EP3561369A1 - Bande de diodes électroluminescentes flexible et entièrement coulée pour grosses sections d'alimentation et son procédé de fabrication - Google Patents
Bande de diodes électroluminescentes flexible et entièrement coulée pour grosses sections d'alimentation et son procédé de fabrication Download PDFInfo
- Publication number
- EP3561369A1 EP3561369A1 EP18020172.5A EP18020172A EP3561369A1 EP 3561369 A1 EP3561369 A1 EP 3561369A1 EP 18020172 A EP18020172 A EP 18020172A EP 3561369 A1 EP3561369 A1 EP 3561369A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- profile
- emitting diode
- light
- flexible
- electrical contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 230000009975 flexible effect Effects 0.000 title claims abstract description 110
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000004020 conductor Substances 0.000 claims abstract description 84
- 238000004382 potting Methods 0.000 claims abstract description 40
- 150000001875 compounds Chemical class 0.000 claims abstract description 39
- 230000002787 reinforcement Effects 0.000 claims abstract description 22
- 238000005452 bending Methods 0.000 claims abstract description 8
- 230000005484 gravity Effects 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 8
- 239000000969 carrier Substances 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 239000002800 charge carrier Substances 0.000 claims description 3
- 239000003000 extruded plastic Substances 0.000 claims description 3
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000005266 casting Methods 0.000 description 11
- 239000002245 particle Substances 0.000 description 9
- 238000013461 design Methods 0.000 description 8
- 229920002635 polyurethane Polymers 0.000 description 7
- 239000004814 polyurethane Substances 0.000 description 7
- 240000005702 Galium aparine Species 0.000 description 5
- 238000005286 illumination Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 230000004313 glare Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 206010041953 Staring Diseases 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229910000639 Spring steel Inorganic materials 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 210000002023 somite Anatomy 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
- F21V15/013—Housings, e.g. material or assembling of housing parts the housing being an extrusion
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
- F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates, according to claim 1, a vollvergossenes, flexible light emitting diode strip for large feeder lines, in particular emergency lighting, facade lighting or similar. Furthermore, the invention relates, according to claim 8, a process for its preparation.
- a flexible light strip which comprises a flexible circuit board, a plurality of light sources for emitting light, arranged on the flexible circuit board, first conductors for supplying the light sources and a housing which is formed around the flexible circuit board and the light sources.
- the light sources are arranged so that light is emitted substantially normal to the flexible circuit board.
- the housing has at least a first portion and a second portion extending along the flexible circuit board. The first portion is substantially transparent to the light emitted from the light sources, and the first and second portions are arranged so that the emitted light is reflected at the second portion.
- the main distribution direction of emitted light is redirected so that an intensity pattern with a maximum intensity in one direction at a non-zero angle to the normal of the flexible printed circuit board is formed.
- the angle to the normal of the flexible circuit board is between 30 degrees and 60 degrees, preferably 45 degrees.
- at least approximately half of the light emitted by the light sources is reflected by the second portion.
- the flexible light strip has a substantially rectangular shape in cross-section with first and second and third and fourth opposing surfaces, the flexible circuit board extending substantially parallel to the first surface, and the first and second sections being arranged such that at least the first and second sections are arranged Half of the light emitted from the light band light from the third and / or fourth surface is reflected.
- a lighting device for example an LED lighting device, comprising a housing made of an electrically insulating, channel-shaped elongated body, preferably a U-profile, with a plurality of electrical lines extending along the length of the U-profile and in the base of the U Profiles are embedded, known.
- the electric wires may have a flat shape or a circular shape and a solid or stranded structure.
- the lighting device comprises at least one electrically operated light source module, which is provided with electrical contact structures for contacting the electrical lines in the base of the U-profile and for contacting contact surfaces of the LEDs.
- the electrical contact formations can be cutting terminals for contacting to penetrate and make contact with the electrically conductive lines of the U-profile.
- fork-like contact arrangements can be provided, in particular, these are arranged astride the electrical lines of the U-profile and contact surfaces of the LED module.
- the contacting by electrically conductive material (eg adhesive) between the electrical lines and the contact surfaces shown.
- the light-emitting diode strip can be produced in any length in a surprisingly simple and cost-effective manner, with the flexible open profile (with integrated electrical lines with or without insulation for power supply and / or control and / or data transmission) serving both as a carrier and as a casting mold ,
- the flexible open profile (with integrated electrical lines with or without insulation for power supply and / or control and / or data transmission) serving both as a carrier and as a casting mold
- the flexible open profile (with integrated electrical lines with or without insulation for power supply and / or control and / or data transmission) serving both as a carrier and as a casting mold
- the flexible open profile with integrated electrical lines with or without insulation for power supply and / or control and / or data transmission
- the Applicant shows, serves as a basic form a flexible, open to one side profile U *, in particular a U-shell (also called U-profile), in the thickened bottom of the wiring and thus the power supply (electrical lines L1, L2,, Ln ) of a flexible conduct
- the two legs of the U-shell U * are preferably designed with an undercut H to the ground.
- This undercut H ensures in the production process for an optimal anchoring of a potting compound V on the U-shell U *.
- the material of the U-shell U * is preferably made of polyurethane and is preferably produced by extrusion.
- the U-shell U * is adjustable by additive particles in color and properties. It is conceivable, for example, by adding color particles, a pure white U-shell U * for optimal light output or by color particles of the RAL palette an individual color design depending on the place of use (decorative element). Furthermore, by incorporation of special particles, a flame-retardant material property can be achieved, v.a. for use in areas with increased safety requirements. Furthermore, a heat-conducting property is possible by ceramic particles.
- a flexible conductor carrier LP is equipped with LEDs and glued and filled with a preferably clear, consisting of polyurethane potting compound V and thereby before Moisture or weather conditions protected.
- a translucent potting compound V can also be used.
- each flexible cable carrier LP By combining the individual currents I1, I2, I3, .., In each flexible cable carrier LP as a total current to the electrical conductors L1, L2,, Ln in the U-shell U *, the limitation of the current carrying capacity of the flexible cable carrier LP is bypassed , which has previously prevented such large feed lengths.
- the flexible conductor support LP which in longitudinal extent preferably with chip LEDs (LED1, LED2, .., LEDn) is fitted, introduced.
- the flexible conductor support LP is glued on the inner floor between the legs of the profile U *.
- a mechanical reinforcement T which is for example a plastic film, a metal foil, alternatively a plastic tape / metal band, a grid or a glass fiber reinforced fabric tape to prevent bending against the permissible bending direction of the flexible conductor carrier LP, can be introduced.
- the individual components are non-positively connected by a suitable adhesive tape.
- the applicant describes the profile U * for strain relief / increase in tensile strength at least one wire or strand (consisting of several individual wires), which in particular in the leg of a U-profile U * or in the base between the electrical lines L1, L2,, Ln or in the upper and / or is arranged in the lower transverse part of a double-T-profile or in the vertical middle part between the electrical lines L1, L2,, Ln / are.
- the wire / strand is in a side wall (limb) which bears against the wall, and the electrical lines L1, L2,, Ln are in the bottom (base) of the profile U * (U-profile) arranged in the extension direction of the light emitting diode band LB *.
- the lower part, in which the insulated or non-insulated conductors L1, L2,, Ln extend can be removed. Now lie the stripped conductors L1, L2,, Ln in the beginning and end area free and can be assembled with plug and socket.
- the on the top of ongoing running flexible rail carrier LP can be installed butt with the next element, without having to take a shadow effect at the beginning and end points in purchasing.
- the prepared profile U * (with connectors at the beginning / end, the introduced mechanical reinforcement T, the defined with the running inside the open profile U conductors L1, L2,, Ln flexible conductor support LP) defined length is fixed in a clamping profile and is now ready for casting.
- a defined amount of a potting compound V preferably consisting of polyurethane, is now discharged in a manner such that a uniform filling level in the open profile U is achieved.
- the potting compound V can consist of one or more layers and in turn can be influenced even by the addition of additives in their properties.
- the open profile U * which serves both as a carrier and as a casting mold, can have different geometries; Undercuts or the like in the profile U *, which serves as a mold for potting, can be seen as unproblematic, since the profile U * and the potting material V are elastic and compensate for the forces occurring during demoulding.
- a double-T profile U * serve as a basic shape (not shown in the drawing). By using two LED modules LED on the double-T profile U *, these can also be controlled independently of each other.
- Luminaire body can be made variable and dynamic.
- the same principle can also be applied to different shades of white, thus a lamp can be variably adjusted from a warm white tone to a cool white tone. For example, to simulate a daylight simulation (early evening: warm white, during the day: cool white).
- a retainer which tapers upwards (thereby bias) and in which the cast light / light emitting diode strip LB * is snapped may be used as the mounting bracket.
- a further possibility of attachment of the light-emitting diode band LB * is a groove with undercut on the back outside of the open profile U * itself before to see. In this undercut groove, a mushroom-shaped holder is inserted and locked, which holds the light emitting diode band LB *.
- the invention is compared to the light-emitting diode bands according to the non-prepublished patent application EP3312506A1 the Applicant the task of further developing them so that a rolling up of the fully potted, flexible light emitting diode bands, especially at higher overall lengths, is not difficult.
- the light-emitting diode strip according to the invention has the advantage that an increased mechanical flexibility can be achieved by reducing a plurality of rigid planes in the fully potted product on one level. This avoids that at longer lengths by bending mechanical stresses (increasingly with a small bending radius) can build, which can damage the flexible conductor carrier (the flexible circuit board) result.
- the bending radius is essentially determined by the electrical contact arranged in the connection region and enclosed by a hard casting compound. Specifically, the summation current conductor is displaced from the bottom of the profile into the sidewalls and the position is raised, i. the center of the cross section of the conductor is placed on the same plane as that of the flexible conductor carrier and the mechanical reinforcement.
- the light-emitting diode strip according to the invention has the advantage that it can be produced in any length in a surprisingly simple and cost-effective manner, wherein the entire region in which the contacting takes place is enclosed by a preferably hard potting compound in order to provide mechanical protection and simultaneously to achieve a strain relief and on the other to achieve encapsulation against environmental influences, moisture and contact protection.
- Fig. 1 to Fig. 17 show various embodiments of a light emitting diode strip LB according to the invention and Fig. 18, 19 the embodiment of a light-emitting diode strip according to the non-prepublished patent application EP3312506A1 the applicant.
- the light-emitting diode band LB according to the invention is similar to the light-emitting diode bands according to the non-prepublished patent application EP3312506A1 the applicant so that the reference numerals have been chosen equal.
- the electrical lines L1, L2,, Ln are arranged in two opposite side walls of the profile U and the center of gravity SL lie approximately in the same plane E as that of the flexible printed circuit board LP and the reinforcement T. Furthermore, an electrical contact SP provided, which in the connection area AB, the end-free wire ends of the electrical lines L1, L2, Ln contacted with the flexible conductor support LP and which is enclosed after contacting with a hard potting compound VM, which in conjunction with the profile U inside filling potting compound V a mechanical protection and at the same time a strain relief of the concatenated light-emitting diode bands LB is achieved.
- the neighboring area potted with a flexible potting compound V.
- the electrical contact SP is configured as a rigid board P, which has insulation-piercing terminals K1 for contacting the electrical leads L1, L2,, Ln, and which in turn are through-contacted to solder pads P1 separately for contacting the flexible conductor supports LP on the upper side.
- via holes are provided with lead bridges LEB having a length corresponding to the distance between the solder pads P1 on the top of the electrical contact SP and the solder pads P1 of the flexible charge carrier LP.
- the electrical lines L1, L2,, Ln bridging the electrical contact SP are combined to form a cable by means of a self-adhesive shrinking tube SC.
- the board P consists of two separate sub-boards.
- the electrical contact SP is designed as a single-cutting clamp, as shown in FIG Fig. 10 is shown.
- the channel 1 is fed from one side and - as Fig. 11b shows - fed from one side of the channel 2 of the light-emitting diode band LB.
- the basic shape used for the finished product is an open profile U made of extruded plastic, preferably polyurethane (PUR).
- PUR polyurethane
- the profile U is cut to the length of the finished product.
- the next manufacturing step is the removal of the sheath contour from the inner conductors L1, L2, ... Ln (see Fig. 2 ).
- each conductor L1, L2, ... Ln is now an electrical contact SP, preferably a rigid board P, with a number of conductors L1, L2, ... Ln corresponding number on the one hand cutting terminals and on the other hand solder pads applied contacting options , pressed on. So that each conductor L1, L2, ... Ln is firmly contacted in a cutting clamp.
- the electrical contact SP has vias from the bottom to the top, so that an electrically conductive connection to the top and there solder pads P1 of the board P is made.
- a conductive connection is made from the conductors L1, L2,... Ln to the flexible conductor carrier LP arranged on the upper side of the board P (see FIG Fig. 3 ).
- the profile U is inserted or clamped in a suitable clamping form V1, which represents the fixation.
- V1 represents the fixation.
- the profile U is fixed in the longitudinal direction, is held straight and has no Height differences. This in turn is important for the later process of introducing the flexible potting compound V or the solid potting compound VM (see, for example Fig. 7 / Fig. 14 ).
- This reinforcement T preferably a plastic film, a metal foil, alternatively plastic tape / metal strip, a grid or a glass fiber reinforced fabric tape or plastic-coated polyester fabric or a flat plate with recesses, is applied to the inner bottom of the open profile U by means of a suitable adhesive.
- the flexible conductor carrier LP is introduced on the mechanical reinforcement T introduced in the previous step with a suitable adhesive (see Fig. 4 ).
- the contacting between the soldering pads P1 on the top side of the board P and the soldering pads takes place on the flexible charge carrier LP.
- line bridges LEB with a length corresponding to the defined distance between the solder pads on the top of the board P and the solder pads P1 of the flexible conductor support LP, electrically connected by material connection, in particular soldering.
- the conductors L1, L2, ... Ln are brought by means of a marsverklebenden shrink tube SC in a circular-like shape and shrunk by heat and glued. This happens on both sides of the product (see Fig. 6 ).
- the contacting area is electrically insulated on the one hand and also protected against moisture and moisture on the other hand.
- the solid to hard (typically with a Shore D hardness of 80) potting compound VM assumes the function of a strain relief in that it absorbs the tensile forces that occur and does not transmit to the internal conductors L1, L2,... Ln (FIG. please refer Fig. 7 ).
- a defined amount of a potting compound V preferably made of polyurethane, is discharged in such a way that a uniform filling level in the open profile U is achieved.
- the potting compound V from a or several layers can be and in turn itself can be influenced by the addition of additives in their properties.
- translucent particles for reduced glare and a more uniform light distribution or fluorescent particles which make it possible to emit afterglow are to be mentioned as conceivable settings, above all in areas for safety-relevant orientation illuminations.
- a variation of the contours can be achieved by constantly tapered walls (see Fig. 12 ) or by convex upward tapered walls (see Fig. 13 ) respectively. Both allow a homogeneous photo across the entire width.
- FIG. 14 shows an embodiment of the electrical contact SP with a rigid board P in side view (see also Fig. 8 in plan view), in particular the contacting between summation current conductors L2a (see also electrical lines L1, L2, ... Ln) and the individual taps.
- a rigid board P On the summation current conductors L2a, which in the side walls of the shell M1 (see Fig. 8 ) run, a rigid board P is placed as an electrical contact SP, which is equipped on the bottom with the number of summation current conductor L2a on insulation displacement terminals K1, which in turn are plated separately from each other on the top to solder pads P1. From these upper-side solder pads P1, the required current is transmitted to the flexible printed circuit board LP by means of feed cable / conductor bridges LEB.
- the summation current conductor L2a (see also electrical lines L1, L2, ... Ln) are passed after the tapping of the current in a cable L1a (see also electrical lines L1, L2, ... Ln), where, for example, to a plug / Socket is contacted.
- the complete area in which the contacting takes place is enclosed with a preferably hard potting compound VM, in order to achieve mechanical protection and at the same time a strain relief, on the other hand to achieve encapsulation against environmental influences, moisture and contact protection.
- Fig. 15 shows an embodiment of the electrical contact SP with a rigid board and a division of the contacting of the summation current conductor L2a on one side in a side view according to the invention.
- Fig. 16 shows the embodiment Figure 15 in plan view, left side and Fig. 17 the design after Fig. 15 in plan view, right side.
- a holder for the attachment (for example an eyelet) of the light-emitting diode band LB in the connection region AB can be inserted and cast in the flexible casting mold VF.
- Usual place of use, especially in emergency lighting, is the assembly in a handrail.
- This handrail has a downwardly directed groove, which is directed to the escape route to illuminate the escape route, if necessary. It can be displayed in the context of the invention by changing the light color (from red to green) or in the manner of a running light and the correct direction of the escape route.
- the groove in the handrail surrounds / surrounds the retracted light-emitting diode band LB in such a way that the light emission is not impaired.
- the groove comprises only the jacket M1 and leaves the area of the conductor carrier LP free. This gives us a secure attachment, too against vibration, reached in the holding groove.
- the profile U sections with flexible potting compound V and solid potting compound VM can be filled inside which, especially for smaller lengths, offers advantages in the assembly of the light-emitting diode strip LB according to the invention.
- the invention is not yet limited to the feature combinations defined in claim 1 or claim 8, but may also be defined by any other combination of certain features of all individually disclosed individual features. This means that in principle virtually every individual feature of patent claim 1 or claim 8 can be omitted or replaced by at least one individual feature disclosed elsewhere in the application.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP18020172.5A EP3561369B1 (fr) | 2018-04-24 | 2018-04-24 | Bande de diodes électroluminescentes flexible et entièrement coulée pour grosses sections d'alimentation et son procédé de fabrication |
PCT/EP2019/025116 WO2019206457A1 (fr) | 2018-04-24 | 2019-04-21 | Ruban souple, encapsulé, de diodes électroluminescentes pour de grandes zones d'alimentation et procédé pour sa fabrication |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP18020172.5A EP3561369B1 (fr) | 2018-04-24 | 2018-04-24 | Bande de diodes électroluminescentes flexible et entièrement coulée pour grosses sections d'alimentation et son procédé de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3561369A1 true EP3561369A1 (fr) | 2019-10-30 |
EP3561369B1 EP3561369B1 (fr) | 2020-12-09 |
Family
ID=62067320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP18020172.5A Active EP3561369B1 (fr) | 2018-04-24 | 2018-04-24 | Bande de diodes électroluminescentes flexible et entièrement coulée pour grosses sections d'alimentation et son procédé de fabrication |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP3561369B1 (fr) |
WO (1) | WO2019206457A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4274731A1 (fr) | 2021-01-08 | 2023-11-15 | Signify Holding B.V. | Procédé de jonction de films souples comprenant des del |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE20119861U1 (de) | 2001-12-07 | 2002-06-20 | Schütz, Winfried, Dr., 81737 München | Lichtschlauch |
DE10243948A1 (de) | 2002-09-22 | 2004-04-01 | Anke Duschek | Lichtschlauch als Leuchtmittel für Leuchtkörper, Leuchtkörper und Verfahren zur Herstellung dieser Leuchtkörper |
DE202005002425U1 (de) | 2005-02-14 | 2005-04-21 | Fan, Ben, Hsitzu | Lichtschlauch |
DE202005006643U1 (de) | 2005-04-26 | 2005-09-08 | Fan, Ben, Hsitzu | Flexible LED-Kabel-Beleuchtung |
DE202008002044U1 (de) | 2008-02-14 | 2008-04-17 | Tsai, Nei-Cheng, Zhonghe City | Flexibles LED-Stablicht-Gerät |
US20080239716A1 (en) * | 2007-03-30 | 2008-10-02 | Yuan Lin | Light strip |
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WO2011110217A1 (fr) | 2010-03-09 | 2011-09-15 | Tri-O-Light Bv | Bande lumineuse |
DE202011003608U1 (de) | 2010-06-23 | 2011-11-30 | Hummel-Formen Gmbh | Vorrichtung zur Herstellung eines Bauteils |
DE202012009416U1 (de) * | 2012-10-01 | 2012-11-22 | Osram Ag | Leuchtvorrichtung |
DE102012213309A1 (de) | 2012-07-30 | 2014-01-30 | Osram Gmbh | Verfahren zum Herstellen eines Leuchtbands und Leuchtband |
DE102012110136A1 (de) | 2012-10-24 | 2014-04-24 | Michael Titze | LED-Band |
DE102013203666A1 (de) | 2013-03-04 | 2014-09-04 | Osram Gmbh | Leuchtband mit bandförmigem Substrat |
CN204127743U (zh) * | 2013-10-29 | 2015-01-28 | 东莞市中之光电科技有限公司 | 防水led灯条 |
CN105927883A (zh) * | 2016-07-06 | 2016-09-07 | 中山市美耐特光电有限公司 | 一种贴片式led柔性灯带 |
EP3270053A1 (fr) | 2016-07-12 | 2018-01-17 | OSRAM GmbH | Réflecteur pour dispositifs d'éclairage, dispositif et procédé d'éclairage correspondants |
EP3312506A1 (fr) | 2016-10-24 | 2018-04-25 | CLD Germany GmbH | Bande de diodes électroluminescentes modulaire, entièrement coulée, flexible et son procédé de fabrication |
-
2018
- 2018-04-24 EP EP18020172.5A patent/EP3561369B1/fr active Active
-
2019
- 2019-04-21 WO PCT/EP2019/025116 patent/WO2019206457A1/fr active Application Filing
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DE10243948A1 (de) | 2002-09-22 | 2004-04-01 | Anke Duschek | Lichtschlauch als Leuchtmittel für Leuchtkörper, Leuchtkörper und Verfahren zur Herstellung dieser Leuchtkörper |
DE202005002425U1 (de) | 2005-02-14 | 2005-04-21 | Fan, Ben, Hsitzu | Lichtschlauch |
DE202005006643U1 (de) | 2005-04-26 | 2005-09-08 | Fan, Ben, Hsitzu | Flexible LED-Kabel-Beleuchtung |
US20080239716A1 (en) * | 2007-03-30 | 2008-10-02 | Yuan Lin | Light strip |
DE202008002044U1 (de) | 2008-02-14 | 2008-04-17 | Tsai, Nei-Cheng, Zhonghe City | Flexibles LED-Stablicht-Gerät |
EP2454520B1 (fr) | 2010-03-09 | 2015-01-28 | Tri-O-Light BV | Bande lumineuse |
WO2011110217A1 (fr) | 2010-03-09 | 2011-09-15 | Tri-O-Light Bv | Bande lumineuse |
DE202011003608U1 (de) | 2010-06-23 | 2011-11-30 | Hummel-Formen Gmbh | Vorrichtung zur Herstellung eines Bauteils |
CN102095118A (zh) * | 2010-11-10 | 2011-06-15 | 中山市科顺分析测试技术有限公司 | 柔性led贴片灯带 |
DE102012213309A1 (de) | 2012-07-30 | 2014-01-30 | Osram Gmbh | Verfahren zum Herstellen eines Leuchtbands und Leuchtband |
DE202012009416U1 (de) * | 2012-10-01 | 2012-11-22 | Osram Ag | Leuchtvorrichtung |
DE102012110136A1 (de) | 2012-10-24 | 2014-04-24 | Michael Titze | LED-Band |
DE102013203666A1 (de) | 2013-03-04 | 2014-09-04 | Osram Gmbh | Leuchtband mit bandförmigem Substrat |
CN204127743U (zh) * | 2013-10-29 | 2015-01-28 | 东莞市中之光电科技有限公司 | 防水led灯条 |
CN105927883A (zh) * | 2016-07-06 | 2016-09-07 | 中山市美耐特光电有限公司 | 一种贴片式led柔性灯带 |
EP3270053A1 (fr) | 2016-07-12 | 2018-01-17 | OSRAM GmbH | Réflecteur pour dispositifs d'éclairage, dispositif et procédé d'éclairage correspondants |
EP3312506A1 (fr) | 2016-10-24 | 2018-04-25 | CLD Germany GmbH | Bande de diodes électroluminescentes modulaire, entièrement coulée, flexible et son procédé de fabrication |
Also Published As
Publication number | Publication date |
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WO2019206457A1 (fr) | 2019-10-31 |
EP3561369B1 (fr) | 2020-12-09 |
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