EP3329737B1 - Liaison thermique de structures de couches pulvérisées de dispositifs de chauffage - Google Patents

Liaison thermique de structures de couches pulvérisées de dispositifs de chauffage Download PDF

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Publication number
EP3329737B1
EP3329737B1 EP16740977.0A EP16740977A EP3329737B1 EP 3329737 B1 EP3329737 B1 EP 3329737B1 EP 16740977 A EP16740977 A EP 16740977A EP 3329737 B1 EP3329737 B1 EP 3329737B1
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EP
European Patent Office
Prior art keywords
thermally sprayed
solder
heating device
household appliance
layer structure
Prior art date
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Active
Application number
EP16740977.0A
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German (de)
English (en)
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EP3329737A1 (fr
Inventor
Stefan Kobler
Robert KÜHN
Philipp Schaller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BSH Hausgeraete GmbH
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BSH Hausgeraete GmbH
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Publication of EP3329737A1 publication Critical patent/EP3329737A1/fr
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/262—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Definitions

  • the invention relates to a household appliance with a heating device.
  • the invention also relates to a method for producing a heating device for a household appliance.
  • the invention can be applied particularly advantageously to cooking appliances, in particular with steam cooking functionality, to washing machines, to dishwashers, to laundry care appliances and to small household appliances.
  • soldering e.g. laser soldering, reflow soldering, iron soldering, etc.
  • solder mass also referred to as solder mass
  • the flux serves to chemically break up the oxide skin.
  • the flux disadvantageously penetrates into the thermally sprayed layer since it is typically slightly porous. It can even penetrate further into underlying porous layers (e.g. an insulation layer) and impair their function. In order to avoid a negative influence of the flux (e.g. deterioration of an electrical insulation property), it has to date been laboriously washed out with solvent.
  • thermally sprayed metals eg copper, tin, bronze
  • solder these metals using classic soldering methods.
  • non-full-surface connection surfaces made of thermally sprayed metals e.g. connection surfaces, Pads, etc.
  • Mask wear is high. An application efficiency is low.
  • DE 10 2012 204 235 A1 discloses a household appliance for preparing food, having a first component and a second component connected to the first component, the first component being made from a first material and the second component being made from a second material that is different from the first material at least at a connection point of the two components and a soldered connection is formed at the connection point for connecting the components, the soldered connection being an ultrasonic soldered connection.
  • DE 10 2012 204 235 A1 also relates to a method for manufacturing a household appliance.
  • EP 0 963 143 A1 discloses a ceramic carrier with an electrical circuit and with a connection device which has at least one metal connection, for example in the form of a threaded bolt.
  • the connection or the connection device is connected to the carrier with compensating means, which consist of a metal with greater deformability than the material of the connection, preferably by means of active soldering.
  • the compensating means can be in the form of an annular disk or the like. be designed and made of copper and compensate for the stresses during cooling.
  • the active solder advantageously has a base of silver and copper and a reactive alloy component, for example titanium or a rare earth metal.
  • the connection device can represent both a heavy-duty mechanical attachment connection for the carrier and an electrical connection for the circuit.
  • DE 20 2010 007 081 U1 discloses a device for producing a gas-tight ultrasonic soldered connection between two different materials as joining partners A and B at low temperatures, which have a corresponding ability to bond with the solder material used, with the following features: a positioning and preheating device for one on the joining device at the bottom Joining partner B, a positioning and laying device for joining partner A to be placed on, a heating and soldering device for jointly heating and soldering joining partners A and B, a removal device for joined joining partners A and B.
  • DE 10 2013 201 386 A1 discloses a hob with a hob plate on which at least one hotplate is formed, and an operating device that includes electronic components that are positioned next to the hotplate in a plan view of the hob plate, and a pot detection device with which the position of a preparation vessel on the hob plate can be identified where the pot detection device has at least one electrically conductive sensor, which is designed as a conductor track on the hob plate and for positional pot detection for electrical interaction with a preparation vessel, and is arranged at least in sections as a surface delimitation for a surface on the hob plate, within which the electronic components are arranged are.
  • a household appliance with a heating device, the heating device having a flat carrier with an electrically insulating carrier surface, at least two layer structures thermally sprayed onto the carrier surface and at least one volume of solder which is applied to at least one thermally sprayed layer structure, the at least one volume of solder is an ultrasonically soldered volume of solder that electrically connects the thermally sprayed layered structure to at least one other thermally sprayed layered structure.
  • This heating device has the advantage that the solder or the solder mass of the solder volume adheres firmly to a thermally sprayed layer structure without any additional auxiliary materials, specifically with a low electrical contact resistance. This is because introducing ultrasonic energy breaks up the oxide skin of the thermally sprayed layered structure. This enables the connection of the solder to the underlying non-oxidized material of the thermally sprayed layer, in particular also without the use of material without organic components, in particular without flux.
  • the solder or the solder mass advantageously has high electrical conductivity.
  • an electrical resistance and a current-carrying capacity of an electrical line or soldered connection formed by the solder are dimensioned such that suitability goes beyond a safety extra-low voltage, specifically in a power range (e.g. from 230 V to more than 8 A).
  • a power range e.g. from 230 V to more than 8 A.
  • the soldered connection is also sufficiently dimensioned for use in the high-voltage range (e.g. from approx. 1250 V AC or 1800 V AC).
  • ultrasonic support it is generally possible to solder solder onto surfaces that cannot be wetted with solder using conventional soldering processes. It is generally possible to wet very heavily oxidized surfaces or non-metallic (e.g. glass-like or ceramic surfaces) firmly and precisely with solder.
  • an exposed ceramic insulation e.g. a ceramic insulating layer
  • soldering material in a simple manner using ultrasonic soldering.
  • ultrasonic soldering is easy to use because it does not need to be masked. Furthermore, compared to the thermal spraying of metallic connection layers, etc., it is significantly more efficient in terms of material utilization (use of material to create the soldering or joining point). In addition, savings in cycle time and costs can be achieved.
  • the ultrasonic soldered connection can be designed to be temperature-stable up to at least 150°C.
  • it can have a thermal expansion coefficient adapted to the substrate and/or the thermally sprayed layer. It is stable to aging over the entire service life of the product, even at high continuous use temperatures.
  • a flat support can be understood to mean, for example, a flat support or a curved support (e.g. in the form of a tube).
  • the carrier can in particular have a plate-like basic shape.
  • the electrically insulating carrier surface can be an electrically insulating layer (e.g. made of ceramic) applied to a base body or substrate of the carrier (e.g. a metal sheet). This layer can also have been thermally sprayed on. However, the electrically insulating carrier surface can also be a surface-treated (e.g. oxidized) layer region of a base body of the carrier.
  • the electrically insulating carrier surface can in particular have a non-negligible porosity. When using soldering flux, this can possibly penetrate into the associated pores and possibly reduce or even practically eliminate an ability for electrical insulation - especially when high voltage is applied.
  • the base body itself is electrically insulating and temperature-resistant (up to at least 150°C)
  • a specially designed superficial layer can also be dispensed with, and the carrier surface then represents the unmodified surface of the base body. This can be the case, for example , if the body is made of ceramic.
  • the carrier surface can be designed to be electrically insulating over its entire surface, at least on one flat side on which there is a thermally sprayed layer or layer structure.
  • the carrier surface is designed to be electrically insulating only underneath electrically conductive layers or layer structures, possibly projecting laterally beyond the layers or layer structures.
  • electrically conductive thermally sprayed layer structures can be thermally sprayed onto layer structures of the same width or somewhat wider from an electrically insulating layer.
  • a thermally sprayed layer can be understood to mean a layer that is produced, for example, by molten pool spraying, arc spraying, plasma spraying (e.g. atmosphere, under protective gas or under low pressure), flame spraying (e.g. powder flame spraying, wire flame spraying or plastic flame spraying), high-velocity flame spraying, detonation spraying, cold gas spraying, laser spraying or PTWA syringes has been produced, in particular sprayed onto the support surface.
  • flame spraying e.g. powder flame spraying, wire flame spraying or plastic flame spraying
  • high-velocity flame spraying e.g. powder flame spraying, wire flame spraying or plastic flame spraying
  • detonation spraying e.g. powder flame spraying, wire flame spraying or plastic flame spraying
  • detonation spraying cold gas spraying
  • laser spraying or PTWA syringes e.g. powder flame spraying, wire flame spraying or plastic flame spraying
  • At least one thermally sprayed layer or layer structure can be, for example, a metallic layer or layer structure, e.g., comprising aluminum (Al), bronze, copper (Cu), silver (Ag), tin (Sn), etc., or an alloy thereof.
  • the thermally sprayed layer can also be a nickel-chromium alloy (NiCr).
  • the thermally sprayed layer can also be a ceramic layer, for example an electrically insulating layer. A surface of the thermally sprayed layer or layered structure may be oxidized.
  • a layered structure is to be understood in particular as a layer which, in plan view, has a shape that differs from the shape of the carrier surface, ie is not a layer that covers the entire carrier surface over its entire surface. Rather, the layered structure on the carrier or on the carrier surface has its own contour (“outer contour”) in plan view, which runs at least partially on the carrier surface (and not only on its edge).
  • the layered structure can be in the form of at least one elongate line track or web.
  • the conduction track can be straight or in sections and/or curved in whole or in sections.
  • the conductor path can have a meandering course.
  • the conductor track can also be in the form of a short strip or a rectangular, round, oval, etc. contact field, for example.
  • An ultrasonically soldered volume of solder is in particular a volume of solder that has been applied by means of an ultrasonic soldering process.
  • At least one thermally sprayed layer structure is a resistance heating conductor layer, in particular a thick layer.
  • the heating conductor layer can in particular be an elongate heating conductor track.
  • the heating conductor track can, for example, run in a meandering or spiral shape.
  • Solder mass can, in particular, in the area at least one end of the heating conductor layer - in particular heating conductor track - are applied in order to connect them electrically.
  • aluminum, an aluminum compound or a nickel-chromium compound can be provided as the material of the heating conductor layer.
  • the heating conductor layer can therefore in particular represent a thermally sprayed surface heating for household appliances.
  • Another configuration is that at least one ultrasonically soldered volume of solder electrically connects the thermally sprayed layer structure to at least one other component of the heating device.
  • At least one volume of solder soldered on by ultrasound is a volume of solder produced in one step or in one stage, which enables a particularly simple and rapid electrical connection.
  • the volume of solder can, for example, be applied between the thermally sprayed layer structure and another component in one operation using an ultrasonic soldering iron.
  • At least one ultrasonically soldered volume of solder is electrically connected to at least one other component of the heating device by means of a further volume of solder that is not applied by ultrasound.
  • part of a soldered connection can also be produced by means of another soldering process (eg laser soldering, reflow soldering, hand soldering, etc.), which enables a particularly diverse range of options for applying the solder volume.
  • a different soldering process can thus bring about a soldering more gently for certain surfaces and/or for complex geometries simply and more quickly.
  • a solder volume can first be ultrasonically soldered onto a thermally sprayed layer and then the ultrasonically soldered solder volume can be electrically further connected via a solder volume applied by other means.
  • the ultrasonically soldered volume of solder thus serves as the basis or ground for the volume of solder not applied by ultrasound.
  • the application of solder volumes by different soldering processes can be carried out in particular within the framework of a multi-stage, for example two-stage, process.
  • a further configuration is that at least one other component of the heating device is a further thermally sprayed layer structure on which at least one ultrasonically soldered solder volume is present. Then, for example, in a first stage, both thermally sprayed layer structures (generally: joining partners) can be provided with an ultrasonically soldered solder volume and then, in a second stage, the two ultrasonically soldered solder volumes can be connected to one another using a different soldering process.
  • both thermally sprayed layer structures generally: joining partners
  • a layer structure produced using arc spraying can be connected to a layer structure produced using atmospheric plasma spraying, which are separated from one another by a laser cut.
  • thermally sprayed conductor tracks across gaps (e.g. laser cuts). This can be used, for example, for subsequent adjustment of the electrical resistance of a thermally sprayed heating conductor, in order to guarantee a required nominal output of the heating device ("trimming") and/or to repair defects in thermally sprayed conductor tracks (e.g. heating conductor tracks).
  • soldering volume is or has also been ultrasonically soldered in the second stage. This corresponds to a two-stage ultrasonic soldering of at least one thermally sprayed layer structure.
  • At least one other component of the heating device is a metallic contact. Then, for example, in a first stage, the thermally sprayed layer structure can be provided with an ultrasonically soldered volume of solder and then, in a second stage, the ultrasonically soldered volume of solder can be directly connected to the metallic contact by means of another soldering process.
  • the metallic contact can be, for example, a contact field applied to the carrier surface by electroplating, application of a metallic foil, etc., for example a contact element, for example made of copper.
  • the metallic contact is a contact element of an electrical or electronic component, for example a contact pin of a plug connection part (e.g. connector plug) or an electrical connection of an electrical or electronic component (e.g. a contact area of an SMD component such as an NTC resistor, a fuse, a sensor - e.g. encapsulated in glass solder - etc.).
  • an electrical or electronic component e.g. an SMD (“Surface Mounted Device") component.
  • SMD Surface Mounted Device
  • the SMD component (e.g. size 0603, 0805 or 1206) can be placed using a vacuum gripper.
  • Wired components that are intended for through-hole mounting (“THT-Through Hole Technology") can also be connected to the thermally sprayed structure via their metallic contact.
  • At least one ultrasonically soldered volume of solder covers at least a section of the thermally sprayed layer structure—in particular a heating conductor layer—without electrically connecting it to another—in particular electrically conductive—component of the heating device.
  • at least one layer of solder also referred to as “conductive layer” can be applied to the heating conductor layer in order to locally reduce an electrical power density in the heating conductor layer. This in turn can prevent local heating (so-called "hot spots").
  • a conductive layer can be applied, for example, to power connections, to construction-related constrictions in conductor tracks, to corners and/or to reversal points in the heating conductor layout.
  • the conductive layer or the soldering material can also rest on the carrier surface.
  • the household appliance can be, for example, a cooking appliance or an accessory for a cooking appliance (eg a heatable cooking space divider).
  • the cooking appliance can have a steam cooking function, for example, with the heating device being assigned to a steam generating device is to evaporate water present in the steam generating device.
  • the cooking appliance can be, for example, an oven with steam cooking functionality or a dedicated steam cooker.
  • the heating device may then represent, for example, a bottom of a water tank.
  • At least one thermally sprayed layer structure can be present on one or both sides, in particular at least one heating conductor layer (structure).
  • the household appliance can also be a laundry care appliance.
  • the heating device can then be used, for example, as a base heater for a washing machine or a washer-dryer.
  • the heating device can also be provided as a process air heater.
  • the household appliance can also be a dishwasher.
  • the heating device can then be used, for example, as a heater for heating the rinsing liquid.
  • the heater is in particular a component of a heat pump assembly.
  • the household appliance can also be an electrically operated small household appliance, e.g. a kettle, a coffee machine (e.g. in the form of an espresso machine), a toaster, etc.
  • a coffee machine e.g. in the form of an espresso machine
  • a toaster e.g. a toaster
  • the heating device can be designed as a tube (generally: a rotationally symmetrical body), with at least one thermally sprayed thick-film heating conductor being present on a wall of the tube of the household appliance.
  • the tube can then be used or viewed in particular as a continuous-flow heater for gas (e.g. process air) and/or liquid (e.g. water to be evaporated, rinsing liquid or lye) passed through there.
  • gas e.g. process air
  • liquid e.g. water to be evaporated, rinsing liquid or lye
  • the object is also achieved by a method for producing a heating device for a household appliance, in which a flat (flat and/or curved) carrier with at least one thermally sprayed layer structure applied thereto is provided and at least one solder volume is ultrasonically is soldered.
  • a method for producing a heating device for a household appliance in which a flat (flat and/or curved) carrier with at least one thermally sprayed layer structure applied thereto is provided and at least one solder volume is ultrasonically is soldered.
  • At least one thermally sprayed layer structure is ultrasonically soldered to another component of the heating device in a single stage.
  • a trace of solder can be drawn from the at least one thermally sprayed layer structure to the other component in one operation, e.g. using an ultrasonic soldering iron.
  • At least one thermally sprayed layer structure is ultrasonically soldered to another component of the heating device in two stages, in that in a first stage a solder volume is applied to at least one thermally sprayed layer structure by ultrasonic soldering and this solder volume is applied to the other in a second stage Component of the heater is soldered.
  • the second stage soldering can be performed with or without ultrasound.
  • the other component of the heating device is a thermally sprayed layer structure on which a solder volume is applied by ultrasonic soldering in the first stage and this ultrasonically applied solder volume is soldered to another ultrasonically applied solder volume of the heating device in the second stage will.
  • the ultrasonic soldering is carried out by means of an ultrasonic soldering iron.
  • the ultrasonic soldering iron can have a sonotrode, for example, which is designed as a soldering tip.
  • the ultrasonic soldering is carried out by means of an ultrasonic soldering bath (or soldering bath).
  • a component to be wetted with solder can be immersed in a solder bath before or after assembly on the carrier. The wetting of this component therefore does not have to be carried out on the carrier, which enables simplified production.
  • the respective individual steps can optionally be improved by a heat treatment process (eg by preheating) of the component.
  • Fig.1 1 shows a top view of a heating device 1 of a household appliance H.
  • the heating device 1 can be used, for example, to heat water in a water tank of a steam generator.
  • the household appliance H can also be an oven with steam cooking functionality, a dedicated steam cooker, an electrically heatable cooking space divider, a laundry care appliance, a dishwasher, a small household appliance, etc.
  • the heating device 1 has a flat support 2 (e.g. made of sheet metal) with an electrically insulating support surface 3 (e.g. made of a slightly porous, for example thermally sprayed ceramic layer).
  • a plurality of metallic layer structures 4 to 8 are thermally sprayed onto the carrier surface 3 .
  • the thermally sprayed layer structures 4 to 8 are electrically insulated from one another by the carrier surface 3 and comprise: a first (long) meandering heating conductor track 4, a second (short) meandering heating conductor track 5 and three short straight conductor tracks 6 to 8.
  • the two heating conductor tracks 4 and 5 are electrically connected to one another by two traces 9 made of a first solder or solder material 10 . As a result, the two heating conductors 4 and 5 electrically connected in series. If the second heating conductor track 5 is not to be used, instead of the two tracks 9, the two corresponding ends of the first heating conductor track 4 could be connected to one another directly by means of a track made of the first soldering material 10 (not illustrated).
  • the electrical resistance can also be precisely trimmed in that a position of the lower track 9 between the heating conductor tracks 4 and 5 can be varied, as indicated by the double arrow.
  • the common heating conductor track 4, 5 can consequently be trimmed by suitably attaching the tracks 9.
  • the trace 9 of the first soldering material 10 has been ultrasonically soldered in one step from the surface of the first heating conductor 4 via the carrier surface 3 to the surface of the second heating conductor 5 . Due to the introduced ultrasonic energy, the first soldering material 10 holds both on the heating conductor tracks 4 and 5 and on the carrier surface 3 without the need for soldering flux.
  • the trace 9 can be applied, for example, by soldering with an ultrasonic soldering iron.
  • the three linear thermally sprayed conductor tracks 6 to 8 are connected to a connector plug 11 of the heating device 1, in particular to a respective electrical contact 11a of the connector plug 11.
  • Adjacent conductor tracks 6 and 7 or 7 and 8 are connected via respective SMD components 12.
  • the SMD components 12 are NTC resistors here, for example, which have electrical contacts or contact pads 14 in the form of soldering connections on their end regions.
  • measured values eg electrical resistance values, voltage values or current values belonging to a respective temperature can be tapped via the plug trough 11 .
  • the SMD components 12 are attached to the conductor tracks 6 and 7 or 7 and 8 via solder points 13 made of the first solder material 10 and a second solder material 15, as in FIG Fig.3 shown as section BB from heater 1.
  • solder points 13 made of the first solder material 10
  • a second solder material 15 as in FIG Fig.3 shown as section BB from heater 1.
  • the conductor tracks 6 and 7 or 7 and 8 have been ultrasonically soldered with a volume of solder made of the first soldering material 10 .
  • the SMD components 12 have been placed with their contact pads 14 on the respective solder volumes of the soldering material 10 .
  • soldering volumes of the soldering material 10 are connected to the associated contact pads 14 by means of a non-ultrasonic soldering process (eg, laser soldering, reflow soldering, hand soldering, etc.) using the second solder material 15 has been soldered.
  • a non-ultrasonic soldering process eg, laser soldering, reflow soldering, hand soldering, etc.
  • the first solder material 10 and the second solder material 15 can be the same or different.
  • the two conductor tracks 7 and 8 are electrically connected to one another by the SMD component 12 via the soldering points 13, which have (partial) solder volumes 13a and 13b made of the first soldering material 10 and the second soldering material 15, respectively.
  • the electrical contacts 11a e.g. contact pins or contact pins
  • the electrical contacts 11a of the connector plug 11 can also be attached to the conductor tracks 6 to 8, whereby they can have been immersed in a solder bath (not shown) before the connector plug 11 was installed.
  • the solder bath can work with or without the introduction of ultrasound.
  • the solder material applied in the solder bath can be, for example, one of the solder materials 10 or 15.
  • Fig.4 shows a section CC from the heating device 1 as a sectional view in a side view.
  • solder volume (solder point) 17 made of the first solder material 10 has been ultrasonically soldered and then a track 18 made of the second solder material 15 has been drawn from the solder volume 17 to the metallic contact surface 16, or vice versa, using a different soldering method (not based on ultrasound).
  • the two thermally sprayed heating conductor tracks 4 and 5 could also each be provided with ultrasonically soldered solder volumes 17 made from the first solder material 10 , which are connected to one another via a track 18 made from the second solder material 15 .
  • a conductive layer 19 has only been ultrasonically soldered onto the heating conductor 4 and possibly the carrier surface 3 in order to reduce a current density there and thus prevent the formation of so-called "hot spots", as in section DD in Fig.5 shown.
  • a numerical specification can also include exactly the specified number as well as a usual tolerance range, as long as this is not explicitly excluded.

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Claims (14)

  1. Appareil ménager (H) avec un dispositif de chauffe (1), dans lequel le dispositif de chauffe (1)
    - présente un support plan (2) avec une surface de support (3)
    - au moins deux structures stratifiées (4-8) pulvérisées thermiquement sur la surface de support (3) et
    - au moins un volume de brasage (9, 13a, 13b, 17, 18, 19), apposé sur au moins deux structures stratifiées (4-8) pulvérisées thermiquement, caractérisé en ce que
    - la surface de support (3) est une surface de support électriquement isolante,
    - au moins un volume de brasage est un volume de brasage brasé par ultrasons (9, 13a, 17, 19),
    - qui relie électriquement la structure stratifiée (4-8) pulvérisée thermiquement à au moins une structure stratifiée (4, 5) pulvérisée thermiquement supplémentaire.
  2. Appareil ménager (H) selon la revendication 1, caractérisé en ce qu'au moins une structure stratifiée (4, 5) pulvérisée thermiquement est une couche conductrice chauffante à résistance.
  3. Appareil ménager (H) selon la revendication 2, caractérisé en ce que
    - les deux structures stratifiées (4-8) pulvérisées thermiquement et reliées électriquement par le volume de brasage (9, 13a, 17, 19) brasé par ultrasons sont des bandes conductrices chauffantes oblongues et
    - le volume de brasage (9, 13a, 17, 19) brasé par ultrasons relie les bandes conductrices chauffantes l'une à l'autre par-delà un espace les séparant.
  4. Appareil ménager (H) selon l'une des revendications précédentes, caractérisé en ce que la surface de support (3) est poreuse.
  5. Appareil ménager (H) selon l'une des revendications précédentes, caractérisé en ce qu'au moins un volume de brasage brasé par ultrasons (13a, 17, 19) est reliée électriquement à au moins un autre composant du dispositif de chauffe (1) au moyen d'un volume de brasage supplémentaire (13b, 18) qui n'est pas apposé par ultrasons.
  6. Appareil ménager (H) selon l'une des revendications précédentes, caractérisé en ce que le volume de brasage brasé par ultrasons (9) s'étend sous la forme d'une trace d'une surface de la structure stratifiée (4) pulvérisée thermiquement via la surface de support (3) vers une surface de la structure stratifiée pulvérisée thermiquement (5) supplémentaire.
  7. Appareil ménager (H) selon l'une des revendications 3 à 6, caractérisé en ce qu'au moins un autre composant du dispositif de chauffe (1) est en outre un contact métallique (11a, 14, 16).
  8. Appareil ménager (H) selon la revendication 7, caractérisé en ce que le contact métallique est un contact (11a, 14) d'un composant électrique ou électronique (11, 12).
  9. Appareil ménager (H) selon l'une des revendications précédentes, caractérisé en ce qu'au moins un volume de brasage brasé par ultrasons (19) couvre en outre au moins une section de la structure stratifiée (4) pulvérisée thermiquement sans la relier électriquement à un autre composant électriquement conducteur du dispositif de chauffe (1).
  10. Appareil ménager (H) selon l'une des revendications précédentes, caractérisé en ce que l'appareil ménager est un appareil de cuisson.
  11. Procédé de fabrication d'un dispositif de chauffe (1) pour un appareil ménager (H), dans lequel
    - un support plan (2) avec une surface de support (3) électriquement isolante et avec au moins deux structures stratifiées (4-8) pulvérisées thermiquement y apposées sous la forme de bandes conductrices chauffantes oblongues, séparées les unes des autres par un espace, est mis à disposition et
    - les deux structures stratifiées (4-8) sont reliées électriquement au moyen d'au moins un volume de brasage (9, 13a, 17, 19) brasé par ultrasons sur les deux structures stratifiées (4-8).
  12. Procédé selon la revendication 11, dans lequel au moins une structure stratifiée (4, 5) pulvérisée thermiquement est brasée par ultrasons en une seule étape avec un autre composant (5, 4) du dispositif de chauffe (1).
  13. Procédé selon l'une des revendications 11 ou 12, dans lequel au moins une structure stratifiée (4, 6-8) pulvérisée thermiquement est brasée par ultrasons en deux étapes avec un autre composant (5, 11a, 12) du dispositif de chauffe (1), en apposant dans une première étape au moins sur au moins une structure stratifiée (4, 6-8) pulvérisée thermiquement un volume de brasage (13a, 17) par brasage aux ultrasons et en brasant dans une deuxième étape ce volume de brasage (13a, 17) avec l'autre composant (5, 11a, 12) du dispositif de chauffe (1).
  14. Procédé selon la revendication 13, dans lequel l'autre composant du dispositif de chauffe (1) est une structure stratifiée pulvérisée thermiquement, sur laquelle un volume de brasage est apposé par brasage aux ultrasons dans la première étape et ce volume de brasage apposé par ultrasons est brasé avec un autre volume de brasage apposé par ultrasons du dispositif de chauffe (1) dans la deuxième étape.
EP16740977.0A 2015-07-31 2016-07-01 Liaison thermique de structures de couches pulvérisées de dispositifs de chauffage Active EP3329737B1 (fr)

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DE102015214627.8A DE102015214627A1 (de) 2015-07-31 2015-07-31 Verbinden thermisch aufgespritzter Schichtstrukturen von Heizeinrichtungen
PCT/EP2016/065541 WO2017021076A1 (fr) 2015-07-31 2016-07-01 Liaison thermique de structures de couches pulvérisées de dispositifs de chauffage

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EP3329737B1 true EP3329737B1 (fr) 2022-04-13

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CN107926084B (zh) 2021-07-27
WO2017021076A1 (fr) 2017-02-09
EP3329737A1 (fr) 2018-06-06
US20180213607A1 (en) 2018-07-26
CN107926084A (zh) 2018-04-17
PL3329737T3 (pl) 2022-07-25
US11641698B2 (en) 2023-05-02
DE102015214627A1 (de) 2017-02-02

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