EP3290175B1 - Procede de traitement de surfaces en bois - Google Patents

Procede de traitement de surfaces en bois Download PDF

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Publication number
EP3290175B1
EP3290175B1 EP16187043.1A EP16187043A EP3290175B1 EP 3290175 B1 EP3290175 B1 EP 3290175B1 EP 16187043 A EP16187043 A EP 16187043A EP 3290175 B1 EP3290175 B1 EP 3290175B1
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EP
European Patent Office
Prior art keywords
hot
melt adhesive
melt
flat side
wood
Prior art date
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EP16187043.1A
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German (de)
English (en)
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EP3290175A1 (fr
Inventor
Rüdiger ERNST
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Jowat Se
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Jowat Se
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Priority to HUE16187043A priority Critical patent/HUE062013T2/hu
Priority to ES16187043T priority patent/ES2941275T3/es
Priority to EP16187043.1A priority patent/EP3290175B1/fr
Priority to PT161870431T priority patent/PT3290175T/pt
Priority to PL16187043.1T priority patent/PL3290175T3/pl
Application filed by Jowat Se filed Critical Jowat Se
Priority to FIEP16187043.1T priority patent/FI3290175T3/fi
Priority to US15/692,344 priority patent/US10532487B2/en
Publication of EP3290175A1 publication Critical patent/EP3290175A1/fr
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Publication of EP3290175B1 publication Critical patent/EP3290175B1/fr
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N7/00—After-treatment, e.g. reducing swelling or shrinkage, surfacing; Protecting the edges of boards against access of humidity
    • B27N7/005—Coating boards, e.g. with a finishing or decorating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/007—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2203/00—Other substrates
    • B05D2203/20—Wood or similar material

Definitions

  • the present invention relates to the technical field of wood materials in the form of coarse chipboard wood material panels or OSB wood composite panels and their processing or treatment.
  • the present invention relates to a method for leveling at least one flat side surface of coarse chipboard wood-based panels or OS B wood composite panels.
  • the present invention equally relates to a coarse-chip wood-based material panel or OSB wood-composite panel as such, which has at least one leveled flat side surface.
  • the present invention also relates to the use of at least one coarse particle board according to the invention as or for the production of planking, cladding, facade elements, facade panels, structural elements or building panels, in particular in (construction) exterior areas or (construction) interior areas or of Furniture or furniture elements, furniture boards, structural elements or construction boards, in particular in furniture, shop and trade fair construction, or of packaging and transport elements or boards, in particular in the transport, logistics or packaging sector.
  • the present invention also relates to building or facade elements as such, which have or consist of at least one coarse-chip wood material board according to the invention.
  • Wood-based panels are generally panel-shaped materials that are produced by crushing wood and then joining or pressing the wood-based structural elements or wood particles.
  • the size and shape of the wood particles determine the type of wood material and its properties.
  • the wood particles on which the panels are based can be connected to one another using binding agents or via mechanical connections (eg mutual hooking or interlocking of the wood particles during pressing).
  • the product portfolio of many manufacturers of wood-based panels includes panel types in the form of chipboard, wood fiber panels, such as B. MDF boards ( medium -density fiber boards), HDF boards ( high - density fiber boards), DHF boards ( wood fiber boards open to diffusion ) and also so-called Coarse chipboards derived from wood (OSB composite wood panels or oriented strand boards or oriented structural boards ) .
  • the coarse particle boards or OSB wood composite panels in question are generally panel-shaped wooden materials which are produced using relatively large, elongated chips.
  • Large-chip wood-based panels are used extensively in the construction industry in particular and can be produced in industrial plants, for example, by first cutting long chips out of debarked round wood in the longitudinal direction using rotating knives as part of chip processing, and then drying the natural moisture is reduced at high temperatures.
  • the chips can then be glued, with the pretreated chips first being oriented or scattered longitudinally and transversely, for example in a throwing process, so that a crosswise layer structure is created, for example, which increases the structural stability, to produce the actual OSB board.
  • the coarse particleboard wood-based material boards are then produced, in particular on continuous presses, in general under high pressure and high temperature.
  • coarse chipboard panels are distinguished from other wood panel systems, such as MDF panels, by increased flexural strength, which is caused in particular by the use of the relatively large and elongated chips.
  • coarse chipboard wood-based panels are often used as building panels in building shells and in interior design as wall or roof cladding in the context of construction applications. In the floor area, they are used, for example, as installation panels, with panels having a tongue and groove profile being used, for example.
  • the coarse-chip wood-based panels in question are basically also used as formwork panels for concrete or the like.
  • coarse chipboard wood-based panels In contrast to chipboard and HDF or MDF fiberboard, which generally have a relatively smooth or even surface, coarse chipboard wood-based panels have an irregular structure or shape of the surface and especially the flat side surface with sometimes large bumps, cavities or Indentations or the like before what in particular by the relatively large and irregularly shaped wood chips, such as those used for the production of coarse chipboard wood-based panels become, is caused. Due to the unevenness, cavities or indentations present in particular in the area of the flat side surface of the large chipboard wood-based material boards, there is often no optimal dimensional accuracy of the underlying boards, especially since the surface can only be leveled with difficulty, for example by grinding or the like, due to the sometimes large indentations and unevenness. It is also noteworthy here that the bumps, depressions or cavities or the like in question can extend through the entire plate.
  • a special feature of coarse chipboard wood-based panels or OSB wood composite panels is the underlying chip geometry, which on the one hand is associated with corresponding advantages, for example with regard to high flexural strength, but also with the fundamental disadvantage that the ready-to-use product in the form of the OSB panel has a there is a highly irregular or non-homogeneous shape of the surface, since due to the coarse-chip structure and the spacing of the chips, there are sometimes considerable unevenness, depressions, cavities or the like in the area of the surface of the panel on which it is based.
  • the irregular surface Due to the irregular structure of the surface described above, coarse chipboard panels are only weatherproof to a limited extent, especially since moisture can easily penetrate into the cavities of the panel. In this context, the irregular surface also has disadvantages with regard to further treatment, such as a homogeneous coating or the like.
  • OSB panels have so far not been suitable or accessible to a sufficient extent for further (surface) treatment steps.
  • coarse chipboard panels have so far been used almost exclusively for construction applications that are primarily not in the immediate field of vision.
  • Another approach to leveling the surfaces of wood-based panels is the partial filling of knotholes or cracks in individual layers of panel composites, such as e.g. B. in plywood or engineered parquet, and beyond that in solid wood to see, with this basically plastics are used to fill in the existing knots.
  • such a procedure sometimes only has a low throughput, which is disadvantageous in particular in the case of a large number of indentations or unevenness, so that the underlying procedure often cannot be operated economically.
  • Another approach consists in filling indentations or unevenness in the surface of wood-based panels using water-based or solvent-based filler systems.
  • water-based filling systems can cause the chips of the wood-based panels to swell during processing due to the high water content, which is disadvantageous with regard to the surface properties and can lead in particular to a significant visual unrest in the surface .
  • the drying of water-dilutable or water-based fillers is sometimes problematic, especially in deeper areas, since the solvent in the form of water is difficult to remove.
  • water-based systems usually lead to a volume shrinkage after redrying in the same order of magnitude as the volume of water previously contained. A level or even surface cannot be achieved in one work step, so that expensive post-treatments are required to level the surface.
  • the EP 1 749 587 A1 or those belonging to the same patent family DE 10 2005 036 579 A1 a building board made of a wood-based material, which consists of at least three layers of scattered and pressed, resin-glued chips, with an upper cover layer and a lower cover layer, with at least the upper cover layer having a coating that fills surface irregularities, made of a water-based paint with additives or fillers consists.
  • the WO 01/62492 A1 discloses a method for leveling a flat side surface of wood-based particle board and a wood-based particle board according to the preamble of claim 10. It relates to a laminated wood product comprising a substrate formed from wood, a decorative top layer and a hot-melt adhesive which is between the substrate and the top Layer is arranged includes.
  • the hot-melt adhesive is intended to connect the upper layer to the substrate, the main component of the adhesive being a polymer which comprises one or more monomers which, on polymerisation or copolymerisation, result in a greater Shore D hardness than the Shore D hardness of the substrate.
  • the JP 2002/086617 A a sheet material and a method for its production, wherein the sheet material is to be provided using an oriented strand sheet as a base material with a smooth surface, wherein wood flour and a thermoplastic material and a compatibilizing agent are mixed to provide a gel-like woody resin composition, and wherein the gel-like woody composition is applied to a single surface of the oriented-strand board and cold-pressed by a press plate having a smooth press surface.
  • the DE 102 26 422 C1 a method for producing a surface structure on at least one surface of a wood-based panel, in which the structured areas are produced by subsequent application of a material to the wood-based panel, the subsequent application of a mixture of a hardening material with at least one granular substance in the form of fine wood chips or plastic granulate mixed plastic on the finished wood-based panel for the purpose of creating a non-slip surface structure.
  • the U.S. 2015/197942 A1 relates to a building board, the building board comprising a surface layer with a wood veneer, a wood fiber-based core and an intermediate layer, the intermediate layer being arranged between the surface layer and the wood fiber-based core, and the intermediate layer comprising wood fibers and a binder.
  • the surface layer also has surface sections that have material from the intermediate layer. The surface portions containing material from the intermediate layer extend into the wood veneer.
  • the DE 196 30 270 A1 relates to a method for upgrading surfaces of wood-based materials, in particular narrow surfaces, with a malleable coating material being applied to the surface, the applied coating material being smoothed or modulated, the coating material having closed pores in contact with at least one heatable metal block while maintaining the smooth surface trains.
  • Document D5 therefore has nothing in common with the targeted successive application of corresponding layers of hot-melt adhesive according to the invention.
  • the situation in D5 is also such that priority is given to the coating of narrow surfaces and thus not to the coating of flat side surfaces according to the type of invention.
  • the EP 0 373 726 A2 a cellulosic fiber aggregate formed from a cellulosic fiber material by a process, the method comprising a softening step comprising exposing a portion of the cellulosic fiber material to the action of an aqueous plasticizer at a specified temperature and pressure, whereby hemicellulose and lignin contained in the cellulosic fiber material are present are at least partially disproportionated and hydrolyzed.
  • the process comprises a hardening step with drying the product of the softening step at a defined temperature in order to obtain a crosslinked cellulosic matrix.
  • the JP H07 11333 U relates to a functional fiberboard in which a hot melt adhesive is applied to one side of the fiberboard and the fiberboard has a biaxially oriented polypropylene layer printed on its front and/or back.
  • the U.S. 5,741,391 A relates to a method of manufacturing a wood panel having a thermoplastic layer bonded to a surface of the panel, the method comprising the steps of applying an adhesive to the surface the plate the spread of particles on the glued surface; distributing a granulate of a thermoplastic onto the particles; melting the thermoplastic granules to form a thermoplastic layer in contact with the particles; and cooling the thermoplastic layer.
  • the JP 2004 276463A relates to a surface treatment using a special varnish, which is applied to the surface of a wood grain formed from a mixture of wood powder and a polylactic acid resin, with the aim of obtaining a product from vegetable materials.
  • the U.S. 2002/155223 A1 relates to a method for increasing the strength and water resistance of a substrate based on a lignocellulosic material.
  • the method comprises the steps of impregnating a substrate based on a lignocellulosic material with an isocyanate resin material; removing excess isocyanate resin material from the impregnated substrate by impinging the impregnated substrate with air at a high flow rate; polymerizing the resin by applying a liquid to the impregnated substrate, the liquid being at a temperature sufficient for polymerization; and removing the liquid from the polymerized resin of the impregnated substrate.
  • the U.S. 2007/029041 A1 relates to a wood panel comprising a composite wood component having top and bottom surface layers and a core layer; a first glueline layer ; a second glueline layer; and an overlay layer , wherein the first glue line or glue line layer is arranged between the composite wood component and the second glue line or glue line layer and wherein the second glue line or glue line layer is arranged between the first glue line or glue line layer and the cover layer is arranged.
  • the approaches known in the prior art for treating or leveling the surfaces of wood-based panels do not always lead to the desired product properties, with the approaches available in the prior art also often not always being optimal from a cost perspective.
  • the approaches or methods available in the prior art often cannot be used for special wood-based panels in the form of coarse chipboard wood-based panels or OSB wood-based composite panels, since OSB wood-based composite panels have very special material properties, especially with regard to the presence of sometimes large ones or large-volume bumps, indentations, cavities, holes or blowholes in the panel surface.
  • the aim of the present invention is to provide corresponding coarse chipboard panels in a technically efficient manner, which have an optimally leveled or filled surface.
  • corresponding indentations or unevenness as well as cavities, holes or blowholes or the like in the area of the surface or flat side surface of coarse chipboard panels should be compensated or filled in a sustainable or effective manner.
  • one object of the present invention is to provide a method and a production plant suitable for carrying out this method, with which a surface treatment of coarse chipboard wood-based panels in particular is to be made possible, so that the product properties of the coarse chipboard wood-based panels treated in this way in particular also with regard to providing a Weather, UV and temperature resistance can be further improved, accompanied by an increase in the range of uses of the coarse particleboard wood-based panels treated in this way.
  • another object of the present invention is to also provide coarse chipboards as such, which have a resistant and durable as well as uniform filling or coating of the unevenness, depressions, cavities, holes or blowholes arranged in the surface area
  • the coarse-chip wood-based panels provided according to the invention should also have further improved product properties, in particular improved (surface) properties, compared to such wood-based panels of the prior art.
  • the object on which the present invention is based is achieved - according to a first aspect of the present invention - by a method for treating, in particular leveling, at least one surface, preferably at least one flat side surface, of coarse chipboard wood-based panels (OSB wood composite panels), according to claim 1.
  • OSB wood composite panels coarse chipboard wood-based panels
  • Another subject of the present invention - according to a second aspect of the invention - is the coarse particle board or OSB wood composite panel according to the invention as such, which can be obtained according to the method according to the invention or which has a treated, in particular leveled surface, preferably flat side surface, according to the independent claims in this regard. Further advantageous configurations of the coarse particle board according to the invention are the subject matter of the relevant dependent claims.
  • another subject of the present invention is - according to a third aspect of the invention - the inventive use of at least one coarse particle board as or for the production of planking, cladding, facade elements, facade panels, construction elements or building panels, in particular in the (construction) outdoor area or in ( Building) interiors and also as or for the production of furniture or furniture elements or the like in furniture, shop or trade fair construction and also as or for the production of packaging or transport elements in particular in Transport or packaging area as defined in the independent claim relating to this use.
  • Another subject of the present invention - according to a fourth aspect of the invention - is the building or façade element according to the invention as such, which has or consists of at least one coarse chipboard material board according to the invention, as defined in the relevant independent claim.
  • polymers listed for the hot-melt adhesive in the context of the present invention, it is such that these can be in the form of homopolymers or copolymers, i.e. the term polymers used according to the invention includes both homopolymers and copolymers (i.e. polymers made of two or more different monomers).
  • the polymers can be present, for example, as random copolymers, alternating copolymers, gradient copolymers, block copolymers or graft copolymers.
  • polyolefin denotes olefin homopolymers (e.g.
  • polypropylene homopolymers or polyethylene homopolymers or also olefin copolymers (e.g. ethylene/propylene copolymers), the term "polyethylene” denotes both polyethylene homopolymers and Polyethylene copolymers, etc.
  • polymers also includes the use of functionalized polymers, in particular to increase the functionality of the underlying hot-melt adhesive.
  • the present invention is therefore aimed at providing a special method, according to which a treatment in the form of evening out or leveling of the flat side surface(s) of coarse chipboard wood-based panels using a special filling or coating compound in the form of a hot-melt adhesive or a hot-melt and/or sealing mass is carried out, the hot-melt adhesive or the hot-melt and/or sealing mass being applied to the surface to be treated in the form of a hot-melt adhesive melt or in the form of a melt for filling the unevenness in question or the like becomes.
  • a technically and economically optimized procedure can be used to implement a permanent filling of the surface of a coarse chipboard material panel with excellent adhesion properties to the substrate in the form of the OSB panel, with the modified on the basis of the process according to the invention or with the hot-melt adhesive coated surface and thus the coarse particleboard wood-based material panels obtained according to the invention as such, in addition to improved optical properties, also has sustainably improved product properties with regard to increased weathering, UV and moisture resistance.
  • the OSB panel obtained according to the invention also has increased chemical resistance.
  • the use of the hot-melt adhesive creates a lasting surface seal of the OSB board, so that moisture, chemicals, dirt or the like cannot penetrate the underlying OSB board and the organic wood components are therefore protected from external influences, accompanied by an improved Storage and weather resistance.
  • a hot-melt adhesive can, for example, ensure an increase in the moisture resistance to the sometimes severe influence of moisture, such as can occur outdoors in the event of heavy rain or the like, so that the coarse chipboard wood-based panels according to the invention are also suitable for this reason, in particular with regard to (construction) Outdoor applications have an extended range of uses.
  • the panel systems provided according to the invention are also suitable for use in (construction) interiors, for example with regard to visible wall and floor systems with improved moisture, wear and dirt resistance.
  • the coarse chipboard wood-based panels according to the invention are also accessible to further surface treatment, in particular with regard to full-surface lamination, painting, lamination or the like, so that this also results in optically attractive and overall smooth or even surface structures can be provided, in addition, the underlying composite due to the uniform surface below Use of a hot melt adhesive is mechanically stabilized.
  • the coarse chipboard wood-based panels coated in this way can thus be coated over the entire surface with a good visual effect, in particular varnished, covered or laminated, so that a particularly durable full-surface bond results, which can also be cut to size at any point after the coarse chipboard wood-based panel has been separated or cut to size Plate is guaranteed, which is of great relevance, for example, with regard to the provision of fixed dimensions in furniture and interior design.
  • the coarse particleboard wood-based material panels or coarse particleboard wood-based composite panels according to the invention can be further modified with regard to their surface to the effect that coated surfaces can be provided on the basis of additional films or foils, such as condensation resin films, for example melamine resin films or phenolic resin films, which the range of use or application of the coarse chipboard wood-based panels according to the invention in the furniture or construction sector is further increased, since products with completely new and specifically adjustable product properties can be provided within the scope of the present invention, as mentioned above.
  • additional films or foils such as condensation resin films, for example melamine resin films or phenolic resin films
  • the concept according to the invention with the use of special hot-melt adhesives for leveling or homogenizing the surface of a coarse chipboard wood-based panel enables a further functionalization of the surface in this regard, for example with regard to an antimicrobial finish and the provision of electrical conductivity or dissipation, targeted optical (surfaces -)Properties or the like.
  • the coarse particleboard wood-based material panels according to the invention can be equipped with anti-slip or anti-slip properties, for example.
  • a hot-melt adhesive Through the targeted use of a hot-melt adhesive and its targeted selection and coordination, it is thus ensured within the scope of the method according to the invention that there is an optimized filling of the unevenness in the area of the flat side surface, with an optimized liability or adhesion of the filling material used in the form of the Hot-melt adhesive to the underlying substrate in the form of the coarse particle board present.
  • the use of a hot-melt adhesive also enables a further optimized coating with the receipt of a particularly uniform or even surface of the coarse particle board. Due to the specifically controllable elastomeric or thermoplastic properties, further structuring or profiling of the surface or further coating with appropriate surface materials such as decorative foils or the like is possible, which can be applied to the coarse particle board according to the invention.
  • the use of a hot-melt adhesive leads to an optimization of the process, in particular with regard to the underlying apparatus, since the hot-melt adhesive can be applied in a simple manner, in particular with heating, with the hot-melt adhesive used also being at least essentially free of sometimes harmful solvents or The like is, so that corresponding extraction devices or the like for removing any solvent can be omitted.
  • the hot-melt adhesive when using a hot-melt adhesive, there are no residual chemicals or waste that are sometimes difficult to dispose of. Due to the high flowability and at least substantially shrinkage-free hardening, even deeper or larger unevenness can be completely and permanently filled.
  • the invention also results in a lasting reduction in the proportion of volatile organic compounds (VOCs [ Volatile Organic Compounds ]) on which the coarse particle board is based, which limit the use of conventional coarse particle board, particularly indoors.
  • VOCs Volatile Organic Compounds
  • the method according to the invention can also be used to set or reduce the water vapor permeability of the OSB board in a targeted manner, so that the coarse particleboard wood-based material boards according to the invention can also have the function of a vapor barrier, which enables them to be used in damp or sanitary areas, for example.
  • the SD value (water vapor diffusion equivalent air layer thickness) of the coarse chipboard wood-based material board according to the invention is improved or correspondingly increased, so that the coarse chipboard wood-based material boards according to the invention likewise have improved moisture protection, since the boards in question are diffusion-inhibiting or diffusion-tight can become.
  • the water vapor diffusion equivalents The thickness of the air layer represents a building physics measure of the water vapor diffusion resistance of a component or a component layer and thus defines its property as a vapor barrier.
  • a hot-melt adhesive in particular in combination with the other measures according to the invention, provides an overall efficient method for upgrading or treating the flat side surface(s) of coarse chipboard wood-based panels, which with high process economy and thus excellent cost efficiency leads to sustainably improved products in form correspondingly treated coarse-grain wood-based panels with tailor-made properties as mentioned above.
  • the procedure can generally be such that the unevenness, indentations, cavities, holes and/or blowholes are at least essentially completely filled and/or filled with the hot-melt adhesive melt.
  • the hot-melt adhesive melt should be applied to the surface, in particular the flat side surface, at least partially and/or in sections, preferably over the entire surface.
  • the hot-melt adhesive melt should be applied to the flat-side surface at least essentially continuously and/or without interruption.
  • the unevenness, indentations, cavities, holes and/or blowholes are at least essentially completely filled with the hot-melt adhesive. This ensures efficient homogenization or leveling of the surface.
  • the application of the hot-melt adhesive melt can be repeated or the amount be adjusted or adjusted accordingly to the applied hot melt adhesive.
  • the hot-melt adhesive melt should be present in an amount in the range from 10 g/m 2 to 2000 g/m 2 , in particular in the range from 25 g/m 2 to 1500 g/m 2 , preferably in the range from 50 g/m 2 2 to 1000 g/m 2 , preferably in the range from 75 g/m 2 to 800 g/m 2 , particularly preferably in the range from 100 g/m 2 to 600 g/m 2 , based on the flat side surface.
  • the hot-melt adhesive as such does not have any further additives or additives or the like, in particular as defined below, appropriate application quantities in the range from 80 g/m 2 to 120 g/m 2 have proven successful.
  • application quantities in the range from 150 g/m 2 to 200 g/m 2 are preferred for hot-melt adhesives which have further additives, additives or the like, in particular as defined below.
  • the hot-melt adhesive melt is applied in such a way that the unevenness, depressions, cavities, holes and/or blowholes are filled with the hot-melt adhesive, in particular with the formation of at least one hot-melt adhesive filling, in particular hot-melt adhesive leveling filling. be filled and/or backfilled.
  • the unevenness, indentations, cavities, holes and/or blowholes can be at least essentially completely filled and/or filled with the hot-melt adhesive. Equally, it can be provided within the scope of the present invention that the unevenness, indentations, cavities, holes and/or blowholes account for at least 30%, in particular at least 50%, preferably at least 70%, preferably at least 80%, particularly preferably at least 90% , particularly preferably at least 95%, very particularly preferably at least 98%, based on the volume of the unevenness, depressions, cavities, holes and/or blowholes, are filled and/or filled with the hot-melt adhesive.
  • the bumps, indentations, cavities, holes or blowholes in question are formed from the interstices generally resulting from the spacing of the irregularly shaped coarse chips of the coarse particleboard wood-based material board, without wishing to be limited to this theory.
  • the filling provided according to the invention in particular those in the area of the surface of the coarse-grain wood-based material board become, so to speak Existing free spaces or gaps are filled or closed with the hot-melt adhesive melt, so that on this basis, in particular, an evening out or leveling of the surface results in the form of a seal.
  • the surface of the underlying coarse particle board is thus sealed to a certain extent with the hot-melt adhesive, which, in addition to the homogenization or leveling in question, leads to the formation of correspondingly improved properties, in particular with regard to increased weather, UV and / or moisture resistance of the treated coarse chipboard leads.
  • the hot-melt adhesive filling is interspersed and/or optionally interrupted at least partially and/or in sections with coarse chips that form or limit the unevenness, depressions, cavities, holes and/or blowholes.
  • the coarse chippings forming or delimiting the unevenness, indentations, cavities, holes and/or blowholes can protrude at least partially and/or in sections into the hot-melt adhesive filling.
  • the hot-melt adhesive filling can have a thickness in the range from 0.2 mm to 50 mm, in particular in the range from 0.5 mm to 25 mm, preferably in the range from 1 mm to 10 mm, preferably in the range from 1 mm to 5 mm , exhibit.
  • the aforementioned thickness specifications generally relate to the hot-melt adhesive filling layer, so to speak, interspersed with the coarse chippings.
  • the hot-melt adhesive filling layer which can be obtained, for example, as part of a first application, it can in principle be the case that it may still have openings with the coarse chip in question or that it as such is not yet completely uniform or leveled surface forms.
  • the application of the hot melt adhesive can be repeated or the amount of hot melt adhesive to be applied can be increased.
  • at least one layer of hot-melt adhesive in particular a covering layer of hot-melt adhesive, is applied as part of a second application of hot-melt adhesive.
  • the hot-melt adhesive filling in particular in the area of its surface, forms a closed hot-melt adhesive layer, so to speak, and thus a homogenized or leveled layer. This can be ensured, for example, by selecting correspondingly large application quantities of hot-melt adhesive.
  • the hot-melt adhesive melt to form the hot-melt adhesive filling is used in an amount in the range from 5 g/m 2 to 1,000 g/m 2 , in particular in the range from 10 g/m 2 to 800 g/m 2 , preferably in the range from 20 g/m 2 to 600 g/m 2 , preferably in the range from 40 g/m 2 to 600 g/m 2 , particularly preferably in the range from 60 g/m 2 to 400 g / m 2 , based on the surface, in particular flat side surface is applied.
  • the procedure can also be such that the hot-melt adhesive melt is also applied in such a way that the flat side surface and/or the hot-melt adhesive filling is at least partially and/or in sections, preferably over the entire surface, coated with the hot-melt adhesive melt and /or filming is carried out in particular in such a way that at least one hot-melt adhesive layer, in particular hot-melt adhesive covering layer, arranged on the flat side surface and/or on the hot-melt adhesive filling results.
  • the application of the hot-melt adhesive melt to form the hot-melt adhesive layer in question can be carried out according to the invention, in particular in addition to the previously described application of the hot-melt adhesive, in particular to produce a hot-melt filling.
  • the particularly additionally applied hot-melt adhesive layer is, in particular, a final layer, with the hot-melt adhesive layer preferably completely covering or sealing the surface, in particular the flat side surface, of the coarse chipboard material board.
  • the hot-melt adhesive layer is therefore in particular a (finish) layer to ensure a smooth or even and at least essentially completely sealed surface, in particular the flat side surface, of the coarse particle board.
  • the layer of hot-melt adhesive is applied subsequently or in a separate method step, in particular the layer of hot-melt adhesive then being applied in the form of an after-coating or after-filming, so to speak.
  • the layer of hot-melt adhesive can be formed at least substantially closed and/or at least substantially free of perforations. Equally, it can be provided according to the invention that the hot-melt adhesive layer at least essentially does not form or has limiting coarse chippings.
  • the layer of hot-melt adhesive can thus in particular be a (covering) layer which has at least essentially only the hot-melt adhesive as such and/or is homogeneous. In addition to optimized optical surface properties, this also ensures a further improved sealing of the coarse chipboard material board, in particular accompanied by a further improved resistance to weathering, UV rays and/or moisture.
  • the hot-melt adhesive layer can have a thickness in the range from 0.1 mm to 30 mm, in particular in the range from 0.2 mm to 20 mm, preferably in the range from 0.5 mm to 10 mm, preferably in the range from 0 75 mm to 5 mm, particularly preferably in the range from 1 mm to 3 mm.
  • the above thickness specifications relate in particular to the hot-melt adhesive layer which is applied to the filled OSB board or to the OSB board which has the hot-melt adhesive filling.
  • the hot-melt adhesive in particular the hot-melt adhesive melt, can be used to form the hot-melt adhesive layer in an amount in the range from 5 g/m 2 to 1,000 g/m 2 , in particular in the range from 10 g/m 2 to 800 g/m m 2 , preferably in the range from 20 g/m 2 to 600 g/m 2 , preferably in the range from 40 g/m 2 to 600 g/m 2 , particularly preferably in the range from 60 g/m 2 to 400 g/m 2 2 , very particularly preferably in the range from 60 g/m 2 to 300 g/m 2 , based on the surface, in particular the flat side surface.
  • the procedure is in particular such that the filling or filling of the unevenness, depressions, cavities, holes and/or blowholes with the hot-melt adhesive, in particular the formation of the hot-melt adhesive filling, or step b1) on the one hand and the coating or filming of the flat side surface, in particular the formation of the hot-melt adhesive layer, or step b2) on the other hand are carried out in separate process steps or in succession.
  • the procedure here is in particular such that first the unevenness, depressions, cavities, holes and/or blowholes are filled with the hot-melt adhesive, in particular the formation of the hot-melt adhesive filling, or step b1), followed by cooling and solidification of the hot-melt adhesive, and then the coating or filming of the surface, preferably the flat side surface, in particular the formation of the hot-melt adhesive layer, or step b2), followed by cooling and solidification of the hot-melt adhesive, is carried out.
  • the same hot-melt adhesive and/or identical hot-melt adhesives are used.
  • hot-melt adhesives can be used within the scope of the present invention, as listed below.
  • hot-melt adhesives used according to the invention are generally at least essentially solvent-free products which are solid at room temperature and assume a free-flowing or liquid state when heated or when hot , so that on this basis an order or an application can be made on the underlying surface, in particular the flat side surface, of the coarse particle board, for the purpose of filling the unevenness or the like.
  • a permanent filling or coating of the coarse chipboard wood-based panel is then formed on the surface of the OSB panel treated in this way.
  • the hot-melt adhesives used according to the invention are generally associated with the advantage of rapid processing combined with a low material price, it also being possible to use a wide variety of materials, as mentioned above.
  • it is also advantageous that the hot-melt adhesives used and the fillings or coatings produced therewith are accessible for subsequent processing or modification, for example in the context of further coatings, lamination, painting or the like.
  • the used Hot-melt adhesives have a high stability and resistance to weathering, UV radiation and moisture, which correspondingly leads to the coarse particleboard wood-based material panels provided according to the invention having improved properties.
  • the hot-melt adhesive is a thermoplastic or one-component hot-melt adhesive, in particular a one-component hot-melt adhesive (1K hot-melt adhesive).
  • the hot-melt adhesive should be at least essentially free of water and/or solvents.
  • the hot-melt adhesive should have a water and/or solvent content of at most 10% by weight, in particular at most 5% by weight, preferably at most 2% by weight, preferably at most 1% by weight, particularly preferably at most 0, 5% by weight, very particularly preferably at most 0.1% by weight, based on the hot-melt adhesive.
  • This improves the processing properties of the hot-melt adhesive used according to the invention. In particular, this ensures that the hot-melt adhesive does not essentially penetrate into the fiber structure of the wood chips on which the wood-based material board is based, so that undesired swelling of the material is avoided.
  • the hot-melt adhesive is a reactive hot-melt adhesive, in particular a thermoplastic or one-component reactive hot-melt adhesive, preferably a one-component reactive hot-melt adhesive.
  • Reactive hot-melt adhesives as they are used according to the invention in a particularly preferred manner, are characterized in particular by the fact that they have chemically reactive functional groups, which in particular during and after application or application, for example, under the influence of heat, radiation or moisture to a (After) crosslinking lead, whereby the adhesion or adhesive bond to the substrate in the form of the coarse particle board is further improved.
  • the reactive hot-melt adhesive is a moisture-crosslinking, heat-crosslinking or radiation-crosslinking hot-melt adhesive, in particular a moisture-crosslinking or radiation-crosslinking, preferably a moisture-crosslinking hot-melt adhesive.
  • Reactive hot-melt adhesives therefore also have advantages when used in that, due to the chemical post-crosslinking and formation of chemical adhesive or contact connections, a correspondingly hardened reactive hot-melt adhesive can at least essentially no longer be melted by the action of heat, so that in this respect too a high level of resistance or .Permanence exists.
  • reactive hot-melt adhesives have equally fast processing properties without lengthy drying phases, in particular due to the physical curing that precedes the post-crosslinking, which is associated with process engineering advantages.
  • the reactive hot melt adhesive has chemically reactive groups.
  • the chemically reactive groups can be selected from isocyanate groups, silane groups, epoxide groups and reactive double or multiple bonds (especially CC double or multiple bonds, such as urethane groups with reactive double or multiple bonds, especially CC double or multiple bonds) and combinations thereof , preferably isocyanate groups and silane groups.
  • the chemically reactive groups are arranged terminally or terminally in the molecular framework of the reactive hot-melt adhesive.
  • the chemically reactive groups in question lead to a defined (post-)crosslinking within the scope of the use of the hot-melt adhesive, likewise to want to limit our to this theory, and also with the formation of adhesive or contact bonds with the surface to be treated the coarse particle board.
  • the reactive hot-melt adhesive is selected from the group consisting of (i) reactive, in particular moisture-crosslinking, polyurethanes (PUR), preferably isocyanate-functionalized and/or isocyanate-containing polyurethanes, preferably isocyanate-terminated polyurethanes; (ii) reactive, in particular moisture-crosslinking, polyolefins (POR), preferably silane-functionalized and/or silane-containing polyolefins, preferably silane-grafted polyolefins; (iii) reactive, in particular radiation-crosslinking, preferably UV-crosslinking, poly(meth)acrylates, preferably poly(meth)acrylates functionalized with urethane groups and/or containing urethane groups; and mixtures and combinations thereof, particularly preferably from the group of (i) reactive, in particular moisture-crosslinking, polyurethanes (PUR), preferably isocyanate-functionalized and/or iso
  • the reactive hot-melt adhesives preferably used according to the invention are characterized overall by high UV stability combined with high mechanical stability and strength.
  • one-component reactive hot-melt adhesives such as in particular reactive, preferably moisture-crosslinking polyurethanes (PUR)
  • PUR moisture-crosslinking polyurethanes
  • hot-melt adhesives in question can in principle also be used in a continuous process or in an inline process, with the coarse chipboard wood-based material panels treated in this way being immediately accessible for further processing, for example further coating with decorative foils or the like.
  • the hot-melt adhesives in question are not sticky after cooling and solidifying or after complete crosslinking due to the non-blocking, so that there is also no sometimes disadvantageous surface tackiness, although due to the material properties on which the reactive hot-melt adhesives are based, high slip resistance or good anti-slip properties of the underlying surfaces are guaranteed.
  • the reactive hot-melt adhesives in question can be covered with coating materials such as (decorative) foils or the like in the thermoplastic phase, ie up to the final crosslinking of the adhesive, due to the residual tack.
  • coating materials such as (decorative) foils or the like in the thermoplastic phase, ie up to the final crosslinking of the adhesive, due to the residual tack.
  • particulate structures such as glitter for decorative purposes
  • moisture-crosslinking reactive hot-melt adhesives are particularly advantageous, since the moisture required for crosslinking can be provided, for example, from the coarse chippings contained in the residual moisture.
  • the above-mentioned reactive PUR hot-melt adhesives in particular also have high chemical resistance in addition to high temperature resistance.
  • the hotmelt adhesives or hotmelt masses used according to the invention are characterized, among other things, by the fact that they have high flowability in the molten state and/or are at least essentially block-free shortly after application or application to the surface, in particular the flat side surface.
  • These properties have proven to be advantageous in particular with regard to the post-processing or further processing or the storage of the coarse-chip wood-based material boards provided according to the invention.
  • the coarse chipboard wood-based material panels provided according to the invention can be further processed or stored promptly after application of the hot-melt adhesive, and specifically without unwanted sticking or the like occurring.
  • the hot-melt adhesive is a non-reactive hot-melt adhesive, in particular a thermoplastic and/or one-component non-reactive hot-melt adhesive, preferably a one-component non-reactive hot-melt adhesive.
  • Non-reactive hot-melt adhesives as can be used within the scope of the present invention, generally have a short application or setting time.
  • the actual bonding takes place to a significant degree physically, namely due to the hardening of the hot-melt adhesive melt applied when the hot-melt adhesive applied cools down.
  • non-reactive hot-melt adhesives can basically be melted again after they have solidified.
  • the use of non-reactive hot-melt adhesives can be considered within the scope of the concept according to the invention, for example against the background of a subsequent coating or lamination of the coarse particle board made of wood material provided according to the invention.
  • the non-reactive hot-melt adhesive can be selected from the group consisting of (i) ethylene vinyl acetates (EVA polymers); (ii) polyolefins (PO), in particular polyethylenes (PE), polypropylenes (PP) and atactic polyolefins (APAO); (iii) polyamides (PA); (iv) thermoplastic polyurethanes (TPU); (v) polyurethanes (PU); (vi) (meth)acrylates; (vii) polyesters (PES); and mixtures and combinations thereof, particularly preferably from the group of (i) ethylene vinyl acetates (EVA polymers); (ii) polyolefins (PO); (iii) polyamides (PA); (iv) thermoplastic polyurethanes (TPU); and mixtures and combinations thereof.
  • EVA polymers ethylene vinyl acetates
  • PO polyolefins
  • PA polyamides
  • TPU polyurethanes
  • TPU polyurethane
  • the hot-melt adhesive is a hot-melt adhesive based on natural raw materials, in particular polylactic acid (PLA).
  • PLA polylactic acid
  • the hot-melt adhesive can comprise or consist of a mixture or combination of at least two different hot-melt adhesives, in particular as defined above.
  • the hot-melt adhesive can comprise or consist of a mixture or combination of at least one reactive hot-melt adhesive, in particular as defined above, and at least one non-reactive hot-melt adhesive, in particular as defined above.
  • the corresponding application and product properties of the hot-melt adhesive used can be adapted or tailored, in particular with regard to the respective application and use.
  • the commercially available product Jowatherm-Reaktant® 602.35 sold by Jowat SE can be used as a reactive hot-melt adhesive.
  • a hot-melt adhesive based on polyolefins can also be used as the non-reactive hot-melt adhesive, in particular in the form of the commercially available product Jowatherm®, which is also marketed by Jowat SE EP 60 287.90 .
  • a non-reactive EVA hot-melt adhesive in the form of the commercially available product Jowatherm® 287.10 sold by Jowat SE can be used.
  • the hot-melt adhesive used in the context of the present invention should be in the solid state at room temperature (20° C.) and ambient pressure (1013.25 hPa).
  • the hot-melt adhesive should have a softening point and/or range, in particular determined by ring and ball, preferably determined in accordance with DIN EN 1238:2011-07, in the range from 30° C. to 200° C., in particular in the range from 40° C. to 100 °C, preferably in the range from 50 °C to 90 °C, preferably in the range from 55 °C to 80 °C.
  • the hot-melt adhesive should preferably have a softening point or range, determined in particular by ring and ball, preferably determined according to DIN EN 1238:2011-07, of at least 30° C., in particular at least 40° C., preferably at least 50° C at least 55°C, more preferably at least 60°C.
  • the hot-melt adhesive has a melting point, in particular determined by means of differential scanning calorimetry (DDK), preferably determined by DIN 53765:1994-03, in the range from 55°C to 275°C, in particular in the range from 65°C to 225°C, preferably in the range from 70°C to 175°C.
  • DK differential scanning calorimetry
  • the hot-melt adhesive has a processing temperature, in particular determined by means of dynamic differential calorimetry (DDK), preferably determined according to DIN 53765:1994-03, in the range from 80° C. to 300° C., in particular in the range from 90 °C to 250 °C, preferably in the range of 95 °C to 200 °C.
  • DDK dynamic differential calorimetry
  • the hot-melt adhesive should have a viscosity, in particular dynamic viscosity and/or in particular determined according to DIN EN ISO 3219:1994-10 and/or in particular in the temperature range from 95° C. to 200° C., in the range from 5,000 mPas to 150,000 mPas , in particular in the range from 7,500 mPas to 125,000 mPas, preferably in the range from 10,000 mPas to 100,000 mPas.
  • a viscosity in particular dynamic viscosity and/or in particular determined according to DIN EN ISO 3219:1994-10 and/or in particular in the temperature range from 95° C. to 200° C., in the range from 5,000 mPas to 150,000 mPas , in particular in the range from 7,500 mPas to 125,000 mPas, preferably in the range from 10,000 mPas to 100,000 mPas.
  • the hot-melt adhesive should have a density ⁇ , determined in particular at a temperature of 20° C. and/or determined in particular according to DIN 51757:2011-01, in the range from 0.5 g/cm 3 to 2.5 g/cm 3 , in particular in the range from 0.6 g/cm 3 to 2.3 g/cm 3 , preferably in the range from 0.7 g/cm 3 to 2.1 g/cm 3 , preferably in the range from 0.8 g/cm 3 to 2 g/cm 3 .
  • the hot-melt adhesive is at least essentially block-free after it has been applied and/or after it has cooled and solidified, in particular after it has cured and/or allowed to solidify.
  • the hot-melt adhesive has thermoplastic and/or elastomeric properties after it has been applied and/or after it has cooled and solidified, in particular after it has cured and/or allowed to solidify.
  • the aforementioned properties or parameters of the hot-melt adhesive used according to the invention lead in particular to application-specific or processing-specific properties and advantages, in particular with regard to the melting behavior, the flowability and the application behavior on the coarse chipboard wood-based panel to be treated.
  • the hot-melt adhesive can have at least one adhesion promoter or primer.
  • the adhesion promoter or primer can be selected from the group consisting of silicon oxides, silanes, silicic acids, siliceous earths and mixtures and combinations thereof.
  • the hot-melt adhesive can contain the adhesion promoter or primer in quantities in the range from 1% by weight to 30% by weight, in particular in the range from 2% by weight to 20% by weight, preferably in the range from 5% by weight to 10% by weight, based on the hot melt adhesive included.
  • the targeted use of an adhesion promoter or primer can on the one hand improve the adhesion of the hot-melt adhesive in relation to the coarse particle board to be treated.
  • the hot-melt adhesive used can be equipped with appropriate properties with a view to providing a primer function, for example for a lamination, backing, coating, painting or the like that may follow the surface treatment of the coarse chipboard panel.
  • the adhesion properties can thus be controlled in relation to subsequent coatings.
  • the hot-melt adhesive can have a primer function for substrates that are difficult to bond or the function of a primer for subsequent coatings or the like, for example with regard to the use of mineral or synthetic resin-based coatings, such as corresponding plasters or the like.
  • the porosity of the surface of the hot-melt adhesive filling or hot-melt adhesive layer can be adjusted in a targeted manner by using an adhesion promoter or primer.
  • the hot-melt adhesive can have at least one additive.
  • the additive can be selected from the group of plasticizers, high-boiling organic oils, esters or other plasticizing additives, stabilizers, in particular UV stabilizers, antioxidants, acid scavengers, in particular nano-particulate fillers, anti-aging agents and mixtures or combinations thereof.
  • the hot-melt adhesive can contain the additive, for example, in amounts ranging from 1% by weight to 60% by weight, in particular in the range from 5% by weight to 50% by weight, preferably in the range from 10% by weight to 40% by weight, based on the hot-melt adhesive.
  • the properties of the hot-melt adhesive used according to the invention can be further adjusted or specified.
  • the hot-melt adhesive can also have at least one non-reactive polymer, resin and/or wax, in particular a natural, synthetic or chemically modified (partially synthetic) wax.
  • the hot-melt adhesive may contain the non-reactive polymer, resin or wax in amounts ranging from 0.5% to 15% by weight, in particular ranging from 1% to 10% by weight, preferably in the range from 1.5% by weight to 5% by weight, based on the hot-melt adhesive.
  • the flowability of the hot-melt adhesive can also be further adjusted, which in particular leads to improved application properties when the hot-melt adhesive is applied to the surface, in particular the flat side surface, of the coarse particle board.
  • the hot-melt adhesive can have at least one functionalization component.
  • the functionalization component can be selected from the group of electrically conductive substances, antimicrobial, antimycotic and/or fungicidal substances and mixtures and combinations thereof.
  • the hot-melt adhesive can contain the functionalization component in amounts in the range from 0.1% by weight to 10% by weight, in particular in the range from 0.2% by weight to 5% by weight, preferably in the range from 0.5 % by weight to 3% by weight, based on the hot-melt adhesive.
  • the hot-melt adhesive can have at least one dye or at least one color pigment.
  • the hot-melt adhesive or the colored pigment can be selected from the group of organic pigment dyes, inorganic pigment dyes and mixtures and combinations thereof.
  • the hot-melt adhesive can contain the dye or the colored pigment in amounts ranging from 0.1% by weight to 30% by weight, in particular in the range from 0.5% by weight to 20% by weight, preferably in the range from 1% by weight to 10% by weight, based on the hot-melt adhesive.
  • the hot-melt adhesive can be equipped with special optical properties in a purposeful manner, so that a coarse-chip wood-based material board treated on this basis can also have further decorative properties.
  • the hot-melt adhesive melt is applied to the surface, in particular the flat side surface, by means of spraying, nozzle application, knife coating, roller application, calendering, printing processes or extrusion, in particular by means of nozzle application and/or roller application, preferably roller application becomes.
  • the procedure can be such that the hot-melt adhesive melt is applied to the surface, in particular the flat side surface, by means of nozzle application, in particular slot nozzle application.
  • the hot-melt adhesive melt is applied by means of roller application, in particular by means of at least one hot-melt adhesive metering roller and/or hot-melt adhesive application roller, is applied to the surface, in particular the flat side surface.
  • the procedure can be such that the hot-melt adhesive metering roller and/or hot-melt adhesive application roller is operated or become.
  • the Amount of hot-melt adhesive applied per unit area can be set or specified in a targeted manner.
  • the application quantity, in particular the area-related application quantity, of the hot-melt adhesive melt via the rotational speed or peripheral speed of the hot-melt adhesive metering roller and/or the hot-melt adhesive application roller, preferably via the ratio of the rotational speed or peripheral speed the hot-melt adhesive metering roller and/or the hot-melt adhesive applicator roller is set or specified for the application speed, in particular the transport speed or feed speed of the coarse particle board.
  • the application speed relates in particular to the length-related application of the hot-melt adhesive to the coarse chipboard wood-based panel per unit of time.
  • a predetermined amount of hot-melt adhesive can be applied to a defined area of the coarse particle board.
  • the special procedure ensures that the hot-melt adhesive is applied evenly in defined amounts per area on the underlying coarse particle board.
  • a hot-melt adhesive application roller in particular with a doctor blade system, can be used. This ensures a particularly defined and even application of the required amount of hot melt adhesive.
  • heatable hot-melt adhesive metering rollers and/or heatable hot-melt adhesive application rollers for example, in particular, heatable hot-melt adhesive application rollers separate hot-melt adhesive metering rollers, or in particular heatable hot-melt adhesive application rollers with doctor blade systems, are used to apply the amounts of hot-melt adhesive provided according to the invention.
  • the amount of hot-melt adhesive can be specified or adjusted by adjusting the ratio of the feed speed of the coarse chipboard to be coated to the rotational or peripheral speed of the applicator roller in particular, and this also taking into account the different viscosities or .rheological properties.
  • the procedure is in particular such that the hot-melt adhesive melt is applied to the flat side surface at a temperature above the softening point or range or above the melting point, preferably above the melting point, of the hot-melt adhesive.
  • This ensures a particularly uniform and complete filling of the unevenness, indentations, cavities, holes or blowholes, since the melt in the free-flowing state can penetrate the surface particularly well, without causing the wood chips to swell.
  • a uniform and homogeneous coating of the coarse particle board with the underlying hot-melt adhesive can also be achieved in this way, with high adhesion to the substrate (i.e. the underlying coarse particle board) also being ensured.
  • the invention provides in particular for the hot-melt adhesive melt to be heated at a temperature (i.e. in particular the temperature of the hot-melt adhesive) in the range from 40° C. to 300° C., in particular in the range from 60° C. to 250° C., preferably in the range of 80° C. and 220° C., preferably in the range from 90° C. to 200° C., particularly preferably in the range from 95° C. to 190° C., is applied to the surface, in particular the flat side surface.
  • a temperature i.e. in particular the temperature of the hot-melt adhesive in the range from 40° C. to 300° C., in particular in the range from 60° C. to 250° C., preferably in the range of 80° C. and 220° C., preferably in the range from 90° C. to 200° C., particularly preferably in the range from 95° C. to 190° C.
  • the hot-melt adhesive melt can be applied at a temperature (ie temperature of the hot-melt adhesive) of at least 40° C., in particular at least 60° C., preferably at least 80° C., preferably at least 90° C., particularly preferably at least 95° C., on the surface in particular flat side surface, are applied.
  • a temperature ie temperature of the hot-melt adhesive
  • the procedure according to the invention can also be such that (i) the application of the hot-melt adhesive melt to the flat side surface of the coarse chipboard wood-based panel and/or step b) and/or (ii) the filling and/or Filling the unevenness, indentations, cavities, holes and/or blowholes with the hot-melt adhesive, in particular the formation of the hot-melt adhesive filling, and/or step b1) and/or (iii) the coating and/or filming of the surface, preferably the flat side surface, in particular the formation of the hot-melt adhesive layer, and/or step b2), in particular independently of one another, is or are carried out or repeated several times, in particular once, twice, 3 times or more.
  • the procedure can also be such that before the hot-melt adhesive is applied again, the previously applied hot-melt adhesive melt is first at least partially cooled or at least partially solidified.
  • the hot-melt adhesive is applied again to the previously applied hot-melt adhesive which has not yet (completely) cooled down or not yet (completely) solidified.
  • the procedure can be such that before the hot-melt adhesive melt is applied to the flat side surface and/or before step b), in particular before step b1) and/or before step b2), preferably before step b1), and/or after Step (a) in addition, a smoothing, in particular a grinding, preferably calibration grinding, of the flat side surface is carried out.
  • a smoothing in particular a grinding, preferably calibration grinding, of the flat side surface is carried out.
  • the smoothing of the flat-side surface which may precede the application of hot-melt adhesive, leads to a reduction in the amount of hot-melt adhesive to be applied.
  • the smoothing can be performed, for example, using a grinding roller or the like. If necessary, the smoothing can be repeated until the desired smoothness of the surface, in particular the flat side surface, of the coarse particle board is obtained.
  • the flat side surface can also be cleaned, in particular to remove previously removed and/or abraded material.
  • the flat side surface can also be cleaned, in particular to remove previously removed and/or abraded material.
  • corresponding brush rollers, suction devices or the like can be used for this purpose.
  • the surface should also be cleaned before applying the hot-melt adhesive, especially the hot-melt adhesive melt
  • the flat side surface or the OSB panel as such is preheated.
  • the surface, in particular the flat side surface, or the OSB panel can be heated to a temperature in the range from 25 °C to 200 °C, in particular in the range from 30 °C to 150 °C, preferably in the range from 40 °C and 125°C, preferably in the range of 50°C to 100°C.
  • the surface, in particular the flat side surface, or the OSB panel can be heated to a temperature of at least 25°C, in particular at least 30°C, preferably at least 40°C, preferably at least 50°C.
  • a temperature of at least 25°C, in particular at least 30°C, preferably at least 40°C, preferably at least 50°C can be guaranteed throughout the process.
  • the preheating leads to improved wetting and penetration behavior of the applied Hot-melt adhesive melt in relation to the flat side surface of the coarse particle board to be coated, since premature curing is prevented, so that the quality of the filled or coated surface is further improved.
  • the procedure can also be such that before the hot-melt adhesive melt is applied to the surface, in particular the flat side surface, and/or before step b), in particular before step b1) and/or step b2), preferably before step b1) , and/or after step (a) and/or after smoothing the flat side surface, a preferably automated detection and evaluation, in particular optical detection and evaluation, preferably opto-electronic detection and evaluation, of the surface, in particular flat side surface, preferably the bumps, depressions, cavities, holes and/or blowholes.
  • the procedure can be such that a differentiated and/or adapted, preferably quantitatively adapted to the detected and analyzed surface, in particular flat side surface, preferably to the detected and analyzed bumps, depressions, cavities, holes and/or voids Hot melt adhesive melt takes place.
  • Corresponding opto-electronic detection or analysis devices can be used for this purpose, for example.
  • a correspondingly differentiated or site-specific application of hot melt adhesive can be carried out, for example, using appropriate nozzle application devices or by applying the hot melt adhesive in sections using a hot melt adhesive metering roller or hot melt adhesive application roller or the like.
  • the procedure can be such that correspondingly larger application quantities of the hot-melt adhesive are used for areas with particularly large or large-volume bumps, depressions, cavities, holes or blowholes, while for areas of the surface to be treated, in particular the flat side surface, with correspondingly few or small-volume bumps, indentations, cavities, holes or blowholes, correspondingly smaller application quantities of hot-melt adhesive can be used.
  • the method according to the invention can be further improved, in particular with regard to optimizing the material use of hot-melt adhesive while at the same time reducing the number of application or coating steps.
  • the procedure can also be such that after the application of the hot-melt adhesive melt to the flat side surface and/or after step b), in particular after step b1) and/or after step b2), preferably after step b2), an optionally further preferably automated detection and evaluation, in particular optical detection and evaluation, preferably optical-electronic detection and evaluation, of the flat side surface filled or coated with the hot-melt adhesive, preferably of the unevenness, depressions, cavities, holes and/or filled or coated with the hot-melt adhesive Blowholes, done.
  • the procedure can be such that the hot-melt adhesive melt is subsequently applied again in the event of incomplete or insufficient filling and/or coating.
  • the hot-melt adhesive applied in particular the Hot-melt adhesive filling or the hot-melt adhesive layer, preferably the hot-melt adhesive layer
  • the hot-melt adhesive applied are carried out.
  • heatable smoothing rollers or the like can be used.
  • the smoothing roller can be operated, for example, in the opposite direction to the transport direction or feed direction of the coarse particle board.
  • the smoothing can be carried out when the applied hot-melt adhesive is not (completely) cooled or not (completely) solidified.
  • the thermoplastic behavior of the hot-melt adhesive used can be used accordingly in the context of smoothing, even in the case of reactive hot-melt adhesives that are not (fully) crosslinked.
  • structuring or profiling in particular Surface structuring and/or surface profiling of the applied hot-melt adhesive, in particular the hot-melt adhesive filling and/or the hot-melt adhesive layer, preferably the hot-melt adhesive layer, are carried out.
  • the structuring and/or profiling can be carried out by means of a preferably heatable structure or profile roller, but also by means of corresponding structure or profile sheets, structure or profile papers and combinations thereof, be performed.
  • the process can preferably be carried out in the not (completely) cooled or in the not (completely) solidified state of the hot-melt adhesive used.
  • the treated surface or the applied hot-melt adhesive of the coarse chipboard material properties can be equipped with additional optical or decorative properties and with further functional properties, such as an anti-slip or anti-slip function.
  • the smoothing on the one hand and/or the structuring or profiling on the other hand can take place during the cooling or solidification and/or before or after the cooling and solidification of the hot-melt adhesive and/or before, during or after step c), in particular before the cooling and solidification of the hot-melt adhesive or before step c).
  • the smoothing or structuring or profiling can in principle also be carried out after the hot-melt adhesive has cooled or hardened, in particular with heating.
  • the surface finish can be achieved by (i) coating, in particular with resin films and/or layers, preferably condensation resin films and/or layers, preferably melamine resin films and/or layers and/or phenolic resin films and/or layers; (ii) laminating, in particular adhesive laminating; (iii) varnishing; and/or (iv) laminating.
  • the coarse-grained wood-based material board provided within the scope of the present invention can thus be subjected to a further surface treatment in the form of a finish, such as for example by painting or covering the surface with, in particular, layered materials or substrates.
  • the coarse particle board can be equipped with additional decorative or functional properties.
  • veneers, Foils, HPL materials High P ressure Laminate
  • CPL materials Continuous Pressed Laminate
  • condensation resin films wallpaper, textiles, mineral and/or synthetic resin-based plasters or the like
  • the finishing with the materials in question which takes place in particular via lamination, preferably adhesive lamination, can take place, depending on the material used, for example via roller or nozzle application (slot nozzle, spray application or multi-bead application).
  • the method according to the invention can be carried out continuously and/or automatically, in particular continuously.
  • the process according to the invention can be carried out continuously with regard to the sequence of the respective process steps.
  • the selection and configuration as well as the type of application or application of the hot-melt adhesive, in particular the hot-melt adhesive melt, in the individual process stages or process sections, in particular with regard to the formation of the hot-melt adhesive filling on the one hand and the hot-melt adhesive layer on the other hand, can each take place independently of one another.
  • the coarse chipboard wood-based panels used according to the invention are concerned in general, they are characterized in particular by the following properties:
  • the coarse chipboard has a density, in particular bulk density, in the range from 300 kg/m 3 to 1000 kg/m 3 , in particular in the range from 400 kg/m 3 to 900 kg/m 3 , preferably in the range of 500 kg /m 3 to 800 kg/m 3 , particularly preferably in the range from 550 kg/m 3 to 750 kg/m 3 .
  • the coarse particle board can have a large number of chips, in particular wood chips, preferably in the form of coarse chips, arranged and/or aligned in layers.
  • the chips can have a length, in particular an average length, in the range from 50 mm to 400 mm, in particular in the range from 75 mm to 300 mm, preferably in the range from 100 mm to 200 mm.
  • the chips can have a width, in particular an average width, in the range from 2 mm to 100 mm, in particular in the range from 5 mm to 75 mm, preferably in the range from 10 mm to 50 mm.
  • the chips can have a thickness, in particular an average thickness, in the range from 0.2 mm to 5 mm, in particular in the range from 0.4 mm to 3 mm, preferably in the range from 0.6 mm to 1.5 mm.
  • the chips can be bonded using at least one binder and/or pressed to form a bond.
  • the coarse chipboard wood-based panels in question have a large number of bumps, indentations, cavities, holes or blowholes, especially in the area of their surface, which can be effectively filled within the scope of the method according to the invention, in particular accompanied by a effective coating of the coarse chipboard based on a special hot-melt adhesive, as mentioned above.
  • an efficient and overall economical method for the treatment, in particular leveling, of the surface, in particular the flat side surface, of coarse-chip wood-based material boards is thus provided overall, which is associated with the aforementioned advantages and properties.
  • Another subject of the present invention - according to a second aspect of the invention - is the coarse particle board (OSB composite wood panel) having at least one leveled flat side surface, the coarse particle board being obtainable or obtained according to the method of the invention described above.
  • OSB composite wood panel the coarse particle board having at least one leveled flat side surface
  • the hot-melt adhesive in particular the hot-melt adhesive melt
  • the hot-melt adhesive is applied in such a way that the unevenness, depressions, cavities, holes and/or voids are filled with the hot-melt adhesive, in particular are filled or filled with the formation of a hot-melt adhesive filling, in particular a hot-melt adhesive leveling filling.
  • the coarse particle board according to the invention has at least one hot-melt adhesive filling, in particular hot-melt adhesive leveling filling, arranged on the flat side surface.
  • the hot-melt adhesive filling is designed in such a way that the bumps, depressions, Cavities, holes and/or blowholes are filled and/or filled with the hot-melt adhesive.
  • the situation in this context is in particular such that the unevenness, indentations, cavities, holes or blowholes are at least essentially completely filled or filled with the hot-melt adhesive.
  • the unevenness, indentations, cavities, holes or blowholes are at least 30%, in particular at least 50%, preferably at least 70%, preferably at least 80%, particularly preferably at least 90%, particularly preferably at least 95% very particularly preferably at least 98%, based on the volume of the unevenness, indentations, cavities, holes and/or blowholes, are filled with the hot-melt adhesive.
  • the hot-melt adhesive filling is interspersed and/or possibly interrupted at least partially and/or in sections with coarse chips that form or limit the unevenness, depressions, cavities, holes and/or blowholes.
  • the coarse chippings forming or delimiting the unevenness, indentations, cavities, holes or cavities can protrude at least partially or in sections into the hot-melt adhesive filling.
  • the hot-melt adhesive filling can have a thickness in the range from 0.2 mm to 50 mm, in particular in the range from 0.5 mm to 25 mm, preferably in the range from 1 mm to 10 mm, preferably in the range from 1 mm to 5 mm.
  • the hot-melt adhesive in particular the hot-melt adhesive melt
  • the hot-melt adhesive is also applied in such a way that the surface, in particular the flat side surface, and/or the hot-melt adhesive filling is at least partially and/or in sections, preferably over the entire surface, covered with the hot-melt adhesive , in particular with the hot-melt adhesive melt, coated and / or filmed.
  • the coarse particle board has at least one hot-melt adhesive layer, in particular hot-melt adhesive cover layer, arranged or applied on the flat side surface or on the hot-melt adhesive filling.
  • the hot melt adhesive layer is formed such that the flat side surface or the hot-melt adhesive filling is coated and/or filmed at least partially and/or in sections, preferably over the entire surface, with the hot-melt adhesive, in particular with the hot-melt adhesive melt.
  • the hot-melt adhesive layer can be at least essentially closed or at least essentially free of perforations.
  • the hot-melt adhesive layer has at least essentially no coarse chips that form or limit the unevenness, depressions, cavities, holes and/or blowholes.
  • the hot-melt adhesive layer can have a thickness in the range from 0.1 mm to 30 mm, in particular in the range from 0.2 mm to 20 mm, preferably in the range from 0.5 mm to 10 mm, preferably in the range from 0 .75 mm to 5 mm, particularly preferably in the range from 1 mm to 3 mm.
  • the hot-melt adhesive in particular the hot-melt adhesive melt, can be used in an amount in the range from 10 g/m 2 to 2,000 g/m 2 , in particular in the range from 25 g/m 2 to 1,500 g/m 2 , preferably in Range from 50 g/m 2 to 1000 g/m 2 , preferably in the range from 75 g/m 2 to 800 g/m 2 , particularly preferably in the range from 100 g/m 2 to 600 g/m 2 , based on the Surface, especially flat side surface, be applied.
  • the hot-melt adhesive is a thermoplastic and/or one-component hot-melt adhesive, in particular a one-component hot-melt adhesive.
  • the hot-melt adhesive should be at least essentially free of water and/or solvents.
  • the hot-melt adhesive should have a water and/or solvent content of at most 10% by weight, in particular at most 5% by weight, preferably at most 2% by weight, preferably at most 1% by weight, particularly preferably at most 0, 5% by weight, very particularly preferably at most 0.1% by weight, based on the hot-melt adhesive.
  • the hot-melt adhesive is a reactive hot-melt adhesive, in particular a thermoplastic and/or one-component reactive hot-melt adhesive, preferably a one-component reactive hot-melt adhesive.
  • the reactive hot-melt adhesive is a moisture-crosslinking, heat-crosslinking and/or radiation-crosslinking hot-melt adhesive, in particular a moisture-crosslinking and/or radiation-crosslinking, preferably a moisture-crosslinking, hot-melt adhesive.
  • the hot-melt adhesive is a non-reactive hot-melt adhesive, in particular a thermoplastic and/or one-component non-reactive hot-melt adhesive, preferably a one-component non-reactive hot-melt adhesive.
  • a hot-melt adhesive based on natural raw materials in particular polylactic acid (PLA), can be used.
  • PLA polylactic acid
  • the hot-melt adhesive has at least one adhesion promoter and/or primer.
  • the adhesion promoter can be selected from the group consisting of silicon oxides, silanes, silicic acids, siliceous earths and mixtures and combinations thereof.
  • the hot-melt adhesive can have at least one additive.
  • the additive can be selected from the group of plasticizers, high-boiling organic oils, esters or other additives used for plasticization, stabilizers, in particular UV stabilizers, antioxidants, acid scavengers, in particular nano-particulate fillers, aging inhibitors and mixtures or combinations thereof.
  • the hot-melt adhesive can have at least one non-reactive polymer, resin and/or wax, in particular a natural, synthetic or chemically modified (partially synthetic) wax.
  • the hot-melt adhesive can have at least one functionalization component.
  • the functionalization component can be selected from the group of electrically conductive substances, antimicrobial, antimycotic and/or fungicidal substances and mixtures and combinations thereof.
  • the hot-melt adhesive can have at least one dye and/or at least one color pigment.
  • the dye or the color pigment can be selected from the group of organic ones Pigment dyes, inorganic pigment dyes and mixtures and combinations thereof.
  • the coarse-chip wood material board according to the invention can furthermore be designed in such a way that the flat side surface is smoothed, in particular ground.
  • the unevenness, indentations, cavities, holes or cavities can be reduced or evened out, in particular by removing coarse chip material.
  • the area-related application quantity of hot-melt adhesive can be correspondingly reduced.
  • the coarse-chip wood-based material panel according to the invention can be designed in such a way that the hot-melt adhesive applied to the flat side surface, in particular the hot-melt adhesive filling and/or the hot-melt adhesive layer, is smoothed or standardized.
  • the surface properties can be further improved, in particular with regard to a uniform and homogeneous appearance of the coarse particle board according to the invention.
  • the hot-melt adhesive applied to the flat side surface in particular the hot-melt adhesive filling and/or the hot-melt adhesive layer, is structured or profiled.
  • further decorative properties can be provided.
  • the anti-slip properties can be improved and thus the slip resistance can be increased accordingly.
  • the coarse particle board is surface-coated or has a further coating, in particular on the flat side surface, preferably on the hot-melt adhesive, in particular on the hot-melt adhesive filling and/or the hot-melt adhesive layer.
  • the coarse chipboard material panel in particular on the flat side surface, can have (i) at least one coating, in particular with resin films and/or layers, preferably condensation resin films and/or layers, preferably melamine resin films and/or layers and/or phenolic resin films and/or -layers; (ii) at least one lamination, in particular adhesive lamination; (iii) at least one finish; and/or (v) at least one lamination.
  • the coarse particle board based on the invention can have a density, in particular bulk density, in the range from 300 kg/m 3 to 1,000 kg/m 3 , in particular in the range from 400 kg/m 3 to 900 kg/m 3 , preferably in the range from 500 kg/m 3 to 800 kg/m 3 , particularly preferably in the range from 550 kg/m 3 to 750 kg/m 3 .
  • the coarse particle board according to the invention is also characterized in that it has a large number of chips, in particular wood chips, preferably in the form of coarse chips, arranged and/or aligned in layers.
  • the chips can have a length, in particular an average length, in the range from 50 mm to 400 mm, in particular in the range from 75 mm to 300 mm, preferably in the range from 100 mm to 200 mm.
  • the chips can have a width, in particular an average width, in the range from 2 mm to 100 mm, in particular in the range from 5 mm to 75 mm, preferably in the range from 10 mm to 50 mm.
  • the chips can have a thickness, in particular an average thickness, in the range from 0.2 mm to 5 mm, in particular in the range from 0.4 mm to 3 mm, preferably in the range from 0.6 mm to 1.5 mm.
  • the situation is in particular such that the chips are connected by means of at least one binder or pressed to form a bond.
  • the coarse chipboard based wood panel according to the invention is distinguished by improved (surface) properties, in particular with regard to improved weathering, UV and/or moisture resistance.
  • the coarse-chip wood-based panels according to the invention have a high resistance to chemicals.
  • the at least essentially perforation-free and/or complete coating of the surface, in particular the flat side surface effectively protects the components of the coarse chipboard material underneath from the weather or environmental influences, such as moisture, while at the same time providing the coating with high mechanical stability.
  • the production plant can comprise a plurality, in particular two, three, four or more, filling and/or coating devices.
  • the respective filling or coating devices can be arranged in particular downstream of one another or in series.
  • a multiple or successive application of the hot-melt adhesive to the surface, in particular the flat side surface is possible with the hot-melt adhesive application increasing in the course of the process, so that in this way the corresponding hot-melt adhesive filling or hot-melt adhesive layer can be formed continuously.
  • the production plant it is also possible in the present case for the production plant to have at least one return device, in particular for the return transport or push-back of the coarse particle board, in particular to the filling or coating device.
  • the coarse-grain wood-based material board it is possible within the scope of the production plant for the coarse-grain wood-based material board to be guided again through a corresponding filling or coating device for renewed application of the hot-melt adhesive.
  • the return device can in particular be a component of the transport or feed device described below.
  • the grinding device of the production plant can have at least one means for grinding, in particular a grinding roller.
  • the grinding device can also have at least one means for cleaning or for removing abraded material. This can be, for example, a roller brush or a suction device or the like.
  • the heating or tempering device on which the production plant is based can have at least one means for heating or tempering the coarse particle board, in particular the flat side surface, of the coarse particle board, in particular a heat radiator or heat fan or an oven, in particular belt or continuous oven , and/or have at least one means for detecting or controlling the temperature of the coarse particle board, preferably the flat side surface of the coarse particle board.
  • the application behavior can be improved overall, in particular with regard to at least essentially complete filling or filling of the unevenness, depressions, cavities, holes or blowholes in question, in particular there premature cooling or solidification of the hot-melt adhesive, as can be the case when it is applied to a cold or unheated substrate, is avoided.
  • the filling and/or coating device of the production plant can have at least one means for heating the hot-melt adhesive, preferably for obtaining the hot-melt adhesive melt, or at least one means for applying the hot-melt adhesive melt to the flat side surface.
  • the means for applying the hot-melt adhesive melt can be selected from the group of (i) hot-melt adhesive rollers, in particular hot-melt adhesive metering rollers and/or hot-melt adhesive application rollers; (ii) hot-melt adhesive application nozzles, in particular slot nozzles for hot-melt adhesive, preferably flat sheet nozzles for hot-melt adhesive; (iii) hot-melt adhesive doctor blades, in particular hot-melt adhesive roller doctor blades; particularly preferably (i) rollers, in particular hot-melt adhesive metering rollers and/or hot-melt adhesive application rollers, and combinations thereof.
  • heatable hot-melt adhesive application rollers with separate, in particular uniformly heatable, hot-melt adhesive metering rollers can be used in the present case.
  • a hot-melt adhesive application roller, in particular with a squeegee system can be used in particular for the defined application of the required application quantity of hot-melt adhesive melt.
  • the means for applying the hot-melt adhesive in particular the hot-melt adhesive roller, in particular hot-melt adhesive metering roller and/or hot-melt adhesive application roller, is designed to be heatable. This avoids premature cooling or solidification of the hot-melt adhesive used and maintains the flowability of the hot-melt adhesive when it is applied to the flat side surface, which further improves the application quality.
  • the filling or coating device has a plurality of first means and a plurality of second means for applying the hot-melt adhesive.
  • the means for applying the hot-melt adhesive is in the form of a hot-melt adhesive roller, in particular hot-melt adhesive metering roller and/or hot-melt adhesive application roller, or comprises it, with the hot-melt adhesive roller, in particular the hot-melt adhesive metering roller or the hot-melt adhesive applicator roller, can be operated in the same direction or in the opposite direction to the transport direction and/or feed direction of the coarse particle board.
  • the hot-melt adhesive roller in particular the hot-melt adhesive metering roller and/or the hot-melt adhesive application roller, has at least one device for controlling and/or operating the hot-melt adhesive roller, in particular the hot-melt adhesive metering roller and/or or the hot-melt adhesive applicator roller, running in the same direction or in the opposite direction to the direction of transport and/or the direction of feed of the coarse particle board.
  • the quantity of the applied hot-melt adhesive can be set or specified accordingly.
  • the production plant or the filling and/or coating device in particular the means for applying the hot-melt adhesive, has at least one control device for setting or controlling the applied quantity of hot-melt adhesive.
  • the control device for setting and/or controlling the amount of hot-melt adhesive applied can be designed such that the amount of hot-melt adhesive to be applied can be adjusted depending on the transport speed and/or feed speed of the coarse particle board. This ensures an even and defined adhesive application with a high throughput at the same time.
  • the means for applying the hot-melt adhesive is designed in the form of a hot-melt adhesive roller, in particular hot-melt adhesive metering roller and/or hot-melt adhesive application roller, or comprises it, with the hot-melt adhesive roller, in particular the hot-melt adhesive dosing roller and/or the hot-melt adhesive application roller, has at least one control device for setting or controlling the roller speed of rotation and/or the roller peripheral speed, in particular as a function of the transport speed and/or feed speed of the coarse particle board.
  • the production plant can have at least one transport and/or feed device, in particular for the transport and/or feed of the coarse particle board.
  • the transport or feed device can have at least one control device for setting or controlling the transport and/or feed speed of the coarse particle board.
  • the control device for setting and/or controlling the transport and/or feed speed can be designed in such a way that the transport and/or feed speed of the coarse particle board is a function of the amount of hot-melt adhesive to be applied and/or a function of the rollers -Rotational speed and/or the peripheral speed of the rollers of the hot-melt adhesive metering roller and/or the hot-melt adhesive applicator roller which is adjustable.
  • the total quantity of hot-melt adhesive to be applied can be specified.
  • the production plant has at least one detection and/or evaluation device for the preferably automated detection and evaluation, in particular optical detection and evaluation, preferably optoelectronic detection and evaluation, of the surface, in particular the flat side surface, preferably the unevenness, indentations , cavities, holes and/or blowholes.
  • the detection or evaluation device can be arranged downstream of the grinding device and/or downstream of the heating and/or temperature control device and/or upstream of the filling and/or coating device.
  • the production plant can also have at least one means for controlling the quantity of hot-melt adhesive to be applied or discharged depending on the optical detection or evaluation of the surface, in particular the flat side surface, of the coarse particle board.
  • an application quantity of hot-melt adhesive which is adapted to the respective circumstances and, in particular, is site-specific, can be set, which leads to correspondingly optimized coatings while at the same time saving material.
  • the further detection or evaluation device can be arranged downstream of the filling and/or coating device.
  • the production plant can be designed, for example, in such a way that if the coating or the like is not complete, the coarse chipboard is subjected to a new application of hot-melt adhesive, for example by being fed back to the filling and/or coating device, in particular by means of the transport and/or Feed device or the return device.
  • the production plant enables continuous and/or automated or fully automated treatment of the underlying OSB panels.
  • the surface treatment and/or structuring device can have at least one means for smoothing or unifying the applied hot-melt adhesive, in particular a preferably heatable smoothing roller, and/or at least one means for structuring and/or profiling the applied hot-melt adhesive, in particular selected from the group of preferably heatable structure or profile rollers, structure or profile sheets, structure or profile papers and combinations thereof.
  • the production plant can also have at least one coating, laminating, painting and/or laminating device.
  • the coating, lining, painting and/or laminating device can be arranged downstream of the filling and/or coating device or upstream of the cooling device or else downstream of the cooling device.
  • the surface can be further treated, for example by applying (decorative) foils, paintwork or the like.
  • coarse-grain wood-based material boards can be treated efficiently on their surface, in particular the flat side surface, with a hot-melt adhesive for sealing the underlying wood-based material boards, in particular based on the method according to the invention.
  • At least one hot-melt adhesive in particular as defined above, to increase the weather, UV and / or moisture resistance of a coarse particle board (OSB wood composite panel) and / or to equip a coarse particle board (OSB wood composite panel) with Description of application properties for outdoor use.
  • At least one hot-melt adhesive in particular as defined above, for evening out or leveling the surface, preferably the flat side surface, of a coarse particle board is also described here.
  • the hot melt adhesive used as a basis for the uses described here is preferably a one-component hot melt adhesive and/or a reactive hot melt adhesive, in particular a one-component reactive hot melt adhesive.
  • the hot-melt adhesive in particular in the form of a hot-melt adhesive melt, can be applied to at least one surface, in particular the flat side surface, of the coarse chipboard material board in such a way that at least the unevenness, depressions, cavities, holes and/or Blowholes are at least essentially filled and/or filled with the hot-melt adhesive, in particular the hot-melt adhesive melt, in particular whereby the surface, preferably the flat side surface, is made more uniform and/or equal, in particular with the formation of at least one hot-melt adhesive filling.
  • the hot-melt adhesive in particular the hot-melt adhesive melt
  • the hot-melt adhesive melt is also applied in such a way that the surface, in particular the flat side surface, and/or the hot-melt adhesive filling is at least partially and/or in sections, preferably over the entire surface, is coated and/or filmed with the hot-melt adhesive, in particular with the hot-melt adhesive melt at least one hot-melt adhesive layer, in particular hot-melt adhesive cover layer, arranged on the surface, in particular flat-side surface, and/or on the hot-melt adhesive filling.
  • Another object of the present invention--according to a third aspect of the invention-- is the use of at least one coarse chipboard material board, as defined above, for the different applications listed below.
  • the coarse-grain wood-based material board according to the invention is suitable for use as and/or for the production of, in particular, weatherproof, UV-resistant and/or moisture-resistant and/or decorative planking, cladding, facade elements, facade panels, structural elements and/or building panels, preferably in the area of wall, roof and/or floor constructions, in particular in the (construction) exterior area and/or (construction) interior area, preferably in the area of exterior and/or interior construction.
  • the coarse-grain wood-based material board according to the invention is suitable for use as and/or for the production of furniture and/or furniture elements and/or in particular decorative furniture boards, components, building boards, in particular in furniture, shop and/or trade fair construction, preferably in the area of wall, roof and/or floor structures.
  • the coarse-grain wood-based material board according to the invention is suitable for use as and/or for the production of packaging and/or transport elements and/or boards, packaging and/or transport devices that are particularly weatherproof, UV-resistant and/or moisture-resistant , in particular packaging and/or transport containers and/or crates, in particular in the transport and/or packaging sector.
  • the present invention relates - according to a fourth aspect of the invention - the building or facade element according to the invention, in particular building and / or facade panel, in particular with weather, UV and / or moisture-resistant and / or decorative properties, wherein the building and / or facade element has at least one coarse particleboard wood-based panel (OSB wood composite panel) having at least one surface treated with at least one hot-melt adhesive, in particular leveled, preferably flat side surface, in particular coarse particleboard wood-based panel (OSB wood composite panel) according to one of the preceding claims, or consists of it.
  • OSB wood composite panel coarse particleboard wood-based panel having at least one surface treated with at least one hot-melt adhesive, in particular leveled, preferably flat side surface, in particular coarse particleboard wood-based panel (OSB wood composite panel) according to one of the preceding claims, or consists of it.
  • FIG. 1 thus shows in the form of a flow chart the implementation of the method according to the invention for leveling at least one flat side surface of coarse chipboard wood-based panels or OSB wood composite panels according to an embodiment of the invention.
  • At least one coarse particle board is first provided in accordance with step 1, the coarse particle board having at least one flat side surface with a large number of bumps, indentations, cavities, holes or blowholes, which are generally due to the shape and arrangement of the the coarse shavings on which the coarse shavings are based. This can also refer to the representation 3A to get expelled.
  • a smoothing in particular a grinding, preferably a calibration grinding of the flat side surface is carried out before the filling of the surface with the hot-melt adhesive.
  • the associated removal of material can smooth out or reduce the unevenness, indentations, cavities, holes or blowholes on the flat side surface, which is beneficial in particular for the subsequent application of hot-melt adhesive, particularly with regard to reducing the amount of material used.
  • the procedure can basically be such that, according to step 3, in particular after the provision or after the grinding of the coarse particle board and before the application of the hot-melt adhesive, the flat side surface or the coarse particle board as such is preheated .
  • the wetting or penetration behavior of the hot-melt adhesive in the form of the hot-melt adhesive melt into the unevenness, depressions, cavities, holes or blowholes on which the surface is based can be improved.
  • steps 4 and 5 it is also provided according to steps 4 and 5 to apply at least one hot-melt adhesive in the form of a hot-melt adhesive melt to at least the flat side surface of the coarse particle board.
  • the procedure according to the invention is such that at least the bumps, depressions, cavities, holes or blowholes are at least essentially filled with the hot-melt adhesive or the hot-melt adhesive melt. This will causes in particular a smoothing or leveling of the flat side surface.
  • the hot-melt adhesive is applied in the form of the hot-melt adhesive melt within the scope of the method according to the invention in such a way that the hot-melt adhesive is first applied in the form of the hot-melt adhesive melt according to step 4 in such a way that the unevenness, depressions, cavities, holes or Blowholes are filled or filled with the hot-melt adhesive, in particular with the formation of a hot-melt adhesive filling, preferably hot-melt adhesive leveling filling, in particular accompanied by a corresponding evening out or leveling of the surface treated in this way.
  • a hot-melt adhesive filling preferably hot-melt adhesive leveling filling, in particular accompanied by a corresponding evening out or leveling of the surface treated in this way.
  • This can also refer to the representation Figure 3B to get expelled.
  • the procedure is such that the hot-melt adhesive is then applied in the form of the hot-melt adhesive melt in such a way that the flat side surface or the hot-melt adhesive filling is also at least partially or in sections, preferably over the entire surface is coated or filmed with the hot-melt adhesive, in particular on this basis a hot-melt adhesive layer arranged on the surface or on the hot-melt adhesive filling, in particular in the form of a hot-melt adhesive covering layer, can result.
  • This can also refer to the representation Figure 3C to get expelled.
  • the applied hot-melt adhesive can be smoothed and/or structured or profiled, in particular when the hot-melt adhesive is not (completely) cooled or in particular not (completely) solidified.
  • cooling and solidification, in particular curing or allowing to solidify, of the hot-melt adhesive also optionally takes place.
  • the cooling and solidification also includes, in particular, (post-)crosslinking of the hot-melt adhesive used.
  • the procedure can be such that, according to step 8, in particular after cooling or solidification, a further surface finishing of the OSB panel equipped with the hot-melt adhesive is carried out takes place, for example by means of coating, lining, painting, laminating or the like.
  • FIG. 1 shows 2 in the form of a schematic representation of a production plant P according to the invention, the production plant P according to the invention according to the described embodiment according to the invention having at least one means A in the form of a grinding device, in particular for grinding, preferably calibration grinding, of the at least one surface, in particular the flat side surface, of the surface to be treated according to the invention Having coarse particle board.
  • the production plant P according to the invention can also, according to means B, optionally have at least one heating or temperature device, which is arranged in particular downstream of the grinding device.
  • the production plant P according to the invention according to means C has at least one filling or coating device for applying the hot-melt adhesive in the form of the hot-melt adhesive melt.
  • the filling or coating device according to means C can be arranged in particular downstream of the heating or temperature control device according to means B.
  • the production plant P has at least one surface treatment or structuring device according to means D and optionally at least one cooling device according to means E, which can each be arranged downstream of the filling and/or coating device.
  • Figure 3A an untreated starting coarse-chip wood-based material panel 2 with a corresponding flat side surface, which has a large number of unevennesses, depressions, cavities, holes or blowholes to be filled.
  • FIG. 3B a treated coarse chipboard composite wood panel 1, in which the underlying starting coarse chipboard wood material panel 2 is filled using a hot-melt adhesive on the flat side surface, in particular to form a hot-melt adhesive filling 3a, accompanied by a corresponding evening out or leveling of the flat side surface (not according to the invention).
  • Figure 3C shows a coarse particle board 1 treated according to the method according to the invention, after which the treated coarse particle board 1 additionally has a further hot-melt adhesive layer 3b, which is applied to the flat side surface of the underlying coarse particle board 2 or to the hot-melt adhesive filling 3a.
  • the present invention is also illustrated by the following exemplary embodiments, but without restricting the present invention thereto.
  • Various coarse particleboards are produced, namely coarse particleboards according to the present invention on the one hand and comparative coarse particleboards on the other hand, the respective coarse particleboards being produced as described below:
  • different hot-melt adhesive systems in the form of the respective hot-melt adhesive melt are applied to an underlying untreated coarse particleboard wood-based panel, with a corresponding production system being used for this purpose, which has a filling or coating device based on hotmelt adhesive -Applicator rollers with squeegee system included.
  • the hot-melt adhesive is applied to the preheated panels at temperatures above the softening point or above the melting point of the hot-melt adhesive used, to the extent that, in addition to complete filling of the unevenness, depressions, cavities, holes or blowholes on the flat side surface, there is also complete filling Coating in the form of a closed hot-melt adhesive layer on the surface of the treated panels.
  • the procedure is such that first the hot-melt adhesive is applied as part of a first treatment step to fill the unevenness, depressions, cavities, holes and/or blowholes in question and then in a second process step the respective hot-melt adhesive is applied again to form the completely closed hot-melt adhesive layer becomes.
  • the applied hot-melt adhesive is smoothed and the applied hot-melt adhesive is cured or cooled in order to obtain the finished coarse particle board.
  • coarse chipboard wood-based panels according to the invention are produced, in which on the one hand a reactive hot-melt adhesive in the form of PUR (OSB panel I according to the invention), POR (OSB panel II according to the invention) and on the other hand a non-reactive hot-melt adhesive in the form of EVA (inventive OSB panel III) is used.
  • a reactive hot-melt adhesive in the form of PUR (OSB panel I according to the invention)
  • POR OSB panel II according to the invention
  • EVA inventive OSB panel III
  • comparative coarse-chip wood-based panels were produced, with treatment of the flat side surface or filling of the depressions, cavities, holes or blowholes on the one hand water-based paint system (comparative OSB panel IV) and on the other hand an organic solvent-based paint system (comparative OSB panel V) for filling the unevenness, indentations, cavities, holes or blowholes on the flat side of the respective coarse particleboard wood-based panels and for the subsequent application a further finishing layer can be used.
  • the paint system used in each case is consequently applied to the flat side surface by manual filling to fill the depressions, cavities, holes or blowholes in question.
  • the respective paint system is then applied to obtain a corresponding final layer, with the respective paint system being applied to the flat side surface by spraying for this purpose.
  • the individual OSB panels are then subjected simultaneously and under identical conditions to an accelerated weathering test under defined humidity, wetness and temperature influences.
  • a visual assessment is then carried out with regard to the quality of the surface or the condition of the respective OSB board as a whole, in particular with regard to swelling of the OSB board, surface texture, cracking or flaking of the applied filling or coating systems, the Here, too, evaluation is based on the school grading system.
  • the results listed in the table show that the OSB boards according to the invention have overall improved surface qualities, also with regard to the optical properties, with the OSB boards according to the invention achieving a permanent and uniform filling of the unevenness, depressions, cavities, holes or Blowholes are guaranteed using mechanical methods.
  • the OSB panels according to the invention have significantly improved weathering behavior.
  • coarse chipboard panels treated overall on their surface, in particular the flat side surface are provided which, with greater homogeneity and durability of the surface, also have increased long-term and weathering resistance.

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Claims (13)

  1. Procédé d'égalisation d'au moins une surface de côté plat de panneaux de particules de bois grossières (panneaux en matériau dérivé du bois à gros copeaux),
    le procédé comprend les étapes suivantes dans l'ordre indiqué:
    a) on met à disposition au moins un panneau de particules de bois grossières, ledit panneau de particules de bois grossières ayant au moins une surface de côté plat avec une pluralité d'inégalités, de creux, de cavités, de trous et/ou de vides (retassures); puis
    b) on applique au moins une colle thermofusible sous la forme d'une masse fondue de colle thermofusible sur le côté plat du panneau de particules de bois grossières, où
    b1) l'on applique tout d'abord la masse fondue de colle thermofusible de telle sorte que les inégalités, les creux, les cavités, les trous et/ou les retassures (vides) sont remplis et/ou obturés (remblayés) de la colle thermofusible, en particulier en formant au moins un remplissage de colle thermofusible, de préférence un remplissage d'égalisation de colle thermofusible, un nivellement et/ou une égalisation de la surface du côté plat étant réalisé(e), et
    b2) l'on applique ensuite la masse fondue de colle thermofusible de telle sorte que la surface du côté plat et/ou le remplissage de colle thermofusible soit en outre revêtu(e) et/ou filmé(e) au moins partiellement et/ou par sections, de préférence sur toute la surface, avec la masse fondue de colle thermofusible, ce qui donne au moins une couche de colle thermofusible, en particulier une couche de recouvrement de colle thermofusible, disposée sur la surface du côté plat et/ou sur le remplissage de colle thermofusible;
    où l'on effectue d'abord l'étape b1), suivie d'un refroidissement et d'une solidification de la colle thermofusible, puis on effectue l'étape b2);
    c) on refroidit et on solidifie la masse fondue de colle thermofusible après l'exécution de l'étape b2).
  2. Procédé selon la revendication 1,
    où, pour le remplissage et/ou l'obturation (remblayage) des inégalités, des creux, des cavités, des trous et/ou des vides, en particulier pour la formation du remplissage de colle thermofusible, et/ou dans l'étape b1), d'une part, et pour le revêtement et/ou le filmage de la surface du côté plat et/ou du remplissage de colle thermofusible, en particulier pour la formation de la couche de colle thermofusible, et/ou dans l'étape b2), d'autre part, on utilise à chaque fois la même colle thermofusible et/ou on utilise à chaque fois des colles thermofusibles identiques, en particulier comme défini ci-après, ou on utilise des colles thermofusibles différentes les unes des autres; et/ou
    où la colle thermofusible est une colle thermofusible thermoplastique et/ou à un seul composant, en particulier une colle thermofusible à un seul composant.
  3. Procédé selon la revendication 1 ou 2,
    où la colle thermofusible est une colle thermofusible réactive, en particulier une colle thermofusible thermoplastique et/ou réactive à un composant, de préférence une colle thermofusible réactive à un composant;
    en particulier où la colle thermofusible réactive est une colle thermofusible réticulant à l'humidité, réticulant à la chaleur et/ou réticulant par rayonnement, en particulier une colle thermofusible réticulant à l'humidité et/ou réticulant par rayonnement, de préférence une colle thermofusible réticulant à l'humidité; et/ou
    en particulier où la colle thermofusible réactive présente des groupes chimiquement réactifs, en particulier où les groupes chimiquement réactifs sont choisis parmi des groupes isocyanate, des groupes silane, des groupes époxyde et des liaisons réactives doubles ou multiples ainsi que leurs combinaisons, de préférence des groupes isocyanate et des groupes silane, et/ou en particulier où les groupes chimiquement réactifs sont terminaux; et/ou
    en particulier où la colle thermofusible réactive est choisie dans le groupe (i) des polyuréthanes réactifs, en particulier réticulant à l'humidité, de préférence des polyuréthanes fonctionnalisés par des groupes isocyanate et/ou contenant des groupes isocyanate, de préférence des polyuréthanes à terminaison isocyanate; (ii) des polyoléfines réactives, en particulier réticulant à l'humidité, de préférence des polyoléfines fonctionnalisées par des groupes silane et/ou contenant des groupes silane, de préférence des polyoléfines greffées par des groupes silane; (iii) des poly(méth)acrylates réactifs, en particulier réticulant par rayonnement, de préférence réticulant aux UV, de préférence des poly(méth)acrylates fonctionnalisés par des groupes uréthane et/ou contenant des groupes uréthane; ainsi que leurs mélanges et combinaisons, de préférence dans le groupe (i) des polyuréthanes réactifs, en particulier réticulant à l'humidité, de préférence des polyuréthanes fonctionnalisés par des groupes isocyanate et/ou contenant des groupes isocyanate, de préférence des polyuréthanes à terminaison isocyanate; (ii) des polyoléfines réactives, en particulier réticulant à l'humidité, de préférence des polyoléfines fonctionnalisées par des groupes silane et/ou contenant des groupes silane, de préférence des polyoléfines greffées par des groupes silane; ainsi que leurs mélanges et combinaisons.
  4. Procédé selon l'une des revendications précédentes,
    où la colle thermofusible est une colle thermofusible non réactive, en particulier une colle thermofusible thermoplastique et/ou une colle thermofusible non réactive à un seul composant, de préférence une colle thermofusible non réactive à un seul composant,
    en particulier où la colle thermofusible non réactive est choisie dans le groupe constitué par (i) des éthylène-acétates de vinyle; (ii) des polyoléfines, en particulier des polyéthylènes, des polypropylènes et des polyoléfines atactiques; (iii) des polyamides; (iv) des polyuréthanes thermoplastiques; (v) des polyuréthanes; (vi) des (méth)acrylates; (vii) des polyesters; ainsi que leurs mélanges et combinaisons, de préférence dans le groupe (i) des éthylène-acétates de vinyle; (ii) des polyoléfines; (iii) des polyamides; (iv) des polyuréthanes thermoplastiques; ainsi que leurs mélanges et combinaisons.
  5. Procédé selon l'une des revendications précédentes,
    où l'adhésif thermofusible est de l'acide polylactique.
  6. Procédé selon l'une des revendications précédentes,
    où la colle thermofusible comprend ou est constituée d'un mélange et/ou d'une combinaison d'au moins deux colles thermofusibles différentes l'une de l'autre, en particulier telles que définies précédemment.
  7. Procédé selon l'une des revendications précédentes,
    où l'adhésif thermofusible comprend ou est constitué d'un mélange et/ou d'une combinaison d'au moins un adhésif thermofusible réactif, notamment tel que défini précédemment, et d'au moins un adhésif thermofusible non réactif, notamment tel que défini précédemment.
  8. Procédé selon l'une des revendications précédentes,
    où la masse fondue de colle thermofusible est appliquée sur la surface, en particulier la surface du côté plat, par pulvérisation et/ou application par buse, raclage, application par rouleau, procédé d'impression et/ou extrusion, en particulier par pulvérisation et/ou application par buse et/ou application par rouleau, de préférence par rouleau.
  9. Procédé selon l'une des revendications précédentes,
    où la masse fondue de colle thermofusible est appliquée sur la surface du côté plat à une température comprise dans la plage de 40 °C à 300 °C, en particulier dans la plage de 60 °C à 250 °C, préférentiellement dans la plage de 80 °C à 220 °C, de préférence dans la plage de 90 °C à 200 °C, de manière particulièrement préférée dans la plage de 95 °C à 190 °C.
  10. Panneau de particules de bois grossières (panneau en matériau dérivé du bois à gros copeaux), présentant au moins une surface de côté plat égalisée, la surface de côté plat présentant une pluralité d'inégalités, de creux, de cavités, de trous et/ou de retassures (vides), les inégalités, les creux, les cavités, les trous et/ou les retassures étant remplis et/ou obturés (remblayés) d'au moins une colle thermofusible, en particulier de telle sorte qu'il y ait un nivellement et/ou une égalisation de la surface de côté plat,
    où le panneau de particules de bois grossières présente au moins un remplissage de colle thermofusible, en particulier un remplissage d'égalisation de colle thermofusible, disposé sur la surface du côté plat, le remplissage de colle thermofusible étant réalisé de telle sorte que les inégalités, les creux, les cavités, les trous et/ou les retassures sont remplis et/ou obturés (remblayés) de la colle thermofusible,
    caractérisé en ce que
    le panneau de particules de bois grossières présente au moins une couche de colle thermofusible, en particulier une couche de recouvrement de colle thermofusible, disposée sur la surface du côté plat et/ou sur le remplissage de colle thermofusible, la couche de colle thermofusible étant réalisée de telle sorte que la surface du côté plat et/ou le remplissage de colle thermofusible sont revêtus et/ou filmés avec la colle thermofusible au moins en partie et/ou par sections, de préférence sur toute la surface.
  11. Panneau de particules de bois grossières selon la revendication 10,
    où la colle thermofusible est appliquée en une quantité dans la plage de 10 g/m2 à 2 000 g/m2, en particulier dans la plage de 25 g/m2 à 1 500 g/m2, préférentiellement dans la plage de 50 g/m2 à 1 000 g/m2, de préférence dans la plage de 75 g/m2 à 800 g/m2, de manière particulièrement préférée dans la plage de 100 g/m2 à 600 g/m2, par rapport à la surface du côté plat.
  12. Utilisation d'au moins un panneau de particules de bois grossières, tel que défini dans la revendication 10 ou 11,
    comme et/ou pour la fabrication de revêtements, d'habillages, d'éléments de façade, de panneaux de façade, d'éléments de construction et/ou de panneaux de construction, en particulier résistants aux intempéries, aux UV et/ou à l'humidité et/ou décoratifs, de préférence dans le domaine de la construction de murs, de toits et/ou de sols, en particulier dans le domaine extérieur et/ou intérieur, de préférence dans le domaine de la construction extérieur et/ou intérieur; et/ou
    comme et/ou pour la fabrication de meubles et/ou d'éléments de meubles et/ou en particulier de panneaux de meubles décoratifs, d'éléments de construction, de panneaux de construction, en particulier dans le domaine de la construction de meubles, de magasins et/ou de stands d'exposition, de préférence dans le domaine de la construction de murs, de toits et/ou de sols; et/ou
    comme et/ou pour la fabrication d'éléments et/ou de plaques d'emballage et/ou de transport, de dispositifs d'emballage et/ou de transport, en particulier de récipients et/ou de caisses d'emballage et/ou de transport, résistants en particulier aux intempéries, aux UV et/ou à l'humidité, en particulier dans le domaine du transport et/ou de l'emballage.
  13. Elément de construction et/ou de façade, en particulier panneau de construction et/ou de façade, en particulier avec des propriétés de résistance aux intempéries, aux UV et/ou à l'humidité et/ou décoratives, l'élément de construction et/ou de façade présentant au moins un panneau de particules de bois grossières selon la revendication 10 ou 11 ou étant constitué de celui-ci.
EP16187043.1A 2016-09-02 2016-09-02 Procede de traitement de surfaces en bois Active EP3290175B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
ES16187043T ES2941275T3 (es) 2016-09-02 2016-09-02 Procedimiento para el procesamiento de superficies de materiales de madera
EP16187043.1A EP3290175B1 (fr) 2016-09-02 2016-09-02 Procede de traitement de surfaces en bois
PT161870431T PT3290175T (pt) 2016-09-02 2016-09-02 Processo para tratamento de superfícies de derivados de madeira
PL16187043.1T PL3290175T3 (pl) 2016-09-02 2016-09-02 Sposób przetwarzania powierzchni materiałów drewnopochodnych
HUE16187043A HUE062013T2 (hu) 2016-09-02 2016-09-02 Eljárás faanyagok felületének kezelésére
FIEP16187043.1T FI3290175T3 (fi) 2016-09-02 2016-09-02 Menetelmä puumateriaalista tehtyjen pintojen käsittelemiseksi
US15/692,344 US10532487B2 (en) 2016-09-02 2017-08-31 Method for working surfaces of wood-based materials

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EP16187043.1A EP3290175B1 (fr) 2016-09-02 2016-09-02 Procede de traitement de surfaces en bois

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EP3290175B1 true EP3290175B1 (fr) 2023-02-22

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WO2019101761A1 (fr) * 2017-11-22 2019-05-31 Dsm Ip Assets B.V. Procédé de production et de recyclage d'un objet constitué d'un panneau pourvu durablement d'un revêtement de surface
EP3597312B1 (fr) * 2018-05-04 2023-06-07 SWISS KRONO Tec AG Procédé de fabrication d'un panneau à particules orientées pourvu d'une surface imprimée
CN110117476A (zh) * 2019-05-14 2019-08-13 永隆高新科技(青岛)有限公司 一种强适应性的聚氨酯木材平贴用胶

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EP3290175A1 (fr) 2018-03-07
PT3290175T (pt) 2023-03-31
FI3290175T3 (fi) 2023-05-08
US10532487B2 (en) 2020-01-14
HUE062013T2 (hu) 2023-09-28
PL3290175T3 (pl) 2023-06-12
US20180065273A1 (en) 2018-03-08

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