EP3329736B1 - Dispositif de chauffage pour appareil ménager - Google Patents

Dispositif de chauffage pour appareil ménager Download PDF

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Publication number
EP3329736B1
EP3329736B1 EP16734370.6A EP16734370A EP3329736B1 EP 3329736 B1 EP3329736 B1 EP 3329736B1 EP 16734370 A EP16734370 A EP 16734370A EP 3329736 B1 EP3329736 B1 EP 3329736B1
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EP
European Patent Office
Prior art keywords
heating device
thermally sprayed
layer structure
layer
electrically
Prior art date
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EP16734370.6A
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German (de)
English (en)
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EP3329736A1 (fr
Inventor
Stefan Kobler
Robert KÜHN
Philipp Schaller
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BSH Hausgeraete GmbH
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BSH Hausgeraete GmbH
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Application filed by BSH Hausgeraete GmbH filed Critical BSH Hausgeraete GmbH
Priority to PL16734370T priority Critical patent/PL3329736T3/pl
Publication of EP3329736A1 publication Critical patent/EP3329736A1/fr
Application granted granted Critical
Publication of EP3329736B1 publication Critical patent/EP3329736B1/fr
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible

Definitions

  • the invention relates to a heating device for a household appliance, comprising a flat carrier with an electrically insulating carrier surface, at least one electrically conductive layer structure thermally sprayed onto the carrier surface and at least one electrically conductive contact volume which is applied to at least one thermally sprayed layer structure.
  • the invention also relates to a household appliance with such a heating device.
  • the invention also relates to a method for electrically connecting a thermally sprayed-on layer structure of a household appliance.
  • the invention is particularly advantageously applicable to cooking appliances, in particular steamers, to water-bearing laundry care appliances, to dishwashers and to small household appliances.
  • solder or soldering compound is used as the contact volume.
  • a flux must be used so that the solder adheres to the layer structure.
  • the flux can be absorbed by the layer structure, which is usually slightly porous. This can negatively affect the connection of the solder to the thermally sprayed-on layer structure and the properties of the thermally sprayed-on layer structure itself. If the layer structure is also applied to a porous insulation layer, the flux can penetrate into the insulation layer and adversely affect the electrical insulation properties.
  • DE 31 09 250 A1 discloses an electrical household appliance with housing parts made of electrically conductive material, which are connected to one another in an electrically conductive manner for electrical protective grounding. A reliable grounding of the various conductive parts is to be achieved with low manufacturing costs.
  • an electrically conductive adhesive compound serve as the electrically conductive connection.
  • An electrically conductive adhesive for example an organic silicone adhesive with metal powder or carbon as filler, is preferably used as the adhesive mass. The adhesive retains a certain elasticity even after it has hardened, which prevents the contact from being interrupted by thermal expansion.
  • DE 39 13 028 A1 discloses a method and a device for producing a conductive connection in an electrical device, in which at least two contact elements to be connected in an electrically conductive manner are attached to an insulating part at a distance from one another.
  • the method and the device for producing a conductive connection are characterized in that an electrically conductive paste is applied to the insulating part by means of a multi-axis positioning unit, which paste connects the contact elements applied to the insulating part with one another.
  • no contacting of thermally sprayed-on layer structures is addressed here.
  • DE 42 06 700 A1 discloses a contacting of the conductor tracks arranged parallel next to one another on a carrier with conductor tracks correspondingly arranged parallel next to one another on a flexible conductor foil, the interconnected conductor tracks of the carrier and conductor foil being brought into overlap and conductively connected to one another.
  • an adhesive consisting of an insulating material and containing a large number of approximately evenly distributed electrically conductive granules is arranged, by means of which the carrier and conductor foil are connected to one another.
  • the conductive grains are in contact with one another and with the conductor tracks and form a conductive connection between the conductor tracks of the carrier and conductor foil assigned to one another.
  • no contacting of thermally sprayed-on layer structures is addressed.
  • DE 10 2013 109 755 A1 discloses a conductive adhesive comprising at least one type of anisotropic conductive nanomaterial and at least one type of photoinduced polymerizable material. Contacting of layer structures is not addressed.
  • EP 0 681 712 B1 discloses an electro-optic thin film device having an electrically responsive layer having optical properties that change under the action of a current or electric field applied to the layer; at least one electrode extending beyond the electrically responsive layer and capable of delivering an electrical current to the electrically responsive layer; and an electrical connector extending along a single edge of the device and is configured to supply electrical power to the electrode from a power source, the electrical connector comprising: flexible insulation having an electrically conductive portion on at least one surface that is capable of electrical contact between the Electrode and a power source, an electrically conductive adhesive disposed on the electrically conductive portion of the insulation near the electrode to make electrical contact with the electrode, the electrically conductive adhesive having electrically conductive particles overlying an entire adhesive matrix are distributed away, and a connecting device which is in electrical contact with the electrically conductive portion of the insulation and is capable of making electrical contact with a power source, wherein at least a portion of the insulation in a portion of the electrically claimed The same layer of the device is introduced, and that the
  • EP 0 963 143 A1 discloses a ceramic carrier with an electrical circuit and a connection device which has at least one metallic connection, for example in the form of a threaded bolt.
  • the connection or the connection device are connected to the carrier with compensating means, which consist of a metal with a higher deformability than the material of the connection, preferably by means of active soldering.
  • the compensating means can or the like in the form of an annular disk. be designed and made of copper and equalize the stresses during cooling.
  • the active solder advantageously has a base made of silver and copper and a reactive alloy component, for example titanium or a rare earth metal.
  • the connection device can represent both a heavy-duty mechanical fastening connection for the carrier and an electrical connection for the circuit.
  • WO 97/42638 discloses a method for electrically conductive and low-tension bonding of sensitive and precisely positioned workpieces with possibly different thermal expansion coefficients, in which the adhesive is applied, then the curing reaction is triggered photochemically and then within one second the workpieces to be bonded can be positioned within 15 minutes.
  • An adhesive formulation is used which is a one-component, storage-stable at room temperature and filled with metal particles.
  • WO 98/44593 discloses an electrical connection arrangement for connecting a circuit carrier with conductor tracks of a conductor track carrier, the circuit carrier and the conductor track carrier being carried by a base plate, the circuit carrier and the conductor track carrier having an area in which they overlap, and the circuit carrier in the area of the overlap by means of a electrically conductive adhesive is electrically connected to the conductor carrier.
  • WO 98/44593 further discloses a method for electrically connecting a circuit carrier with conductor tracks of a conductor track carrier, wherein the conductor track carrier is fixed on a base plate, the conductor track carrier is electrically connected on its side facing away from the base plate in an area that is free of an insulating cover opposite a conductor track Provided conductive adhesive, and a circuit carrier is glued to the conductor track carrier, so that an electrical connection is created between a conductor track of the conductor track carrier and a contact point of the circuit carrier.
  • DE 10 2012 212 798 A1 discloses a heating element with at least one thermoelectric heating element, the heating element being at least partially formed with a conductive material and the heating element being able to be supplied with electrical energy via at least two conductor tracks.
  • the conductor tracks are formed by means of a thermal spraying process, in particular by plasma spraying in accordance with DIN 657.
  • a thermal spraying process in particular by plasma spraying in accordance with DIN 657.
  • the thermally sprayed-on conductor tracks there is a good electrical connection between the conductor tracks and the conductive particles within the matrix of the conductive material of the heater.
  • there is a mechanically resilient connection of the conductor tracks to the radiator can be given a variety of three-dimensional shapes, resulting in a variety of uses for the heating element.
  • the heating element can have the shape of a pipe-like fluid line, so that the heating element, in addition to its actual heating function, can also fulfill other structurally prescribed tasks at the same time. Due to this functional integration or dual functionality, when using the heating element, there are significant structural simplifications and optimization options that hold considerable potential for cost savings. In addition, a method is disclosed, in particular for producing the heating element, as well as uses of the heating element as the subject matter.
  • a heating device for a household appliance having a flat carrier with an electrically insulating surface (hereinafter referred to as “carrier surface” without loss of generality), at least one electrically conductive layer structure thermally sprayed onto the carrier surface and at least one electrically conductive layer structure Contact volume which is applied to at least one thermally sprayed-on layer structure, at least one contact volume consisting of electrically conductive adhesive (hereinafter referred to as “conductive adhesive” without restricting the generality).
  • the conductive adhesive is a reactive one-component (1-component) conductive adhesive. This has the advantage of being particularly easy to use.
  • the 1-component conductive adhesive can be premixed by the adhesive manufacturer, i.e. that, for example, resin and a hardener are already mixed in the correct mixing ratio. The hardening reaction can be greatly delayed by storage at low temperatures.
  • conductive adhesive has the advantage that it has good adhesive strength on the thermally sprayed-on layer or layer structure, especially on porous layers.
  • flux As in traditional soldering. In classic soldering with flux, this penetrates the porous, thermally sprayed layers. In order to avoid a negative influence of the flux, it has to be washed out with solvent. This step can now be saved. In contrast to soldering, a solder mask can also be dispensed with.
  • the precisely adjustable viscoelasticity of the conductive adhesive results in a high level of application accuracy.
  • the conductive adhesive is also suitable for small contact areas, so that even small amounts of adhesive can be implemented with precise positioning and without splashes.
  • the thixotropy of the adhesive system can be adjusted so that after a component has been positioned or placed, it is held in its position.
  • Another advantage of using the conductive adhesive is its good adhesion, even on smooth, non-porous surfaces, e.g. on compact, polished surfaces.
  • the conductive adhesive can easily be adjusted so that practically no or only little adhesive penetrates the thermally sprayed-on layer structure or another porous substrate, so that properties of the substrate, for example insulation properties, are not adversely affected. Furthermore, there is only a slight ionic contamination, which helps to avoid corrosion at the contact point. If the non-electrically conductive, organic adhesive penetrates the thermally sprayed-on layer structure or another porous substrate (which is also known as bleeding (resin bleeding) is), this has no negative effects on the electrical properties of the thermally sprayed-on layer structure.
  • hardened conductive adhesive can be designed to be temperature-stable up to at least 150 ° C. It has good mechanical strength and an adapted coefficient of thermal expansion, for example when exposed to thermal cycling. Even at high continuous use temperatures, it is sufficiently resistant to aging over the entire service life of the product.
  • conductive adhesive provides a contact volume with good electrical conductivity (for example of at least 1 * 10 6 S / m, in particular at least 1.5 * 10 6 S / m). This results in a low contact resistance between the conductive adhesive and the thermally sprayed-on layer structure.
  • the resulting connection also has a low temperature coefficient, with in particular electrical properties of the conductive adhesive, such as its resistance, not increasing significantly over the service life of the product.
  • a conductive adhesive can in particular be understood to mean an adhesive with a matrix of viscous, in particular pasty, adhesive (e.g. resin, in particular epoxy resin) with electrically conductive particles as filler material.
  • the adhesive can generally have one or more polymers.
  • the filler material can, for example, comprise metal particles such as copper, silver and / or gold particles, but also other electrically conductive and temperature-resistant materials such as certain types of carbon (e.g. CNTs).
  • the particles can be powder particles.
  • the conductive adhesive has a high or medium viscosity for processing and is solid in its final state.
  • the conductive adhesive shrinks (chemical volume shrinkage due to crosslinking reaction), so that the electrically conductive particles touch each other and consequently can form point, line and / or surface contacts, which in turn can form current paths in the conductive adhesive.
  • the adhesive is preferably addition-crosslinking, so that no chemical cleavage products are formed during curing that escape / evaporate from the material, as is the case, for example, with silicones, which are referred to as "condensation-crosslinking".
  • silicones which are referred to as "condensation-crosslinking”.
  • a flat carrier can be understood to mean, for example, a flat carrier or a curved carrier (e.g. in the form of a tube).
  • the carrier can in particular have a plate-like basic shape.
  • the electrically insulating carrier surface can be an electrically insulating layer (e.g. made of ceramic) applied to a base body or substrate of the carrier (e.g. a metal sheet). This layer can also have been thermally sprayed on.
  • the electrically insulating support surface can, however, also be a surface-treated (e.g. oxidized) layer area of a base body of the support.
  • the electrically insulating support surface can in particular have a non-negligible porosity. When using solder flux, it can penetrate the associated pores and possibly reduce the ability to provide electrical insulation or lead to a breakdown when high voltage is applied (e.g. of more than 1000 V).
  • the base body itself is electrically insulating and temperature-resistant (up to at least 150 ° C)
  • a specially designed superficial layer can be dispensed with, and the carrier surface then represents the unmodified surface of the base body. This can be the case, for example if the base body is made of ceramic.
  • a thermally sprayed-on layer can be understood to mean a layer that is produced, for example, by molten bath spraying, arc spraying, plasma spraying (e.g. atmosphere, under protective gas or under low pressure), flame spraying (e.g. powder flame spraying, wire flame spraying or plastic flame spraying), high-speed flame spraying, detonation spraying, cold gas spraying or PTWA syringes have been produced, in particular sprayed onto the carrier surface.
  • At least one thermally sprayed-on layer or layer structure can be, for example, a metallic layer or layer structure, for example comprising aluminum (Al), bronze, copper (Cu), silver (Ag), tin (Sn) etc., or an alloy thereof.
  • the thermally sprayed-on layer can also be a nickel-chromium alloy (NiCr).
  • the thermal The sprayed-on layer can also be a ceramic layer, for example an electrically insulating layer. A surface of the thermally sprayed-on layer or layer structure can be oxidized.
  • the thermally sprayed-on layer or layer structure can be at least partially covered by at least one further layer.
  • This at least one further layer can represent a ("contact") layer for improved electrical contacting, in particular made of metal, e.g. a layer made of tin, copper, silver and / or gold.
  • the conductive adhesive can be applied to the thermally sprayed-on layer structure via the contact layer.
  • a layer structure is understood to mean, in particular, a layer which, in plan view, has a shape different from the shape of the carrier surface, that is to say is not a layer that completely covers the entire carrier surface. Rather, the layer structure on the carrier or on the carrier surface in plan view has its own contour (“outer contour”) which runs at least partially on the carrier surface (and not only on its edge).
  • the layer structure can in particular be in the form of at least one elongate line track or path.
  • the conduction path can be completely or partially straight and / or completely or partially curved.
  • the conduction path can have a meandering course.
  • the conduction path can, however, also be in the form of a short strip or a rectangular, round, oval, etc. contact field, for example.
  • a contact volume is understood to mean, in particular, a mass volume made of electrically conductive contact material, namely the conductive adhesive here.
  • At least one thermally sprayed-on layer structure is a resistance heating conductor layer, in particular a thick layer.
  • the heat conductor layer can in particular be an elongate heat conductor track.
  • the heating conductor track can, for example, run in a meander shape or in a spiral shape.
  • Solder mass can be applied in particular in the region of at least one end of the heating conductor layer in order to connect it electrically.
  • aluminum, an aluminum compound or a nickel-chromium compound can be provided as the material of the heating conductor layer.
  • the heat conductor layer can therefore in particular represent a thermally sprayed surface heating for household appliances.
  • the thermally sprayed-on layer structure - in particular also a heating conductor layer - is connected to a further electrically conductive area of the heating device by means of a trace of conductive adhesive.
  • the further electrically conductive area can be, for example, a further heating conductor layer or an electrical connection contact (e.g. in the form of a thermally sprayed-on layer structure or as a metallic contact field).
  • the conductive adhesive can also partially run on the carrier surface in this development.
  • the thermally sprayed-on layer structure is medium permeable to solder (flux). If solder flux penetrated the layers, the electrical properties and corrosion stability of the thermally sprayed-on layer structure could be adversely affected.
  • the conductive components (i.e. the electrically conductive filler) of the conductive adhesive cannot enter the thermally sprayed-on layer structure, so that a negative influence on the layer properties is avoided.
  • the thermally sprayed-on layer structure is therefore impermeable to the conductive parts of the conductive adhesive.
  • the thermally sprayed-on layer structure can also be impermeable to the adhesive or only partially (slightly) permeable.
  • the carrier surface - possibly also thermally sprayed on - is permeable to solder flux. If solder flux penetrated the carrier surface, the electrical properties and corrosion stability of the carrier surface could be adversely affected. In contrast, the conductive components (ie the electrically conductive filler) of the conductive adhesive cannot penetrate the carrier surface, so that a negative influence on its properties is avoided as a result.
  • the carrier surface is therefore impermeable to the conductive parts of the conductive adhesive.
  • the carrier surface can also be impermeable to the adhesive or only partially (slightly) permeable.
  • the curing can take place at room temperature or preferably at an elevated temperature (for example in an oven). Higher temperatures accelerate the curing reaction and improve the electrical properties. If necessary, this can harden can also be carried out by means of a photoinitiator contained in the adhesive.
  • adhesives are also referred to as UV or light-curing adhesives.
  • At least one contact volume connects two thermally sprayed-on layer structures - in particular conductor tracks - and for this purpose rests on the carrier surface present between the layer structures.
  • two or more electrically separate sections of a line can also be connected to one another, e.g. two or more heating conductor layers (in particular heating conductor tracks) - for example running parallel to one another - to form a common heating conductor or heating element.
  • This can be used, for example, for the subsequent adjustment of the electrical resistance of a thermally sprayed-on heating conductor in order to guarantee the required nominal output of the heating device ("trimming") and / or to repair defects in thermally sprayed-on conductor tracks (e.g. heating conductor tracks).
  • At least one contact volume connects a thermally sprayed-on layer structure with an electrical contact field of an in particular surface-mountable component - also referred to as an SMD ("Surface Mounted Device") component.
  • SMD Surface Mounted Device
  • thermally sprayed-on layer structures and electrical and / or electronic components can be connected to one another in a particularly simple and inexpensive manner.
  • a particularly small volume of conductive adhesive or "conductive adhesive point" is applied to the thermally sprayed layer structure by means of a dispenser and the SMD component with its contact surfaces (terminals) is pressed onto the conductive adhesive point before the conductive adhesive hardens. The conductive adhesive then hardens, for example by means of an oven process.
  • the SMD component is then securely attached to the thermally sprayed layer or layer structure.
  • the SMD component eg size 0603, 0805 or 1206
  • the SMD component can be positioned or placed using a vacuum gripper.
  • so-called “underfillers” can be dispensed with, some of which are necessary with SMD soldering so that the SMD component does not change its intended position during the soldering process.
  • Wired components that are intended for through-hole assembly THT; "Through Hole Technology” can also be connected to the thermally sprayed-on structure by means of the conductive adhesive via their metallic contact.
  • the SMD component can, for example, be a heat-sensitive resistor (e.g. an NTC resistor), a fuse, a sensor, etc.
  • a heat-sensitive resistor e.g. an NTC resistor
  • two thermally sprayed-on conductor tracks are electrically connected to one another by an electrical component, with contact fields of the component being connected to the respective conductor tracks via adhesive dots made of the electrically conductive adhesive.
  • At least one contact volume made of conductive adhesive covers at least one section of the thermally sprayed-on layer structure - in particular a heating conductor layer - without electrically connecting it to another component of the heating device.
  • at least one contact volume made of conductive adhesive can be applied to the heating conductor layer in order to locally reduce an electrical current density in the heating conductor layer. This in turn can prevent local overtemperature (so-called "hot spots").
  • a conductive layer can be applied, for example, to power connections, to constrictions in conductor tracks due to the design, to corners and / or to reversal points in the heating conductor layout.
  • the conductive layer or the conductive adhesive can also rest on the carrier surface.
  • the object is also achieved by a household appliance with at least one heating device as described above.
  • the household appliance has the same advantages as the heating device and can be designed analogously.
  • the household appliance can be, for example, a cooking appliance or an accessory for a cooking appliance (for example a heatable cooking space divider).
  • the cooking appliance can, for example, have a steam cooking function, the heating device being assigned to a steam generating device in order to evaporate water present in the steam generating device.
  • the cooking device can be, for example, an oven with steam cooking functionality or a dedicated steam cooker.
  • the heating device may then represent, for example, the bottom of a water tank.
  • At least one thermally sprayed-on layer structure can be present on one or both sides, in particular at least one heating conductor layer.
  • the household appliance can also be a laundry care appliance.
  • the heating device can then be used, for example, as a lye heater for a washing machine or a washer dryer.
  • the heating device can also be provided as a process air heater.
  • the household appliance can also be a dishwasher.
  • the heating device can then be used, for example, as a heater for heating the rinsing liquid.
  • the heater can be a component of a heat pump assembly.
  • the household appliance can also be an electrically operated small household appliance, e.g. a kettle, a coffee machine (e.g. in the form of an espresso machine), a toaster, etc.
  • a coffee machine e.g. in the form of an espresso machine
  • a toaster e.g. a toaster
  • the heating device can be designed as a tube (generally: a rotationally symmetrical body), with at least one thermally sprayed-on heating conductor layer being present on a wall of the tube of the household appliance.
  • the pipe can then be used or viewed in particular as a flow heater for gas (e.g. process air) and / or liquid (e.g. water to be evaporated, rinsing liquid or lye) passed through it.
  • gas e.g. process air
  • liquid e.g. water to be evaporated, rinsing liquid or lye
  • the object is also achieved by a method for electrically connecting a thermally sprayed-on layer structure of a household appliance, in which at least one volume of a pasty, electrically conductive conductive adhesive is applied to at least one thermally sprayed-on layer structure and the conductive adhesive is solidified - in particular hardened.
  • the method results in the same advantages as the heating device and / or the household appliance and can be designed analogously.
  • the conductive adhesive is applied by means of a dispenser.
  • Fig. 1 shows a plan view of a heating device 1 of a household appliance H.
  • the heating device 1 can be used, for example, for heating water located in a water tank of a steam generator (not shown).
  • the household appliance H can, however, also be an oven with steam cooking functionality, a dedicated steam oven, an electrically heatable cooking space divider, a laundry care device, a dishwasher, a small household appliance, etc.
  • the heating device 1 has a flat carrier 2 (e.g. made of sheet metal) with an electrically insulating carrier surface 3 (e.g. made of a slightly porous ceramic layer).
  • Several metallic layer structures 4 to 8 are thermally sprayed onto the carrier surface 3.
  • the thermally sprayed-on layer structures 4 to 8 are electrically insulated from one another by the carrier surface 3 and comprise: a first (long) meander-shaped heating conductor layer in the form of an elongated first heating conductor layer 4, a second (short) meandering heating conductor layer in the form of an elongated second heating conductor path 5 and three straight ones Conductor tracks 6 to 8.
  • the two heating conductor tracks 4 and 5 are electrically connected to one another by two tracks 9 of electrically conductive adhesive 10. As a result, the two heating conductor tracks 4 and 5 are electrically connected in series. Should the second heating conductor 5 not be used instead of the two tracks 9, the two corresponding ends of the first heating conductor 4 could be connected to one another directly by means of a track of conductive adhesive 10 (not shown).
  • the track 9 of the conductive adhesive 10 has been drawn from the surface of the first heating conductor 4 over the carrier surface 3 to the surface of the second heating conductor 5.
  • the adhesive e.g. silicone polymer or epoxy resin
  • the adhesive of the conductive adhesive 10 is so viscous that it does not penetrate or only to a negligibly small extent into the heating conductor tracks 4 and 5 and the carrier surface 3, while soldering flux could penetrate and thereby locally adversely affect the properties there could. In this case, the soldering flux could even penetrate through the slightly porous heating conductor tracks 4 and 5 into the area of the carrier surface 3 below.
  • the track 9 can be applied, for example, by applying a conductive adhesive 10 in the form of a reactive 1-component conductive adhesive in the viscous state of the associated adhesive by means of a dispenser and then hardening it, in particular at an elevated temperature (e.g. up to 150 ° C) especially in an oven.
  • a conductive adhesive 10 in the form of a reactive 1-component conductive adhesive in the viscous state of the associated adhesive by means of a dispenser and then hardening it, in particular at an elevated temperature (e.g. up to 150 ° C) especially in an oven.
  • the three straight, thermally sprayed-on conductor tracks 6 to 8 are connected to a connector 11 of the heating device 1, in particular to a respective electrical contact 11a of the connector 11.
  • the electrical connection can also be made via a respective contact volume 11b made of conductive adhesive 10.
  • Adjacent conductor tracks 6 and 7 or 7 and 8 are connected via respective SMD components 12.
  • the SMD components 12 are, for example, NTC resistors here. Thus, measured values (for example electrical resistance values, voltage values or current values) associated with a particular temperature can be tapped via the connector 11.
  • the SMD components 12 are attached to the conductor tracks 6 and 7 or 7 and 8 via adhesive dots 13 made of conductive adhesive 10, as in FIG Fig. 3 is shown as section BB from heating device 1.
  • the SMD component 12 has electrical contacts or contact fields 14 on its end regions, which are connected to the respective conductor track 7 or 8 via the adhesive points 13. As a result, the two conductor tracks 7 and 8 are electrically connected to one another by the SMD component 12 via the adhesive dots 13.
  • the adhesive dots 13 can first be applied to the thermally sprayed-on conductor tracks 7 or 8 by means of a dispenser (not shown). Subsequently, before the conductive adhesive 10 hardens, the SMD component 12 can be brought in and its contact fields 14 can be pressed onto the respective adhesive points 13, e.g. by means of a vacuum gripper.
  • Fig. 4 shows a section CC from the heating device 1 as a sectional illustration in side view.
  • the metallic contact surfaces 15 can be connected to a respective end of the first heating conductor 4 by means of a respective track 9 of the conductive adhesive 10, specifically analogous to the connection of the two heating conductor tracks 4 and 5.
  • a conductive layer 16 of the conductive adhesive 10 has been applied to the heating conductor 4 and possibly the carrier surface 3 at a bend in the heating conductor 4 in order to reduce a current density there and thus prevent the formation of so-called "hot spots", as shown in section DD in Fig. 5 shown.
  • a number can also include exactly the specified number as well as a customary tolerance range, as long as this is not explicitly excluded.

Claims (13)

  1. Dispositif de chauffage (1) pour un appareil électroménager (H), présentant
    - un support plan (2) avec une surface de support (3),
    - au moins une structure en couches (4-8) électriquement conductrice et pulvérisée thermiquement sur la surface de support (3) et
    - au moins un volume de contact électriquement conducteur (9 ; 13) qui est appliqué sur au moins une structure en couches (4-8) pulvérisée thermiquement, caractérisé en ce que
    - la surface de support (3) est une surface de support (3) électriquement isolante, et en ce qu'au moins un volume de contact (9 ; 13) est composé de colle conductrice (10), dans lequel la colle conductrice est une colle conductrice monocomposante réactive.
  2. Dispositif de chauffage (1) selon la revendication 1, caractérisé en ce que l'au moins une structure en couches (4-8) pulvérisée thermiquement est une couche de conducteur de chaleur (4, 5).
  3. Dispositif de chauffage (1) selon l'une des revendications précédentes, caractérisé en ce que la structure en couches (4-8) pulvérisée thermiquement est perméable aux agents d'écoulement de brasure.
  4. Dispositif de chauffage (1) selon l'une des revendications précédentes, caractérisé en ce que la surface de support (3) est perméable aux agents d'écoulement de brasure.
  5. Dispositif de chauffage (1) selon l'une des revendications précédentes, caractérisé en ce que la colle conductrice (10) réticule par addition.
  6. Dispositif de chauffage (1) selon l'une des revendications précédentes, caractérisé en ce que l'au moins un volume de contact (9) relie deux structures en couches (4, 5) pulvérisées thermiquement et de plus repose sur la surface de support (3) présente entre les structures en couches (4, 5).
  7. Dispositif de chauffage (1) selon l'une des revendications précédentes, caractérisé en ce que l'au moins un volume de contact (13) relie une structure en couches (6-8) pulvérisée thermiquement avec une plaque de contact électrique (14) d'un composant (12) apte à être monté sur une surface.
  8. Dispositif de chauffage (1) selon l'une des revendications précédentes, caractérisé en ce que deux pistes conductrices (6-8) pulvérisées thermiquement sont reliées par le biais d'un composant électrique (12), dans lequel des plaques de contact (14) du composant (12) sont reliées aux pistes conductrices (6-8) respectives par l'intermédiaire de points de colle (13) à partir de la colle conductrice (10) électriquement conductrice.
  9. Dispositif de chauffage (1) selon l'une des revendications précédentes, caractérisé en ce qu'au moins un volume de contact (16) issu de la colle conductrice (10) recouvre au moins une section de la structure en couches (4) pulvérisée thermiquement sans la relier électriquement à un autre constituant électriquement conducteur du dispositif de chauffage (1).
  10. Appareil électroménager (H) avec un dispositif de chauffage, caractérisé en ce que le dispositif de chauffage est au moins un dispositif de chauffage (1) selon l'une des revendications précédentes.
  11. Appareil électroménager (H) selon la revendication 10, caractérisé en ce que l'appareil électroménager (H) est un appareil de cuisson ou un accessoire pour un appareil de cuisson.
  12. Appareil électroménager (H) selon la revendication 10, caractérisé en ce que l'appareil électroménager (H) est un appareil de traitement du linge ou un appareil de lavage de la vaisselle.
  13. Procédé permettant de relier électriquement une structure en couches (4-8) pulvérisée thermiquement d'un appareil électroménager (H) selon l'une des revendications 10 à 12, dans lequel
    - au moins un volume (9 ; 13) d'une colle conductrice pâteuse (10) en forme de colle conductrice monocomposante réactive est appliqué dans tous les cas sur au moins une structure en couches (4-8) pulvérisée thermiquement et
    - la colle conductrice (10) se solidifie.
EP16734370.6A 2015-07-31 2016-07-01 Dispositif de chauffage pour appareil ménager Active EP3329736B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL16734370T PL3329736T3 (pl) 2015-07-31 2016-07-01 Układ grzewczy do urządzenia gospodarstwa domowego

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015214628.6A DE102015214628A1 (de) 2015-07-31 2015-07-31 Heizeinrichtung für ein Haushaltsgerät
PCT/EP2016/065536 WO2017021075A1 (fr) 2015-07-31 2016-07-01 Dispositif de chauffage pour appareil ménager

Publications (2)

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EP3329736A1 EP3329736A1 (fr) 2018-06-06
EP3329736B1 true EP3329736B1 (fr) 2021-03-24

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US (1) US20180242401A1 (fr)
EP (1) EP3329736B1 (fr)
CN (1) CN107852782B (fr)
DE (1) DE102015214628A1 (fr)
ES (1) ES2862099T3 (fr)
PL (1) PL3329736T3 (fr)
WO (1) WO2017021075A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021130128A1 (de) 2021-11-18 2023-05-25 Endress+Hauser SE+Co. KG Baugruppe für eine Verbindung mindestens eines Bauteils mit einer Leiterplatte

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015214627A1 (de) * 2015-07-31 2017-02-02 BSH Hausgeräte GmbH Verbinden thermisch aufgespritzter Schichtstrukturen von Heizeinrichtungen
DE102017122059A1 (de) * 2017-09-22 2019-03-28 Plasma Innovations GmbH Verfahren zur Herstellung einer Endoberfläche und Leiterplatte

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3109250A1 (de) 1981-03-11 1982-10-28 Bosch-Siemens Hausgeräte GmbH, 7000 Stuttgart Elektrisches haushaltgeraet mit gehaeuseteilen aus elektrisch leitendem material
DE3913028A1 (de) 1989-04-20 1990-10-25 Fraunhofer Ges Forschung Verfahren und vorrichtung zur herstellung einer leitenden verbindung
DE4206700A1 (de) 1992-03-04 1993-09-16 Vdo Schindling Kontaktierung
US5416622A (en) 1993-02-01 1995-05-16 Minnesota Mining And Manufacturing Company Electrical connector
WO1997042638A1 (fr) 1996-05-06 1997-11-13 Siemens Aktiengesellschaft Procede de collage par electroconduction
EP0972318B1 (fr) 1997-04-02 2002-10-23 Siemens Aktiengesellschaft Connexion electrique entre un support de circuit et un support de traces conducteurs
DE19825451A1 (de) 1998-06-06 1999-12-09 Ego Elektro Geraetebau Gmbh Keramischer Träger mit einer elektrischen Schaltung und mit einer Anschlußvorrichtung
AT508327A1 (de) * 2008-07-29 2010-12-15 Villinger Markus Heizvorrichtung zum enteisen von luftfahrzeugteilen
DE202010009208U1 (de) * 2010-06-17 2010-09-16 Futurecarbon Gmbh Flexibles Heizelement
DE102012212798A1 (de) * 2011-12-22 2013-06-27 Robert Bosch Gmbh Heizelement und Verfahren zu dessen Herstellung sowie Verwendung des Heizelementes
JP6185983B2 (ja) * 2012-04-20 2017-08-23 フューチャー カーボン ゲゼルシャフト ミット ベシュレンクテル ハフツングＦｕｔｕｒｅ Ｃａｒｂｏｎ ＧｍｂＨ 電気式の加熱装置及び構成要素並びに電気式の加熱装置及び構成要素素子を製造するための方法
BR112015007644A2 (pt) * 2012-10-30 2017-07-04 Saint Gobain vitrificação veicular polimérica com uma zona de borda opaca montada em nível
FR2998092B1 (fr) * 2012-11-13 2014-11-07 Commissariat Energie Atomique Interposeur en graphene et procede de fabrication d'un tel interposeur
DE102013109755A1 (de) 2013-09-06 2015-03-12 Rent A Scientist Gmbh Leitfähiger Klebstoff

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021130128A1 (de) 2021-11-18 2023-05-25 Endress+Hauser SE+Co. KG Baugruppe für eine Verbindung mindestens eines Bauteils mit einer Leiterplatte

Also Published As

Publication number Publication date
CN107852782B (zh) 2021-10-29
WO2017021075A1 (fr) 2017-02-09
US20180242401A1 (en) 2018-08-23
DE102015214628A1 (de) 2017-02-02
EP3329736A1 (fr) 2018-06-06
CN107852782A (zh) 2018-03-27
ES2862099T3 (es) 2021-10-07
PL3329736T3 (pl) 2021-10-11

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