EP3365644A1 - Strahlungssensoranordnung und gasdetektoranordnung - Google Patents
Strahlungssensoranordnung und gasdetektoranordnungInfo
- Publication number
- EP3365644A1 EP3365644A1 EP16763517.6A EP16763517A EP3365644A1 EP 3365644 A1 EP3365644 A1 EP 3365644A1 EP 16763517 A EP16763517 A EP 16763517A EP 3365644 A1 EP3365644 A1 EP 3365644A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- radiation
- radiation sensor
- sensor arrangement
- arrangement
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
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- 239000004065 semiconductor Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
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- 230000000996 additive effect Effects 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/429—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to measurement of ultraviolet light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0853—Optical arrangements having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0896—Optical arrangements using a light source, e.g. for illuminating a surface
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J2005/066—Differential arrangement, i.e. sensitive/not sensitive
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
- G01J2005/206—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices on foils
Definitions
- Radiation sensor arrangement and gas detector arrangement The invention relates to a radiation sensor arrangement and a
- the invention relates to a radiation sensor arrangement and a
- a plurality of radiation sensors are known, which are based on the bolometric principle.
- the bolometric principle is based on the fact that an electrical resistance of a material changes in the course of a temperature change.
- Radiation sensors based on this principle have a sensitive element comprising a structure adapted to absorb electromagnetic radiation of a certain wavelength range. Furthermore, the sensitive includes
- Element another structure whose electrical resistance serves as a measure of the incident electromagnetic radiation. Due to the absorption of the electromagnetic radiation, the sensitive element undergoes a
- Temperature change results in a change in the electrical resistance of the further structure of the sensitive element, which represents a measure of the absorbed radiation.
- the radiation sensors which are based on the bolometric principle, for measuring infrared radiation, since most of these radiation sensors have the highest sensitivity in the infrared range.
- NDI R nondispersive infrared
- the NDI R gas detector typically includes an infrared light source, optical filters and an infrared radiation detector, many atmospheric gases absorb infrared radiation of specific wavelengths, so-called absorption bands, carbon dioxide and water are examples of such atmospheric gases
- the optical filters of the NDI R gas detector are designed as narrow-band bandpass interference filters and transmit characteristic wavelengths of the gas to be detected, which are part of the absorption band. The transmitted radiation is then detected using the infrared radiation detector.
- the present invention provides a radiation sensor assembly and a gas detector assembly.
- the invention with the features of the independent claim has the advantage that the radiation sensor arrangement according to the invention can be produced inexpensively and with standard processes of the semiconductor industry and that the sensitivity of the radiation sensor arrangement according to the invention against electromagnetic radiation of different wavelengths can be adjusted. This is of interest for a large number of applications in which the transmission behavior of radiation of specific wavelengths is to be investigated.
- a radiation sensor assembly comprising a radiation sensor comprising a cantilevered element comprising an optical absorber and a resistor structure and a support structure which keeps the cantilevered element at a distance from a substrate and which connects between the cantilevered element and the substrate represents, and an evaluation unit for determining an absorbed radiation from the change of an electrical resistance of the resistance structure, wherein the radiation sensor arrangement is characterized by a wavelength-selective design of the optical absorber.
- the cantilevered element comprises the
- Radiation sensor arrangement without plasmonic absorber elements is increased.
- a reflector can be applied to the substrate below the cantilevered element, which, together with the
- cantilevered element forms a resonator.
- the optical absorber becomes wavelength selective
- Radiation sensor arrangement advantageously be used to determine a radiation in the ultraviolet range by the optical absorber is designed for wavelength-selective absorption in the ultraviolet radiation.
- the optical absorber can be designed as a lacquer. In the production of the radiation sensor, this can be sprayed or spin-coated onto another layer, for example a sacrificial layer or another material layer. This will be advantageous
- the radiation sensor of the radiation sensor arrangement according to the invention which forms a first sensor unit
- the radiation sensor of the radiation sensor arrangement according to the invention can be supplemented by a second sensor unit.
- the first and the second sensor unit together form a pair of sensor units, which together with at least one evaluation unit represents a further development of the radiation sensor arrangement according to the invention.
- the second sensor unit is designed as a reference sensor unit, wherein the reference sensor unit is constructed identical to the first sensor unit.
- the sensor unit pair is arranged under a common cap. This makes the first and the second
- the capping is applied in particular by means of a low-temperature bonding process.
- the cap over the reference sensor unit may be coated with a layer impermeable to the radiation to be measured.
- Reference sensor unit thus measures only the unwanted temperature influences, since it is shielded from the radiation to be measured. This is
- the error known by undesirable temperature effects can be compensated, for example by subtraction.
- Radiation sensor arrangement are suitable for use in one
- a gas detector arrangement according to the invention comprises, in addition to a radiation sensor arrangement according to the invention
- the absorption path is in
- Radiation sensor arrangement arranged.
- An advantage of the gas detector arrangement according to the invention is that the introduction of optical filters in the beam path is not necessary, since the radiation sensor arrangement is itself designed for wavelength-selective absorption. Thus, one is
- gas detector assembly of the invention advantageously features low response times in the millisecond range, whereas gas detector assemblies known in the art typically have an order of magnitude longer response times exhibit.
- Another advantage of the gas detector arrangement according to the invention is that it consumes less power than
- the gas detector arrangement according to the invention may comprise an auxiliary sensor for monitoring the radiation source. This can be done
- FIG. 1 shows a cross section of a radiation sensor arrangement according to the invention, which comprises a radiation sensor
- FIG. 2 shows a cross-section of a radiation sensor arrangement according to the invention which comprises a radiation sensor, wherein a reflector is arranged on the substrate below the self-supporting element,
- FIG. 3a shows a top view of a radiation sensor arrangement according to the invention, which comprises a radiation sensor, wherein the self-supporting element comprises a plasmonic absorber,
- FIG. 3b shows a section through the cantilevered element of Fig. 3a
- Reference sensor unit is coated on the outside with a functional layer
- 6 shows a cross-section of a radiation sensor arrangement according to the invention, wherein a sensor unit pair is arranged on a common substrate and under a common cap, a functional layer being arranged on the inside of the cap above a reference sensor unit,
- FIG. 7a shows a cross section of a gas detector arrangement according to the invention
- FIG. 7b shows a cross section of a gas detector arrangement according to the invention with auxiliary sensor
- FIG. 8 shows a flow chart of a method for determining a radiation by means of a radiation sensor arrangement according to the invention
- FIG. 1 shows a cross-section of a device according to the invention
- the radiation sensor arrangement 21 comprises a radiation sensor 2 and an evaluation unit, which in this
- Embodiment is integrated in a substrate 1.
- a holding structure 4 is arranged, which carries a cantilevered element 5.
- the cantilevered element 5 is disposed at a distance from the underlying substrate 1.
- the support structure 4, the cantilevered element 5 and the substrate 1 enclose a cavity.
- the cantilevered element 5 comprises an optical absorber 6, which is designed to absorb electromagnetic radiation.
- the optical absorber 6 can be designed in particular as a lacquer.
- the optical absorber 6 is designed for wavelength-selective absorption. Wavelength selective means that a property of the optical absorber 6 is to absorb only radiation of one or more defined wavelengths or, alternatively, a selected one or more selected wavelength ranges.
- the self-supporting element 5 furthermore comprises a resistance structure 3.
- the resistance structure 3 is formed, in particular, from a metal. This metal should preferably have a low thermal conductivity.
- An example of such a metal from which the resistor structure 3 is made is given by titanium (Ti).
- Resistor structure 3 in a preferred embodiment has a thickness of about 100 nm and a width of about 500 nm.
- the width and the thickness refer to the dimensions of a metal strip, which is arranged to a meander-shaped structure, which then forms the resistance structure 3.
- the width indicates the dimension of the metal strip in x-
- Resistor structure 3 is also along the support structure 4 of the optical
- Substrate 1 are arranged. Over the cantilevered element 5 and the support structure 4, a cap 10 is arranged, which is connected to the substrate 1.
- the cap 10 is particularly adapted to a vacuum
- the electrical contacts of the substrate 1 are exposed and deposited thereon a layer of a metal and structured.
- the thickness of this layer is preferably in the order of 100 nm.
- the resulting metal structure forms the resistance structure 3, the electrical resistance of which depends on the
- Substrate 1 is integrated, the resistance structure 3 is also connected to the evaluation unit.
- On the metal layer is a second layer of the paint
- the paint is structured and cured in a temperature step. This makes it insensitive to standard etching solutions. By etching, the sacrificial layer is removed. Thus, a cavity is formed between the cantilevered element 5 and the substrate 1.
- the cantilevered element 5 is held by the support structure 4 at a distance above the substrate 1.
- a suitable Niedertemperaturbondmaschinen for example SLID bonding, the cantilevered element 5 and the support structure 4 are vacuum-sealed.
- Radiation sensor arrangement 21 is identical to the radiation sensor arrangement 21 in FIG. 1.
- the radiation sensor arrangement 21 in FIG. 2 additionally comprises a reflector 20 which is arranged on a first upper side 22 of the substrate 1.
- the reflector 20 is applied so as to be disposed between the substrate 1 and the cantilevered element 5. Together with the cantilevered element 5, it forms an optical resonator for improving the absorption.
- the radiation to be measured passes through the cantilevered element 5 and is directed by the reflector 20 back towards the cantilevered element 5, which comprises the optical absorber 6.
- the production of the radiation sensor arrangement 21 shown in FIG. 2 is analogous to the production method of that shown in FIG.
- Substrate 1 and cantilevered element 5 is arranged.
- the cantilevered element 5 comprises plasmonic in this exemplary embodiment
- Fig. 3b is a section through the cantilevered element 5 of Fig. 3a is shown.
- the plasmonic absorber is composed of three layers. A first layer is formed by a lower metallization 23. It forms a mirror for the incident radiation 24. On the lower metallization 23. It forms a mirror for the incident radiation 24. On the lower metallization 23. It forms a mirror for the incident radiation 24. On the lower metallization 23. It forms a mirror for the incident radiation 24. On the lower
- Metallization 23 a second layer is deposited, which is the optical
- Absorber 6 forms.
- the resistance structure 3 is arranged.
- the plasmonic absorber elements 7 are formed on the side facing away from the side with the lower metallization 23 side of the optical absorber 6.
- the optical absorber 6 represents a dielectric resonator. The resonances of the plasmonic resonators produced by the
- Absorber elements 7 are coupled to couple the modes of the dielectric resonator. Thereby, the radiation absorption of the cantilevered element 5 is improved.
- An example of a three-layered plasmonic absorber is described in "Achiving an ultra-narrow multiband light absorption meta-surface via coupling with an optical cavity” (Liu et al., Nanotechnology 26 (2015)).
- the plasmonic absorber elements 7 are formed as an arrangement of a respective large disc 7b adjacent to a small disc 7a.
- the dimensions of the absorber elements are adapted to the wavelength range of the incident radiation 24. For infrared radiation, for example, the diameter of the large disk 1, 9 pm is selected, the
- Diameter of the small disc in this case is 1 pm.
- the disks 7a, 7b are each arranged at a distance of 2 pm from each other.
- the thickness of the optical absorber 4 is about 300 nm.
- a further layer of the optical absorber 6 can be applied to the absorber elements 7.
- FIG. 4 shows a sketch of a transmittance curve of an infrared cut lacquer which is suitable for use as an optical absorber 6 of a radiation sensor 2 according to the invention.
- the curve has a minimum at 870 nm. Radiation of this
- lacquers are also suitable as an optical absorber 6 of a radiation sensor 2 according to the invention, which have similar transmittance curves as those outlined in FIG. 4, but whose minimum lies at a different wavelength. By choosing the paint, it is thus possible to adapt the radiation sensor 2 according to the invention to different applications.
- Fig. 5 shows a development of an inventive
- Radiation sensor arrangement 21 In this embodiment, a
- Substrate 1 is arranged.
- the reference sensor unit 8 is identical to the
- the reference sensor unit 8 comprises a cantilevered element 5 and a
- the cantilevered element 5 comprises an optical absorber 6 and a resistance structure 3 as shown in FIG. 1, for example.
- the radiation sensor 2 and the reference sensor unit 8 together form one
- the sensor unit pair is under a common
- Cap 10 is arranged. Thus, the first and the second sensor unit are exposed to the same temperature influences.
- the cap 10 is in particular designed to enclose a vacuum, so that the sensor unit pair 9 in the Vacuum can be included.
- the capping 10 is applied in particular by means of a low-temperature bonding process.
- the cap 10 may be coated over the reference sensor unit 8 with a layer 11 impermeable to the radiation to be measured. This layer 11 is in
- the functional layer 11 is applied from the outside to the cap 10 in this embodiment.
- An alternative arrangement of the functional layer 11 is shown in FIG. There, the functional layer 11 is inside the cap 10 above the
- Reference sensor unit 8 applied so that it is shielded from the radiation to be measured.
- Evaluation unit integrated into the substrate 1.
- the substrate 1 can be formed as a CMOS wafer, which comprises an evaluation unit 100 for detecting an absorbed radiation, whereby undesired temperature influences are compensated. The detection of
- Resistor structure 3 is based on a temperature change.
- Absorber 6 and from undesirable temperature effects such as a fluctuation of the ambient / substrate temperature and a
- Resistor structure 3 transferred. This changes the electrical Resistor 101 of the resistor structure 3.
- the transmission of a selected wavelength can be read through the material layer. Since the transmittance curve of the optical absorber 6 is adjustable by the choice of the material of the optical absorber 6, only radiation of selected wavelengths or selected wavelength ranges is absorbed. The change in the electrical resistance 101 is thus a measure of the wavelength-selectively absorbed radiation.
- the association between electrical resistance 101 and absorbed radiation takes place, for example, by means of a characteristic curve 104 which is stored in the evaluation unit 100.
- the reference sensor unit 8 is not exposed to the radiation to be measured due to the functional layer 1 1. The task of the reference sensor unit 8 is to compensate for undesired temperature influences. These unwanted temperature effects cause a change in the electrical resistance of the resistance structure 3 in the radiation sensor 2, which is not to be distinguished from a change in resistance d due to the wavelength-selectively absorbed radiation to be measured.
- Radiation sensor are exposed to the same undesirable temperature effects, since they are arranged under a common cap 10 and are arranged in this embodiment on a common substrate 1. Since the reference sensor unit 8 of the radiation to be measured
- Evaluation unit 100 detects the change of the electrical resistance 101, 102 of the resistance structure 3 of the radiation sensor 2 and the
- Reference sensor unit 8 This is done for example by means of a current or
- the resistance structure 3 is flowed through by a known current and the voltage which drops across the resistance structure 3 is measured.
- a known voltage is applied to the resistor structure 3 and the current measured, which is the
- Resistance structure 3 can be determined.
- a characteristic 104 is created, which assigns radiation to an electrical resistance value. This characteristic 104 is stored in the evaluation unit 100.
- One possible evaluation provides that the electrical resistance 101 of the Radiation sensor 2 and the second electrical resistance 102 of the
- Reference sensor unit 8 are subtracted 103 from each other.
- the unwanted temperature influences are consequently by means of the difference formation 103
- the radiation sensor arrangement 21 comprises only one radiation sensor 2, as for example in the case of those shown in FIGS. 1 and 2
- the electrical resistance 101 is determined, for example by means of current or voltage measurement and associated with a characteristic 104 of radiation, which then forms the output 105 of the evaluation unit 100 and thus the radiation sensor assembly 21.
- the evaluation unit comprises, as described above, an additive E for the compensation of undesired temperature influences.
- the radiation of the two sensor units 2, 8 is determined in separate
- the difference between the separately determined radiation values of the sensor units 2, 8 is then formed.
- the radiation thus determined then forms the output of the further evaluation unit and the output of the radiation sensor arrangement 21 according to the invention, wherein undesired temperature influences were compensated.
- Fig. 7a shows an embodiment of an inventive
- Gas detector assembly 18 The gas detector assembly 18 includes a
- the absorption path 15 denotes a chamber which is provided with a gas inlet 14 and a gas outlet 13, so that the gas to be examined in the absorption path 15 on and is derivable.
- the gas inlet 14 and the gas outlet 13 are in this
- Embodiment arranged on opposite side surfaces of the absorption path 15.
- Radiation sensor arrangement 21 according to the invention are on each other
- the radiation 16 emitted by the radiation source 12 first passes through the absorption path 15, where it interacts with the introduced gas.
- the radiation 16 reaches the radiation sensor arrangement 21 after the interaction.
- the optical absorber 6 of the radiation sensor arrangement 21 is designed for wavelength-selective absorption.
- the wavelength selection is thus carried out by the radiation sensor arrangement 21.
- a radiation source 12 is arranged which preferably emits in a range from about 1 ⁇ m to about 5 ⁇ m.
- the absorption path 15 allows optical path lengths in the range of a few millimeters to a few centimeters.
- a radiation sensor arrangement 21 according to the invention for detecting the radiation 16 can be arranged, which is adjacent to the
- FIG. 7 b shows an exemplary embodiment of a gas detector arrangement 18 according to the invention, which comprises an auxiliary structure A.
- Gas detector arrangement 18 comprises, as already described above, a radiation source 12, an absorption path 15 and a radiation sensor arrangement 21 according to the invention.
- the exemplary embodiment illustrated in FIG. 7b further comprises the auxiliary structure A for monitoring the radiation source 12.
- the auxiliary structure A comprises an auxiliary sensor 19 which is located outside the
- the Absorption path 15 is arranged so that a signal of the auxiliary sensor 19 is independent of the C0 2 absorption.
- the auxiliary sensor 19 is designed for the detection of radiation. In one embodiment, it may be identical in construction to a radiation sensor arrangement 21 according to the invention.
- the auxiliary sensor 19 is a photodiode.
- the auxiliary sensor 19 is enclosed in another chamber. This further chamber is arranged on the absorption path 15 such that the radiation sensor arrangement 21 and the auxiliary sensor 19 are arranged on opposite sides with respect to the radiation source 12.
- the auxiliary sensor 19 monitors the radiation source 12 and its degradation.
- the absorption at the radiation sensor arrangement 21 is dependent on how much radiation is emitted by the radiation source 12.
- the power absorbed by the radiation sensor arrangement 21 is therefore normalized to the power emitted by the radiation source 12.
- the power emitted by the radiation source 12 is determined by means of the auxiliary sensor 19.
- FIG. 9 shows a flowchart for determining a gas concentration below
- a gas detector arrangement 18 Use of a gas detector arrangement 18 according to the invention.
- the introduction 201 of a gas mixture to be examined into the absorption section 15 takes place through the gas inlet 14.
- the interaction 202 of the radiation 16 emitted by the radiation source 12 takes place with the gas mixture.
- the gas detector arrangement 18 is designed, for example, to detect C0 2 , then the optical absorber 6 is the one according to the invention
- Radiation sensor array 21 designed to absorb radiation of wavelength 3.5 ⁇ . Is contained in the introduced gas mixture C0 2 , the detected radiation S indicates a lower intensity than when in the
- the detected radiation S is a
- the absorbed radiation is therefore a measure of the CO 2 concentration in the gas mixture to be investigated.
- the assignment between absorbed radiation and C0 2 - concentration for example, via a characteristic curve 204, which is stored in the evaluation unit 100.
- This characteristic curve 204 is determined in a calibration measurement.
- the output 205 of the gas detector assembly 18 thus forms the C0 2 concentration in the gas mixture to be examined.
- the gas to be examined is discharged via the gas outlet 13 from the absorption path 15.
- the determination of a gas concentration of another gas using a gas detector arrangement 18 according to the invention takes place analogously. For this purpose, the gas detector assembly 18 to the characteristic
- Radiation sensor array 21 adapted to the characteristic wavelength of the absorption spectrum of the gas whose concentration is to be examined.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015220310.7A DE102015220310A1 (de) | 2015-10-19 | 2015-10-19 | Strahlungssensoranordnung und Gasdetektoranordnung |
PCT/EP2016/071411 WO2017067711A1 (de) | 2015-10-19 | 2016-09-12 | Strahlungssensoranordnung und gasdetektoranordnung |
Publications (1)
Publication Number | Publication Date |
---|---|
EP3365644A1 true EP3365644A1 (de) | 2018-08-29 |
Family
ID=56896555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16763517.6A Withdrawn EP3365644A1 (de) | 2015-10-19 | 2016-09-12 | Strahlungssensoranordnung und gasdetektoranordnung |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3365644A1 (de) |
CN (1) | CN108139273A (de) |
DE (1) | DE102015220310A1 (de) |
WO (1) | WO2017067711A1 (de) |
Families Citing this family (1)
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CN111060466B (zh) * | 2019-12-30 | 2023-01-13 | 暨南大学 | 一种便携式光学气体传感器 |
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US7262412B2 (en) * | 2004-12-10 | 2007-08-28 | L-3 Communications Corporation | Optically blocked reference pixels for focal plane arrays |
JP4228232B2 (ja) * | 2005-02-18 | 2009-02-25 | 日本電気株式会社 | 熱型赤外線検出素子 |
WO2008018082A2 (en) * | 2006-08-10 | 2008-02-14 | Technion - Research & Development Foundation Ltd | Plasmon resonance bolometer for radiation detection |
WO2008028512A1 (de) | 2006-09-08 | 2008-03-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Bolometer und verfahren zum herstellen eines bolometers |
FR2966595B1 (fr) * | 2010-10-26 | 2013-01-25 | Commissariat Energie Atomique | Dispositif de detection d'un rayonnement electromagnetique. |
CN102692276B (zh) * | 2011-03-21 | 2014-05-21 | 浙江大立科技股份有限公司 | 一种非制冷红外探测器 |
FR2977937B1 (fr) * | 2011-07-15 | 2013-08-16 | Centre Nat Rech Scient | Detecteur bolometrique a performances ameliorees |
KR101910573B1 (ko) * | 2012-12-20 | 2018-10-22 | 삼성전자주식회사 | 광대역 광 흡수체를 포함하는 적외선 검출기 |
WO2015070223A1 (en) * | 2013-11-11 | 2015-05-14 | General Electric Company | Optical gas sensor |
US9804084B2 (en) * | 2013-11-11 | 2017-10-31 | Amphenol Thermometrics, Inc. | Optical gas sensor |
DE102014204676A1 (de) * | 2014-03-13 | 2015-09-17 | Robert Bosch Gmbh | Wärmesensor und Verfahren zur Herstellung eines Wärmesensors |
-
2015
- 2015-10-19 DE DE102015220310.7A patent/DE102015220310A1/de not_active Withdrawn
-
2016
- 2016-09-12 CN CN201680060924.8A patent/CN108139273A/zh active Pending
- 2016-09-12 EP EP16763517.6A patent/EP3365644A1/de not_active Withdrawn
- 2016-09-12 WO PCT/EP2016/071411 patent/WO2017067711A1/de unknown
Also Published As
Publication number | Publication date |
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DE102015220310A1 (de) | 2017-04-20 |
WO2017067711A1 (de) | 2017-04-27 |
CN108139273A (zh) | 2018-06-08 |
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