EP3290175A1 - Procede de traitement de surfaces en bois - Google Patents

Procede de traitement de surfaces en bois Download PDF

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Publication number
EP3290175A1
EP3290175A1 EP16187043.1A EP16187043A EP3290175A1 EP 3290175 A1 EP3290175 A1 EP 3290175A1 EP 16187043 A EP16187043 A EP 16187043A EP 3290175 A1 EP3290175 A1 EP 3290175A1
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EP
European Patent Office
Prior art keywords
melt adhesive
hot melt
adhesive
range
hot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP16187043.1A
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German (de)
English (en)
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EP3290175B1 (fr
Inventor
Rüdiger ERNST
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jowat Se
Original Assignee
Jowat Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to HUE16187043A priority Critical patent/HUE062013T2/hu
Priority to FIEP16187043.1T priority patent/FI3290175T3/fi
Priority to EP16187043.1A priority patent/EP3290175B1/fr
Priority to PL16187043.1T priority patent/PL3290175T3/pl
Priority to PT161870431T priority patent/PT3290175T/pt
Application filed by Jowat Se filed Critical Jowat Se
Priority to ES16187043T priority patent/ES2941275T3/es
Priority to US15/692,344 priority patent/US10532487B2/en
Publication of EP3290175A1 publication Critical patent/EP3290175A1/fr
Application granted granted Critical
Publication of EP3290175B1 publication Critical patent/EP3290175B1/fr
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N7/00—After-treatment, e.g. reducing swelling or shrinkage, surfacing; Protecting the edges of boards against access of humidity
    • B27N7/005—Coating boards, e.g. with a finishing or decorating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/007—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2203/00—Other substrates
    • B05D2203/20—Wood or similar material

Definitions

  • the present invention relates to the technical field of wood-based materials in the form of coarse-particle wood panels or OSB-wood composite panels and their processing or treatment.
  • the present invention relates to a process for the treatment, in particular equalization, of at least one surface, preferably at least one flat-side surface, of coarse-particle wood-based panels or OSB-wood composite panels.
  • the present invention also relates to a chipboard wood fiberboard panel which is obtainable according to the method of the present invention or which has at least one treated, especially leveled surface, preferably flat side surface.
  • the present invention additionally relates to a production plant for the treatment, in particular equalization, of at least one surface, preferably of at least one flat side surface, of coarse chip wood-based panels or for carrying out the method according to the present invention.
  • the present invention relates to a use of at least one hot melt adhesive for increasing the weathering, UV or moisture resistance of a chipboard wood-based panel or for equipping a chipboard-wood-based panel with application properties for outdoor use.
  • the present invention furthermore also relates to a use of at least one hotmelt adhesive for equalizing or leveling the surface, preferably flat side surface, of a coarse chip wood-based panel.
  • the present invention also relates to the use of at least one coarse chip wood-based panel according to the invention as or for the production of skins, cladding, facade elements, facade panels, building elements or structural panels in particular in the (construction) outside or (construction) interior or of Furniture or furniture elements, furniture panels, building elements or construction panels, in particular in furniture, shop and exhibition construction or of packaging and transport elements or plates in particular in the transport, logistics or packaging sector.
  • the present invention also relates to building or facade elements as such, which have at least one coarse chip wood-based panel according to the invention or consist thereof.
  • Wood-based panels are generally plate-shaped materials, which are obtained by crushing wood and then joining it together or pressing the wood-based structural elements or wood particles are produced.
  • the size and shape of the wood particles determine the type of wood-based material and its properties.
  • the wood particles underlying the plates can thereby be connected to one another using binders as well as via mechanical connections (eg mutual interlocking or interlocking of the wood particles during pressing).
  • the product portfolio of many manufacturers of wood-based panels here include plate types in the form of chipboard, wood fiber boards, such. B.
  • MDF m edium d ensity F aserplatten
  • HDF h igh D ensity F aserplatten
  • DHF boards d iffusionsoffene H olz f aserplatten
  • OSB wood composite panels or . riented- O S trand boards or O riented- S comptural- oards B.
  • the coarse-chip wood-based panels or OSB-wood composite panels in question are generally panel-shaped wood-based panels, which are produced using relatively large, elongated chips.
  • Rough-chip wood-based panels are used extensively, especially in the construction industry, and can be produced, for example, in the course of chip preparation from debarked roundwood in the longitudinal direction by rotating blades elongated chips, in which by subsequent drying, the natural moisture is reduced at high temperatures.
  • a gluing of the chips can be carried out, wherein subsequent to the production of the actual OSB plate, the pretreated chips, for example, first longitudinally and transversely oriented or scattered, for example, in the throwing process, so that, for example, a crosswise and the structural stability-increasing layer structure is created.
  • the coarse-particle wood-based panels are generally produced under high pressure and high temperature, in particular on continuous presses.
  • Rough-chip wood-based panels are generally distinguished from other panel systems, such as MDF panels, by increased flexural strength, which is particularly caused by the use of the relatively large and elongated chips.
  • coarse chip wood-based panels are often used in the context of construction applications as structural panels in the shell and interior design as wall or Dachbeplankung. In the floor area, for example, they serve as installation panels, in which case, for example, panels with tongue and groove profiles are used.
  • the in question coarse chipboard panels are generally used as formwork panels for concrete or the like.
  • chipboard and HDF or MDF fiberboard which generally have a relatively smooth or flat surface
  • an irregular structuring or shaping of the surface and in particular the flat side surface with sometimes large bumps, cavities or Wells or the like which is particularly caused by the relatively large and irregular shaped wood chips, such as those used for the production of coarse wood-based panels.
  • Due to the existing in particular in the flat side surface of the chipboard wood panels unevenness, cavities or depressions is often no optimal dimensional stability of the underlying plates given, especially since the surface is difficult to equalize due to the sometimes large depressions and bumps, for example, by grinding or the like. It is also noteworthy that the unevenness, depressions or cavities or the like in question can extend through the entire plate.
  • a peculiarity of coarse wood-wood boards or OSB wood composite panels thus lies in the underlying Spangeometrie, which is accompanied on the one hand with corresponding advantages, for example, in terms of high bending strength, but also with the fundamental disadvantage that the ready-to-use product in the form of OSB board a strongly irregular or non-homogeneous shaping of the surface is present, since due to the coarse-chip structure and the spacing of the chips sometimes considerable unevenness, depressions, cavities or the like also in the region of the surface of the underlying plate.
  • the irregular texture of the surface described above Due to the irregular texture of the surface described above, coarse-particle wood-based panels are weathering resistant only to a limited extent, especially since moisture can easily penetrate into the cavities of the plate.
  • the irregular surface also has disadvantages in terms of a further compensation, such as a homogeneous coating or the like.
  • OSB panels have not been sufficiently suitable or inaccessible for further (surface) tempering steps. Also, therefore, coarse chipboard panels are used almost exclusively for such construction applications, which are mainly not in the immediate field of vision.
  • Another approach for equalization of surfaces in wood-based panels is also in the partial backfilling, for example, knotholes or cracks in individual layers of sheet composite materials such.
  • Such an approach has in particular a sometimes only low throughput, which is disadvantageous in particular with a high number of depressions or unevenness, so that the underlying process can often not be operated economically.
  • Another approach is to fill depressions or unevennesses in the surface of wood-based panels using water-based or solvent-based filler systems.
  • the use of such systems does not always lead to satisfactory product properties, especially since water-based filling systems can cause the chips of the wood-based panels to swell during processing due to the high proportion of water, which is disadvantageous in terms of surface properties and in particular can lead to significant visual restlessness in the surface .
  • water-based systems generally lead, after re-drying, to a volume shrinkage of the order of magnitude of the volume of water previously contained. A level or uniform surface can thus not be achieved in one step, so that expensive post-treatments for leveling the surface are required.
  • solvent-based systems that are produced using organic solvents, high demands on job security, especially with regard to the prevention of emissions, and also the subsequent disposal or re-use of organic solvents, for example in the form of thermal utilization, for example by post-combustion or the like, is sometimes not optimal for economic reasons.
  • the concerns EP 1 749 587 A1 or belonging to the same patent family DE 10 2005 036 579 A1 a building board from one Wood material, which consists of at least three layers of scattered and pressed, resin-coated chips, with an upper cover layer and a lower cover layer, wherein at least the upper cover layer has a surface unevenness filling coating consisting of a water-based paint with additives or fillers.
  • the approaches known in the prior art for the treatment or leveling of the surfaces of wood-based panels do not always lead to the desired product properties, and the approaches present in the prior art are often also not always optimal from a cost point of view.
  • the approaches or methods present in the prior art often can not be used for special wood-based panels in the form of coarse-particle wood panels or OSB-wood composite panels, since OSB-wood composite panels have very special material properties, in particular with regard to the presence of sometimes large or large-volume unevenness, depressions, cavities, holes or voids in the plate surface.
  • a process or a corresponding production plant for the treatment, in particular equalization, of a surface, in particular a flat side surface, of coarse chip wood-based panels or OSB wood composite panels the disadvantages described above and Insufficiencies of the prior art, at least largely avoided or at least mitigated.
  • corresponding coarse chip wood-based panels are to be provided in a technically efficient manner, which have an optimally leveled or filled surface.
  • Hollow spaces, holes or voids or the like in the area of the surface or flat side surface of coarse chip wood-based panels are sustained or effectively compensated or filled.
  • an object of the present invention is to provide a method and a suitable method for carrying out this process plant, with which a surface treatment especially of coarse wood-wood panels is to be made possible, so that therefore also the product properties of the so-treated coarse chipboard panels in particular also with regard to the provision of weathering, UV and temperature resistance, be further improved, along with an increase in the range of use of the so-treated coarse chip wood-based panels.
  • a still further object of the present invention is also to provide coarse-particle wood-based panels as such, which have a resistant and durable and uniform filling or coating of the unevennesses, depressions, cavities, holes or voids, which are arranged in the region of the surface.
  • the coarse chip wood-based panels provided according to the invention should also have further improved product properties, in particular improved (surface) properties, compared with such wood-based panels of the prior art.
  • the object underlying the present invention is achieved - according to a first aspect of the present invention - by a process for the treatment, in particular equalization, of at least one surface, preferably at least one flat side surface, of coarse chip wood-based panels (OSB wood composite panels) according to claim 1.
  • advantageous embodiments of the method according to the invention are the subject of related method claims.
  • Another object of the present invention - according to a second aspect of the invention - is the inventive chipboard wood composite panel or OSB wood composite panel as such, which is obtainable according to the method according to the invention or which has a treated, especially leveled surface, preferably flat side surface, according to the independent claims in this regard. Further, advantageous embodiments of the coarse chip wood-based panel according to the invention are the subject of the relevant subclaims.
  • Another object of the present invention - according to a third aspect of the invention - is also the production plant for the treatment, in particular leveling, at least one surface, preferably at least one flat side surface of coarse particleboard as defined in the independent claim concerned and the production plant.
  • Yet another object of the present invention - according to a fourth aspect of the invention - is also the use of at least one hot melt adhesive or a melting and / or sealing compound to increase the weathering, UV or moisture resistance of a chipboard wood board or to equip a coarse chip Engineered wood panel having outdoor application properties as defined in the corresponding independent use claim.
  • the present invention also relates - according to a fifth aspect of the invention - the use of at least one hot melt adhesive or a sealing and / or sealing compound for equalization of the surface, preferably the flat side surface, a coarse chip wood-based panel, as in this use defined independent claim.
  • another object of the present invention - according to a sixth aspect of the invention the inventive use of at least one coarse chipboard wood panel as or for the production of skins, cladding, facade elements, facade panels, building elements or construction panels in particular in (outdoor) construction or in ( Bau-) interior and beyond as or for the production of furniture or furniture elements or the like in furniture, shop or exhibition, and continue as or for the production of packaging or transport elements, especially in the transport or packaging area, such as in the independent claim relating to this use.
  • Another object of the present invention - according to a seventh aspect of the invention - the building or façade element according to the invention as such, which comprises at least one coarse chip wood-based panel according to the invention or consists thereof, as defined in the relevant independent claim.
  • polymers referred to in the context of the present invention for the hot melt adhesive such that they may be in the form of homopolymers or copolymers, i.
  • the term polymers used in the present invention includes both homopolymers and copolymers (i.e., polymers of two or more different monomers).
  • the polymers can be present for example as random copolymers, alternating copolymers, gradient copolymers, block copolymers or graft copolymers.
  • polyolefin refers to olefin homopolymers (eg, polypropylene homopolymers or polyethylene homopolymers) or olefin copolymers (eg, ethylene / propylene copolymers), the term “polyethylenes” to both polyethylene homopolymers and Polyethylene copolymers, etc.
  • polymers also includes the use of functionalized polymers, in particular for increasing the functionality of the underlying hotmelt adhesive.
  • the present invention - according to a first aspect of the present invention - is thus a
  • the present invention thus aims to provide a special process, according to which in a targeted manner a treatment, in particular equalization or leveling, in particular the flat side surface (s) of coarse chipboard panels using a special filling or coating composition in the form of a hot melt adhesive or .
  • a melt and / or sealant is carried out, wherein the hot melt adhesive or the melt and / or sealant in particular in the form of a hot melt adhesive or in the form of a melt for backfilling the bumps in question or the like to be treated Surface is applied.
  • a hot melt adhesive is associated with both process and product specific advantages.
  • a technically and economically optimized procedure a durable and provided with excellent adhesion to the substrate in the form of OSB board filling the surface of a coarse particle board can be realized, which modified based on the method according to the invention or with the hot melt adhesive coated surface and thus the inventively obtained coarse chipboard wood panels as such, in addition to improved optical properties also has sustainably improved product properties in terms of increased weathering, UV and moisture resistance.
  • the OSB board obtained according to the invention also has an increased resistance to chemicals.
  • a sustainable surface seal of the OSB board is provided, so that, for example, moisture, chemicals, dirt or the like, can not penetrate into the underlying OSB board and thus the organic wood components are protected from external influences, along with an improved Storage and weathering resistance.
  • the inventively provided plate systems are also suitable for use in (indoor) interior, for example, with regard to laid in the field of vision wall and floor systems with improved resistance to moisture, wear and dirt.
  • the coarse-particle wood-based panels according to the invention are also accessible to further surface treatment, in particular with respect to full-surface lamination, lacquering, lamination or the like, so that visually appealing and overall smooth or even surface textures are achieved as well
  • the underlying composite is mechanically stabilized.
  • the thus coated coarse chip wood-based panels can thus be with good optical Coating in particular over the entire surface, in particular painting, laminating or laminating, so that a particular permanent full-surface composite results, which is guaranteed even after separation or trimming the coarse particle board at any point a cut plate, which, for example, with regard to the provision of Fixed dimensions in furniture and interior design is of high relevance.
  • the coarse chip wood composite panels of the present invention may be further modified in surface area to provide tempered surfaces based on additional films such as condensation resin films such as melamine resin films and phenolic resin films, respectively the range of applications and applications of the coarse chip wood-based panels according to the invention in the furniture and construction sector continues to be increased, since in the context of the present invention, so to speak, products with completely novel and specifically adjustable product properties can be provided, as stated above.
  • additional films such as condensation resin films such as melamine resin films and phenolic resin films
  • inventive concept with the use of special hot melt adhesives for equalization or homogenization of the surface of a coarse chipboard panel enables further functionalization of the surface, for example with regard to antimicrobial equipment and the provision of electrical conductivity or conductivity, targeted optical (surfaces -) properties or the like.
  • a targeted structuring or profiling of the surface can be carried out on the basis of the hot melt adhesive applied to the flat side so that the coarse chip wood-based panels according to the invention can be equipped, for example, with anti-slip or anti-slip properties.
  • the targeted use of a hot-melt adhesive and its targeted selection and coordination thus ensure, as a result, that an optimized backfilling of the unevenness in the area of the surface, in particular flat side surface, is present, wherein, in addition, an optimized adhesion or adhesion of the used Filler material in the form of the hot melt adhesive to the underlying substrate in the form of the coarse chip wood-based panel is present.
  • a hotmelt adhesive a further optimized coating is also made possible with the maintenance of a particularly uniform or even surface of the coarse chipboard board.
  • Due to the specifically controllable elastomeric or thermoplastic properties is also a further structuring or profiling of the surface or a further coating with corresponding surface materials, such as decorative films or the like, possible, which can be applied, for example, to the coarse chip wood-based panel according to the invention.
  • the use of a hot melt adhesive to a process engineering optimization, especially with regard to the underlying equipment since the hot melt adhesive can be applied in a simple manner, especially under warming, wherein the hot melt adhesive used also at least substantially free of sometimes harmful solvents or The like is such that corresponding extraction devices or the like to remove any solvents can be omitted.
  • the hot melt adhesive when using a hot melt adhesive, no residual chemicals or wastes, which are sometimes difficult to dispose of, are obtained. Due to the high flowability and at least substantially dehydration-free even deeper or larger bumps can be completely and permanently filled.
  • VOCs volatile organic compounds
  • the water vapor permeability of the OSB board can be selectively adjusted or reduced, so that the coarse chip wood-based panels according to the invention also can serve the function of a vapor barrier, which allows their use, for example, in the wet or sanitary area.
  • the SD value (water vapor diffusion-equivalent air layer thickness) of the coarse chip wood-based panel according to the invention is improved or correspondingly increased, so that the coarse chip wood-based panels according to the invention likewise have an improved moisture protection, since the panels in question have a diffusion-inhibiting or diffusion-tight design can be.
  • the water vapor diffusion-equivalent air layer thickness represents a building physics measure for the water vapor diffusion resistance of a component or a component layer and thus defines its property as a vapor barrier.
  • the targeted use of hotmelt adhesives makes it possible to compensate for unevenness or the like on the OSB board, wherein the resulting coating may optionally also have a certain elasticity.
  • a hotmelt adhesive in particular in combination with the other measures according to the invention, thus provides overall an efficient process for the compensation or treatment of the surface (s), in particular flat side surface (s), of coarse chipboard wood panels, which with high process economy and thus outstanding Cost efficiency to sustainably improved products in the form of appropriately treated coarse chipboard panels with tailor-made properties, as stated above leads.
  • the hotmelt adhesive in particular the hotmelt adhesive melt
  • the hotmelt adhesive, in particular the hotmelt adhesive melt should be applied to the surface, in particular the flat side surface, at least substantially continuously and / or without interruption.
  • the unevennesses, depressions, cavities, holes and / or voids are at least substantially completely filled or filled with the hotmelt adhesive. This ensures an efficient homogenization or leveling of the surface.
  • the order of the hot melt adhesive, in particular the hot melt adhesive melt, repeated or the amount of hot melt adhesive applied can be adjusted or adjusted accordingly.
  • the hotmelt adhesive in particular the hotmelt adhesive melt, in an amount in the range of 10 g / m 2 to 2,000 g / m 2 , in particular in the range of 25 g / m 2 to 1,500 g / m 2 , preferably in the range from 50 g / m 2 to 1,000 g / m 2 , preferably in the range from 75 g / m 2 to 800 g / m 2 , particularly preferably in the range from 100 g / m 2 to 600 g / m 2 , based on the surface , in particular flat side surface, are applied.
  • hotmelt adhesive as such has no further additives or additives or the like, in particular as defined below, have become appropriate order quantities in the range of 80 g / m 2 to 120 g / m 2 proven.
  • application rates in the range from 150 g / m 2 to 200 g / m 2 are preferred.
  • the hotmelt adhesive in particular the hotmelt adhesive melt
  • the hotmelt adhesive is applied such that the unevennesses, depressions, cavities, holes and / or voids with the hotmelt adhesive, in particular forming at least one hotmelt adhesive filling , in particular hot melt equalization filling, filled and / or filled.
  • the unevenness, depressions, cavities, holes and / or voids can be at least substantially completely filled with the hotmelt adhesive and / or filled.
  • the unevennesses, depressions, cavities, holes and / or voids to at least 30%, in particular at least 50%, preferably at least 70%, preferably at least 80%, particularly preferably at least 90% , particularly preferably at least 95%, very particularly preferably at least 98%, based on the volume of the unevenness, depressions, cavities, holes and / or voids, filled with the hotmelt adhesive and / or filled.
  • the unevennesses, depressions, cavities, holes or voids which are in question are - without wishing to be limited to this theory - formed from the spaces generally resulting from the spacing of the irregularly shaped coarse chips of the coarse-particle wood-based panel.
  • the free spaces or imperfections in the region of the surface of the coarse chipboard are thus filled or closed with the hotmelt adhesive, in particular with the hotmelt adhesive melt, so that in particular a homogenization or leveling takes place on this basis the surface results in the form of a seal.
  • the surface of the underlying coarse chip wood-based panel is thus effectively closed with the hot melt adhesive, which is equally beside the equalization in question or leveling to form correspondingly improved properties in particular with regard to increased weathering, UV and / or moisture resistance of the thus treated Coarse chip wood-based panel leads.
  • the coarse chip forming or delimiting the unevennesses, depressions, cavities, holes and / or voids can protrude at least partially and / or in sections into the hot-melt adhesive filling.
  • the hot-melt adhesive filling may have a thickness in the range of 0.2 mm to 50 mm, in particular in the range of 0.5 mm to 25 mm, preferably in the range of 1 mm to 10 mm, preferably in the range of 1 mm to 5 mm , exhibit.
  • the abovementioned thickness specifications generally relate to the hot-melt adhesive filling layer, so to say interspersed with the coarse chip.
  • the hot-melt adhesive filling layer which may be obtained, for example, within the scope of a first application, that it may also have perforations with the coarse chip in question or if these as such are not completely uniform or leveled surface is formed.
  • the application of the hot melt adhesive can be repeated or the amount of hot melt adhesive to be applied can be increased.
  • at least one further hotmelt adhesive filling or a hotmelt adhesive layer, in particular hotmelt adhesive covering layer can be applied, for example in the context of a second hotmelt adhesive application.
  • the hot-melt adhesive filling in particular in the region of its surface, so to speak forms a closed melt adhesive layer and thus a uniformized or leveled (final) layer. This can be ensured, for example, by selecting correspondingly high application quantities of hotmelt adhesive.
  • the hotmelt adhesive in particular the hotmelt adhesive melt, for forming the hotmelt adhesive filling in an amount in the range of 5 g / m 2 to 1,000 g / m 2 , in particular in the range of 10 g / m 2 to 800 g / m 2 , preferably in the range of 20 g / m 2 to 600 g / m 2 , preferably in the range of 40 g / m 2 to 600 g / m 2 , particularly preferably in the range of 60 g / m 2 to 400 g / m 2 , based on the surface, in particular flat side surface is applied.
  • the hotmelt adhesive in particular the hotmelt adhesive melt
  • the hotmelt adhesive melt is also applied such that the surface, in particular flat side surface, and / or the hotmelt adhesive filling at least partially and / or in sections, preferably full surface, with the hot melt adhesive, in particular with the hotmelt adhesive melt, coated and / or filmed in particular such that at least one on the surface, in particular flat side surface, and / or arranged on the hot melt adhesive filling hot melt adhesive layer, in particular hot melt adhesive covering layer results.
  • the application of the hotmelt adhesive, in particular the hotmelt adhesive melt to form the hot melt adhesive layer in question can be carried out according to the invention, in particular in addition to the above-described application of the hot melt adhesive, in particular for the preparation of a Schmelzstoff spallung.
  • the particularly additionally applied hotmelt adhesive layer is in particular a final layer, the hotmelt adhesive layer preferably completely covering or sealing the surface, in particular the flat side surface, of the coarse chip wood-based panel.
  • the hot-melt adhesive layer is thus in particular a (final) layer to ensure a smooth or even and at least substantially completely sealed surface, in particular flat-side surface, of the coarse-particle wood-based panel.
  • the hot-melt adhesive layer can in principle also be produced at the same time or in a common process step with the application of the hot-melt adhesive filling, in which case the hot-melt adhesive filling on the one hand and hot melt adhesive on the other hand form a common layer or be present as a common layer.
  • the hot-melt adhesive layer can also be applied subsequently or in a separate process step, in particular wherein the hot-melt adhesive layer is then applied, so to speak, in the form of a postcoating or secondary filming.
  • the hot-melt adhesive layer can be formed at least substantially closed and / or at least substantially free of interruptions. Similarly, it may be provided according to the invention that the hot-melt adhesive layer has at least substantially no coarse chip forming or delimiting the unevennesses, depressions, cavities, holes or voids.
  • the hot-melt adhesive layer can thus be, in particular, a (covering) layer which has at least essentially only the hotmelt adhesive as such and / or.
  • the hotmelt adhesive layer may have a thickness in the range of 0.1 mm to 30 mm, in particular in the range of 0.2 mm to 20 mm, preferably in the range of 0.5 mm to 10 mm, preferably in the range of 0, 75 mm to 5 mm, particularly preferably in the range of 1 mm to 3 mm.
  • the above thickness specifications relate in particular to the hot-melt adhesive layer which is applied to the filled or filled hot melt adhesive OSB board.
  • the hotmelt adhesive in particular the hotmelt adhesive melt, can be used to form the hotmelt adhesive layer in an amount in the range from 5 g / m 2 to 1000 g / m 2 , in particular in the range from 10 g / m 2 to 800 g / m 2 , preferably in the range of 20 g / m 2 to 600 g / m 2 , preferably in the range of 40 g / m 2 to 600 g / m 2 , particularly preferably in the range of 60 g / m 2 to 400 g / m 2 , very particularly preferably in the range of 60 g / m 2 to 300 g / m 2 , based on the surface, in particular flat side surface applied.
  • the procedure is in particular such that initially filling and / or filling of the unevennesses, depressions, cavities, holes and / or voids with the hot melt adhesive, in particular the formation of the hot melt adhesive filling, or step b1), optionally followed by cooling and Solidifying the hot melt adhesive, and then the coating or filming of the surface, preferably flat side surface, in particular the formation of the hot melt adhesive layer, or step b2), optionally followed by cooling and solidification of the hot melt adhesive is performed.
  • the hot melt adhesives used according to the invention which are also referred to as hot-melt adhesives, hot-melt adhesives or hotmelts , are generally at least substantially solvent-free and solid at room temperature products which assume a flowable or liquid state when heated or when hot so that on this basis an order or an application on the underlying surface, in particular flat side surface, the coarse chip wood-based panel, for purposes of backfilling the bumps or the like, can take place.
  • the subsequent cooling with a concomitant hardening or curing of the hot melt adhesive is then the formation of a permanent backfilling or coating of the coarse chip wood-based panel on the thus treated surface of the OSB board.
  • the hot-melt adhesives used according to the invention are generally associated with the advantage of rapid processing and, at the same time, a low material price, and, as stated above, a wide variety of materials can additionally be used.
  • the hot melt adhesives used and the backings or coatings produced therewith are susceptible to subsequent processing or modification, for example in the context of further-reaching coatings, laminations, coatings or the like.
  • the hot melt adhesives used have a high resistance and resistance to weathering, UV radiation and moisture, which results in a corresponding manner to inventively provided coarse chipboard panels with improved properties.
  • the hot-melt adhesive is a thermoplastic or one-component hot melt adhesive, in particular a one-component hot melt adhesive (1K hot melt adhesive).
  • the hot melt adhesive should be at least substantially water and / or solvent free.
  • the hotmelt adhesive should have a water and / or solvent content of at most 10% by weight, in particular at most 5% by weight, preferably at most 2% by weight, preferably at most 1% by weight, particularly preferably at most 0. 5 wt .-%, most preferably at most 0.1 wt .-%, based on the hot melt adhesive having.
  • the processing properties of the invention used Improved hot melt adhesive. In particular, this ensures that the hot melt adhesive at least substantially does not penetrate into the fiber structure of the wood-based panel underlying wood chips, so that an undesirable swelling of the material is avoided.
  • the hotmelt adhesive is a reactive hotmelt adhesive, in particular a thermoplastic or one-component reactive hotmelt adhesive, preferably a one-component reactive hotmelt adhesive.
  • Reactive hot melt adhesives which are used according to the invention in a particularly preferred manner, are characterized in particular by the fact that they have chemically reactive functional groups, which in particular during and after application or application, for example, under the influence of heat, radiation or moisture to a (Post) crosslinking, whereby the adhesion or adhesive bond to the substrate in the form of the coarse chip wood-based panel is further improved.
  • the reactive hot melt adhesive is a moisture-crosslinking, heat-crosslinking or radiation-crosslinking hot-melt adhesive, in particular a moisture-crosslinking or radiation-crosslinking, preferably a moisture-crosslinking hot-melt adhesive.
  • Reactive hot melt adhesives thus have advantages in their application also to the effect that due to the chemical post-crosslinking and formation of chemical adhesive or contact compounds, a correspondingly cured reactive hot melt adhesive can not be melted by heat at least substantially, so that in this respect, a high resistance or Durability is present.
  • reactive hot melt adhesives in particular by the physical curing which precedes the postcrosslinking, are equally fast Processing properties without lengthy drying phases, which is associated with procedural advantages.
  • the reactive hot melt adhesive has chemically reactive groups.
  • the chemically reactive groups can be selected from isocyanate groups, silane groups, epoxide groups and reactive double or multiple bonds (especially CC double or multiple bonds, such as urethane groups with reactive double or multiple bonds, especially CC double or multiple bonds) and combinations thereof , preferably isocyanate groups and silane groups.
  • the chemically reactive groups are arranged terminally or terminally in the molecular skeleton of the reactive hot melt adhesive.
  • the chemically reactive groups in question lead in the context of the application of the hot melt adhesive, alike in order to be limited to this theory, to a defined (post-) crosslinking, even under formation of adhesive or contact compounds with the surface to be treated the coarse chip wood-based panel.
  • the reactive hotmelt adhesive is selected from the group of (i) reactive, especially moisture-crosslinking, polyurethanes (PUR), preferably isocyanate-functionalized and / or isocyanate-functional polyurethanes, preferably isocyanate-terminated polyurethanes; (ii) reactive, in particular moisture-crosslinking, polyolefins (POR), preferably polyolefin-functionalized and / or silane-containing polyolefins, preferably polyolefin-grafted polyolefins; (iii) reactive, in particular radiation-crosslinking, preferably UV-crosslinking poly (meth) acrylates, preferably urethane-functionalized and / or urethane-group-containing poly (meth) acrylates; as well as their mixtures and combinations, particularly preferably from the group of (i) reactive, in particular moisture-crosslinking, polyurethanes (PU), preferably isocyanate-
  • PUR polyurethanes
  • reactive hot melt adhesives in particular one-component reactive hot melt adhesives, such as in particular reactive, preferably moisture-curing polyurethanes (PUR), are characterized in total by a high UV stability coupled with high mechanical stability and strength.
  • PUR reactive, preferably moisture-curing polyurethanes
  • hot melt adhesives in question can in principle also be used in the continuous process or in the inline process, wherein the thus treated coarse chip wood-based panels are directly accessible to further processing, for example, a continuing coating with decorative films or the like.
  • the hot melt adhesives in question after cooling and solidification or after complete crosslinking due to the freedom from blockage are not tacky, so that no sometimes disadvantageous surface tackiness is present, but due to the reactive hot melt adhesives underlying material properties in general nevertheless high slip resistance or good anti-slip properties of the underlying surfaces are ensured.
  • thermoplastic phase the reactive hot melt adhesives in question in the thermoplastic phase, so to the final crosslinking of the adhesive, due to the residual tack, for example, with coating materials, such as (decorative) films or the like, are occupied.
  • coating materials such as (decorative) films or the like
  • particulate structures such as glitter for decorative purposes
  • the hotmelt adhesives or hotmelts used according to the invention are distinguished inter alia by the fact that they have a high flowability in the molten state and / or are at least substantially block-free after application or application on the surface, in particular flat side surface.
  • These properties have particularly with regard to the Nach- or Further processing or storage of inventively provided coarse chip wood-based panels proved to be advantageous.
  • the coarse chip wood-based panels provided according to the invention can be further processed or stored in a timely manner after the application of the hotmelt adhesive, without this resulting in undesired gluing or the like.
  • the hot melt adhesive is a non-reactive hot melt adhesive, in particular a thermoplastic and / or one-component non-reactive hot melt adhesive, preferably a one-component non-reactive hot melt adhesive.
  • Non-reactive hot-melt adhesives as can be used in the context of the present invention, generally have a short application or setting time.
  • the actual adhesion occurs significantly physically, due to the solidification of the applied hot-melt adhesive melt that occurs during the cooling of the applied hotmelt adhesive.
  • nonreactive hotmelt adhesives can generally be remelted after solidification.
  • the use of non-reactive hotmelt adhesives for example, in the context of the inventive concept, for example against the background of a subsequent coating or lamination of the inventively provided coarse chipboard board can be considered.
  • the non-reactive hot melt adhesive can be selected from the group of (i) ethylene vinyl acetates (EVA polymers); (ii) polyolefins (PO), especially polyethylenes (PE), polypropylenes (PP) and atactic polyolefins (APAO); (iii) polyamides (PA); (iv) thermoplastic polyurethanes (TPU); (v) polyurethanes (PU); (vi) (meth) acrylates; (vii) polyesters (PES); as well as their mixtures and combinations, more preferably from the group of (i) ethylene vinyl acetates (EVA polymers); (ii) polyolefins (PO); (iii) polyamides (PA); (iv) thermoplastic polyurethanes (TPU); as well as their mixtures and combinations.
  • EVA polymers ethylene vinyl acetates
  • PO polyolefins
  • PA polyamides
  • TPU thermoplastic polyurethanes
  • TPU polyure
  • the hot-melt adhesive is a hot-melt adhesive based on natural raw materials, in particular polylactic acid (PLA).
  • PLA polylactic acid
  • the hotmelt adhesive may comprise or consist of a mixture or combination of at least two mutually different hotmelt adhesives, in particular as defined above.
  • the hotmelt adhesive may comprise or consist of a mixture or combination of at least one reactive hotmelt adhesive, in particular as defined above, and at least one non-reactive hotmelt adhesive, in particular as defined above.
  • the corresponding application and product properties of the hot melt adhesive used can be adapted or tailored, in particular with regard to the respective application and application.
  • the sold by Jowat SE commercially available product Jowatherm reactant ® can be used as a reactive hot-melt adhesive 602.35, for example.
  • a non-reactive hot melt adhesive is a hot melt adhesive are used based on polyolefins, in particular in the form of equally displaced from the Jowat SE, commercially available product ® Jowatherm EP 60 287.90 .
  • a non-reactive EVA hot melt adhesive can be used in the form of 287.10 sold by Jowat SE commercially available product Jowatherm® ®.
  • the hot-melt adhesive used in the context of the present invention should be in the solid state at room temperature (20 ° C.) and ambient pressure (1013.25 hPa).
  • the hot melt adhesive should have a softening point and / or range, in particular determined by ring and ball, preferably determined according to DIN EN 1238: 2011-07, in the range of 30 ° C to 200 ° C, in particular in the range of 40 ° C to 100 ° C, preferably in the range of 50 ° C to 90 ° C, preferably in the range of 55 ° C to 80 ° C, have.
  • the hotmelt adhesive should have a softening point or range, in particular determined by ring and ball, preferably determined according to DIN EN 1238: 2011-07, of at least 30 ° C., in particular at least 40 ° C., preferably at least 50 ° C. at least 55 ° C, more preferably at least 60 ° C have.
  • the hotmelt adhesive preferably determines a melting point, in particular as determined by means of dynamic differential calorimetry (DDK) DIN 53765: 1994-03, in the range of 55 ° C to 275 ° C, in particular in the range of 65 ° C to 225 ° C, preferably in the range of 70 ° C to 175 ° C.
  • DDK dynamic differential calorimetry
  • the hotmelt adhesive has a processing temperature, in particular determined by means of dynamic differential calorimetry (DDK), preferably determined according to DIN 53765: 1994-03, in the range of 80 ° C. to 300 ° C., in particular in the range of 90 ° ° C to 250 ° C, preferably in the range of 95 ° C to 200 ° C, having.
  • DK dynamic differential calorimetry
  • the hotmelt adhesive should have a viscosity of the hot melt adhesive, in particular dynamic viscosity and / or in particular determined according to DIN EN ISO 3219: 1994-10 and / or in particular in the temperature range of 95 ° C to 200 ° C, in the range of 5,000 mPas to 150,000 mPas , in particular in the range of 7,500 mPas to 125,000 mPas, preferably in the range of 10,000 mPas to 100,000 mPas.
  • a viscosity of the hot melt adhesive in particular dynamic viscosity and / or in particular determined according to DIN EN ISO 3219: 1994-10 and / or in particular in the temperature range of 95 ° C to 200 ° C, in the range of 5,000 mPas to 150,000 mPas , in particular in the range of 7,500 mPas to 125,000 mPas, preferably in the range of 10,000 mPas to 100,000 mPas.
  • the hotmelt adhesive should have a density p, in particular determined at a temperature of 20 ° C and / or in particular determined according to DIN 51757: 2011-01, in the range of 0.5 g / cm 3 to 2.5 g / cm 3 , in particular in the range of 0.6 g / cm 3 to 2.3 g / cm 3 , preferably in the range of 0.7 g / cm 3 to 2.1 g / cm 3 , preferably in the range of 0.8 g / cm 3 to 2 g / cm 3 .
  • the hotmelt adhesive after its application and / or after its cooling and solidification, in particular curing and / or solidification, at least substantially free from block.
  • the hotmelt adhesive has thermoplastic and / or elastomeric properties after it has been applied and / or after it has been cooled and solidified, in particular hardening and / or solidifying.
  • the abovementioned properties or parameters of the hotmelt adhesive used according to the invention lead in particular to application- or processing-specific properties and advantages, in particular with regard to the melting behavior, the flowability and the application behavior on the coarse chip wood-based panel to be treated.
  • the hotmelt adhesive may comprise at least one adhesion promoter or primer.
  • the primer may be selected from the group of silicas, silanes, silicas, silicas, and mixtures and combinations thereof.
  • the hot-melt adhesive may contain the adhesion promoter or primer in amounts in the range from 1% by weight to 30% by weight, in particular in the range from 2% by weight to 20% by weight, preferably in the range from 5% by weight. % to 10 wt .-%, based on the hot melt adhesive included.
  • the hotmelt adhesive used can, for example, be provided with corresponding properties for lamination, lamination, coating, lacquering or the like, optionally subsequent to the surface treatment of the coarse chip wood-based panel.
  • the hotmelt adhesive can have a primer function in the case of substrates which are difficult to bond or the function of a primer for subsequent coatings or the like, for example with regard to the use of mineral or synthetic resin-based coatings, such as corresponding plasters or the like.
  • the porosity of the surface of the hot melt adhesive filling or hot melt adhesive layer can be adjusted in a targeted manner by using an adhesion promoter or primer.
  • the hotmelt adhesive may additionally comprise at least one nonreactive polymer, resin and / or wax, in particular a natural, synthetic or chemically modified (semi-synthetic) wax.
  • the hotmelt adhesive may comprise the non-reactive polymer, resin or wax in amounts ranging from 0.5% to 15% by weight, more preferably in the range of from 1% to 10% by weight, preferably in the range of 1.5 wt .-% to 5 wt .-%, based on the hot melt adhesive included.
  • the flowability of the hot melt adhesive can be adjusted further, which leads in particular to improved application properties when applying the hot melt adhesive to the surface, in particular flat side surface, the coarse chipboard board.
  • the hot melt adhesive may have at least one functionalization component.
  • the functionalization component are selected from the group of electrically conductive substances, antimicrobial, antifungal and / or fungicidal substances and their mixtures and combinations.
  • the hot melt adhesive may comprise the functionalization component in amounts ranging from 0.1% to 10%, more preferably in the range of from 0.2% to 5%, preferably in the range of 0.5% Wt .-% to 3 wt .-%, based on the hot melt adhesive included.
  • the hotmelt adhesive may comprise at least one dye or at least one color pigment.
  • the hotmelt adhesive or the color pigment may be selected from the group of organic pigment dyes, inorganic pigment dyes and their mixtures and combinations.
  • the hotmelt adhesive may contain the dye or the color pigment in amounts in the range from 0.1% by weight to 30% by weight, in particular in the range from 0.5% by weight to 20% by weight, preferably in the range from 1 wt .-% to 10 wt .-%, based on the hot melt adhesive included. In this way, the hot melt adhesive can be equipped in a purposive manner with special optical properties, so that a treated on this basis coarse chip wood-based panel may also have additional decorative properties.
  • the hotmelt adhesive in particular the hotmelt adhesive melt
  • spraying nozzle application, doctoring, roller application, calendering, printing process or extrusion
  • roller application preferably roller application, on the surface , in particular flat side surface
  • the hotmelt adhesive in particular the hotmelt adhesive melt
  • the surface in particular the flat side surface
  • the hot-melt adhesive in particular the hot-melt adhesive
  • the hot-melt adhesive is applied to the surface, in particular the flat side surface, by means of roll application, in particular by means of at least one hot melt adhesive metering roll and / or hot melt adhesive application roll.
  • the hot-melt adhesive metering roller and / or hot melt application roller is operated in synchronism or counterrotation to the process or application direction, in particular in synchronism or counterrotation to the transport direction or feed direction of the coarse-particle wood-based panel. become.
  • the hot melt adhesive metering roller and / or hot melt adhesive applicator roll is operated independently of one another, in synchronism or countercurrent to the process or application direction or to the transport direction and / or feed direction of the coarse wood particle board, can the amount of applied Hot melt adhesive per unit area specifically set or specified.
  • the application quantity, in particular the area-related application quantity, of the hotmelt adhesive, in particular of the hotmelt adhesive melt via the rotational speed or circumferential speed of the hot melt adhesive metering roller and / or the hot melt adhesive applicator roll, preferably via the ratio the rotational speed or peripheral speed of the hot melt adhesive metering roller and / or the hot melt adhesive applicator roll to the order speed, in particular transport speed or feed rate of the coarse chip wood-based panel, set or predetermined.
  • the speed of application relates in particular to the length-per unit time order of the hot melt adhesive to the coarse chip wood-based panel.
  • a predetermined amount of hotmelt adhesive can be applied to a defined surface of the coarse-particle wood-based panel. According to the invention is thus ensured by the special procedure that a uniform application of the hot melt adhesive in defined surface-related amounts is carried out on the underlying coarse chip wood-based panel.
  • a hot melt application roller can be used, in particular with a doctor blade system.
  • a particularly defined and uniform application of the required amount of hot melt adhesive is ensured.
  • heatable hot melt adhesive metering rollers and / or heated hot melt adhesive application rollers for example, in particular heatable hot melt adhesive applicator rolls with separate hot melt adhesive metering rollers, or in particular heatable hot melt adhesive applicator rolls with doctor blade systems, can be used to apply the inventively provided amounts of hot melt adhesive.
  • the procedure is such that the hot melt adhesive, in particular the melt adhesive melt, at a temperature above the softening point or range or above the melting point, preferably above the melting point of the hot melt adhesive to the surface, in particular flat side surface, is applied.
  • the hot melt adhesive in particular the melt adhesive melt
  • the melt in the flowable state can penetrate particularly well into the surface, without causing swelling of the wood chips.
  • a uniform and homogeneous coating of the coarse-particle wood-based panel with the underlying hotmelt adhesive can thereby also be achieved, wherein, in addition, a high adhesion to the substrate (that is to say the underlying coarse-particle wood-based panel) is ensured.
  • the hotmelt adhesive in particular the hotmelt adhesive melt, at a temperature (ie in particular temperature of the hotmelt adhesive) in the range of 40 ° C to 300 ° C, in particular in the range of 60 ° C to 250 ° C, preferably in the range of 80 ° C and 220 ° C, preferably in the range of 90 ° C to 200 ° C, more preferably in the range of 95 ° C to 190 ° C, is applied to the surface, in particular flat side surface.
  • the hotmelt adhesive in particular the hotmelt adhesive melt, at a temperature (ie temperature of the hotmelt adhesive) of at least 40 ° C, in particular at least 60 ° C, preferably at least 80 ° C, preferably at least 90 ° C, particularly preferably at least 95 ° C. , on the surface, in particular flat side surface, are applied.
  • the process according to the invention can also be such that (i) the application of the hotmelt adhesive, in particular the hotmelt adhesive melt, to the surface, in particular flat side surface, the coarse chip wood-based panel and / or step b) and / or or (ii) filling and / or filling the unevennesses, depressions, cavities, holes and / or voids with the hotmelt adhesive, in particular the formation of the hotmelt adhesive filling, and / or step b1) and / or (iii) the coating and / or or filming of the surface, preferably flat side surface, in particular the formation of the hot melt adhesive layer, and / or step b2), in particular independently, repeatedly, in particular 1, 2, 3 times or more, carried out or repeated or . become.
  • the previously applied hotmelt adhesive melt is first at least partially cooled or at least partially solidified.
  • step (a) it is possible to proceed in such a way that, prior to the application of the hot-melt adhesive, in particular the melt-adhesive melt, to the surface, in particular flat side surface, and / or before step b), in particular before step b1) and / or before step b2) Before step b1), and / or after step (a), in addition, a smoothing, in particular a grinding, preferably a calibration loop, of the surface, in particular flat side surface, is carried out.
  • the unevenness, depressions, cavities, holes and / or voids can be reduced or evened out, in particular, by removal of, in particular, (surface) material or coarse chip material of the coarse chip wood-based panel to be treated before the actual equipment with the hotmelt adhesive.
  • even more uniform backfilling or coating with the hotmelt adhesive can be achieved overall, whereby particularly uniform and homogeneous surfaces can be provided.
  • the smoothing of the surface, in particular the flat-side surface, which may precede the hot-melt adhesive application leads to a reduction in the amount of hot melt adhesive to be applied.
  • the smoothing may be performed, for example, by using a grinding roller or the like.
  • the smoothing may optionally be repeated until the desired smoothness of the surface, in particular flat side surface, of the coarse-particle wood-based panel is present.
  • the surface, in particular flat side surface, nor a cleaning of the surface, in particular flat side surface, in particular for the removal of previously abraded and / or abraded material performed preferably calibration loops
  • the surface, in particular flat side surface, nor a cleaning of the surface, in particular flat side surface, in particular for the removal of previously abraded and / or abraded material performed in particular corresponding brush rollers, suction or the like can be used.
  • the cleaning of the surface should also be done before the application of the hot melt adhesive, in particular the hot melt adhesive melt
  • the surface, in particular flat side surface, or the OSB plate to a temperature in the range of 25 ° C to 200 ° C, in particular in the range of 30 ° C to 150 ° C, preferably in the range of 40 ° C and 125 ° C, preferably in the range of 50 ° C to 100 ° C, are heated.
  • the surface, in particular flat side surface, or the OSB plate to a temperature of at least 25 ° C, in particular at least 30 ° C, preferably at least 40 ° C, preferably at least 50 ° C, are heated.
  • consistent application and processing conditions can be guaranteed throughout the process.
  • the preheating leads to an improved wetting and penetration behavior of the applied hotmelt adhesive, in particular the hotmelt adhesive melt, with respect to the surface to be coated, in particular flat side surface, the chipboard wood board, as premature curing is prevented, so that the quality of the filled or coated surface is further improved.
  • the hotmelt adhesive in particular the hotmelt adhesive melt
  • the surface in particular flat side surface, and / or before step b
  • in particular before step b1) and / or step b2) preferably before step b1), and / or after step (a) and / or after the smoothing of the surface, in particular flat side surface
  • automated detection and evaluation in particular optical detection and evaluation, preferably optical-electronic detection and evaluation of the surface, in particular flat side surface, preferably the unevenness, depressions, cavities, holes and / or voids.
  • corresponding opto-electronic detection or analysis devices can be used.
  • a correspondingly differentiated or site-specific hotmelt adhesive application can be carried out, for example, using appropriate nozzle application devices or by applying the hotmelt adhesive in sections by means of a hotmelt adhesive metering roll or hot melt applicator roll or the like.
  • the hot-melt adhesive in particular the melt-adhesive melt
  • the surface in particular flat side surface, and / or after step b
  • optionally further preferably automated detection and evaluation in particular optical detection and evaluation, preferably optical-electronic detection and evaluation of the hot melt filled or coated surface, in particular flat side surface, preferably filled with the hot melt adhesive or Coated unevennesses, depressions, cavities, holes and / or voids.
  • a smoothing or standardization of the applied hot melt adhesive in particular the hot melt adhesive filling or the hot melt adhesive layer, preferably the hot melt adhesive layer, are performed.
  • a smoothing roller in particular heatable smoothing rollers or the like can be used.
  • the smoothing roller can be operated, for example, in the opposite direction to the transport direction or feed direction of the coarse chip wood-based panel.
  • the smoothing can be carried out in the not (completely) cooled or not (fully) solidified state of the applied hotmelt adhesive.
  • the thermoplastic behavior of the hot melt adhesive used in the context of smoothing can be used accordingly, even in non (fully) crosslinked reactive hot melt adhesives.
  • the hotmelt adhesive in particular the melt adhesive melt
  • the surface in particular flat side surface, and / or after step b
  • structuring or profiling in particular surface structuring and / or surface profiling, of the applied hot melt adhesive, in particular the hot melt adhesive filling and / or the hot melt adhesive layer, preferably the hot melt adhesive layer.
  • the structuring and / or profiling can be carried out by means of a preferably heatable structural or profile roller, but also by means of corresponding structural or profile sheets, structural or profile papers and combinations thereof.
  • the optional structuring or profiling it is possible to proceed preferably in the not (completely) cooled or not (completely) solidified state of the hotmelt adhesive used.
  • the treated surface or the applied hotmelt adhesive of the coarse chip wood-based material properties can be equipped with additional optical or decorative properties as well as with further functional properties, such as an anti-slip or anti- slip function .
  • the smoothing on the one hand and / or structuring or profiling on the other hand during cooling or solidifying and / or before or after cooling and solidifying the hot melt adhesive and / or before, during or after step c), in particular before the cooling and solidification of the hot melt adhesive or before step c) are performed.
  • the hot melt adhesive used according to the invention also has thermoplastic properties after cooling or after solidification
  • the smoothing or structuring or profiling can be carried out in particular under heating basically also be carried out after cooling or curing of the hot melt adhesive.
  • the surface finish may be by (i) coating, in particular with resin films and / or layers, preferably condensation resin films and / or layers, preferably melamine resin films and / or layers and / or phenolic resin films and / or layers; (ii) laminating, in particular adhesive laminating; (iii) painting; and / or (iv) lamination.
  • the coarse chip wood-based panel provided in the context of the present invention can thus be subjected to a further surface treatment in the form of a coating, such as, for example, by coating or covering the surface with, in particular, layered materials or substrates.
  • the coarse-particle wood-based panel can be equipped with other decorative or functional properties.
  • the previously treated coarse chip-wood panels and veneers, sheets, HPL materials (High Pressure Laminate), CPL materials (C ontinuous P fortressed L aminate), condensation resin films, wall paper, textiles, mineral and / or synthetic resin-based plasters or the like becomes.
  • the equipment with the materials in question which takes place in particular on laminating, preferably Klebkaschieren, can be done depending on the material used, for example via roller or nozzle application (slot die, spray application or multi-bead job).
  • the method according to the invention can be carried out continuously and / or automatically, in particular continuously.
  • the method according to the invention can be carried out continuously with regard to the sequence of the respective method steps.
  • the coarse-particle wood-based panel can have a large number of shavings, in particular layers arranged and / or oriented, in particular wood shavings, preferably in the form of coarse shavings.
  • the chips may have a length, in particular average length, in the range of 50 mm to 400 mm, in particular in the range of 75 mm to 300 mm, preferably in the range of 100 mm to 200 mm.
  • the chips may have a width, in particular average width, in the range of 2 mm to 100 mm, in particular in the range of 5 mm to 75 mm, preferably in the range of 10 mm to 50 mm.
  • the chips can have a thickness, in particular average thickness, in the range from 0.2 mm to 5 mm, in particular in the range from 0.4 mm to 3 mm, preferably in the range from 0.6 mm to 1.5 mm.
  • the chips can be connected using at least one binder and / or be pressed to form a composite.
  • the coarse chip wood-based panels in question in particular in the area of their surface on a variety of bumps, depressions, cavities, holes or voids, which can be filled in the process according to the invention in an effective manner, in particular accompanied by a effective coating of the coarse chip wood-based panels Based on a special hot melt adhesive, as stated above.
  • a powerful and overall economical process for the treatment, in particular equalization, of the surface, in particular flat side surface, of coarse-particle wood-based panels is thus provided overall, which is accompanied by the abovementioned advantages and properties.
  • Another object of the present invention - according to a second aspect of the invention - is also the chipped wood-based panel (OSB-wood composite panel), comprising at least one treated, especially leveled surface, preferably flat side surface, the coarse chipboard board according to the method described above according to the invention is available or is obtained.
  • OSB-wood composite panel chipped wood-based panel
  • the present invention thus also relates to the particle board (OSB wood composite board) as such, having at least one treated, especially leveled surface, preferably flat side surface, wherein the surface, in particular flat side surface, a plurality of bumps, depressions, cavities, holes
  • the voids, depressions, cavities, holes or voids are filled or filled with at least one hotmelt adhesive, in particular such that a homogenization or leveling of the surface, preferably the flat side surface, is present.
  • the hot-melt adhesive in particular the hot-melt adhesive
  • the hot-melt adhesive is applied such that the unevennesses, depressions, cavities, holes and / or blowholes with the hotmelt adhesive, in particular to form a hot melt adhesive filling, in particular hot melt equalization, filled or filled.
  • the coarse-particle wood-based panel according to the invention may have at least one hot-melt adhesive filling arranged on the surface, in particular flat-side surface, in particular hot-melt equalization filling.
  • the hot-melt adhesive filling can be designed such that the unevennesses, depressions, cavities, holes and / or voids are filled and / or filled with the hot-melt adhesive.
  • the unevennesses, depressions, cavities, holes or voids are at least substantially completely filled or filled with the hotmelt adhesive.
  • the unevennesses, depressions, cavities, holes or voids are at least 30%, in particular at least 50%, preferably at least 70%, preferably at least 80%, particularly preferably at least 90%, particularly preferably at least 95%. most preferably at least 98%, based on the Volume of imperfections, depressions, cavities, holes and / or voids, are filled or filled with the hot melt adhesive.
  • the hot melt adhesive filling at least partially and / or in sections with the bumps, depressions, cavities, holes and / or Lunker Weg forming or limiting coarse chip passes through and / or is optionally interrupted.
  • the coarse chip forming or delimiting the unevennesses, depressions, cavities, holes or voids can project at least partially or in sections into the hot-melt adhesive filling.
  • the hot-melt adhesive filling may have a thickness in the range of 0.2 mm to 50 mm, in particular in the range of 0.5 mm to 25 mm, preferably in the range of 1 mm to 10 mm, preferably in the range of 1 mm to 5 mm.
  • the hotmelt adhesive in particular the hotmelt adhesive melt
  • the hotmelt adhesive melt is also applied such that the surface, in particular flat side surface, and / or the hot melt adhesive filling at least partially and / or in sections, preferably over the entire surface, with the hot melt adhesive , in particular with the hotmelt adhesive melt, coated and / or filmed.
  • the coarse-particle wood-based panel according to the invention may thus have at least one hot-melt adhesive layer, in particular hot-melt adhesive covering layer, arranged or applied to the surface, in particular flat-side surface, or to the hot-melt adhesive filling.
  • the hotmelt adhesive layer may be formed such that the surface, in particular flat side surface or the hot melt adhesive filling at least partially and / or in sections, preferably over the entire surface, coated with the hot melt adhesive, in particular with the hot melt adhesive, and / or is filmed.
  • the hot-melt adhesive layer may be at least substantially closed or at least substantially free of interruptions.
  • the hot-melt adhesive layer has at least substantially no coarse chip forming or delimiting the unevennesses, depressions, cavities, holes and / or voids.
  • the hotmelt adhesive layer may have a thickness in the range of 0.1 mm to 30 mm, in particular in the range of 0.2 mm to 20 mm, preferably in the range of 0.5 mm to 10 mm, preferably in the range of 0 , 75 mm to 5 mm, more preferably in the range of 1 mm to 3 mm.
  • the hotmelt adhesive in particular the hotmelt adhesive melt, in an amount in the range of 10 g / m 2 to 2,000 g / m 2 , in particular in the range of 25 g / m 2 to 1,500 g / m 2 , preferably in Range from 50 g / m 2 to 1,000 g / m 2 , preferably in the range of 75 g / m 2 to 800 g / m 2 , particularly preferably in the range of 100 g / m 2 to 600 g / m 2 , based on the Surface, in particular flat side surface, be applied.
  • the hot-melt adhesive filling on the one hand and the hot-melt adhesive layer, in particular the hot-melt adhesive covering layer, on the other hand, as it were, be present as a uniform layer, in particular in the form of a filling and / or covering layer, which can be realized, for example, by the hotmelt adhesive as a whole is applied to the surface, in particular the flat side surface, in the context of a single application step.
  • the hotmelt adhesive is a thermoplastic and / or one-component hotmelt adhesive, in particular a one-component hotmelt adhesive.
  • the hotmelt adhesive should be at least substantially free of water and / or solvents.
  • the hotmelt adhesive should have a water and / or solvent content of at most 10% by weight, in particular at most 5% by weight, preferably at most 2% by weight, preferably at most 1% by weight, particularly preferably at most 0. 5 wt .-%, most preferably at most 0.1 wt .-%, based on the hot melt adhesive having.
  • the hot melt adhesive is a reactive hot melt adhesive, in particular a thermoplastic and / or one-component reactive hot melt adhesive, preferably a one-component reactive hot melt adhesive.
  • the reactive hot melt adhesive is a moisture-crosslinking, heat-crosslinking and / or radiation-crosslinking hot-melt adhesive, in particular a moisture-crosslinking and / or radiation-crosslinking, preferably a moisture-crosslinking hot-melt adhesive.
  • the hot melt adhesive is a non-reactive hot melt adhesive, in particular a thermoplastic and / or one-component non-reactive hot melt adhesive, preferably a one-component non-reactive hot melt adhesive.
  • PLA polylactic acid
  • the hotmelt adhesive has at least one adhesion promoter and / or primer.
  • the coupling agent may be selected from the group of silicon oxides, silanes, silicas, silicas and mixtures and combinations thereof.
  • the hot melt adhesive may comprise at least one additive.
  • the additive may be selected from the group of plasticizers, high-boiling organic oils, esters or other plasticizing additives, stabilizers, in particular UV stabilizers, antioxidants, acid scavengers, in particular nanoparticulate fillers, anti-aging agents and their mixtures or combinations.
  • the hot-melt adhesive may comprise at least one non-reactive polymer, resin and / or wax, in particular a natural, synthetic or chemically modified (semi-synthetic) wax.
  • the hotmelt adhesive may have at least one functionalization component.
  • the functionalizing component may be selected from the group of electrically conductive substances, antimicrobial, antifungal and / or fungicidal substances and their mixtures and combinations.
  • the hotmelt adhesive may comprise at least one dye and / or at least one color pigment.
  • the dye or the color pigment may be selected from the group of organic pigment dyes, inorganic pigment dyes and their mixtures and combinations.
  • the coarse chip wood-based panel according to the invention can furthermore be designed such that the surface, in particular the flat-side surface, is smoothed, in particular ground.
  • the unevennesses, depressions, cavities, holes or voids can be reduced or evened out, in particular by removal, preferably of coarse chip material.
  • the area-related application amount of hot melt adhesive can be reduced accordingly.
  • the coarse chip wood-based panel according to the invention can be designed such that the hot melt adhesive applied to the surface, in particular the flat side surface, in particular the hot melt adhesive filling and / or the hot melt adhesive layer, is smoothed or unified. hereby the surface properties can be further improved, in particular with regard to a uniform and homogeneous appearance of the coarse chip wood-based panel according to the invention.
  • the hot melt adhesive applied to the surface in particular the flat side surface, in particular the hot melt adhesive filling and / or the hot melt adhesive layer, is structured or profiled.
  • further decorative properties can be provided.
  • the anti-slip properties can be improved and thus the slip resistance can be increased accordingly.
  • the coarse-particle wood-based panel in particular on the surface, in particular flat side surface, preferably on the hot melt adhesive, in particular on the hot melt adhesive filling and / or the hot melt adhesive layer, is surface-coated or has a further coating.
  • the coarse-particle wood-based panel in particular on the surface, in particular flat side surface, (i) at least one coating, in particular with resin films and / or layers, preferably condensation resin films and / or layers, preferably melamine resin films and / or layers and / or phenolic resin films and / or layers; (ii) at least one lamination, in particular adhesive lamination; (iii) at least one finish; and / or (v) have at least one lamination.
  • resin films and / or layers preferably condensation resin films and / or layers, preferably melamine resin films and / or layers and / or phenolic resin films and / or layers
  • lamination in particular adhesive lamination
  • finish at least one finish
  • / or (v) have at least one lamination.
  • the coarse chip wood-based panel according to the invention may have a density, in particular bulk density, in the range from 300 kg / m 3 to 1000 kg / m 3 , in particular in the range from 400 kg / m 3 to 900 kg / m 3 . preferably in the range from 500 kg / m 3 to 800 kg / m 3 , particularly preferably in the range from 550 kg / m 3 to 750 kg / m 3 .
  • the coarse-particle wood-based panel according to the invention is also distinguished by the fact that it has a large number of shavings, in particular layers arranged and / or aligned, in particular wood shavings, preferably in the form of coarse shavings.
  • the chips may have a length, in particular average length, in the range of 50 mm to 400 mm, in particular in the range of 75 mm to 300 mm, preferably in the range of 100 mm to 200 mm.
  • the chips can have a width, in particular average width, in the range from 2 mm to 100 mm, in particular in the range from 5 mm to 75 mm, preferably in the range from 10 mm to 50 mm.
  • the chips can have a thickness, in particular average thickness, in the range from 0.2 mm to 5 mm, in particular in the range from 0.4 mm to 3 mm, preferably in the range from 0.6 mm to 1.5 mm.
  • the chips are connected by means of at least one binder or compressed to form a composite.
  • the coarse chipboard board according to the invention is characterized by improved (surface) properties, in particular with regard to improved weathering, UV and / or moisture resistance.
  • the coarse chip wood-based panels according to the invention have a high chemical resistance.
  • the production plant according to the invention may in particular comprise a plurality, in particular two, three, four or more, backfilling and / or coating devices.
  • the respective filling or coating devices can be arranged in particular downstream of one another or in series.
  • a multiple or successive order of the hot melt adhesive to the surface, in particular flat side surface, with increasing in the process flow hot melt adhesive application is possible, so that in this way the corresponding hot melt adhesive filling or hot melt adhesive layer can be formed continuously.
  • the production plant according to the invention it is also possible within the scope of the present invention for the production plant according to the invention to have at least one return device, in particular for the return transport or retraction of the coarse-particle wood-based panel, in particular for the filling or coating device.
  • the coarse chip wood-based panel can be performed again by a corresponding filling or coating device for re-applying the hot melt adhesive.
  • the return device may in particular be part of the transport or feed device described below.
  • the grinding device of the production plant can have at least one means for grinding, in particular a grinding roller.
  • the grinding device can also have at least one means for cleaning or removing abraded material. This may be, for example, a brush roller or an aspirator or the like.
  • the heating or tempering device on which the production plant according to the invention is based may comprise at least one means for heating or tempering the coarse-particle wood-based panel, preferably the surface, in particular the flat-side surface, the coarse-particle wood-based panel, in particular a heat radiator or heat ventilator or a furnace, in particular belt or continuous furnace, and / or at least one means for detecting or controlling the temperature of the coarse-particle wood material panel, in particular the surface, preferably flat side surface, the coarse chip wood-based panel.
  • the application behavior can be improved overall, in particular with regard to an at least substantially complete filling or filling of the unevenness, recesses, cavities, holes or voids, in particular as premature cooling or solidification of the hot melt adhesive, as it may be the case when applied to a cold or unheated substrate, is avoided.
  • the filling and / or coating device of the production plant according to the invention at least one means for heating the hot melt adhesive, preferably to obtain the melt adhesive melt, or at least one means for applying the hot melt adhesive, in particular the hot melt adhesive, to the surface, in particular flat side surface.
  • the means for applying the hotmelt adhesive in particular the hotmelt adhesive melt, be selected from the group of (i) hot melt adhesive rollers, in particular hot melt metering rollers and / or hot melt adhesive applicator rollers; (ii) hot melt applicator nozzles, especially hot melt slot dies, preferably hot melt slot die nozzles; (iii) hot melt adhesive squeegees, especially hot melt roll squeegees; particularly preferably (i) rollers, in particular hot melt metering rollers and / or hot melt application rollers, and combinations thereof.
  • hot melt adhesive rollers in particular hot melt metering rollers and / or hot melt adhesive applicator rollers
  • hot melt applicator nozzles especially hot melt slot dies, preferably hot melt slot die nozzles
  • hot melt adhesive squeegees especially hot melt roll squeegees
  • rollers in particular hot melt metering rollers and / or hot melt application rollers, and combinations thereof.
  • heatable hot melt adhesive application rollers with separate, in particular uniformly heatable, hot melt metering rollers.
  • a hot melt application roller in particular with a doctor blade system, can in particular also be used for the defined application of the required application quantity of hot melt adhesive, preferably melt adhesive melt.
  • the means for applying the hot-melt adhesive in particular the hot-melt adhesive roll, in particular hot-melt adhesive metering roll and / or hot-melt adhesive application roll, is designed to be heatable.
  • the hot-melt adhesive roll in particular hot-melt adhesive metering roll and / or hot-melt adhesive application roll
  • the means for applying the hot-melt adhesive is designed to be heatable.
  • the filling or coating device has a plurality of first means and a plurality of second means for applying the hotmelt adhesive.
  • the means for applying the hotmelt adhesive in the form of a hot melt adhesive roll, in particular hot melt metering roll and / or hot melt adhesive applicator roll is formed or comprises these, wherein the hot melt adhesive roll, in particular the hot melt adhesive metering roll or the hot-melt adhesive applicator roll, in synchronism or countercurrent to the transport direction and / or feed direction of the coarse chip wood-based panel is operable.
  • the hot melt adhesive roller in particular the hot melt adhesive metering roller and / or the hot melt adhesive applicator roll, at least one device for controlling and / or operating the hot melt adhesive roll, in particular the hot melt adhesive metering roll and / or or the hot melt application roller, in synchronism or countercurrent to the transport direction and / or feed direction of the coarse chip wood-based panel.
  • the amount of hot melt adhesive applied can be set or specified accordingly.
  • the production plant or the filling and / or coating device in particular the means for applying the hot melt adhesive, at least one control device for adjusting or for controlling the application amount of hot melt adhesive.
  • the control device for adjusting and / or controlling the application quantity of hotmelt adhesive can be designed, for example, such that the amount of hotmelt adhesive to be applied is adjustable as a function of the transport speed and / or feed rate of the coarse chip wood-based panel. As a result, a uniform and defined application of adhesive is ensured at the same time high throughput.
  • the means for applying the hot melt adhesive is in the form of a hot melt adhesive roll, in particular hot melt metering roll and / or hot melt adhesive applicator roll, and comprises, wherein the hot melt adhesive roll, in particular the hot-melt adhesive metering roll and / or the hot-melt adhesive applicator roll, at least one control device for setting or controlling the roll rotation speed and / or the roller peripheral speed, in particular as a function of the transport speed and / or feed rate of the coarse-wood particle board ,
  • the production plant according to the invention may have at least one transport and / or feed device, in particular for transporting and / or feeding the coarse-particle wood-based panel.
  • the transport or feed device may have at least one control device for setting or for controlling the transport and / or feed rate of the coarse-particle wood-based panel.
  • the control device for setting and / or for controlling the transport and / or feed speed can be designed such that the transport and / or feed rate of the coarse wood-based panel depending on the amount of applied hot melt adhesive and / or in dependence on the rolls Rotational speed and / or the roller peripheral speed of the hot melt metering roller and / or the hot melt applicator roll which is adjustable.
  • the transport or feed rate of the coarse-particle wood-based panel in particular in coordination with the setting of the rotation or rotation direction and / or the rotational or peripheral speed of the invention used hot melt adhesive rollers, in particular hot melt metering roller or hot melt applicator roll , Overall, the amount of hot melt adhesive to be applied can be specified.
  • the production plant according to the invention has at least one detection and / or evaluation device for preferably automated detection and evaluation, in particular optical detection and evaluation, preferably optical-electronic detection and evaluation, the surface, in particular flat side surface, preferably the unevennesses, depressions, cavities, holes and / or Lunkerstellen has.
  • the detection means may be disposed downstream of the grinding means and / or downstream of the heating and / or tempering means and / or upstream of the backfilling and / or coating means.
  • the production plant according to the invention may additionally comprise at least one means for controlling the amount of hot melt adhesive to be applied or dispensed as a function of the optical detection or evaluation of the surface, in particular flat side surface, of the coarse chip wood-based panel.
  • at least one means for controlling the amount of hot melt adhesive to be applied or dispensed as a function of the optical detection or evaluation of the surface, in particular flat side surface, of the coarse chip wood-based panel.
  • the production plant according to the invention comprises at least one optionally further detection and / or evaluation device for preferably automated detection and evaluation, in particular optical detection and evaluation, preferably optical-electronic detection and evaluation, backfilling and / or coating of Surface, especially flat side surface, preferably the backfilling and / or coating of the bumps, depressions, cavities, holes and / or Lunkerstellen, having the hot melt adhesive.
  • the further detection or evaluation device can be arranged downstream of the filling and / or coating device.
  • the production plant may be designed, for example, such that, if the coating or the like is not complete, the comminuted wood-based panel is subjected to another hot-melt adhesive application, for example by renewed supply to the backfilling and / or coating device, in particular by means of the transport and / or Feed device or the return device.
  • the production plant according to the invention enables a continuous and / or automated or fully automated treatment of the underlying OSB boards.
  • the surface treatment and / or structuring device can be at least one means for smoothing or standardizing the applied hot melt adhesive, in particular a preferably heatable smoothing roll, and / or at least one means for structuring and / or profiling the applied hot melt adhesive, in particular selected from the group of preferably heatable structural or profile rollers, structural or profile sheets, structural or profiled papers and combinations thereof.
  • the production plant according to the invention may also have at least one coating, laminating, painting and / or laminating device.
  • the coating, laminating, painting and / or laminating device can be arranged downstream of the filling and / or coating device or upstream of the cooling device or else downstream of the cooling device. On this basis, a further compensation of the surface, for example by applying (decorative) films, coatings or the like, be made.
  • the present invention - according to a fourth aspect of the invention - the use of at least one hot melt adhesive, in particular as defined above, to increase the weathering, UV and / or moisture resistance of a chipboard wood panel (OSB-wood composite panel) and / or Equipment of a chipboard wood panel (OSB wood composite panel) with outdoor application properties.
  • at least one hot melt adhesive in particular as defined above, to increase the weathering, UV and / or moisture resistance of a chipboard wood panel (OSB-wood composite panel) and / or Equipment of a chipboard wood panel (OSB wood composite panel) with outdoor application properties.
  • the subject of the present invention - according to a fifth aspect of the invention - the use of at least one hot melt adhesive, in particular as defined above, for equalization or leveling of the surface, preferably the flat side surface of a coarse chip wood-based panel.
  • the underlying hotmelt adhesive as used in the uses according to the fourth and fifth aspects of the invention is preferably a one-component hot melt adhesive and / or a reactive hot melt adhesive, in particular a one-component reactive hot melt adhesive.
  • the hotmelt adhesive in particular in the form of a hotmelt adhesive melt, can be applied to at least one surface, in particular flat side surface, of the coarse chipboard so that at least the unevennesses, depressions, cavities, Holes and / or voids at least substantially with the hot melt adhesive, in particular the hot-melt adhesive melt, filled and / or filled, in particular wherein a homogenization and / or leveling of the surface, preferably the flat side surface, in particular to form at least one hot melt adhesive filling is effected.
  • the hot melt adhesive in particular the hot melt adhesive
  • the hot melt adhesive is also applied such that the surface, in particular flat side surface, and / or the hot melt adhesive filling at least partially and / or in sections, preferably over the entire surface, with the hotmelt adhesive, in particular with the hotmelt adhesive melt, coated and / or filmed, in particular wherein at least one on the surface, in particular flat side surface, and / or arranged on the hot melt adhesive filling hot melt adhesive layer, in particular hot melt adhesive covering layer results.
  • Yet another object of the present invention - according to a sixth aspect of the invention - is also the use of at least one coarse chipboard panel, as defined above, for the different applications mentioned below.
  • the coarse chip wood-based panel according to the invention is suitable for use as and / or for the production of in particular weathering, UV and / or moisture-resistant and / or decorative skins, cladding, facade elements, facade panels, building elements and / or building boards, preferably in the range of wall, roof and / or floor structures, in particular in the (construction) outside and / or (construction) - interior, preferably in the field of exterior and / or interior.
  • the coarse chip wood-based panel according to the invention is suitable for use as and / or for the production of furniture and / or furniture elements and / or in particular decorative furniture panels, building elements, building boards, in particular in furniture, shop and / or exhibition construction, preferably in the range of wall, roof and / or floor structures.
  • the coarse chip wood-based panel according to the invention is suitable for use as and / or for the production of in particular weatherproof, UV and / or moisture-resistant packaging and / or transport elements and / or boards, packaging and / or transport devices , in particular packaging and / or transport containers and / or boxes, in particular in the transport and / or packaging sector.
  • the present invention relates to the building element or façade element according to the invention, in particular building and / or façade panel, in particular with weathering, UV and / or moisture-resistant and / or decorative properties, wherein the building and / or facade element at least one coarse chipboard wood panel (OSB wood composite panel), comprising at least one with at least one Hot melt adhesive treated, in particular equalized surface, preferably flat side surface, in particular coarse chip wood fiber board (OSB wood composite board) according to one of the preceding claims, comprises or consists thereof.
  • OSB wood composite panel coarse chipboard wood panel
  • OSB wood composite board coarse chipboard wood panel
  • Fig. 1 shows the implementation of the method according to the invention for the treatment, in particular equalization, at least one surface, preferably at least one flat side surface of coarse chipboard wood panels or OSB wood composite panels according to an embodiment of the invention.
  • At least one coarse chipboard panel is first provided according to step 1, wherein the coarse panel panel has at least one surface, preferably at least one flat side surface, with a plurality of bumps, depressions, cavities, holes or voids, which in general are due to the shape and arrangement of the coarse chip wood-based panel underlying coarse chips.
  • a smoothing in particular a grinding, preferably a calibration grinding of the surface, in particular a flat side surface, is carried out.
  • a smoothing or reduction of the unevennesses, depressions, cavities, holes or voids on the surface, in particular flat side surface can be realized, which is particularly beneficial to the subsequent hot melt adhesive application, in particular with a view to reducing the use of materials.
  • step 3 in particular after the preparation of the coarse chip wood-based panel and before the application of the hot-melt adhesive, a preheating of the surface, in particular flat side surface or of the coarse chip wood-based panel is carried out as such.
  • the wetting or penetration behavior of the hot melt adhesive in the form of hot melt adhesive melt be improved in the surface underlying irregularities, depressions, cavities, holes or Lunkerstellen.
  • the method according to the invention is additionally provided according to steps 4 and 5 to apply at least one hotmelt adhesive, in particular in the form of a hotmelt adhesive melt, to the at least one surface, in particular flat side surface, of the coarse chip wood-based panel.
  • the method according to the invention is such that at least the unevennesses, depressions, cavities, holes or voids are at least substantially filled or filled with the hot-melt adhesive or the melt-adhesive melt.
  • a homogenization or leveling of the surface preferably the flat side surface, causes.
  • the application of the hotmelt adhesive, in particular in the form of hotmelt adhesive melt in the context of the inventive method also be carried out such that first according to step 4, the hot melt adhesive, in particular in the form of hot melt adhesive is applied such that the bumps, Recesses, cavities, holes or voids with the hot melt adhesive, in particular to form a hot melt adhesive filling, preferably hot-melt leveling, are filled or filled, in particular accompanied by a corresponding homogenization or leveling of the thus treated surface.
  • the presentation according to Fig. 3B to get expelled.
  • the hotmelt adhesive in particular in the form of the hotmelt adhesive melt, in such a way that the surface, in particular the flat side surface, or the hotmelt adhesive filling, moreover at least partially. or in sections, preferably over the entire surface, with the hotmelt adhesive is coated or filmed, in particular wherein on this basis a arranged on the surface or on the hot melt adhesive filling hot melt adhesive layer, in particular in the form of a hot melt adhesive covering layer, may result.
  • the presentation according to Fig. 3C to get expelled.
  • step 6 after the application of the hotmelt adhesive, in particular the hotmelt adhesive melt, smoothing and / or structuring or profiling of the applied hotmelt adhesive can take place, in particular in the not (completely) cooled or especially in the not (complete) solidified state of the hot melt adhesive.
  • cooling and solidifying in particular curing or Solidifying, the hot melt adhesive.
  • cooling and solidification in particular also include (post) crosslinking of the hotmelt adhesive used.
  • step 8 it is possible to proceed in such a way that according to step 8, in particular after cooling or solidifying, a further surface treatment of the OSB board equipped with the hot-melt adhesive takes place, for example by means of coating, laminating, lacquering, laminating or the like.
  • FIG. 2 in the form of a schematic representation of a production plant P according to the invention, wherein the production plant P according to the invention according to the described embodiment, at least one agent A in the form of a grinding device, in particular for grinding, preferably Kalibrierschleifen, the at least one surface, in particular flat side surface to be treated according to the invention Coarse chip wood-based panel has.
  • the production plant P according to the invention may also, according to means B, optionally have at least one heating or temperature device, which is arranged in particular downstream of the grinding device.
  • the production plant P according to the invention according to means C at least one filling or coating device for applying the hot melt adhesive, in particular in the form of hot melt adhesive, have.
  • the filling or coating device according to the means C can be arranged in particular downstream of the heating or tempering device according to means B.
  • FIG. 3A an untreated initial coarse chipboard board 2 with a corresponding flat side surface, which has a plurality of unevenness, depressions, cavities, holes or voids to be filled.
  • FIG. 3B a treated according to the inventive coarse chip wood composite panel 1, wherein the underlying starting coarse chipboard wood panel 2 using a hot melt adhesive to the Flat side surface is filled in particular for forming a hot melt adhesive filling 3a, accompanied with a corresponding equalization or leveling of the flat side surface.
  • Fig. 3C shows a treated according to the invention coarse chipboard board 1 according to another embodiment of the invention, according to which the treated chipboard wood board 1 additionally has a further hot melt adhesive layer 3b, which on the flat side surface of the underlying coarse chipboard board 2 and on the hot melt adhesive filling 3a is applied.
  • FIG. 3D another coarse chip wood-based panel 1 according to the invention, in which in addition to the embodiment according to Fig. 3C the additionally applied hotmelt adhesive layer 3b is profiled or structured.
  • comparative coarse chip wood-based panels were produced, for the treatment of the flat side surface or for filling the depressions, cavities, holes or voids on the one hand a water-based paint system (comparative OSB board IV) and on the other hand, based on organic solvent coating system ( Comparative OSB plate V) for filling the unevennesses, depressions, cavities, holes or voids the flat side of each coarse chipboard panels and for subsequent application of a secondary finishing layer can be used.
  • a water-based paint system comparativative OSB board IV
  • organic solvent coating system Comparative OSB plate V
  • the individual OSB boards are simultaneously and under identical conditions subjected to an accelerated weathering test under defined moisture, moisture and temperature influence.
  • This is followed by a visual assessment with regard to the quality of the surface or the state of the respective OSB board as a whole, in particular with regard to swelling of the OSB board, surface condition, cracking or flaking of the applied filling or coating systems, wherein the Rating also done here according to the school grading system.
  • OSB optical properties / quality of the treated surface from weathering Rating after weathering (1 month) Rating after weathering (3 months) OSB board I PUR, reactive (according to the invention) 1 1 1 OSB plate II POR, reactive (according to the invention) 1 1 2 OSB plate III EVA, non-reactive (according to the invention) 1-2 3 3-4 OSB board IV water-based paint system (comparison) 2-3 4-5 6 OSB board V paint system based on organic solvents (comparison) 2-3 4 6
  • the results listed in the table show that the OSB boards according to the invention have overall improved surface qualities also with regard to the optical properties, wherein in the OSB boards according to the invention a permanent and uniform backfilling of the bumps, depressions, cavities, holes or Lunkerstellen is ensured using mechanical methods.
  • the OSB boards according to the invention have a significantly improved weathering behavior.
  • coarse-particle wood-based panels are thus provided on their surface, in particular flat-side surface, which, with greater homogeneity and durability of the surface, also have an increased long-term or weathering resistance.

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)
EP16187043.1A 2016-09-02 2016-09-02 Procede de traitement de surfaces en bois Active EP3290175B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FIEP16187043.1T FI3290175T3 (fi) 2016-09-02 2016-09-02 Menetelmä puumateriaalista tehtyjen pintojen käsittelemiseksi
EP16187043.1A EP3290175B1 (fr) 2016-09-02 2016-09-02 Procede de traitement de surfaces en bois
PL16187043.1T PL3290175T3 (pl) 2016-09-02 2016-09-02 Sposób przetwarzania powierzchni materiałów drewnopochodnych
PT161870431T PT3290175T (pt) 2016-09-02 2016-09-02 Processo para tratamento de superfícies de derivados de madeira
HUE16187043A HUE062013T2 (hu) 2016-09-02 2016-09-02 Eljárás faanyagok felületének kezelésére
ES16187043T ES2941275T3 (es) 2016-09-02 2016-09-02 Procedimiento para el procesamiento de superficies de materiales de madera
US15/692,344 US10532487B2 (en) 2016-09-02 2017-08-31 Method for working surfaces of wood-based materials

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EP16187043.1A EP3290175B1 (fr) 2016-09-02 2016-09-02 Procede de traitement de surfaces en bois

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EP3290175B1 EP3290175B1 (fr) 2023-02-22

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EP (1) EP3290175B1 (fr)
ES (1) ES2941275T3 (fr)
FI (1) FI3290175T3 (fr)
HU (1) HUE062013T2 (fr)
PL (1) PL3290175T3 (fr)
PT (1) PT3290175T (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3597312A1 (fr) * 2018-05-04 2020-01-22 SWISS KRONO Tec AG Procédé de fabrication d'un panneau à particules orientées pourvu d'une surface imprimée et panneau à particules orientées à surface imprimée fabriqué selon ledit procédé

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11202004388RA (en) * 2017-11-22 2020-06-29 Dsm Ip Assets Bv Method for producing and recycling an object consisting of a panel durably provided with a surface covering
CN110117476A (zh) * 2019-05-14 2019-08-13 永隆高新科技(青岛)有限公司 一种强适应性的聚氨酯木材平贴用胶

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0373726A2 (fr) * 1988-12-16 1990-06-20 Shell Internationale Researchmaatschappij B.V. Agrégat fibreux cellulosique et procédé pour sa préparation
JPH0711333U (ja) * 1993-07-29 1995-02-21 ヤスハラケミカル株式会社 機能性繊維板
DE19630270A1 (de) * 1996-07-26 1998-01-29 Henkel Kgaa Verfahren zur Vergütung von Oberflächen
US5741391A (en) * 1993-05-12 1998-04-21 Schauman Wood Oy Method for the preparation of board
WO2001062492A1 (fr) * 2000-02-23 2001-08-30 Ato Findley, Inc. Adhesif thermofusible a durete elevee destine a la stratification de couches decoratives sur du bois
JP2002086617A (ja) * 2000-09-19 2002-03-26 Eidai Co Ltd 板材及びその製造方法
US20020155223A1 (en) * 2001-02-13 2002-10-24 John Colvin Resin-impregnated substrate, method of manufacture and system therefor
DE10226422C1 (de) * 2002-06-13 2003-11-20 Metso Paper Inc Verfahren und Vorrichtung zum Erzeugen einer Oberflächenstruktur auf einer Holzwerkstoffplatte
JP2004276463A (ja) * 2003-03-17 2004-10-07 Kurea Life:Kk 器類
EP1749587A1 (fr) 2005-08-01 2007-02-07 Kronotec Ag Planche en bois reconstitué pour le bâtiment et méthode de sa fabrication
EP2781573A1 (fr) 2013-03-22 2014-09-24 Jowat AG Nouvelles compositions d'adhésif à base de matières premières renouvelables et leur utilisation
US20150197942A1 (en) * 2014-01-10 2015-07-16 Välinge Innovation AB Wood fibre based panel with a surface layer

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5316812A (en) * 1991-12-20 1994-05-31 Minnesota Mining And Manufacturing Company Coated abrasive backing
US5525663A (en) * 1994-08-18 1996-06-11 Minnesota Mining And Manufacturing Company Reactive hot-melt adhesive and/or sealing composition and method of using same
JP3494859B2 (ja) * 1997-10-02 2004-02-09 シャープ株式会社 液晶パネルおよびその製造方法
DE10031992A1 (de) * 2000-06-30 2002-01-24 Henkel Kgaa Schmelzklebstoffe zur Abdichtung von Gestein oder Baumaterial
US6699551B2 (en) * 2001-02-09 2004-03-02 Ncr Corporation Printable form with removable label and method for producing same
US7482064B2 (en) * 2005-08-08 2009-01-27 Huber Engineered Woods Llc Wood panel
DE102012201780A1 (de) * 2012-02-07 2013-08-08 Henkel Ag & Co. Kgaa Verklebung mit unterschiedlichen Klebstoffen

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0373726A2 (fr) * 1988-12-16 1990-06-20 Shell Internationale Researchmaatschappij B.V. Agrégat fibreux cellulosique et procédé pour sa préparation
US5741391A (en) * 1993-05-12 1998-04-21 Schauman Wood Oy Method for the preparation of board
JPH0711333U (ja) * 1993-07-29 1995-02-21 ヤスハラケミカル株式会社 機能性繊維板
DE19630270A1 (de) * 1996-07-26 1998-01-29 Henkel Kgaa Verfahren zur Vergütung von Oberflächen
WO2001062492A1 (fr) * 2000-02-23 2001-08-30 Ato Findley, Inc. Adhesif thermofusible a durete elevee destine a la stratification de couches decoratives sur du bois
JP2002086617A (ja) * 2000-09-19 2002-03-26 Eidai Co Ltd 板材及びその製造方法
US20020155223A1 (en) * 2001-02-13 2002-10-24 John Colvin Resin-impregnated substrate, method of manufacture and system therefor
DE10226422C1 (de) * 2002-06-13 2003-11-20 Metso Paper Inc Verfahren und Vorrichtung zum Erzeugen einer Oberflächenstruktur auf einer Holzwerkstoffplatte
JP2004276463A (ja) * 2003-03-17 2004-10-07 Kurea Life:Kk 器類
EP1749587A1 (fr) 2005-08-01 2007-02-07 Kronotec Ag Planche en bois reconstitué pour le bâtiment et méthode de sa fabrication
DE102005036579A1 (de) 2005-08-01 2007-02-08 Kronotec Ag Bauplatte aus Holzwerkstoff und Verfahren zur Herstellung
EP2781573A1 (fr) 2013-03-22 2014-09-24 Jowat AG Nouvelles compositions d'adhésif à base de matières premières renouvelables et leur utilisation
DE102013004909A1 (de) 2013-03-22 2014-10-09 Jowat Ag Neue Klebstoffzusammensetzungen auf Basis nachwachsender Rohstoffe und deren Verwendung
US20150191635A1 (en) 2013-03-22 2015-07-09 Jowat Ag New adhesive compositions based on renewable raw materials and use thereof
US20150197942A1 (en) * 2014-01-10 2015-07-16 Välinge Innovation AB Wood fibre based panel with a surface layer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3597312A1 (fr) * 2018-05-04 2020-01-22 SWISS KRONO Tec AG Procédé de fabrication d'un panneau à particules orientées pourvu d'une surface imprimée et panneau à particules orientées à surface imprimée fabriqué selon ledit procédé

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PT3290175T (pt) 2023-03-31
US20180065273A1 (en) 2018-03-08
US10532487B2 (en) 2020-01-14
ES2941275T3 (es) 2023-05-19
PL3290175T3 (pl) 2023-06-12
FI3290175T3 (fi) 2023-05-08
HUE062013T2 (hu) 2023-09-28
EP3290175B1 (fr) 2023-02-22

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