EP3271650A1 - Halbleiterlampe - Google Patents
HalbleiterlampeInfo
- Publication number
- EP3271650A1 EP3271650A1 EP16705132.5A EP16705132A EP3271650A1 EP 3271650 A1 EP3271650 A1 EP 3271650A1 EP 16705132 A EP16705132 A EP 16705132A EP 3271650 A1 EP3271650 A1 EP 3271650A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- tube
- connecting element
- semiconductor lamp
- circuit board
- end caps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 73
- 239000004033 plastic Substances 0.000 claims description 11
- 229920003023 plastic Polymers 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 229910000831 Steel Inorganic materials 0.000 description 25
- 239000010959 steel Substances 0.000 description 25
- 230000008859 change Effects 0.000 description 10
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 230000008901 benefit Effects 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 102100037149 3-oxoacyl-[acyl-carrier-protein] synthase, mitochondrial Human genes 0.000 description 1
- 101001098439 Homo sapiens 3-oxoacyl-[acyl-carrier-protein] synthase, mitochondrial Proteins 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- QXAITBQSYVNQDR-UHFFFAOYSA-N amitraz Chemical compound C=1C=C(C)C=C(C)C=1N=CN(C)C=NC1=CC=C(C)C=C1C QXAITBQSYVNQDR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
- F21K9/272—Details of end parts, i.e. the parts that connect the light source to a fitting; Arrangement of components within end parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/03—Lighting devices intended for fixed installation of surface-mounted type
- F21S8/031—Lighting devices intended for fixed installation of surface-mounted type the device consisting essentially only of a light source holder with an exposed light source, e.g. a fluorescent tube
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
- F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/104—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using feather joints, e.g. tongues and grooves, with or without friction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to a semiconductor lamp, comprising a rectilinear translucent tube whose open
- End surfaces can be closed by means of respective end caps, and equipped with at least one semiconductor light source circuit board, which is housed in the tube and is electrically contacted by at least one end cap.
- the invention is applicable to retrofit or replacement lamps for conventional elongate lamps, e.g.
- Fluorescent lamps and tube lamps With respect to semiconductor lamps is often a
- Plastic tube used as a piston. On the open
- End faces are usually the end caps firmly
- US 2010/0008085 A1 discloses a method of forming an LED-based light to replace a conventional one
- a fluorescent lamp in a fluorescent lighting fixture comprising: forming an elongated sheet of a highly thermally conductive material to form a heat sink. Shaping the heatsink allows the heatsink to be formed to cover and end cap attachment structures,
- WO 2014/001474 AI relates to a lighting device with a housing and with an accommodated in the housing electronic assembly, wherein it further at least one Side of the electronic module at least one
- An operative connection with the electronic module is and can be actuated from outside the housing, so that the electronic assembly is kept taut in the housing.
- EP 2 395 278 A2 discloses a lighting device comprising a light source unit, which in a
- a transparent cover member which is formed in a substantially straight pipe shape and has openings at both ends, is for receiving the
- Light source unit formed in the longitudinal direction.
- the cover member has a higher thermal expansion coefficient than the light source unit.
- End plate elements are at the two ends of
- Light source unit attached and close the openings at the two ends of the cover. It is the object of the present invention to overcome the disadvantages of the prior art, at least in part, and in particular to provide a semiconductor lamp of the type in question, which undergoes little change in temperature under temperature changes and particularly simple
- the object is achieved by a semiconductor lamp
- a printed circuit board housed in the pipe and electrically contacted by at least one of the two end caps, the two end caps being connected by means of one in the pipe extending connecting element are mechanically connected to each other, at least one of the end caps relative to the tube with a clearance is arranged longitudinally displaceable and a thermal expansion of the connecting element in a
- Semiconductor lamp can be assembled by simply plugging together or a simple plug movement.
- a locking connection can be implemented by comparatively easy to manufacture components.
- the attachment of the end caps on the connecting element with simultaneous longitudinal displacement of the tube relative to at least one of the end caps also has the advantage that a thermal change in length of the semiconductor lamp is determined by the change in length of the connecting element and not by the change in length of the tube. Since the thermal expansion of the connecting element in a longitudinal direction of the tube is less than the thermal expansion of the tube, this change in length is less than in a fixedly attached to the end caps tube.
- the tube may be longitudinally displaceable with respect to both end caps or may be longitudinally displaceable with respect to only one of the end caps.
- the translucent tube may be a transparent and / or a diffused tube.
- the tube may have a hollow cylindrical basic shape with e.g. a circular
- the tube may also be referred to as a tubular piston, tube piston or piston tube.
- the end caps can also be used as sockets, end pieces or
- both end caps serve for fastening the semiconductor lamp in a corresponding socket.
- only one of the end caps can also serve for an electrical contact.
- both end caps also one
- Contacting can be provided, for example, electrically conductive contact pins, e.g. for bipin connections.
- a driver for converting electrical signals input via at least one end cap into operating signals for operating the at least one semiconductor source may be accommodated in at least one of the end caps.
- Driver may be arranged only in an end cap, be split on both end caps and / or at least partially disposed on the equipped with the at least one semiconductor light source circuit board.
- the driver or part of it likes one or more on its own circuit board
- Driver board (Driver board ) arranged driver blocks.
- an end cap has the driver or a part of the driver, the part of this end cap having the electrical contacts can also be referred to as an "end cap contact part".
- the end cap then has in particular the end cap contact part and the driver attached thereto.
- the connecting element is connected directly to the end cap contact part of at least one end cap. It is also a development that the connecting element with the driver (or a part thereof) is connected to at least one end cap, that is, only indirectly via this driver with the end cap contact part.
- end caps are mated with the tube may mean that the end caps (inward) into the tube
- the mating includes in particular, that the end caps are at least partially inserted into the tube and / or attached to the pipe.
- Semiconductor light source at least one light emitting diode.
- a color may be monochrome (e.g., red, green, blue, etc.) or multichrome (e.g., white). This can also be done by the at least one
- LED emitted light is an infrared light (IR LED) or an ultraviolet light (UV LED).
- Light emitting diodes can produce a mixed light; e.g. a white mixed light.
- the at least one light-emitting diode may contain at least one wavelength-converting phosphor
- the phosphor may alternatively or additionally be arranged away from the light-emitting diode
- the at least one light-emitting diode can be in the form of at least one individually lighted LED or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate (“submount").
- the at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, e.g. at least one Fresnel lens,
- organic LEDs can generally also be used.
- the at least one semiconductor light source may be e.g. have at least one diode laser.
- the printed circuit board equipped with the at least one semiconductor light source can be a flexible or rigid band-shaped one
- the at least one semiconductor light source can be used, for example, as an extension direction of the
- Circuit board aligned row of LEDs are present, for example of LED chips.
- the fact that the printed circuit board is contacted by the two end caps, comprises in particular a mechanical contact, and for at least one of the two end caps also electrical contact.
- the contacting can be implemented directly or indirectly (eg via a driver or a part thereof).
- That at least one of the end caps is second to the pipe with a play longitudinally displaceable may include that - at least for a given temperature range such as between -20 ° C and + 70 ° C, 0 ° C and 50 ° C, etc. - the tube in Longitudinal direction has a play or a possible displacement path with respect to at least one of the end caps,
- the end cap can also be glued and / or jammed in addition to a latching with the connecting element, etc.
- the locking can basically be solvable or insoluble (without destruction of the semiconductor lamp).
- the fact that the connecting element is latched with at least one of the end caps may include that the end cap has at least one latching projection, which in at least one
- Locking receptacle of the connecting element engages, and / or that the connecting element has at least one latching projection which engages in at least one latching receptacle of the end cap.
- the connecting element has at least one latching recess which engages with at least one latching
- Locking projection of a respective end cap can be brought, as this can usually implement easier than the reverse
- Connecting element is flat, e.g. a metal strip is.
- the connecting element is a band-shaped, metallic connecting element.
- One such is particularly easy to produce and can be introduced into the tube and robust. Metal has a noticeable
- End caps is possible.
- PMMA Polymethyl methacrylate
- the connecting element may e.g. an aluminum strip or a steel strip or an element made of a steel strip.
- the band can also be used as a profile or as a strip
- the latching receptacle of the connecting element can in particular in this case a continuous
- End cap has at least one envelope area or envelope, which has a Raufaufnähme, in particular latching recess.
- a material reinforcement in the region of the Raufage is provided, which also allows a greater depth of Raufage for a particularly secure holding the associated locking cap.
- Envelope is located at one or both end portions of the connecting element and is particularly simple
- the connecting element for latching with a respective end cap has at least one latching recess, to which a ramp-like inwardly projecting area (hereinafter referred to as "fuse area" without restriction of the generality) in the direction of a proximal open end face followed. This allows a sliding of the connecting element for latching with a respective end cap.
- Latching recess extending in the plug-in direction (hereinafter also without limitation of generality direction of attachment,
- End cap located behind the securing area, and provides for the slide latching projection an additional
- respective end cap has at least one latching recess, from which a material region is turned over in the direction of a proximal open end face.
- circuit board rests flat on the connecting element. This can do that
- Connecting element in particular if it consists of a good thermal conductivity material such as metal, as well
- Heat sink for the circuit board and thus serve for the circuit board located at least one semiconductor light source.
- the printed circuit board can be fixedly attached to the connecting element, for example glued to it, for example by means of a double-sided adhesive tape, a thermal paste, etc.
- Die PCB can additionally or alternatively with the
- Connecting element screwed, riveted, jammed, clamped, etc. It is yet another embodiment that the circuit board rests loosely on the connecting element. This allows the circuit board and the connecting element
- Embodiment is particularly advantageous when the coefficients of longitudinal expansion of the printed circuit board and connecting element differ significantly. But it is also possible that the circuit board and the
- Connecting element are spaced from each other, so not or at least not over a large area (but, for example, only selectively) touch. This can be a mutual
- End cap is connected. It is also a development that the circuit board with the driver (or part thereof) is connected to at least one end cap, so only indirectly via this driver with the end cap contact part.
- circuit board by means of an electrical plug contact with at least one
- End cap i.e., with its end cap contact portion or
- the plug contact may be attached to the printed circuit board.
- the plug contact counter element For example, the driver board itself or one on the
- the plug contact counter element may also act as a jamming. It is also an embodiment that the connecting element is integrated into the circuit board. This allows a particularly compact and easily assembled internal structure of the semiconductor lamp. For example, that may be
- Connecting element have a metal strip or a metal strip, such as. has been described above, wherein at least one flat side of which at least one semiconductor light source is arranged.
- Insulation against the - e.g. electrically conductive connection element may already be the underside of the at least one semiconductor light source itself (i.e.
- Support surface be electrically isolated and / or there may be an electrical insulating layer between the connecting element and the at least one semiconductor light source.
- Plastic pipe is. A plastic pipe is inexpensive
- the invention is particularly advantageously applicable to this configuration, since the plastic tube commonly used have a problematic high thermal expansion coefficient in the range from typically about 70 x 10 "6 / ⁇ .
- the plastic may, for example, PC, PA, PVC, PMMA have etc. It can be transparent or diffused.
- the tube is formed on the inside as a linear guide for the circuit board and / or for the connecting element.
- Connecting element in the pipe allows without a
- the linear guide prevents in particular a free movement perpendicular to the Longitudinal direction.
- the linear guide can serve in particular as a stop against a movement perpendicular to the longitudinal direction and thus in this direction a positive
- the tube has inwardly projecting projections, which the circuit board
- Projections may be formed, for example, as rails or nubs. They may have been made in one piece with the remainder of the tube, e.g. by means of a
- Injection molding process may alternatively have been incorporated retrospectively, e.g. by gluing or by forming the tube.
- Connecting element is arranged in a cavity formed between the circuit board and the pipe.
- the circuit board act as a cover of the cavity and the
- the tube is equipped on the inside with a receptacle for the connecting element, which the connecting element in a
- Semiconductor lamp is a replacement lamp or retrofit lamp. It assigns to it at least approximately the form factor of
- the semiconductor lamp may be a retrofit lamp for replacing T-type fluorescent lamps, eg of the T5 or T8 type.
- the end caps then have in particular the form factor of G5 or G13 sockets, for example by the presence of two contact pins.
- the tube can then in particular have a diameter like the piston of the
- Fig.l shows a sectional view in side view a
- FIG. 2 shows a sectional view in an oblique view of a further detail of the semiconductor lamp according to the first embodiment
- Connecting element of a semiconductor lamp according to a third embodiment; 8 shows a sectional view in an oblique view
- Fig. 10 shows the semiconductor lamp according to the fourth
- Fig.l shows a sectional side view of an end portion of a semiconductor lamp 1 according to a first embodiment.
- 2 shows the semiconductor lamp 1 in sections as a sectional view in an oblique view.
- the retrofit lamp e.g. to replace a T8
- Fluorescent lamp provided semiconductor lamp 1 has a straight translucent tube 2 with a
- the tube 2 has e.g. open on both sides
- End faces 3 which are closable by means of respective end caps 4.
- the end caps 4 have an open in the direction of the tube 2 hollow cylindrical shape, so that they up to a predetermined maximum penetration depth into the tube. 2
- a driver 6 is housed, which has a driver board 7, which is equipped with a plurality of driver blocks 8.
- Semiconductor light sources in the form of e.g. of LEDs 17 um.
- the driver board 7 is inserted longitudinally displaceable in an electrical plug contact 15 and contacts it electrically.
- the electrical plug contact 15 is connected to a
- a band-shaped circuit board 16 is arranged, which is also equipped with a plurality of series-arranged along the longitudinal direction L LEDs 17.
- the plug contact 15 is against the driver board 7 while maintaining a
- the printed circuit board 16 lies with its underside loosely on a band-shaped connecting element in the form of a
- the steel strip 18 is locked at one end to the end cap 4, here with a
- the end cap 4 can therefore also be regarded as a system of the Endkappen- contact part 19 and the driver 6.
- the latching mechanism comprises a latching projection 20 of the end cap 4 projecting outwards on the shell side, which has a bevel in an insertion direction E of the end cap 4 into the tube 2. At the side facing away from the tube 2 of the
- the end cap 4 also has a introduced into the outer surface of the end cap 4 recess 21.
- the steel strip 18 has a counter-locking means a
- Locking recess 22 for engagement with the locking projection 20.
- the steel strip also has an inwardly directed
- End caps 4 can be shaped the same. Due to the
- a temperature-dependent change in length of the semiconductor lamp 1 as such is essentially determined by the comparatively small change in length of the steel strip 18. Since the coefficient of longitudinal expansion of the steel of the steel strip 18 is considerably lower than that of the plastic of the pipe 2, when heated, the clearance d becomes smaller and becomes larger as it cools. Therefore, a length expansion of the tube 2 is compensated by a change of the game d.
- the size of the game d can be easily determined by knowing the longitudinal expansion coefficients of the steel strip 18 and the
- Plastic tube 2 and the desired temperature range e.g., from -20 ° C to 70 ° C, from 0 ° C to 50 ° C or so).
- the connecting element 18 has at its end the envelope region 23, which is e.g. has been achieved by bending a flat steel strip by 180 °.
- Turnover area 23 has two superimposed layers 23a and 23b, in which congruent respective recesses have been introduced to form together the locking recess 22.
- the tube 2 is on the inside as a linear guide for the circuit board 16th and formed for the steel strip 18.
- the tube 2 has inwardly projecting projections 24 which hold the printed circuit board 16 perpendicular to the longitudinal direction L on the tube 2.
- the projections 24 may extend over a greater length or even the full length of the tube 2, or may, for example, have a plurality of longitudinally spaced L's
- Projections 24 may be present.
- the circuit board 16 and the tube 2 together form a cavity 25 in which the steel strip 18 is arranged.
- the steel strip 18 is located in a groove-like receptacle 26 and is held by the circuit board 16 therein. This has the advantage that the steel strip 18 is prevented by the circuit board 16 from bending and thereby
- FIG. 5 shows an oblique view of a section of a connecting element serving as a steel strip 32 a
- Semiconductor lamp 31 which also has the end cap 4, the circuit board 16 and the tube 2.
- the steel strip 32 also has in its end region a latching recess 33 for engagement with the latching projection 20 of the end cap 4, as in FIG.
- the securing portion 34 is disposed in the recess 21 of the end cap 4.
- the latching projection 20 can when inserting the end cap 4 on the
- FIG. 7 shows an oblique view of a section of a connecting element serving as a steel strip 42 a
- the steel strip 42 has in its
- End region also has a latching recess 43 for engagement with the latching projection 20 of the end cap 4 of the semiconductor lamp 41st as shown in Fig.8.
- a material region 44 in the direction of a next open end face of the tube 2 here: against the
- Material region 44 is arranged in the recess 21 of the end cap 4.
- the semiconductor lamp 51 has, in contrast to the semiconductor lamps 1, 31 and 41, a metallic connecting element which in a
- Printed circuit board 52 is integrated and e.g. as a core of it can serve. For engagement with the latching projection 20, a simple latching recess 53 is now provided.
- Fig. 10 shows the semiconductor lamp 51 in cross-sectional view through an LED 17.
- a tube 54 of the semiconductor lamp 51 is flattened at the back of the printed circuit board 52 to avoid a gap between a back of the printed circuit board 52 and the tube 54 to provide improved heat transfer from the circuit board 52 to allow the tube 54.
- the semiconductor lamps 1, 31, 41 and 51 shown in the embodiments can be assembled particularly easily by the circuit board and the (possibly in it
- the other end cap can be placed analogously or already connected to it before inserting the printed circuit board and the metal strip into the tube.
- the metal strip e.g. also a - in particular band-shaped - glass connecting element
- the connecting element itself may be a printed circuit board main body, in particular without a metallization.
- a number may include exactly the specified number as well as a usual tolerance range, as long as this is not explicitly excluded.
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015205030.0A DE102015205030A1 (de) | 2015-03-19 | 2015-03-19 | Halbleiterlampe |
PCT/EP2016/053314 WO2016146330A1 (de) | 2015-03-19 | 2016-02-17 | Halbleiterlampe |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3271650A1 true EP3271650A1 (de) | 2018-01-24 |
EP3271650B1 EP3271650B1 (de) | 2019-04-10 |
Family
ID=55398288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16705132.5A Active EP3271650B1 (de) | 2015-03-19 | 2016-02-17 | Halbleiterlampe |
Country Status (5)
Country | Link |
---|---|
US (1) | US10502370B2 (de) |
EP (1) | EP3271650B1 (de) |
CN (1) | CN107407478A (de) |
DE (1) | DE102015205030A1 (de) |
WO (1) | WO2016146330A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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CN103672763A (zh) * | 2013-11-27 | 2014-03-26 | 莱特尔科技公司 | 一种led灯管端盖组件 |
CN105090765A (zh) * | 2014-04-15 | 2015-11-25 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管灯具 |
CN204153514U (zh) * | 2014-10-08 | 2015-02-11 | 深圳市豪恩光电照明有限公司 | 灯具 |
-
2015
- 2015-03-19 DE DE102015205030.0A patent/DE102015205030A1/de not_active Withdrawn
-
2016
- 2016-02-17 EP EP16705132.5A patent/EP3271650B1/de active Active
- 2016-02-17 US US15/558,838 patent/US10502370B2/en active Active
- 2016-02-17 WO PCT/EP2016/053314 patent/WO2016146330A1/de active Application Filing
- 2016-02-17 CN CN201680016747.3A patent/CN107407478A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
US20180112836A1 (en) | 2018-04-26 |
DE102015205030A1 (de) | 2016-09-22 |
EP3271650B1 (de) | 2019-04-10 |
CN107407478A (zh) | 2017-11-28 |
US10502370B2 (en) | 2019-12-10 |
WO2016146330A1 (de) | 2016-09-22 |
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