EP3565011A1 - Dispositif électroluminescent - Google Patents

Dispositif électroluminescent Download PDF

Info

Publication number
EP3565011A1
EP3565011A1 EP19176082.6A EP19176082A EP3565011A1 EP 3565011 A1 EP3565011 A1 EP 3565011A1 EP 19176082 A EP19176082 A EP 19176082A EP 3565011 A1 EP3565011 A1 EP 3565011A1
Authority
EP
European Patent Office
Prior art keywords
wavelength
fluorescent material
light emitting
light
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19176082.6A
Other languages
German (de)
English (en)
Other versions
EP3565011B1 (fr
Inventor
Suguru Takashima
Masato Aihara
Junji Takeichi
Takahiro Naitou
Hiroto Tamaki
Tomohisa Kishimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of EP3565011A1 publication Critical patent/EP3565011A1/fr
Application granted granted Critical
Publication of EP3565011B1 publication Critical patent/EP3565011B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/66—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing germanium, tin or lead
    • C09K11/661—Chalcogenides
    • C09K11/662—Chalcogenides with zinc or cadmium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7767—Chalcogenides
    • C09K11/7769—Oxides
    • C09K11/7771—Oxysulfides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • C09K11/7784—Chalcogenides
    • C09K11/7785—Chalcogenides with zinc or cadmium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
EP19176082.6A 2005-06-15 2006-06-15 Dispositif électroluminescent Active EP3565011B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005174518 2005-06-15
PCT/JP2006/312026 WO2006135005A1 (fr) 2005-06-15 2006-06-15 Dispositif émetteur de lumière
EP06766760.0A EP1895599B1 (fr) 2005-06-15 2006-06-15 Dispositif émetteur de lumière

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
EP06766760.0A Division-Into EP1895599B1 (fr) 2005-06-15 2006-06-15 Dispositif émetteur de lumière
EP06766760.0A Division EP1895599B1 (fr) 2005-06-15 2006-06-15 Dispositif émetteur de lumière

Publications (2)

Publication Number Publication Date
EP3565011A1 true EP3565011A1 (fr) 2019-11-06
EP3565011B1 EP3565011B1 (fr) 2022-03-30

Family

ID=37532359

Family Applications (2)

Application Number Title Priority Date Filing Date
EP19176082.6A Active EP3565011B1 (fr) 2005-06-15 2006-06-15 Dispositif électroluminescent
EP06766760.0A Active EP1895599B1 (fr) 2005-06-15 2006-06-15 Dispositif émetteur de lumière

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP06766760.0A Active EP1895599B1 (fr) 2005-06-15 2006-06-15 Dispositif émetteur de lumière

Country Status (7)

Country Link
US (1) US8044569B2 (fr)
EP (2) EP3565011B1 (fr)
JP (2) JP5200537B2 (fr)
KR (1) KR101194129B1 (fr)
CN (1) CN101194375B (fr)
TW (1) TWI413276B (fr)
WO (1) WO2006135005A1 (fr)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9335006B2 (en) 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
JP2009054633A (ja) * 2007-08-23 2009-03-12 Stanley Electric Co Ltd Ｌｅｄ照明灯具
JP2012502472A (ja) * 2008-09-04 2012-01-26 スリーエム イノベイティブ プロパティズ カンパニー 単色光源
CN102197500A (zh) 2008-09-04 2011-09-21 3M创新有限公司 具有高纵横比的单色光源
WO2010027650A1 (fr) * 2008-09-04 2010-03-11 3M Innovative Properties Company Source de lumière à monochromaticité améliorée
KR20110048580A (ko) * 2008-09-04 2011-05-11 쓰리엠 이노베이티브 프로퍼티즈 컴파니 광 차단 구성요소를 갖는 광원
CN102197551A (zh) * 2008-09-04 2011-09-21 3M创新有限公司 由gan ld光泵的散热器上式ⅱ-ⅵ族mqw vcsel
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
US8598809B2 (en) 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
US8511851B2 (en) 2009-12-21 2013-08-20 Cree, Inc. High CRI adjustable color temperature lighting devices
JP5410342B2 (ja) * 2010-03-12 2014-02-05 星和電機株式会社 発光装置
JP5734581B2 (ja) * 2010-05-21 2015-06-17 シャープ株式会社 半導体発光装置
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
WO2012124267A1 (fr) 2011-03-15 2012-09-20 株式会社 東芝 Source de lumière blanche
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
KR101219106B1 (ko) * 2011-08-01 2013-01-11 삼성전자주식회사 발광소자 패키지 및 그 제조방법
JP6356606B2 (ja) * 2012-10-04 2018-07-11 株式会社東芝 歯科用照明装置
JP6380826B2 (ja) * 2013-09-20 2018-08-29 パナソニックＩｐマネジメント株式会社 光源装置
EP3557635B1 (fr) * 2013-10-02 2020-05-27 Glbtech Co. Ltd. Dispositif émetteur de lumière blanche à rendu de couleur élevé
CN103642493A (zh) * 2013-12-23 2014-03-19 张书生 一种高光效、高稳定性无机发光材料及其制造方法
JP6275829B2 (ja) * 2014-04-30 2018-02-07 シャープ株式会社 発光装置
JP6455817B2 (ja) * 2014-09-12 2019-01-23 パナソニックＩｐマネジメント株式会社 照明装置
JP2017147290A (ja) * 2016-02-16 2017-08-24 岩崎電気株式会社 Ｌｅｄユニット、及び照明装置
KR101995000B1 (ko) * 2016-05-16 2019-07-01 엘지이노텍 주식회사 발광소자 패키지 및 조명장치
EP3460569A4 (fr) 2016-05-19 2020-01-08 LG Innotek Co., Ltd. Module flash et terminal le comprenant
US10270015B1 (en) 2017-01-13 2019-04-23 Nichia Corporation Light-emitting device
JP6558378B2 (ja) * 2017-01-13 2019-08-14 日亜化学工業株式会社 発光装置
US10669479B2 (en) 2017-02-20 2020-06-02 Panasonic Intellectual Property Management Co., Ltd. Light-emitting device
WO2023107239A1 (fr) * 2021-12-09 2023-06-15 Lumileds Llc Luminophores d'oxonitridobéryllosilicate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003045206A (ja) 2001-05-24 2003-02-14 Matsushita Electric Ind Co Ltd 照明光源
WO2004039915A1 (fr) * 2002-10-16 2004-05-13 Nichia Corporation Oxynitrure de phosphore, methode de production correspondante et dispositif luminescent utilisant l'oxynitrure de phosphore

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6613247B1 (en) * 1996-09-20 2003-09-02 Osram Opto Semiconductors Gmbh Wavelength-converting casting composition and white light-emitting semiconductor component
US6680569B2 (en) * 1999-02-18 2004-01-20 Lumileds Lighting U.S. Llc Red-deficiency compensating phosphor light emitting device
US6686691B1 (en) * 1999-09-27 2004-02-03 Lumileds Lighting, U.S., Llc Tri-color, white light LED lamps
US6577073B2 (en) 2000-05-31 2003-06-10 Matsushita Electric Industrial Co., Ltd. Led lamp
JP4386693B2 (ja) * 2000-05-31 2009-12-16 パナソニック株式会社 Ｌｅｄランプおよびランプユニット
CN100430456C (zh) * 2002-03-22 2008-11-05 日亚化学工业株式会社 氮化物荧光体,其制造方法及发光装置
JP2003318447A (ja) * 2002-04-24 2003-11-07 Toshiba Lighting & Technology Corp 発光ダイオードおよびｌｅｄ照明装置
US6717353B1 (en) * 2002-10-14 2004-04-06 Lumileds Lighting U.S., Llc Phosphor converted light emitting device
JP2004210921A (ja) * 2002-12-27 2004-07-29 Nichia Chem Ind Ltd オキシ窒化物蛍光体及びその製造方法並びにそれを用いた発光装置
JP4991026B2 (ja) 2003-02-26 2012-08-01 日亜化学工業株式会社 発光装置
JP4916651B2 (ja) * 2003-08-28 2012-04-18 三菱化学株式会社 発光装置及び蛍光体
EP1659335A4 (fr) 2003-08-28 2010-05-05 Mitsubishi Chem Corp Dispositif emetteur de lumiere et phosphore
JP4414821B2 (ja) * 2004-06-25 2010-02-10 Ｄｏｗａエレクトロニクス株式会社 蛍光体並びに光源およびｌｅｄ
JP2006063214A (ja) * 2004-08-27 2006-03-09 Dowa Mining Co Ltd 蛍光体及びその製造方法並びに光源

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003045206A (ja) 2001-05-24 2003-02-14 Matsushita Electric Ind Co Ltd 照明光源
WO2004039915A1 (fr) * 2002-10-16 2004-05-13 Nichia Corporation Oxynitrure de phosphore, methode de production correspondante et dispositif luminescent utilisant l'oxynitrure de phosphore
EP1571194A1 (fr) * 2002-10-16 2005-09-07 Nichia Corporation Oxynitrure de phosphore, methode de production correspondante et dispositif luminescent utilisant l'oxynitrure de phosphore

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
RAVICHANDRAN D ET AL: "Crystal chemistry and luminescence of the Eu2+-activated alkaline earth aluminate phosphors", DISPLAYS DEVICES, DEMPA PUBLICATIONS, TOKYO, JP, vol. 19, no. 4, 1999, pages 197 - 203, XP029996192, ISSN: 0141-9382, DOI: 10.1016/S0141-9382(98)00050-X *

Also Published As

Publication number Publication date
EP1895599A1 (fr) 2008-03-05
US8044569B2 (en) 2011-10-25
JP5200537B2 (ja) 2013-06-05
TWI413276B (zh) 2013-10-21
WO2006135005A1 (fr) 2006-12-21
KR20080027343A (ko) 2008-03-26
EP1895599B1 (fr) 2019-09-04
KR101194129B1 (ko) 2012-10-24
JP2013033971A (ja) 2013-02-14
TW200711174A (en) 2007-03-16
EP3565011B1 (fr) 2022-03-30
JP5429342B2 (ja) 2014-02-26
US20100277054A1 (en) 2010-11-04
CN101194375B (zh) 2011-03-23
CN101194375A (zh) 2008-06-04
EP1895599A4 (fr) 2014-03-19
JPWO2006135005A1 (ja) 2009-01-08

Similar Documents

Publication Publication Date Title
EP3565011B1 (fr) Dispositif électroluminescent
EP1630877B1 (fr) LED avec un matériau fluorescent
US7854859B2 (en) Nitride phosphor, method for producing this nitride phosphor, and light emitting device that uses this nitride phosphor
EP1830418B1 (fr) Dispositif électroluminescent
US7753553B2 (en) Illumination system comprising color deficiency compensating luminescent material
EP1503428B1 (fr) Dispositif electroluminescent utilisant une substance fluorescente
JP4559496B2 (ja) 発光装置
KR100894372B1 (ko) 반도체 발광소자와 이를 이용한 발광장치
TWI492413B (zh) 發光裝置
EP2604669B1 (fr) Substance luminescente et dispositif électroluminescent
JP2004207688A (ja) 発光装置およびそれを用いた面状光源
JP6550889B2 (ja) 発光装置及びその製造方法

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN PUBLISHED

AC Divisional application: reference to earlier application

Ref document number: 1895599

Country of ref document: EP

Kind code of ref document: P

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20200401

RBV Designated contracting states (corrected)

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20210909

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAJ Information related to disapproval of communication of intention to grant by the applicant or resumption of examination proceedings by the epo deleted

Free format text: ORIGINAL CODE: EPIDOSDIGR1

GRAL Information related to payment of fee for publishing/printing deleted

Free format text: ORIGINAL CODE: EPIDOSDIGR3

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTC Intention to grant announced (deleted)
INTG Intention to grant announced

Effective date: 20220125

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AC Divisional application: reference to earlier application

Ref document number: 1895599

Country of ref document: EP

Kind code of ref document: P

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602006060308

Country of ref document: DE

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1480007

Country of ref document: AT

Kind code of ref document: T

Effective date: 20220415

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: NL

Ref legal event code: FP

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220330

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220330

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220630

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1480007

Country of ref document: AT

Kind code of ref document: T

Effective date: 20220330

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220330

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220701

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220330

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220330

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220330

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220801

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220330

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220330

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220330

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220330

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220330

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220730

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602006060308

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220330

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220330

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20220630

26N No opposition filed

Effective date: 20230103

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220615

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220630

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220615

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220330

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220630

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230522

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20230515

Year of fee payment: 18

Ref country code: IT

Payment date: 20230510

Year of fee payment: 18

Ref country code: FR

Payment date: 20230510

Year of fee payment: 18

Ref country code: DE

Payment date: 20230502

Year of fee payment: 18

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: TR

Payment date: 20230615

Year of fee payment: 18

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20230427

Year of fee payment: 18

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20060615

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220330