EP3329736B1 - Heating device for a domestic appliance - Google Patents

Heating device for a domestic appliance Download PDF

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Publication number
EP3329736B1
EP3329736B1 EP16734370.6A EP16734370A EP3329736B1 EP 3329736 B1 EP3329736 B1 EP 3329736B1 EP 16734370 A EP16734370 A EP 16734370A EP 3329736 B1 EP3329736 B1 EP 3329736B1
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EP
European Patent Office
Prior art keywords
heating device
thermally sprayed
layer structure
layer
electrically
Prior art date
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Active
Application number
EP16734370.6A
Other languages
German (de)
French (fr)
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EP3329736A1 (en
Inventor
Stefan Kobler
Robert KÜHN
Philipp Schaller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BSH Hausgeraete GmbH
Original Assignee
BSH Hausgeraete GmbH
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Filing date
Publication date
Application filed by BSH Hausgeraete GmbH filed Critical BSH Hausgeraete GmbH
Priority to PL16734370T priority Critical patent/PL3329736T3/en
Publication of EP3329736A1 publication Critical patent/EP3329736A1/en
Application granted granted Critical
Publication of EP3329736B1 publication Critical patent/EP3329736B1/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible

Definitions

  • the invention relates to a heating device for a household appliance, comprising a flat carrier with an electrically insulating carrier surface, at least one electrically conductive layer structure thermally sprayed onto the carrier surface and at least one electrically conductive contact volume which is applied to at least one thermally sprayed layer structure.
  • the invention also relates to a household appliance with such a heating device.
  • the invention also relates to a method for electrically connecting a thermally sprayed-on layer structure of a household appliance.
  • the invention is particularly advantageously applicable to cooking appliances, in particular steamers, to water-bearing laundry care appliances, to dishwashers and to small household appliances.
  • solder or soldering compound is used as the contact volume.
  • a flux must be used so that the solder adheres to the layer structure.
  • the flux can be absorbed by the layer structure, which is usually slightly porous. This can negatively affect the connection of the solder to the thermally sprayed-on layer structure and the properties of the thermally sprayed-on layer structure itself. If the layer structure is also applied to a porous insulation layer, the flux can penetrate into the insulation layer and adversely affect the electrical insulation properties.
  • DE 31 09 250 A1 discloses an electrical household appliance with housing parts made of electrically conductive material, which are connected to one another in an electrically conductive manner for electrical protective grounding. A reliable grounding of the various conductive parts is to be achieved with low manufacturing costs.
  • an electrically conductive adhesive compound serve as the electrically conductive connection.
  • An electrically conductive adhesive for example an organic silicone adhesive with metal powder or carbon as filler, is preferably used as the adhesive mass. The adhesive retains a certain elasticity even after it has hardened, which prevents the contact from being interrupted by thermal expansion.
  • DE 39 13 028 A1 discloses a method and a device for producing a conductive connection in an electrical device, in which at least two contact elements to be connected in an electrically conductive manner are attached to an insulating part at a distance from one another.
  • the method and the device for producing a conductive connection are characterized in that an electrically conductive paste is applied to the insulating part by means of a multi-axis positioning unit, which paste connects the contact elements applied to the insulating part with one another.
  • no contacting of thermally sprayed-on layer structures is addressed here.
  • DE 42 06 700 A1 discloses a contacting of the conductor tracks arranged parallel next to one another on a carrier with conductor tracks correspondingly arranged parallel next to one another on a flexible conductor foil, the interconnected conductor tracks of the carrier and conductor foil being brought into overlap and conductively connected to one another.
  • an adhesive consisting of an insulating material and containing a large number of approximately evenly distributed electrically conductive granules is arranged, by means of which the carrier and conductor foil are connected to one another.
  • the conductive grains are in contact with one another and with the conductor tracks and form a conductive connection between the conductor tracks of the carrier and conductor foil assigned to one another.
  • no contacting of thermally sprayed-on layer structures is addressed.
  • DE 10 2013 109 755 A1 discloses a conductive adhesive comprising at least one type of anisotropic conductive nanomaterial and at least one type of photoinduced polymerizable material. Contacting of layer structures is not addressed.
  • EP 0 681 712 B1 discloses an electro-optic thin film device having an electrically responsive layer having optical properties that change under the action of a current or electric field applied to the layer; at least one electrode extending beyond the electrically responsive layer and capable of delivering an electrical current to the electrically responsive layer; and an electrical connector extending along a single edge of the device and is configured to supply electrical power to the electrode from a power source, the electrical connector comprising: flexible insulation having an electrically conductive portion on at least one surface that is capable of electrical contact between the Electrode and a power source, an electrically conductive adhesive disposed on the electrically conductive portion of the insulation near the electrode to make electrical contact with the electrode, the electrically conductive adhesive having electrically conductive particles overlying an entire adhesive matrix are distributed away, and a connecting device which is in electrical contact with the electrically conductive portion of the insulation and is capable of making electrical contact with a power source, wherein at least a portion of the insulation in a portion of the electrically claimed The same layer of the device is introduced, and that the
  • EP 0 963 143 A1 discloses a ceramic carrier with an electrical circuit and a connection device which has at least one metallic connection, for example in the form of a threaded bolt.
  • the connection or the connection device are connected to the carrier with compensating means, which consist of a metal with a higher deformability than the material of the connection, preferably by means of active soldering.
  • the compensating means can or the like in the form of an annular disk. be designed and made of copper and equalize the stresses during cooling.
  • the active solder advantageously has a base made of silver and copper and a reactive alloy component, for example titanium or a rare earth metal.
  • the connection device can represent both a heavy-duty mechanical fastening connection for the carrier and an electrical connection for the circuit.
  • WO 97/42638 discloses a method for electrically conductive and low-tension bonding of sensitive and precisely positioned workpieces with possibly different thermal expansion coefficients, in which the adhesive is applied, then the curing reaction is triggered photochemically and then within one second the workpieces to be bonded can be positioned within 15 minutes.
  • An adhesive formulation is used which is a one-component, storage-stable at room temperature and filled with metal particles.
  • WO 98/44593 discloses an electrical connection arrangement for connecting a circuit carrier with conductor tracks of a conductor track carrier, the circuit carrier and the conductor track carrier being carried by a base plate, the circuit carrier and the conductor track carrier having an area in which they overlap, and the circuit carrier in the area of the overlap by means of a electrically conductive adhesive is electrically connected to the conductor carrier.
  • WO 98/44593 further discloses a method for electrically connecting a circuit carrier with conductor tracks of a conductor track carrier, wherein the conductor track carrier is fixed on a base plate, the conductor track carrier is electrically connected on its side facing away from the base plate in an area that is free of an insulating cover opposite a conductor track Provided conductive adhesive, and a circuit carrier is glued to the conductor track carrier, so that an electrical connection is created between a conductor track of the conductor track carrier and a contact point of the circuit carrier.
  • DE 10 2012 212 798 A1 discloses a heating element with at least one thermoelectric heating element, the heating element being at least partially formed with a conductive material and the heating element being able to be supplied with electrical energy via at least two conductor tracks.
  • the conductor tracks are formed by means of a thermal spraying process, in particular by plasma spraying in accordance with DIN 657.
  • a thermal spraying process in particular by plasma spraying in accordance with DIN 657.
  • the thermally sprayed-on conductor tracks there is a good electrical connection between the conductor tracks and the conductive particles within the matrix of the conductive material of the heater.
  • there is a mechanically resilient connection of the conductor tracks to the radiator can be given a variety of three-dimensional shapes, resulting in a variety of uses for the heating element.
  • the heating element can have the shape of a pipe-like fluid line, so that the heating element, in addition to its actual heating function, can also fulfill other structurally prescribed tasks at the same time. Due to this functional integration or dual functionality, when using the heating element, there are significant structural simplifications and optimization options that hold considerable potential for cost savings. In addition, a method is disclosed, in particular for producing the heating element, as well as uses of the heating element as the subject matter.
  • a heating device for a household appliance having a flat carrier with an electrically insulating surface (hereinafter referred to as “carrier surface” without loss of generality), at least one electrically conductive layer structure thermally sprayed onto the carrier surface and at least one electrically conductive layer structure Contact volume which is applied to at least one thermally sprayed-on layer structure, at least one contact volume consisting of electrically conductive adhesive (hereinafter referred to as “conductive adhesive” without restricting the generality).
  • the conductive adhesive is a reactive one-component (1-component) conductive adhesive. This has the advantage of being particularly easy to use.
  • the 1-component conductive adhesive can be premixed by the adhesive manufacturer, i.e. that, for example, resin and a hardener are already mixed in the correct mixing ratio. The hardening reaction can be greatly delayed by storage at low temperatures.
  • conductive adhesive has the advantage that it has good adhesive strength on the thermally sprayed-on layer or layer structure, especially on porous layers.
  • flux As in traditional soldering. In classic soldering with flux, this penetrates the porous, thermally sprayed layers. In order to avoid a negative influence of the flux, it has to be washed out with solvent. This step can now be saved. In contrast to soldering, a solder mask can also be dispensed with.
  • the precisely adjustable viscoelasticity of the conductive adhesive results in a high level of application accuracy.
  • the conductive adhesive is also suitable for small contact areas, so that even small amounts of adhesive can be implemented with precise positioning and without splashes.
  • the thixotropy of the adhesive system can be adjusted so that after a component has been positioned or placed, it is held in its position.
  • Another advantage of using the conductive adhesive is its good adhesion, even on smooth, non-porous surfaces, e.g. on compact, polished surfaces.
  • the conductive adhesive can easily be adjusted so that practically no or only little adhesive penetrates the thermally sprayed-on layer structure or another porous substrate, so that properties of the substrate, for example insulation properties, are not adversely affected. Furthermore, there is only a slight ionic contamination, which helps to avoid corrosion at the contact point. If the non-electrically conductive, organic adhesive penetrates the thermally sprayed-on layer structure or another porous substrate (which is also known as bleeding (resin bleeding) is), this has no negative effects on the electrical properties of the thermally sprayed-on layer structure.
  • hardened conductive adhesive can be designed to be temperature-stable up to at least 150 ° C. It has good mechanical strength and an adapted coefficient of thermal expansion, for example when exposed to thermal cycling. Even at high continuous use temperatures, it is sufficiently resistant to aging over the entire service life of the product.
  • conductive adhesive provides a contact volume with good electrical conductivity (for example of at least 1 * 10 6 S / m, in particular at least 1.5 * 10 6 S / m). This results in a low contact resistance between the conductive adhesive and the thermally sprayed-on layer structure.
  • the resulting connection also has a low temperature coefficient, with in particular electrical properties of the conductive adhesive, such as its resistance, not increasing significantly over the service life of the product.
  • a conductive adhesive can in particular be understood to mean an adhesive with a matrix of viscous, in particular pasty, adhesive (e.g. resin, in particular epoxy resin) with electrically conductive particles as filler material.
  • the adhesive can generally have one or more polymers.
  • the filler material can, for example, comprise metal particles such as copper, silver and / or gold particles, but also other electrically conductive and temperature-resistant materials such as certain types of carbon (e.g. CNTs).
  • the particles can be powder particles.
  • the conductive adhesive has a high or medium viscosity for processing and is solid in its final state.
  • the conductive adhesive shrinks (chemical volume shrinkage due to crosslinking reaction), so that the electrically conductive particles touch each other and consequently can form point, line and / or surface contacts, which in turn can form current paths in the conductive adhesive.
  • the adhesive is preferably addition-crosslinking, so that no chemical cleavage products are formed during curing that escape / evaporate from the material, as is the case, for example, with silicones, which are referred to as "condensation-crosslinking".
  • silicones which are referred to as "condensation-crosslinking”.
  • a flat carrier can be understood to mean, for example, a flat carrier or a curved carrier (e.g. in the form of a tube).
  • the carrier can in particular have a plate-like basic shape.
  • the electrically insulating carrier surface can be an electrically insulating layer (e.g. made of ceramic) applied to a base body or substrate of the carrier (e.g. a metal sheet). This layer can also have been thermally sprayed on.
  • the electrically insulating support surface can, however, also be a surface-treated (e.g. oxidized) layer area of a base body of the support.
  • the electrically insulating support surface can in particular have a non-negligible porosity. When using solder flux, it can penetrate the associated pores and possibly reduce the ability to provide electrical insulation or lead to a breakdown when high voltage is applied (e.g. of more than 1000 V).
  • the base body itself is electrically insulating and temperature-resistant (up to at least 150 ° C)
  • a specially designed superficial layer can be dispensed with, and the carrier surface then represents the unmodified surface of the base body. This can be the case, for example if the base body is made of ceramic.
  • a thermally sprayed-on layer can be understood to mean a layer that is produced, for example, by molten bath spraying, arc spraying, plasma spraying (e.g. atmosphere, under protective gas or under low pressure), flame spraying (e.g. powder flame spraying, wire flame spraying or plastic flame spraying), high-speed flame spraying, detonation spraying, cold gas spraying or PTWA syringes have been produced, in particular sprayed onto the carrier surface.
  • At least one thermally sprayed-on layer or layer structure can be, for example, a metallic layer or layer structure, for example comprising aluminum (Al), bronze, copper (Cu), silver (Ag), tin (Sn) etc., or an alloy thereof.
  • the thermally sprayed-on layer can also be a nickel-chromium alloy (NiCr).
  • the thermal The sprayed-on layer can also be a ceramic layer, for example an electrically insulating layer. A surface of the thermally sprayed-on layer or layer structure can be oxidized.
  • the thermally sprayed-on layer or layer structure can be at least partially covered by at least one further layer.
  • This at least one further layer can represent a ("contact") layer for improved electrical contacting, in particular made of metal, e.g. a layer made of tin, copper, silver and / or gold.
  • the conductive adhesive can be applied to the thermally sprayed-on layer structure via the contact layer.
  • a layer structure is understood to mean, in particular, a layer which, in plan view, has a shape different from the shape of the carrier surface, that is to say is not a layer that completely covers the entire carrier surface. Rather, the layer structure on the carrier or on the carrier surface in plan view has its own contour (“outer contour”) which runs at least partially on the carrier surface (and not only on its edge).
  • the layer structure can in particular be in the form of at least one elongate line track or path.
  • the conduction path can be completely or partially straight and / or completely or partially curved.
  • the conduction path can have a meandering course.
  • the conduction path can, however, also be in the form of a short strip or a rectangular, round, oval, etc. contact field, for example.
  • a contact volume is understood to mean, in particular, a mass volume made of electrically conductive contact material, namely the conductive adhesive here.
  • At least one thermally sprayed-on layer structure is a resistance heating conductor layer, in particular a thick layer.
  • the heat conductor layer can in particular be an elongate heat conductor track.
  • the heating conductor track can, for example, run in a meander shape or in a spiral shape.
  • Solder mass can be applied in particular in the region of at least one end of the heating conductor layer in order to connect it electrically.
  • aluminum, an aluminum compound or a nickel-chromium compound can be provided as the material of the heating conductor layer.
  • the heat conductor layer can therefore in particular represent a thermally sprayed surface heating for household appliances.
  • the thermally sprayed-on layer structure - in particular also a heating conductor layer - is connected to a further electrically conductive area of the heating device by means of a trace of conductive adhesive.
  • the further electrically conductive area can be, for example, a further heating conductor layer or an electrical connection contact (e.g. in the form of a thermally sprayed-on layer structure or as a metallic contact field).
  • the conductive adhesive can also partially run on the carrier surface in this development.
  • the thermally sprayed-on layer structure is medium permeable to solder (flux). If solder flux penetrated the layers, the electrical properties and corrosion stability of the thermally sprayed-on layer structure could be adversely affected.
  • the conductive components (i.e. the electrically conductive filler) of the conductive adhesive cannot enter the thermally sprayed-on layer structure, so that a negative influence on the layer properties is avoided.
  • the thermally sprayed-on layer structure is therefore impermeable to the conductive parts of the conductive adhesive.
  • the thermally sprayed-on layer structure can also be impermeable to the adhesive or only partially (slightly) permeable.
  • the carrier surface - possibly also thermally sprayed on - is permeable to solder flux. If solder flux penetrated the carrier surface, the electrical properties and corrosion stability of the carrier surface could be adversely affected. In contrast, the conductive components (ie the electrically conductive filler) of the conductive adhesive cannot penetrate the carrier surface, so that a negative influence on its properties is avoided as a result.
  • the carrier surface is therefore impermeable to the conductive parts of the conductive adhesive.
  • the carrier surface can also be impermeable to the adhesive or only partially (slightly) permeable.
  • the curing can take place at room temperature or preferably at an elevated temperature (for example in an oven). Higher temperatures accelerate the curing reaction and improve the electrical properties. If necessary, this can harden can also be carried out by means of a photoinitiator contained in the adhesive.
  • adhesives are also referred to as UV or light-curing adhesives.
  • At least one contact volume connects two thermally sprayed-on layer structures - in particular conductor tracks - and for this purpose rests on the carrier surface present between the layer structures.
  • two or more electrically separate sections of a line can also be connected to one another, e.g. two or more heating conductor layers (in particular heating conductor tracks) - for example running parallel to one another - to form a common heating conductor or heating element.
  • This can be used, for example, for the subsequent adjustment of the electrical resistance of a thermally sprayed-on heating conductor in order to guarantee the required nominal output of the heating device ("trimming") and / or to repair defects in thermally sprayed-on conductor tracks (e.g. heating conductor tracks).
  • At least one contact volume connects a thermally sprayed-on layer structure with an electrical contact field of an in particular surface-mountable component - also referred to as an SMD ("Surface Mounted Device") component.
  • SMD Surface Mounted Device
  • thermally sprayed-on layer structures and electrical and / or electronic components can be connected to one another in a particularly simple and inexpensive manner.
  • a particularly small volume of conductive adhesive or "conductive adhesive point" is applied to the thermally sprayed layer structure by means of a dispenser and the SMD component with its contact surfaces (terminals) is pressed onto the conductive adhesive point before the conductive adhesive hardens. The conductive adhesive then hardens, for example by means of an oven process.
  • the SMD component is then securely attached to the thermally sprayed layer or layer structure.
  • the SMD component eg size 0603, 0805 or 1206
  • the SMD component can be positioned or placed using a vacuum gripper.
  • so-called “underfillers” can be dispensed with, some of which are necessary with SMD soldering so that the SMD component does not change its intended position during the soldering process.
  • Wired components that are intended for through-hole assembly THT; "Through Hole Technology” can also be connected to the thermally sprayed-on structure by means of the conductive adhesive via their metallic contact.
  • the SMD component can, for example, be a heat-sensitive resistor (e.g. an NTC resistor), a fuse, a sensor, etc.
  • a heat-sensitive resistor e.g. an NTC resistor
  • two thermally sprayed-on conductor tracks are electrically connected to one another by an electrical component, with contact fields of the component being connected to the respective conductor tracks via adhesive dots made of the electrically conductive adhesive.
  • At least one contact volume made of conductive adhesive covers at least one section of the thermally sprayed-on layer structure - in particular a heating conductor layer - without electrically connecting it to another component of the heating device.
  • at least one contact volume made of conductive adhesive can be applied to the heating conductor layer in order to locally reduce an electrical current density in the heating conductor layer. This in turn can prevent local overtemperature (so-called "hot spots").
  • a conductive layer can be applied, for example, to power connections, to constrictions in conductor tracks due to the design, to corners and / or to reversal points in the heating conductor layout.
  • the conductive layer or the conductive adhesive can also rest on the carrier surface.
  • the object is also achieved by a household appliance with at least one heating device as described above.
  • the household appliance has the same advantages as the heating device and can be designed analogously.
  • the household appliance can be, for example, a cooking appliance or an accessory for a cooking appliance (for example a heatable cooking space divider).
  • the cooking appliance can, for example, have a steam cooking function, the heating device being assigned to a steam generating device in order to evaporate water present in the steam generating device.
  • the cooking device can be, for example, an oven with steam cooking functionality or a dedicated steam cooker.
  • the heating device may then represent, for example, the bottom of a water tank.
  • At least one thermally sprayed-on layer structure can be present on one or both sides, in particular at least one heating conductor layer.
  • the household appliance can also be a laundry care appliance.
  • the heating device can then be used, for example, as a lye heater for a washing machine or a washer dryer.
  • the heating device can also be provided as a process air heater.
  • the household appliance can also be a dishwasher.
  • the heating device can then be used, for example, as a heater for heating the rinsing liquid.
  • the heater can be a component of a heat pump assembly.
  • the household appliance can also be an electrically operated small household appliance, e.g. a kettle, a coffee machine (e.g. in the form of an espresso machine), a toaster, etc.
  • a coffee machine e.g. in the form of an espresso machine
  • a toaster e.g. a toaster
  • the heating device can be designed as a tube (generally: a rotationally symmetrical body), with at least one thermally sprayed-on heating conductor layer being present on a wall of the tube of the household appliance.
  • the pipe can then be used or viewed in particular as a flow heater for gas (e.g. process air) and / or liquid (e.g. water to be evaporated, rinsing liquid or lye) passed through it.
  • gas e.g. process air
  • liquid e.g. water to be evaporated, rinsing liquid or lye
  • the object is also achieved by a method for electrically connecting a thermally sprayed-on layer structure of a household appliance, in which at least one volume of a pasty, electrically conductive conductive adhesive is applied to at least one thermally sprayed-on layer structure and the conductive adhesive is solidified - in particular hardened.
  • the method results in the same advantages as the heating device and / or the household appliance and can be designed analogously.
  • the conductive adhesive is applied by means of a dispenser.
  • Fig. 1 shows a plan view of a heating device 1 of a household appliance H.
  • the heating device 1 can be used, for example, for heating water located in a water tank of a steam generator (not shown).
  • the household appliance H can, however, also be an oven with steam cooking functionality, a dedicated steam oven, an electrically heatable cooking space divider, a laundry care device, a dishwasher, a small household appliance, etc.
  • the heating device 1 has a flat carrier 2 (e.g. made of sheet metal) with an electrically insulating carrier surface 3 (e.g. made of a slightly porous ceramic layer).
  • Several metallic layer structures 4 to 8 are thermally sprayed onto the carrier surface 3.
  • the thermally sprayed-on layer structures 4 to 8 are electrically insulated from one another by the carrier surface 3 and comprise: a first (long) meander-shaped heating conductor layer in the form of an elongated first heating conductor layer 4, a second (short) meandering heating conductor layer in the form of an elongated second heating conductor path 5 and three straight ones Conductor tracks 6 to 8.
  • the two heating conductor tracks 4 and 5 are electrically connected to one another by two tracks 9 of electrically conductive adhesive 10. As a result, the two heating conductor tracks 4 and 5 are electrically connected in series. Should the second heating conductor 5 not be used instead of the two tracks 9, the two corresponding ends of the first heating conductor 4 could be connected to one another directly by means of a track of conductive adhesive 10 (not shown).
  • the track 9 of the conductive adhesive 10 has been drawn from the surface of the first heating conductor 4 over the carrier surface 3 to the surface of the second heating conductor 5.
  • the adhesive e.g. silicone polymer or epoxy resin
  • the adhesive of the conductive adhesive 10 is so viscous that it does not penetrate or only to a negligibly small extent into the heating conductor tracks 4 and 5 and the carrier surface 3, while soldering flux could penetrate and thereby locally adversely affect the properties there could. In this case, the soldering flux could even penetrate through the slightly porous heating conductor tracks 4 and 5 into the area of the carrier surface 3 below.
  • the track 9 can be applied, for example, by applying a conductive adhesive 10 in the form of a reactive 1-component conductive adhesive in the viscous state of the associated adhesive by means of a dispenser and then hardening it, in particular at an elevated temperature (e.g. up to 150 ° C) especially in an oven.
  • a conductive adhesive 10 in the form of a reactive 1-component conductive adhesive in the viscous state of the associated adhesive by means of a dispenser and then hardening it, in particular at an elevated temperature (e.g. up to 150 ° C) especially in an oven.
  • the three straight, thermally sprayed-on conductor tracks 6 to 8 are connected to a connector 11 of the heating device 1, in particular to a respective electrical contact 11a of the connector 11.
  • the electrical connection can also be made via a respective contact volume 11b made of conductive adhesive 10.
  • Adjacent conductor tracks 6 and 7 or 7 and 8 are connected via respective SMD components 12.
  • the SMD components 12 are, for example, NTC resistors here. Thus, measured values (for example electrical resistance values, voltage values or current values) associated with a particular temperature can be tapped via the connector 11.
  • the SMD components 12 are attached to the conductor tracks 6 and 7 or 7 and 8 via adhesive dots 13 made of conductive adhesive 10, as in FIG Fig. 3 is shown as section BB from heating device 1.
  • the SMD component 12 has electrical contacts or contact fields 14 on its end regions, which are connected to the respective conductor track 7 or 8 via the adhesive points 13. As a result, the two conductor tracks 7 and 8 are electrically connected to one another by the SMD component 12 via the adhesive dots 13.
  • the adhesive dots 13 can first be applied to the thermally sprayed-on conductor tracks 7 or 8 by means of a dispenser (not shown). Subsequently, before the conductive adhesive 10 hardens, the SMD component 12 can be brought in and its contact fields 14 can be pressed onto the respective adhesive points 13, e.g. by means of a vacuum gripper.
  • Fig. 4 shows a section CC from the heating device 1 as a sectional illustration in side view.
  • the metallic contact surfaces 15 can be connected to a respective end of the first heating conductor 4 by means of a respective track 9 of the conductive adhesive 10, specifically analogous to the connection of the two heating conductor tracks 4 and 5.
  • a conductive layer 16 of the conductive adhesive 10 has been applied to the heating conductor 4 and possibly the carrier surface 3 at a bend in the heating conductor 4 in order to reduce a current density there and thus prevent the formation of so-called "hot spots", as shown in section DD in Fig. 5 shown.
  • a number can also include exactly the specified number as well as a customary tolerance range, as long as this is not explicitly excluded.

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  • Resistance Heating (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Description

Die Erfindung betrifft eine Heizeinrichtung für ein Haushaltsgerät, aufweisend einen flächigen Träger mit einer elektrisch isolierenden Trägeroberfläche, mindestens eine auf die Trägeroberfläche thermisch aufgespritzte, elektrisch leitfähige Schichtstruktur und mindestens ein elektrisch leitfähiges Kontaktvolumen, das auf mindestens einer thermisch aufgespritzten Schichtstruktur aufgebracht ist. Die Erfindung betrifft auch ein Haushaltsgerät mit einer solchen Heizeinrichtung. Die Erfindung betrifft ferner ein Verfahren zum elektrischen Verbinden einer thermisch aufgespritzten Schichtstruktur eines Haushaltsgeräts. Die Erfindung ist insbesondere vorteilhaft anwendbar auf Gargeräte, insbesondere Dampfgargeräte, auf wasserführende Wäschepflegegeräte, auf Spülmaschinen und auf Haushaltskleingeräte.The invention relates to a heating device for a household appliance, comprising a flat carrier with an electrically insulating carrier surface, at least one electrically conductive layer structure thermally sprayed onto the carrier surface and at least one electrically conductive contact volume which is applied to at least one thermally sprayed layer structure. The invention also relates to a household appliance with such a heating device. The invention also relates to a method for electrically connecting a thermally sprayed-on layer structure of a household appliance. The invention is particularly advantageously applicable to cooking appliances, in particular steamers, to water-bearing laundry care appliances, to dishwashers and to small household appliances.

Um bei einer Heizeinrichtung der eingangs genannten Art die thermisch aufgespritzte Schichtstruktur elektrisch anzuschließen, wird Lot oder Lötmasse als Kontaktvolumen verwendet. Jedoch muss für die meisten Lote ein Flussmittel verwendet werden, damit das Lot auf der Schichtstruktur haftet. Das Flussmittel kann von der Schichtstruktur, die in der Regel leicht porös ist, aufgesogen werden. Dies kann die Verbindung des Lots auf der thermisch aufgespritzten Schichtstruktur sowie die Eigenschaften der thermisch aufgespritzten Schichtstruktur selbst negativ beeinflussen. Ist die Schichtstruktur zudem auf eine poröse Isolationsschicht aufgebracht, kann das Flussmittel in die Isolationsschicht eindringen und die elektrischen Isolationseigenschaften nachteilig beeinflussen.In order to electrically connect the thermally sprayed-on layer structure in a heating device of the type mentioned at the outset, solder or soldering compound is used as the contact volume. However, for most solders, a flux must be used so that the solder adheres to the layer structure. The flux can be absorbed by the layer structure, which is usually slightly porous. This can negatively affect the connection of the solder to the thermally sprayed-on layer structure and the properties of the thermally sprayed-on layer structure itself. If the layer structure is also applied to a porous insulation layer, the flux can penetrate into the insulation layer and adversely affect the electrical insulation properties.

DE 31 09 250 A1 offenbart ein elektrisches Haushaltsgerät mit Gehäuseteilen aus elektrisch leitendem Material, die zur elektrischen Schutzerdung elektrisch leitend miteinander verbunden sind. Es soll eine zuverlässige Erdung der verschiedenen leitenden Teile bei niedrigem Fertigungsaufwand erzielt werden. Hierzu wird vorgeschlagen, dass als elektrisch leitende Verbindung eine elektrisch leitende Haftmasse dient. Als Haftmasse dient dabei vorzugsweise ein elektrisch leitender Kleber, z.B. ein organischer Silikonkleber mit Metallpulver oder Kohlenstoff als Füllstoff. Der Kleber behält auch nach dem Aushärten eine gewisse Elastizität bei, was eine Unterbrechung des Kontaktes durch Wärmedehnungen verhindert. DE 31 09 250 A1 discloses an electrical household appliance with housing parts made of electrically conductive material, which are connected to one another in an electrically conductive manner for electrical protective grounding. A reliable grounding of the various conductive parts is to be achieved with low manufacturing costs. For this purpose, it is proposed that an electrically conductive adhesive compound serve as the electrically conductive connection. An electrically conductive adhesive, for example an organic silicone adhesive with metal powder or carbon as filler, is preferably used as the adhesive mass. The adhesive retains a certain elasticity even after it has hardened, which prevents the contact from being interrupted by thermal expansion.

DE 39 13 028 A1 offenbart ein Verfahren und eine Vorrichtung zur Herstellung einer leitenden Verbindung in einem elektrischen Gerät, bei dem wenigstens zwei elektrisch leitend zu verbindende Kontaktelemente voneinander beabstandet auf einem isolierenden Teil angebracht sind. Das Verfahren bzw. die Vorrichtung zur Herstellung einer leitenden Verbindung zeichnen sich dadurch aus, dass mittels einer mehrachsigen Positioniereinheit auf dem isolierenden Teil eine stromleitende Paste aufgebracht wird, die die auf dem isolierenden Teil aufgebrachten Kontaktelemente miteinander verbindet. Jedoch wird hier keine Kontaktierung thermisch aufgespritzter Schichtstrukturen angesprochen. DE 39 13 028 A1 discloses a method and a device for producing a conductive connection in an electrical device, in which at least two contact elements to be connected in an electrically conductive manner are attached to an insulating part at a distance from one another. The method and the device for producing a conductive connection are characterized in that an electrically conductive paste is applied to the insulating part by means of a multi-axis positioning unit, which paste connects the contact elements applied to the insulating part with one another. However, no contacting of thermally sprayed-on layer structures is addressed here.

DE 42 06 700 A1 offenbart eine Kontaktierung der auf einem Träger parallel nebeneinander angeordneten Leiterbahnen mit entsprechend parallel nebeneinander auf einer flexiblen Leiterfolie angeordneten Leiterbahnen, wobei die einander zugeordneten Leiterbahnen von Träger und Leiterfolie in Überdeckung gebracht und leitend miteinander verbunden sind. Zwischen den Leiterbahnen des Trägers und der Leiterfolie ist ein aus einem isolierenden Werkstoff bestehender, eine Vielzahl etwa gleichmäßig verteilter, elektrisch leitender Körnchen enthaltender Kleber angeordnet, durch den Träger und Leiterfolie miteinander verbunden sind. Die leitenden Körnchen sind in den zu verbindenden Bereichen der Leiterbahnen in Anlage aneinander und an den Leiterbahnen und bilden eine leitende Verbindung der einander zugeordneten Leiterbahnen von Träger und Leiterfolie. Auch hier wird keine Kontaktierung thermisch aufgespritzter Schichtstrukturen angesprochen. DE 42 06 700 A1 discloses a contacting of the conductor tracks arranged parallel next to one another on a carrier with conductor tracks correspondingly arranged parallel next to one another on a flexible conductor foil, the interconnected conductor tracks of the carrier and conductor foil being brought into overlap and conductively connected to one another. Between the conductor tracks of the carrier and the conductor foil, an adhesive consisting of an insulating material and containing a large number of approximately evenly distributed electrically conductive granules is arranged, by means of which the carrier and conductor foil are connected to one another. In the areas of the conductor tracks to be connected, the conductive grains are in contact with one another and with the conductor tracks and form a conductive connection between the conductor tracks of the carrier and conductor foil assigned to one another. Here, too, no contacting of thermally sprayed-on layer structures is addressed.

DE 10 2013 109 755 A1 offenbart einen leitfähigen Klebstoff aufweisend zumindest eine Art eines anisotropen leitfähigen Nanomaterials und zumindest eine Art eines photoinduziert polymerisierbaren Materials. Es wird keine Kontaktierung von Schichtstrukturen angesprochen. DE 10 2013 109 755 A1 discloses a conductive adhesive comprising at least one type of anisotropic conductive nanomaterial and at least one type of photoinduced polymerizable material. Contacting of layer structures is not addressed.

EP 0 681 712 B1 offenbart eine elektro-optische Dünnschicht-Vorrichtung mit einer elektrisch ansprechenden Schicht mit optischen Eigenschaften, die sich unter Einwirkung eines auf die Schicht aufgebrachten Stroms oder elektrischen Feldes verändern; mindestens einer Elektrode, die sich über die elektrisch ansprechende Schicht hinaus erstreckt und in der Lage ist, der elektrisch ansprechenden Schicht einen elektrischen Strom zuzuführen; und einem elektrischen Konnektor, der entlang einem einzigen Rand der Vorrichtung angeordnet ist und derart konfiguriert ist, dass er der Elektrode elektrischen Strom aus einer Stromquelle zuführt, wobei der elektrische Konnektor aufweist: eine flexible Isolierung, die an mindestens einer Fläche einen elektrisch leitenden Abschnitt aufweist, der in der Lage ist, einen elektrischen Kontakt zwischen der Elektrode und einer Stromquelle herzustellen, einen elektrisch leitenden Kleber, der an dem elektrisch leitenden Abschnitt der Isolierung nahe der Elektrode angeordnet ist, um einen elektrischen Kontakt mit der Elektrode herzustellen, wobei der elektrisch leitende Kleber elektrisch leitende Partikel aufweist, die über eine gesamte haftvermittelnde Matrix hinweg verteilt sind, und eine Verbindungseinrichtung, die sich in elektrischem Kontakt mit dem elektrisch leitenden Abschnitt der Isolierung befindet und in der Lage ist, einen elektrischen Kontakt mit einer Stromquelle herzustellen, wobei mindestens ein Abschnitt der Isolierung in einen Abschnitt der elektrisch ansprechenden Schicht der Vorrichtung eingeführt ist, und dass der wirksame Kontaktbereich zwischen den elektrisch leitenden Partikeln und der Elektrode hinreichend groß ist, um eine Stromübertragung zu gewährleisten, während ein Aufbau von Wärme in der Elektrode in dem Bereich unterhalb der elektrisch leitenden Partikel minimiert wird. Auch hierin wird keine Kontaktierung thermisch aufgespritzter Schichtstrukturen angesprochen. EP 0 681 712 B1 discloses an electro-optic thin film device having an electrically responsive layer having optical properties that change under the action of a current or electric field applied to the layer; at least one electrode extending beyond the electrically responsive layer and capable of delivering an electrical current to the electrically responsive layer; and an electrical connector extending along a single edge of the device and is configured to supply electrical power to the electrode from a power source, the electrical connector comprising: flexible insulation having an electrically conductive portion on at least one surface that is capable of electrical contact between the Electrode and a power source, an electrically conductive adhesive disposed on the electrically conductive portion of the insulation near the electrode to make electrical contact with the electrode, the electrically conductive adhesive having electrically conductive particles overlying an entire adhesive matrix are distributed away, and a connecting device which is in electrical contact with the electrically conductive portion of the insulation and is capable of making electrical contact with a power source, wherein at least a portion of the insulation in a portion of the electrically claimed The same layer of the device is introduced, and that the effective contact area between the electrically conductive particles and the electrode is sufficiently large to ensure a current transfer while a build-up of heat in the electrode in the area below the electrically conductive particles is minimized. Contacting thermally sprayed-on layer structures is not addressed here either.

EP 0 963 143 A1 offenbart einen keramischen Träger mit einer elektrischen Schaltung und einer Anschlussvorrichtung, die wenigstens einen metallischen Anschluss, beispielsweise in Form eines Gewindebolzens, aufweist. Der Anschluss bzw. die Anschlussvorrichtung sind mit Ausgleichsmitteln, welche aus einem Metall mit einer höheren Verformbarkeit als das Material des Anschlusses bestehen, mit dem Träger verbunden, vorzugsweise mittels Aktivlötens. Die Ausgleichsmittel können in Form einer Ringscheibe o.dgl. ausgeführt sein und aus Kupfer bestehen und gleichen die Spannungen beim Abkühlen aus. Das Aktivlot weist vorteilhaft eine Basis aus Silber und Kupfer sowie eine reaktive Legierungskomponente, z.B. Titan oder ein Selten-Erd-Metall, auf. Die Anschlussvorrichtung kann sowohl einen hochbelastbaren mechanischen Befestigungsanschluss für den Träger als auch einen elektrischen Anschluss für die Schaltung darstellen. EP 0 963 143 A1 discloses a ceramic carrier with an electrical circuit and a connection device which has at least one metallic connection, for example in the form of a threaded bolt. The connection or the connection device are connected to the carrier with compensating means, which consist of a metal with a higher deformability than the material of the connection, preferably by means of active soldering. The compensating means can or the like in the form of an annular disk. be designed and made of copper and equalize the stresses during cooling. The active solder advantageously has a base made of silver and copper and a reactive alloy component, for example titanium or a rare earth metal. The connection device can represent both a heavy-duty mechanical fastening connection for the carrier and an electrical connection for the circuit.

WO 97/42638 offenbart ein Verfahren zur elektrisch leitenden und spannungsarmen Verklebung von empfindlichen und präzise zu positionierenden Werkstücken mit ggf. unterschiedlichem thermischen Ausdehnungskoeffizienten, bei dem der Klebstoff aufgetragen wird, dann die Härtungsreaktion photochemisch ausgelöst wird und dann innerhalb von einer Sekunde bis 15 Minuten die zu verklebenden Werkstücke positioniert werden. Es wird eine Klebstoff-formulierung verwendet, die einkomponentig, bei Raumtemperatur lagerstabil und mit Metallpartikeln gefüllt ist. WO 97/42638 discloses a method for electrically conductive and low-tension bonding of sensitive and precisely positioned workpieces with possibly different thermal expansion coefficients, in which the adhesive is applied, then the curing reaction is triggered photochemically and then within one second the workpieces to be bonded can be positioned within 15 minutes. An adhesive formulation is used which is a one-component, storage-stable at room temperature and filled with metal particles.

WO 98/44593 offenbart eine elektrische Verbindungsanordnung zum Verbinden eines Schaltungsträgers mit Leiterbahnen eines Leiterbahnträgers, wobei der Schaltungsträger und der Leiterbahnträger von einer Grundplatte getragen sind, der Schaltungsträger und der Leiterbahnträger einen Bereich aufweisen, in dem sie sich überlappen, und der Schaltungsträger in dem Bereich der Überlappung mittels eines elektrisch leitenden Klebers mit dem Leiterbahnträger elektrisch verbunden ist. WO 98/44593 offenbart ferner ein Verfahren zum elektrischen Verbinden eines Schaltungsträgers mit Leiterbahnen eines Leiterbahnträgers, wobei der Leiterbahnträger auf einer Grundplatte fixiert wird, der Leiterbahnträger wird auf seiner der Grundplatte abgewandten Seite in einem Bereich, der frei von einer isolierenden Abdeckung gegenüber einer Leiterbahn ist, mit einem elektrisch leitenden Kleber versehen, und ein Schaltungsträger auf den Leiterbahnträger geklebt wird, so dass eine elektrische Verbindung zwischen einer Leiterbahn des Leiterbahnträgers und einer Kontaktstelle des Schaltungsträgers entsteht. WO 98/44593 discloses an electrical connection arrangement for connecting a circuit carrier with conductor tracks of a conductor track carrier, the circuit carrier and the conductor track carrier being carried by a base plate, the circuit carrier and the conductor track carrier having an area in which they overlap, and the circuit carrier in the area of the overlap by means of a electrically conductive adhesive is electrically connected to the conductor carrier. WO 98/44593 further discloses a method for electrically connecting a circuit carrier with conductor tracks of a conductor track carrier, wherein the conductor track carrier is fixed on a base plate, the conductor track carrier is electrically connected on its side facing away from the base plate in an area that is free of an insulating cover opposite a conductor track Provided conductive adhesive, and a circuit carrier is glued to the conductor track carrier, so that an electrical connection is created between a conductor track of the conductor track carrier and a contact point of the circuit carrier.

DE 10 2012 212 798 A1 offenbart ein Heizelement mit mindestens einem thermoelektrischen Heizkörper, wobei der Heizkörper zumindest teilweise mit einem Leitmaterial gebildet ist und der Heizkörper über mindestens zwei Leiterbahnen mit elektrischer Energie versorgbar ist. Dabei sind die Leiterbahnen mittels eines thermischen Spritzverfahrens, insbesondere durch Plasmaspritzen gemäß DIN 657, ausgebildet. Infolge der thermisch aufgespritzten Leiterbahnen ergibt sich eine gute elektrische Anbindung der Leiterbahnen an die leitfähigen Partikel innerhalb der Matrix des Leitmaterials des Heizkörpers. Ferner ergibt sich eine mechanisch belastbare Anbindung der Leiterbahnen an den Heizkörper. Dem Heizkörper kann eine Vielzahl von dreidimensionalen Formen verliehen werden, so dass sich für das Heizelement eine Vielzahl von Anwendungen ergibt. So kann der Heizkörper beispielsweise die Gestalt einer rohrartigen Fluidleitung haben, so dass das Heizelement neben seiner eigentlichen Heizfunktion zugleich auch andere konstruktiv vorgegebene Aufgaben erfüllen kann. Aufgrund dieser Funktionsintegration bzw. Doppelfunktionalität ergeben sich beim Einsatz des Heizelementes signifikante konstruktive Vereinfachungen und Optimierungsmöglichkeiten, die ein beträchtliches Kosteneinsparungspotenzial in sich bergen. Daneben wird ein Verfahren offenbart, insbesondere zur Herstellung des Heizelementes, sowie Verwendungen des Heizelementes zum Gegenstand. DE 10 2012 212 798 A1 discloses a heating element with at least one thermoelectric heating element, the heating element being at least partially formed with a conductive material and the heating element being able to be supplied with electrical energy via at least two conductor tracks. The conductor tracks are formed by means of a thermal spraying process, in particular by plasma spraying in accordance with DIN 657. As a result of the thermally sprayed-on conductor tracks, there is a good electrical connection between the conductor tracks and the conductive particles within the matrix of the conductive material of the heater. Furthermore, there is a mechanically resilient connection of the conductor tracks to the radiator. The radiator can be given a variety of three-dimensional shapes, resulting in a variety of uses for the heating element. For example, the heating element can have the shape of a pipe-like fluid line, so that the heating element, in addition to its actual heating function, can also fulfill other structurally prescribed tasks at the same time. Due to this functional integration or dual functionality, when using the heating element, there are significant structural simplifications and optimization options that hold considerable potential for cost savings. In addition, a method is disclosed, in particular for producing the heating element, as well as uses of the heating element as the subject matter.

Es ist die Aufgabe der vorliegenden Erfindung, die Nachteile des Standes der Technik zumindest teilweise zu überwinden und insbesondere eine verbesserte Möglichkeit zur elektrischen Kontaktierung einer thermisch gespritzten Schicht oder Schichtstruktur eines Haushaltsgeräts bereitzustellen.It is the object of the present invention to at least partially overcome the disadvantages of the prior art and in particular to provide an improved possibility for electrical contacting of a thermally sprayed layer or layer structure of a household appliance.

Diese Aufgabe wird gemäß den Merkmalen der unabhängigen Ansprüche gelöst. Bevorzugte Ausführungsformen sind insbesondere den abhängigen Ansprüchen entnehmbar.This object is achieved according to the features of the independent claims. Preferred embodiments can be inferred in particular from the dependent claims.

Die Aufgabe wird gelöst durch eine Heizeinrichtung für ein Haushaltsgerät, aufweisend einen flächigen Träger mit einer elektrisch isolierenden Oberfläche (im Folgenden ohne Beschränkung der Allgemeinheit als "Trägeroberfläche" bezeichnet), mindestens eine auf die Trägeroberfläche thermisch aufgespritzte, elektrisch leitfähige Schichtstruktur und mindestens ein elektrisch leitfähiges Kontaktvolumen, das auf mindestens einer thermisch aufgespritzten Schichtstruktur aufgebracht ist, wobei mindestens ein Kontaktvolumen aus elektrisch leitfähigem Kleber (im Folgenden ohne Beschränkung der Allgemeinheit als "Leitkleber" bezeichnet) besteht.The object is achieved by a heating device for a household appliance, having a flat carrier with an electrically insulating surface (hereinafter referred to as "carrier surface" without loss of generality), at least one electrically conductive layer structure thermally sprayed onto the carrier surface and at least one electrically conductive layer structure Contact volume which is applied to at least one thermally sprayed-on layer structure, at least one contact volume consisting of electrically conductive adhesive (hereinafter referred to as “conductive adhesive” without restricting the generality).

Der Leitkleber ist ein reaktiver einkomponentiger (1-K-)Leitkleber ist. Dieser weist den Vorteil einer besonders einfachen Handhabung auf. Der 1-K-Leitkleber kann beim Klebstoffhersteller vorgemischt werden, d.h., dass z.B.-Harz und ein Härter bereits im richtigen Mischungsverhältnis gemischt sind. Die Härtungsreaktion kann durch Tieftemperaturlagerung stark verzögert werden.The conductive adhesive is a reactive one-component (1-component) conductive adhesive. This has the advantage of being particularly easy to use. The 1-component conductive adhesive can be premixed by the adhesive manufacturer, i.e. that, for example, resin and a hardener are already mixed in the correct mixing ratio. The hardening reaction can be greatly delayed by storage at low temperatures.

Die Verwendung von Leitkleber weist den Vorteil auf, dass dieser eine gute Haftfestigkeit auf der thermisch aufgespritzten Schicht oder Schichtstruktur aufweist, besonders auf porösen Schichten. Dabei kann auf einen Einsatz von Flussmitteln wie beim klassischen Löten verzichtet werden. Beim klassischen Löten mit Flussmittel dringt dieses in die porösen thermisch gespritzten Schichten ein. Um einen negativen Einfluss des Flussmittels zu vermeiden, muss es aufwendig mit Lösemittel ausgewaschen werden. Dieser Schritt kann nun eingespart werden. Auch kann im Gegensatz zum Löten auf einen Lötstopplack verzichtet werden.The use of conductive adhesive has the advantage that it has good adhesive strength on the thermally sprayed-on layer or layer structure, especially on porous layers. There is no need to use flux as in traditional soldering. In classic soldering with flux, this penetrates the porous, thermally sprayed layers. In order to avoid a negative influence of the flux, it has to be washed out with solvent. This step can now be saved. In contrast to soldering, a solder mask can also be dispensed with.

Darüber hinaus ergibt sich durch die genau einstellbare Viskoelastizität des Leitklebers eine hohe Applikationsgenauigkeit. Dadurch ist der Leitkleber auch für kleine Kontaktierflächen geeignet, so dass auch kleine Klebemengen, positionsgenau und ohne Spritzer realisierbar sind.In addition, the precisely adjustable viscoelasticity of the conductive adhesive results in a high level of application accuracy. As a result, the conductive adhesive is also suitable for small contact areas, so that even small amounts of adhesive can be implemented with precise positioning and without splashes.

Darüber hinaus ist die Thixotropie des Klebesystems so einstellbar, dass nach einem Positionieren oder Platzieren eines Bauteils dieses in seiner Position gehalten wird.In addition, the thixotropy of the adhesive system can be adjusted so that after a component has been positioned or placed, it is held in its position.

Noch ein weiterer Vorteil der Verwendung des Leitklebers ist seine gute Haftung auch auf glatten, nicht-porösen Oberflächen, z.B. auf kompakten polierten Oberflächen.Another advantage of using the conductive adhesive is its good adhesion, even on smooth, non-porous surfaces, e.g. on compact, polished surfaces.

Der Leitkleber kann ohne weiteres so eingestellt werden, dass praktisch kein oder nur wenig Klebstoff in die thermisch aufgespritzte Schichtstruktur oder ein anderes poröses Substrat eindringt, so dass Eigenschaften des Substrats, z.B. Isolationseigenschaften, nicht negativ beeinflusst werden. Ferner ergibt sich eine nur geringe ionische Verunreinigung, was eine Korrosion an der Kontaktstelle zu vermeiden hilft. Dringt der nicht elektrisch leitfähige, organische Klebstoff in die thermisch aufgespritzte Schichtstruktur oder ein anderes poröses Substrat ein (was auch als Ausbluten (Harzbluten) bezeichnet wird), hat dies keine negativen Auswirkungen auf die elektrischen Eigenschaften der thermisch aufgespritzten Schichtstruktur.The conductive adhesive can easily be adjusted so that practically no or only little adhesive penetrates the thermally sprayed-on layer structure or another porous substrate, so that properties of the substrate, for example insulation properties, are not adversely affected. Furthermore, there is only a slight ionic contamination, which helps to avoid corrosion at the contact point. If the non-electrically conductive, organic adhesive penetrates the thermally sprayed-on layer structure or another porous substrate (which is also known as bleeding (resin bleeding) is), this has no negative effects on the electrical properties of the thermally sprayed-on layer structure.

Ferner ist ausgehärteter Leitkleber temperaturstabil bis mindestens 150°C ausgestaltbar. Er weist eine gute mechanische Festigkeit und einen angepassten thermischen Ausdehnungskoeffizient auf, beispielsweise bei einer Temperaturwechselbeanspruchung. Er ist auch bei hohen Dauergebrauchstemperaturen über die gesamte Produktlebensdauer ausreichend alterungsstabil.Furthermore, hardened conductive adhesive can be designed to be temperature-stable up to at least 150 ° C. It has good mechanical strength and an adapted coefficient of thermal expansion, for example when exposed to thermal cycling. Even at high continuous use temperatures, it is sufficiently resistant to aging over the entire service life of the product.

Zudem stellt Leitkleber ein Kontaktvolumen mit einer guten elektrischen Leitfähigkeit (beispielsweise von mindestens 1*106 S/m, insbesondere mindestens 1,5*106 S/m) bereit. Dabei ergibt sich ein niedriger Kontaktwiderstand zwischen dem Leitkleber und der thermisch aufgespritzten Schichtstruktur. Die entstehende Verbindung weist ferner einen niedrigen Temperaturbeiwert auf, wobei insbesondere elektrische Eigenschaften des Leitklebers wie sein Widerstand über die Produktlebensdauer nicht wesentlich ansteigen.In addition, conductive adhesive provides a contact volume with good electrical conductivity (for example of at least 1 * 10 6 S / m, in particular at least 1.5 * 10 6 S / m). This results in a low contact resistance between the conductive adhesive and the thermally sprayed-on layer structure. The resulting connection also has a low temperature coefficient, with in particular electrical properties of the conductive adhesive, such as its resistance, not increasing significantly over the service life of the product.

Unter einem Leitkleber kann insbesondere ein Kleber mit einer Matrix aus viskosem, insbesondere pastösem, Klebstoff (z.B. Harz, insbesondere Epoxidharz) mit elektrisch leitfähigen Partikeln als Füllmaterial verstanden werden. Der Klebstoff kann allgemein ein Polymer oder mehrere Polymere aufweisen. Das Füllmaterial kann z.B. Metallpartikel wie Kupfer-, Silber- und/oder Gold-Partikel umfassen, aber auch andere elektrisch leitfähige und temperaturbeständige Materialien wie bestimmte Kohlenstoffvarianten (z.B. CNTs). Die Partikel können Pulverpartikel sein. Der Leitkleber ist zur Prozessierung hoch- bzw. mittelviskos und in seinem Endzustand fest. Während des Aushärtungsprozesses schrumpft der Leitklebstoff (chemischer Volumenschrumpf durch Vernetzungsreaktion), so dass die elektrisch leitfähigen Partikel sich berühren und folglich punkt-, linien- und/oder flächige Berührungen ausbilden können, wodurch sich wiederum Strompfade im Leitkleber ausbilden können. Es gibt typischerweise keinen definierten Schmelzpunkt, sondern nur einen klebstoffspezifischen Glasübergangsbereich.A conductive adhesive can in particular be understood to mean an adhesive with a matrix of viscous, in particular pasty, adhesive (e.g. resin, in particular epoxy resin) with electrically conductive particles as filler material. The adhesive can generally have one or more polymers. The filler material can, for example, comprise metal particles such as copper, silver and / or gold particles, but also other electrically conductive and temperature-resistant materials such as certain types of carbon (e.g. CNTs). The particles can be powder particles. The conductive adhesive has a high or medium viscosity for processing and is solid in its final state. During the curing process, the conductive adhesive shrinks (chemical volume shrinkage due to crosslinking reaction), so that the electrically conductive particles touch each other and consequently can form point, line and / or surface contacts, which in turn can form current paths in the conductive adhesive. There is typically no defined melting point, but only an adhesive-specific glass transition area.

Der Klebstoff ist vorzugsweise additionsvernetzend, so dass beim Aushärten keine chemischen Spaltprodukte entstehen, die aus dem Material austreten/verdunsten, so wie es z.B. bei Silikonen der Fall ist, die als "kondensationsvernetzend" bezeichnet werden. Als additionsvernetzender Klebstoff ist insbesondere additionsvernetzendes Silikon vorgesehen.The adhesive is preferably addition-crosslinking, so that no chemical cleavage products are formed during curing that escape / evaporate from the material, as is the case, for example, with silicones, which are referred to as "condensation-crosslinking". When Addition-crosslinking adhesive, in particular, addition-crosslinking silicone is provided.

Unter einem flächigen Träger kann beispielsweise ein ebener Träger oder ein gekrümmter Träger (z.B. in Rohrform) verstanden werden. Der Träger kann insbesondere eine plattenartige Grundform aufweisen.A flat carrier can be understood to mean, for example, a flat carrier or a curved carrier (e.g. in the form of a tube). The carrier can in particular have a plate-like basic shape.

Die elektrisch isolierende Trägeroberfläche kann eine auf einen Grundkörper oder Substrat des Trägers (z.B. ein Metallblech) aufgebrachte elektrisch isolierende Schicht (z.B. aus Keramik) sein. Diese Schicht kann ebenfalls thermisch aufgespritzt worden sein. Die elektrisch isolierende Trägeroberfläche kann aber auch ein oberflächenbehandelter (z.B. oxidierter) Schichtbereich eines Grundkörpers des Trägers sein. Die elektrisch isolierende Trägeroberfläche kann insbesondere eine nicht vernachlässigbare Porosität aufweisen. Bei Verwendung von Lotflussmittel kann dieses ggf. in die zugehörigen Poren eindringen und ggf. Fähigkeit zur elektrischen Isolierung herabsetzen oder zu einem Durchschlag beim Anlegen von Hochspannung (z.B. von mehr als 1000 V) führen.The electrically insulating carrier surface can be an electrically insulating layer (e.g. made of ceramic) applied to a base body or substrate of the carrier (e.g. a metal sheet). This layer can also have been thermally sprayed on. The electrically insulating support surface can, however, also be a surface-treated (e.g. oxidized) layer area of a base body of the support. The electrically insulating support surface can in particular have a non-negligible porosity. When using solder flux, it can penetrate the associated pores and possibly reduce the ability to provide electrical insulation or lead to a breakdown when high voltage is applied (e.g. of more than 1000 V).

Insbesondere falls der Grundkörper bereits selbst elektrisch isolierend und temperaturbeständig (bis mindestens 150°C) ist, kann auch auf eine speziell ausgebildete oberflächliche Schicht verzichtet werden, und die Trägeroberfläche stellt dann die nicht-modifizierte Oberfläche des Grundkörpers dar. Dies kann beispielsweise der Fall sein, wenn der Grundkörper aus Keramik besteht.In particular, if the base body itself is electrically insulating and temperature-resistant (up to at least 150 ° C), a specially designed superficial layer can be dispensed with, and the carrier surface then represents the unmodified surface of the base body. This can be the case, for example if the base body is made of ceramic.

Unter einer thermisch aufgespritzten Schicht kann eine Schicht verstanden werden, die beispielsweise durch Schmelzbadspritzen, Lichtbogenspritzen, Plasmaspritzen (z.B. Atmosphäre, unter Schutzgas oder unter niedrigem Druck), Flammspritzen (z.B. Pulverflammspritzen, Drahtflammspritzen oder Kunststoffflammspritzen), Hochgeschwindigkeit-Flammspritzen, Detonationsspritzen, Kaltgasspritzen, Laserspritzen oder PTWA-Spritzen hergestellt worden ist, insbesondere auf die Trägeroberfläche aufgespritzt worden ist.A thermally sprayed-on layer can be understood to mean a layer that is produced, for example, by molten bath spraying, arc spraying, plasma spraying (e.g. atmosphere, under protective gas or under low pressure), flame spraying (e.g. powder flame spraying, wire flame spraying or plastic flame spraying), high-speed flame spraying, detonation spraying, cold gas spraying or PTWA syringes have been produced, in particular sprayed onto the carrier surface.

Zumindest eine thermisch aufgespritzte Schicht oder Schichtstruktur kann beispielsweise eine metallische Schicht oder Schichtstruktur sein, z.B. aufweisend Aluminium (Al), Bronze, Kupfer (Cu), Silber (Ag), Zinn (Sn) usw., oder einer Legierung davon. Die thermisch aufgespritzte Schicht kann auch eine Nickel-Chrom-Legierung (NiCr) sein. Die thermisch aufgespritzte Schicht kann zudem eine keramische Schicht sein, beispielsweise eine elektrisch isolierende Schicht. Eine Oberfläche der thermisch aufgespritzten Schicht oder Schichtstruktur kann oxidiert sein.At least one thermally sprayed-on layer or layer structure can be, for example, a metallic layer or layer structure, for example comprising aluminum (Al), bronze, copper (Cu), silver (Ag), tin (Sn) etc., or an alloy thereof. The thermally sprayed-on layer can also be a nickel-chromium alloy (NiCr). The thermal The sprayed-on layer can also be a ceramic layer, for example an electrically insulating layer. A surface of the thermally sprayed-on layer or layer structure can be oxidized.

Die thermisch aufgespritzte Schicht oder Schichtstruktur kann zumindest teilweise von mindestens einer weiteren Schicht bedeckt sein. Diese mindestens eine weitere Schicht kann eine ("Kontakt"-) Schicht zur verbesserten elektrischen Kontaktierung darstellen, insbesondere aus Metall, z.B. eine Schicht aus Zinn, Kupfer, Silber und/oder Gold. In diesem Fall kann der Leitkleber über die Kontaktschicht auf der thermisch aufgespritzten Schichtstruktur aufgebracht sein.The thermally sprayed-on layer or layer structure can be at least partially covered by at least one further layer. This at least one further layer can represent a ("contact") layer for improved electrical contacting, in particular made of metal, e.g. a layer made of tin, copper, silver and / or gold. In this case, the conductive adhesive can be applied to the thermally sprayed-on layer structure via the contact layer.

Unter einer Schichtstruktur wird insbesondere eine Schicht verstanden, welche in Draufsicht eine von der Form der Trägeroberfläche unterschiedliche Form aufweist, also keine die ganze Trägeroberfläche vollflächig bedeckende Schicht ist. Vielmehr weist die Schichtstruktur auf dem Träger bzw. auf der Trägeroberfläche in Draufsicht eine eigene Kontur ("Außenkontur") auf, die zumindest teilweise auf der Trägeroberfläche (und nicht nur an ihrem Rand) verläuft. Die Schichtstruktur kann insbesondere in Form mindestens einer länglichen Leitungsspur oder Bahn vorliegen. Die Leitungsbahn kann ganz oder abschnittsweise geradlinig und/oder ganz oder abschnittsweise gekrümmt sein. Beispielsweise kann die Leitungsbahn einen mäanderförmigen Verlauf aufweisen. Die Leitungsbahn kann aber z.B. auch in Form eines kurzen Streifens oder eines rechteckigen, runden, ovalen usw. Kontaktfelds vorliegen.A layer structure is understood to mean, in particular, a layer which, in plan view, has a shape different from the shape of the carrier surface, that is to say is not a layer that completely covers the entire carrier surface. Rather, the layer structure on the carrier or on the carrier surface in plan view has its own contour (“outer contour”) which runs at least partially on the carrier surface (and not only on its edge). The layer structure can in particular be in the form of at least one elongate line track or path. The conduction path can be completely or partially straight and / or completely or partially curved. For example, the conduction path can have a meandering course. The conduction path can, however, also be in the form of a short strip or a rectangular, round, oval, etc. contact field, for example.

Unter einem Kontaktvolumen wird insbesondere ein Massevolumen aus elektrisch leitfähigem Kontaktmaterial verstanden, nämlich hier dem Leitkleber.A contact volume is understood to mean, in particular, a mass volume made of electrically conductive contact material, namely the conductive adhesive here.

Es ist eine Ausgestaltung, dass mindestens eine thermisch aufgespritzte Schichtstruktur eine Widerstands-Heizleiterschicht ist, insbesondere eine Dickschicht. Die Heizleiterschicht kann insbesondere eine längliche Heizleiterbahn sein. Die Heizleiterbahn kann z.B. mäanderförmig oder spiralförmig verlaufen. Lotmasse kann insbesondere im Bereich mindestens eines Endes der Heizleiterschicht aufgebracht werden, um diese elektrisch anzuschließen. Als Material der Heizleiterschicht kann insbesondere Aluminium, eine Aluminiumverbindung oder eine Nickel-Chrom-Verbindung vorgesehen sein. Die Heizleiterschicht kann also insbesondere eine thermisch aufgespritzte Flächenheizung für Haushaltsgeräte darstellen.In one embodiment, at least one thermally sprayed-on layer structure is a resistance heating conductor layer, in particular a thick layer. The heat conductor layer can in particular be an elongate heat conductor track. The heating conductor track can, for example, run in a meander shape or in a spiral shape. Solder mass can be applied in particular in the region of at least one end of the heating conductor layer in order to connect it electrically. In particular, aluminum, an aluminum compound or a nickel-chromium compound can be provided as the material of the heating conductor layer. The heat conductor layer can therefore in particular represent a thermally sprayed surface heating for household appliances.

Es ist eine Weiterbildung, dass die thermisch aufgespritzte Schichtstruktur - insbesondere auch eine Heizleiterschicht - mittels einer Spur aus Leitkleber mit einem weiteren elektrisch leitfähigen Bereich der Heizeinrichtung verbunden ist. Der weitere elektrisch leitfähige Bereich kann z.B. eine weitere Heizleiterschicht oder ein elektrischer Anschlusskontakt (z.B. in Form einer thermisch aufgespritzten Schichtstruktur oder als metallisches Kontaktfeld) sein. Der Leitkleber kann insbesondere auch in dieser Weiterbildung teilweise auf der Trägeroberfläche verlaufen.It is a further development that the thermally sprayed-on layer structure - in particular also a heating conductor layer - is connected to a further electrically conductive area of the heating device by means of a trace of conductive adhesive. The further electrically conductive area can be, for example, a further heating conductor layer or an electrical connection contact (e.g. in the form of a thermally sprayed-on layer structure or as a metallic contact field). In particular, the conductive adhesive can also partially run on the carrier surface in this development.

Es ist noch eine Ausgestaltung, dass die thermisch aufgespritzte Schichtstruktur für Lot(fluss)mittel durchlässig ist. Würde Lotflussmittel in die Schichten eindringen, könnten die elektrischen Eigenschaften und eine Korrosionsstabilität der thermisch aufgespritzten Schichtstruktur nachteilig beeinflusst werden. Hingegen können die leitfähigen Anteile (d.h., der elektrisch leitfähige Füllstoff) des Leitklebers nicht in die thermisch aufgespritzte Schichtstruktur eingingen, so dass dadurch eine negative Beeinflussung der Schichteigenschaften vermieden wird. Die thermisch aufgespritzte Schichtstruktur ist also für die die leitfähigen Anteile des Leitklebers undurchlässig. Die thermisch aufgespritzte Schichtstruktur kann ferner für den Klebstoff undurchlässig oder nur teilweise (leicht) durchlässig sein.Another embodiment is that the thermally sprayed-on layer structure is medium permeable to solder (flux). If solder flux penetrated the layers, the electrical properties and corrosion stability of the thermally sprayed-on layer structure could be adversely affected. On the other hand, the conductive components (i.e. the electrically conductive filler) of the conductive adhesive cannot enter the thermally sprayed-on layer structure, so that a negative influence on the layer properties is avoided. The thermally sprayed-on layer structure is therefore impermeable to the conductive parts of the conductive adhesive. The thermally sprayed-on layer structure can also be impermeable to the adhesive or only partially (slightly) permeable.

Es ist eine weitere Ausgestaltung, dass die - ggf. auch thermisch aufgespritzte - Trägeroberfläche für Lotflussmittel durchlässig ist. Würde Lotflussmittel in die Trägeroberfläche eindringen, könnten die elektrischen Eigenschaften und eine Korrosionsstabilität der Trägeroberfläche nachteilig beeinflusst werden. Hingegen können die leitfähigen Anteile (d.h., der elektrisch leitfähige Füllstoff) des Leitklebers nicht in die Trägeroberfläche eingingen, so dass dadurch eine negative Beeinflussung ihrer Eigenschaften vermieden wird. Die Trägeroberfläche ist also für die die leitfähigen Anteile des Leitklebers undurchlässig. Die Trägeroberfläche kann ferner für den Klebstoff undurchlässig oder nur teilweise (leicht) durchlässig sein.It is a further embodiment that the carrier surface - possibly also thermally sprayed on - is permeable to solder flux. If solder flux penetrated the carrier surface, the electrical properties and corrosion stability of the carrier surface could be adversely affected. In contrast, the conductive components (ie the electrically conductive filler) of the conductive adhesive cannot penetrate the carrier surface, so that a negative influence on its properties is avoided as a result. The carrier surface is therefore impermeable to the conductive parts of the conductive adhesive. The carrier surface can also be impermeable to the adhesive or only partially (slightly) permeable.

Das Aushärten kann bei Raumtemperatur oder vorzugsweise bei erhöhter Temperatur (beispielsweise in einem Ofen) geschehen. Höhere Temperaturen beschleunigen die Härtungsreaktion und verbessern die elektrischen Eigenschaften. Ggf. kann das Aushärten auch mittels eines Photoinitiators durchgeführt werden, der in dem Klebstoff enthalten ist. Solche Klebstoffe werden auch als UV- bzw. lichthärtende Klebstoffe bezeichnet.The curing can take place at room temperature or preferably at an elevated temperature (for example in an oven). Higher temperatures accelerate the curing reaction and improve the electrical properties. If necessary, this can harden can also be carried out by means of a photoinitiator contained in the adhesive. Such adhesives are also referred to as UV or light-curing adhesives.

Es ist ferner eine Ausgestaltung, dass mindestens ein Kontaktvolumen zwei thermisch aufgespritzte Schichtstrukturen - insbesondere Leiterbahnen - verbindet und dazu auf der zwischen den Schichtstrukturen vorhandenen Trägeroberfläche aufliegt. So können insbesondere auch zwei oder mehr elektrisch getrennte Abschnitte einer Leitung miteinander verbunden werden, z.B. zwei oder mehr - beispielsweise parallel zueinander verlaufende - Heizleiterschichten (insbesondere Heizeiterbahnen) zu einem gemeinsamen Heizleiter oder Heizelement. Dies kann z.B. zum nachträglichen Abgleich eines elektrischen Widerstandes eines thermisch aufgespritzten Heizleiters genutzt werden, um eine geforderte Nennleistung der Heizeinrichtung zu gewährleisten ("Trimmen") und/oder um Fehlstellen in thermisch aufgespritzten Leiterbahnen (z.B. Heizleiterbahnen) zu reparieren.It is also an embodiment that at least one contact volume connects two thermally sprayed-on layer structures - in particular conductor tracks - and for this purpose rests on the carrier surface present between the layer structures. In particular, two or more electrically separate sections of a line can also be connected to one another, e.g. two or more heating conductor layers (in particular heating conductor tracks) - for example running parallel to one another - to form a common heating conductor or heating element. This can be used, for example, for the subsequent adjustment of the electrical resistance of a thermally sprayed-on heating conductor in order to guarantee the required nominal output of the heating device ("trimming") and / or to repair defects in thermally sprayed-on conductor tracks (e.g. heating conductor tracks).

Es ist auch eine Ausgestaltung, dass mindestens ein Kontaktvolumen eine thermisch aufgespritzte Schichtstruktur mit einem elektrischen Kontaktfeld eines insbesondere oberflächenmontierbaren Bauelements - auch als SMD ("Surface Mounted Device")-Bauteil bezeichnet - verbindet. So können thermisch aufgespritzte Schichtstrukturen und elektrische und/oder elektronische Bauelemente besonders einfach und preiswert miteinander verbunden werden. Es ist eine Weiterbildung, dass dazu mittels eines Dispensers auf die thermisch aufgespritzte Schichtstruktur ein insbesondere kleines Leitklebervolumen oder "Leitkleberpunkt" aufgebracht wird und vor Aushärtung des Leitklebers das SMD-Bauteil mit seinen Kontaktflächen (Terminals) auf den Leitkleberpunkt aufgedrückt wird. Es folgt die Aushärtung des Leitklebers, beispielsweise durch einen Ofenprozess. Danach ist das SMD-Bauteil sicher auf der thermisch gespritzten Schicht oder Schichtstruktur befestigt. Das SMD-Bauteil (z.B. der Größe 0603, 0805 oder 1206) kann mittels eines Vakuumgreifers positioniert oder platziert werden. Für eine solche SMD-Montage kann auf sogenannte "Underfiller" verzichtet werden, die beim SMD-Löten teilweise notwendig sind, damit das SMD-Bauteil seine vorgesehene Position während des Lötprozesses nicht verändert. Bedrahtete Bauteile, die für eine Durchsteckmontage (THT; "Through Hole Technology") vorgesehen sind, können ebenfalls mittels des Leitklebers über ihren metallischen Kontakt mit der thermisch aufgespritzten Struktur verbunden werden.It is also an embodiment that at least one contact volume connects a thermally sprayed-on layer structure with an electrical contact field of an in particular surface-mountable component - also referred to as an SMD ("Surface Mounted Device") component. In this way, thermally sprayed-on layer structures and electrical and / or electronic components can be connected to one another in a particularly simple and inexpensive manner. In a further development, a particularly small volume of conductive adhesive or "conductive adhesive point" is applied to the thermally sprayed layer structure by means of a dispenser and the SMD component with its contact surfaces (terminals) is pressed onto the conductive adhesive point before the conductive adhesive hardens. The conductive adhesive then hardens, for example by means of an oven process. The SMD component is then securely attached to the thermally sprayed layer or layer structure. The SMD component (eg size 0603, 0805 or 1206) can be positioned or placed using a vacuum gripper. For such an SMD assembly, so-called "underfillers" can be dispensed with, some of which are necessary with SMD soldering so that the SMD component does not change its intended position during the soldering process. Wired components that are intended for through-hole assembly (THT; "Through Hole Technology") can also be connected to the thermally sprayed-on structure by means of the conductive adhesive via their metallic contact.

Das SMD-Bauteil kann beispielsweise ein wärmeempfindlicher Widerstand (z.B. ein NTC-Widerstand), eine Schmelzsicherung, eine - z.B. in Glaslot vergossener - Sensor usw. sein.The SMD component can, for example, be a heat-sensitive resistor (e.g. an NTC resistor), a fuse, a sensor, etc.

Es ist außerdem eine Ausgestaltung, dass zwei thermisch aufgespritzte Leiterbahnen durch ein elektrisches Bauelement elektrisch miteinander verbunden werden, wobei Kontaktfelder des Bauelements mit den jeweiligen Leiterbahnen über Klebepunkte aus dem elektrisch leitfähigen Leitkleber verbunden sind.It is also an embodiment that two thermally sprayed-on conductor tracks are electrically connected to one another by an electrical component, with contact fields of the component being connected to the respective conductor tracks via adhesive dots made of the electrically conductive adhesive.

Es ist auch eine Ausgestaltung, dass mindestens ein Kontaktvolumen aus Leitkleber zumindest einen Abschnitt der thermisch aufgespritzten Schichtstruktur - insbesondere einer Heizleiterschicht - bedeckt, ohne sie mit einer anderen Komponente der Heizeinrichtung elektrisch zu verbinden. Es kann in dieser Ausgestaltung insbesondere mindestens ein Kontaktvolumen aus Leitkleber (auch als "Leitschicht" bezeichnet) auf der Heizleiterschicht aufgebracht werden, um lokal eine elektrische Stromdichte in der Heizleiterschicht herabzusetzen. Dadurch wiederum kann lokal eine Übertemperatur (sog. "Hot Spots") verhindert werden. Eine Leitschicht kann beispielsweise an Leistungsanschlüssen, an konstruktiv bedingten Verengungen in Leiterbahnen, an Ecken und/oder an Umkehrpunkten im Heizleiterlayout aufgebracht werden. Die Leitschicht bzw. der Leitkleber kann dabei auch auf der Trägeroberfläche aufliegen.It is also an embodiment that at least one contact volume made of conductive adhesive covers at least one section of the thermally sprayed-on layer structure - in particular a heating conductor layer - without electrically connecting it to another component of the heating device. In this embodiment, in particular at least one contact volume made of conductive adhesive (also referred to as “conductive layer”) can be applied to the heating conductor layer in order to locally reduce an electrical current density in the heating conductor layer. This in turn can prevent local overtemperature (so-called "hot spots"). A conductive layer can be applied, for example, to power connections, to constrictions in conductor tracks due to the design, to corners and / or to reversal points in the heating conductor layout. The conductive layer or the conductive adhesive can also rest on the carrier surface.

Die Aufgabe wird auch gelöst durch ein Haushaltsgerät mit mindestens einer Heizeinrichtung wie oben beschrieben. Das Haushaltsgerät ergibt die gleichen Vorteile wie die Heizeinrichtung und kann analog ausgebildet werden.The object is also achieved by a household appliance with at least one heating device as described above. The household appliance has the same advantages as the heating device and can be designed analogously.

Das Haushaltsgerät kann beispielsweise ein Gargerät oder ein Zubehör für ein Gargerät (z.B. ein beheizbarer Garraumteiler) sein. Das Gargerät kann beispielsweise eine Dampfgarfunktion aufweisen, wobei die Heizeinrichtung einer Dampferzeugungsvorrichtung zugeordnet ist, um in der Dampferzeugungsvorrichtung vorhandenes Wasser zu verdampfen. Das Gargerät kann z.B. ein Backofen mit Dampfgarfunktionalität oder ein dedizierter Dampfgarer sein. Die Heizeinrichtung mag dann z.B. einen Boden eines Wassertanks darstellen.The household appliance can be, for example, a cooking appliance or an accessory for a cooking appliance (for example a heatable cooking space divider). The cooking appliance can, for example, have a steam cooking function, the heating device being assigned to a steam generating device in order to evaporate water present in the steam generating device. The cooking device can be, for example, an oven with steam cooking functionality or a dedicated steam cooker. The heating device may then represent, for example, the bottom of a water tank.

Für den Fall des beheizbaren Garraumteilers kann einseitig oder beidseitig mindestens eine thermisch aufgespritzte Schichtstruktur vorhanden sein, insbesondere mindestens eine Heizleiterschicht.In the case of the heatable cooking space divider, at least one thermally sprayed-on layer structure can be present on one or both sides, in particular at least one heating conductor layer.

Das Haushaltsgerät kann aber auch ein Wäschepflegegerät sein. Die Heizeinrichtung kann dann beispielsweise als Laugenheizung einer Waschmaschine oder eines Waschtrockners verwendet werden. Auch kann die Heizeinrichtung als Prozessluftheizung vorgesehen sein.The household appliance can also be a laundry care appliance. The heating device can then be used, for example, as a lye heater for a washing machine or a washer dryer. The heating device can also be provided as a process air heater.

Das Haushaltsgerät kann ferner eine Spülmaschine sein. Die Heizeinrichtung kann dann beispielsweise als Heizung zum Erwärmen der Spülflüssigkeit verwendet werden. In diesem Fall kann die Heizung eine Komponente einer Heizpumpenbaugruppe sein.The household appliance can also be a dishwasher. The heating device can then be used, for example, as a heater for heating the rinsing liquid. In this case, the heater can be a component of a heat pump assembly.

Das Haushaltsgerät kann zudem ein elektrisch betriebenes Haushaltskleingerät sein, z.B. ein Wasserkocher, eine Kaffeemaschine (z.B. in Form einer Espressomaschine), ein Toaster usw.The household appliance can also be an electrically operated small household appliance, e.g. a kettle, a coffee machine (e.g. in the form of an espresso machine), a toaster, etc.

Die Heizeinrichtung kann als ein Rohr (allgemein: ein rotationssymmetrischer Körper) ausgebildet sein, wobei mindestens eine thermisch aufgespritzter Heizleiterschicht an einer Wand des Rohrs des Haushaltsgeräts vorhanden ist. Das Rohr kann dann insbesondere als Durchlauferhitzer für dort durchgeleitetes Gas (z.B. Prozessluft) und/oder Flüssigkeit (z.B. zu verdampfendes Wasser, Spülflüssigkeit oder Lauge) verwendet oder angesehen werden.The heating device can be designed as a tube (generally: a rotationally symmetrical body), with at least one thermally sprayed-on heating conductor layer being present on a wall of the tube of the household appliance. The pipe can then be used or viewed in particular as a flow heater for gas (e.g. process air) and / or liquid (e.g. water to be evaporated, rinsing liquid or lye) passed through it.

Die Aufgabe wird ferner gelöst durch ein Verfahren zum elektrischen Verbinden einer thermisch aufgespritzten Schichtstruktur eines Haushaltsgeräts, bei dem mindestens ein Volumen eines pastösen elektrisch leitfähigen Leitklebers zumindest auf mindestens eine thermisch aufgespritzte Schichtstruktur aufgebracht wird und der Leitkleber verfestigt - insbesondere ausgehärtet - wird. Das Verfahren ergibt die gleichen Vorteile wie die Heizeinrichtung und/oder das Haushaltsgerät und kann analog ausgebildet werden.The object is also achieved by a method for electrically connecting a thermally sprayed-on layer structure of a household appliance, in which at least one volume of a pasty, electrically conductive conductive adhesive is applied to at least one thermally sprayed-on layer structure and the conductive adhesive is solidified - in particular hardened. The method results in the same advantages as the heating device and / or the household appliance and can be designed analogously.

So ist es eine Weiterbildung, dass der Leitklebstoff mittels eines Dispensers aufgebracht wird.It is a further development that the conductive adhesive is applied by means of a dispenser.

Die oben beschriebenen Eigenschaften, Merkmale und Vorteile dieser Erfindung sowie die Art und Weise, wie diese erreicht werden, werden klarer und deutlicher verständlich im Zusammenhang mit der folgenden schematischen Beschreibung eines Ausführungsbeispiels, das im Zusammenhang mit den Zeichnungen näher erläutert wird.

Fig.1
zeigt in Draufsicht eine Skizze einer Heizeinrichtung eines Haushaltsgeräts;
Fig.2
zeigt als Schnittdarstellung in Seitenansicht einen ersten Ausschnitt aus der Heizeinrichtung nach Fig.1;
Fig.3
zeigt als Schnittdarstellung in Seitenansicht einen zweiten Ausschnitt aus der Heizeinrichtung nach Fig.1;
Fig.4
zeigt als Schnittdarstellung in Seitenansicht einen dritten Ausschnitt aus der Heizeinrichtung nach Fig.1 und
Fig.5
zeigt als Schnittdarstellung in Seitenansicht einen vierten Ausschnitt aus der Heizeinrichtung nach Fig.1.
The properties, features and advantages of this invention described above and the manner in which they are achieved will become clearer and more clearly understandable in connection with the following schematic description of an exemplary embodiment which is explained in more detail in connection with the drawings.
Fig. 1
shows a plan view of a heating device of a household appliance;
Fig. 2
shows, as a sectional illustration in side view, a first detail from the heating device Fig. 1 ;
Fig. 3
shows, as a sectional illustration in side view, a second section from the heating device Fig. 1 ;
Fig. 4
shows a third section from the heating device as a sectional illustration in side view Fig. 1 and
Fig. 5
shows a fourth section from the heating device as a sectional illustration in side view Fig. 1 .

Fig.1 zeigt in Draufsicht eine Heizeinrichtung 1 eines Haushaltsgeräts H. Die Heizeinrichtung 1 kann beispielsweise zum Heizen von in einem Wassertank eines Dampferzeugers (o. Abb.) befindlichem Wasser verwendet werden. Das Haushaltsgerät H kann aber auch ein Backofen mit Dampfgarfunktionalität, ein dedizierter Dampfgarer, ein elektrisch beheizbarer Garraumteiler, ein Wäschepflegegerät, eine Spülmaschine, ein Haushaltskleingerät usw. sein. Fig. 1 shows a plan view of a heating device 1 of a household appliance H. The heating device 1 can be used, for example, for heating water located in a water tank of a steam generator (not shown). The household appliance H can, however, also be an oven with steam cooking functionality, a dedicated steam oven, an electrically heatable cooking space divider, a laundry care device, a dishwasher, a small household appliance, etc.

Die Heizeinrichtung 1 weist einen flächigen Träger 2 (z.B. aus einem Metallblech) mit einer elektrisch isolierenden Trägeroberfläche 3 (z.B. aus einer leicht porösen Keramikschicht) auf. Auf der Trägeroberfläche 3 sind mehrere metallische Schichtstrukturen 4 bis 8 thermisch aufgespritzt. Die thermisch aufgespritzten Schichtstrukturen 4 bis 8 sind durch die Trägeroberfläche 3 voneinander elektrisch isoliert und umfassen: eine erste (lange) mäanderförmige Heizleiterschicht in Form einer länglichen ersten Heizleiterbahn 4, eine zweite (kurzen) mäanderförmige Heizleiterschicht in Form einer länglichen zweiten Heizleiterbahn 5 und drei geradlinige Leiterbahnen 6 bis 8.The heating device 1 has a flat carrier 2 (e.g. made of sheet metal) with an electrically insulating carrier surface 3 (e.g. made of a slightly porous ceramic layer). Several metallic layer structures 4 to 8 are thermally sprayed onto the carrier surface 3. The thermally sprayed-on layer structures 4 to 8 are electrically insulated from one another by the carrier surface 3 and comprise: a first (long) meander-shaped heating conductor layer in the form of an elongated first heating conductor layer 4, a second (short) meandering heating conductor layer in the form of an elongated second heating conductor path 5 and three straight ones Conductor tracks 6 to 8.

Die beiden Heizleiterbahnen 4 und 5 sind durch zwei Spuren 9 aus elektrisch leitfähigem Leitkleber 10 elektrisch miteinander verbunden. Dadurch sind die beiden Heizleiterbahnen 4 und 5 elektrisch in Reihe geschaltet. Soll die zweite Heizleiterbahn 5 nicht verwendet werden, könnten anstelle der zwei Spuren 9 die beiden entsprechenden Enden der ersten Heizleiterbahn 4 direkt mittels einer Spur aus Leitkleber 10 miteinander verbunden sein (o. Abb.).The two heating conductor tracks 4 and 5 are electrically connected to one another by two tracks 9 of electrically conductive adhesive 10. As a result, the two heating conductor tracks 4 and 5 are electrically connected in series. Should the second heating conductor 5 not be used instead of the two tracks 9, the two corresponding ends of the first heating conductor 4 could be connected to one another directly by means of a track of conductive adhesive 10 (not shown).

Wie in Fig.2 im Schnitt A-A gezeigt, ist die Spur 9 des Leitklebers 10 dazu von der Oberfläche der ersten Heizleiterbahn 4 über die Trägeroberfläche 3 zu der Oberfläche der zweiten Heizleiterbahn 5 gezogen worden. Dabei ist der Klebstoff (z.B. Silikonpolymer oder Epoxidharz) des Leitklebers 10 so viskos, dass er nicht oder in einem nur vernachlässigbar geringen Maß in die Heizleiterbahnen 4 und 5 und die Trägeroberfläche 3 eindringt, während Lötflussmittel eindringen könnte und dadurch die Eigenschaften dort lokal nachteilig beeinflussen könnte. Dabei könnte das Lötflussmittel sogar durch die leicht porösen Heizleiterbahnen 4 und 5 in den darunterliegenden Bereich der Trägeroberfläche 3 eindringen.As in Fig. 2 shown in section AA, the track 9 of the conductive adhesive 10 has been drawn from the surface of the first heating conductor 4 over the carrier surface 3 to the surface of the second heating conductor 5. The adhesive (e.g. silicone polymer or epoxy resin) of the conductive adhesive 10 is so viscous that it does not penetrate or only to a negligibly small extent into the heating conductor tracks 4 and 5 and the carrier surface 3, while soldering flux could penetrate and thereby locally adversely affect the properties there could. In this case, the soldering flux could even penetrate through the slightly porous heating conductor tracks 4 and 5 into the area of the carrier surface 3 below.

Die Spur 9 kann beispielsweise dadurch aufgebracht werden, dass ein Leitkleber 10 in Form eines reaktiven 1-K-Leitkleber im viskosen Zustand des zugehörigen Klebstoffs mittels eines Dispensers aufgebracht wird und dann ausgehärtet wird, insbesondere bei einer erhöhten Temperatur (z.B. bis 150°C), insbesondere in einem Ofen.The track 9 can be applied, for example, by applying a conductive adhesive 10 in the form of a reactive 1-component conductive adhesive in the viscous state of the associated adhesive by means of a dispenser and then hardening it, in particular at an elevated temperature (e.g. up to 150 ° C) especially in an oven.

Wieder zurückkehrend zu Fig.1 sind die drei geradlinigen thermisch aufgespritzten Leiterbahnen 6 bis 8 mit einem Anschlussstecker 11 der Heizeinrichtung 1 verbunden, insbesondere mit einem jeweiligen elektrischen Kontakt 11a des Anschlusssteckers 11. Der elektrische Anschluss kann ebenfalls über ein jeweiliges Kontaktvolumen 11b aus Leitklebers 10 geschehen.Returning again to Fig. 1 the three straight, thermally sprayed-on conductor tracks 6 to 8 are connected to a connector 11 of the heating device 1, in particular to a respective electrical contact 11a of the connector 11. The electrical connection can also be made via a respective contact volume 11b made of conductive adhesive 10.

Benachbarte Leiterbahnen 6 und 7 bzw. 7 und 8 sind über jeweilige SMD-Bauelemente 12 verbunden. Die SMD-Bauelemente 12 sind hier beispielhaft NTC-Widerstände. So können über den Anschlussstecker 11 zu einer jeweiligen Temperatur gehörige Messwerte (z.B. elektrische Widerstandswerte, Spannungswerte oder Stromwerte) abgegriffen werden. Die SMD-Bauelemente 12 sind über Klebepunkte 13 aus Leitkleber 10 an den Leiterbahnen 6 und 7 bzw. 7 und 8 befestigt, wie in Fig.3 als Schnitt B-B aus der Heizeinrichtung 1 gezeigt wird.Adjacent conductor tracks 6 and 7 or 7 and 8 are connected via respective SMD components 12. The SMD components 12 are, for example, NTC resistors here. Thus, measured values (for example electrical resistance values, voltage values or current values) associated with a particular temperature can be tapped via the connector 11. The SMD components 12 are attached to the conductor tracks 6 and 7 or 7 and 8 via adhesive dots 13 made of conductive adhesive 10, as in FIG Fig. 3 is shown as section BB from heating device 1.

Das SMD-Bauelement 12 weist an seinen Stirnbereichen elektrische Kontakte oder Kontaktfelder 14 auf, die über die Klebepunkte 13 mit der jeweiligen Leiterbahn 7 bzw. 8 verbunden sind. Folglich werden die beiden Leiterbahnen 7 und 8 durch das SMD-Bauelement 12 über die Klebepunkte 13 elektrisch miteinander verbunden.The SMD component 12 has electrical contacts or contact fields 14 on its end regions, which are connected to the respective conductor track 7 or 8 via the adhesive points 13. As a result, the two conductor tracks 7 and 8 are electrically connected to one another by the SMD component 12 via the adhesive dots 13.

Insbesondere können zur Befestigung der SMD-Bauelemente 12 zunächst mittels eines Dispensers (o. Abb.) die Klebepunkte 13 auf die thermisch aufgespritzten Leiterbahnen 7 bzw. 8 aufgebracht werden. Folgend kann - vor Aushärtung des Leitklebers 10 - das SMD-Bauelement 12 herangebracht und mit seinen Kontaktfeldern 14 auf die jeweiligen Klebepunkte 13 aufgedrückt werden, z.B. mittels eines Vakuumgreifers.In particular, for fastening the SMD components 12, the adhesive dots 13 can first be applied to the thermally sprayed-on conductor tracks 7 or 8 by means of a dispenser (not shown). Subsequently, before the conductive adhesive 10 hardens, the SMD component 12 can be brought in and its contact fields 14 can be pressed onto the respective adhesive points 13, e.g. by means of a vacuum gripper.

Wieder zurückkehrend zu Fig.1 sind zudem zwei metallische Kontaktflächen 15 auf der Trägeroberfläche 3 aufgebracht, über welche die kombinierte Heizleiterbahn 4 und 5 endseitig elektrisch angeschlossen werden kann, z.B. an eine Spannungsversorgung. Fig.4 zeigt dazu als Schnittdarstellung in Seitenansicht einen Schnitt C-C aus der Heizeinrichtung 1.Returning again to Fig. 1 In addition, two metallic contact surfaces 15 are applied to the carrier surface 3, via which the combined heating conductor 4 and 5 can be electrically connected at the end, for example to a voltage supply. Fig. 4 shows a section CC from the heating device 1 as a sectional illustration in side view.

Die metallischen Kontaktflächen 15 können mittels einer jeweiligen Spur 9 des Leitklebers 10 mit einem jeweiligen Ende der ersten Heizleiterbahn 4 verbunden sein, und zwar analog zu der Verbindung der beiden Heizleiterbahnen 4 und 5.The metallic contact surfaces 15 can be connected to a respective end of the first heating conductor 4 by means of a respective track 9 of the conductive adhesive 10, specifically analogous to the connection of the two heating conductor tracks 4 and 5.

Wieder zurückkehrend zu Fig.1 ist ferner an einer Biegung der Heizleiterbahn 4 eine Leitschicht 16 des Leitklebers 10 auf die Heizleiterbahn 4 und ggf. die Trägeroberfläche 3 aufgebracht worden, um dort eine Stromdichte zu verringern und so eine Bildung von sog. "Hot Spots" zu verhindern, wie in Schnitt D-D in Fig.5 gezeigt.Returning again to Fig. 1 Furthermore, a conductive layer 16 of the conductive adhesive 10 has been applied to the heating conductor 4 and possibly the carrier surface 3 at a bend in the heating conductor 4 in order to reduce a current density there and thus prevent the formation of so-called "hot spots", as shown in section DD in Fig. 5 shown.

Selbstverständlich ist die vorliegende Erfindung nicht auf das gezeigte Ausführungsbeispiel beschränkt.It goes without saying that the present invention is not restricted to the exemplary embodiment shown.

Allgemein kann unter "ein", "eine" usw. eine Einzahl oder eine Mehrzahl verstanden werden, insbesondere im Sinne von "mindestens ein" oder "ein oder mehrere" usw., solange dies nicht explizit ausgeschlossen ist, z.B. durch den Ausdruck "genau ein" usw.In general, “a”, “an” etc. can be understood as a singular or a plurality, in particular in the sense of “at least one” or “one or more” etc., as long as this is not explicitly excluded, for example by the expression “precisely” a "etc.

Auch kann eine Zahlenangabe genau die angegebene Zahl als auch einen üblichen Toleranzbereich umfassen, solange dies nicht explizit ausgeschlossen ist.A number can also include exactly the specified number as well as a customary tolerance range, as long as this is not explicitly excluded.

BezugszeichenlisteList of reference symbols

11
HeizeinrichtungHeating device
22
Trägercarrier
33
TrägeroberflächeSupport surface
44th
Erste thermisch aufgespritzte HeizleiterbahnFirst thermally sprayed heating conductor
55
Zweite thermisch aufgespritzte HeizleiterbahnSecond thermally sprayed heating conductor
66th
Thermisch aufgespritzte LeiterbahnThermally sprayed-on conductor track
77th
Thermisch aufgespritzte LeiterbahnThermally sprayed-on conductor track
88th
Thermisch aufgespritzte LeiterbahnThermally sprayed-on conductor track
99
Spurtrack
1010
LeitkleberConductive adhesive
1111
AnschlusssteckerConnector
11a11a
Elektrischer KontaktElectric contact
11b11b
KontaktvolumenContact volume
1212th
SMD-BauelementSMD component
1313th
KlebepunktGlue point
1414th
KontaktfeldContact field
1515th
KontaktflächeContact area
1616
LeitschichtConductive layer
HH
HaushaltsgerätHome appliance

Claims (13)

  1. Heating device (1) for a household appliance (H) comprising
    - a planar carrier (2) with a carrier surface (3),
    - at least one electrically conductive layer structure (4-8) that is thermally sprayed onto said carrier surface (3) and
    - at least one electrically conductive contact volume (9; 13) applied onto at least one thermally sprayed layer structure (4-8), characterised in that
    - the carrier surface (3) is an electrically insulating carrier surface (3), and that the at least one contact volume (9; 13) consists of conductive glue (10), wherein the conductive glue (10) is a reactive 1-C conductive glue.
  2. Heating device (1) according to claim 1, characterised in that the at least one thermally sprayed layer structure (4-8) is a heat-conducting layer (4, 5).
  3. Heating device (1) according to one of the preceding claims, characterised in that the thermally sprayed layer structure (4-8) is permeable to soldering flux.
  4. Heating device (1) according to one of the preceding claims, characterised in that the carrier surface (3) is permeable to soldering flux.
  5. Heating device (1) according to one of the preceding claims, characterised in that the conductive glue (10) is addition-crosslinking.
  6. Heating device (1) according to one of the preceding claims, characterised in that the at least one contact volume (9) connects two thermally sprayed layer structures (4, 5) and to this end lies on the carrier surface (3) present between the layer structures (4, 5).
  7. Heating device (1) according to one of the preceding claims, characterised in that the at least one contact volume (13) connects a thermally sprayed layer structure (6-8) to an electrical contact pad (14) of a surface-mountable structural element (12).
  8. Heating device (1) according to one of the preceding claims, characterised in that two thermally sprayed conducting tracks (6-8) are connected by an electrical structural element (12), wherein contact pads (14) of the structural element (12) are connected to the respective conducting tracks (6-8) by glue dots (13) of the electrically conductive glue (10).
  9. Heating device (1) according to one of the preceding claims, characterised in that the at least one contact volume (16) of conductive glue (10) covers at least one section of the thermally sprayed layer structure (4) without connecting them electrically to another electrically conductive component of the heating device (1).
  10. Household appliance (H) with a heating device, characterised in that the heating device is at least one heating device (1) according to one of the preceding claims.
  11. Household appliance (H) according to claim 10, characterised in that the household appliance (H) is a cooking appliance or an accessory for a cooking appliance.
  12. Household appliance (H) according to claim 10, characterised in that the household appliance (H) is a laundry care appliance or a dishwashing appliance.
  13. Method for electrically connecting a thermally sprayed layer structure (4-8) of a household appliance (H) according to one of claims 10 to 12, with which
    - at least one volume (9; 13) of a pasty conductive glue (10) in the form of a reactive 1-C conductive glue is at least applied to at least one thermally sprayed layer structure (4-8) and
    - said conductive glue (10) is solidified.
EP16734370.6A 2015-07-31 2016-07-01 Heating device for a domestic appliance Active EP3329736B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL16734370T PL3329736T3 (en) 2015-07-31 2016-07-01 Heating device for a domestic appliance

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015214628.6A DE102015214628A1 (en) 2015-07-31 2015-07-31 Heating device for a household appliance
PCT/EP2016/065536 WO2017021075A1 (en) 2015-07-31 2016-07-01 Heating device for a domestic appliance

Publications (2)

Publication Number Publication Date
EP3329736A1 EP3329736A1 (en) 2018-06-06
EP3329736B1 true EP3329736B1 (en) 2021-03-24

Family

ID=56321947

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16734370.6A Active EP3329736B1 (en) 2015-07-31 2016-07-01 Heating device for a domestic appliance

Country Status (7)

Country Link
US (1) US20180242401A1 (en)
EP (1) EP3329736B1 (en)
CN (1) CN107852782B (en)
DE (1) DE102015214628A1 (en)
ES (1) ES2862099T3 (en)
PL (1) PL3329736T3 (en)
WO (1) WO2017021075A1 (en)

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DE102021130128A1 (en) 2021-11-18 2023-05-25 Endress+Hauser SE+Co. KG Assembly for connecting at least one component to a printed circuit board

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DE102015214627A1 (en) * 2015-07-31 2017-02-02 BSH Hausgeräte GmbH Connecting thermally sprayed layer structures of heaters
DE102017122059A1 (en) * 2017-09-22 2019-03-28 Plasma Innovations GmbH Method for producing an end surface and printed circuit board

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US5416622A (en) 1993-02-01 1995-05-16 Minnesota Mining And Manufacturing Company Electrical connector
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DE102021130128A1 (en) 2021-11-18 2023-05-25 Endress+Hauser SE+Co. KG Assembly for connecting at least one component to a printed circuit board

Also Published As

Publication number Publication date
ES2862099T3 (en) 2021-10-07
EP3329736A1 (en) 2018-06-06
US20180242401A1 (en) 2018-08-23
WO2017021075A1 (en) 2017-02-09
PL3329736T3 (en) 2021-10-11
CN107852782A (en) 2018-03-27
CN107852782B (en) 2021-10-29
DE102015214628A1 (en) 2017-02-02

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