EP3363044A4 - Substrate carrier system - Google Patents

Substrate carrier system Download PDF

Info

Publication number
EP3363044A4
EP3363044A4 EP16856168.6A EP16856168A EP3363044A4 EP 3363044 A4 EP3363044 A4 EP 3363044A4 EP 16856168 A EP16856168 A EP 16856168A EP 3363044 A4 EP3363044 A4 EP 3363044A4
Authority
EP
European Patent Office
Prior art keywords
carrier system
substrate carrier
substrate
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP16856168.6A
Other languages
German (de)
French (fr)
Other versions
EP3363044B1 (en
EP3363044A1 (en
Inventor
Jeffrey Tobin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP3363044A1 publication Critical patent/EP3363044A1/en
Publication of EP3363044A4 publication Critical patent/EP3363044A4/en
Application granted granted Critical
Publication of EP3363044B1 publication Critical patent/EP3363044B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
EP16856168.6A 2015-10-15 2016-10-13 Substrate carrier system Active EP3363044B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562242174P 2015-10-15 2015-10-15
PCT/US2016/056798 WO2017066418A1 (en) 2015-10-15 2016-10-13 Substrate carrier system

Publications (3)

Publication Number Publication Date
EP3363044A1 EP3363044A1 (en) 2018-08-22
EP3363044A4 true EP3363044A4 (en) 2019-06-12
EP3363044B1 EP3363044B1 (en) 2021-12-15

Family

ID=58518570

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16856168.6A Active EP3363044B1 (en) 2015-10-15 2016-10-13 Substrate carrier system

Country Status (6)

Country Link
US (1) US9929029B2 (en)
EP (1) EP3363044B1 (en)
JP (1) JP6942121B2 (en)
KR (1) KR102615853B1 (en)
TW (1) TWI691006B (en)
WO (1) WO2017066418A1 (en)

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US9929029B2 (en) * 2015-10-15 2018-03-27 Applied Materials, Inc. Substrate carrier system
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US10872804B2 (en) * 2017-11-03 2020-12-22 Asm Ip Holding B.V. Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination
US10872803B2 (en) 2017-11-03 2020-12-22 Asm Ip Holding B.V. Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination
US10755955B2 (en) * 2018-02-12 2020-08-25 Applied Materials, Inc. Substrate transfer mechanism to reduce back-side substrate contact
CN112005356A (en) * 2018-05-03 2020-11-27 应用材料公司 Substrate tilt control in high speed rotary sorter
US11499666B2 (en) 2018-05-25 2022-11-15 Applied Materials, Inc. Precision dynamic leveling mechanism with long motion capability
JP7147551B2 (en) 2018-12-27 2022-10-05 株式会社Sumco Vapor deposition apparatus and carrier used therefor
JP7163764B2 (en) * 2018-12-27 2022-11-01 株式会社Sumco Vapor deposition equipment
JP7003905B2 (en) 2018-12-27 2022-01-21 株式会社Sumco Vapor deposition equipment
JP7245071B2 (en) * 2019-02-21 2023-03-23 株式会社ジェイテクトサーモシステム Substrate support device
JP7188250B2 (en) * 2019-04-11 2022-12-13 株式会社Sumco Vapor deposition apparatus and carrier used therefor
JP7188256B2 (en) 2019-04-18 2022-12-13 株式会社Sumco Vapor deposition method and vapor deposition apparatus
JP7099398B2 (en) * 2019-04-18 2022-07-12 株式会社Sumco Vapor phase growth method and vapor phase growth device
KR20220020961A (en) * 2019-07-17 2022-02-21 어플라이드 머티어리얼스, 인코포레이티드 Methods and apparatus for post-exposure processing
JP6999614B2 (en) * 2019-07-26 2022-01-18 株式会社バルカー Support member
JP7264038B2 (en) * 2019-12-19 2023-04-25 株式会社Sumco Vapor deposition apparatus and vapor deposition treatment method
JP7192756B2 (en) * 2019-12-19 2022-12-20 株式会社Sumco Vapor deposition apparatus and vapor deposition method
JP7205458B2 (en) 2019-12-25 2023-01-17 株式会社Sumco Vapor deposition equipment

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US20110318142A1 (en) * 2008-12-11 2011-12-29 Christopher Gage Minimum contact area wafer clamping with gas flow for rapid wafer cooling

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Also Published As

Publication number Publication date
WO2017066418A1 (en) 2017-04-20
KR20180056790A (en) 2018-05-29
TW201725645A (en) 2017-07-16
EP3363044B1 (en) 2021-12-15
TWI691006B (en) 2020-04-11
EP3363044A1 (en) 2018-08-22
KR102615853B1 (en) 2023-12-21
JP2018536986A (en) 2018-12-13
JP6942121B2 (en) 2021-09-29
US9929029B2 (en) 2018-03-27
US20170110352A1 (en) 2017-04-20

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