EP3339267B1 - Pierre artificielle et son procédé de fabrication - Google Patents
Pierre artificielle et son procédé de fabrication Download PDFInfo
- Publication number
- EP3339267B1 EP3339267B1 EP17200437.6A EP17200437A EP3339267B1 EP 3339267 B1 EP3339267 B1 EP 3339267B1 EP 17200437 A EP17200437 A EP 17200437A EP 3339267 B1 EP3339267 B1 EP 3339267B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- phosphorescent
- silica
- amount
- weight
- equal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011439 engineered stone Substances 0.000 title claims description 68
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 343
- 239000000377 silicon dioxide Substances 0.000 claims description 128
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 57
- 239000002245 particle Substances 0.000 claims description 52
- 150000001875 compounds Chemical class 0.000 claims description 51
- 239000011342 resin composition Substances 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 47
- 239000000049 pigment Substances 0.000 claims description 44
- 239000000843 powder Substances 0.000 claims description 40
- 239000004576 sand Substances 0.000 claims description 39
- 239000010453 quartz Substances 0.000 claims description 21
- 239000003431 cross linking reagent Substances 0.000 claims description 18
- 239000001023 inorganic pigment Substances 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 16
- 239000012860 organic pigment Substances 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- 230000000694 effects Effects 0.000 claims description 11
- 238000002156 mixing Methods 0.000 claims description 10
- 238000002834 transmittance Methods 0.000 claims description 10
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 8
- 229910000077 silane Inorganic materials 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 238000000748 compression moulding Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 229920005989 resin Polymers 0.000 description 21
- 239000011347 resin Substances 0.000 description 21
- 239000004575 stone Substances 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 16
- 229920006305 unsaturated polyester Polymers 0.000 description 14
- 125000000217 alkyl group Chemical group 0.000 description 8
- 239000002928 artificial marble Substances 0.000 description 7
- 238000005286 illumination Methods 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- 239000002253 acid Substances 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 239000002969 artificial stone Substances 0.000 description 4
- 239000003086 colorant Substances 0.000 description 4
- 125000001072 heteroaryl group Chemical group 0.000 description 4
- 125000005842 heteroatom Chemical group 0.000 description 4
- 229920001225 polyester resin Polymers 0.000 description 4
- 239000004645 polyester resin Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000002009 alkene group Chemical group 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 description 3
- 239000004579 marble Substances 0.000 description 3
- 239000011707 mineral Substances 0.000 description 3
- 150000007519 polyprotic acids Polymers 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- -1 acryl Chemical group 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000002355 alkine group Chemical group 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- ZQHJVIHCDHJVII-OWOJBTEDSA-N (e)-2-chlorobut-2-enedioic acid Chemical compound OC(=O)\C=C(\Cl)C(O)=O ZQHJVIHCDHJVII-OWOJBTEDSA-N 0.000 description 1
- SASYHUDIOGGZCN-ARJAWSKDSA-N (z)-2-ethylbut-2-enedioic acid Chemical compound CC\C(C(O)=O)=C\C(O)=O SASYHUDIOGGZCN-ARJAWSKDSA-N 0.000 description 1
- ORTVZLZNOYNASJ-UPHRSURJSA-N (z)-but-2-ene-1,4-diol Chemical compound OC\C=C/CO ORTVZLZNOYNASJ-UPHRSURJSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- CWPKTBMRVATCBL-UHFFFAOYSA-N 3-[1-[1-[(2-methylphenyl)methyl]piperidin-4-yl]piperidin-4-yl]-1h-benzimidazol-2-one Chemical compound CC1=CC=CC=C1CN1CCC(N2CCC(CC2)N2C(NC3=CC=CC=C32)=O)CC1 CWPKTBMRVATCBL-UHFFFAOYSA-N 0.000 description 1
- PKBVYRDGTJBIKR-UHFFFAOYSA-N C(=C)C(O)C(CO)(CO)CO Chemical compound C(=C)C(O)C(CO)(CO)CO PKBVYRDGTJBIKR-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000005084 Strontium aluminate Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000005103 alkyl silyl group Chemical group 0.000 description 1
- 125000000304 alkynyl group Chemical group 0.000 description 1
- 229920005603 alternating copolymer Polymers 0.000 description 1
- 238000012648 alternating copolymerization Methods 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000012661 block copolymerization Methods 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- PMMYEEVYMWASQN-IMJSIDKUSA-N cis-4-Hydroxy-L-proline Chemical compound O[C@@H]1CN[C@H](C(O)=O)C1 PMMYEEVYMWASQN-IMJSIDKUSA-N 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 239000010438 granite Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- MLDWIYATQASALW-UHFFFAOYSA-N pent-1-ene-1,1-diol Chemical compound CCCC=C(O)O MLDWIYATQASALW-UHFFFAOYSA-N 0.000 description 1
- MHGMBRBPBZPUAD-UHFFFAOYSA-N pent-4-ene-1,2,3-triol Chemical compound OCC(O)C(O)C=C MHGMBRBPBZPUAD-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920005646 polycarboxylate Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- FNWBQFMGIFLWII-UHFFFAOYSA-N strontium aluminate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Sr+2].[Sr+2] FNWBQFMGIFLWII-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000004950 trifluoroalkyl group Chemical group 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- 125000004417 unsaturated alkyl group Chemical group 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/02—Macromolecular compounds
- C04B26/10—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B26/18—Polyesters; Polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
- B29C67/242—Moulding mineral aggregates bonded with resin, e.g. resin concrete
- B29C67/243—Moulding mineral aggregates bonded with resin, e.g. resin concrete for making articles of definite length
- B29C67/244—Moulding mineral aggregates bonded with resin, e.g. resin concrete for making articles of definite length by vibrating the composition before or during moulding
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B14/00—Use of inorganic materials as fillers, e.g. pigments, for mortars, concrete or artificial stone; Treatment of inorganic materials specially adapted to enhance their filling properties in mortars, concrete or artificial stone
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B14/00—Use of inorganic materials as fillers, e.g. pigments, for mortars, concrete or artificial stone; Treatment of inorganic materials specially adapted to enhance their filling properties in mortars, concrete or artificial stone
- C04B14/005—Inorganic fillers with a shape other than granular or fibrous
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B14/00—Use of inorganic materials as fillers, e.g. pigments, for mortars, concrete or artificial stone; Treatment of inorganic materials specially adapted to enhance their filling properties in mortars, concrete or artificial stone
- C04B14/02—Granular materials, e.g. microballoons
- C04B14/04—Silica-rich materials; Silicates
- C04B14/06—Quartz; Sand
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B16/00—Use of organic materials as fillers, e.g. pigments, for mortars, concrete or artificial stone; Treatment of organic materials specially adapted to enhance their filling properties in mortars, concrete or artificial stone
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B18/00—Use of agglomerated or waste materials or refuse as fillers for mortars, concrete or artificial stone; Treatment of agglomerated or waste materials or refuse, specially adapted to enhance their filling properties in mortars, concrete or artificial stone
- C04B18/02—Agglomerated materials, e.g. artificial aggregates
- C04B18/022—Agglomerated materials, e.g. artificial aggregates agglomerated by an organic binder
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B24/00—Use of organic materials as active ingredients for mortars, concrete or artificial stone, e.g. plasticisers
- C04B24/24—Macromolecular compounds
- C04B24/28—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B24/283—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
- C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
- B29C2043/561—Compression moulding under special conditions, e.g. vacuum under vacuum conditions
- B29C2043/563—Compression moulding under special conditions, e.g. vacuum under vacuum conditions combined with mechanical pressure, i.e. mould plates, rams, stampers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2067/00—Use of polyesters or derivatives thereof, as moulding material
- B29K2067/06—Unsaturated polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/24—Condition, form or state of moulded material or of the material to be shaped crosslinked or vulcanised
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2509/00—Use of inorganic materials not provided for in groups B29K2503/00 - B29K2507/00, as filler
- B29K2509/08—Glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
- B29K2995/0026—Transparent
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2103/00—Function or property of ingredients for mortars, concrete or artificial stone
- C04B2103/54—Pigments; Dyes
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/00965—Uses not provided for elsewhere in C04B2111/00 for household applications, e.g. use of materials as cooking ware
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/54—Substitutes for natural stone, artistic materials or the like
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/54—Substitutes for natural stone, artistic materials or the like
- C04B2111/542—Artificial natural stone
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/80—Optical properties, e.g. transparency or reflexibility
- C04B2111/805—Transparent material
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/80—Optical properties, e.g. transparency or reflexibility
- C04B2111/807—Luminescent or fluorescent materials
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/80—Optical properties, e.g. transparency or reflexibility
- C04B2111/82—Coloured materials
Definitions
- An engineered stone and a manufacturing method thereof are disclosed.
- Natural stones such as granite and marble can have beautiful patterns on the surface thereof and thus have been used as building decoration material. Recently, the demand for natural stones for use in applications such as flooring, wall panels, sinks, and the like has significantly increased. However, this demand may not be met only with high cost natural stones. Accordingly, various artificial stones are also being developed and used.
- the artificial stones are classified into general artificial stones manufactured by adding various mixing materials such as an inorganic filler, a colorant, a curing agent, and the like to an acryl-based or unsaturated polyester base resin and resin-based engineered stones (so called, "engineering stones") manufactured by mixing an inorganic (silica-based) natural mineral and a binder resin to obtain a compound and then, vacuuming, vibrating, compressing, and molding the compound to appear a texture of the natural stones.
- various mixing materials such as an inorganic filler, a colorant, a curing agent, and the like
- engineered stones manufactured by mixing an inorganic (silica-based) natural mineral and a binder resin to obtain a compound and then, vacuuming, vibrating, compressing, and molding the compound to appear a texture of the natural stones.
- the resin-based engineered stones may be manufactured to show various colors and textures depending on a kind of natural mineral, a color of a resin or pigment, a stirring process, and the like and more excellent natural textures than the general artificial stones due to a use of the natural mineral as a main material and thus have recently been in increasing demand.
- These resin-base engineered stones may be manufactured to have a single color, a multicolor tone by adding pigments having different colors one another and mixing resin mixtures having various colors in a mixer, or a natural stone texture by using a chip.
- an attempt to apply luminance to the artificial marble by using a noctilucenct material such as a phosphorescent material and the like, a light emitting material such as an ultraviolet (UV) emitting as well as ultraviolet (UV) absorbing material, or the like has been made.
- a conventional phosphorescent artificial marble may be manufactured in a method of coating a phosphorescent pigment on the surface or creating a texture by using a phosphorescent chip.
- a phosphorescent chip When the phosphorescent chip is used, uniform phosphorescence may not be obtained, and when the phosphorescent pigment is coated on the surface, the texture on the surface may be different from that of natural marble.
- the conventional phosphorescent artificial marble uses an excessive amount of the phosphorescent pigment to accomplish sufficient phosphorescence performance.
- the phosphorescent pigment is expensive and thus may increase a manufacturing cost when used in the excessive amount and resultantly, put an obstacle on commercial availability of the artificial marble. Accordingly, a request of accomplishing sufficient phosphorescence by minimizing use of the phosphorescent pigment has been made.
- EP 2 610 227 A2 relates to an artificial marble that includes unsaturated polyester resin (A), compound containing silica (B), and luminescent pigment (C). It also relates to artificial marble that includes 70 to 95 % by weight of a non-luminescent base material (I) comprising unsaturated polyester resin (A), compound containing silica (B), and organic/inorganic pigment (C) and 5 to 30 % by weight of a luminescent amorphous pattern part (II) comprising unsaturated polyester resin (A), compound containing silica (B), and luminescent pigment (D). Furthermore, it relates to marble that includes unsaturated polyester resin (A), compound containing silica (B), and amorphous luminescent chip (C).
- the present inventors have researched an appropriate mixing ratio in order to solve this problem and resultantly developed a resin-based engineered stone capable of accomplishing phosphorescence keeping sufficient luminance for a long time as well as using a minimum amount of the phosphorescent pigment.
- the present disclosure is to provide a resin-based engineered stone appearing various surface textures depending on illumination of lighting.
- An engineered stone includes a light transmitting mother material (I) and a phosphorescent chip (II), wherein the light transmitting mother material (I) includes ⁇ 7 wt% to ⁇ 12 wt% of an unsaturated polyester resin (A) and ⁇ 88 wt% to ⁇ 93 wt% of a silica-containing compound (B) based on a total amount of the light transmitting mother material (I), the light transmitting mother material (I) further includes ⁇ 0.01 part by weight to ⁇ 1 part by weight of an organic/inorganic pigment (C) based on 100 parts by weight of the unsaturated polyester resin (A), the phosphorescent chip (II) includes ⁇ 8 wt% to ⁇ 15 wt% of an unsaturated polyester resin (A), ⁇ 85 wt% to ⁇ 92 wt% of a silica-containing compound (B'), and a phosphorescent pigment (D) based on a total amount
- the silica-containing compound (B) may include a silica powder (b1), a silica sand (b2), and a quartz chip (b3).
- An average particle diameter of the silica powder (b1) is greater than 0 ⁇ m and less than or equal to 45 ⁇ m
- an average particle diameter of the silica sand (b2) may be greater than or equal to 0.1 mm and less than 1.2 mm
- an average particle diameter of the quartz chip (b3) may be greater than or equal to 1.2 mm and less than or equal to 6.0 mm.
- the average particle diameter can be measured using a HELOS (a light diffraction particle size analyzer by Sympatec Ltd).
- the silica powder (b1) may be included in an amount of ⁇ 20 wt% to ⁇ 30 wt% based on a total amount of the light transmitting mother material (I)
- the silica sand (b2) may be included in an amount of ⁇ 35 wt% to ⁇ 45 wt% based on a total amount of the light transmitting mother material (I)
- the quartz chip (b3) may be included in an amount of ⁇ 10 wt% to ⁇ 30 wt% based on a total amount of the light transmitting mother material (I).
- the silica powder (b1) may have a specific gravity of ⁇ 2.50 to ⁇ 2.80, more preferred ⁇ 2.60 to ⁇ 2.70, most preferred ⁇ 2.62 to ⁇ 2.67.
- the silica-containing compound (B') may include the silica powder (b1) and the silica sand (b2).
- An average particle diameter of the silica powder (b1) is greater than 0 ⁇ m and less than or equal to 45 ⁇ m and an average particle diameter of the silica sand (b2) may be greater than or equal to 0.1 mm and less than 1.2 mm.
- the silica sand (b2) may be included in an amount of ⁇ 60 wt% to ⁇ 70 wt% based on a total amount of the phosphorescent chip (II).
- An average particle diameter of the phosphorescent pigment (D) may be ⁇ 6 ⁇ m to ⁇ 150 ⁇ m. This diameter can be measured using a RODOS/M device.
- the specific gravity of the phosphorescent pigment (D) may be ⁇ 3.5 to ⁇ 4.5, more preferred ⁇ 3.8 to ⁇ 4.2 and most preferred ⁇ 3.9 to 4.1.
- the light transmitting mother material (I) and the phosphorescent chip (II) may independently further include a curing agent, a curing accelerator, and a cross-linking agent.
- the curing agent may be included in an amount of ⁇ 1.0 part by weight to ⁇ 3.0 parts by weight based on 100 parts by weight of the unsaturated polyester resin (A).
- the curing accelerator may be included in an amount of ⁇ 0.1 part by weight to ⁇ 0.2 parts by weight based on 100 parts by weight of the unsaturated polyester resin (A).
- the cross-linking agent may be a silane-based cross-linking agent.
- the cross-linking agent may be included in an amount of ⁇ 0.5 parts by weight to ⁇ 2.0 parts by weight based on 100 parts by weight of the unsaturated polyester resin (A).
- the engineered stone may have a diffuse transmittance of greater than or equal to 6.0 % and luminance after 1 hour of greater than or equal to 7.0 mcd/m 2 .
- the phosphorescent chip (II) may be an amorphous phosphorescent chip.
- Another embodiment of the present disclosure provides a method for manufacturing an engineered stone that includes preparing a phosphorescent resin composition (ii) including ⁇ 8 wt% to ⁇ 15 wt% of an unsaturated polyester resin (A), ⁇ 85 wt% to ⁇ 92 wt% of a silica-containing compound (B'), and a phosphorescent pigment (D), wherein the phosphorescent pigment (D) is included in an amount of ⁇ 2 parts by weight to ⁇ 5 parts by weight based on 100 parts by weight of the unsaturated polyester resin (A), and the silica-containing compound (B') includes ⁇ 20 wt% to ⁇ 30 wt% of a silica powder (b1) based on a total amount of the phosphorescent resin composition (ii); wherein an average particle diameter of the silica powder (b1) is greater than 0 ⁇ m and less than or equal to 45 ⁇ m, dispersing the phosphorescent resin composition (ii) using a dis
- the silica-containing compound (B) includes a silica powder (b1) having an average particle diameter of greater than 0 ⁇ m and less than or equal to 45 ⁇ m, and may include a silica sand (b2) having an average particle diameter of greater than or equal to 0.1 mm and less than 1.2 mm, and a quartz chip (b3) having an average particle diameter of greater than or equal to 1.2 mm and less than or equal to 6.0 mm, wherein the silica powder (b1) is included in an amount of ⁇ 20 wt% to ⁇ 30 wt% based on a total amount of the light transmitting resin composition (i), the silica sand (b2) is included in an amount of ⁇ 35 wt% to ⁇ 45 wt% based on a total amount of the light transmitting resin composition (i), and the quartz chip (b3) may be included in an amount of ⁇ 10 wt% to ⁇ 30 wt% based on a total amount of the light transmitting resin composition
- the silica-containing compound (B') includes a silica powder (b1) having an average particle diameter of greater than 0 ⁇ m and less than or equal to 45 ⁇ m and may include a silica sand (b2) having an average particle diameter of greater than or equal to 0.1 mm and less than 1.2 mm, wherein the silica sand (b2) may be included in an amount of 60 wt% to 70 wt% based on a total amount of the phosphorescent resin composition (ii).
- the light transmitting resin composition (i) may further include ⁇ 1.0 part by weight to ⁇ 3.0 parts by weight of a curing agent, ⁇ 0.1 part by weight to ⁇ 0.2 parts by weight of a curing accelerator, and ⁇ 0.5 parts by weight to ⁇ 2.0 parts by weight of a silane-based cross-linking agent based on 100 parts by weight of the unsaturated polyester resin (A).
- the phosphorescent resin composition (ii) may further include ⁇ 1.0 part by weight to ⁇ 3.0 parts by weight of a curing agent, ⁇ 0.1 part by weight to ⁇ 0.2 parts by weight of a curing accelerator, and ⁇ 0.5 parts by weight to ⁇ 2.0 parts by weight of a silane-based cross-linking agent based on 100 parts by weight of the unsaturated polyester resin (A).
- the light transmitting resin composition (i) may be provided from a plurality of blenders.
- the present disclosure may provide a resin-based engineered stone having excellent light transmittance and phosphorescence and variously appearing surface textures depending on illumination of lighting.
- substituted refers to replacement of at least one hydrogen of a compound with a C1 to C30 alkyl group; a C1 to C10 alkylsilyl group; a C3 to C30 cycloalkyl group; a C6 to C30 aryl group; a C2 to C30 heteroaryl group; a C1 to C10 alkoxy group; a fluoro group, a C1 to C10 trifluoroalkyl group such as a trifluoromethyl group; or a cyano group.
- hetero may refer to one including 1 to 3 heteroatoms selected from N, O, S, and P, and remaining carbons in a compound or a substituent.
- alkyl group may refer to a "saturated alkyl group” without an alkene group or an alkyne group; or an "unsaturated alkyl group” including at least one of an alkene group and an alkyne group.
- alkene group may refer to a substituent in which at least two carbon atoms are bound with at least one carbon-carbon double bond
- alkynyl group refers to a substituent in which at least two carbon atoms are bound with at least one carbon-carbon triple bond.
- the alkyl group may be a branched, linear, or cyclic alkyl group.
- the alkyl group may be a C1 to C20 alkyl group, specifically a C1 to C6 lower alkyl group, a C7 to C10 middle alkyl group, or a C11 to C20 higher alkyl group.
- aromatic group may refer a compound including a cyclic structure where all elements have p-orbitals which form conjugation. Specific examples thereof may be aryl group and a heteroaryl group.
- aryl group may refer to a monocyclic or fused ring-containing polycyclic (i.e., rings sharing adjacent pairs of carbon atoms) groups.
- heteroaryl group may refer to one including 1 to 3 heteroatoms selected from N, O, S, or P in aryl group, and remaining carbons.
- each ring may include 1 to 3 heteroatoms.
- (meth)acrylate refers to acrylate or methacrylate.
- the (meth)acrylic acid alkyl ester refers to acrylic acid alkyl ester or methacrylic acid alkyl ester, and (meth)acrylic acid ester refers to acrylic acid ester or methacrylic acid ester.
- copolymerization may refer to a block copolymerization, random copolymerization, graft copolymerization, or alternating copolymerization
- copolymer may refer to a block copolymer, a random copolymer, a graft copolymer, or an alternating copolymer.
- an engineered stone includes a light transmitting mother material (I) and a phosphorescent chip (II).
- the engineered stone of the present disclosure may appear various surface textures depending on illumination of light as shown in FIGS. 1 to 3 .
- the light transmitting mother material (I) includes an unsaturated polyester resin (A), a silica-containing compound (B), and an organic/inorganic pigment (C) as essential constituent elements, so that the engineered stone of the present disclosure may have an appearance and a texture close to those of a natural stone.
- the light transmitting mother material (I) includes ⁇ 7 wt% to ⁇ 12 wt% of an unsaturated polyester resin (A) and ⁇ 88 wt% to ⁇ 93 wt% of a silica-containing compound (B), and further include an organic/inorganic pigment (C).
- the organic/inorganic pigment (C) may be included in an amount of ⁇ 0.01 part by weight to ⁇ 1 part by weight based on 100 parts by weight of the unsaturated polyester resin (A).
- the phosphorescent chip (II) includes the unsaturated polyester resin (A), a silica-containing compound (B'), and a phosphorescent pigment (D) to apply a partial phosphorescence effect to the engineered stone.
- the phosphorescent chip (II) has common or very similar components with the light transmitting mother material (I) except for using the phosphorescent pigment (D) instead of the organic/inorganic pigment (C) as a pigment component.
- the phosphorescent chip (II) includes ⁇ 8 wt% to ⁇ 15 wt% of an unsaturated polyester resin (A), ⁇ 85 wt% to ⁇ 92 wt% of a silica-containing compound (B'), and a phosphorescent pigment (D).
- the phosphorescent pigment (D) may be included in an amount of ⁇ 2 parts by weight to ⁇ 5 parts by weight based on 100 parts by weight of the unsaturated polyester resin (A).
- the phosphorescent chip (II) may be an amorphous phosphorescent chip.
- a partial phosphorescent pattern of the engineered stone according to the present disclosure may be variously formed by controlling the amounts of the light transmitting mother material (I) and the phosphorescent chip (II).
- the engineered stone includes ⁇ 70 wt% to ⁇ 95 wt% of the light transmitting mother material (I) and ⁇ 5 wt% to ⁇ 30 wt% of the phosphorescent chip (II), for example 80 wt% to ⁇ 90 wt% of a light transmitting mother material (I) and ⁇ 10 wt% to ⁇ 20 wt% of the phosphorescent chip (II).
- the phosphorescent chip (II) is included in an amount of less than 5 wt%, the phosphorescent pattern may not be appropriately formed, but when the phosphorescent chip (II) is included in an amount of greater than 30 wt%, a texture of a natural stone may not be realized.
- the phosphorescent pattern may take ⁇ 5 wt% to ⁇ 30 wt% of the surface area of the engineered stone, for example, ⁇ 10 wt% to ⁇ 20 wt% of the surface area of the engineered stone and thus form a natural texture.
- the engineered stone of the present disclosure may have diffusion transmittance of greater than or equal to 6.0 % and one hour later, maintain luminance of greater than or equal to 7.0 mcd/m 2 .
- a resin component surrounds a natural stone particle and a mineral filler forming a frame of the engineered stone, plays a role of bonding the whole along with a cross-linking agent, and applies elastic or tensile strength to the engineered stone.
- the present disclosure uses an unsaturated polyester resin (UPE resin) having an excellent bonding force with the natural stone particle and the like as the resin component.
- UE resin unsaturated polyester resin
- the unsaturated polyester resin used in the present disclosure is well known in this art, may be an esterification product of a polybasic acid and a polyvalent alcohol, wherein the polybasic acid and/or the polyvalent alcohol compound includes an unsaturated moiety.
- Polycarboxylic acid, polycarboxylic anhydride, polycarboxylic acid halide, or polycarboxylate ester may be used as the polybasic acid.
- Specific examples of the unsaturated polycarboxylic acid may be maleic acid, maleic anhydride, fumaric acid, chloromaleic acid, ethylmaleic acid, itaconic acid, citraconic acid, zeronic acid, mesaconic acid, acornic acid, ethylene dicarboxylic acid, or a mixture thereof, and the like.
- phthalic acid, isophthalic acid, terephthalic acid, succinic acid, or a mixture thereof which are normally used in the preparation of the polyester resin may be used.
- Divalent alcohols such as ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, 1,3-butanediol, 1,6-hexanediol, neopentyl glycol, and 1,4-cyclohexanediol; trivalent alcohols such as glycerin; tetravalent alcohol such as pentaerythritol; and the like and combinations thereof may be used as the polyhydric alcohols.
- Other examples of unsaturated polyhydric alcohols include without limitation butene diol, pentene diol, allyl or vinyl glycerol ether, allyl or vinyl pentaerythritol, or a mixture thereof.
- the unsaturated polyester resin may have a molecular weight ranging from ⁇ 70,000 g/mol to ⁇ 100,000 g/mol. Since the larger molecular weight the unsaturated polyester resin has, the more excellent bonding force with the natural stone particle it has, the unsaturated polyester resin may effectively fix the natural stone particle exposed outside, even though a part of the resin is polished off during a polishing process.
- the unsaturated polyester resin has a molecular weight of less than 70,000 g/mol, the natural stone particle may be dropped off from the surface of the engineered stone, but when the unsaturated polyester resin has a molecular weight of greater than 10,000 g/mol, the unsaturated polyester resin has too large viscosity and thus may not be well mixed with the natural stone particle.
- the unsaturated polyester resin (A) is included in an amount of ⁇ 7 wt% to ⁇ 12 wt% based on 100 wt% of the light transmitting mother material (I) including the unsaturated polyester resin (A) and the silica-containing compound (B) and as for the phosphorescent chip (II), in an amount of ⁇ 8 wt% to ⁇ 15 wt% based on 100 wt% of the phosphorescent chip (II) including the unsaturated polyester resin (A), the silica-containing compound (B'), and the phosphorescent pigment (D).
- the unsaturated polyester resin When the unsaturated polyester resin is included in an amount of less than 7 wt% based on 100 wt% of the light transmitting mother material (I) or in an amount of less than 8 wt% based on 100 wt% of the phosphorescent chip (II), the bonding force with the natural stone particle may be deteriorated, but when the unsaturated polyester resin is included in an amount of greater than 12 wt% based on 100 wt% of light transmitting mother material (I) or in an amount of greater than 15 wt% based on 100 wt% of the phosphorescent chip (II), an appearance and a texture of a natural stone may be lost.
- the silica-containing compound is included in an amount of ⁇ 88 wt% to ⁇ 93 wt% based on 100 wt% of the light transmitting mother material (I) including the unsaturated polyester resin (A) and the silica-containing compound (B) and as for the phosphorescent chip (II), in an amount of ⁇ 85 wt% to ⁇ 92 wt% based on 100 wt% of the phosphorescent chip (II) including the unsaturated polyester resin (A), the silica-containing compound (B'), and the phosphorescent pigment (D).
- the silica-containing compound (B, B') is included in a large amount like the range, an appearance and a texture near to those of a natural stone may be obtained.
- the silica-containing compound (B) may include a silica powder (b1), a silica sand (b2), and a quartz chip (b3).
- An average particle diameter of the silica powder (b1) is greater than 0 ⁇ m and less than or equal to 45 ⁇ m
- an average particle diameter of the silica sand (b2) may be greater than or equal to 0.1 mm and less than 1.2 mm
- an average particle diameter of the quartz chip (b3) may be greater than or equal to 1.2 mm and less than or equal to 6.0 mm.
- the silica powder (b1) may be included in an amount of ⁇ 20 wt% to ⁇ 30 wt% based on a total amount of the light transmitting mother material (I)
- the silica sand (b2) may be included in an amount of ⁇ 35 wt% to ⁇ 45 wt% based on a total amount of the light transmitting mother material (I)
- the quartz chip (b3) may be included in an amount of ⁇ 10 wt% to ⁇ 30 wt% based on a total amount of the light transmitting mother material (I).
- the ranges of the silica powder (b1), the silica sand (b2), and the quartz chip (b3) may be appropriate in terms of a phosphorescence effect and a cost.
- the silica sand (b2) is included in an amount of ⁇ 35 wt% to 45 wt% based on a total amount of the light transmitting mother material (I)
- the quartz chip (b3) is included in an amount of ⁇ 10 wt% to ⁇ 30 wt% based on a total amount of the light transmitting mother material (I)
- an excellent texture of a natural stone may not be obtained, but diffusion transmittance may be much improved, and thus various surface textures depending on illumination of light may be realized.
- the silica-containing compound (B') includes a silica powder (b1) and may include a silica sand (b2).
- silica powder (b1) and the silica sand (b2) are the same as described above.
- the silica powder (b1) is included in an amount of ⁇ 20 wt% to ⁇ 30 wt% based on a total amount of the phosphorescent chip (II) and the silica sand (b2) may be included in an amount of ⁇ 60 wt% to ⁇ 70 wt% based on a total amount of the phosphorescent chip (II).
- the silica sand is included in an amount of ⁇ 60 wt% to 70 wt% based on a total amount of the phosphorescent chip (II)
- diffusion transmittance may be much improved, and thus various surface textures depending on illumination of light may be obtained.
- an organic/inorganic pigment may be further included to diversify a phosphorescent color.
- the organic/inorganic pigment may be azo-based or phthalocyanine-based and is used in an amount of ⁇ 0.01 parts by weight to 1 part by weight based on 100 parts by weight of the unsaturated polyester resin (A).
- Any general phosphorescent pigment applying phosphorescence to the engineered stone of the present disclosure may be used without any particular limit, but a strontium aluminate-based pigment or a zinc sulfide-based pigment may be used.
- the phosphorescent pigment may have an average particle diameter ranging from ⁇ 6 ⁇ m to ⁇ 150 ⁇ m. When the phosphorescent pigment has an average particle diameter of less than 6 ⁇ m, light emitting performance may be deteriorated, but when the phosphorescent pigment has an average particle diameter of greater than 150 ⁇ m, a photo-radiation time for its initial saturation state may be longer.
- the phosphorescent pigment is expensive and thus should be used at a minimum ratio to maximize light emitting performance of the engineered stone and in the present disclosure, used in an amount of ⁇ 2 parts by weight to 5 wt% based on 100 parts by weight of the unsaturated polyester resin (A).
- the phosphorescent pigment is used in an amount of less than 2 parts by weight according to the mixing ratio of the present disclosure, a sufficient phosphorescence effect may not be obtained, but when the phosphorescent pigment is used in an amount of greater than 5 parts by weight, use of the phosphorescent pigment may neither be economical nor expected to improve phosphorescence performance.
- a curing agent (e1) may be used in order to cure an engineered stone and a curing accelerator (e2) may be used in order to enhance a curing reaction.
- the curing agent may independently be in amount of ⁇ 1.0 part by weight to ⁇ 3.0 parts by weight based on 100 parts by weight of the polyester resin (A) and the curing accelerator may independently be in amount of ⁇ 0.1 part by weight to ⁇ 0.2 parts by weight based on 100 parts by weight of the polyester resin (A).
- a cross-linking agent (e3) can be used to bond the unsaturated polyester resin of the present disclosure with the natural stone particle.
- the cross-linking agent may be a silane-based cross-linking agent and may independently be used in an amount of ⁇ 0.5 parts by weight to ⁇ 2.0 parts by weight based on 100 parts by weight of the polyester resin (A).
- the engineered stone of the present comprises the the light transmitting mother material (I) and the phosphorescent chip (II).
- the preparation of the phosphorescent chip includes preparing a phosphorescent resin composition (ii), dispersing the phosphorescent resin composition (ii) using a dispersing equipment, vacuum-vibration-compression molding the phosphorescent resin composition (ii) dispersed to have a predetermined shape and molding it into a sheet having a phosphorescence effect, and crushing the sheet having the phosphorescence effect to prepare a phosphorescent chip.
- the sheet may be crushed to have a size of ⁇ 4.0 mm to ⁇ 10.0 mm.
- the phosphorescent resin composition (ii) In the preparation of the phosphorescent resin composition (ii), ⁇ 8 wt% to ⁇ 15 wt% of an unsaturated polyester resin (A), ⁇ 85 wt% to ⁇ 92 wt% of a silica-containing compound (B'), and a phosphorescent pigment (D) are mixed, wherein the phosphorescent pigment (D) is included in an amount of ⁇ 2 parts by weight to ⁇ 5 parts by weight based on 100 parts by weight of the unsaturated polyester resin (A), the silica-containing compound (B') includes a silica powder (b1) and the silica powder (b1) is included in an amount of ⁇ 20 wt% to ⁇ 30 wt% based on a total amount of the phosphorescent resin composition (ii).
- the preparation of the phosphorescent resin composition (ii) may further include ⁇ 1.0 part by weight to ⁇ 3.0 parts by weight of a curing agent, ⁇ 0.1 part by weight to ⁇ 0.2 parts by weight of a curing accelerator, and ⁇ 0.5 parts by weight to ⁇ 2.0 parts by weight of a silane-based cross-linking agent based on 100 parts by weight of the unsaturated polyester resin (A).
- the light transmitting resin composition (i) forming a part of the light transmitting mother material (I) is prepared by mixing the unsaturated polyester resin (A), the silica-containing compound (B), and the organic/inorganic pigment (C) with a mixer.
- the light transmitting resin composition (i) includes ⁇ 7 wt% to ⁇ 12 wt% of the unsaturated polyester resin (A) and ⁇ 88 wt% to ⁇ 93 wt% of the silica-containing compound (B) and further includes ⁇ 0.01 part by weight to 1 part by weight of organic/inorganic pigment (C) based on 100 parts by weight of the unsaturated polyester resin (A).
- the silica-containing compound (B) may include a silica powder (b1) having an average particle diameter of greater than 0 ⁇ m and less than or equal to 45 ⁇ m, a silica sand (b2) having an average particle diameter of greater than or equal to 0.1 mm and less than 1.2 mm, and a quartz chip (b3) having an average particle diameter of greater than or equal to 1.2 mm and less than or equal to 6.0 mm.
- the silica powder (b1) may be included in an amount of ⁇ 20 wt% to ⁇ 30 wt% based on a total amount of the light transmitting resin composition (i)
- the silica sand (b2) may be included in an amount of ⁇ 35 wt% to ⁇ 45 wt% based on a total amount of the light transmitting resin composition (i)
- the quartz chip (b3) may be included in an amount of ⁇ 10 wt% to ⁇ 30 wt% based on a total amount of the light transmitting resin composition (i).
- the silica-containing compound (B') includes a silica powder (b1) having an average particle diameter of greater than 0 ⁇ m and less than or equal to 45 ⁇ m and may include a silica sand (b2) having an average particle diameter of greater than or equal to 0.1 mm and less than 1.2 mm.
- the silica powder (b1) is included in an amount of ⁇ 20 wt% to ⁇ 30 wt% based on a total amount of the phosphorescent resin composition (ii) and the silica sand (b2) may be included in an amount of ⁇ 60 wt% to 70 wt% based on a total amount of the phosphorescent resin composition (ii).
- the light transmitting resin composition (i) may further include ⁇ 1.0 part by weight to ⁇ 3.0 parts by weight of a curing agent, ⁇ 0.1 part by weight to about ⁇ 0.2 parts by weight of a curing accelerator, and ⁇ 0.5 parts by weight to ⁇ 2.0 parts by weight of a silane-based cross-linking agent based on 100 parts by weight of the unsaturated polyester resin (A).
- the engineered stone may be manufactured by preparing the light transmitting resin composition (i), mixing the light transmitting resin composition (i) with the phosphorescent chip (II) to prepare an engineered stone mixture, dispersing the engineered stone mixture with a dispersing equipment into a predetermined shape, and then, vacuuming, vibrating, compressing, and molding the uniformly dispersed engineered stone mixture.
- the light transmitting resin composition (i) may be divisively supplied from a plurality of mixer to control a supply speed.
- the prepared engineered stone mixture is supplied in a sheet shape into a load plate, vacuum-vibration-compression-molded, and then, cured and cooled down into a slab as a half finished product, and the slab is processed into the engineered stone.
- Silica powder having an average particle diameter of greater than 0 ⁇ m and 45 ⁇ m and made by 21 st Century Silica Ltd.
- Silica sand having an average particle diameter of greater than or equal to 0.1 mm and less than 1.2 mm and made by Microman (Turkey).
- TR92, 318M, Y8G, Y6R, and R110 pigments made by Wooshin Pigment Co., Ltd. were used.
- a PL-120 phosphorescent pigment having an average particle diameter of 25 ⁇ m and made by Sachiro was used.
- each light transmitting resin composition (i) was added as shown in Table 1 to prepare each light transmitting resin composition (i) and also, as shown in Table 2 to prepare each phosphorescent resin composition (ii), and each phosphorescent chip (II) was prepared from the phosphorescent resin composition (ii).
- the phosphorescent chips (II) were respectively added to the light transmitting resin composition (i) and dispersed therein and then, vacuum-vibration-compression molded to manufacture engineered stones, and properties of the engineered stones were measured. The results are shown in Table 3.
- the engineered stones according to Examples 1 and 2 showed excellent diffusion transmittance and luminance compared with the engineered stones according to Comparative Examples 1 to 4 and thus turned out to realize various product patterns depending on illumination of light.
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Claims (12)
- Pierre artificielle, comprenant
un matériau mère transmettant la lumière (I) et un éclat phosphorescent (II),
dans laquelle le matériau mère transmettant la lumière (I) comporte ≥ 7% en poids à ≤ 12% en poids d'une résine polyester insaturée (A) et ≥ 88% en poids à ≤ 93% en poids d'un composé contenant de la silice (B) par rapport à une quantité totale du matériau mère transmettant la lumière (I),
le matériau mère transmettant la lumière (I) comporte en outre ≥ 0,01 partie en poids à ≤ 1 partie en poids d'un pigment organique/inorganique (C) par rapport à 100 parties en poids de la résine polyester insaturée (A),
l'éclat phosphorescent (II) comporte ≥ 8% en poids à ≤ 15% en poids d'une résine polyester insaturée (A), ≥ 85% en poids à ≤ 92% en poids d'un composé contenant de la silice (B'), et un pigment phosphorescent (D) par rapport à une quantité totale de l'éclat phosphorescent (II),
le pigment phosphorescent (D) est inclus en une quantité ≥ 2 parties en poids à ≤ 5 parties en poids par rapport à 100 parties en poids de la résine polyester insaturée (A), et
le composé contenant de la silice (B') comporte ≥ 20% en poids à ≤ 30% en poids d'une poudre de silice (b1) par rapport à une quantité totale de l'éclat phosphorescent (II), où un diamètre moyen de particule de la poudre de silice (b1) est supérieur à 0 µm et inférieur ou égal à 45 µm, où
le matériau mère transmettant la lumière (I) est inclus en une quantité ≥ 70% en poids à ≤ 95% en poids et l'éclat phosphorescent (II) est inclus en une quantité ≥ 5% en poids à ≤ 30% en poids par rapport à la quantité totale de la pierre artificielle. - Pierre artificielle de la revendication 1, dans laquelle le composé contenant de la silice (B) comporte une poudre de silice (b1), un sable de silice (b2) et un éclat de quartz (b3), dans laquelle un diamètre moyen de particule de la poudre de silice (b1) est supérieur à 0 µm et inférieur ou égal à 45 µm, un diamètre moyen de particule du sable de silice (b2) est supérieur ou égal à 0,1 mm et inférieur à 1,2 mm, et un diamètre moyen de particule de l'éclat de quartz (b3) est supérieur ou égal à 1,2 mm et inférieur ou égal à 6,0 mm.
- Pierre artificielle de l'une des revendications 1 et 2, dans laquelle la poudre de silice (b1) est incluse en une quantité ≥ 20% en poids à ≤ 30% en poids par rapport à une quantité totale du matériau mère transmettant la lumière (I),
le sable de silice (b2) est inclus en une quantité ≥ 35% en poids à ≤ 45% en poids par rapport à une quantité totale du matériau mère transmettant la lumière (I), et
l'éclat de quartz (b3) est inclus en une quantité ≥ 10% en poids à ≤ 30% en poids par rapport à une quantité totale du matériau mère transmettant la lumière (I), où un diamètre moyen de particule de la poudre de silice (b1) est supérieur à 0 µm et inférieur ou égal à 45 µm, un diamètre moyen de particule du sable de silice (b2) est supérieur ou égal à 0,1 mm et inférieur à 1,2 mm, et un diamètre moyen de particule de l'éclat de quartz (b3) est supérieur ou égal à 1,2 mm et inférieur ou égal à 6,0 mm. - Pierre artificielle de l'une des revendications 1 à 3, dans laquelle le composé contenant de la silice (B') comporte en outre du sable de silice (b2), où un diamètre moyen de particule du sable de silice (b2) est supérieur ou égal à 0,1 mm et inférieur à 1,2 mm.
- Pierre artificielle de l'une des revendications 1 à 4, dans laquelle le sable de silice (b2) est inclus en une quantité ≥ 60% en poids à ≤ 70% en poids par rapport à une quantité totale de l'éclat phosphorescent (II), où un diamètre moyen de particule du sable de silice (b2) est supérieur ou égal à 0,1 mm et inférieur à 1,2 mm.
- Pierre artificielle de l'une des revendications 1 à 5, dans laquelle le matériau mère transmettant la lumière (I) et l'éclat phosphorescent (II) comportent en outre indépendamment un agent de durcissement, un accélérateur de durcissement et un agent de réticulation.
- Pierre artificielle de l'une des revendications 1 à 6, dans laquelle l'agent de réticulation est un agent de réticulation à base de silane.
- Pierre artificielle de l'une des revendications 1 à 7, dans laquelle la pierre artificielle a un facteur de transmission diffuse supérieur ou égal à 6,0% et maintient une luminance supérieure ou égale à 7,0 mcd/m2 après une heure.
- Pierre artificielle de l'une des revendications 1 à 8, dans laquelle l'éclat phosphorescent (II) est un éclat phosphorescent amorphe.
- Procédé de fabrication d'une pierre artificielle, comprenant le fait de préparer une composition de résine phosphorescente (ii) comportant ≥ 8% en poids à ≤ 15% en poids d'une résine polyester insaturée (A), ≥ 85% en poids à ≤ 92% en poids d'un composé contenant de la silice (B'), et un pigment phosphorescent (D), où le pigment phosphorescent (D) est inclus en une quantité ≥ 2 parties en poids à ≤ 5 parties en poids par rapport à 100 parties en poids de la résine polyester insaturée (A), et le composé contenant de la silice (B') comporte ≥ 20% en poids à ≤ 30% en poids d'une poudre de silice (b1) par rapport à une quantité totale de la composition de résine phosphorescente (ii), où un diamètre moyen de particule de la poudre de silice (b1) est supérieur à 0 µm et inférieur ou égal à 45 µm ;
de disperser la composition de résine phosphorescente (ii) en utilisant un équipement de dispersion ;
de mouler sous vide-vibration-compression la composition de résine phosphorescente (ii) dispersée pour avoir une forme prédéterminée et la mouler sous forme d'une feuille ayant un effet phosphorescent ;
d'écraser la feuille ayant l'effet phosphorescent pour préparer un éclat phosphorescent (II) ;
de préparer une composition de résine transmettant la lumière (i) comportant ≥ 7% en poids à ≤ 12% en poids d'une résine polyester insaturée (A) et ≥ 88% en poids à ≤ 93% en poids d'un composé contenant de la silice (B), et comportant en outre ≥ 0,01 partie en poids à ≤ 1 partie en poids d'un pigment organique/inorganique (C) par rapport à 100 parties en poids de la résine polyester insaturée (A) ;
de mélanger la composition de résine transmettant la lumière (i) avec l'éclat phosphorescent (II) pour préparer un mélange de pierres artificielles ;
de disperser le mélange de pierres artificielles en utilisant un équipement de dispersion pour avoir une forme prédéterminée ; et
de mouler sous vide-vibration-compression un mélange de pierres artificielles uniformément réparti pour fabriquer une pierre artificielle, où
la composition de résine transmettant la lumière (i) est incluse en une quantité ≥ 70% en poids à ≤ 95% en poids et l'éclat phosphorescent (II) est inclus en une quantité ≥ 5% en poids à ≤ 30% en poids par rapport à la quantité totale de la pierre artificielle. - Procédé de la revendication 10, dans lequel le composé contenant de la silice (B) comporte une poudre de silice (b1) ayant un diamètre moyen de particule supérieur à 0 µm et inférieur ou égal à 45 µm, un sable de silice (b2) ayant un diamètre moyen de particule supérieur ou égal à 0,1 mm et inférieur à 1,2 mm, et un éclat de quartz (b3) ayant un diamètre moyen de particule supérieur ou égal à 1,2 mm et inférieur ou égal à 6,0 mm, et
la poudre de silice (b1) est incluse en une quantité ≥ 20% en poids à ≤ 30% en poids par rapport à une quantité totale de la composition de résine transmettant la lumière (i), le sable de silice (b2) est inclus en une quantité ≥ 35% en poids à ≤ 45% en poids par rapport à une quantité totale de la composition de résine transmettant la lumière (i), et l'éclat de quartz (b3) inclus en une quantité ≥ 10% en poids à ≤ 30% en poids par rapport à une quantité totale de la composition de résine transmettant la lumière (i). - Procédé de la revendication 10 ou 11, dans lequel le composé contenant de la silice (B') comporte en outre un sable de silice (b2) ayant un diamètre moyen de particule supérieur ou égal à 0,1 mm et inférieur à 1,2 mm, et
le sable de silice (b2) est inclus en une quantité ≥ 60% en poids à ≤ 70% en poids par rapport à une quantité totale de la composition de résine phosphorescente (ii).
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EP (1) | EP3339267B1 (fr) |
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CN109265068B (zh) * | 2018-10-10 | 2019-09-10 | 广东中旗新材料股份有限公司 | 一种以非天然矿物为主料的人造石及其制备方法 |
CN109020302A (zh) * | 2018-10-10 | 2018-12-18 | 广东中旗新材料股份有限公司 | 一种以玻璃为主料的人造石及其制备方法 |
CN109336467A (zh) * | 2018-10-31 | 2019-02-15 | 苏州观上文化科技有限公司 | 一种可塑透光石的制造方法及可塑透光石 |
US11753341B2 (en) | 2018-12-12 | 2023-09-12 | Mflgh Inc. | Engineered stone product and methods of making the same |
KR102487226B1 (ko) * | 2021-06-03 | 2023-01-12 | 에코리엔트샤인 (주) | 자체발광 마스터배치 조성물, 이를 이용하여 사출성형된 바닥재 및 이의 시공방법 |
KR102487225B1 (ko) * | 2021-09-06 | 2023-01-12 | 에코리엔트샤인 (주) | 고기능성 축광 및 발광 석재 |
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US7727435B2 (en) * | 2006-04-18 | 2010-06-01 | Safas Corporation | Engineered stone |
KR20090088147A (ko) | 2008-02-14 | 2009-08-19 | 한화엘앤씨 주식회사 | 인조대리석 |
CN101818553B (zh) * | 2010-04-21 | 2011-07-20 | 廖荣刚 | 夜光石英复合板材的生产方法 |
US8999199B2 (en) * | 2011-12-29 | 2015-04-07 | Cheil Industries Inc. | Artificial marble having natural textures and luminescent patterns and method of preparing the same |
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KR101425514B1 (ko) | 2011-12-29 | 2014-08-04 | 제일모직주식회사 | 자연석 질감 및 부분 축광성을 갖는 인조대리석 및 그 제조방법. |
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KR101861900B1 (ko) | 2014-12-16 | 2018-05-28 | 롯데첨단소재(주) | 강화천연석용 조성물, 이를 포함하는 금속 펄 질감을 갖는 강화천연석용 칩 및 강화 천연석 |
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- 2016-12-23 KR KR1020160178218A patent/KR20180074279A/ko active Search and Examination
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2017
- 2017-11-06 CN CN201711078692.1A patent/CN108238741A/zh active Pending
- 2017-11-07 EP EP17200437.6A patent/EP3339267B1/fr active Active
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US10766815B2 (en) | 2020-09-08 |
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US20180179110A1 (en) | 2018-06-28 |
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