the gas or vapour flowing through the materials or objects to be dried
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B17/00—Machines or apparatus for drying materials in loose, plastic, or fluidised form, e.g. granules, staple fibres, with progressive movement
    • F26B17/02—Machines or apparatus for drying materials in loose, plastic, or fluidised form, e.g. granules, staple fibres, with progressive movement with movement performed by belts carrying the materials; with movement performed by belts or elements attached to endless belts or chains propelling the materials over stationary surfaces
    • F26B17/04—Machines or apparatus for drying materials in loose, plastic, or fluidised form, e.g. granules, staple fibres, with progressive movement with movement performed by belts carrying the materials; with movement performed by belts or elements attached to endless belts or chains propelling the materials over stationary surfaces the belts being all horizontal or slightly inclined
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B17/00—Machines or apparatus for drying materials in loose, plastic, or fluidised form, e.g. granules, staple fibres, with progressive movement
    • F26B17/02—Machines or apparatus for drying materials in loose, plastic, or fluidised form, e.g. granules, staple fibres, with progressive movement with movement performed by belts carrying the materials; with movement performed by belts or elements attached to endless belts or chains propelling the materials over stationary surfaces
    • F26B17/08—Machines or apparatus for drying materials in loose, plastic, or fluidised form, e.g. granules, staple fibres, with progressive movement with movement performed by belts carrying the materials; with movement performed by belts or elements attached to endless belts or chains propelling the materials over stationary surfaces the belts being arranged in a sinuous or zig-zag path

Definitions

  • the invention relates to a method and a system for producing blocks, in particular pallet blocks, with the features in the preamble of the main claim.
  • the invention solves this problem with the features in the main claim.
  • the claimed manufacturing technique i.e. the system and the associated process have various advantages.
  • a low residual moisture of e.g. 2 to 4% atro can be achieved in an advantageous manner.
  • the residual moisture can be up to 6% dry.
  • the air dryer which is designed as a multi-layer continuous dryer, allows optimal use of the thermal energy contained in the heated dry air flow and improved handling of the moisture absorbed in the dry air flow after flowing through the chip material layers.
  • the successive flow through several differently moist chip material layers is advantageous for this.
  • the multiple layers of chip material can be arranged one above the other and / or next to one another.
  • An arrangement one above the other is favorable in order to be able to flow through the differently moist layers of chip material directly one after another.
  • a substantially vertical and continuous alignment of the dry air flow is advantageous for the drying effect. Flow losses can be kept low.
  • it is easier to implement a switchable bypass on the multi-layer continuous dryer which, if necessary, enables a direct flow to the subsequent, in particular relatively wet, chip material layer. This is done e.g. if the subsequent chip position is too low.
  • the chip material is transported in a pass through the multi-layer continuous dryer, the wet chip material entering at a feed and the dried chip material exiting at a discharge after the pass.
  • the chip material can preferably be implemented vertically between the chip material layers separated from one another. Within the chip material layers, the chip material can also be moved in the pass. This is preferably a circumferential movement, for example a circumferential rotary movement about a central and preferably upright axis of rotation.
  • the continuous movement of the chips can work in the counterflow principle be directed against the flow direction of the dry air flow.
  • the multi-layer continuous dryer can be designed and designed in such a way that the chip material layers are subjected to a uniformly conditioned dry air flow during their continuous movement.
  • the dry air flow can therefore have the same temperature in the entire flow and exposure area. This facilitates and simplifies the heating of the dry air flow. This can be supplied by supply air from the surroundings.
  • the dry air stream can alternatively or additionally be circulated and possibly regenerated or processed, in particular dehumidified.
  • the differently moist chip material layers can each be arranged on a movable and air-permeable chip material carrier that allows the dry air flow to pass through. Due to the movable chip carrier, the chip is transported through the multi-layer continuous dryer.
  • the chip carriers can be used in different ways, e.g. be designed as bands, disks or rings. Disc-shaped or ring-shaped chip carriers can execute a circular movement about a central and preferably upright axis of rotation.
  • the chip carriers can be arranged separately from one another, in particular when arranged one above the other.
  • a converter for the chip material can be arranged between the separate chip material carriers.
  • the chip carriers and chip layers through which the dry air flow flows successively are moved in opposite directions during the passage. This results in opposite drying advances in the chip material layers on the dry air flow one after the other flowed through places. As the drying progresses, the moisture drops and the temperature rises locally in the chip material layer.
  • the relative humidity values of the locations of the chip material flow through one after the other add up. Seen over the length of the layer, the dry air exiting after the last chip material layer has essentially the same moisture value or water content everywhere. The dry air flow absorbs essentially the same amount of water and moisture at each of these chip flow locations. In addition, the opposite drying progress results in a substantially constant heat emission from the dry air flow at the points through which the flow passes.
  • the relatively dry layer of chip material flowed through first has a higher temperature than the relatively wet layer of chip material flowed through subsequently.
  • the number of chip material layers and chip carrier that are arranged next to and / or above one another and flowed through in succession can vary.
  • the number of layers and supports can e.g. amount to two. Alternatively, it can be higher and e.g. be three or more.
  • the multi-layer continuous dryer can have a heating device and a circulating device for the dry air flow. These can be designed differently.
  • the heater can e.g. be designed as a heat exchanger, the primary energy e.g. comes from the waste heat of a thermal power station or from a burner or the like.
  • the dry air stream can also be heated in other ways, e.g. through direct firing.
  • the circulating device can move the dry air flow from an access point to an exit point and possibly additionally or alternatively in a circuit.
  • the Circulation device is equipped with suitable fans or the like. It can also have a device for heat recovery and / or dehumidification of the dry air flow.
  • the drying device can have one or more further dryers.
  • This can e.g. be a mechanical dryer, especially a squeeze mechanism.
  • the mechanical dryer can be connected upstream of the air dryer.
  • the energy requirement of the air dryer or multi-layer continuous dryer can be reduced by an upstream mechanical dehumidification.
  • the desired residual moisture content in the dried chip material can be achieved with less effort.
  • a particle former can be connected upstream and / or downstream of the drying device. This changes, in particular reduces the particle size of the chip material and can preferably also set it to a desired size.
  • a particle shaper can be formed in any suitable manner, e.g. as a hammer mill.
  • Drying can be simplified and improved with a particle shaper connected upstream of the drying device, in particular the air dryer or multi-layer continuous dryer.
  • a particle shaper connected upstream of the drying device, in particular the air dryer or multi-layer continuous dryer.
  • a particle shaper can be connected upstream and / or downstream of a mechanical dryer of the drying device.
  • a particle former can also be combined with a mechanical dryer to form a structural and functional unit.
  • a particle shaper connected downstream of the drying device enables the particle size to be changed, in particular reduced, to the extent that is advantageous and desired for the subsequent extrusion.
  • the chip material Before the subsequent extrusion, the chip material can also be stored. A classification of the dried chip material according to the particle size is unnecessary. It can alternatively take place, if necessary before saving.
  • One or more addition devices for the dried chip material can be arranged between the drying device and the extrusion device.
  • a binder can be added to the dried chips in an addition device.
  • This can e.g. a thermosetting glue or a thermosetting organic binder, which separates water or another liquid during curing or polymerization.
  • Other binders are also possible.
  • the dried chip material can have a slightly increased moisture content of e.g. 5 to 8% dry, preferably 6 to 7% dry.
  • the extrusion device has an extrusion press which produces a quasi-endless and tied strand from the chip material.
  • the activated binding agent ensures the desired or required strength of the strand and the blocks. This applies, for example, to a specified nail pull-out strength.
  • the blocks can thus meet the strength requirements set in operation, especially when Use as pallet blocks. They have high compressive strength, impact resistance and breaking strength.
  • the extrusion press can have a chip feed and a driven pressing member, e.g. have an oscillating driven ram or a press screw. It can also have a binding device for the extruded chip material provided with the binder or for the strand. The binding device activates the binding agent contained in the chip material. This can be done in different ways.
  • the binding device can e.g. have a vaporization device and / or high-frequency heating.
  • An evaporator is e.g. an advantage for a thermosetting glue and for its polymerization.
  • a combination of a vapor deposition device and a high-frequency heating can be advantageous for the organic binder mentioned.
  • condensation can suddenly release the thermal energy or enthalpy contained in the steam in the applied strand area and ensure uniform heat dissipation and extreme acceleration of a thermal setting reaction of the strand material.
  • the supply of superheated steam has the advantage that the condensation and the phase change are delayed and evenly distributed over the strand cross section. Early condensation on the exposed outer surface or pinhole surface of the strand can be prevented.
  • a high-frequency heating can preferentially and locally heat local binder concentrations and also moisture excretions of an organic binder, for example, with high-frequency electromagnetic alternating fields.
  • a combination of steaming and high-frequency heating can be reduced by the synergistic addition of the amount of steam entered and thus the moisture input in the line. This is advantageous if the blocks should have a low residual moisture and a cooling and drying effort for the blocks can be reduced or avoided.
  • the reduced steam input can also improve the surface quality of the strand and thus the blocks made from it.
  • a cooling section of the extrusion press following the binding device is also advantageous.
  • the claimed system and the claimed method can have the advantageous configurations mentioned below. These can be used individually or in any combination.
  • the multiple layers of chip material can be arranged one above the other and / or next to one another in the multi-layer continuous dryer. An arrangement one above the other is preferred.
  • a particle shaper can be connected upstream and / or downstream of the drying device in the system, which changes, in particular reduces, and preferably adjusts the particle size of the chip material.
  • An addition device can be arranged between the drying device and the extrusion device, which adds a binder to the dried chip material, in particular a thermosetting glue or a thermosetting organic binder.
  • a binder to the dried chip material, in particular a thermosetting glue or a thermosetting organic binder.
  • An organic binder can separate water or another liquid during curing or polymerization.
  • An addition device can be arranged between the drying device and the extrusion device, which adds a hydrophobizing agent to the dried chip material.
  • the extrusion device can have a separating device, in particular a saw, which is connected downstream of an extrusion press.
  • the separating device can cut off blocks from a strand discharged from the extrusion press.
  • An extrusion press can have a chip feed and a driven pressing member, in particular an oscillating driven punch.
  • the pressing member can be driven hydraulically, e.g. through a cylinder.
  • An extrusion press can have a setting device, in particular a vapor deposition device and / or high-frequency heating, for the extruded chip material provided with the binder.
  • the steaming device can introduce superheated steam into the strand.
  • An extrusion press can have a cooling section for the set strand.
  • the invention relates to a system (1) for producing blocks (3), in particular pallet blocks.
  • the invention also relates to a method for producing said blocks (3), in particular pallet blocks.
  • the blocks (3) are made from a chip (2), which small vegetable parts, in particular small wooden parts, e.g. Wood particles, wood chips, wood chips or the like.
  • the chip material (2) preferably consists essentially of the small plant parts, in particular small wooden parts.
  • the small plant parts, in particular small wooden parts are provided with a binder.
  • Figure 1 shows such a system (1). It has a drying device (4) to which the chip material (2) is fed in the direction of the arrow.
  • the system (1) also includes an extrusion device (10) and other components.
  • the chip (2) comes, for example, from a sawmill and the cutting of fresh wood. As an alternative or in addition, it can consist of processed waste wood or other small plant parts, in particular small wood parts.
  • the chip (2) can contain lignin or other cellulose components.
  • the blocks (3) are formed from the dried and then extruded and tied chip material (2). These are e.g. manufactured and used as massive or with a through hole pallet blocks.
  • the blocks (3) preferably have a circumferential shape that is at least partially flat. This can e.g. be a rectangular circumference with beveled corner areas. Other block shapes are also possible.
  • the blocks (3) can have a length that is equal to or less than their height and / or width.
  • the blocks (3) can alternatively have a significantly greater length and a last shape.
  • the drying device (4) can have one or more dryers.
  • it has an air dryer (21) which is designed as a multi-layer continuous dryer (22) and which directs a heated dry air flow (32) through the chip material (2).
  • the dry air flow (32) flows through several, e.g. two layers of chips (23, 24) formed from the chips (2) in succession.
  • the dry air flow (32) can flow through the chip material layers (23, 24) in particular directly one after the other.
  • a free space is arranged between the locally separated chip material layers (23, 24).
  • the flat and e.g. flat chip material layers (23, 24) are aligned with their main plane essentially horizontally and parallel to one another. They preferably have a constant thickness.
  • the chip material layers (23, 24) are e.g. by pouring and evenly distributing the bulk material-like chip material (2) on chip chip carriers (25, 26) explained below.
  • the chip material layers (23, 24) have a different degree of moisture or water content.
  • the dry air flow (32) is preferably first through a chip layer (24) with a low degree of moisture or water content and then directed through a chip layer (23) with a higher degree of moisture or water content.
  • the dry air flow (32) is preferably oriented perpendicular to the main plane of the chip material layers (23, 24). It extends, for example, vertically, in particular from top to bottom.
  • the chip material layers (23, 24) can be spatially separated from one another.
  • the multiple chip material layers (23, 24) are in the embodiment shown in FIG Figure 1 and 2nd eg arranged one above the other on floors. In particular, they are arranged directly one above the other in the vertical direction. You can align vertically.
  • the chip material (2) and the chip material layers (23, 24) pass through the multi-layer continuous dryer (22) in one pass, the wet chip material (2) entering at a feed (28) and exiting dried at a discharge (29).
  • the feed (28) and the discharge (29) can be arranged on different sides of a housing of the multi-layer continuous dryer (22).
  • the feed (28) is, for example, according to Figure 2 arranged on the lower side of the housing and the discharge (29) above on the upper side of the housing.
  • the chip material (2) and the chip material layers (23, 24) are acted upon by the dry air flow (32) in the multi-layer continuous dryer (22) during their continuous movement.
  • the dry air flow (32) can be uniformly conditioned.
  • the first flow of chip material (24) flows over the entire surface with the same dry air.
  • the multi-layer continuous dryer (22) has a heating device (31) and a circulating device (33) for the dry air flow (32).
  • the heating device (31) is arranged in the air flow direction in front of the chip material layer (24) that is first acted on. she is located above this chip material layer (24), for example.
  • the heating device (31) is designed, for example, as a heat exchanger which is fed with primary energy from waste heat from a power plant, from an oven or burner or with thermal energy of any other origin.
  • the heat exchanger from the outside according to the arrow in Figure 2 supplied fresh air can be heated. Alternatively or additionally, it is possible to partially or completely recirculate the dry air flow (32) and feed it into the heating device (31). Figure 2 indicated this possibility with dashed lines.
  • the heated dry air stream (32) emerging at the heating device (31) can have a high temperature of, for example, 90 ° to 100 ° C. or also above it.
  • the dry air flow (32) can according to Figure 2 apply the full area of the chip material (24). Its flow cross section can be adapted to the layer size.
  • the circulating device (33) can have one or more circulating devices, e.g. Fans for the movement of dry air.
  • the heating device (31) and the circulating device (33) can extend over a surface which corresponds to the surface of the preferably flat chip material layers (23, 24) and is possibly parallel to this plane.
  • the circulating device (33) can have one or more further components. For example, it can have a device for dehumidifying the dry air flow (32) emerging from the last flow of chip material (23). This can be a condensation device, for example.
  • the circulating device (33) can alternatively or additionally have a device for heat recovery from said emerging dry air flow (32). This can be a heat exchanger, for example.
  • the recovered Thermal energy can be supplied to the heating device (31) or another consumer.
  • the circulating device (33) can additionally or alternatively include a device for recycling the dry air flow (32). This can e.g. a filter device, a catalytic converter, an afterburning device for solids contained in the dry air stream (32) or the like.
  • the circulating device (33) can deliver the non-recirculated part of the dry air flow (32) received as exhaust air to a blow-out duct or the like.
  • the circulating device (33) is e.g. arranged below the last flow of chip material (23) through which the dry air stream (32) escapes. For this you can e.g. suck in the dry air from above and, if there is any recirculation, blow it back up to the heating device (31).
  • the air flow can be guided in the dryer housing and possibly in air channels.
  • the multi-layer continuous dryer (22) can also have a switchable and possibly controllable bypass for part of the dry air flow (32).
  • This can be an outside bypass on the dryer housing with one or more externally controlled, closable air shafts.
  • the bypass not shown, allows heated dry air to be directed past the first layer of chips (24) directly to the next layer of chips (23).
  • the multi-layer continuous dryer (22) has a plurality of moveable and air-permeable chip carriers (25, 26), each for a chip layer (23, 24).
  • the chip carriers (25, 26) are arranged one above the other in the exemplary embodiment shown. They are permeable to air and the dry air flow (32) also flows through them in succession.
  • the chip carriers (25, 26) can be used together with the the existing chip material layer (23, 24) are moved in the direction indicated by arrows (27) during the passage.
  • the chip material (2) is moved, for example, in two or more layers of chip material (23, 24) arranged one above the other from the supply (28) to the removal (29).
  • the chip carrier (25, 26) through which the dry air flow (32) flows successively and their chip layers (23, 24) are according to Figure 1 and 2nd moved in opposite directions (27).
  • the drying progress in the chip material (2) changes in the respective direction of movement (27) during the continuous movement.
  • the chip material layers (23, 24) are acted upon by the dry air flow (32) over a larger and preferably coherent surface.
  • the e.g. vertically oriented dry air flow (32) moves from the e.g. the heating device (31) lying at the top perpendicular to the circulating device (33).
  • the temperature in the chip material (2) increases in every chip material layer (23, 24). At the same time, the degree of moisture or the water content in the chip material drops (2). The chip material (2) becomes drier and warmer over the transport route in the respective direction (27).
  • the multi-layer continuous dryer (22) has a converter (30) arranged between, for example, separate chip carriers (25, 26) and their chip layers.
  • the converter (30) transports the chip (2) in the embodiment shown from the bottom chip carrier (25) up to the top chip carrier (26).
  • the chip material (2) designed as bulk material can be transported in any suitable manner, for example by means of a screw conveyor, a conveyor belt, for example a cyclone-type air conveyor or the like.
  • the converter (30) removes the chip (2) from the lower chip layer (23) at the end of the conveying path running in the direction (27) from the chip carrier (25) and transports it to the rear end (27) of the upper chip carrier ( 26).
  • the chip material (2) is applied to the chip carrier (25, 26) in a controlled manner and with a predetermined layer thickness to form the chip layer (24).
  • the chip material (2) can be discharged and discharged from the upper chip material layer (24) in a suitable manner directly or by means of an intermediate conveyor or the like at the discharge (29).
  • the movable and air-permeable chip carriers (25, 26) can be of identical or different design to one another. They can be designed in any suitable manner, for example as perforated bands, disks or rings. These can move in the respective direction (27) for the chip removal. This can be a circular movement, for example.
  • a chip carrier (25, 26) designed, for example, as a continuous endless belt can effect chip transport in a straight linear direction (27). The chip material (2) or the chip material layer (23, 24) is transported on the upper run of the air-permeable conveyor belt.
  • the chip carrier (25, 26) can rotate about an axis of rotation, for example vertical, that is directed, for example, transversely to the main planes of the chip layer (23, 24). He can execute a circular orbital movement with a correspondingly curved direction (27).
  • the several, in particular two, chip carriers (25, 26) and chip layers (23, 24) rotate in opposite directions (27).
  • the wet chip material is transferred from the feed (28) to the lower chip carrier (25) and there the lower chip material layer (23) in a controlled manner. educated.
  • the upper layer of chips (24) on the upper chip carrier (26) has already passed through part of the drying process. At the end, the dry chip material is released to the removal unit (29).
  • the fresh and preferably dry air stream (32) emerging from the heating device (31) is first directed onto the upper and already pre-dried chip material layer (24).
  • the dry air stream (32) cools down and at the same time absorbs moisture or water from the chip material layer (24). This is done gradually in direction (27) according to the respective drying progress.
  • the slightly humidified and cooled dry air stream (32) then preferably goes directly to the next lower chip material layer (23) with its lower temperature and the higher degree of moisture or water content, the dry air stream (32) cooling further and absorbing moisture or water content. This also takes place gradually in accordance with the progress of drying in the direction (27).
  • the dry air flow (32) essentially takes up the same moisture everywhere and flows through the chip material layers (23, 24) and emits essentially the same temperature.
  • the chip material In the upper and relatively dry chip material layer (24), the chip material has the highest temperature and at the end facing in the direction (27) and the discharge (29) the least moisture. In the area of the lower chip material layer (23) projected below in the flow direction, the chip material just supplied has the highest degree of moisture and the lowest temperature. In the dry and hot area of the upper chip material layer (24), relatively little temperature is emitted from the dry air flow (2) and relatively little moisture is absorbed. In the lower, colder and wetter area of the chip material layer (24) which is subsequently flowed through, the more temperature is released from the dry air flow (32) and the more moisture is absorbed.
  • the conditions are more balanced.
  • the temperature is lower and the moisture in the chip material (2) is higher than at the end on the discharge side. Accordingly, more temperature is taken up from the dry air stream (32), which is preferably equally conditioned, and more moisture is released to the dry air stream (32).
  • the temperature in the chip material (2) is somewhat higher due to the progress of drying and the humidity is already lower than at the feed end. As a result, less temperature is absorbed from the dry air flow (32) and less moisture is released to the dry air flow (2).
  • the feed (28) and the discharge (29) are arranged, for example, on one carrier side and the converter (30) is arranged on the other, opposite carrier side.
  • the feed (28) and the discharge (29) as well as the converter (30) can be arranged closely adjacent to one another at a circumferential location.
  • an annular chip carrier (25, 26) a possible Dry air is recirculated through the free interior of the ring.
  • the drying device (4) can have one or more further dryers (20).
  • This can, for example, according to Figure 1 be a mechanical dryer.
  • Such a dryer (20) can be designed, for example, as a squeeze mechanism or in some other way.
  • the further and in particular mechanical dryer (20) can, for example, be connected upstream of the air dryer (21) or multi-layer continuous dryer (22) in the feed direction of the chip material (2).
  • the dryers (20, 21, 22) can each have a suitable sensor system for recording physical parameters relevant to drying, e.g. Have temperature and humidity, the chip material (2) and the dry air flow (32) and a control and devices acted upon by it for mechanical influencing of the chip material (2) and the chip material layers (23, 24). This can e.g. Be a shaker, scraper, turner or the like.
  • a sensor system can also detect the physical parameters, in particular movement parameters, of the chip carriers (25, 26), the converter (30), the heating device (31) and the circulating device (33) and can be used to control and, if necessary, regulate them.
  • the system (1) can have at least one particle former (5, 6) which changes, in particular reduces, and preferably also adjusts the particle size of a chip (2).
  • a particle former (5, 6) can be designed, for example, as a hammer mill or pulse breaker, which breaks up the particles of the chip material (2) supplied with ultrasound pulses and thereby reduces the particle size.
  • a particle shaper (5) can e.g. be connected upstream of the air dryer (21) or the multi-layer continuous dryer (22) in the feed direction of the chip material (2).
  • the particle shaper (5) can be located between a possible mechanical dryer (20) and the air dryer (21). Alternatively, it can be arranged in front of the possible mechanical dryer (20). If necessary, it can also be combined with the possible mechanical dryer (20).
  • Such an upstream particle shaper (5) can carry out a rough treatment of the chip material (2) and produce a particle size suitable for the subsequent air drying. This particle size can be too large for the extrusion process.
  • the air drying or the air dryer (21) can be followed by at least one further particle shaper (6) in the transport direction of the chip.
  • the particle size of the chip material (2) suitable for the subsequent extrusion process can be produced here, for example with a fine treatment.
  • Figure 1 shows this embodiment. In a variation of this, only one of the particle formers (5, 6) may be present if necessary, this being connected upstream or downstream of the air dryer (21) or the multi-layer continuous dryer (22).
  • the system (1) can have further components acting on the dried chip material (2).
  • This can e.g. be a memory (9).
  • the memory (9) is unnecessary in the preferred embodiment and is therefore shown in dashed lines.
  • one or more addition devices (7) can be arranged between the drying device (4) and the extrusion device (10).
  • This can be, for example, an addition device (7) that the dried Chip material (2) adds a binder which can be activated during the extrusion process and which gives strength to the chip material (2) pressed into a strand (15).
  • the binder can be designed in any suitable manner.
  • it can be a thermosetting glue.
  • another binder can be designed as a possibly thermosetting organic binder which separates water or another liquid during curing or polymerization. This can be a Maillard binder, for example.
  • a hydrophobizing agent can also be added to the dried chips (2).
  • This can e.g. be a wax.
  • a further addition device (8) can be provided for this.
  • the order of the addition devices (7, 8) can depend on the type of agent added. Alternatively, several addition devices (7, 8) can also be combined with one another to form a unit.
  • the extrusion device (10) connected downstream in the transport direction of the dried chip material (2) has an extrusion press (11) and a separating device (18) and, if appropriate, a subsequent conveyor section (19).
  • the extruder (11) uses the binder to produce a quasi-endless, tied strand (15) with preferably straight extension from the dried chip material (2). This is fed continuously or intermittently in the straight pressing direction (14).
  • the extrusion press (11) has a chip feed supply (12) facing the one or more feed devices (7, 8) and a driven pressing member (13).
  • the pressing member (13) is, for example, an oscillating driven punch or a rotating one Press screw or the like.
  • the emerging strand (15) is formed from the still loosely pressed chip material (2) in a collecting and pressing chamber and a recipient.
  • the rod-shaped, straight strand (15) can have a rounded or prismatic circumferential contour.
  • the strand (15) is then transferred in the pressing direction (14) into a binding device (16) of the extrusion press (11), in which the binder in the strand (15) is activated.
  • the binding device (16) can be in one part or in several parts. It can e.g. have a vaporization device. Additionally or alternatively, a high-frequency device can be present. Depending on the type of binder, the binding device (16) can also have a different type of activation device.
  • the strand (15) is acted upon by steam on the outer jacket and / or on an inside mandrel hole.
  • This can be saturated steam or superheated steam.
  • the superheated steam is e.g. stretched and is in pure gas form. For this purpose, it can have a suitable pressure and a correspondingly high temperature.
  • the binding device can also include a suitable steam generator. The superheated steam can gradually cool down in the line after the entry and condense with delay in the further feed.
  • High-frequency heating works, for example, with alternating electromagnetic fields. It can have one or more field generators arranged on the strand (15), which may be preceded by an interchangeable and field-permeable adaptation means which contacts the strand (15) and which is adapted to the outer strand contour.
  • High-frequency heating is particularly suitable for an organic binder, especially a Maillard binder.
  • a steaming device and high-frequency heating can be used together and in combination. You can work together synergistically. Alternatively, a steaming device or high-frequency heating can be used.
  • the extrusion press (11) can have a downstream cooling section (17) in the pressing direction (14) or in the feed direction of the strand (15), in which the strand (15), which may be heated by the activation of the binder, can cool down.
  • the cooling can take place in the ambient air or with the active use of a coolant and heat sinks.
  • the set strand (15) then reaches the separating device (18) in the pressing direction (14). This separates the blocks (3) from the quasi-endless strand (15) in the desired format.
  • the separator (18) can e.g. be designed as a saw.
  • the blocks (3) can be cut off, for example, by a cut transverse to the pressing direction (14) and, for example, in the manner of a cross-cut saw.
  • the separating device (18) can be designed as a compartment separating device which separates and divides the rod-shaped strand (15) with its given end face into a plurality of individual blocks and / or strips with a smaller end face.
  • Different separating cuts can be made transversely and longitudinally to the pressing direction (14).
  • several differently inclined separating cuts can also be made along the strand axis or the pressing direction (14).
  • the separating device (18) can also have a detection device for the separated blocks (3). This can e.g. a weighing device and / or a measuring device for the block format.
  • the block densities can also be recorded directly or indirectly. It is also possible to record the temperature and / or residual moisture or other physical parameters of the blocks (3).
  • the detection device can also be integrated in the conveyor line (19).
  • the blocks (3) are removed on the conveyor line (19). They can then be temporarily stored if necessary and then in a suitable manner, e.g. layered, compiled and packaged, especially palletized.
  • the chip material layers (23, 24) and the chip carrier (25, 26) can be arranged next to one another, the air flow (32) in after flowing through said first chip layer (23) to the following chip layer (23) in is deflected in a suitable manner, for example by a flow shaft or the like.
  • the chip carriers (25, 26) can be designed, for example, as parallel, endless conveyor belts. They can also be at the same height.
  • a converter (30) can be designed, for example, as a cross conveyor.
  • the chip carriers (25, 26) can be connected to one another and, for example, form an air-permeable circulation conveyor.
  • the chip material layers (23, 24) are formed by different areas in a single chip material bed.
  • the supply and removal of the chip (2) can be on the same side of the Dryer housing done.
  • the heating device (31) and the circulating device (33) can be arranged in a correspondingly adapted manner.
  • the design and arrangement of the heating device (31) and the circulating device (33) can vary.
  • the two devices can also be combined.
  • the circulating device (33) draws in the dry air flow (32).
  • it can blow out the dry air flow (32).
  • the heating device (31) and / or the circulating device (33) can also be present more than once.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microbiology (AREA)
  • Drying Of Solid Materials (AREA)
EP19202016.2A 2018-10-08 2019-10-08 Procédé et installation de fabrication d'entretoises Pending EP3637030A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE202018105738.3U DE202018105738U1 (de) 2018-10-08 2018-10-08 Anlage zum Herstellen von Klötzen

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Publication Number Publication Date
EP3637030A1 true EP3637030A1 (fr) 2020-04-15

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4022702C1 (fr) * 1990-07-17 1991-11-28 Fritz Egger Ges.M.B.H., Sankt Johann In Tirol, At
WO1996007070A2 (fr) * 1994-09-01 1996-03-07 William Benny Teal Procede de sechage de matiere premiere pour fabriquer des panneaux de particules
EP2425947A2 (fr) * 2006-11-21 2012-03-07 Anton Heggenstaller GmbH Dispositif d'extrusion
DE102016014642A1 (de) * 2016-12-09 2018-06-14 Tec-IN GmbH Bandtrockner zur Trocknung von insbesondere pflanzlichen Produkten (beispielsweise Hopfen)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19915658A1 (de) * 1999-03-19 2000-09-21 Wolf Stahlbau Kg Einrichtung zum Trocknen von pflanzlichen Produkten
DE102015200680B4 (de) * 2014-10-18 2016-05-25 Haarslev Industries GmbH Aufgabevorrichtung einer Bandtrocknungsanlage und Verfahren zum Steuern einer Aufgabevorrichtung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4022702C1 (fr) * 1990-07-17 1991-11-28 Fritz Egger Ges.M.B.H., Sankt Johann In Tirol, At
WO1996007070A2 (fr) * 1994-09-01 1996-03-07 William Benny Teal Procede de sechage de matiere premiere pour fabriquer des panneaux de particules
EP2425947A2 (fr) * 2006-11-21 2012-03-07 Anton Heggenstaller GmbH Dispositif d'extrusion
DE102016014642A1 (de) * 2016-12-09 2018-06-14 Tec-IN GmbH Bandtrockner zur Trocknung von insbesondere pflanzlichen Produkten (beispielsweise Hopfen)

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DE202018105738U1 (de) 2020-01-09

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