EP3344717A1 - Composition adhesive photopolymerisable - Google Patents
Composition adhesive photopolymerisableInfo
- Publication number
- EP3344717A1 EP3344717A1 EP16766997.7A EP16766997A EP3344717A1 EP 3344717 A1 EP3344717 A1 EP 3344717A1 EP 16766997 A EP16766997 A EP 16766997A EP 3344717 A1 EP3344717 A1 EP 3344717A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- acrylic
- acrylate
- meth
- methacrylate
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 80
- 239000000853 adhesive Substances 0.000 title claims abstract description 58
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 58
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 106
- 229920001400 block copolymer Polymers 0.000 claims abstract description 34
- 239000011159 matrix material Substances 0.000 claims abstract description 31
- 239000000178 monomer Substances 0.000 claims description 55
- 229920000642 polymer Polymers 0.000 claims description 28
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 19
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 19
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 19
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 16
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 15
- 229920001577 copolymer Polymers 0.000 claims description 14
- -1 cyclosiloxanes Chemical class 0.000 claims description 14
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 14
- 229920005862 polyol Polymers 0.000 claims description 11
- 150000003077 polyols Chemical class 0.000 claims description 11
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 10
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims description 10
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 8
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 8
- 239000000654 additive Substances 0.000 claims description 7
- 229920001223 polyethylene glycol Polymers 0.000 claims description 7
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 238000005886 esterification reaction Methods 0.000 claims description 6
- 150000002148 esters Chemical class 0.000 claims description 6
- 239000004814 polyurethane Substances 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 6
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical class C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 claims description 5
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical class C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000002202 Polyethylene glycol Substances 0.000 claims description 5
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 5
- 230000009477 glass transition Effects 0.000 claims description 5
- 229920001519 homopolymer Polymers 0.000 claims description 5
- 150000003440 styrenes Chemical class 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 4
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 4
- 125000004122 cyclic group Chemical group 0.000 claims description 4
- 230000032050 esterification Effects 0.000 claims description 4
- 150000002734 metacrylic acid derivatives Chemical class 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 229920000570 polyether Polymers 0.000 claims description 4
- 229920001228 polyisocyanate Polymers 0.000 claims description 4
- 239000005056 polyisocyanate Substances 0.000 claims description 4
- 229920001451 polypropylene glycol Polymers 0.000 claims description 4
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 claims description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 150000001408 amides Chemical class 0.000 claims description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 3
- 239000012965 benzophenone Substances 0.000 claims description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 3
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 claims description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 3
- FAQJJMHZNSSFSM-UHFFFAOYSA-N phenylglyoxylic acid Chemical compound OC(=O)C(=O)C1=CC=CC=C1 FAQJJMHZNSSFSM-UHFFFAOYSA-N 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- MDDUHVRJJAFRAU-YZNNVMRBSA-N tert-butyl-[(1r,3s,5z)-3-[tert-butyl(dimethyl)silyl]oxy-5-(2-diphenylphosphorylethylidene)-4-methylidenecyclohexyl]oxy-dimethylsilane Chemical compound C1[C@@H](O[Si](C)(C)C(C)(C)C)C[C@H](O[Si](C)(C)C(C)(C)C)C(=C)\C1=C/CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MDDUHVRJJAFRAU-YZNNVMRBSA-N 0.000 claims description 3
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 2
- YTLYLLTVENPWFT-UPHRSURJSA-N (Z)-3-aminoacrylic acid Chemical compound N\C=C/C(O)=O YTLYLLTVENPWFT-UPHRSURJSA-N 0.000 claims description 2
- UGIJCMNGQCUTPI-UHFFFAOYSA-N 2-aminoethyl prop-2-enoate Chemical compound NCCOC(=O)C=C UGIJCMNGQCUTPI-UHFFFAOYSA-N 0.000 claims description 2
- FAKVHJPTDNJHKJ-UHFFFAOYSA-N 2-aminoprop-2-enoic acid prop-2-enoic acid Chemical class C(C=C)(=O)O.NC(C(=O)O)=C FAKVHJPTDNJHKJ-UHFFFAOYSA-N 0.000 claims description 2
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 claims description 2
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 claims description 2
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 claims description 2
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 claims description 2
- 238000006845 Michael addition reaction Methods 0.000 claims description 2
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- FTWHFXMUJQRNBK-UHFFFAOYSA-N alpha-Methylen-gamma-aminobuttersaeure Natural products NCCC(=C)C(O)=O FTWHFXMUJQRNBK-UHFFFAOYSA-N 0.000 claims description 2
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 claims description 2
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 claims description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims description 2
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 claims description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 2
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 claims description 2
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 claims description 2
- 239000012948 isocyanate Substances 0.000 claims description 2
- 150000002513 isocyanates Chemical class 0.000 claims description 2
- 239000003921 oil Substances 0.000 claims description 2
- 125000006353 oxyethylene group Chemical group 0.000 claims description 2
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- 229920005906 polyester polyol Polymers 0.000 claims description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 2
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 claims description 2
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 claims description 2
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 claims description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 2
- 150000003335 secondary amines Chemical class 0.000 claims description 2
- 150000003573 thiols Chemical class 0.000 claims description 2
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 claims 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 claims 1
- GDCRSXZBSIRSFR-UHFFFAOYSA-N ethyl prop-2-enoate;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CCOC(=O)C=C GDCRSXZBSIRSFR-UHFFFAOYSA-N 0.000 claims 1
- 229940119545 isobornyl methacrylate Drugs 0.000 claims 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 description 13
- 230000032683 aging Effects 0.000 description 9
- 238000009864 tensile test Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000004132 cross linking Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 238000010008 shearing Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 229920006243 acrylic copolymer Polymers 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 230000005670 electromagnetic radiation Effects 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 230000000977 initiatory effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000006254 rheological additive Substances 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000012205 single-component adhesive Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 239000004634 thermosetting polymer Substances 0.000 description 2
- 230000001960 triggered effect Effects 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 102100026735 Coagulation factor VIII Human genes 0.000 description 1
- 208000035126 Facies Diseases 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- 101000911390 Homo sapiens Coagulation factor VIII Proteins 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical group C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 1
- DNBZRBSJOJZJKV-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;2-methylprop-2-enoic acid Chemical group CC(=C)C(O)=O.COC(=O)C(C)=C.CCCCOC(=O)C=C DNBZRBSJOJZJKV-UHFFFAOYSA-N 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 229920000359 diblock copolymer Polymers 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 1
- 239000002304 perfume Substances 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000001698 pyrogenic effect Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/07—Aldehydes; Ketones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/092—Polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Definitions
- the invention relates to an adhesive composition curable by electromagnetic radiation of the gamma, IR, visible or UV type.
- the invention relates more particularly to a photopolymerizable adhesive composition based on a (meth) acrylic matrix, capable of being polymerized under light radiation and more particularly under UV radiation.
- a photopolymerizable adhesive composition based on a (meth) acrylic matrix, capable of being polymerized under light radiation and more particularly under UV radiation.
- Such a composition has many applications in various fields such as, for example, the cosmetics industry, in particular for producing perfume bottles, or else electronics for manufacturing or assembling electronic components.
- Adhesive compositions or more simply “adhesives”, based on acrylic compounds are called “two-component” when the mixture of the base resin and the hardener is made at the time of bonding, to initiate the crosslinking of the polymer , or “single-component” when in the form of a single ready-to-use mixture.
- Two-component adhesives also called "structural adhesives" comprise a first resin-type component generally comprising a monomer matrix associated with one or more polymers, and a second initiator-type component.
- the initiator is intended to be contacted with the resin in order to initiate the polymerization of the monomers it contains, allowing the adhesive to cure.
- the assembly forms a crosslinked polymeric network and the adhesive therefore fulfills its function of glue.
- these two-component systems have the disadvantage of requiring, prior to their use, an independent storage of the two components, thus avoiding any contact between them and the polymerization of the monomers of the resin.
- two-component adhesives is relatively restrictive because it requires two impregnations surfaces or elements to be bonded: a first impregnation with the resin, followed by a second impregnation by the initiator. This requires time and generates significant costs.
- the single-component adhesives comprise a single mixture comprising both the resin and the initiator.
- the polymerization of the monomers of the resin is then carried out in several different ways that do not require the addition of a subsequent chemical compound.
- the polymerization can be initiated, for example, thermally via an increase in temperature, or by exposure of the adhesive to light, and in particular to ultraviolet (UV) radiation.
- UV ultraviolet
- the single-component adhesives whose polymerization is initiated by exposure of the adhesive to light are called “photopolymerizable” adhesives.
- the constituent monomers of the matrix are generally intended to form thermosetting polymers, by crosslinking the polymer chains. They are therefore also called “photo-crosslinkable” adhesives.
- Such adhesives allow a significant time saving compared to two-component adhesives, and allow a rapid and complete polymerization by simple exposure to light, making them very simple to implement.
- the photopolymerizable adhesives are generally weak or even brittle. They generally have physico-chemical properties, and in particular mechanical properties, lower than those of two-component adhesives, and may therefore be unsuitable for certain industrial applications requiring high physicochemical properties.
- the performance of these adhesives is related more particularly to their Young's modulus and their elongation.
- the Young's modulus also referred to as tensile modulus
- MPa megapascals
- the photopolymerizable adhesive must also be able to withstand aging both thermal and climatic, while retaining good tensile shear properties, have good dimensional stability and in particular a very low sensitivity to water absorption, and have transparency properties in order to achieve completely invisible glue joints.
- the object of the invention is therefore to overcome the drawbacks of the prior art by providing a photopolymerizable adhesive composition, based on a (meth) acrylic matrix, having improved physico-chemical properties, and in particular properties of transparency, high elongation at break, high Young's modulus, high shear tensile performance irrespective of thermal and climatic conditions, and very low sensitivity to moisture, resulting in low absorption of water by the photopolymerizable adhesive composition.
- the subject of the invention is a photopolymerizable adhesive composition
- a (meth) acrylic matrix mainly characterized in that it further comprises a (meth) acrylic block copolymer, or a mixture of copolymers with (meth) acrylic blocks, and one or more photoinitiator (s).
- the (meth) acrylic matrix comprises one or more acrylic or methacrylic monomers and one or more acrylic or methacrylic oligomers;
- the (meth) acrylic block copolymer (s) is (are) chosen from block copolymers having one of the following structures: BM, MBM, in which: • Each block is connected to the other by means of a covalent bond or an intermediate molecule connected to one of the blocks by a covalent bond and to the other block by another covalent bond,
- M is a polymer block of polymethyl methacrylate (PMMA), namely a homopolymer or a copolymer comprising at least 50% by weight of methyl methacrylate,
- PMMA polymethyl methacrylate
- Tg glass transition temperature
- the (meth) acrylic copolymer (s) comprises only (meth) acrylic blocks, that is to say that all its blocks are polymers or copolymers mainly comprising (meth) acrylic monomers ;
- the (meth) acrylic block copolymer (s), and the monomers and / or oligomers constituting the (meth) acrylic matrix can be functionalized.
- the (meth) acrylic matrix is a thermosetting matrix, and the (meth) acrylic composition is photo-crosslinkable;
- composition advantageously comprises (limits included): from 0.1 to 40%, preferably from 1% to 20%, advantageously from 5 to
- composition From 0.5 to 10% by weight, preferably from 0.5% to 4% by weight of one or more photoinitiators.
- the composition further comprises from 0 to 10% by weight, preferably from 5% to 10% by weight of rheological, physical and / or chemical additives;
- The, or the photoinitiator (s) is (are) chosen from at least one of the following compounds: benzophenone, phosphine oxide, ⁇ , ⁇ -dihydroxyketone and aminoketone s iodonium salt, and phenylglyoxylate.
- photopolymerizable composition or "photocurable composition” means a composition for which the initiation of the polymerization is triggered by exposure to electromagnetic radiation.
- initiation of the polymerization of the composition according to the invention is triggered by exposure to ultraviolet (UV) radiation.
- UV radiation ultraviolet
- monomer as used refers to a molecule that can undergo polymerization.
- polymerization refers to the process of converting a monomer or mixture of monomers into a polymer.
- polymer is meant either a copolymer or a homopolymer.
- copolymer a polymer comprising several different monomer units and “homopolymer”, a polymer grouping identical monomeric units.
- block copolymer is meant a polymer comprising one or more uninterrupted sequences of each of the different polymeric species, the polymer blocks being chemically different from one another and being linked together by a covalent bond. These polymer blocks are still referred to as polymer blocks.
- (meth) acrylic refers to any type of compounds, polymers, monomers or oligomers, acrylic and methacrylic. However, it would not be outside the scope of the invention if the (meth) acrylic matrix and / or the copolymer to (meth) acrylic blocks comprise up to 10% by weight, preferably less than 5% by weight of other non-acrylic monomers, selected from the group: butadiene, isoprene, styrene, substituted styrene such as ⁇ -methylstyrene or tert-butylstyrene, cyclosiloxanes, vinylnaphthalenes and vinylpyridines.
- thermoplastic polymer refers to a polymer having a glass transition temperature Tg greater than room temperature.
- thermosetting polymer refers to a plastic material which is irreversibly converted by polymerization into an insoluble polymer network.
- an "oligomer” is a polymer compound of small size, comprising between 2 and 30 monomers, that is to say whose degree of polymerization is between 2 and 30.
- the invention relates to a photopolymerizable adhesive composition based on a (meth) acrylic matrix, for the particular embodiment of bonding various materials, having a fast hardening, and improved durability and resistance to the conditions. high temperatures and humidity.
- the adhesive composition makes it possible to maintain the entirety of the bonding and bonded elements, and enables the bonding to withstand mechanical and thermal stresses.
- the gluing elements may for example comprise any type of part made of selected materials, for example, among glass, polystyrene, ABS, polyester, polycarbonate, aluminum, steel, stainless steel galvanized steel, or polymethylmethacrylate (PMMA) etc.
- the photopolymerizable adhesive composition according to the invention advantageously comprises a (meth) acrylic block copolymer, or a mixture of (meth) acrylic block copolymers, solubilized in a (meth) acrylic matrix comprising itself one or more monomers. (meth) acrylic and one or more (meth) acrylic oligomers.
- the composition further comprises one or more photoinitiators intended to allow initiation of the polymerization of the (meth) acrylic monomers and (meth) acrylic oligomers of the (meth) acrylic matrix by exposure to electromagnetic radiation, especially ultraviolet (UV) radiation.
- (meth) acrylic copolymer to refer to a copolymer (meth) acrylic or a mixture of (meth) acrylic copolymers.
- the block copolymer is said to be "(meth) acrylic" in that at least one of its constituent blocks is a polymer or copolymer based on (meth) acrylic monomers.
- the (meth) acrylic block copolymer is preferably chosen from block copolymers comprising one or more M blocks and one or more B blocks.
- Block copolymers having one of the following structures: BM, MBM, in which each block is connected to the other by means of a covalent bond or of an intermediate molecule connected to the one of the blocks by a covalent bond and to the other block by another covalent bond, and wherein M is a polymer block of polymethyl methacrylate (PMMA) homopolymer or a copolymer comprising at least 50% by weight of methyl methacrylate and in which B is an elastomeric polymer block incompatible with the (meth) acrylic matrix and with the block M, and whose glass transition temperature (Tg) is below room temperature, advantageously below 0 ° C. and preferably below -20 ° C.
- PMMA polymethyl methacrylate
- B is an elastomeric polymer block incompatible with the (meth) acrylic matrix and with the block M, and whose glass transition temperature (Tg) is below room temperature, advantageously below 0 ° C. and preferably below -20 ° C.
- the block M is composed of methyl methacrylate monomers or contains at least 50% by weight of methyl methacrylate, preferably at least 75% by weight of methyl methacrylate.
- the other monomers constituting the M block may be acrylic monomers or not.
- non-acrylic monomers that may constitute the M block
- the monomers that can constitute the M block are chosen from methyl methacrylate, ethyl methacrylate and methyl acrylate.
- ethyl acrylate methacrylic acid, acrylic acid, propyl methacrylate, propyl acrylate, n-butyl acrylate, isobutyl acrylate, n-butyl methacrylate, isobutyl methacrylate, pentyl methacrylate, pentyl acrylate, hexyl methacrylate, hexyl acrylate, cyclohexyl acrylate, cyclohexyl methacrylate, isobornyl acrylate, methacrylate isobornyl, amides derived from acrylic acid or methacrylic acid such as ⁇ , ⁇ -dimethylacrylamide (DMA), 2-methoxyethylacrylate or methacrylate, 2-aminoethylacrylate or methacrylate, (meth) acrylate polyethylene glycol (PEG), wherein the PEG group has a molar mass ranging from 400 to 10,000 g / mol,
- the monomer used to synthesize the elastomeric B block may be an alkyl (meth) acrylate, the following Tg is obtained in parentheses according to the acrylate name: ethyl acrylate (-24 ° C.) , butyl acrylate (-54 ° C), 2-ethylhexyl acrylate (-85 ° C), hydroxyethyl acrylate (-15 ° C) and 2-ethylhexyl methacrylate (-10 °) VS).
- Butyl acrylate is advantageously used.
- the block B further comprises up to 5% by weight of acrylic or non-acrylic monomers, such as acrylic acid, methacrylic acid, styrene, butadiene, substituted styrene, isoprene, cyclosiloxane, vinylnaphthalene or vinylpyridine.
- acrylic or non-acrylic monomers such as acrylic acid, methacrylic acid, styrene, butadiene, substituted styrene, isoprene, cyclosiloxane, vinylnaphthalene or vinylpyridine.
- the diblock B-M has a number-average molar mass which may be between 10,000 g / mol and 500,000 g / mol, preferably between 20000 and 200000 g / mol.
- the diblock B-M advantageously consists of a mass fraction in M of between 5 and 95% and preferably between 15 and 85%.
- M consists of the same monomers and possibly comonomers as the M block of the B-M diblock.
- the two blocks M of the triblock M-B-M may be identical or different. They can be different in their molar mass but consist of the same monomers.
- Block B consists of the same monomers and possibly comonomers as block B of diblock B-M.
- the MBM triblock has a number-average molar mass which may be between 10,000 g / mol and 500,000 g / mol, preferably between 20000 and 200000 g / mol.
- the MBM triblock has the following compositions in M and B expressed in mass fraction, the total being 100%: M: between 10 and 80% and preferably between 15 and 70%.
- - B between 90 and 20% and preferably between 85 and 30%.
- the block copolymers used in the materials of the present invention may be manufactured by controlled radical polymerization (PRC) for example according to the methods described in WO 96/24620 and WO 00/71501.
- PRC controlled radical polymerization
- the blocks M and B is functionalized by means of one or more functions selected from acid, amine, amide, epoxy, thiol, quaternary ammonium groups, chlorinated groups and fluorinated groups.
- the (meth) acrylic block copolymer comprises only (meth) acrylic blocks, that is to say that all its blocks are polymers or copolymers based on (meth) acrylic monomers.
- the blocks B and M of the diblock copolymer B-M or triblock M-B-M are polymers based on (meth) acrylic monomers.
- the block copolymer does not comprise monomers or styrenic functional groups.
- the photo-polymerizable adhesive composition according to the invention comprises between 0.1 and 40% by weight of (meth) acrylic block copolymer solubilized in the (meth) acrylic matrix. Even more preferably, it comprises between 1 and 20%, and advantageously between 5 and 15% by weight of block copolymer.
- the (meth) acrylic monomers and oligomers are preferably chosen from alkyl acrylates and / or alkyl methacrylates.
- the constituent monomers of the matrix may be linear and / or branched aliphatic acrylic and / or methacrylic monomers, and / or cyclic methacrylate monomers, and / or aromatic methacrylate monomers.
- said (meth) acrylic monomer is chosen from acrylic acid, methacrylic acid, alkyl acrylic monomers, alkyl methacrylic monomers and mixtures thereof, the alkyl group containing from 1 to 22 carbons, linear, branched or cyclic; the alkyl group preferably containing 1 to 12 carbons, linear, branched or cyclic.
- the (meth) acrylic monomers are chosen from the following groups:
- Said alcohol or polyol may be alkoxylated (ethoxy or propoxy).
- Said alcohol or polyol may be linear or branched, aliphatic or cycloaliphatic;
- urethane acrylates derived from the reaction of a hydroxylated acrylate or methacrylate (such as hydroxy alkyl acrylate or methacrylate with C2 to C4 alkyl, in particular hydroxy ethyl acrylate or methacrylate, HEA or HEMA) on an isocyanate or polyisocyanate, preferably aliphatic or cycloaliphatic;
- a hydroxylated acrylate or methacrylate such as hydroxy alkyl acrylate or methacrylate with C2 to C4 alkyl, in particular hydroxy ethyl acrylate or methacrylate, HEA or HEMA
- mono or multifunctional acrylate aminoacrylates derived from the Michael addition of a secondary amine to a multifunctional acrylate and partial saturation by this addition of the acrylate functions (with at least one or more residual acrylate functions per aminoacrylate molecule).
- the (meth) acrylic oligomers are chosen from the following groups:
- Polyoxyethylene or polyoxypropylene is also called polyethylene glycol or polypropylene glycol;
- polyesters derived from the esterification with acrylic or methacrylic acid of a polyester polyol or monool.
- Said polyesters are polycondensation products between a polyacid (diacid) and a polyol (diol) and may be of variable structure depending on the structures of these polyacidic components and / or polyols;
- acrylate or methacrylate polyurethanes which may result from the esterification reaction of a polyurethane polyol or monool with acrylic acid or methacrylic acid or the recation between a prepolymer (oligomer) polyurethane polyisocyanate and a hydroxyalkyl acrylate or methacrylate;
- epoxy acrylate oligomers resulting from the acrylation or methacrylation of a mono or polyepoxidized oligomer for example epoxidized oligodienes such as epoxidized polybutadiene or epoxidized polyunsaturated oils;
- Acrylated or methacrylated acrylic oligomers such as copolymers of glycidyl methacrylate (MAGLY) with another acrylic or methacrylic comonomer, by reaction with acrylic or methacrylic acid.
- MAGLY glycidyl methacrylate
- the adhesive composition comprises from 5% to 80% by weight, and more preferably from 30% to 70% by weight of (meth) acrylic monomers.
- the adhesive composition comprises from 5% to 80% by weight, and more preferably from 10% to 30% by weight of (meth) acrylic oligomers.
- the matrix is entirely (meth) acrylic, so that the monomers and oligomers that it comprises are all (meth) acrylic.
- the photoinitiator (s) are advantageously chosen from at least one of the following compounds: benzophenone, phosphine oxide, ⁇ , ⁇ -dihydroxyketone, amino ketone, iodonium salt, and phenylglyoxylate .
- the adhesive composition comprises from 0.5% to 10% by weight, and more preferably between 0.5% and 4% by weight of photoinitiator.
- the adhesive composition according to the invention may further comprise other components such as, for example, physical and / or chemical rheological additives, and adhesion additives.
- rheological additives there may be mentioned for example: pyrogenic silicas, or modified ureas.
- the adhesive composition comprises from 0% to 10% by weight, and more preferably from 5% to 10% by weight of the rheological additive.
- the adhesive composition comprises from 1% to 10% by weight, and more preferably from 2% to 7% by weight of adhesion additive.
- F1 a photo-crosslinkable adhesive composition based on a (meth) acrylic matrix in which a non-acrylic block copolymer is solubilized and comprising a styrene-butadiene-styrene unit (S-B-S).
- F 2 a photo-crosslinkable adhesive composition based on a (meth) acrylic matrix comprising an oligomer with a urethane-acrylate unit, and comprising no block copolymer.
- F3 (comparative example): a photo-crosslinkable adhesive composition comprising a matrix of (meth) acrylic monomers and oligomers, and not comprising a (meth) acrylic block copolymer.
- F4 a photo-crosslinkable adhesive composition according to the invention, based on a (meth) acrylic matrix, and in which a (meth) acrylic block copolymer having a methyl methacrylate-butyl acrylate-methacrylate sequence is solubilized; of methyl (MMA-ABU-MMA).
- MMA-ABU-MMA methyl methacrylate-butyl acrylate-methacrylate sequence
- the tensile modulus also called Young's modulus, was measured for each adhesive composition after crosslinking. For that,
- the Young's modulus can be directly deduced from the traction curve. It is proportional to the slope of the line in the elastic zone.
- the adhesive compositions were then used to assemble a piece of glass and a piece of aluminum type 6060 (the term 6060 refers to the type of aluminum alloy) according to standard NF 1465. For this,
- the cover will be 312.5mm 2 and the thickness guaranteed by a Teflon tape calibrated at 250 ⁇ .
- L xlx (mm) 100 x 25 x 2 •
- the cover will be 312,5mm 2 and the thickness guaranteed by a Teflon tape calibrated at 250 ⁇
- the shear tensile tests are carried out in accordance with standard NF 1465, in the same way as for the tests at 23 ° C.
- the results of the different measurements made on the various adhesive compositions are summarized in Table I below.
- the unit of the test Shear tensile is the Mega Pascal (MPa).
- the terms "RA” (adhesive failure) and "RS" (substrate failure) correspond to the failure facies observed during shear tensile tests.
- the photo-crosslinked adhesive composition F4 according to the invention is transparent and has, compared with the compositions F1 and F2, an elongation at break and a much higher Young's modulus.
- the composition F4 also has much higher post-bake TC post-bake tensile and post-aging values.
- the composition F4 according to the invention has a higher shear tensile value TC after baking, and a lower percentage of water absorption.
- the adhesive composition F4 according to the invention has an excellent compromise between the elongation at break and the stiffness (Young's modulus) whose respective values are both high, giving it very good properties. mechanical.
- the adhesive composition F4 according to the invention has excellent resistance to thermal and climatic aging, and low sensitivity to water.
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Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1558206A FR3040707B1 (fr) | 2015-09-04 | 2015-09-04 | Composition adhesive photopolymerisable |
| PCT/FR2016/052124 WO2017037366A1 (fr) | 2015-09-04 | 2016-08-25 | Composition adhesive photopolymerisable |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP3344717A1 true EP3344717A1 (fr) | 2018-07-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP16766997.7A Withdrawn EP3344717A1 (fr) | 2015-09-04 | 2016-08-25 | Composition adhesive photopolymerisable |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US20180327641A1 (fr) |
| EP (1) | EP3344717A1 (fr) |
| JP (1) | JP2018529807A (fr) |
| FR (1) | FR3040707B1 (fr) |
| WO (1) | WO2017037366A1 (fr) |
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| JP2019505617A (ja) * | 2015-12-15 | 2019-02-28 | スリーエム イノベイティブ プロパティズ カンパニー | 硬化性組成物、感圧接着剤、接着テープ、接合製品 |
| CN109810664B (zh) * | 2017-11-20 | 2021-11-12 | 比亚迪股份有限公司 | 紫外光固化组合物和应用以及转印精细图案形成体及其制造方法 |
| CN111534269B (zh) * | 2020-05-07 | 2022-04-12 | 苏州金枪新材料股份有限公司 | 一种用于液晶屏幕粘接的双组份柔韧性丙烯酸酯结构胶及其制备方法 |
| EP4012000A1 (fr) * | 2020-12-11 | 2022-06-15 | Bostik SA | Composition adhésive photodurcissable |
| CN112940169B (zh) * | 2021-03-05 | 2023-04-07 | 金玛瑙香水(明光)有限公司 | 一种香水瓶用有机玻璃材料及其制备方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4022001B2 (ja) * | 1998-09-03 | 2007-12-12 | 関西ペイント株式会社 | 電子線硬化型接着剤及びこれを用いたポリエステルフィルム貼合せ金属板 |
| JP3947754B1 (ja) * | 2006-01-20 | 2007-07-25 | 株式会社セイコーアドバンス | 紫外線硬化型印刷インキ |
| JP5275635B2 (ja) * | 2008-01-22 | 2013-08-28 | 関西ペイント株式会社 | 金属缶外面用接着剤及びポリエステルフィルム貼り合せ金属板 |
| JP2011026551A (ja) * | 2009-05-21 | 2011-02-10 | Kaneka Corp | 紫外線硬化型粘接着剤組成物 |
| JP5655001B2 (ja) * | 2009-10-23 | 2015-01-14 | クラレノリタケデンタル株式会社 | 重合性組成物及び歯科材料 |
| WO2011138630A1 (fr) * | 2010-05-03 | 2011-11-10 | Arkema France | Matière d'encapsulation durcissable par uv |
| KR102215376B1 (ko) * | 2012-10-11 | 2021-02-10 | 스미또모 가가꾸 가부시끼가이샤 | 광 경화성 접착제 조성물, 편광판과 그 제조법, 광학 부재 및 액정 표시 장치 |
| JP6597310B2 (ja) * | 2013-12-27 | 2019-10-30 | 横浜ゴム株式会社 | 紫外線硬化型樹脂組成物および積層体 |
| JP5973476B2 (ja) * | 2014-01-24 | 2016-08-23 | オリジン電気株式会社 | 耐久性に優れた接着剤組成物 |
| CN103923572B (zh) * | 2014-04-30 | 2015-03-11 | 河北工业大学 | 一种uv可剥离胶及其制备方法 |
| FR3040706B1 (fr) * | 2015-09-04 | 2019-08-30 | Arkema France | Composition photo-polymerisable a base d'une matrice (meth)acrylique et de copolymeres a blocs (meth)acryliques |
| FR3047991B1 (fr) * | 2016-02-24 | 2020-03-20 | Arkema France | Composition polymerisable de faible viscosite precurseur de materiaux renforces a l'impact |
-
2015
- 2015-09-04 FR FR1558206A patent/FR3040707B1/fr not_active Expired - Fee Related
-
2016
- 2016-08-25 EP EP16766997.7A patent/EP3344717A1/fr not_active Withdrawn
- 2016-08-25 WO PCT/FR2016/052124 patent/WO2017037366A1/fr not_active Ceased
- 2016-08-25 US US15/756,861 patent/US20180327641A1/en not_active Abandoned
- 2016-08-25 JP JP2018511717A patent/JP2018529807A/ja active Pending
-
2019
- 2019-10-16 US US16/654,463 patent/US20200063005A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018529807A (ja) | 2018-10-11 |
| US20200063005A1 (en) | 2020-02-27 |
| US20180327641A1 (en) | 2018-11-15 |
| WO2017037366A1 (fr) | 2017-03-09 |
| FR3040707A1 (fr) | 2017-03-10 |
| FR3040707B1 (fr) | 2019-08-30 |
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