EP3610539A1 - Ensemble de contact électrique - Google Patents

Ensemble de contact électrique

Info

Publication number
EP3610539A1
EP3610539A1 EP18714485.2A EP18714485A EP3610539A1 EP 3610539 A1 EP3610539 A1 EP 3610539A1 EP 18714485 A EP18714485 A EP 18714485A EP 3610539 A1 EP3610539 A1 EP 3610539A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
contact
receiving opening
contact body
electrical contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP18714485.2A
Other languages
German (de)
English (en)
Inventor
Steffen Waldenmeier
Uwe Katzenwadel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP3610539A1 publication Critical patent/EP3610539A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/26—Connectors or connections adapted for particular applications for vehicles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins

Definitions

  • Printed circuit boards and press-in contacts to provide the circuit board with a receiving opening in the form of a metallized and electrically connected to at least one conductor track of the printed circuit board fürgangsaus originallyung.
  • a press-in contact can be pressed from one side of the circuit board into the receiving opening.
  • the press-in contact for example, have a portion whose outer walls press on pressing against the inner wall of the metallized through-hole, wherein a variety of geometries can be used.
  • Such electrical contacts serve to connect the contact pins of plugs or electronic components to the circuit board. In the literature this becomes
  • Press-in contact in some cases starting from a component side can be performed to the opposite side of the circuit board.
  • the invention relates to an electrical contact arrangement for the connection of a press-fit contact to an electronic circuit.
  • the contact arrangement comprises a printed circuit board provided with the electronic circuit, a receiving opening continuously provided with an electrically conductive inner wall for pressing in a press-fit contact and at least one conductor track of the printed circuit board electrically connected to the electrically conductive inner wall and the electronic circuit.
  • the receiving opening is formed on a contact body which is electrically connected to the conductor track and which is in the form of an SMT-capable contact body Component (SMT: Surface Mount Technology) on a component side of the SMT-capable contact body Component (SMT: Surface Mount Technology) on a component side of the SMT-capable contact body Component (SMT: Surface Mount Technology) on a component side of the SMT-capable contact body Component (SMT: Surface Mount Technology) on a component side of the SMT-capable contact body Component (SMT: Surface Mount Technology) on a component side of the SMT-capable contact body Component (SMT: Surface Mount Technology) on a component side of the SMT-capable contact body Component (SMT: Surface Mount Technology) on a component side of the SMT-capable contact body Component (SMT: Surface Mount Technology) on a component side of the SMT-capable contact body Component (SMT: Surface Mount Technology) on a component side of the SMT-capable contact body Component (
  • Printed circuit board is applied. This includes both embodiments with a single contact body, which has exactly one receiving opening for a single press-in contact, as well as versions with a plurality of stocked on the circuit board and example, each having exactly one receiving opening contact bodies. Likewise, a reaction with one or more contact bodies is possible, each of which has a plurality of receiving openings for the receiving openings
  • An SMD component (SMD: Surface Mount Device) is understood to mean a component which, in contrast to Through Hole Technology (THT) components, has no wire connections for through-hole mounting, but instead uses solderable connection surfaces on the surface of the printed circuit board
  • SMT surface-mounting technology
  • a printed circuit board is understood to mean a rigid printed circuit board substrate, preferably made of fiberglass-reinforced epoxy resin material, which is provided with printed conductors on at least one layer or even several layers, as is known in the art as FR4 material, FR5 material or higher.
  • Circuit board no continuous receiving openings must be provided or these receiving openings can be covered with the contact body. This is particularly advantageous when a potting compound is used on the circuit board to protect the components mounted on the circuit board.
  • HCD Hard Cover Dispense
  • a circumferential dam material can be dispensed onto the component side of the printed circuit board.
  • the potting compound for example, a thermosetting epoxy resin is filled in the area surrounded by the dam material surface area on the component side of the circuit board. If this surface area has through openings, the Run down due to gravity casting compound. For this reason, the known through-hole mounting can not be readily used in conjunction with a potting compound. Necessary would be expensive and space-demanding
  • Inner wall provided receiving opening formed in a contact body, which can be equipped as a separate component in SMT mounting on the circuit board.
  • the contact body advantageously allows an electrical contact by means
  • the contact body has for this purpose a consistently provided with an electrically leicertainen inner wall
  • Receiving opening for example, as a simple hole, especially as
  • Press-fitting presses the press-in contact against the inner wall (press-fit contact) and establishes the electrical connection with the contact body independent of the press-in depth.
  • the contact body may be inexpensive, completely formed of metal or, for example, as a plastic part with a metallic inner sleeve, in which the
  • Receiving opening is arranged.
  • a press-in contact can be pressed into the receiving opening even after a reflow soldering process of the circuit board for contacting electronic components.
  • the contact body has a mounting surface facing the printed circuit board, an outer surface facing away from the mounting surface, and a peripheral lateral surface, wherein the receiving opening extends from the outer surface perpendicular to the component side of the printed circuit board into the contact body.
  • Mounting surface may preferably be flat and allows the exact fit system to a contact surface of the component side of the circuit board.
  • the contact body can be applied in the production as a compact component in a simple manner by means of an SMD placement device on the circuit board.
  • the SMD Placement device can receive the contact body, for example by means of a suction head on the flat outer surface and put on the contact surface of the circuit board.
  • the receiving opening may also extend as a blind hole in the contact body.
  • the receiving opening is formed as a through hole, which penetrates the contact body from the outer surface to the mounting surface.
  • the printed circuit board has a recess adjoining the receiving opening. This recess may in particular extend coaxially with the receiving opening. The recess may serve to receive one end of the press-in contact, which may optionally protrude from the contact body on the mounting surface, so that it is possible to press the press-in contact deeper into the receiving opening than without the additional recess.
  • the recess of the printed circuit board preferably serves to receive a centering collar.
  • the contact body can project from the mounting surface and into the
  • Electrolytic capacitor or connector parts define.
  • the contact body can be formed in a particularly simple and inexpensive manner, for example in the manner of a socket with a circumferential cylindrical jacket surface.
  • the receiving opening can be formed for example by a central bore in the contact body as a cylindrical channel.
  • Conductor connected contact surface on the component side of the circuit board is applied and the lateral surface are at least partially electrically and mechanically connected by means of a circumferential surface Lot réelles the contact surface.
  • This can be achieved advantageously in the well-controlled SMT technique.
  • Particularly advantageous is the use of the contact body in conjunction with the potting of the circuit board.
  • the electronic circuit on the component side are completely or at least partially covered with a potting compound, wherein the potting surrounds the lateral surface of the contact body sealing and the contact body protrudes with the outer surface through the potting compound to the outside, so that the receiving opening accessible for pressing a press-fit is.
  • the contact body allows the pressing of the press-fit even after the application of the potting compound.
  • the contact body covers the
  • Recess may be provided in the circuit board, in which the potting compound can not penetrate.
  • the potting compound is applied to the printed circuit board after the press-fit contact has been pressed in.
  • no recess in the printed circuit board is provided under the contact body, so that the potting compound can also be applied to the outer surface of the contact body and can penetrate from the outer surface into the receiving opening.
  • the electrical contact arrangement can be used particularly advantageously on a transmission control module for controlling a motor vehicle transmission.
  • Transmission control modules are often installed in the hydraulic fluid of the transmission, so that the sealing of the electronic circuit by means of a potting compound represents a significant added value here.
  • the electrical contact arrangement makes it possible here advantageous to contact components whose electrical connections are formed as press-in contacts, even after the production of the potting compound with the electrical circuit board.
  • FIG. 2 is a plan view of the embodiment of FIG. 1 without potting compound and without press-fit
  • FIG. 3 shows a section through a cross section of a second embodiment of an electrical contact arrangement
  • 4 shows a section through a cross section of a third embodiment of an electrical contact arrangement
  • FIG. 5 shows a section through a cross section of a fourth exemplary embodiment of an electrical contact arrangement.
  • Fig. 1 shows a section through a cross section of a first embodiment of an electrical contact arrangement 1.
  • Fig. 2 shows the same arrangement in plan view without press-fit and without potting compound.
  • the contact arrangement 1 comprises a rigid printed circuit board 2, on which an electronic circuit 26 is arranged.
  • Fig. 1 shows only a single component of the electronic circuit 26, the terminals 27 are electrically connected to a conductor 25 a on a component side 21 of the circuit board 2.
  • the conductor 25a is integrally connected to an example circular contact surface 25 on the component side of the circuit board 2.
  • Contact surface 25 may be formed, for example, as a copper metallization.
  • a contact body 3 is equipped on the component side 21 of the circuit board 2, a contact body 3 is equipped.
  • the contact body 3 has a mounting surface 6 facing the printed circuit board 2, an outer surface 5 facing away from the mounting surface 6 and a peripheral lateral surface 7.
  • the contact body 3 as a socket with a
  • a receiving opening is formed, which extends, starting from the outer surface 5 perpendicular to the component side 21 of the printed circuit board 2 in the contact body 3 inside.
  • the receiving opening 4 is for example formed centrally in the contact body 3 as a cylindrical channel, for example through a bore.
  • the receiving opening is preferably formed as a through hole, which penetrates the contact body 3 from the outer surface 5 to the mounting surface 6.
  • the contact body 3 is fitted as an SMD component in SMT technology on the circuit board, ie, the contact body is placed with the mounting surface 6 on the contact surface 25 and electrically contacted by a heatlötung with the contact surface 25.
  • the solder application is, for example, circular, circumferentially applied around the lateral surface 7 and connects the lower edge of the lateral surface 7 with the contact surface 25 electrically and mechanically.
  • the contact body 3 may be formed entirely of metal or as a plastic part with a metallic inner sleeve, in which the receiving opening 4 is arranged.
  • the metallic inner sleeve can be connected, for example, by means of a guided through the plastic of the contact body conductive bridge contact with a circumferential metallic surface of the outer surface of the contact body 3, which metallic outer surface in turn by means of the Lotrlandes in SMT Technique with the contact surface 25 can be soldered.
  • the inner wall 14 is provided with a continuous electrically conductive inner wall 14, for example by the contact body is made entirely of metal or has said metallic inner sleeve.
  • the component side 21 of the printed circuit board 2 is covered with a hardenable potting compound 23.
  • This may preferably be a thermoset, in particular a
  • Epoxy resin act.
  • the potting compound 23 covers the electronic circuit 26 and protects it from external influences.
  • the distance of the outer surface 5 of the mounting surface 6 of the contact body 3 is dimensioned so that the contact body 3 projects with the outer surface 5 through the potting compound 23 to the outside, so that the receiving opening 4 in the outer space Pressing in a
  • Press-fit contact 100 is accessible.
  • the potting compound 23 encloses the lateral surface 7 of the contact body 3 sealingly, so that no aggressive medium along the
  • Jacket surface 7 can penetrate to the circuit board 2.
  • a press-fit contact 100 for example, a connection end of an electrical component, actuator, sensor, plug part or capacitor or other electrical component can from the outer surface 5 in the direction of the arrow P in the
  • the press-fit contact 100 presses on at least in sections (for example, with a thickening) against the receiving opening 4, which is provided with an electrically conductive inner wall 14 throughout, so that electrical contact is always ensured, regardless of the press-in depth.
  • Fig. 3 shows a second embodiment, in which a recess 27 is additionally provided in the printed circuit board 2.
  • the recess 27 is disposed in the contact surface 25 and the circuit board 2 as a bore or breakthrough of the Component side 21 penetrate to the side facing away from the mounting side 21 side 22.
  • the recess 27 is formed coaxially with the receiving opening (4), that is, the longitudinal axes of the receiving opening and the recess coincide.
  • the diameter of the recess 27 may correspond to the diameter of the receiving opening 4, so that the recess 27 is aligned with the receiving opening 4.
  • the recess 27 of the printed circuit board 2 advantageously makes it possible to insert the press-fit contact 100 deeper into the receiving opening 4. By soldered to the contact surface 25 contact body 3 is still ensured that the potting compound when applied to the circuit board 2 can not run through the recess 27.
  • the centering collar 16 may have cone-shaped flanks, which in the
  • the centering collar 16 may be provided, for example, with ribs distributed over the circumference.
  • tolerances of the component side (x-y plane) can be reduced.
  • a tolerance in the direction perpendicular thereto (z) can be compensated by the ribs.
  • FIG. 5 shows a fourth exemplary embodiment, in which the potting compound is applied to the printed circuit board 2 after the press-fit contact 100 has been pressed in.
  • the printed circuit board 2 is formed closed under the contact body 3.
  • Potting compound 23 is applied in this embodiment also on the side facing away from the mounting surface 6 outer surface 5 of the contact body 3. From the outer surface 5, the potting compound in this example can also penetrate into the receiving opening 4 and completely or partially fill the not occupied with the press-in contact 100 part of the receiving opening 4. In this case, the potting compound also envelops the
  • Plug-in portion of the press-fit so that it is additionally protected.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

L'invention concerne un ensemble de contact électrique pour la connexion d'un contact à enfoncement (100) à un circuit (26) électronique. L'ensemble de contact électrique comprend une carte de circuits imprimés (2) pourvue du circuit (26) électronique, une ouverture de réception (4) pourvue en continu d'une paroi intérieure (14) électroconductrice servant à enfoncer un contact à enfoncement (100), et au moins une piste conductrice (25a), électriquement raccordée à la paroi intérieure (14) et au circuit électronique (26), de la carte de circuits imprimés (2). L'invention propose de réaliser l'ouverture de réception (4) sur un corps de contact (3) électriquement raccordé à la piste conductrice (25a), lequel est installé, en tant que composant pouvant être monté en surface, sur un côté d'équipement (21) de la carte de circuits imprimés (2).
EP18714485.2A 2017-04-11 2018-03-27 Ensemble de contact électrique Withdrawn EP3610539A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017206217.7A DE102017206217A1 (de) 2017-04-11 2017-04-11 Elektrische Kontaktanordnung
PCT/EP2018/057799 WO2018188947A1 (fr) 2017-04-11 2018-03-27 Ensemble de contact électrique

Publications (1)

Publication Number Publication Date
EP3610539A1 true EP3610539A1 (fr) 2020-02-19

Family

ID=61832498

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18714485.2A Withdrawn EP3610539A1 (fr) 2017-04-11 2018-03-27 Ensemble de contact électrique

Country Status (5)

Country Link
US (1) US10873141B2 (fr)
EP (1) EP3610539A1 (fr)
CN (1) CN110521063B (fr)
DE (1) DE102017206217A1 (fr)
WO (1) WO2018188947A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020210961A1 (de) * 2020-08-31 2022-03-03 Robert Bosch Gesellschaft mit beschränkter Haftung Elektrische Kontaktanordnung sowie Leiterplattenanordnung und Verfahren zu deren Herstellung
DE102021208217A1 (de) 2021-07-29 2023-02-02 Robert Bosch Gesellschaft mit beschränkter Haftung Kontaktelement zur mittelbaren Verbindung eines Einpresspins mit einer Leiterplatte sowie Leiterplatte mit solch einem Kontaktelement

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4056302A (en) * 1976-06-04 1977-11-01 International Business Machines Corporation Electrical connection structure and method
JPH04132250A (ja) 1990-09-21 1992-05-06 Nec Corp 無ハンダ実装用ｉｃパッケージ
JPH04162377A (ja) 1990-10-26 1992-06-05 Matsushita Electric Ind Co Ltd 金属ベース回路基板と外部リード線との接続端子
US5607313A (en) * 1995-02-27 1997-03-04 Autosplice Systems, Inc. Surface mounted holes for printed circuit boards
US5653601A (en) 1995-07-11 1997-08-05 Molex Incorporated Terminal socket assembly
JPH1140713A (ja) 1997-07-18 1999-02-12 Nec Eng Ltd Ｌｓｉパッケージ及びソケットの組み合わせ構造
KR200215511Y1 (ko) 1998-03-03 2001-03-15 윤종용 집적회로소자용소켓과회로기판및보조회로기판
DE102009020984A1 (de) * 2008-05-13 2009-11-19 Continental Teves Ag & Co. Ohg Toleranzausgleichender elektrischer Verbinder, insbesondere für Kraftfahrzeugsteuergeräte
JP5255365B2 (ja) 2008-08-09 2013-08-07 古河電気工業株式会社 中継端子部材及びそれを備えた回路構造体、並びに電子ユニット
KR101719822B1 (ko) * 2010-11-24 2017-03-27 삼성전기주식회사 솔더링 연결핀, 상기 솔더링 연결핀을 이용한 반도체 패키지 기판 및 반도체칩의 실장방법
DE102011088969A1 (de) * 2011-12-19 2013-06-20 Robert Bosch Gmbh Getriebesteuermodul
DE102012213812A1 (de) 2012-08-03 2014-02-06 Robert Bosch Gmbh Einpresskontaktierung
JP6323098B2 (ja) 2014-03-20 2018-05-16 富士電機株式会社 ピン挿入装置及びピン挿入不良判定方法
DE102015214311A1 (de) 2015-07-29 2017-02-02 Robert Bosch Gmbh Elektronikmodul mit über Sockelelement flexibel platzierbarem Bauelement und Verfahren zum Fertigen desselben

Also Published As

Publication number Publication date
DE102017206217A1 (de) 2018-10-11
CN110521063A (zh) 2019-11-29
US20200052423A1 (en) 2020-02-13
CN110521063B (zh) 2021-09-07
WO2018188947A1 (fr) 2018-10-18
US10873141B2 (en) 2020-12-22

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