EP3290175B1 - Method for treating surfaces of wooden materials - Google Patents

Description

The present invention relates to the technical field of wood materials in the form of coarse chipboard wood material panels or OSB wood composite panels and their processing or treatment.

In particular, the present invention relates to a method for leveling at least one flat side surface of coarse chipboard wood-based panels or OS B wood composite panels.

The present invention equally relates to a coarse-chip wood-based material panel or OSB wood-composite panel as such, which has at least one leveled flat side surface.

In addition, the present invention also relates to the use of at least one coarse particle board according to the invention as or for the production of planking, cladding, facade elements, facade panels, structural elements or building panels, in particular in (construction) exterior areas or (construction) interior areas or of Furniture or furniture elements, furniture boards, structural elements or construction boards, in particular in furniture, shop and trade fair construction, or of packaging and transport elements or boards, in particular in the transport, logistics or packaging sector.

Finally, the present invention also relates to building or facade elements as such, which have or consist of at least one coarse-chip wood material board according to the invention.

Wood-based panels are generally panel-shaped materials that are produced by crushing wood and then joining or pressing the wood-based structural elements or wood particles. The size and shape of the wood particles determine the type of wood material and its properties. The wood particles on which the panels are based can be connected to one another using binding agents or via mechanical connections (eg mutual hooking or interlocking of the wood particles during pressing). The product portfolio of many manufacturers of wood-based panels includes panel types in the form of chipboard, wood fiber panels, such as B. MDF boards ( medium -density fiber boards), HDF boards ( high - density fiber boards), DHF boards ( wood fiber boards open to diffusion ) and also so-called Coarse chipboards derived from wood (OSB composite wood panels or oriented strand boards or oriented structural boards ) .

The coarse particle boards or OSB wood composite panels in question, also referred to synonymously as coarse particle boards or OSB panels, are generally panel-shaped wooden materials which are produced using relatively large, elongated chips. Large-chip wood-based panels are used extensively in the construction industry in particular and can be produced in industrial plants, for example, by first cutting long chips out of debarked round wood in the longitudinal direction using rotating knives as part of chip processing, and then drying the natural moisture is reduced at high temperatures. The chips can then be glued, with the pretreated chips first being oriented or scattered longitudinally and transversely, for example in a throwing process, so that a crosswise layer structure is created, for example, which increases the structural stability, to produce the actual OSB board. The coarse particleboard wood-based material boards are then produced, in particular on continuous presses, in general under high pressure and high temperature.

In general, coarse chipboard panels are distinguished from other wood panel systems, such as MDF panels, by increased flexural strength, which is caused in particular by the use of the relatively large and elongated chips. For this reason too, coarse chipboard wood-based panels are often used as building panels in building shells and in interior design as wall or roof cladding in the context of construction applications. In the floor area, they are used, for example, as installation panels, with panels having a tongue and groove profile being used, for example. In addition, the coarse-chip wood-based panels in question are basically also used as formwork panels for concrete or the like.

In contrast to chipboard and HDF or MDF fiberboard, which generally have a relatively smooth or even surface, coarse chipboard wood-based panels have an irregular structure or shape of the surface and especially the flat side surface with sometimes large bumps, cavities or Indentations or the like before what in particular by the relatively large and irregularly shaped wood chips, such as those used for the production of coarse chipboard wood-based panels become, is caused. Due to the unevenness, cavities or indentations present in particular in the area of the flat side surface of the large chipboard wood-based material boards, there is often no optimal dimensional accuracy of the underlying boards, especially since the surface can only be leveled with difficulty, for example by grinding or the like, due to the sometimes large indentations and unevenness. It is also noteworthy here that the bumps, depressions or cavities or the like in question can extend through the entire plate.

A special feature of coarse chipboard wood-based panels or OSB wood composite panels is the underlying chip geometry, which on the one hand is associated with corresponding advantages, for example with regard to high flexural strength, but also with the fundamental disadvantage that the ready-to-use product in the form of the OSB panel has a there is a highly irregular or non-homogeneous shape of the surface, since due to the coarse-chip structure and the spacing of the chips, there are sometimes considerable unevenness, depressions, cavities or the like in the area of the surface of the panel on which it is based.

In particular, this is also associated with disadvantageous optical properties of the surface, so that the coarse chipboard wood-based panels in question are sometimes not suitable for sustainable use in the immediate field of vision, even if the OSB boards on which they are based have a striking appearance due to their special chip structure. In particular, the strong irregularity of the surface structure also leads to an increased susceptibility to dirt and sometimes unsatisfactory properties in terms of weather resistance and moisture resistance.

Due to the irregular structure of the surface described above, coarse chipboard panels are only weatherproof to a limited extent, especially since moisture can easily penetrate into the cavities of the panel. In this context, the irregular surface also has disadvantages with regard to further treatment, such as a homogeneous coating or the like.

For this reason, too, OSB panels have so far not been suitable or accessible to a sufficient extent for further (surface) treatment steps. For this reason too, coarse chipboard panels have so far been used almost exclusively for construction applications that are primarily not in the immediate field of vision.

With regard to coarse-grain wood-based panels, there is a great overall need to expand the area of application or to further improve the underlying product properties, in particular with regard to the surface finish, since this type of panel, with a good price-performance ratio overall, has positive panel properties, in particular with regard to the board stability or the fundamentally striking surface appearance, which makes the use of this board type - also in comparison to chipboard, for example - fundamentally interesting in other areas of application.

Approaches to treating the surface of panel-shaped wood-based material panels as such are generally pursued in the prior art, in which case the aim is sometimes to make the surface more uniform.

In this context, an approach is being pursued, according to which the surface of a wood-based panel is to be standardized using UV-curing paint systems in a multi-layer application. However, this method is particularly associated with the disadvantage that the UV-curing coating layers can be sufficiently cured usually only in the range of up to 0.3 mm per curing process, so that a processing of any existing large depressions or bumps in the Surface, which can have an extent of up to several millimeters, is not possible or this requires a considerable number of work steps, which significantly impairs the economics of the process.

In addition to the comparatively high purchase price for UV-curing coating systems, there is also the risk of residual monomers remaining if curing is not complete. In addition, the energy input, which is required in a multi-stage curing process, is generally high and therefore uneconomical. In addition, the surfaces of wood-based panels treated or painted with UV-curing paint systems only have a very limited adhesion spectrum, which is particularly disadvantageous for further coating or treatment or surface treatment, for example by means of adhesive lamination with condensation resin films, for example in short-cycle presses or the like.

Another approach to leveling the surfaces of wood-based panels is the partial filling of knotholes or cracks in individual layers of panel composites, such as e.g. B. in plywood or engineered parquet, and beyond that in solid wood to see, with this basically plastics are used to fill in the existing knots. In particular, such a procedure sometimes only has a low throughput, which is disadvantageous in particular in the case of a large number of indentations or unevenness, so that the underlying procedure often cannot be operated economically.

In this context, in the area of the treatment of solid wood or solid wood panels in the prior art, such methods are also used in which defects are first generously milled out using a milling device, with corresponding solid wood parts adapted to the milling then being introduced into the previously created depressions , which can be done manually or by machine, for example. Such methods cannot be implemented economically if there are a large number of indentations or bumps in an underlying panel.

Another approach consists in filling indentations or unevenness in the surface of wood-based panels using water-based or solvent-based filler systems. However, the use of such systems does not always lead to satisfactory product properties, especially since water-based filling systems can cause the chips of the wood-based panels to swell during processing due to the high water content, which is disadvantageous with regard to the surface properties and can lead in particular to a significant visual unrest in the surface . In addition, the drying of water-dilutable or water-based fillers is sometimes problematic, especially in deeper areas, since the solvent in the form of water is difficult to remove. In addition, water-based systems usually lead to a volume shrinkage after redrying in the same order of magnitude as the volume of water previously contained. A level or even surface cannot be achieved in one work step, so that expensive post-treatments are required to level the surface.

In addition, solvent-based systems that are manufactured using organic solvents place high demands on workplace safety, particularly with regard to avoiding emissions, and also the Subsequent disposal or further use of organic solvent, for example in the form of thermal use, for example by afterburning or the like, is sometimes not optimal from an economic point of view.

In this context, the EP 1 749 587 A1 or those belonging to the same patent family DE 10 2005 036 579 A1 a building board made of a wood-based material, which consists of at least three layers of scattered and pressed, resin-glued chips, with an upper cover layer and a lower cover layer, with at least the upper cover layer having a coating that fills surface irregularities, made of a water-based paint with additives or fillers consists.

The WO 01/62492 A1 discloses a method for leveling a flat side surface of wood-based particle board and a wood-based particle board according to the preamble of claim 10. It relates to a laminated wood product comprising a substrate formed from wood, a decorative top layer and a hot-melt adhesive which is between the substrate and the top Layer is arranged includes. The hot-melt adhesive is intended to connect the upper layer to the substrate, the main component of the adhesive being a polymer which comprises one or more monomers which, on polymerisation or copolymerisation, result in a greater Shore D hardness than the Shore D hardness of the substrate.

Furthermore, the JP 2002/086617 A a sheet material and a method for its production, wherein the sheet material is to be provided using an oriented strand sheet as a base material with a smooth surface, wherein wood flour and a thermoplastic material and a compatibilizing agent are mixed to provide a gel-like woody resin composition, and wherein the gel-like woody composition is applied to a single surface of the oriented-strand board and cold-pressed by a press plate having a smooth press surface.

In addition, the DE 102 26 422 C1 a method for producing a surface structure on at least one surface of a wood-based panel, in which the structured areas are produced by subsequent application of a material to the wood-based panel, the subsequent application of a mixture of a hardening material with at least one granular substance in the form of fine wood chips or plastic granulate mixed plastic on the finished wood-based panel for the purpose of creating a non-slip surface structure.

The U.S. 2015/197942 A1 relates to a building board, the building board comprising a surface layer with a wood veneer, a wood fiber-based core and an intermediate layer, the intermediate layer being arranged between the surface layer and the wood fiber-based core, and the intermediate layer comprising wood fibers and a binder. The surface layer also has surface sections that have material from the intermediate layer. The surface portions containing material from the intermediate layer extend into the wood veneer.

The DE 196 30 270 A1 relates to a method for upgrading surfaces of wood-based materials, in particular narrow surfaces, with a malleable coating material being applied to the surface, the applied coating material being smoothed or modulated, the coating material having closed pores in contact with at least one heatable metal block while maintaining the smooth surface trains. Document D5 therefore has nothing in common with the targeted successive application of corresponding layers of hot-melt adhesive according to the invention. In addition, the situation in D5 is also such that priority is given to the coating of narrow surfaces and thus not to the coating of flat side surfaces according to the type of invention.

Furthermore, the EP 0 373 726 A2 a cellulosic fiber aggregate formed from a cellulosic fiber material by a process, the method comprising a softening step comprising exposing a portion of the cellulosic fiber material to the action of an aqueous plasticizer at a specified temperature and pressure, whereby hemicellulose and lignin contained in the cellulosic fiber material are present are at least partially disproportionated and hydrolyzed. In addition, the process comprises a hardening step with drying the product of the softening step at a defined temperature in order to obtain a crosslinked cellulosic matrix.

The JP H07 11333 U relates to a functional fiberboard in which a hot melt adhesive is applied to one side of the fiberboard and the fiberboard has a biaxially oriented polypropylene layer printed on its front and/or back.

The U.S. 5,741,391 A relates to a method of manufacturing a wood panel having a thermoplastic layer bonded to a surface of the panel, the method comprising the steps of applying an adhesive to the surface the plate the spread of particles on the glued surface; distributing a granulate of a thermoplastic onto the particles; melting the thermoplastic granules to form a thermoplastic layer in contact with the particles; and cooling the thermoplastic layer.

The JP 2004 276463A relates to a surface treatment using a special varnish, which is applied to the surface of a wood grain formed from a mixture of wood powder and a polylactic acid resin, with the aim of obtaining a product from vegetable materials.

The U.S. 2002/155223 A1 relates to a method for increasing the strength and water resistance of a substrate based on a lignocellulosic material. The method comprises the steps of impregnating a substrate based on a lignocellulosic material with an isocyanate resin material; removing excess isocyanate resin material from the impregnated substrate by impinging the impregnated substrate with air at a high flow rate; polymerizing the resin by applying a liquid to the impregnated substrate, the liquid being at a temperature sufficient for polymerization; and removing the liquid from the polymerized resin of the impregnated substrate.

The U.S. 2007/029041 A1 relates to a wood panel comprising a composite wood component having top and bottom surface layers and a core layer; a first glueline layer ; a second glueline layer; and an overlay layer , wherein the first glue line or glue line layer is arranged between the composite wood component and the second glue line or glue line layer and wherein the second glue line or glue line layer is arranged between the first glue line or glue line layer and the cover layer is arranged.

In particular, there are also approaches in the prior art to generally provide wood-based panels with additional homogeneous top layers, as is the case for chipboard, for example. However, this requires massive interventions in the actual production process of the wood-based panel, since a separate material flow has to be integrated into the present process, starting with the chip preparation, drying and storage of the cover layer chips, right through to gluing and spreading of the cover layer chips.

Another approach that is basically comparable in terms of the result is the application or doubling of additional cover layers, which can be present, for example, in the form of veneers, thin-layer panels or thin fiber panels. However, such methods are equally expensive and do not always lead to the desired product qualities.

As a result, the approaches known in the prior art for treating or leveling the surfaces of wood-based panels do not always lead to the desired product properties, with the approaches available in the prior art also often not always being optimal from a cost perspective. In addition, the approaches or methods available in the prior art often cannot be used for special wood-based panels in the form of coarse chipboard wood-based panels or OSB wood-based composite panels, since OSB wood-based composite panels have very special material properties, especially with regard to the presence of sometimes large ones or large-volume bumps, indentations, cavities, holes or blowholes in the panel surface.

Against this technical background, it is therefore an object of the present invention to provide a method and a corresponding production plant for the treatment, in particular leveling, of a surface, in particular a flat side surface, of coarse chipboard wood-based panels or OSB wood-based composite panels, the disadvantages and Shortcomings of the prior art are to be at least largely avoided or at least mitigated. The aim of the present invention is to provide corresponding coarse chipboard panels in a technically efficient manner, which have an optimally leveled or filled surface. In particular, with the present invention corresponding indentations or unevenness as well as cavities, holes or blowholes or the like in the area of the surface or flat side surface of coarse chipboard panels should be compensated or filled in a sustainable or effective manner.

In particular, one object of the present invention is to provide a method and a production plant suitable for carrying out this method, with which a surface treatment of coarse chipboard wood-based panels in particular is to be made possible, so that the product properties of the coarse chipboard wood-based panels treated in this way in particular also with regard to providing a Weather, UV and temperature resistance can be further improved, accompanied by an increase in the range of uses of the coarse particleboard wood-based panels treated in this way.

In this context, another object of the present invention is to also provide coarse chipboards as such, which have a resistant and durable as well as uniform filling or coating of the unevenness, depressions, cavities, holes or blowholes arranged in the surface area, the coarse-chip wood-based panels provided according to the invention should also have further improved product properties, in particular improved (surface) properties, compared to such wood-based panels of the prior art.

The object on which the present invention is based is achieved - according to a first aspect of the present invention - by a method for treating, in particular leveling, at least one surface, preferably at least one flat side surface, of coarse chipboard wood-based panels (OSB wood composite panels), according to claim 1. Further advantageous refinements of the method according to the invention are the subject matter of the relevant method dependent claims.

Another subject of the present invention - according to a second aspect of the invention - is the coarse particle board or OSB wood composite panel according to the invention as such, which can be obtained according to the method according to the invention or which has a treated, in particular leveled surface, preferably flat side surface, according to the independent claims in this regard. Further advantageous configurations of the coarse particle board according to the invention are the subject matter of the relevant dependent claims.

Likewise, another subject of the present invention is - according to a third aspect of the invention - the inventive use of at least one coarse particle board as or for the production of planking, cladding, facade elements, facade panels, construction elements or building panels, in particular in the (construction) outdoor area or in ( Building) interiors and also as or for the production of furniture or furniture elements or the like in furniture, shop or trade fair construction and also as or for the production of packaging or transport elements in particular in Transport or packaging area as defined in the independent claim relating to this use.

Finally, another subject of the present invention - according to a fourth aspect of the invention - is the building or façade element according to the invention as such, which has or consists of at least one coarse chipboard material board according to the invention, as defined in the relevant independent claim.

It goes without saying that in the following description of the present invention, such configurations, embodiments, advantages, examples or the like, which are described below - for the purpose of avoiding unnecessary repetitions - only for a single aspect of the invention, of course also in relation to the others Aspects of the invention apply accordingly, without the need for an express mention of this.

Furthermore, it goes without saying that in the following statements of values, numbers and ranges, the relevant statements of values, numbers and ranges are not to be understood as limiting; It goes without saying for the person skilled in the art that it is possible to deviate from the specified ranges or specifications in individual cases or in relation to the application, without departing from the scope of the present invention.

In addition, all values or parameter information or the like mentioned below can be determined or determined using standardized or explicitly stated determination methods or otherwise using determination or measurement methods familiar to the person skilled in the art in this field. Unless otherwise stated, the underlying values or parameters are determined under standard conditions (i.e. in particular at a temperature of 20 °C and/or at a pressure of 1,013.25 hPa or 1.01325 bar).

Furthermore, it should be noted that with all relative or percentage, in particular weight-related, quantity data listed below, this data must be selected or combined within the scope of the present invention by the person skilled in the art in such a way that in total - possibly including other components or Ingredients, in particular as defined below - always result in 100% or 100% by weight. This goes without saying for the expert.

Furthermore, with regard to the polymers listed for the hot-melt adhesive in the context of the present invention, it is such that these can be in the form of homopolymers or copolymers, i.e. the term polymers used according to the invention includes both homopolymers and copolymers (i.e. polymers made of two or more different monomers). In the case of copolymers, the polymers can be present, for example, as random copolymers, alternating copolymers, gradient copolymers, block copolymers or graft copolymers. For example, in the context of the present invention, the term "polyolefin" denotes olefin homopolymers (e.g. polypropylene homopolymers or polyethylene homopolymers) or also olefin copolymers (e.g. ethylene/propylene copolymers), the term "polyethylene" denotes both polyethylene homopolymers and Polyethylene copolymers, etc. In principle, the term polymers also includes the use of functionalized polymers, in particular to increase the functionality of the underlying hot-melt adhesive.

Having said that, the present invention will be described and explained in more detail below, also with reference to drawings or representations of figures showing preferred embodiments or exemplary embodiments.

1. a) Bereitstellung mindestens einer Grobspan-Holzwerkstoffplatte, wobei die Grobspan-Holzwerkstoffplatte mindestens eine Flachseitenoberfläche mit einer Vielzahl von Unebenheiten, Vertiefungen, Hohlräumen, Löchern und/oder Lunkerstellen aufweist; dann
2. b) Aufbringen mindestens eines Schmelzklebstoffs in Form einer Schmelzklebstoff-Schmelze, auf die Flachseitenoberfläche der Grobspan-Holzwerkstoffplatte, wobei
   • b1) zunächst die Schmelzklebstoff-Schmelze aufgebracht wird derart, dass die Unebenheiten, Vertiefungen, Hohlräume, Löcher und/oder Lunkerstellen mit dem Schmelzklebstoff, insbesondere unter Ausbildung mindestens einer Schmelzklebstoff-Füllung, vorzugsweise Schmelzklebstoff-Egalisierungsfüllung, gefüllt und/oder verfüllt werden, wobei eine Vergleichmäßigung und/oder Egalisierung der Flachseitenoberfläche bewirkt wird, und
   • b2) anschließend die Schmelzklebstoff-Schmelze aufgebracht wird derart, dass die Flachseitenoberfläche und/oder die Schmelzklebstoff-Füllung zudem zumindest teil- und/oder abschnittsweise, vorzugsweise vollflächig, mit der Schmelzklebstoff-Schmelze beschichtet und/oder verfilmt wird, wobei mindestens eine auf der Flachseitenoberfläche und/oder auf der Schmelzklebstoff-Füllung angeordnete Schmelzklebstoff-Schicht, insbesondere Schmelzklebstoff-Abdeckschicht, resultiert;
   • wobei zunächst Schritt b1), gefolgt von einem Abkühlen und Verfestigen des Schmelzklebstoffs, und anschließend Schritt b2) durchgeführt wird;
3. c) Abkühlen und Verfestigen, insbesondere Aushärten und/oder Erstarrenlassen, der Schmelzklebstoff-Schmelze nach Durchführung von Schritt b2).

The subject of the present invention - according to a first aspect of the present invention - is thus a method for leveling at least one flat side surface of coarse chipboard wood-based panels (OSB wood composite panels),
the method comprising the following steps in the order given:

1. a) Provision of at least one coarse-chip wood-based material board, wherein the coarse-chip wood-based material board has at least one flat side surface with a multiplicity of bumps, indentations, cavities, holes and/or blowholes; then
2. b) applying at least one hot-melt adhesive in the form of a hot-melt adhesive melt to the flat side surface of the coarse particleboard wood-based material panel, wherein
   • b1) first the hot-melt adhesive melt is applied in such a way that the unevenness, indentations, cavities, holes and/or blowholes are filled and/or filled with the hot-melt adhesive, in particular with the formation of at least one hot-melt adhesive filling, preferably hot-melt adhesive leveling filling, wherein a smoothing and/or leveling of the flat side surface is brought about, and
   • b2) the hot-melt adhesive melt is then applied in such a way that the flat side surface and/or the hot-melt adhesive filling is also coated and/or filmed at least partially and/or in sections, preferably over the entire surface, with the hot-melt adhesive melt, with at least one on the Flat side surface and/or hot-melt adhesive layer arranged on the hot-melt adhesive filling, in particular hot-melt adhesive cover layer;
   • step b1) being carried out first, followed by cooling and solidification of the hot-melt adhesive, and then step b2);
3. c) cooling and solidifying, in particular curing and/or allowing to solidify, the hot-melt adhesive melt after step b2) has been carried out.

The present invention is therefore aimed at providing a special method, according to which a treatment in the form of evening out or leveling of the flat side surface(s) of coarse chipboard wood-based panels using a special filling or coating compound in the form of a hot-melt adhesive or a hot-melt and/or sealing mass is carried out, the hot-melt adhesive or the hot-melt and/or sealing mass being applied to the surface to be treated in the form of a hot-melt adhesive melt or in the form of a melt for filling the unevenness in question or the like becomes.

In the context of the present invention, in this way an effective (ie permanently mechanically stable and the OSB panel is protected from the effects of weather, UV and moisture) filling of the underlying bumps, depressions, cavities, holes or blowholes can be carried out, with the purposeful Using a hot melt adhesive with both process- and product-specific advantages. Because within the scope of the present invention, a technically and economically optimized procedure can be used to implement a permanent filling of the surface of a coarse chipboard material panel with excellent adhesion properties to the substrate in the form of the OSB panel, with the modified on the basis of the process according to the invention or with the hot-melt adhesive coated surface and thus the coarse particleboard wood-based material panels obtained according to the invention as such, in addition to improved optical properties, also has sustainably improved product properties with regard to increased weathering, UV and moisture resistance. In addition, the OSB panel obtained according to the invention also has increased chemical resistance. The use of the hot-melt adhesive creates a lasting surface seal of the OSB board, so that moisture, chemicals, dirt or the like cannot penetrate the underlying OSB board and the organic wood components are therefore protected from external influences, accompanied by an improved Storage and weather resistance.

The use of a hot-melt adhesive can, for example, ensure an increase in the moisture resistance to the sometimes severe influence of moisture, such as can occur outdoors in the event of heavy rain or the like, so that the coarse chipboard wood-based panels according to the invention are also suitable for this reason, in particular with regard to (construction) Outdoor applications have an extended range of uses.

Due to the surface structure of the coarse chipboard wood-based panel, which is standardized using a hot-melt adhesive, the panel systems provided according to the invention are also suitable for use in (construction) interiors, for example with regard to visible wall and floor systems with improved moisture, wear and dirt resistance.

Due to the evening out or leveling of the surface carried out according to the invention, the coarse chipboard wood-based panels according to the invention are also accessible to further surface treatment, in particular with regard to full-surface lamination, painting, lamination or the like, so that this also results in optically attractive and overall smooth or even surface structures can be provided, in addition, the underlying composite due to the uniform surface below Use of a hot melt adhesive is mechanically stabilized. The coarse chipboard wood-based panels coated in this way can thus be coated over the entire surface with a good visual effect, in particular varnished, covered or laminated, so that a particularly durable full-surface bond results, which can also be cut to size at any point after the coarse chipboard wood-based panel has been separated or cut to size Plate is guaranteed, which is of great relevance, for example, with regard to the provision of fixed dimensions in furniture and interior design.

In this context, the coarse particleboard wood-based material panels or coarse particleboard wood-based composite panels according to the invention can be further modified with regard to their surface to the effect that coated surfaces can be provided on the basis of additional films or foils, such as condensation resin films, for example melamine resin films or phenolic resin films, which the range of use or application of the coarse chipboard wood-based panels according to the invention in the furniture or construction sector is further increased, since products with completely new and specifically adjustable product properties can be provided within the scope of the present invention, as mentioned above.

In addition, the concept according to the invention with the use of special hot-melt adhesives for leveling or homogenizing the surface of a coarse chipboard wood-based panel enables a further functionalization of the surface in this regard, for example with regard to an antimicrobial finish and the provision of electrical conductivity or dissipation, targeted optical (surfaces -)Properties or the like.

In addition, based on the hot-melt adhesive applied to the flat side, a specific structuring or profiling of the surface can be undertaken, so that the coarse particleboard wood-based material panels according to the invention can be equipped with anti-slip or anti-slip properties, for example.

Through the targeted use of a hot-melt adhesive and its targeted selection and coordination, it is thus ensured within the scope of the method according to the invention that there is an optimized filling of the unevenness in the area of the flat side surface, with an optimized liability or adhesion of the filling material used in the form of the Hot-melt adhesive to the underlying substrate in the form of the coarse particle board present. The use of a hot-melt adhesive also enables a further optimized coating with the receipt of a particularly uniform or even surface of the coarse particle board. Due to the specifically controllable elastomeric or thermoplastic properties, further structuring or profiling of the surface or further coating with appropriate surface materials such as decorative foils or the like is possible, which can be applied to the coarse particle board according to the invention.

In addition, the use of a hot-melt adhesive leads to an optimization of the process, in particular with regard to the underlying apparatus, since the hot-melt adhesive can be applied in a simple manner, in particular with heating, with the hot-melt adhesive used also being at least essentially free of sometimes harmful solvents or The like is, so that corresponding extraction devices or the like for removing any solvent can be omitted. In particular, when using a hot-melt adhesive, there are no residual chemicals or waste that are sometimes difficult to dispose of. Due to the high flowability and at least substantially shrinkage-free hardening, even deeper or larger unevenness can be completely and permanently filled.

Consequently, the invention also results in a lasting reduction in the proportion of volatile organic compounds (VOCs [ Volatile Organic Compounds ]) on which the coarse particle board is based, which limit the use of conventional coarse particle board, particularly indoors.

In addition, the method according to the invention can also be used to set or reduce the water vapor permeability of the OSB board in a targeted manner, so that the coarse particleboard wood-based material boards according to the invention can also have the function of a vapor barrier, which enables them to be used in damp or sanitary areas, for example. In particular, within the scope of the present invention, the SD value (water vapor diffusion equivalent air layer thickness) of the coarse chipboard wood-based material board according to the invention is improved or correspondingly increased, so that the coarse chipboard wood-based material boards according to the invention likewise have improved moisture protection, since the boards in question are diffusion-inhibiting or diffusion-tight can become. The water vapor diffusion equivalents The thickness of the air layer represents a building physics measure of the water vapor diffusion resistance of a component or a component layer and thus defines its property as a vapor barrier.

Within the scope of the present invention, through the targeted use of hot-melt adhesives, unevenness or the like on the OSB panel can be leveled out, with the resulting coating possibly also having a certain elasticity.

The purposeful use of a hot-melt adhesive, in particular in combination with the other measures according to the invention, provides an overall efficient method for upgrading or treating the flat side surface(s) of coarse chipboard wood-based panels, which with high process economy and thus excellent cost efficiency leads to sustainably improved products in form correspondingly treated coarse-grain wood-based panels with tailor-made properties as mentioned above.

The method according to the invention is described further below, in particular with regard to special embodiments and configurations:
According to the invention, the procedure can generally be such that the unevenness, indentations, cavities, holes and/or blowholes are at least essentially completely filled and/or filled with the hot-melt adhesive melt.

In addition, the hot-melt adhesive melt should be applied to the surface, in particular the flat side surface, at least partially and/or in sections, preferably over the entire surface. Likewise, the hot-melt adhesive melt should be applied to the flat-side surface at least essentially continuously and/or without interruption. As a result, there is in particular an at least partial and/or sectional, preferably full-surface, filling of the unevenness, indentations, cavities, holes and/or blowholes, based on the flat side surface.

According to the invention, it is therefore preferred if the unevenness, indentations, cavities, holes and/or blowholes are at least essentially completely filled with the hot-melt adhesive. This ensures efficient homogenization or leveling of the surface. For this purpose, the application of the hot-melt adhesive melt can be repeated or the amount be adjusted or adjusted accordingly to the applied hot melt adhesive.

In general, therefore, the hot-melt adhesive melt should be present in an amount in the range from 10 g/m ² to 2000 g/m ² , in particular in the range from 25 g/m ² to 1500 g/m ² , preferably in the range from 50 g/m 2 ² to 1000 g/m ² , preferably in the range from 75 g/m ² to 800 g/m ² , particularly preferably in the range from 100 g/m ² to 600 g/m ² , based on the flat side surface. If the hot-melt adhesive as such does not have any further additives or additives or the like, in particular as defined below, appropriate application quantities in the range from 80 g/m ² to 120 g/m ² have proven successful. In contrast, application quantities in the range from 150 g/m ² to 200 g/m ² are preferred for hot-melt adhesives which have further additives, additives or the like, in particular as defined below.

In the context of the present invention, it is therefore provided that the hot-melt adhesive melt is applied in such a way that the unevenness, depressions, cavities, holes and/or blowholes are filled with the hot-melt adhesive, in particular with the formation of at least one hot-melt adhesive filling, in particular hot-melt adhesive leveling filling. be filled and/or backfilled.

In this connection, as mentioned above, the unevenness, indentations, cavities, holes and/or blowholes can be at least essentially completely filled and/or filled with the hot-melt adhesive. Equally, it can be provided within the scope of the present invention that the unevenness, indentations, cavities, holes and/or blowholes account for at least 30%, in particular at least 50%, preferably at least 70%, preferably at least 80%, particularly preferably at least 90% , particularly preferably at least 95%, very particularly preferably at least 98%, based on the volume of the unevenness, depressions, cavities, holes and/or blowholes, are filled and/or filled with the hot-melt adhesive.

The bumps, indentations, cavities, holes or blowholes in question are formed from the interstices generally resulting from the spacing of the irregularly shaped coarse chips of the coarse particleboard wood-based material board, without wishing to be limited to this theory. As a result of the filling provided according to the invention, in particular those in the area of the surface of the coarse-grain wood-based material board become, so to speak Existing free spaces or gaps are filled or closed with the hot-melt adhesive melt, so that on this basis, in particular, an evening out or leveling of the surface results in the form of a seal. According to the invention, the surface of the underlying coarse particle board is thus sealed to a certain extent with the hot-melt adhesive, which, in addition to the homogenization or leveling in question, leads to the formation of correspondingly improved properties, in particular with regard to increased weather, UV and / or moisture resistance of the treated coarse chipboard leads.

According to the invention, it can be provided in particular that the hot-melt adhesive filling is interspersed and/or optionally interrupted at least partially and/or in sections with coarse chips that form or limit the unevenness, depressions, cavities, holes and/or blowholes. In particular, the coarse chippings forming or delimiting the unevenness, indentations, cavities, holes and/or blowholes can protrude at least partially and/or in sections into the hot-melt adhesive filling.

The hot-melt adhesive filling can have a thickness in the range from 0.2 mm to 50 mm, in particular in the range from 0.5 mm to 25 mm, preferably in the range from 1 mm to 10 mm, preferably in the range from 1 mm to 5 mm , exhibit. The aforementioned thickness specifications generally relate to the hot-melt adhesive filling layer, so to speak, interspersed with the coarse chippings.

According to the invention, with regard to the hot-melt adhesive filling layer, which can be obtained, for example, as part of a first application, it can in principle be the case that it may still have openings with the coarse chip in question or that it as such is not yet completely uniform or leveled surface forms. In this case, the application of the hot melt adhesive can be repeated or the amount of hot melt adhesive to be applied can be increased. According to the invention, as already mentioned, at least one layer of hot-melt adhesive, in particular a covering layer of hot-melt adhesive, is applied as part of a second application of hot-melt adhesive. According to the invention, however, it can also be provided that the hot-melt adhesive filling, in particular in the area of its surface, forms a closed hot-melt adhesive layer, so to speak, and thus a homogenized or leveled layer. This can be ensured, for example, by selecting correspondingly large application quantities of hot-melt adhesive.

In this context, it can be provided according to the invention in particular that the hot-melt adhesive melt to form the hot-melt adhesive filling is used in an amount in the range from 5 g/m ² to 1,000 g/m ² , in particular in the range from 10 g/m ² to 800 g/m ² , preferably in the range from 20 g/m ² to 600 g/m ² , preferably in the range from 40 g/m ² to 600 g/m ² , particularly preferably in the range from 60 g/m ² to 400 g / m ² , based on the surface, in particular flat side surface is applied.

Within the scope of the present invention, the procedure can also be such that the hot-melt adhesive melt is also applied in such a way that the flat side surface and/or the hot-melt adhesive filling is at least partially and/or in sections, preferably over the entire surface, coated with the hot-melt adhesive melt and /or filming is carried out in particular in such a way that at least one hot-melt adhesive layer, in particular hot-melt adhesive covering layer, arranged on the flat side surface and/or on the hot-melt adhesive filling results.

The application of the hot-melt adhesive melt to form the hot-melt adhesive layer in question can be carried out according to the invention, in particular in addition to the previously described application of the hot-melt adhesive, in particular to produce a hot-melt filling. The particularly additionally applied hot-melt adhesive layer is, in particular, a final layer, with the hot-melt adhesive layer preferably completely covering or sealing the surface, in particular the flat side surface, of the coarse chipboard material board. The hot-melt adhesive layer is therefore in particular a (finish) layer to ensure a smooth or even and at least essentially completely sealed surface, in particular the flat side surface, of the coarse particle board.

According to the invention, the layer of hot-melt adhesive is applied subsequently or in a separate method step, in particular the layer of hot-melt adhesive then being applied in the form of an after-coating or after-filming, so to speak.

The layer of hot-melt adhesive can be formed at least substantially closed and/or at least substantially free of perforations. Equally, it can be provided according to the invention that the hot-melt adhesive layer at least essentially does not form or has limiting coarse chippings. The layer of hot-melt adhesive can thus in particular be a (covering) layer which has at least essentially only the hot-melt adhesive as such and/or is homogeneous. In addition to optimized optical surface properties, this also ensures a further improved sealing of the coarse chipboard material board, in particular accompanied by a further improved resistance to weathering, UV rays and/or moisture.

In general, the hot-melt adhesive layer can have a thickness in the range from 0.1 mm to 30 mm, in particular in the range from 0.2 mm to 20 mm, preferably in the range from 0.5 mm to 10 mm, preferably in the range from 0 75 mm to 5 mm, particularly preferably in the range from 1 mm to 3 mm. In this case, the above thickness specifications relate in particular to the hot-melt adhesive layer which is applied to the filled OSB board or to the OSB board which has the hot-melt adhesive filling.

In this context, the hot-melt adhesive, in particular the hot-melt adhesive melt, can be used to form the hot-melt adhesive layer in an amount in the range from 5 g/m ² to 1,000 g/m ² , in particular in the range from 10 g/m ² to 800 g/m m ² , preferably in the range from 20 g/m ² to 600 g/m ² , preferably in the range from 40 g/m ² to 600 g/m ² , particularly preferably in the range from 60 g/m ² to 400 g/m 2 ² , very particularly preferably in the range from 60 g/m ² to 300 g/m ² , based on the surface, in particular the flat side surface.

1. a) Bereitstellung mindestens einer Grobspan-Holzwerkstoffplatte, wobei die Grobspan-Holzwerkstoffplatte mindestens eine Flachseitenoberfläche mit einer Vielzahl von Unebenheiten, Vertiefungen, Hohlräumen, Löchern und/oder Lunkerstellen aufweist; dann
2. b) Aufbringen mindestens eines Schmelzklebstoffs in Form einer Schmelzklebstoff-Schmelze auf die Flachseitenoberfläche der Grobspan-Holzwerkstoffplatte, wobei
   • b1) zunächst die Schmelzklebstoff-Schmelze aufgebracht wird derart, dass die Unebenheiten, Vertiefungen, Hohlräume, Löcher und/oder Lunkerstellen mit dem Schmelzklebstoff, insbesondere unter Ausbildung mindestens einer Schmelzklebstoff-Füllung, vorzugsweise Schmelzklebstoff-Egalisierungsfüllung, gefüllt und/oder verfüllt werden, wobei eine Vergleichmäßigung und/oder Egalisierung der Flachseitenoberfläche bewirkt wird und
   • b2) anschließend die Schmelzklebstoff-Schmelze aufgebracht wird derart, dass die Flachseitenoberfläche und/oder die Schmelzklebstoff-Füllung zudem zumindest teil- und/oder abschnittsweise, vorzugsweise vollflächig, mit der Schmelzklebstoff-Schmelze beschichtet und/oder verfilmt wird, wobei mindestens eine auf der Flachseitenoberfläche und/oder auf der Schmelzklebstoff-Füllung angeordnete Schmelzklebstoff-Schicht, insbesondere Schmelzklebstoff-Abdeckschicht, resultiert;
   wobei zunächst Schritt b1), gefolgt von einem Abkühlen und Verfestigen des Schmelzklebstoffs, und anschließend Schritt b2) durchgeführt wird;
3. c) Abkühlen und Verfestigen, insbesondere Aushärten und/oder Erstarrenlassen, der Schmelzklebstoff-Schmelze nach Durchführung von Schritt b2).

The present invention thus relates, as stated above, to a method for leveling at least one flat side surface of coarse particleboard wood-based panels (OSB wood composite panels), in particular a method as defined above, the method comprising the following steps in the order given:

1. a) Provision of at least one coarse-chip wood-based material board, wherein the coarse-chip wood-based material board has at least one flat side surface with a multiplicity of bumps, indentations, cavities, holes and/or blowholes; then
2. b) applying at least one hot-melt adhesive in the form of a hot-melt adhesive melt to the flat-side surface of the coarse particle board, wherein
   • b1) first the hot-melt adhesive melt is applied in such a way that the unevenness, indentations, cavities, holes and/or blowholes are filled and/or filled with the hot-melt adhesive, in particular with the formation of at least one hot-melt adhesive filling, preferably hot-melt adhesive leveling filling, wherein a smoothing and/or leveling of the flat side surface is brought about and
   • b2) the hot-melt adhesive melt is then applied in such a way that the flat side surface and/or the hot-melt adhesive filling is also coated and/or filmed at least partially and/or in sections, preferably over the entire surface, with the hot-melt adhesive melt, with at least one on the Flat side surface and/or hot-melt adhesive layer arranged on the hot-melt adhesive filling, in particular hot-melt adhesive cover layer;
   step b1) being carried out first, followed by cooling and solidification of the hot-melt adhesive, and then step b2);
3. c) cooling and solidifying, in particular curing and/or allowing to solidify, the hot-melt adhesive melt after step b2) has been carried out.

With regard to the sequence of the respective method steps, the procedure is in particular such that the filling or filling of the unevenness, depressions, cavities, holes and/or blowholes with the hot-melt adhesive, in particular the formation of the hot-melt adhesive filling, or step b1) on the one hand and the coating or filming of the flat side surface, in particular the formation of the hot-melt adhesive layer, or step b2) on the other hand are carried out in separate process steps or in succession. The procedure here is in particular such that first the unevenness, depressions, cavities, holes and/or blowholes are filled with the hot-melt adhesive, in particular the formation of the hot-melt adhesive filling, or step b1), followed by cooling and solidification of the hot-melt adhesive, and then the coating or filming of the surface, preferably the flat side surface, in particular the formation of the hot-melt adhesive layer, or step b2), followed by cooling and solidification of the hot-melt adhesive, is carried out.

In this context, on the one hand, and for the coating or filming of the Flat side surface or the hot-melt adhesive filling, in particular for the formation of the hot-melt adhesive layer, or in step b2) on the other hand, the same hot-melt adhesive and/or identical hot-melt adhesives, in particular as defined below, are used.

With regard to the use of identical hot-melt adhesives, there is in particular a further simplification of the procedure. By using different hot-melt adhesives, on the other hand, the respective properties of the hot-melt adhesive filling on the one hand and of the hot-melt adhesive layer on the other hand can be specifically adjusted or tailored.

In principle, a large number of hot-melt adhesives can be used within the scope of the present invention, as listed below.

The hot-melt adhesives used according to the invention, which are also synonymously referred to as hot-melt adhesives, hot-melt adhesives or hot-melts , are generally at least essentially solvent-free products which are solid at room temperature and assume a free-flowing or liquid state when heated or when hot , so that on this basis an order or an application can be made on the underlying surface, in particular the flat side surface, of the coarse particle board, for the purpose of filling the unevenness or the like. During the subsequent cooling with an accompanying solidification or hardening of the hot-melt adhesive, a permanent filling or coating of the coarse chipboard wood-based panel is then formed on the surface of the OSB panel treated in this way.

The hot-melt adhesives used according to the invention are generally associated with the advantage of rapid processing combined with a low material price, it also being possible to use a wide variety of materials, as mentioned above. In this context, it is also advantageous that the hot-melt adhesives used and the fillings or coatings produced therewith are accessible for subsequent processing or modification, for example in the context of further coatings, lamination, painting or the like. In addition, the used Hot-melt adhesives have a high stability and resistance to weathering, UV radiation and moisture, which correspondingly leads to the coarse particleboard wood-based material panels provided according to the invention having improved properties.

According to the invention, it has generally proven to be advantageous if the hot-melt adhesive is a thermoplastic or one-component hot-melt adhesive, in particular a one-component hot-melt adhesive (1K hot-melt adhesive).

In general, the hot-melt adhesive should be at least essentially free of water and/or solvents. In this context, the hot-melt adhesive should have a water and/or solvent content of at most 10% by weight, in particular at most 5% by weight, preferably at most 2% by weight, preferably at most 1% by weight, particularly preferably at most 0, 5% by weight, very particularly preferably at most 0.1% by weight, based on the hot-melt adhesive. This improves the processing properties of the hot-melt adhesive used according to the invention. In particular, this ensures that the hot-melt adhesive does not essentially penetrate into the fiber structure of the wood chips on which the wood-based material board is based, so that undesired swelling of the material is avoided.

According to the invention, particularly good filling or coating results are obtained if the hot-melt adhesive is a reactive hot-melt adhesive, in particular a thermoplastic or one-component reactive hot-melt adhesive, preferably a one-component reactive hot-melt adhesive.

Reactive hot-melt adhesives, as they are used according to the invention in a particularly preferred manner, are characterized in particular by the fact that they have chemically reactive functional groups, which in particular during and after application or application, for example, under the influence of heat, radiation or moisture to a (After) crosslinking lead, whereby the adhesion or adhesive bond to the substrate in the form of the coarse particle board is further improved.

In this context, it can be provided according to the invention in particular that the reactive hot-melt adhesive is a moisture-crosslinking, heat-crosslinking or radiation-crosslinking hot-melt adhesive, in particular a moisture-crosslinking or radiation-crosslinking, preferably a moisture-crosslinking hot-melt adhesive.

In the processing of reactive hot-melt adhesives - without wanting to be limited to this theory - after application to the coarse chipboard to be processed, there is generally a physical setting as well as a further chemical reaction with the formation of high-molecular polymers with high cohesion or with the formation of additional crosslinking - and adhesive bonds, in particular as a result of chemical reactions, also with the surface of the coarse-grain wood-based panels to be treated. In this way, very good coating or filling properties, high temperature resistance combined with good low-temperature flexibility and high resistance to chemicals or environmental influences can be achieved with reactive hot-melt adhesives.

Reactive hot-melt adhesives therefore also have advantages when used in that, due to the chemical post-crosslinking and formation of chemical adhesive or contact connections, a correspondingly hardened reactive hot-melt adhesive can at least essentially no longer be melted by the action of heat, so that in this respect too a high level of resistance or .Permanence exists. In addition, reactive hot-melt adhesives have equally fast processing properties without lengthy drying phases, in particular due to the physical curing that precedes the post-crosslinking, which is associated with process engineering advantages.

In general, the reactive hot melt adhesive has chemically reactive groups. The chemically reactive groups can be selected from isocyanate groups, silane groups, epoxide groups and reactive double or multiple bonds (especially CC double or multiple bonds, such as urethane groups with reactive double or multiple bonds, especially CC double or multiple bonds) and combinations thereof , preferably isocyanate groups and silane groups. In particular, the chemically reactive groups are arranged terminally or terminally in the molecular framework of the reactive hot-melt adhesive. The chemically reactive groups in question lead to a defined (post-)crosslinking within the scope of the use of the hot-melt adhesive, likewise to want to limit ourselves to this theory, and also with the formation of adhesive or contact bonds with the surface to be treated the coarse particle board.

According to the invention, it is particularly advantageous if the reactive hot-melt adhesive is selected from the group consisting of (i) reactive, in particular moisture-crosslinking, polyurethanes (PUR), preferably isocyanate-functionalized and/or isocyanate-containing polyurethanes, preferably isocyanate-terminated polyurethanes; (ii) reactive, in particular moisture-crosslinking, polyolefins (POR), preferably silane-functionalized and/or silane-containing polyolefins, preferably silane-grafted polyolefins; (iii) reactive, in particular radiation-crosslinking, preferably UV-crosslinking, poly(meth)acrylates, preferably poly(meth)acrylates functionalized with urethane groups and/or containing urethane groups; and mixtures and combinations thereof, particularly preferably from the group of (i) reactive, in particular moisture-crosslinking, polyurethanes (PUR), preferably isocyanate-functionalized and/or isocyanate-group-containing polyurethanes, preferably isocyanate-terminated polyurethanes; (ii) reactive, in particular moisture-crosslinking, polyolefins (POR), preferably silane-functionalized and/or silane-containing polyolefins, preferably silane-grafted polyolefins; and mixtures and combinations thereof.

The reactive hot-melt adhesives preferably used according to the invention, in particular one-component reactive hot-melt adhesives, such as in particular reactive, preferably moisture-crosslinking polyurethanes (PUR), are characterized overall by high UV stability combined with high mechanical stability and strength. In addition, there is no excessively exothermic reaction during cooling or solidification, so that the underlying coarse particle board or the filling as such is not influenced by an additional and sometimes difficult to control heat effect during application and solidification of the applied hot-melt adhesive, which also contributes to the formation of a good adhesive connection is conducive and which also counteracts an undesirable distortion of the coarse chipboard wood-based panel by avoiding excessive heat development on one side.

In addition, the hot-melt adhesives in question can in principle also be used in a continuous process or in an inline process, with the coarse chipboard wood-based material panels treated in this way being immediately accessible for further processing, for example further coating with decorative foils or the like.

In addition, the hot-melt adhesives in question are not sticky after cooling and solidifying or after complete crosslinking due to the non-blocking, so that there is also no sometimes disadvantageous surface tackiness, although due to the material properties on which the reactive hot-melt adhesives are based, high slip resistance or good anti-slip properties of the underlying surfaces are guaranteed.

In addition, the reactive hot-melt adhesives in question can be covered with coating materials such as (decorative) foils or the like in the thermoplastic phase, ie up to the final crosslinking of the adhesive, due to the residual tack. In addition, the incorporation of particulate structures, such as glitter for decorative purposes, in the thermoplastic phase is also possible.

Due to the post-crosslinking on which it is based, there is also an additional bonding of the reactive hot-melt adhesives to the interface or surface of the coarse chipboard wood-based panel, which increases the strength at the same time. In this regard, moisture-crosslinking reactive hot-melt adhesives are particularly advantageous, since the moisture required for crosslinking can be provided, for example, from the coarse chippings contained in the residual moisture. In addition, the above-mentioned reactive PUR hot-melt adhesives in particular also have high chemical resistance in addition to high temperature resistance.

In general, the hotmelt adhesives or hotmelt masses used according to the invention are characterized, among other things, by the fact that they have high flowability in the molten state and/or are at least essentially block-free shortly after application or application to the surface, in particular the flat side surface. These properties have proven to be advantageous in particular with regard to the post-processing or further processing or the storage of the coarse-chip wood-based material boards provided according to the invention. In particular, the coarse chipboard wood-based material panels provided according to the invention can be further processed or stored promptly after application of the hot-melt adhesive, and specifically without unwanted sticking or the like occurring.

According to an alternative but less preferred embodiment of the present invention, it can also be provided that the hot-melt adhesive is a non-reactive hot-melt adhesive, in particular a thermoplastic and/or one-component non-reactive hot-melt adhesive, preferably a one-component non-reactive hot-melt adhesive.

Non-reactive hot-melt adhesives, as can be used within the scope of the present invention, generally have a short application or setting time. In the case of non-reactive hot-melt adhesives, the actual bonding takes place to a significant degree physically, namely due to the hardening of the hot-melt adhesive melt applied when the hot-melt adhesive applied cools down. In contrast to reactive hot-melt adhesives, non-reactive hot-melt adhesives can basically be melted again after they have solidified. In this context, the use of non-reactive hot-melt adhesives can be considered within the scope of the concept according to the invention, for example against the background of a subsequent coating or lamination of the coarse particle board made of wood material provided according to the invention.

In general, within the scope of the present invention, the non-reactive hot-melt adhesive can be selected from the group consisting of (i) ethylene vinyl acetates (EVA polymers); (ii) polyolefins (PO), in particular polyethylenes (PE), polypropylenes (PP) and atactic polyolefins (APAO); (iii) polyamides (PA); (iv) thermoplastic polyurethanes (TPU); (v) polyurethanes (PU); (vi) (meth)acrylates; (vii) polyesters (PES); and mixtures and combinations thereof, particularly preferably from the group of (i) ethylene vinyl acetates (EVA polymers); (ii) polyolefins (PO); (iii) polyamides (PA); (iv) thermoplastic polyurethanes (TPU); and mixtures and combinations thereof.

In addition, it can also be provided according to the invention that the hot-melt adhesive is a hot-melt adhesive based on natural raw materials, in particular polylactic acid (PLA). For further information on the hot-melt adhesives based on natural raw materials that can be used according to the invention, EP 2 781 573 as well as on the parallel DE 10 2013 004 909 as well as the U.S. 2015 191 635 referenced, the respective disclosure content of which is hereby fully incorporated by reference.

In the context of the present invention, it is also possible for the hot-melt adhesive to comprise or consist of a mixture or combination of at least two different hot-melt adhesives, in particular as defined above. In particular, the hot-melt adhesive can comprise or consist of a mixture or combination of at least one reactive hot-melt adhesive, in particular as defined above, and at least one non-reactive hot-melt adhesive, in particular as defined above. On this basis, too, the corresponding application and product properties of the hot-melt adhesive used can be adapted or tailored, in particular with regard to the respective application and use.

In the context of the present invention ^, the commercially available product Jowatherm-Reaktant® 602.35 sold by Jowat SE can be used as a reactive hot-melt adhesive. According to the invention, a hot-melt adhesive based on polyolefins can also be used as the non-reactive hot-melt adhesive, in particular ⁱⁿ the form of the commercially available product Jowatherm®, which is also marketed by Jowat SE EP 60 287.90 . In addition, a non-reactive EVA hot-melt adhesive in the form of the commercially available product ^Jowatherm® 287.10 sold by Jowat SE can be used.

As far as the hot-melt adhesive used in the context of the present invention is concerned, it should be in the solid state at room temperature (20° C.) and ambient pressure (1013.25 hPa).

In addition, the hot-melt adhesive should have a softening point and/or range, in particular determined by ring and ball, preferably determined in accordance with DIN EN 1238:2011-07, in the range from 30° C. to 200° C., in particular in the range from 40° C. to 100 °C, preferably in the range from 50 °C to 90 °C, preferably in the range from 55 °C to 80 °C.

In this context, the hot-melt adhesive should preferably have a softening point or range, determined in particular by ring and ball, preferably determined according to DIN EN 1238:2011-07, of at least 30° C., in particular at least 40° C., preferably at least 50° C at least 55°C, more preferably at least 60°C.

In the context of the present invention, it is also advantageous if the hot-melt adhesive has a melting point, in particular determined by means of differential scanning calorimetry (DDK), preferably determined by DIN 53765:1994-03, in the range from 55°C to 275°C, in particular in the range from 65°C to 225°C, preferably in the range from 70°C to 175°C.

In this context, it can equally be provided that the hot-melt adhesive has a processing temperature, in particular determined by means of dynamic differential calorimetry (DDK), preferably determined according to DIN 53765:1994-03, in the range from 80° C. to 300° C., in particular in the range from 90 °C to 250 °C, preferably in the range of 95 °C to 200 °C.

In addition, the hot-melt adhesive should have a viscosity, in particular dynamic viscosity and/or in particular determined according to DIN EN ISO 3219:1994-10 and/or in particular in the temperature range from 95° C. to 200° C., in the range from 5,000 mPas to 150,000 mPas , in particular in the range from 7,500 mPas to 125,000 mPas, preferably in the range from 10,000 mPas to 100,000 mPas.

Likewise, the hot-melt adhesive should have a density ρ, determined in particular at a temperature of 20° C. and/or determined in particular according to DIN 51757:2011-01, in the range from 0.5 g/cm ³ to 2.5 g/cm ³ , in particular in the range from 0.6 g/cm ³ to 2.3 g/cm ³ , preferably in the range from 0.7 g/cm ³ to 2.1 g/cm ³ , preferably in the range from 0.8 g/cm ³ to 2 g/cm ³ .

In addition, it can be provided that the hot-melt adhesive is at least essentially block-free after it has been applied and/or after it has cooled and solidified, in particular after it has cured and/or allowed to solidify.

Likewise, it can optionally be provided that the hot-melt adhesive has thermoplastic and/or elastomeric properties after it has been applied and/or after it has cooled and solidified, in particular after it has cured and/or allowed to solidify.

The aforementioned properties or parameters of the hot-melt adhesive used according to the invention lead in particular to application-specific or processing-specific properties and advantages, in particular with regard to the melting behavior, the flowability and the application behavior on the coarse chipboard wood-based panel to be treated.

According to one embodiment of the invention, the hot-melt adhesive can have at least one adhesion promoter or primer. In this regard, the adhesion promoter or primer can be selected from the group consisting of silicon oxides, silanes, silicic acids, siliceous earths and mixtures and combinations thereof. In particular, the hot-melt adhesive can contain the adhesion promoter or primer in quantities in the range from 1% by weight to 30% by weight, in particular in the range from 2% by weight to 20% by weight, preferably in the range from 5% by weight to 10% by weight, based on the hot melt adhesive included. The targeted use of an adhesion promoter or primer can on the one hand improve the adhesion of the hot-melt adhesive in relation to the coarse particle board to be treated. On the other hand, the hot-melt adhesive used can be equipped with appropriate properties with a view to providing a primer function, for example for a lamination, backing, coating, painting or the like that may follow the surface treatment of the coarse chipboard panel. In particular, the adhesion properties can thus be controlled in relation to subsequent coatings. In particular, the hot-melt adhesive can have a primer function for substrates that are difficult to bond or the function of a primer for subsequent coatings or the like, for example with regard to the use of mineral or synthetic resin-based coatings, such as corresponding plasters or the like. In addition, the porosity of the surface of the hot-melt adhesive filling or hot-melt adhesive layer can be adjusted in a targeted manner by using an adhesion promoter or primer.

In addition, the hot-melt adhesive can have at least one additive. The additive can be selected from the group of plasticizers, high-boiling organic oils, esters or other plasticizing additives, stabilizers, in particular UV stabilizers, antioxidants, acid scavengers, in particular nano-particulate fillers, anti-aging agents and mixtures or combinations thereof. In this regard, the hot-melt adhesive can contain the additive, for example, in amounts ranging from 1% by weight to 60% by weight, in particular in the range from 5% by weight to 50% by weight, preferably in the range from 10% by weight to 40% by weight, based on the hot-melt adhesive. As a result, the properties of the hot-melt adhesive used according to the invention can be further adjusted or specified.

In particular, the hot-melt adhesive can also have at least one non-reactive polymer, resin and/or wax, in particular a natural, synthetic or chemically modified (partially synthetic) wax. In this context, the hot-melt adhesive may contain the non-reactive polymer, resin or wax in amounts ranging from 0.5% to 15% by weight, in particular ranging from 1% to 10% by weight, preferably in the range from 1.5% by weight to 5% by weight, based on the hot-melt adhesive. This can In particular, the flowability of the hot-melt adhesive can also be further adjusted, which in particular leads to improved application properties when the hot-melt adhesive is applied to the surface, in particular the flat side surface, of the coarse particle board.

Equally, the hot-melt adhesive can have at least one functionalization component. In this context, the functionalization component can be selected from the group of electrically conductive substances, antimicrobial, antimycotic and/or fungicidal substances and mixtures and combinations thereof. In particular, the hot-melt adhesive can contain the functionalization component in amounts in the range from 0.1% by weight to 10% by weight, in particular in the range from 0.2% by weight to 5% by weight, preferably in the range from 0.5 % by weight to 3% by weight, based on the hot-melt adhesive.

Furthermore, the hot-melt adhesive can have at least one dye or at least one color pigment. In this context, the hot-melt adhesive or the colored pigment can be selected from the group of organic pigment dyes, inorganic pigment dyes and mixtures and combinations thereof. The hot-melt adhesive can contain the dye or the colored pigment in amounts ranging from 0.1% by weight to 30% by weight, in particular in the range from 0.5% by weight to 20% by weight, preferably in the range from 1% by weight to 10% by weight, based on the hot-melt adhesive. As a result, the hot-melt adhesive can be equipped with special optical properties in a purposeful manner, so that a coarse-chip wood-based material board treated on this basis can also have further decorative properties.

In the context of the present invention, it is particularly preferred if the hot-melt adhesive melt is applied to the surface, in particular the flat side surface, by means of spraying, nozzle application, knife coating, roller application, calendering, printing processes or extrusion, in particular by means of nozzle application and/or roller application, preferably roller application becomes.

According to the invention, the procedure can be such that the hot-melt adhesive melt is applied to the surface, in particular the flat side surface, by means of nozzle application, in particular slot nozzle application.

According to the invention, however, particularly good results are achieved if the hot-melt adhesive melt is applied by means of roller application, in particular by means of at least one hot-melt adhesive metering roller and/or hot-melt adhesive application roller, is applied to the surface, in particular the flat side surface. In this context, the procedure can be such that the hot-melt adhesive metering roller and/or hot-melt adhesive application roller is operated or become. Through the targeted procedure, according to which the hot-melt adhesive metering roller and/or hot-melt adhesive application roller is or are operated independently of one another, in the same direction or counter-current to the process or application direction or to the transport direction and/or feed direction of the coarse chipboard wood-based panel, the Amount of hot-melt adhesive applied per unit area can be set or specified in a targeted manner.

In this context, it can also be provided according to the invention that the application quantity, in particular the area-related application quantity, of the hot-melt adhesive melt via the rotational speed or peripheral speed of the hot-melt adhesive metering roller and/or the hot-melt adhesive application roller, preferably via the ratio of the rotational speed or peripheral speed the hot-melt adhesive metering roller and/or the hot-melt adhesive applicator roller is set or specified for the application speed, in particular the transport speed or feed speed of the coarse particle board. In this case, the application speed relates in particular to the length-related application of the hot-melt adhesive to the coarse chipboard wood-based panel per unit of time. On this basis, within the scope of the present invention, a predetermined amount of hot-melt adhesive can be applied to a defined area of the coarse particle board. According to the invention, the special procedure ensures that the hot-melt adhesive is applied evenly in defined amounts per area on the underlying coarse particle board.

According to the invention, for example, a hot-melt adhesive application roller, in particular with a doctor blade system, can be used. This ensures a particularly defined and even application of the required amount of hot melt adhesive.

According to the invention, for example, heatable hot-melt adhesive metering rollers and/or heatable hot-melt adhesive application rollers, for example, in particular, heatable hot-melt adhesive application rollers separate hot-melt adhesive metering rollers, or in particular heatable hot-melt adhesive application rollers with doctor blade systems, are used to apply the amounts of hot-melt adhesive provided according to the invention.

As previously mentioned, the amount of hot-melt adhesive can be specified or adjusted by adjusting the ratio of the feed speed of the coarse chipboard to be coated to the rotational or peripheral speed of the applicator roller in particular, and this also taking into account the different viscosities or .rheological properties.

In the context of the method according to the invention, the procedure is in particular such that the hot-melt adhesive melt is applied to the flat side surface at a temperature above the softening point or range or above the melting point, preferably above the melting point, of the hot-melt adhesive. This ensures a particularly uniform and complete filling of the unevenness, indentations, cavities, holes or blowholes, since the melt in the free-flowing state can penetrate the surface particularly well, without causing the wood chips to swell. In particular, a uniform and homogeneous coating of the coarse particle board with the underlying hot-melt adhesive can also be achieved in this way, with high adhesion to the substrate (i.e. the underlying coarse particle board) also being ensured.

In this context, the invention provides in particular for the hot-melt adhesive melt to be heated at a temperature (i.e. in particular the temperature of the hot-melt adhesive) in the range from 40° C. to 300° C., in particular in the range from 60° C. to 250° C., preferably in the range of 80° C. and 220° C., preferably in the range from 90° C. to 200° C., particularly preferably in the range from 95° C. to 190° C., is applied to the surface, in particular the flat side surface.

In particular, the hot-melt adhesive melt can be applied at a temperature (ie temperature of the hot-melt adhesive) of at least 40° C., in particular at least 60° C., preferably at least 80° C., preferably at least 90° C., particularly preferably at least 95° C., on the surface in particular flat side surface, are applied.

In particular with regard to a further optimization of the application of the hot-melt adhesive, the procedure according to the invention can also be such that (i) the application of the hot-melt adhesive melt to the flat side surface of the coarse chipboard wood-based panel and/or step b) and/or (ii) the filling and/or Filling the unevenness, indentations, cavities, holes and/or blowholes with the hot-melt adhesive, in particular the formation of the hot-melt adhesive filling, and/or step b1) and/or (iii) the coating and/or filming of the surface, preferably the flat side surface, in particular the formation of the hot-melt adhesive layer, and/or step b2), in particular independently of one another, is or are carried out or repeated several times, in particular once, twice, 3 times or more.

In this way, a particularly uniform or complete filling and a uniform and homogeneous coating of the underlying coarse particle board can be provided, even in the event that the coarse particle board to be treated has an excessive number or correspondingly large or large-volume bumps , indentations, cavities, holes or blowholes. The repetitions of the respective process steps in question can be implemented by appropriate recycling or renewed feeding of the coarse particle board to be treated again to the hot-melt adhesive metering roller or the hot-melt adhesive applicator roller. Alternatively, several hot-melt adhesive metering rollers or hot-melt adhesive applicator rollers arranged one after the other or in succession can also be used within the scope of the method according to the invention. According to the invention, the procedure can also be such that before the hot-melt adhesive is applied again, the previously applied hot-melt adhesive melt is first at least partially cooled or at least partially solidified. Alternatively, however, it is also possible to proceed in such a way that the hot-melt adhesive is applied again to the previously applied hot-melt adhesive which has not yet (completely) cooled down or not yet (completely) solidified.

In addition, according to the invention, the procedure can be such that before the hot-melt adhesive melt is applied to the flat side surface and/or before step b), in particular before step b1) and/or before step b2), preferably before step b1), and/or after Step (a) in addition, a smoothing, in particular a grinding, preferably calibration grinding, of the flat side surface is carried out. This allows the bumps, depressions, cavities, holes and/or voids are reduced or made more uniform, in particular by removing (surface) material or coarse chip material from the coarse chipboard wood-based panel to be treated before the actual finishing with the hot-melt adhesive. As a result, even more uniform fillings or coatings with the hot-melt adhesive can be realized overall, with particularly uniform and homogeneous surfaces being able to be provided. In particular, the smoothing of the flat-side surface, which may precede the application of hot-melt adhesive, leads to a reduction in the amount of hot-melt adhesive to be applied. The smoothing can be performed, for example, using a grinding roller or the like. If necessary, the smoothing can be repeated until the desired smoothness of the surface, in particular the flat side surface, of the coarse particle board is obtained.

In this context, after the smoothing, in particular the grinding, preferably calibration grinding, of the flat side surface, the flat side surface can also be cleaned, in particular to remove previously removed and/or abraded material. In particular, corresponding brush rollers, suction devices or the like can be used for this purpose. The surface should also be cleaned before applying the hot-melt adhesive, especially the hot-melt adhesive melt

In addition, within the scope of the method according to the invention, before the hot-melt adhesive melt is applied to the flat side surface and/or before step b), in particular before step b1) and/or before step b2), preferably before step b1), and/or after Step (a) and/or after the flat side surface has been smoothed, the flat side surface or the OSB panel as such is preheated. In this context, the surface, in particular the flat side surface, or the OSB panel can be heated to a temperature in the range from 25 °C to 200 °C, in particular in the range from 30 °C to 150 °C, preferably in the range from 40 °C and 125°C, preferably in the range of 50°C to 100°C. In particular, the surface, in particular the flat side surface, or the OSB panel can be heated to a temperature of at least 25°C, in particular at least 30°C, preferably at least 40°C, preferably at least 50°C. On this basis, uniform application and processing conditions can be guaranteed throughout the process. In addition, the preheating leads to improved wetting and penetration behavior of the applied Hot-melt adhesive melt in relation to the flat side surface of the coarse particle board to be coated, since premature curing is prevented, so that the quality of the filled or coated surface is further improved.

According to the present invention, the procedure can also be such that before the hot-melt adhesive melt is applied to the surface, in particular the flat side surface, and/or before step b), in particular before step b1) and/or step b2), preferably before step b1) , and/or after step (a) and/or after smoothing the flat side surface, a preferably automated detection and evaluation, in particular optical detection and evaluation, preferably opto-electronic detection and evaluation, of the surface, in particular flat side surface, preferably the bumps, depressions, cavities, holes and/or blowholes. According to the invention, the procedure can be such that a differentiated and/or adapted, preferably quantitatively adapted to the detected and analyzed surface, in particular flat side surface, preferably to the detected and analyzed bumps, depressions, cavities, holes and/or voids Hot melt adhesive melt takes place.

Corresponding opto-electronic detection or analysis devices can be used for this purpose, for example. A correspondingly differentiated or site-specific application of hot melt adhesive can be carried out, for example, using appropriate nozzle application devices or by applying the hot melt adhesive in sections using a hot melt adhesive metering roller or hot melt adhesive application roller or the like. In this context, the procedure can be such that correspondingly larger application quantities of the hot-melt adhesive are used for areas with particularly large or large-volume bumps, depressions, cavities, holes or blowholes, while for areas of the surface to be treated, in particular the flat side surface, with correspondingly few or small-volume bumps, indentations, cavities, holes or blowholes, correspondingly smaller application quantities of hot-melt adhesive can be used. As a result, the method according to the invention can be further improved, in particular with regard to optimizing the material use of hot-melt adhesive while at the same time reducing the number of application or coating steps.

In this context, according to the invention, the procedure can also be such that after the application of the hot-melt adhesive melt to the flat side surface and/or after step b), in particular after step b1) and/or after step b2), preferably after step b2), an optionally further preferably automated detection and evaluation, in particular optical detection and evaluation, preferably optical-electronic detection and evaluation, of the flat side surface filled or coated with the hot-melt adhesive, preferably of the unevenness, depressions, cavities, holes and/or filled or coated with the hot-melt adhesive Blowholes, done. According to the invention, the procedure can be such that the hot-melt adhesive melt is subsequently applied again in the event of incomplete or insufficient filling and/or coating.

In addition, after the hot-melt adhesive melt has been applied to the flat side surface and/or after step b), in particular after step b1) and/or after step b2), preferably after step b2), the hot-melt adhesive applied, in particular the Hot-melt adhesive filling or the hot-melt adhesive layer, preferably the hot-melt adhesive layer, are carried out. For this purpose, in particular, heatable smoothing rollers or the like can be used. The smoothing roller can be operated, for example, in the opposite direction to the transport direction or feed direction of the coarse particle board. The smoothing can be carried out when the applied hot-melt adhesive is not (completely) cooled or not (completely) solidified. In particular, the thermoplastic behavior of the hot-melt adhesive used can be used accordingly in the context of smoothing, even in the case of reactive hot-melt adhesives that are not (fully) crosslinked.

In the context of the present invention, after the hot-melt adhesive melt has been applied to the flat side surface and/or after step b), in particular after step b1) and/or after step b2), preferably after step b2), structuring or profiling, in particular Surface structuring and/or surface profiling of the applied hot-melt adhesive, in particular the hot-melt adhesive filling and/or the hot-melt adhesive layer, preferably the hot-melt adhesive layer, are carried out. The structuring and/or profiling can be carried out by means of a preferably heatable structure or profile roller, but also by means of corresponding structure or profile sheets, structure or profile papers and combinations thereof, be performed. Also with regard to the structuring or profiling that may have to be carried out, the process can preferably be carried out in the not (completely) cooled or in the not (completely) solidified state of the hot-melt adhesive used. By structuring or profiling, the treated surface or the applied hot-melt adhesive of the coarse chipboard material properties can be equipped with additional optical or decorative properties and with further functional properties, such as an anti-slip or anti-slip function.

In this context, the smoothing on the one hand and/or the structuring or profiling on the other hand can take place during the cooling or solidification and/or before or after the cooling and solidification of the hot-melt adhesive and/or before, during or after step c), in particular before the cooling and solidification of the hot-melt adhesive or before step c). In particular if the hot-melt adhesive used according to the invention also has thermoplastic properties after cooling or after solidification, the smoothing or structuring or profiling can in principle also be carried out after the hot-melt adhesive has cooled or hardened, in particular with heating.

Furthermore, it can be provided within the scope of the present invention that after the application of the hot-melt adhesive melt to the flat side surface and/or after step b) and/or after the smoothing and/or standardization and/or after the structuring and/or profiling a treatment or further coating of the surface, in particular the flat side surface, is carried out.

In this context, the surface finish can be achieved by (i) coating, in particular with resin films and/or layers, preferably condensation resin films and/or layers, preferably melamine resin films and/or layers and/or phenolic resin films and/or layers; (ii) laminating, in particular adhesive laminating; (iii) varnishing; and/or (iv) laminating. In general, the coarse-grained wood-based material board provided within the scope of the present invention can thus be subjected to a further surface treatment in the form of a finish, such as for example by painting or covering the surface with, in particular, layered materials or substrates. In this context, the coarse particle board can be equipped with additional decorative or functional properties. For example, veneers, Foils, HPL materials ( High P ressure Laminate ), CPL materials ( Continuous Pressed Laminate ), condensation resin films, wallpaper, textiles, mineral and/or synthetic resin-based plasters or the like can be applied. The finishing with the materials in question, which takes place in particular via lamination, preferably adhesive lamination, can take place, depending on the material used, for example via roller or nozzle application (slot nozzle, spray application or multi-bead application).

In general, the additional surface finish during cooling and solidification and / or before and / or after cooling and solidification of the hot melt adhesive and / or before, during and / or after step c), in particular after cooling and solidification of the hot melt adhesive and / or be carried out after step c).

The method according to the invention can be carried out continuously and/or automatically, in particular continuously. In particular, the process according to the invention can be carried out continuously with regard to the sequence of the respective process steps.

According to the invention, it goes without saying that the selection and configuration as well as the type of application or application of the hot-melt adhesive, in particular the hot-melt adhesive melt, in the individual process stages or process sections, in particular with regard to the formation of the hot-melt adhesive filling on the one hand and the hot-melt adhesive layer on the other hand, can each take place independently of one another. In particular, it is self-evident according to the invention that the selection and design as well as the type of application or application of the hot-melt adhesive, in particular the hot-melt adhesive melt, (i) for filling or filling the unevenness, depressions, cavities, holes or blowholes and/or for forming the hot-melt adhesive filling and/or in step b1) on the one hand and (ii) for coating or filming the flat side surface and/or for forming the hot-melt adhesive layer and/or in step b2) on the other hand, can take place independently of one another .

As far as the coarse chipboard wood-based panels used according to the invention are concerned in general, they are characterized in particular by the following properties:
In general, the coarse chipboard has a density, in particular bulk density, in the range from 300 kg/m ³ to 1000 kg/m ³ , in particular in the range from 400 kg/m ³ to 900 kg/m ³ , preferably in the range of 500 kg /m ³ to 800 kg/m ³ , particularly preferably in the range from 550 kg/m ³ to 750 kg/m ³ .

In addition, the coarse particle board can have a large number of chips, in particular wood chips, preferably in the form of coarse chips, arranged and/or aligned in layers.

In this context, the chips can have a length, in particular an average length, in the range from 50 mm to 400 mm, in particular in the range from 75 mm to 300 mm, preferably in the range from 100 mm to 200 mm.

Likewise, the chips can have a width, in particular an average width, in the range from 2 mm to 100 mm, in particular in the range from 5 mm to 75 mm, preferably in the range from 10 mm to 50 mm.

Furthermore, the chips can have a thickness, in particular an average thickness, in the range from 0.2 mm to 5 mm, in particular in the range from 0.4 mm to 3 mm, preferably in the range from 0.6 mm to 1.5 mm.

Finally, the chips can be bonded using at least one binder and/or pressed to form a bond.

As mentioned above, the coarse chipboard wood-based panels in question have a large number of bumps, indentations, cavities, holes or blowholes, especially in the area of their surface, which can be effectively filled within the scope of the method according to the invention, in particular accompanied by a effective coating of the coarse chipboard based on a special hot-melt adhesive, as mentioned above. On the basis of the present invention, an efficient and overall economical method for the treatment, in particular leveling, of the surface, in particular the flat side surface, of coarse-chip wood-based material boards is thus provided overall, which is associated with the aforementioned advantages and properties.

Another subject of the present invention - according to a second aspect of the invention - is the coarse particle board (OSB composite wood panel) having at least one leveled flat side surface, the coarse particle board being obtainable or obtained according to the method of the invention described above.

• wobei die Grobspan-Holzwerkstoffplatte mindestens eine auf der Flachseitenoberfläche angeordnete Schmelzklebstoff-Füllung, insbesondere Schmelzklebstoff-Egalisierungsfüllung, aufweist, wobei die Schmelzklebstoff-Füllung derart ausgebildet ist, dass die Unebenheiten, Vertiefungen, Hohlräume, Löcher und/oder Lunkerstellen mit dem Schmelzklebstoff gefüllt und/oder verfüllt sind, und
• wobei die Grobspan-Holzwerkstoffplatte mindestens eine auf der Flachseitenoberfläche und/oder auf der Schmelzklebstoff-Füllung angeordnete Schmelzklebstoff-Schicht, insbesondere Schmelzklebstoff-Abdeckschicht aufweist, wobei die Schmelzklebstoff-Schicht derart ausgebildet ist, dass die Flachseitenoberfläche und/oder die Schmelzklebstoff-Füllung zumindest teil- und/oder abschnittsweise, vorzugsweise vollflächig, mit dem Schmelzklebstoff beschichtet und/oder verfilmt ist.

In this context, the present invention also relates to the coarse-grain wood-based material board (OSB-wood composite board) as such, having at least one leveled flat side surface, the flat side surface having a large number of bumps, depressions, cavities, holes or blowholes, the bumps, depressions , cavities, holes or blowholes are filled or filled with at least one hot-melt adhesive, in particular in such a way that the surface of the flat side is made more uniform or level,

• wherein the coarse chipboard material panel has at least one hot-melt adhesive filling, in particular hot-melt adhesive leveling filling, arranged on the flat side surface, wherein the hot-melt adhesive filling is designed in such a way that the unevenness, depressions, cavities, holes and/or blowholes are filled with the hot-melt adhesive and/or or are filled, and
• wherein the coarse chipboard has at least one hot-melt adhesive layer, in particular hot-melt adhesive cover layer, arranged on the flat side surface and/or on the hot-melt adhesive filling, the hot-melt adhesive layer being formed in such a way that the flat side surface and/or the hot-melt adhesive filling is at least partially - And/or in sections, preferably over the entire surface, is coated and/or filmed with the hot-melt adhesive.

As far as the coarse chipboard wood-based material board according to the invention is concerned in this context, it can be provided according to the invention that the hot-melt adhesive, in particular the hot-melt adhesive melt, is applied in such a way that the unevenness, depressions, cavities, holes and/or voids are filled with the hot-melt adhesive, in particular are filled or filled with the formation of a hot-melt adhesive filling, in particular a hot-melt adhesive leveling filling.

The coarse particle board according to the invention has at least one hot-melt adhesive filling, in particular hot-melt adhesive leveling filling, arranged on the flat side surface. In this context, the hot-melt adhesive filling is designed in such a way that the bumps, depressions, Cavities, holes and/or blowholes are filled and/or filled with the hot-melt adhesive.

In the context of the present invention, the situation in this context is in particular such that the unevenness, indentations, cavities, holes or blowholes are at least essentially completely filled or filled with the hot-melt adhesive.

In particular, it can be provided according to the invention that the unevenness, indentations, cavities, holes or blowholes are at least 30%, in particular at least 50%, preferably at least 70%, preferably at least 80%, particularly preferably at least 90%, particularly preferably at least 95% very particularly preferably at least 98%, based on the volume of the unevenness, indentations, cavities, holes and/or blowholes, are filled with the hot-melt adhesive.

Equally, it can be provided in this connection that the hot-melt adhesive filling is interspersed and/or possibly interrupted at least partially and/or in sections with coarse chips that form or limit the unevenness, depressions, cavities, holes and/or blowholes. In addition, the coarse chippings forming or delimiting the unevenness, indentations, cavities, holes or cavities can protrude at least partially or in sections into the hot-melt adhesive filling.

In general, in this context, the hot-melt adhesive filling can have a thickness in the range from 0.2 mm to 50 mm, in particular in the range from 0.5 mm to 25 mm, preferably in the range from 1 mm to 10 mm, preferably in the range from 1 mm to 5 mm.

Furthermore, it can be provided according to the invention that the hot-melt adhesive, in particular the hot-melt adhesive melt, is also applied in such a way that the surface, in particular the flat side surface, and/or the hot-melt adhesive filling is at least partially and/or in sections, preferably over the entire surface, covered with the hot-melt adhesive , in particular with the hot-melt adhesive melt, coated and / or filmed.

With regard to the coarse particle board according to the invention, it has at least one hot-melt adhesive layer, in particular hot-melt adhesive cover layer, arranged or applied on the flat side surface or on the hot-melt adhesive filling. In this connection, the hot melt adhesive layer is formed such that the flat side surface or the hot-melt adhesive filling is coated and/or filmed at least partially and/or in sections, preferably over the entire surface, with the hot-melt adhesive, in particular with the hot-melt adhesive melt. In this case, the hot-melt adhesive layer can be at least essentially closed or at least essentially free of perforations. In addition, it can be provided that the hot-melt adhesive layer has at least essentially no coarse chips that form or limit the unevenness, depressions, cavities, holes and/or blowholes.

In this context, the hot-melt adhesive layer can have a thickness in the range from 0.1 mm to 30 mm, in particular in the range from 0.2 mm to 20 mm, preferably in the range from 0.5 mm to 10 mm, preferably in the range from 0 .75 mm to 5 mm, particularly preferably in the range from 1 mm to 3 mm.

In this context in particular, the hot-melt adhesive, in particular the hot-melt adhesive melt, can be used in an amount in the range from 10 g/m ² to 2,000 g/m ² , in particular in the range from 25 g/m ² to 1,500 g/m ² , preferably in Range from 50 g/m ² to 1000 g/m ² , preferably in the range from 75 g/m ² to 800 g/m ² , particularly preferably in the range from 100 g/m ² to 600 g/m ² , based on the Surface, especially flat side surface, be applied.

According to the invention, particularly good results are obtained with regard to the properties of the coarse particle board according to the invention if the hot-melt adhesive is a thermoplastic and/or one-component hot-melt adhesive, in particular a one-component hot-melt adhesive.

In this context, the hot-melt adhesive should be at least essentially free of water and/or solvents. In this context, the hot-melt adhesive should have a water and/or solvent content of at most 10% by weight, in particular at most 5% by weight, preferably at most 2% by weight, preferably at most 1% by weight, particularly preferably at most 0, 5% by weight, very particularly preferably at most 0.1% by weight, based on the hot-melt adhesive.

In the context of the present invention, it is particularly preferred if the hot-melt adhesive is a reactive hot-melt adhesive, in particular a thermoplastic and/or one-component reactive hot-melt adhesive, preferably a one-component reactive hot-melt adhesive.

In this context, it is equally advantageous if the reactive hot-melt adhesive is a moisture-crosslinking, heat-crosslinking and/or radiation-crosslinking hot-melt adhesive, in particular a moisture-crosslinking and/or radiation-crosslinking, preferably a moisture-crosslinking, hot-melt adhesive.

According to a less preferred embodiment according to the invention, it can also be provided that the hot-melt adhesive is a non-reactive hot-melt adhesive, in particular a thermoplastic and/or one-component non-reactive hot-melt adhesive, preferably a one-component non-reactive hot-melt adhesive.

Equally, within the scope of the present invention, a hot-melt adhesive based on natural raw materials, in particular polylactic acid (PLA), can be used.

According to the invention, it can also be provided that the hot-melt adhesive has at least one adhesion promoter and/or primer. In this context, the adhesion promoter can be selected from the group consisting of silicon oxides, silanes, silicic acids, siliceous earths and mixtures and combinations thereof.

Equally, the hot-melt adhesive can have at least one additive. In this context, the additive can be selected from the group of plasticizers, high-boiling organic oils, esters or other additives used for plasticization, stabilizers, in particular UV stabilizers, antioxidants, acid scavengers, in particular nano-particulate fillers, aging inhibitors and mixtures or combinations thereof.

In addition, the hot-melt adhesive can have at least one non-reactive polymer, resin and/or wax, in particular a natural, synthetic or chemically modified (partially synthetic) wax.

Furthermore, the hot-melt adhesive can have at least one functionalization component. In this context, the functionalization component can be selected from the group of electrically conductive substances, antimicrobial, antimycotic and/or fungicidal substances and mixtures and combinations thereof.

Furthermore, the hot-melt adhesive can have at least one dye and/or at least one color pigment. In this context, the dye or the color pigment can be selected from the group of organic ones Pigment dyes, inorganic pigment dyes and mixtures and combinations thereof.

The coarse-chip wood material board according to the invention can furthermore be designed in such a way that the flat side surface is smoothed, in particular ground. In this context, the unevenness, indentations, cavities, holes or cavities can be reduced or evened out, in particular by removing coarse chip material. As a result, the area-related application quantity of hot-melt adhesive can be correspondingly reduced.

In addition, the coarse-chip wood-based material panel according to the invention can be designed in such a way that the hot-melt adhesive applied to the flat side surface, in particular the hot-melt adhesive filling and/or the hot-melt adhesive layer, is smoothed or standardized. As a result, the surface properties can be further improved, in particular with regard to a uniform and homogeneous appearance of the coarse particle board according to the invention.

In contrast, it can also be provided within the scope of the present invention that the hot-melt adhesive applied to the flat side surface, in particular the hot-melt adhesive filling and/or the hot-melt adhesive layer, is structured or profiled. As a result, further decorative properties can be provided. In addition, due to the structuring or profiling of the surface, the anti-slip properties can be improved and thus the slip resistance can be increased accordingly.

According to the invention, it can also be provided that the coarse particle board is surface-coated or has a further coating, in particular on the flat side surface, preferably on the hot-melt adhesive, in particular on the hot-melt adhesive filling and/or the hot-melt adhesive layer.

For example, the coarse chipboard material panel, in particular on the flat side surface, can have (i) at least one coating, in particular with resin films and/or layers, preferably condensation resin films and/or layers, preferably melamine resin films and/or layers and/or phenolic resin films and/or -layers; (ii) at least one lamination, in particular adhesive lamination; (iii) at least one finish; and/or (v) at least one lamination.

With regard to the coarse particle board based on the invention, it can have a density, in particular bulk density, in the range from 300 kg/m ³ to 1,000 kg/m ³ , in particular in the range from 400 kg/m ³ to 900 kg/m ³ , preferably in the range from 500 kg/m ³ to 800 kg/m ³ , particularly preferably in the range from 550 kg/m ³ to 750 kg/m ³ .

The coarse particle board according to the invention is also characterized in that it has a large number of chips, in particular wood chips, preferably in the form of coarse chips, arranged and/or aligned in layers.

In this context, the chips can have a length, in particular an average length, in the range from 50 mm to 400 mm, in particular in the range from 75 mm to 300 mm, preferably in the range from 100 mm to 200 mm.

In addition, the chips can have a width, in particular an average width, in the range from 2 mm to 100 mm, in particular in the range from 5 mm to 75 mm, preferably in the range from 10 mm to 50 mm.

Furthermore, the chips can have a thickness, in particular an average thickness, in the range from 0.2 mm to 5 mm, in particular in the range from 0.4 mm to 3 mm, preferably in the range from 0.6 mm to 1.5 mm.

With regard to the coarse-chip wood-based material board according to the invention or the starting or base board used in this regard, the situation is in particular such that the chips are connected by means of at least one binder or pressed to form a bond.

As stated above, the coarse chipboard based wood panel according to the invention is distinguished by improved (surface) properties, in particular with regard to improved weathering, UV and/or moisture resistance. In addition, the coarse-chip wood-based panels according to the invention have a high resistance to chemicals. The at least essentially perforation-free and/or complete coating of the surface, in particular the flat side surface, effectively protects the components of the coarse chipboard material underneath from the weather or environmental influences, such as moisture, while at the same time providing the coating with high mechanical stability.

1. (A) gegebenenfalls mindestens eine Schleifeinrichtung, insbesondere Kalibrierschleifeinrichtung, insbesondere zum Schleifen, vorzugsweise Kalibrierschleifen, der mindestens einen Flachseitenoberfläche der Grobspan-Holzwerkstoffplatte;
2. (B) mindestens eine Erwärmungs- und/oder Temperiereinrichtung, insbesondere zur Erwärmung und/oder zum Temperieren der mindestens einen Flachseitenoberfläche der Grobspan-Holzwerkstoffplatte, insbesondere wobei die Erwärmungs- und/oder Temperiereinrichtung stromabwärts zur Schleifeinrichtung angeordnet ist;
3. (C) mindestens eine Verfüllungs- und/oder Beschichtungseinrichtung
   • zum Aufbringen mindestens eines Schmelzklebstoffs in Form einer Schmelzklebstoff-Schmelze auf die mindestens eine Flachseitenoberfläche der Grobspan-Holzwerkstoffplatte derart, dass zumindest die Unebenheiten, Vertiefungen, Hohlräume, Löcher und/oder Lunkerstellen zumindest im Wesentlichen mit der Schmelzklebstoff-Schmelze gefüllt und/oder verfüllt werden, insbesondere derart, dass eine Vergleichmäßigung und/oder Egalisierung der Flachseitenoberfläche, insbesondere unter Ausbildung mindestens einer Schmelzklebstoff-Füllung, bewirkt wird und
   • zum weiteren Aufbringen des Schmelzklebstoffs in Form der Schmelzklebstoff-Schmelze auf die mindestens eine Flachseitenoberfläche der Grobspan-Holzwerkstoffplatte und/oder auf die Schmelzklebstoff-Füllung derart, dass die Flachseitenoberfläche und/oder die Schmelzklebstoff-Füllung zumindest teil- und/oder abschnittsweise, vorzugsweise vollflächig, mit der Schmelzklebstoff-Schmelze beschichtet und/oder verfilmt wird, insbesondere wobei mindestens eine auf der Flachseitenoberfläche und/oder auf der Schmelzklebstoff-Füllung angeordnete Schmelzklebstoff-Schicht, insbesondere Schmelzklebstoff-Abdeckschicht, resultiert,
   • insbesondere wobei die Verfüllungs- und/oder Beschichtungseinrichtung stromabwärts zur Erwärmungs- und/oder Temperiereinrichtung angeordnet ist;
4. (D) gegebenenfalls mindestens eine Oberflächenbehandlungs- und/oder Strukturgebungseinrichtung, insbesondere zur Glättung und/oder zur Strukturierung und/oder Profilierung des aufgebrachten Schmelzklebstoffs, insbesondere der Schmelzklebstoff-Füllung und/oder der Schmelzklebstoff-Abdeckschicht, vorzugsweise der Schmelzklebstoff-Abdeckschicht, insbesondere wobei die Oberflächenbehandlungs- und/oder Strukturgebungseinrichtung stromabwärts zur Verfüllungs- und/oder Beschichtungseinrichtung angeordnet ist;
5. (E) gegebenenfalls mindestens eine Abkühleinrichtung, insbesondere zum Abkühlen und Verfestigen, der aufgebrachten Schmelzklebstoff-Schmelze, insbesondere wobei die Abkühleinrichtung stromabwärts zur Verfüllungs- und/oder Beschichtungseinrichtung und/oder stromabwärts zur Oberflächenbehandlungs- und/oder Strukturgebungseinrichtung angeordnet ist.

Also described here is the production plant for leveling at least one flat side surface of coarse chipboard wood-based material panels (OSB wood composite panels), the flat side surface having a large number of bumps, depressions, holes and/or blowholes, or for carrying out the method according to the invention, as described above. where the production plant comprises the following units:

1. (A) optionally at least one grinding device, in particular calibrating grinding device, in particular for grinding, preferably calibrating grinding, the at least one flat side surface of the coarse particle board;
2. (B) at least one heating and/or temperature control device, in particular for heating and/or for temperature control of the at least one flat side surface of the coarse particle board, in particular the heating and/or temperature control device being arranged downstream of the grinding device;
3. (C) at least one filling and/or coating device
   • for applying at least one hot-melt adhesive in the form of a hot-melt adhesive melt to the at least one flat side surface of the coarse particle board such that at least the bumps, depressions, cavities, holes and/or blowholes are at least essentially filled and/or filled with the hot-melt adhesive melt , in particular in such a way that the flat side surface is made more uniform and/or level, in particular with the formation of at least one hot-melt adhesive filling, and
   • for further application of the hot-melt adhesive in the form of the hot-melt adhesive melt to the at least one flat side surface of the coarse chipboard wood-based material board and/or to the hot-melt adhesive filling in such a way that the flat side surface and/or the hot-melt adhesive filling is at least partially and/or in sections, preferably over the entire surface , is coated and/or filmed with the hot-melt adhesive melt, in particular resulting in at least one hot-melt adhesive layer, in particular hot-melt adhesive covering layer, arranged on the flat side surface and/or on the hot-melt adhesive filling,
   • In particular, the filling and/or coating device being arranged downstream of the heating and/or temperature control device;
4. (D) optionally at least one surface treatment and/or structuring device, in particular for smoothing and/or for structuring and/or profiling of the applied hot-melt adhesive, in particular the hot-melt adhesive filling and/or the hot-melt adhesive covering layer, preferably the hot-melt adhesive covering layer, in particular wherein the surface treatment and/or structuring device is arranged downstream of the filling and/or coating device;
5. (E) optionally at least one cooling device, in particular for cooling and solidifying the applied hot-melt adhesive melt, in particular with the cooling device being arranged downstream of the filling and/or coating device and/or downstream of the surface treatment and/or structuring device.

In particular, the production plant can comprise a plurality, in particular two, three, four or more, filling and/or coating devices. In this context, the respective filling or coating devices can be arranged in particular downstream of one another or in series. On this basis, a multiple or successive application of the hot-melt adhesive to the surface, in particular the flat side surface, is possible with the hot-melt adhesive application increasing in the course of the process, so that in this way the corresponding hot-melt adhesive filling or hot-melt adhesive layer can be formed continuously.

Equally, however, it is also possible in the present case for the production plant to have at least one return device, in particular for the return transport or push-back of the coarse particle board, in particular to the filling or coating device. As a result, it is possible within the scope of the production plant for the coarse-grain wood-based material board to be guided again through a corresponding filling or coating device for renewed application of the hot-melt adhesive. As a result, the number of filling or coating devices can be reduced accordingly. The return device can in particular be a component of the transport or feed device described below.

As far as the grinding device of the production plant is concerned, it can have at least one means for grinding, in particular a grinding roller. In particular, the grinding device can also have at least one means for cleaning or for removing abraded material. This can be, for example, a roller brush or a suction device or the like.

Furthermore, the heating or tempering device on which the production plant is based can have at least one means for heating or tempering the coarse particle board, in particular the flat side surface, of the coarse particle board, in particular a heat radiator or heat fan or an oven, in particular belt or continuous oven , and/or have at least one means for detecting or controlling the temperature of the coarse particle board, preferably the flat side surface of the coarse particle board.

By heating the coarse particleboard wood-based panel before applying the hot-melt adhesive, the application behavior can be improved overall, in particular with regard to at least essentially complete filling or filling of the unevenness, depressions, cavities, holes or blowholes in question, in particular there premature cooling or solidification of the hot-melt adhesive, as can be the case when it is applied to a cold or unheated substrate, is avoided.

Furthermore, the filling and/or coating device of the production plant can have at least one means for heating the hot-melt adhesive, preferably for obtaining the hot-melt adhesive melt, or at least one means for applying the hot-melt adhesive melt to the flat side surface.

In this context, the means for applying the hot-melt adhesive melt can be selected from the group of (i) hot-melt adhesive rollers, in particular hot-melt adhesive metering rollers and/or hot-melt adhesive application rollers; (ii) hot-melt adhesive application nozzles, in particular slot nozzles for hot-melt adhesive, preferably flat sheet nozzles for hot-melt adhesive; (iii) hot-melt adhesive doctor blades, in particular hot-melt adhesive roller doctor blades; particularly preferably (i) rollers, in particular hot-melt adhesive metering rollers and/or hot-melt adhesive application rollers, and combinations thereof.

In this regard, heatable hot-melt adhesive application rollers with separate, in particular uniformly heatable, hot-melt adhesive metering rollers can be used in the present case. In the present case, a hot-melt adhesive application roller, in particular with a squeegee system, can be used in particular for the defined application of the required application quantity of hot-melt adhesive melt.

In the present case, it can be provided that the means for applying the hot-melt adhesive, in particular the hot-melt adhesive roller, in particular hot-melt adhesive metering roller and/or hot-melt adhesive application roller, is designed to be heatable. This avoids premature cooling or solidification of the hot-melt adhesive used and maintains the flowability of the hot-melt adhesive when it is applied to the flat side surface, which further improves the application quality.

• B1) mindestens ein erstes Mittel zum Aufbringen der Schmelzklebstoff-Schmelze auf die Flachseitenoberfläche derart, dass die Unebenheiten, Vertiefungen, Hohlräume, Löcher und/oder Lunkerstellen mit dem Schmelzklebstoff, insbesondere unter Ausbildung einer Schmelzklebstoff-Füllung, vorzugsweise Schmelzklebstoff-Egalisierungsfüllung, gefüllt und/oder verfüllt werden; und/oder
• B2) mindestens ein zweites Mittel zum Aufbringen der Schmelzklebstoff-Schmelze auf die Oberfläche, insbesondere Flachseitenoberfläche, der Grobspan-Holzwerkstoffplatte und/oder auf die Schmelzklebstoff-Füllung, derart, dass die Flachseitenoberfläche und/oder die Schmelzklebstoff-Füllung zudem zumindest teil- und/oder abschnittsweise, vorzugsweise vollflächig, mit der Schmelzklebstoff-Schmelze beschichtet und/oder verfilmt wird, insbesondere wobei mindestens eine auf der Flachseitenoberfläche und/oder auf der Schmelzklebstoff-Füllung angeordnete Schmelzklebstoff-Schicht, insbesondere Schmelzklebstoff-Abdeckschicht, resultiert;

aufweist.In addition, it can be provided in the present case that the filling or coating device

• B1) at least one first means for applying the hot-melt adhesive melt to the flat side surface in such a way that the unevenness, depressions, cavities, holes and/or blowholes are filled with the hot-melt adhesive, in particular with formation of a hot-melt adhesive filling, preferably hot-melt adhesive leveling filling, and/ or be filled in; and or
• B2) at least one second means for applying the hot-melt adhesive melt to the surface, in particular the flat side surface, of the coarse particle board and/or to the hot-melt adhesive filling, such that the flat side surface and/or the hot-melt adhesive filling is also at least partially and/or or is coated and/or filmed in sections, preferably over the entire surface, with the hot-melt adhesive melt, in particular with at least one hot-melt adhesive layer, in particular hot-melt adhesive covering layer, arranged on the flat side surface and/or on the hot-melt adhesive filling;

having.

In this case, it can basically be provided in the present case that the filling or coating device has a plurality of first means and a plurality of second means for applying the hot-melt adhesive.

In the present case, it is preferred if the means for applying the hot-melt adhesive is in the form of a hot-melt adhesive roller, in particular hot-melt adhesive metering roller and/or hot-melt adhesive application roller, or comprises it, with the hot-melt adhesive roller, in particular the hot-melt adhesive metering roller or the hot-melt adhesive applicator roller, can be operated in the same direction or in the opposite direction to the transport direction and/or feed direction of the coarse particle board. In this context, it is equally preferred in the present case if the hot-melt adhesive roller, in particular the hot-melt adhesive metering roller and/or the hot-melt adhesive application roller, has at least one device for controlling and/or operating the hot-melt adhesive roller, in particular the hot-melt adhesive metering roller and/or or the hot-melt adhesive applicator roller, running in the same direction or in the opposite direction to the direction of transport and/or the direction of feed of the coarse particle board. As a result, in particular the quantity of the applied hot-melt adhesive can be set or specified accordingly.

Likewise, it can be provided that the production plant or the filling and/or coating device, in particular the means for applying the hot-melt adhesive, has at least one control device for setting or controlling the applied quantity of hot-melt adhesive. The control device for setting and/or controlling the amount of hot-melt adhesive applied can be designed such that the amount of hot-melt adhesive to be applied can be adjusted depending on the transport speed and/or feed speed of the coarse particle board. This ensures an even and defined adhesive application with a high throughput at the same time.

In particular, it can also be provided in the present case that the means for applying the hot-melt adhesive is designed in the form of a hot-melt adhesive roller, in particular hot-melt adhesive metering roller and/or hot-melt adhesive application roller, or comprises it, with the hot-melt adhesive roller, in particular the hot-melt adhesive dosing roller and/or the hot-melt adhesive application roller, has at least one control device for setting or controlling the roller speed of rotation and/or the roller peripheral speed, in particular as a function of the transport speed and/or feed speed of the coarse particle board.

Equally, the production plant can have at least one transport and/or feed device, in particular for the transport and/or feed of the coarse particle board. In this context, the transport or feed device can have at least one control device for setting or controlling the transport and/or feed speed of the coarse particle board. In this regard, the control device for setting and/or controlling the transport and/or feed speed can be designed in such a way that the transport and/or feed speed of the coarse particle board is a function of the amount of hot-melt adhesive to be applied and/or a function of the rollers -Rotational speed and/or the peripheral speed of the rollers of the hot-melt adhesive metering roller and/or the hot-melt adhesive applicator roller which is adjustable.

By setting the transport or feed speed of the coarse-grain wood-based material panel, in particular in coordination with the setting of the direction of rotation or rotation and/or the rotational speed or peripheral speed of the hot-melt adhesive rollers used here, in particular hot-melt adhesive metering roller or hot-melt adhesive application roller , the total quantity of hot-melt adhesive to be applied can be specified.

In the present case, it can also be provided that the production plant has at least one detection and/or evaluation device for the preferably automated detection and evaluation, in particular optical detection and evaluation, preferably optoelectronic detection and evaluation, of the surface, in particular the flat side surface, preferably the unevenness, indentations , cavities, holes and/or blowholes. In this regard, the detection or evaluation device can be arranged downstream of the grinding device and/or downstream of the heating and/or temperature control device and/or upstream of the filling and/or coating device. In this context, the production plant can also have at least one means for controlling the quantity of hot-melt adhesive to be applied or discharged depending on the optical detection or evaluation of the surface, in particular the flat side surface, of the coarse particle board. In this context, an application quantity of hot-melt adhesive which is adapted to the respective circumstances and, in particular, is site-specific, can be set, which leads to correspondingly optimized coatings while at the same time saving material.

Provision can furthermore be made for the production plant to have at least one additional detection and/or evaluation device, if required, for preferably automated detection and evaluation, in particular optical detection and evaluation, preferably opto-electronic detection and evaluation, of the filling and/or coating of the flat side surface, preferably the filling and/or coating of the bumps, indentations, cavities, holes and/or blowholes with the hot-melt adhesive. In this regard, the further detection or evaluation device can be arranged downstream of the filling and/or coating device. In this context, the production plant can be designed, for example, in such a way that if the coating or the like is not complete, the coarse chipboard is subjected to a new application of hot-melt adhesive, for example by being fed back to the filling and/or coating device, in particular by means of the transport and/or Feed device or the return device.

On this basis, the production plant enables continuous and/or automated or fully automated treatment of the underlying OSB panels.

Furthermore, the surface treatment and/or structuring device can have at least one means for smoothing or unifying the applied hot-melt adhesive, in particular a preferably heatable smoothing roller, and/or at least one means for structuring and/or profiling the applied hot-melt adhesive, in particular selected from the group of preferably heatable structure or profile rollers, structure or profile sheets, structure or profile papers and combinations thereof.

Furthermore, the production plant can also have at least one coating, laminating, painting and/or laminating device. The coating, lining, painting and/or laminating device can be arranged downstream of the filling and/or coating device or upstream of the cooling device or else downstream of the cooling device. On this basis, the surface can be further treated, for example by applying (decorative) foils, paintwork or the like.

On the basis of the production plant, coarse-grain wood-based material boards can be treated efficiently on their surface, in particular the flat side surface, with a hot-melt adhesive for sealing the underlying wood-based material boards, in particular based on the method according to the invention.

Also present is the use of at least one hot-melt adhesive, in particular as defined above, to increase the weather, UV and / or moisture resistance of a coarse particle board (OSB wood composite panel) and / or to equip a coarse particle board (OSB wood composite panel) with Description of application properties for outdoor use.

In this context, the use of at least one hot-melt adhesive, in particular as defined above, for evening out or leveling the surface, preferably the flat side surface, of a coarse particle board is also described here.

As mentioned above, the hot melt adhesive used as a basis for the uses described here is preferably a one-component hot melt adhesive and/or a reactive hot melt adhesive, in particular a one-component reactive hot melt adhesive.

As far as the uses described above are concerned, the hot-melt adhesive, in particular in the form of a hot-melt adhesive melt, can be applied to at least one surface, in particular the flat side surface, of the coarse chipboard material board in such a way that at least the unevenness, depressions, cavities, holes and/or Blowholes are at least essentially filled and/or filled with the hot-melt adhesive, in particular the hot-melt adhesive melt, in particular whereby the surface, preferably the flat side surface, is made more uniform and/or equal, in particular with the formation of at least one hot-melt adhesive filling.

Equally, it can be provided in the present uses that the hot-melt adhesive, in particular the hot-melt adhesive melt, is also applied in such a way that the surface, in particular the flat side surface, and/or the hot-melt adhesive filling is at least partially and/or in sections, preferably over the entire surface, is coated and/or filmed with the hot-melt adhesive, in particular with the hot-melt adhesive melt at least one hot-melt adhesive layer, in particular hot-melt adhesive cover layer, arranged on the surface, in particular flat-side surface, and/or on the hot-melt adhesive filling.

Another object of the present invention--according to a third aspect of the invention--is the use of at least one coarse chipboard material board, as defined above, for the different applications listed below.

The coarse-grain wood-based material board according to the invention, as defined above, is suitable for use as and/or for the production of, in particular, weatherproof, UV-resistant and/or moisture-resistant and/or decorative planking, cladding, facade elements, facade panels, structural elements and/or building panels, preferably in the area of wall, roof and/or floor constructions, in particular in the (construction) exterior area and/or (construction) interior area, preferably in the area of exterior and/or interior construction.

Furthermore, the coarse-grain wood-based material board according to the invention, as defined above, is suitable for use as and/or for the production of furniture and/or furniture elements and/or in particular decorative furniture boards, components, building boards, in particular in furniture, shop and/or trade fair construction, preferably in the area of wall, roof and/or floor structures.

In addition, the coarse-grain wood-based material board according to the invention, as defined above, is suitable for use as and/or for the production of packaging and/or transport elements and/or boards, packaging and/or transport devices that are particularly weatherproof, UV-resistant and/or moisture-resistant , in particular packaging and/or transport containers and/or crates, in particular in the transport and/or packaging sector.

Finally, the present invention relates - according to a fourth aspect of the invention - the building or facade element according to the invention, in particular building and / or facade panel, in particular with weather, UV and / or moisture-resistant and / or decorative properties, wherein the building and / or facade element has at least one coarse particleboard wood-based panel (OSB wood composite panel) having at least one surface treated with at least one hot-melt adhesive, in particular leveled, preferably flat side surface, in particular coarse particleboard wood-based panel (OSB wood composite panel) according to one of the preceding claims, or consists of it.

The present invention is explained in more detail below with reference to drawings and figure representations showing preferred exemplary embodiments. In connection with the explanation of these preferred exemplary embodiments of the present invention, which are in no way limiting in relation to the present invention, further advantages, properties and aspects and features of the present invention are also described.

Fig. 1

eine schematische Darstellung in Form eines Ablaufschemas einer erfindungsgemäßen Verfahrensführung gemäß einer erfindungsgemäßen Ausführungsform zur Behandlung, insbesondere Egalisierung, mindestens einer Oberfläche, vorzugsweise mindestens einer Flachseitenoberfläche, von Grobspan-Holzwerkstoffplatten;

Fig. 2

eine schematische Darstellung einer erfindungsgemäßen Produktionsanlage gemäß einer erfindungsgemäßen Ausführungsform zur Behandlung, insbesondere Egalisierung, mindestens einer Oberfläche, vorzugsweise mindestens einer Flachseitenoberfläche, von Grobspan-Holzwerkstoffplatten bzw. zur Durchführung des Verfahrens nach der vorliegenden Erfindung;

Fig. 3A

eine Querschnittsdarstellung einer unbehandelten GrobspanHolzwerkstoffplatte (OSB-Holzverbundstoffplatte);

Fig. 3B

eine Querschnittsdarstellung einer behandelten GrobspanHolzwerkstoffplatte unter Verwendung eines Schmelzklebstoffs verfüllter Flachseitenoberfläche (nicht erfindungsgemäß);

Fig. 3C

eine Querschnittsdarstellung einer gemäß dem erfindungsgemäßen Verfahren behandelten Grobspan-Holzwerkstoffplatte mit entsprechend verfüllter Flachseitenoberfläche und weiterem Auftrag eines Schmelzklebstoffs, insbesondere zur Ausbildung einer zusätzlichen Schmelzklebstoff-Schicht ;

Fig. 3D

eine Querschnittsdarstellung einer gemäß dem erfindungsgemäßen Verfahren behandelten Grobspan-Holzwerkstoffplatte gemäß einer wiederum weiteren Ausführungsform der vorliegenden Erfindung, wobei die aufgebracht Schmelzklebstoff-Schicht zusätzlich strukturiert bzw. profiliert ist.

In the figure representations shows

1

a schematic representation in the form of a flowchart of a method according to an embodiment of the invention for the treatment, in particular leveling, of at least one surface, preferably at least one flat side surface, of coarse chipboard panels;

2

a schematic representation of a production plant according to the invention according to an embodiment of the invention for the treatment, in particular leveling, of at least one surface, preferably at least one flat side surface, of coarse chipboard wood-based panels or for carrying out the method according to the present invention;

Figure 3A

a cross-sectional view of an untreated coarse particle board (OSB wood composite panel);

Figure 3B

a cross-sectional representation of a treated coarse chipboard using a hot-melt adhesive filled flat side surface (not according to the invention);

Figure 3C

a cross-sectional view of a coarse chipboard material board treated according to the method according to the invention with a correspondingly filled flat side surface and further application of a hot-melt adhesive, in particular to form an additional hot-melt adhesive layer;

3D

a cross-sectional representation of a coarse chipboard material panel treated according to the method according to the invention according to yet another embodiment of the present invention, wherein the hot-melt adhesive layer applied is additionally structured or profiled.

1 thus shows in the form of a flow chart the implementation of the method according to the invention for leveling at least one flat side surface of coarse chipboard wood-based panels or OSB wood composite panels according to an embodiment of the invention.

As part of the method according to the invention, at least one coarse particle board is first provided in accordance with step 1, the coarse particle board having at least one flat side surface with a large number of bumps, indentations, cavities, holes or blowholes, which are generally due to the shape and arrangement of the the coarse shavings on which the coarse shavings are based. This can also refer to the representation 3A to get expelled.

In the context of the method according to the invention, it can optionally be provided according to step 2 that a smoothing, in particular a grinding, preferably a calibration grinding of the flat side surface is carried out before the filling of the surface with the hot-melt adhesive. The associated removal of material can smooth out or reduce the unevenness, indentations, cavities, holes or blowholes on the flat side surface, which is beneficial in particular for the subsequent application of hot-melt adhesive, particularly with regard to reducing the amount of material used.

In addition, within the scope of the method according to the invention, the procedure can basically be such that, according to step 3, in particular after the provision or after the grinding of the coarse particle board and before the application of the hot-melt adhesive, the flat side surface or the coarse particle board as such is preheated . As a result, the wetting or penetration behavior of the hot-melt adhesive in the form of the hot-melt adhesive melt into the unevenness, depressions, cavities, holes or blowholes on which the surface is based can be improved.

In the context of the method according to the invention, it is also provided according to steps 4 and 5 to apply at least one hot-melt adhesive in the form of a hot-melt adhesive melt to at least the flat side surface of the coarse particle board. The procedure according to the invention is such that at least the bumps, depressions, cavities, holes or blowholes are at least essentially filled with the hot-melt adhesive or the hot-melt adhesive melt. This will causes in particular a smoothing or leveling of the flat side surface.

In this context, the hot-melt adhesive is applied in the form of the hot-melt adhesive melt within the scope of the method according to the invention in such a way that the hot-melt adhesive is first applied in the form of the hot-melt adhesive melt according to step 4 in such a way that the unevenness, depressions, cavities, holes or Blowholes are filled or filled with the hot-melt adhesive, in particular with the formation of a hot-melt adhesive filling, preferably hot-melt adhesive leveling filling, in particular accompanied by a corresponding evening out or leveling of the surface treated in this way. This can also refer to the representation Figure 3B to get expelled.

In addition, as part of the application of the hot-melt adhesive according to step 5, the procedure is such that the hot-melt adhesive is then applied in the form of the hot-melt adhesive melt in such a way that the flat side surface or the hot-melt adhesive filling is also at least partially or in sections, preferably over the entire surface is coated or filmed with the hot-melt adhesive, in particular on this basis a hot-melt adhesive layer arranged on the surface or on the hot-melt adhesive filling, in particular in the form of a hot-melt adhesive covering layer, can result. This can also refer to the representation Figure 3C to get expelled.

In addition, according to step 6, after the hot-melt adhesive melt has been applied, the applied hot-melt adhesive can be smoothed and/or structured or profiled, in particular when the hot-melt adhesive is not (completely) cooled or in particular not (completely) solidified.

According to the method according to the invention, according to step 7, cooling and solidification, in particular curing or allowing to solidify, of the hot-melt adhesive also optionally takes place. When using reactive hot-melt adhesives that are preferred according to the invention, the cooling and solidification also includes, in particular, (post-)crosslinking of the hot-melt adhesive used.

Finally, according to the invention, the procedure can be such that, according to step 8, in particular after cooling or solidification, a further surface finishing of the OSB panel equipped with the hot-melt adhesive is carried out takes place, for example by means of coating, lining, painting, laminating or the like.

Furthermore shows 2 in the form of a schematic representation of a production plant P according to the invention, the production plant P according to the invention according to the described embodiment according to the invention having at least one means A in the form of a grinding device, in particular for grinding, preferably calibration grinding, of the at least one surface, in particular the flat side surface, of the surface to be treated according to the invention Having coarse particle board.

The production plant P according to the invention can also, according to means B, optionally have at least one heating or temperature device, which is arranged in particular downstream of the grinding device.

In addition, the production plant P according to the invention according to means C has at least one filling or coating device for applying the hot-melt adhesive in the form of the hot-melt adhesive melt. The filling or coating device according to means C can be arranged in particular downstream of the heating or temperature control device according to means B.

According to the invention, it can also be provided that the production plant P has at least one surface treatment or structuring device according to means D and optionally at least one cooling device according to means E, which can each be arranged downstream of the filling and/or coating device.

Furthermore shows Figure 3A an untreated starting coarse-chip wood-based material panel 2 with a corresponding flat side surface, which has a large number of unevennesses, depressions, cavities, holes or blowholes to be filled.

Furthermore shows Figure 3B a treated coarse chipboard composite wood panel 1, in which the underlying starting coarse chipboard wood material panel 2 is filled using a hot-melt adhesive on the flat side surface, in particular to form a hot-melt adhesive filling 3a, accompanied by a corresponding evening out or leveling of the flat side surface (not according to the invention).

Figure 3C shows a coarse particle board 1 treated according to the method according to the invention, after which the treated coarse particle board 1 additionally has a further hot-melt adhesive layer 3b, which is applied to the flat side surface of the underlying coarse particle board 2 or to the hot-melt adhesive filling 3a.

Finally shows 3D another coarse particle board 1 according to the invention, in which, in addition to the embodiment according to Figure 3C the additionally applied hot-melt adhesive layer 3b is profiled or structured.

Further configurations, modifications, variations, modifications, special features and advantages of the present invention can be readily recognized and implemented by a person skilled in the art when reading the description, without departing from the scope of the present invention.

The present invention is also illustrated by the following exemplary embodiments, but without restricting the present invention thereto.

Examples:

Various coarse particleboards are produced, namely coarse particleboards according to the present invention on the one hand and comparative coarse particleboards on the other hand, the respective coarse particleboards being produced as described below:
To produce coarse particleboard wood-based panels according to the invention and treated on their flat side surface, different hot-melt adhesive systems in the form of the respective hot-melt adhesive melt are applied to an underlying untreated coarse particleboard wood-based panel, with a corresponding production system being used for this purpose, which has a filling or coating device based on hotmelt adhesive -Applicator rollers with squeegee system included. The hot-melt adhesive is applied to the preheated panels at temperatures above the softening point or above the melting point of the hot-melt adhesive used, to the extent that, in addition to complete filling of the unevenness, depressions, cavities, holes or blowholes on the flat side surface, there is also complete filling Coating in the form of a closed hot-melt adhesive layer on the surface of the treated panels. The procedure is such that first the hot-melt adhesive is applied as part of a first treatment step to fill the unevenness, depressions, cavities, holes and/or blowholes in question and then in a second process step the respective hot-melt adhesive is applied again to form the completely closed hot-melt adhesive layer becomes.

Subsequently, the applied hot-melt adhesive is smoothed and the applied hot-melt adhesive is cured or cooled in order to obtain the finished coarse particle board.

On this basis, coarse chipboard wood-based panels according to the invention are produced, in which on the one hand a reactive hot-melt adhesive in the form of PUR (OSB panel I according to the invention), POR (OSB panel II according to the invention) and on the other hand a non-reactive hot-melt adhesive in the form of EVA (inventive OSB panel III) is used.

In addition, corresponding comparative coarse-chip wood-based panels were produced, with treatment of the flat side surface or filling of the depressions, cavities, holes or blowholes on the one hand water-based paint system (comparative OSB panel IV) and on the other hand an organic solvent-based paint system (comparative OSB panel V) for filling the unevenness, indentations, cavities, holes or blowholes on the flat side of the respective coarse particleboard wood-based panels and for the subsequent application a further finishing layer can be used.

In contrast to the OSB panels according to the invention using the reactive or non-reactive hot-melt adhesive, roller application is not possible due to the non-optimal processing properties of both the water-based paint system and the paint system based on organic solvents. With regard to the comparison OSB panels IV and V, the paint system used in each case is consequently applied to the flat side surface by manual filling to fill the depressions, cavities, holes or blowholes in question. The respective paint system is then applied to obtain a corresponding final layer, with the respective paint system being applied to the flat side surface by spraying for this purpose.

After cooling or hardening or allowing to solidify, the OSB panels provided in this way are first evaluated visually with regard to the optical quality of the treated flat side surface, in particular with regard to a homogeneous formation of the applied layers, with the evaluation being based on the school grading system (i.e. evaluations of 1 = very good to 6 = insufficient).

The individual OSB panels are then subjected simultaneously and under identical conditions to an accelerated weathering test under defined humidity, wetness and temperature influences. A visual assessment is then carried out with regard to the quality of the surface or the condition of the respective OSB board as a whole, in particular with regard to swelling of the OSB board, surface texture, cracking or flaking of the applied filling or coating systems, the Here, too, evaluation is based on the school grading system.

The test results are summarized accordingly in the table below. OSB panel optical properties / quality of the treated surface before weathering Evaluation after weathering (1 month) Evaluation after weathering (3 months) OSB panel I PUR, reactive (according to the invention) 1 1 1 OSB panel II POR, reactive (according to the invention) 1 1 2 OSB panel III EVA, non-reactive (according to the invention) 1-2 3 3-4 OSB panel IV water-based paint system (comparison) 2-3 4-5 6 OSB panel V Lacquer system based on organic solvents (comparison) 2-3 4 6

The results listed in the table show that the OSB boards according to the invention have overall improved surface qualities, also with regard to the optical properties, with the OSB boards according to the invention achieving a permanent and uniform filling of the unevenness, depressions, cavities, holes or Blowholes are guaranteed using mechanical methods. In addition, the OSB panels according to the invention have significantly improved weathering behavior. On the basis of the present invention, coarse chipboard panels treated overall on their surface, in particular the flat side surface, are provided which, with greater homogeneity and durability of the surface, also have increased long-term and weathering resistance.

Claims (13)

1. A method of levelling at least one flat side surface of coarse wood-chip boards (coarse chip wood-based panels),
   the method comprising the following steps in the order indicated:

   a) providing at least one coarse wood-chip board, said coarse wood-chip board having at least one flat side surface with a plurality of unevennesses, depressions, cavities, holes and/or voids (blowholes); then

   b) applying at least one hot-melt adhesive in the form of a hot-melt adhesive melt to the flat side surface of the coarse wood-chip board, wherein

   b1) first, the hot-melt adhesive melt is applied in such a way that the unevennesses, depressions, cavities, holes and/or voids are filled and/or backfilled with the hot-melt adhesive, in particular with the formation of at least one hot-melt adhesive filling, preferably hot-melt adhesive levelling filling, wherein a levelling and/or equalization of the flat side surface is effected, and,

   b2) subsequently, the hot-melt adhesive melt is applied in such a way that the flat side surface and/or the hot-melt adhesive filling is additionally coated and/or filmed with the hot-melt adhesive melt at least partially and/or in sections, preferably over the entire surface, resulting in at least one hot-melt adhesive layer, in particular hot-melt adhesive covering layer, arranged on the flat side surface and/or on the hot-melt adhesive filling;

   wherein step b1) is carried out first, followed by cooling and solidification of the hot-melt adhesive, and then step b2) is carried out;

   c) cooling and solidification of the hot-melt adhesive melt after carrying out step b2).
2. The method according to claim 1,

   wherein for the filling and/or backfilling of the unevennesses, depressions, cavities, holes and/or voids, in particular for the formation of the hot-melt adhesive filling, and/or in step b1), on the one hand, and for the coating and/or filming of the flat side surface and/or the hot-melt adhesive filling, and/or in step b2), on the other hand, in each case the same hot-melt adhesive is used and/or in each case identical hot-melt adhesives, in particular as defined below, are used, or hot-melt adhesives different from one another are used; and/or

   the hot-melt adhesive being a thermoplastic and/or single-component hot-melt adhesive, in particular a single-component hot-melt adhesive.
3. The method according to claim 1 or 2,

   wherein the hot-melt adhesive is a reactive hot-melt adhesive, in particular a thermoplastic and/or single-component reactive hot-melt adhesive, preferably a single-component reactive hot-melt adhesive;

   in particular wherein the reactive hot-melt adhesive is a moisture-crosslinking, heat-crosslinking and/or radiation-crosslinking hot-melt adhesive, in particular a moisture-crosslinking and/or radiation-crosslinking, preferably a moisture-crosslinking hot-melt adhesive; and/or

   in particular wherein the reactive hot-melt adhesive has chemically reactive groups, in particular wherein the chemically reactive groups are selected from isocyanate groups, silane groups, epoxide groups and reactive double or multiple bonds as well as combinations thereof, preferably isocyanate groups and silane groups, and/or in particular wherein the chemically reactive groups are terminal; and/or

   in particular wherein the reactive hot-melt adhesive is selected from the group of (i) reactive, in particular moisture-crosslinking polyurethanes, preferably isocyanate-group-functionalized polyurethanes and/or isocyanate-group-containing polyurethanes, preferably isocyanate-terminated polyurethanes; (ii) reactive, in particular moisture-crosslinking polyolefins, preferably silane-group-functionalized and/or silane-group-containing polyolefins, preferably silane-group-grafted polyolefins; (iii) reactive, in particular radiation-crosslinking, preferably UV-crosslinking poly(meth)acrylates, preferably urethane-group-functionalized and/or urethane-group-containing poly(meth)acrylates; and mixtures and combinations thereof, particularly preferably from the group consisting of (i) reactive, in particular moisture-crosslinking polyurethanes, preferably isocyanate-group-functionalized and/or isocyanate-group-containing polyurethanes, preferably isocyanate-terminated polyurethanes; (ii) reactive, in particular moisture-crosslinking polyolefins, preferably silane-group-functionalized and/or silane-group-containing polyolefins, preferably silane-group-grafted polyolefins; and mixtures and combinations thereof.
4. The method according to any one of the preceding claims,

   wherein the hot-melt adhesive is a non-reactive hot-melt adhesive, in particular a thermoplastic and/or single-component non-reactive hot-melt adhesive, preferably a single-component non-reactive hot-melt adhesive.

   in particular wherein the non-reactive hot-melt adhesive is selected from the group of (i) ethylene vinyl acetates; (ii) polyolefins, in particular polyethylenes, polypropylenes and atactic polyolefins; (iii) polyamides; (iv) thermoplastic polyurethanes; (v) polyurethanes; (vi) (meth)acrylates; (vii) polyesters; and mixtures and combinations thereof, particularly preferably from the group of (i) ethylene vinyl acetates; (ii) polyolefins; (iii) polyamides; (iv) thermoplastic polyurethanes; and mixtures and combinations thereof.
5. The method according to any one of the preceding claims,
   wherein the hot-melt adhesive is polylactic acid.
6. The method according to any one of the preceding claims,
   wherein the hot-melt adhesive comprises or consists of a mixture and/or combination of at least two mutually different hot-melt adhesives, in particular as defined above.
7. The method according to any one of the preceding claims,
   wherein the hot-melt adhesive comprises or consists of a mixture and/or combination of at least one reactive hot-melt adhesive, in particular as previously defined, and at least one non-reactive hot-melt adhesive, in particular as previously defined.
8. The method according to any one of the preceding claims,
   wherein the hot-melt adhesive melt is applied to the surface, in particular flat side surface, by means of spraying and/or nozzle application, doctoring (blading), roller application, printing process and/or extrusion, in particular by means of spraying and/or nozzle application and/or roller application, preferably roller application.
9. The method according to any one of the preceding claims,
   wherein the hot-melt adhesive melt is applied to the flat side surface at a temperature in the range from 40 °C to 300 °C, in particular in the range from 60 °C to 250 °C, preferably in the range from 80 °C and 220 °C, more preferably in the range from 90 °C to 200 °C, particularly preferably in the range from 95 °C to 190 °C.
10. A coarse wood-chip board (coarse chip wood-based panel) comprising at least one levelled flat side surface, the flat side surface having a plurality of unevennesses, depressions, cavities, holes and/or voids, the unevennesses, depressions, cavities, holes and/or voids being filled and/or backfilled with at least one hot-melt adhesive, in particular in such a way that there is a levelling and/or equalization of the flat side surface,

    the coarse wood-chip board having at least one hot-melt adhesive filling, in particular hot-melt adhesive levelling filling, arranged on the flat side surface, the hot-melt adhesive filling being designed in such a way that the unevennesses, depressions, cavities, holes and/or voids are filled and/or backfilled with the hot-melt adhesive,

    characterized in that

    the coarse wood-chip board has at least one hot-melt adhesive layer, in particular hot-melt adhesive covering layer, arranged on the flat side surface and/or on the hot-melt adhesive filling, the hot-melt adhesive layer being designed in such a way that the flat side surface and/or the hot-melt adhesive filling is coated and/or filmed with the hot-melt adhesive at least partially and/or in sections, preferably over the entire surface.
11. The coarse wood-chip board according to claim 10,
    wherein the hot-melt adhesive is applied in an amount in the range from 10 g/m² to 2,000 g/m², particularly in the range from 25 g/m² to 1,500 g/m², preferably in the range from 50 g/m² to 1,000 g/m², more preferably in the range from 75 g/m² to 800 g/m², particularly preferably in the range from 100 g/m² to 600 g/m², based on the flat side surface.
12. Use of at least one coarse wood-chip board as defined in claim 10 or 11,

    as and/or for the production of, in particular, weather-resistant, UV-resistant and/or moisture-resistant and/or decorative coverings (plankings), claddings (panelings), facade elements, facade panels, construction elements and/or construction panels, preferably in the area of wall, roof and/or floor structures, in particular in the exterior and/or interior, preferably in the area of exterior and/or interior construction; and/or

    as and/or for the production of furniture and/or furniture elements and/or in particular decorative furniture panels, building elements, building panels, in particular in furniture, store and/or trade fair construction, preferably in the area of wall, roof and/or floor structures; and/or

    as and/or for the manufacture of, in particular, weather-resistant, UV-resistant and/or moisture-resistant packaging and/or transport elements and/or panels, packaging and/or transport devices, in particular packaging and/or transport containers and/or boxes, in particular in the transport and/or packaging sector.
13. Building and/or facade element, in particular building and/or facade panel, in particular with weather-resistant, UV-resistant and/or moisture-resistant and/or decorative properties, wherein the building and/or facade element comprises or consists of at least one coarse wood-chip board according to claim 10 or 11.

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