EP3503681B1 - High-frequency heating device - Google Patents

High-frequency heating device Download PDF

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Publication number
EP3503681B1
EP3503681B1 EP17843288.6A EP17843288A EP3503681B1 EP 3503681 B1 EP3503681 B1 EP 3503681B1 EP 17843288 A EP17843288 A EP 17843288A EP 3503681 B1 EP3503681 B1 EP 3503681B1
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EP
European Patent Office
Prior art keywords
surface wave
unit
microwaves
wave exciter
heating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP17843288.6A
Other languages
German (de)
English (en)
French (fr)
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EP3503681A4 (en
EP3503681A1 (en
Inventor
Toshiyuki Okajima
Yoshiharu Oomori
Koji Yoshino
Takanori Hirobe
Hiroyuki Uejima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Publication of EP3503681A1 publication Critical patent/EP3503681A1/en
Publication of EP3503681A4 publication Critical patent/EP3503681A4/en
Application granted granted Critical
Publication of EP3503681B1 publication Critical patent/EP3503681B1/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H05B6/707—Feed lines using waveguides

Definitions

  • the present disclosure relates to a high-frequency heating device such as a microwave oven.
  • Patent Literature 1 discloses a high-frequency heating device which thaws a frozen sushi placed in a surface wave transmission line by directly supplying microwaves to the surface wave transmission line.
  • An objective of the present disclosure is to provide a high-frequency heating device which contributes to achieving the aforementioned goal.
  • a high-frequency heating device includes a generation unit, a surface wave exciter, a first connecting unit, and a reuse unit.
  • the generation unit generates microwaves.
  • the surface wave exciter includes a periodic structure and heats a heating subject by propagating the microwaves in a surface wave mode.
  • the first connecting unit is disposed at one end portion of the surface wave exciter. The microwaves generated by the generation unit are supplied to the surface wave exciter through the first connecting unit.
  • the reuse unit reuses, for heating the heating subject, the microwaves in the surface wave mode that have reached another end portion of the surface wave exciter located in a propagation direction of the microwaves from one end portion of the surface wave exciter.
  • microwaves that have not been absorbed by the heating subject can be reused for heating a heating subject.
  • the utilization efficiency of microwave energy can be improved.
  • a high-frequency heating device includes the features of claim 1, preferred embodiments are disclosed in the dependent claims.
  • the generation unit is configured to generate microwaves.
  • the surface wave exciter includes a periodic structure and heats a heating subject by propagating the microwaves in a surface wave mode.
  • the first connecting unit is disposed at one end portion of the surface wave exciter. The microwaves generated by the generation unit are supplied to the surface wave exciter through the first connecting unit.
  • the reuse unit is configured to reuse, for heating the heating subject, the microwaves in the surface wave mode that have reached another end portion of the surface wave exciter located in a propagation direction of the microwaves from one end portion of the surface wave exciter.
  • the high-frequency heating device according to the present disclosure is specifically a microwave oven.
  • the high-frequency heating device according to the present disclosure is not limited to this and includes a heating device which uses dielectric heating, a garbage disposer, a semiconductor manufacturing device, and the like.
  • FIG. 1 and FIG. 2 are a vertical cross-sectional view and a horizontal cross-sectional view, respectively, which schematically illustrate a configuration of high-frequency heating device 1a according to Embodiment 1 of the present disclosure.
  • high-frequency heating device 1a includes heating chamber 2, generation unit 8, surface wave exciter 10, connecting unit 12, reflective unit 14, and control unit 16.
  • High-frequency heating device 1a is configured to heat heating subject 6 placed on tray 4 by microwaves which propagate on a surface of surface wave exciter 10 in a surface wave mode.
  • FIG. 2 schematically illustrates a situation in which microwaves in the surface wave mode propagate on surface wave exciter 10 and also schematically illustrates a placement position of heating subject 6 on tray 4 (not illustrated in FIG. 2 ).
  • Generation unit 8 includes a magnetron and an inverter and is configured to generate microwaves under control of control unit 16.
  • a solid-state oscillator and a power amplifier may constitute generation unit 8.
  • Surface wave exciter 10 is disposed below tray 4.
  • Surface wave exciter 10 heats heating subject 6 placed on tray 4 by propagating the microwaves in the surface wave mode.
  • Surface wave exciter 10 is a stub-type surface wave exciter which is a metallic periodic structure.
  • Surface wave exciter 10 includes a plurality of metal plates 11 arranged on metal plate 13 at a predetermined interval.
  • Surface wave exciter 10 does not need to be the stub-type surface wave exciter and may be an interdigital surface wave exciter obtained by stamping a metal plate into an interdigitated pattern.
  • Surface wave exciter 10 may be formed using a dielectric plate such as an alumna plate or a Bakelite plate instead of the metallic periodic structure.
  • the excitation frequency of surface wave exciter 10 depends on material, size, etc. In the case of the stub-type surface wave exciter, the excitation frequency can be set to a desired value by appropriately selecting the height, interval, etc., of metal plates 11. Generally, the excitation frequency of surface wave exciter 10 increases as the height of metal plates 11 is reduced and as the interval between metal plates 11 is reduced.
  • Metal plates 11 are arranged parallel to each other.
  • Surface wave exciter 10 propagates the surface waves perpendicularly to metal plate 11, that is, along the alinement of metal plates 11.
  • the propagation direction of the microwaves propagating on surface wave exciter 10 in the surface wave mode matches the alinement direction of metal plates 11.
  • Connecting unit 12 is disposed on power supply edge 15 which is one end portion of surface wave exciter 10 (the left end of surface wave exciter 10 in FIG. 1 and FIG. 2 ).
  • the microwaves generated by generation unit 8 are supplied from power supply edge 15 to surface wave exciter 10 through connecting unit 12.
  • connecting unit 12 is a rectangular waveguide. Connecting unit 12 corresponds to the first connecting unit.
  • Reflective unit 14 is disposed so as to cover terminal edge 17.
  • Terminal edge 17 is another end portion of surface wave exciter 10 that is located in propagation direction D1 from power supply edge 15 (the right end of surface wave exciter 10 in FIG. 1 and FIG. 2 ).
  • Reflective unit 14 totally reflects, off terminal edge 17, microwaves in the surface wave mode that have propagated on the surface of surface wave exciter 10.
  • reflective unit 14 is a rectangular waveguide.
  • the microwaves generated by generation unit 8 are supplied from power supply edge 15 to surface wave exciter 10 through connecting unit 12.
  • Surface waves S2 which are part of surface waves S1, further propagate on the surface of surface wave exciter 10 in propagation direction D1 without being absorbed by heating subject 6, and reach terminal edge 17 of surface wave exciter 10.
  • Reflective unit 14 reflects surface waves S2 off terminal edge 17, reversing the propagation direction of surface waves S2.
  • the propagation direction of surface waves S2 is changed from propagation direction D1 to propagation direction D2 (in the figure, from the right to the left).
  • microwaves in the surface wave mode that have not been absorbed by heating subject 6 and have reached the terminal edge of the surface wave exciter are radiated to space.
  • the microwaves that have been radiated to space do not contribute to heating of heating subject 6; thus, the utilization efficiency of microwave energy is reduced.
  • heating subject 6 is heated not only with surface waves S1, but also with surface waves S2 reflected by reflective unit 14.
  • high-frequency heating device 1a is capable of reusing, for heating a heating subject, microwaves that have not been absorbed by the heating subject. As a result, the utilization efficiency of microwave energy can be improved.
  • reflective unit 14 corresponds to a reuse unit configured to reuse microwaves that have not been absorbed by heating subject 6 and have reached the terminal edge of the surface wave exciter.
  • FIG. 3 is a horizontal cross-sectional view schematically illustrating a configuration of high-frequency heating device 1b.
  • FIG. 3 schematically illustrates a situation in which microwaves in the surface wave mode propagate on surface wave exciter 10 and also schematically illustrates a placement position of heating subject 6 on tray 4 (not illustrated in FIG. 3 ).
  • Embodiment 1 surface waves S2 that have reached terminal edge 17 of surface wave exciter 10 are reflected so that the microwaves are reused.
  • microwaves in the surface wave mode are converted into microwaves in another mode by impedance matching so that the microwaves are reused.
  • high-frequency heating device 1b includes matching unit 22 and conversion unit 24 instead of reflective unit 14.
  • matching unit 22 and conversion unit 24 correspond to the reuse unit.
  • High-frequency heating device 1b further includes power storage unit 26.
  • Matching unit 22 is connected to terminal edge 17 of surface wave exciter 10.
  • Conversion unit 24 is connected to matching unit 22 by microwave transmission line 23 and is connected to power storage unit 26 by direct-current power transmission line 25.
  • Power storage unit 26 is connected to generation unit 8 and supplies power to generation unit 8.
  • Matching unit 22 is an impedance matching device configured to provide impedance matching for microwaves. Through the impedance matching, microwaves in the surface wave mode can be converted into microwaves in a co-axial mode or microwaves in a waveguide mode. Hereinafter, this will be referred to as mode conversion by impedance matching.
  • matching unit 22 may have a stepped stub structure.
  • matching unit 22 may have a two-step structure which converts microwaves in the surface wave mode into microwaves in the waveguide mode and then, converts the microwaves into microwaves in the coaxial mode.
  • Matching unit 22 is not limited to these and may have various structures.
  • Microwave transmission line 23 may be formed of a co-axial line or a waveguide line, for example.
  • matching unit 22 converts microwaves in the surface wave mode into microwaves in the co-axial mode or the waveguide mode. Therefore, the microwaves can be transmitted to conversion unit 24, which is another structural element, by microwave transmission line 23.
  • Conversion unit 24 is a member which converts microwaves, which are alternating-current power, into direct-current power.
  • a rectifying antenna (rectenna) may be used for conversion unit 24.
  • heating subject 6 is heated with surface waves S1 obtained from the microwaves supplied through connecting unit 12.
  • Surface waves S2 that have propagated on surface wave exciter 10 without being absorbed by heating subject 6 reach terminal edge 17.
  • Matching unit 22 generates microwaves in the co-axial mode or the waveguide mode by carrying out, by impedance matching, mode conversion of the microwaves (surface waves S2) in the surface wave mode that have reached terminal edge 17. Matching unit 22 transmits the microwaves resulting from the mode conversion to conversion unit 24 by microwave transmission line 23.
  • Conversion unit 24 converts the microwaves into direct-current power and transmits the direct-current power to power storage unit 26 by direct-current power transmission line 25.
  • Power storage unit 26 stores the direct-current power as power to be supplied to generation unit 8.
  • high-frequency heating device 1b converts the microwaves that have not been absorbed by heating subject 6 into the direct-current power using matching unit 22 and conversion unit 24.
  • This direct-current power is stored in power storage unit 26 and, when required, is supplied to generation unit 8.
  • high-frequency heating device 1b is capable of reusing, for heating a heating subject, microwaves that have not been absorbed by the heating subject. As a result, the utilization efficiency of microwave energy can be improved.
  • FIG. 4 is a horizontal cross-sectional view schematically illustrating a configuration of high-frequency heating device 1c.
  • FIG. 4 schematically illustrates a situation in which microwaves in the surface wave mode propagate on surface wave exciter 20 and also schematically illustrates a placement position of heating subject 6 on tray 4 (not illustrated in FIG. 4 ).
  • high-frequency heating device 1c does not include conversion unit 24 or power storage unit 26, but includes connecting unit 32 instead.
  • High-frequency heating device 1c includes surface wave exciter 20 instead of surface wave exciter 10.
  • Surface wave exciter 20 has a configuration different from the configuration of surface wave exciter 10 according to Embodiment 2.
  • Connecting unit 32 corresponds to the second connecting unit.
  • High-frequency heating device 1c includes connecting unit 32 in addition to connecting unit 12.
  • Connecting unit 32 is disposed on power supply edge 33 which is an end portion of surface wave exciter 20 different from power supply edge 15 and terminal edge 17.
  • surface wave exciter 20 has the shape of an approximate square in plan view, and connecting unit 32 is disposed on power supply edge 33 orthogonal to power supply edge 15.
  • Connecting unit 32 is connected to matching unit 22 by microwave transmission line 31.
  • heating subject 6 is heated with surface waves S1 obtained from the microwaves supplied through connecting unit 12.
  • Surface waves S2 which are part of surface waves S1, propagate on the surface of surface wave exciter 10 without being absorbed by heating subject 6, and reach terminal edge 17.
  • Matching unit 22 generates microwaves in the co-axial mode or the waveguide mode by carrying out, by impedance matching, mode conversion of the microwaves (surface waves S2) in the surface wave mode that have reached terminal edge 17. Matching unit 22 transmits the microwaves resulting from the mode conversion to connecting unit 32 by microwave transmission line 31.
  • the microwaves are supplied to surface wave exciter 20 through power supply edge 33 by way of connecting unit 32.
  • surface waves S3 which propagate in propagation direction D3 orthogonal to propagation direction D1 of surface waves S1 and S2, are generated.
  • Heating subject 6 is heated also with surface waves S3.
  • matching unit 22 and connecting unit 32 correspond to the reuse unit.
  • the pin-type stub structure is a periodic structure including a plurality of columnar pins horizontally periodically arranged.
  • FIG. 5 and FIG. 6 illustrate examples of the pin-type stub structure.
  • Surface wave exciter 20 illustrated in FIG. 5 includes pins 20a each in the shape of a quadrangular prism.
  • Surface wave exciter 20 illustrated in FIG. 6 includes pins 20b each in the shape of a circular cylinder.
  • the surface waves can propagate along in the alinement of the pins, that is, in an arbitrary direction parallel to the horizontal plane in which the pins are arranged.
  • high-frequency heating device 1c microwaves that have not been absorbed by heating subject 6 are re-supplied to surface wave exciter 20 through connecting unit 32.
  • high-frequency heating device 1c is capable of reusing, for heating a heating subject, microwaves that have not been absorbed by the heating subject. As a result, the utilization efficiency of microwave energy can be improved.
  • FIG. 7 is a horizontal cross-sectional view schematically illustrating a configuration of high-frequency heating device 1d.
  • FIG. 7 schematically illustrates a situation in which microwaves in the surface wave mode propagate on surface wave exciter 30 and also schematically illustrates a placement position of heating subject 6 on tray 4 (not illustrated in FIG. 7 ).
  • High-frequency heating device 1d does not include reflective unit 14 which is the reuse unit, but includes surface wave exciter 30 which, because of its shape, can reuse microwaves that have not been absorbed by heating subject 6.
  • surface wave exciter 30 is curved in a U-shape in plan view. Specifically, surface wave exciter 30 includes straight portion 30a, curved portion 30b, and straight portion 30c. Heating subject 6 is placed on tray 4 (not illustrated in the drawings), on and between straight portions 30a and 30c. Straight portion 30a, curved portion 30b, and straight portion 30c correspond to the first portion, the second portion, and the third portion, respectively.
  • Straight portion 30a extends in a straight line in plan view and propagates, in propagation direction D1, surface waves S1 obtained from the microwaves supplied through connecting unit 12.
  • Surface waves S2, which are part of surface waves S1 further propagate on straight portion 30a without being absorbed by heating subject 6, and reach the terminal edge of straight portion 30a.
  • Curved portion 30b has the shape of a fan with a central angle of 180 degrees in plan view and connects straight portion 30a and straight portion 30c.
  • Surface waves S2 that have propagated from straight portion 30a to curved portion 30b in propagation direction D1 propagate from curved portion 30b to straight portion 30c in propagation direction D2.
  • curved portion 30b changes the propagation direction of surface waves S2.
  • the propagation direction of surface waves S2 is reversed.
  • Straight portion 30c is connected to curved portion 30b and extends in a straight line in plan view.
  • Straight portion 30c propagates, in propagation direction D2, surface waves S2 that have been reversed in the propagation direction by curved portion 30b.
  • heating subject 6 is heated with surface waves S1 obtained as a result of propagation, on straight portion 30a, of the microwaves supplied through connecting unit 12.
  • heating subject 6 is also heated with surface waves S2 propagating on straight portion 30c in the propagation direction reversed by the curved portion 30b.
  • the reuse unit is not formed of other members such as reflective unit 14 and matching unit 22 unlike in Embodiments 1 and 2. Curved portion 30b and straight portion 30c included in surface wave exciter 30 function as the reuse unit.
  • high-frequency heating device 1d uses again, for heating heating subject 6, microwaves that have not been absorbed by heating subject 6.
  • high-frequency heating device 1d is capable of reusing, for heating a heating subject, microwaves that have not been absorbed by the heating subject. As a result, the utilization efficiency of microwave energy can be improved.
  • Embodiments 1 to 4 have been described above, the present disclosure is not limited to these exemplary embodiments.
  • reflective unit 14 is disposed so as to cover terminal edge 17 of surface wave exciter 10.
  • another configuration is also applicable as long as the surface waves can be reflected.
  • reflective unit 14 may completely cover surface wave exciter 10.
  • Embodiment 1 all metal plates 11 included in surface wave exciter 10 are set to the same height. However, metal plates 11 covered by reflective unit 14 may be stepwise reduced in height toward terminal edge 17, for example. With this configuration, the surface waves can be more accurately reflected.
  • the rectenna is given as an example of conversion unit 24.
  • this is not limiting as long as the microwaves can be converted into direct-current power.
  • connecting unit 32 is disposed on power supply edge 33 which is an end portion of surface wave exciter 20 different from power supply edge 15 and terminal edge 17.
  • power supply edge 33 may be disposed on power supply edge 15 or terminal edge 17.
  • surface wave exciter 20 according to Embodiment 3 has a pin-type stub structure.
  • surface wave exciters 10 according to Embodiments 1 and 2 and surface wave exciter 30 according to Embodiment 4 may each have the pin-type stub structure.
  • surface wave exciter 30 is U-shaped.
  • the shape of surface wave exciter 30 is not limited to this as long as surface wave exciter 30 changes the propagation direction of surface waves S2 that have propagated on surface wave exciter 30.
  • the present disclosure is applicable to a microwave oven, a dehydrator, a heating device for pottery, a garbage disposer, a semiconductor manufacturing device, and the like.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Constitution Of High-Frequency Heating (AREA)
EP17843288.6A 2016-08-22 2017-07-24 High-frequency heating device Active EP3503681B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016162145 2016-08-22
PCT/JP2017/026620 WO2018037802A1 (ja) 2016-08-22 2017-07-24 高周波加熱装置

Publications (3)

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EP3503681A1 EP3503681A1 (en) 2019-06-26
EP3503681A4 EP3503681A4 (en) 2019-11-20
EP3503681B1 true EP3503681B1 (en) 2020-05-13

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Application Number Title Priority Date Filing Date
EP17843288.6A Active EP3503681B1 (en) 2016-08-22 2017-07-24 High-frequency heating device

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EP (1) EP3503681B1 (zh)
JP (1) JP6967707B2 (zh)
CN (1) CN109076656B (zh)
WO (1) WO2018037802A1 (zh)

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Publication number Priority date Publication date Assignee Title
CN111066375B (zh) * 2018-04-06 2022-03-04 松下知识产权经营株式会社 高频加热装置
CN114040533B (zh) * 2021-11-19 2022-11-22 北京航空航天大学 一种喇叭激励介质表面波均匀加热装置
JP2023148648A (ja) * 2022-03-30 2023-10-13 パナソニックＩｐマネジメント株式会社 高周波加熱装置

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Publication number Priority date Publication date Assignee Title
US4121078A (en) * 1975-04-30 1978-10-17 Matsushita Electric Industrial Co., Ltd. Microwave heating apparatus
JPS57124875A (en) * 1981-01-27 1982-08-03 Sanyo Electric Co Microwave heater
JPS5832239Y2 (ja) * 1981-09-22 1983-07-16 松下電器産業株式会社 高周波加熱器
WO2004098241A1 (ja) * 2003-04-25 2004-11-11 Matsushita Electric Industrial Co., Ltd. 高周波加熱装置及びその制御方法
JP2007192518A (ja) * 2006-01-23 2007-08-02 Matsushita Electric Ind Co Ltd 高周波加熱装置
WO2009050893A1 (ja) * 2007-10-18 2009-04-23 Panasonic Corporation マイクロ波加熱装置
CN103718644B (zh) * 2011-08-04 2016-02-10 松下电器产业株式会社 微波加热装置
JP6288461B2 (ja) * 2012-12-07 2018-03-07 パナソニックＩｐマネジメント株式会社 マイクロ波処理装置
US10426001B2 (en) * 2013-03-15 2019-09-24 Tokyo Electron Limited Processing system for electromagnetic wave treatment of a substrate at microwave frequencies
JP2015162272A (ja) * 2014-02-26 2015-09-07 パナソニック株式会社 マイクロ波処理装置

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Publication number Publication date
WO2018037802A1 (ja) 2018-03-01
JP6967707B2 (ja) 2021-11-17
CN109076656A (zh) 2018-12-21
CN109076656B (zh) 2020-12-08
JPWO2018037802A1 (ja) 2019-06-20
EP3503681A4 (en) 2019-11-20
EP3503681A1 (en) 2019-06-26

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