EP3263471A1 - Capteur d'étiquettes destiné à détecter des étiquettes sur une bande support - Google Patents

Capteur d'étiquettes destiné à détecter des étiquettes sur une bande support Download PDF

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Publication number
EP3263471A1
EP3263471A1 EP17001070.6A EP17001070A EP3263471A1 EP 3263471 A1 EP3263471 A1 EP 3263471A1 EP 17001070 A EP17001070 A EP 17001070A EP 3263471 A1 EP3263471 A1 EP 3263471A1
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EP
European Patent Office
Prior art keywords
sensor
label
sensor body
layer
sensor according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP17001070.6A
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German (de)
English (en)
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EP3263471B1 (fr
Inventor
Roger Thiel
Alexander Nagel
Armin Ringwald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cab Produkttechnik Gesellschaft fur Computer- und Automations-Bausteine Mbh & Co KG
Original Assignee
Cab Produkttechnik Gesellschaft fur Computer- und Automations-Bausteine Mbh & Co KG
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Publication of EP3263471A1 publication Critical patent/EP3263471A1/fr
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65C—LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES
    • B65C9/00—Details of labelling machines or apparatus
    • B65C9/40—Controls; Safety devices
    • B65C9/42—Label feed control

Definitions

  • the invention relates to a label sensor for scanning labels on a carrier tape, with a sensor body, with a ferromagnetic core with a coil, and with a scanning member.
  • the labels are usually detached from a label tape and applied to the article in an adhesive manner.
  • This process is commonly referred to as label dispensing and is accomplished by means of labeling machines that drive a label tape provided with labels.
  • the labeling machines also have at least one label sensor, which is arranged on the label tape and constantly checks whether a label is present at a certain point of the label tape. If this is the case, the labeling machine stops the drive of the label tape for a short time to print and / or transfer the label. The label tape is then accelerated again until the label sensor detects a label again.
  • the labels are applied to the tape at small intervals, usually 2 mm to 4 mm, on the tape.
  • the efficiency of the labeling process is therefore largely determined by the time in which labels can be detected and applied.
  • Generic label sensors are for example from the DE 20 2014 101 101 U1 known, which have a sensor head, two electrically conductive spring elements and a fastening part.
  • the sensor head is provided with an electromagnet having a ferromagnetic core and a coil, and whose signal is used for label detection.
  • the fastener is used to attach the label sensor to the labeller.
  • the known label sensor is arranged in the vicinity of the label tape such that its sensor head is in contact with the label tape.
  • the electrically conductive spring elements of the sensor head of the label sensor is designed to be elastic.
  • an electrically conductive part also a ferromagnetic part, such as a stainless steel sheet arranged.
  • the sensor head changes its distance from the label tape depending on whether or not there is a label between the sensor head and the label tape.
  • This changed distance causes a change in the magnetic field between the electromagnet formed with the sensor coil and the opposite ferromagnetic part and thus manifests itself in an altered electrical signal the coil of the sensor head, which is measured and evaluated by means of an electrical measuring unit.
  • it can be determined when exactly a label is present on the label tape, so that then the label tape can be stopped and the label can be applied to the article.
  • the known label sensors have the disadvantage that, in particular for the production of the sensor body always several different components made of different materials are necessary, which are interconnected.
  • a label sensor having the features of independent claim 1, which is characterized in that the sensor body is designed as a printed circuit board with at least one electrically insulating carrier layer and at least one arranged on the carrier layer conductor level with electrical conductors and that a middle connection region of Sensor body has a lower strength or weakening compared to the two adjacent contact and sensor areas.
  • the entire sensor body formed as a printed circuit board is so unitary, i. formed as a non-destructive separable part. It has at one end a contact region and at the other end a sensor region carrying the actual sensor and between this a connection region with a small thickness, which is designed so elastic.
  • the invention is based on the consideration that the design of the sensor head as printed circuit board obviates the need for the discrete components of the sensor body known from the prior art, in particular the spring elements mentioned in this connection and the fastening part. Instead, both the properties of the circuit board in terms of their elasticity and in terms of electrical connection options can be used. This eliminates the known from the prior art disadvantages.
  • the components required for the label sensor can be formed as integrated components on the circuit board, which manifests itself in a space-saving design of the label sensor.
  • the carrier layer of the printed circuit board is electrically insulating, ie non-conductive, and preferably comprises at least partially a component made of a composite material, in particular a glass fiber composite material, most preferably a composite material of glass fibers and an epoxy resin is provided.
  • a composite material in particular a glass fiber composite material, most preferably a composite material of glass fibers and an epoxy resin is provided.
  • the material FR4 which is widely used for circuit boards may be provided for the carrier layer, such as Isola IS 410 from Isola GmbH.
  • the sensor body as a component of the label sensor sufficiently flexible material properties for the use case. In particular, also eliminates the need for additional spring elements.
  • the carrier layer of the printed circuit board may comprise components of polymers, polyesters, in particular films of polyamide, Teflon, aluminum oxide, PET, PEN or ceramic.
  • the carrier layer of the printed circuit board consists of a flexible polyamide film which has elastic properties.
  • Flexibility in the sense of the invention refers to the ability of a body to change its shape due to an external force.
  • Elastic in the sense of the invention means that a deformed by an external force body due to the deformation generates a restoring force to return to discharge in the original state. This restoring force can be particularly proportional to the deformation of the body, such as in a spring.
  • the conductor plane of the sensor body has at least one electrical conductor, which is preferably configured as a conductor made of copper.
  • the at least one conductor track of the conductor plane can be made, for example, by means of an etching process, starting from an originally flat conductor layer. The remaining, not provided with the track region of the conductor level is provided with electrically insulating material, such as an epoxy resin.
  • the carrier layer has both at one Top as well as on a bottom in each case a conductor level. This offers greater freedom for the electrical connections.
  • the spatially separated conductor planes at the top and at the bottom of the carrier layer are in themselves electrically insulated from each other by the carrier layer, but may be electrically connected to one another by means of at least one VIA.
  • a VIA in the sense of the invention denotes an opening in the carrier layer and, if appropriate, in the conductor plane, which is provided with electrically conductive material and thereby enables an electrical connection of a plurality of conductor planes.
  • the printed circuit board preferably has at least one plate layer.
  • a plate layer in the sense of the invention refers to a layer composite of a carrier layer and at least one additional layer, wherein preferably two additional layers, one of the additional layers on one upper side of the carrier layer and the other of the additional layers on a lower side of the carrier layer can be arranged.
  • these additional layers are formed as conductor planes, but the layers may also comprise other materials and perform other functions, as described in detail below.
  • Conductor tracks of conductor planes of different plate layers can be electrically connected to one another, preferably by means of at least one VIA.
  • the conductor track of at least one conductor layer of the sensor body is provided with a protective layer, wherein in particular the protective layer consists of a compound of nickel and gold, also known as "Chemically Nickel Gold" (NiAu).
  • the protective layer of NiAu serves on the one hand as oxidation protection (Au) and on the other hand as solder bridge (Ni) for additional components for the sensor body.
  • a middle connection region of the sensor body has a lower strength or weakening or depression than at the contact and sensor regions adjoining on both sides, whereby the elastic properties of the sensor body are improved.
  • the weakening of the sensor body is created a larger pivot radius of the flexible sensor body.
  • this embodiment increases the application margin of the label sensor and, on the other hand, increases its longevity.
  • the middle connection region with the weakening forms a resilient element of the sensor body.
  • the recess of the sensor body in the central region can be milled and is thus easy to manufacture.
  • the recess can be punched out or made by laser machining.
  • the sensor body is designed as a multilayer printed circuit board with at least one prepreg layer.
  • a prepreg layer designates a finished part, namely a layer of a semifinished product of a resin and a carrier material which has not yet been cured, referred to as a prepreg.
  • carrier materials serve the same materials as in the carrier layer.
  • the prepreg layer may be provided between two plate layers. Since no curing of the prepreg layer has taken place, parts of the prepreg semifinished product arrive in possibly existing, small recesses of the sheet layers surrounding the prepreg layer.
  • the prepreg layer In order to cure the prepreg layer, it is pressed together with the surrounding sheet layers with the addition of heat, so that after hardening of the prepreg layer, the two sheet layers are bonded together in a material-locking manner due to the original flow properties of the prepreg layer.
  • the prepreg layer is formed as a no-flow prepreg layer.
  • a no-flow prepreg layer refers to a prepreg layer which has a particularly high viscosity, especially during the curing process, so that the no-flow prepreg layer retains its shape during the curing process and hardly changes its structure in order to maintain its dimensional stability.
  • a particularly dimensionally stable connection of two plate layers is created. It is possible contours, for example punched or generated by laser cutting, to introduce into the no-flow prepreg layer and to maintain these contours dimensionally stable even after the curing process.
  • the no-flow prepreg layer is applied only in the end regions of the sensor leaving the area of later lesser strength or weakening.
  • the further stratification is carried out by hardened plate layers.
  • these layers located above the no-flow prepreg layer are subsequently removed, in particular by stitching. It has been shown that a significantly better reproducible sensor carrier with smaller tolerances can be produced as a result (Aus-) milling the weakening is already possible. In particular, very precisely reproducible parts are therefore reasonably attainable.
  • the risk is minimized that parts of the no-flow prepreg layer reach the region of the recess or later weakening and the structure of the PCB adversely affect.
  • the defined shape of the depression or the weakening also remains after the curing process, and thus the mechanical properties of the sensor body can be precisely defined.
  • the middle connection region of the sensor body can be provided with at least one longitudinal breakdown in order to improve the elastic properties of the sensor body.
  • An underside of the sensor body facing away from the scanning element may be at least partially provided with a plastic coating, which preferably consists of a polyamide, in particular of nylon or Teflon.
  • a plastic coating which preferably consists of a polyamide, in particular of nylon or Teflon.
  • the carrier layer as a film for example made of polyamide, PET or PEN, on the one or both sides in each case a conductor layer may be arranged, the rigidity of the sensor body and thus its elastic properties are influenced by the coating.
  • the coil is formed as a conductor or wound from wire winding.
  • the first embodiment eliminates the need for coils in the form of a winding as a separate component for the label sensor, so that rather the coil is designed as an integrated component, namely helical conductor in the sensor body.
  • such coil tracks are provided in a plurality of conductor planes of the sensor body, so that a significantly higher number of turns and thus a larger inductance in connection with the core of the label sensor can be achieved.
  • one winding is provided in each of the conductor planes.
  • Multiple coil paths may be electrically connected to each other by means of at least one VIA.
  • the ferromagnetic core has concentric inner and outer annular projections, between which an annular groove for receiving the coil is formed.
  • An embodiment provides that the outer annular projection has openings in the longitudinal direction of the label sensor.
  • the sensor body has an ESD protective structure for protection against, in particular, electrostatic discharges. Similar to a lightning arrester, the ESD protection structure serves to dissipate static charges, preferably via a grounded electrical connection provided on the sensor body. As a result, damage to the sensor body due to electrical discharges are avoided.
  • the ESD protection structure is formed in a conductor plane of the sensor body, in particular as at least one protective line.
  • the protective line is connected to all integrated components of the sensor body.
  • individual or all conductor levels may have protective lines. These may be electrically connected to each other, for example by means of at least one VIAs.
  • the sensor body may have at least one temperature-independent resistor, to which at least one parallel-connected capacitor may preferably be assigned.
  • a parameter correlating to the ambient temperature can be measured at the temperature-independent resistor, for example the temperature-dependent resistor itself and / or the voltage drop resulting from the temperature-dependent resistance.
  • the ambient temperature can be determined indirectly via this temperature-dependent parameter.
  • the inductance of the electromagnet core and coil may change, which leads to a falsification of the measurement results.
  • a corresponding correction can take place on the software side. As a result, the measurements are less sensitive to fluctuations in the ambient temperature.
  • the temperature-dependent resistor is preferably mounted on the side facing the carrier tape side of the printed circuit board, so that no heating effects of the sensor itself affect the measurement.
  • the temperature-dependent resistor may be attached to the upper side of a conductor layer of the sensor body, in particular soldered.
  • This design as SMD Surface Mounted Device eliminates the need for holes in the sensor body for mounting the temperature-dependent resistor.
  • FIG. 1a shows a label sensor 1 according to the invention with a sensor body 2 in a perspective view obliquely from above.
  • the sensor body 2 can be roughly divided into three areas, a front, in FIG. 1a Contact area 3 shown on the left, a middle connecting area 4 and a rear, in FIG. 1 right illustrated sensor area 5.
  • the sensor body 2 is designed as a printed circuit board whose structure is described in detail below. Due to the configuration according to the invention, the sensor body 2 is so elastic that the rear sensor area 5 can be deflected relative to the front contact area 3, this causing a restoring force directed counter to the deflection.
  • a direction “forward” denotes a direction facing the front contact area 3, while a “rear” direction faces the rear sensor area 5.
  • the front contact region 3 has a substantially rectangular base surface, wherein those sides which run parallel to a longitudinal direction L of the label sensor 1 are each provided with a funnel-shaped recess 6 with concavely curved walls, by means of which the label sensor 1 in positive connection to a Labeling machine can be attached, for example by clamping action.
  • the contact holes 8 are used for electrical and mechanical connection of the sensor body 2 with an electrical contact part 9, which in the embodiment shown on its the label sensor 1 facing upper three contact pins 10 which in Fig. 1 are covered in perspective of the sensor body 2 and in section the Fig. 3 can be seen.
  • the contact pins 10 of the contact part 9 pass through the contact bores 8 of the front contact region 3 in such a way that the contact pins 10 are flush with an upper side 11 of the front contact region 3.
  • the electrical contact part 9 itself is arranged on a lower side 12 of the sensor body 2.
  • the contact pins 10 form on the side facing away from the sensor body 2 underside of the contact part 9 three contact feet 13, via which the label sensor 1 with a higher-level circuit of the labeling machine is electrically connected.
  • the front contact region 3 has, on its side facing the middle connection region 4, a circular fastening bore 22, which is designed as a breakthrough and by means of which the label sensor 1 can be fastened to the labeling machine, for example by a bolt, a screw or the like.
  • the fastening bore 22 may have a thread (not shown).
  • the middle connection region 4 of the sensor body 2 has a smaller thickness in this embodiment than the regions 3, 5, so that a weakening 14 or a Well is formed.
  • the recess 14 may be formed by milling in the sensor body 2.
  • “flexible” means that the rear sensor region 5 of the sensor body 2 can be deflected relative to the front contact region 3 without damaging the sensor body 2.
  • the rear sensor area 5 of the sensor body 2 essentially has an octagonal base area and corresponds in its material thickness to the front contact area 3.
  • An upper side 15 of the rear sensor area 5 has centrally a recess 16 with a circular base area whose depth corresponds to the depth of the weakening 14 of the middle connection area 4 corresponds to what also FIG. 3 comes out.
  • an upright scanning member 17 is arranged radially is completely surrounded by a ferromagnetic core 18. In the application, the scanning member 17 is in contact with the label tape or with the labels attached to the label tape.
  • the ferromagnetic core 18 is made of iron, for example. He has in this embodiment, an inner vertical annular projection 18.1 and an interrupted in the longitudinal direction L of the label sensor 1 on both sides by openings 21 outer annular projection 18.2, between which an annular groove 18.3 is formed for receiving a coil 19.
  • the coil 19 is formed here by a winding of wound copper wire
  • the annular projections 18.1, 18.2 occupy about half the height of the scanning member 17 a.
  • the winding 19 consists essentially of (insulated) copper wire.
  • the winding 19 surrounds the inner annular projection 18.1.
  • the outer annular projection 18.2 of the core 18 on two opposite and molded in the longitudinal direction L of the label sensor 1 openings 21. Through the core 18 and arranged around him coil 19, an electromagnet is formed.
  • the scanning member 17, the core 18 and the coil 19 project beyond the upper side 15 of the rear sensor region 5.
  • FIG. 1b shows the label sensor 1 of FIG. 1a in supervision. From the supervision of FIG. 2 shows that the width of the front contact region 3 at the depths of the funnel-shaped recesses 6 corresponds to the width of the middle connection region 4 and the maximum transverse extent of the sensor body 2 in the rear sensor region 5.
  • the diameter of the mounting hole 22 corresponds approximately to the diameter of the core 18 in the rear sensor area 5 and is larger than the respective diameter of the five contact holes 8 in the front contact area 3.
  • the radial centers of the central contact hole 8, the mounting hole 22 and the circular recess 16 are on a straight line which is parallel to the longitudinal direction L of the label sensor 1 and aligned with the in FIG. 2 drawn section line AA coincides.
  • Figure 1c shows the label sensor 1 of FIGS. 1a and 1b in a schematic section along the in FIG. 1b drawn section line AA.
  • the upper sides of the contact pins 10 of the electrical contact part 9 terminate flush with the upper side 11 of the front contact region 3 of the sensor body 2.
  • the electrical contact part 9 is, as already stated, arranged on the underside 12 of the sensor body 2, so that the contact feet 13 of the contact device 9 extend away from the sensor body 2.
  • the structure already described with scanning element 17, core 18, winding 19 and shield 20 can be seen.
  • the underside 12 of the sensor body 2 in the rear sensor region 5 is provided with an opening 23 in which a socket-shaped end piece 24 of the scanning member 17 is arranged such that the end piece 24 is flush with the underside 20 of the sensor body 2.
  • the scanning member 17 is positively, positively and / or materially connected to the sensor body 2.
  • FIGS. 2a to 2c show a further embodiment of the label sensor 2, in which the central connecting portion 4 is provided with a centered and slot-shaped aperture 14a.
  • the breakthrough 14a extends in the longitudinal direction L over the entire length of the central connection region 4. Due to the material weakening of the sensor body 2 caused by the opening 14a, the required flexibility of the sensor body 2 is achieved without the embodiment of FIGS. 2a to 2c the strength of the middle connection region 4 has to be reduced.
  • the label sensor 1 may be provided both with a recess 14 and with an opening 14 a, which is an embodiment of the label sensor 2 according to the FIGS. 3a to 3c shows.
  • FIG. 4 shows - not to scale - a schematic structure of an embodiment of the sensor body 2 with a multilayer printed circuit board. For the sake of clarity, only the sensor body 2 is shown, without the previously described constructive embodiments of the areas 3, 5 FIG. 4 is located on the left side of the front contact area 3, centered the middle connection area 4 with the recess 14 on the right side of the rear sensor area. 5
  • both conductor planes 27 are arranged above and below the carrier layer 26 and thus spatially separated and thus electrically isolated from each other by the interposed carrier layer 26, both conductor planes 27 can be interconnected by vertical interconnect access (VIA) connections (not shown) be electrically connected.
  • VIAs have in the carrier layer 26 and possibly also in the conductor planes 27 molded-through openings, which are provided with electrically conductive material and thereby allow an electrical connection of both conductor planes 27.
  • the thickness of the carrier layer 26 is in the embodiment shown the FIG. 4 about 510 microns, the thickness of each conductor plane 27 in about 35 microns.
  • a second plate layer 29 is arranged above the upper conductor plane 27 after a first intermediate layer 28.
  • the first intermediate layer 28 is configured as a "no-flow prepreg".
  • prepreg usually denotes a semi-finished resin and carrier material, and substantially corresponds to a not yet cured precursor of the base material for the carrier layer 26.
  • the prepreg material is initially soft and then hardens finally for connecting the hard plate layers, wherein it is pressed with the surrounding layers. After curing and compression, the prepreg layer bonds the layers immediately surrounding it.
  • first intermediate layer 28 As a "no-flow prepreg” prepregs are referred to, which have a particularly high viscosity, especially in the final pressing and curing process. As a result, the "no-flow prepreg” material cures largely dimensionally stable.
  • the concrete embodiment of FIG. 4 serves as a "no-flow prepreg" formed first intermediate layer 28 to avoid flow of the material in the region of the recess 14 of the central connecting portion 4 during the pressing and curing process.
  • the thickness of the first intermediate layer 28 is in the two-digit micron range.
  • the second plate layer 29 above the first intermediate layer 28 consists of a carrier layer 30, a "no-flow prepreg" layer 31 on the underside of the carrier layer 30 and a prepreg layer 32 arranged above the carrier layer 30
  • the "no-flow prepreg" layer 31 substantially corresponds in material and thickness to the first intermediate layer 28 and, like all other layers of the second and third plate layers 29, 34, extends only to the front contact region 3 and the rear Sensor area 5 of the sensor body second
  • the carrier layer 30 of the second plate layer 29 corresponds in its thickness and in its material to the carrier layer 26 of the first plate layer 25.
  • the prepreg layer 32 is arranged, whose viscosity in the pressing and curing process is higher than that the "no-flow prepreg" layer 31 and its strength is in the two-digit micrometer range.
  • a second intermediate layer 33 is arranged, which corresponds in thickness and material of the prepreg layer 32 arranged underneath.
  • a third plate layer 34 is arranged, which has a central carrier layer 35 which carries above and below each a conductor plane 36 with copper tracks.
  • the materials and the arrangement of the layers of the third plate layer 34 substantially correspond to the first plate layer 25, wherein the detailed configuration of the conductor planes 27, 36, in particular with respect to the conductor tracks, can be configured differently.
  • VIAs (not shown), individual or all conductor levels 27, 36 can be electrically connected to one another.
  • the structure of the rear sensor area 5 according to FIG. 4 corresponds to the above-described construction of the front contact area 3, so that reference is made.
  • the conductor planes 36 of the rear sensor region 5 can be electrically connected to one another via the conductor planes 27 of the first plate layer 25 with the conductor planes 36 of the third plate layer 24 in the front contact region 3.
  • the conductor tracks of the upper conductor plane 36 of the third plate layer 34 of the front contact region 3, the upper conductor plane 27 of the first plate layer 25 in the middle connection region 4 and the upper conductor plane 36 of the third plate layer 34 of the rear sensor region 5 are provided with a coating 37 of nickel and gold , referred to as "NiAu” or as "chemical nickel gold".
  • the coating has a thickness of 3 to 6 microns and serves on the one hand as a solder bridge (Ni) for additionally provided components that can be soldered onto the sensor body 2 and on the other hand as oxidation protection (Au).
  • FIG. 5 shows a schematic side view of a further embodiment of the sensor body 2 in a simplified representation similar to that in FIG FIG. 4 shown illustration.
  • the sensor body 2 has according to FIG. 5 again three plate layers 25, 29, 34, wherein the first plate layer 25 as a rectangle and the second plate layer 29 together with the third plate layer 34 in the front contact area 3 and in the rear sensor area 5 are also shown as a rectangle.
  • the carrier layer (not shown) of the first plate layer 25 is configured as a polyamide film and has a significantly reduced thickness compared to the second and third plate layers 29, 34, which FIG. 5 not shown to scale.
  • the carrier layer of the first plate layer 25 is provided with a respective conductor level of copper, which also for clarity not in FIG. 5 is drawn.
  • the structure in detail insofar as in the embodiment of FIG. 4 , to which reference is made.
  • Coating 37a disposed of polyamide, wherein for the coating 37a, other plastics may be provided.
  • the thickness of the coating 37a may be up to a multiple of the thickness of the first plate layer 25. Due to the coating 37a, the rigidity of the sensor body increases, so that its properties with regard to its elasticity are adjustable by the configuration of the coating 37a.
  • first plate layer 25, the second and third plate layers 29, 34 and the coating 37a are shown as spaced apart from each other, but this is only for clarity since the components mentioned are, of course, in contact with each other.
  • FIG. 6 shows a sensor body 2 in a further embodiment in a perspective view obliquely from above.
  • the front contact region 3 and the middle connection region 4 are according to the previously shown embodiment of FIG Fig. 1 configured, so that in the following the design of the rear sensor portion 5 is discussed.
  • the rear sensor region 5 is provided with a substantially arcuate opening 38 with the exception of a connecting web 39, on which a cylindrical sensor fitting 40 is formed.
  • the connecting web 38 and the sensor fitting 40 are formed integrally with the remaining sensor body 2 and as a multilayer printed circuit board, the sensor fitting 40 having a central recess 41.
  • FIG. 7 is the electromagnet ferromagnetic core 18 and coil 19 to the sensor body 2 of the FIG. 6 arranged such that the sensor fitting 40 of the annular groove 18.3 of the Kerns 18 is included.
  • the inner annular projection 18.1 passes through the central recess 41 and the outer annular projection 18.2 passes through the arcuate opening 38.
  • the coil 19 is formed by tracks of the conductor planes 27 of the first plate layer 25 (see the structure of the circuit board according to FIG. 4 ).
  • the traces are indicated by circumferentially extending lines on the sensor mount 40, in fact being configured in the sensor mount 40 as an integrated component in the printed circuit board.
  • FIG. 8 a further embodiment of the label sensor 1 is shown, wherein the central connection region 4, or the region of the weakening 14 is characterized for clarity with a greater line thickness.
  • the embodiment of the label sensor 1 according to the FIG. 8 In addition, two VIAs 44 for the winding 19 and two VIAs 47 for a discharge protection 45 are formed in the rear sensor area 5, which will be described further below is.
  • the label sensor 1 according to FIG. 8 has a sensor body 2, which is designed as a three-layer printed circuit board, and for example in the in FIG. 4 is shown embodiment, so that in the depth direction three levels of tracks are formed, which are explained below.
  • FIG. 9 shows an upper conductor plane, for example, one of the two in FIG. 4 shown conductor planes 36 of the third plate layer 34 corresponds. In the region of this conductor level, the components of the front contact region 3 and of the rear sensor region 5 are spatially separated from one another, since there is no consistently configured conductor plane due to the weakening 14 in the middle connection region 4.
  • the front contact area 3 points in FIG. 9 a substantially circumferentially configured front protective line 46, which serves as an ESD protection structure 45.
  • the ESD protection structure 45 protects the printed conductors and the electronic components of the sensor body 2 similar to a lightning conductor against locally occurring voltage peaks due to electrostatic discharges (ESD: electrostatic discharges). As a result, damage due to electrical charges are avoided.
  • the contact holes 8 are in the following perpendicular to the longitudinal direction L of the sensor body according to FIG. 9 counted from top to bottom, so that the fifth contact hole is the one that is furthest down.
  • the front protection line 46 is connected to the third contact hole 8, which is formed as a ground terminal. For example, if an electrostatically charged user touches the FIG. 9 shown upper conductor level, the electrostatic potential of the user on the - grounded - front protection line is derived before electronic components of the sensor body are damaged.
  • the second and fourth contact holes 5 are electrically connected to temperature-dependent resistors, wherein the temperature-dependent resistors on solder points 42 (in FIG. 9 shown as black rectangles) can be soldered.
  • the temperature-dependent resistors are capacitors in parallel circuit for stabilizing the voltages associated with the resistors 42, which are also attached as a black rectangle solder pads attached.
  • two terminals 43 for the coil 19 are shown as black circles, which are electrically connected to a respective VIA 44.
  • FIG. 10 shows a middle conductor plane, according to FIG. 4 the upper conductor level 27 of the first plate layer 25 corresponds.
  • the front contact region 3 is electrically connected to the rear sensor region 5.
  • the first of the five contact holes 8 of the front contact region 3 is connected via a conductor track to the upper VIA 44 for the coil 19 at approximately the same height.
  • the fifth contact bore 8 is connected to the VIA 44 for the contacting 43 of the coil 19 at the same height.
  • FIG. 11 shows a lower conductor level in FIG. 4 the lower conductor level 27 of the first plate layer 25 corresponds and in particular, as already the middle conductor level according to FIG. 10 , the front contact area 3 electrically connects to the rear sensor area 5 via conductor tracks.
  • the lower conductor level according to FIG. 11 has a lower one Protective line 49, the mounting hole 22 and the third contact hole 8 in the front contact area 3 with the two VIAs 47 of the rear sensor area 5 for connection to the rear protection line 48 of in FIG. 9 connecting upper conductor level connects.
  • FIG. 12 is a possible electrical circuit diagram for the sensor head of FIGS. 8 to 11 shown.
  • the contact holes 8 are shown.
  • the first and fifth contact holes 8 are connected to the terminals 43 for the coil 19.
  • the second and fourth contact bores 8 are both connected to the temperature-dependent resistor 42 and a capacitor 50 connected in parallel thereto.
  • the third contact bore 8 is connected to the protective lines 46, 48, 49 of the ESD protection structure 45.
  • the label sensor 1 is in direct contact with a label tape provided with labels, wherein the scanning member 17 contacts the label tape on the side facing the labels.
  • a ferromagnetic part is arranged so that both the label tape and the label sensor are in the magnetic field of the permanent magnet.
  • the label tape When the label tape is driven, a label passes between the label tape and the scanning member 17, so that the rear sensor area is deflected. As a result of this movement is due to the inductance of the core 18 and the coil 19 by a change in the distance to the rear ferromagnetic part of an altered electrical signal measurable that used for detection and switching operations becomes.
  • the label tape - may be stopped under predetermined lead for removal of the label and re-driven after removal, so that the process can be repeated at the next label.

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  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
EP17001070.6A 2016-06-29 2017-06-23 Capteur d'étiquettes destiné à détecter des étiquettes sur une bande support Active EP3263471B1 (fr)

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DE102016007940.1A DE102016007940A1 (de) 2016-06-29 2016-06-29 Etikettensensor zum Abtasten von Etiketten auf einem Trägerband

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EP3263471A1 true EP3263471A1 (fr) 2018-01-03
EP3263471B1 EP3263471B1 (fr) 2021-04-21

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017003018B4 (de) 2017-03-29 2020-06-04 Cab Produkttechnik Gesellschaft für Computer- und Automations-Bausteine mbH & Co. KG Verfahren zum Überwachen eines durch ein Etikettiergerät geführten Etikettenbandes und Vorrichtung zum Etikettieren

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0569024A1 (fr) * 1992-05-07 1993-11-10 HERMA GmbH + Co KG Détecteur d'étiquettes
WO2001010723A1 (fr) * 1999-08-06 2001-02-15 Koch Supplies Inc. Appareil et procede de detection d'etiquettes
DE202014101101U1 (de) 2014-03-11 2014-04-03 Herma Gmbh Etikettensensor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH464055A (de) * 1966-09-29 1968-10-15 Guhl & Scheibler Ag Ausgabevorrichtung für Selbstklebe-Etiketten
DE2828103A1 (de) * 1978-06-27 1980-01-03 Hermann Gmbh Co Heinrich Blattabtaster
DE102005054593B4 (de) * 2005-11-14 2018-04-26 Immobiliengesellschaft Helmut Fischer Gmbh & Co. Kg Messonde zur Messung der Dicke dünner Schichten
DE202010006062U1 (de) * 2010-04-23 2010-07-22 Helmut Fischer GmbH Institut für Elektronik und Messtechnik Messsonde zur zerstörungsfreien Messung der Dicke dünner Schichten

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0569024A1 (fr) * 1992-05-07 1993-11-10 HERMA GmbH + Co KG Détecteur d'étiquettes
WO2001010723A1 (fr) * 1999-08-06 2001-02-15 Koch Supplies Inc. Appareil et procede de detection d'etiquettes
DE202014101101U1 (de) 2014-03-11 2014-04-03 Herma Gmbh Etikettensensor

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DE102016007940A1 (de) 2018-01-04

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