EP3213338B1 - Générateur de rayons x - Google Patents
Générateur de rayons x Download PDFInfo
- Publication number
- EP3213338B1 EP3213338B1 EP15825793.1A EP15825793A EP3213338B1 EP 3213338 B1 EP3213338 B1 EP 3213338B1 EP 15825793 A EP15825793 A EP 15825793A EP 3213338 B1 EP3213338 B1 EP 3213338B1
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- EP
- European Patent Office
- Prior art keywords
- base body
- heat
- heat dissipating
- ray tube
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 6
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- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J35/00—X-ray tubes
- H01J35/02—Details
- H01J35/04—Electrodes ; Mutual position thereof; Constructional adaptations therefor
- H01J35/08—Anodes; Anti cathodes
- H01J35/12—Cooling non-rotary anodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/12—Cooling
- H01J2235/1225—Cooling characterised by method
- H01J2235/1262—Circulating fluids
- H01J2235/1283—Circulating fluids in conjunction with extended surfaces (e.g. fins or ridges)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2235/00—X-ray tubes
- H01J2235/12—Cooling
- H01J2235/1225—Cooling characterised by method
- H01J2235/1291—Thermal conductivity
- H01J2235/1295—Contact between conducting bodies
Definitions
- the present invention relates generally to an X-ray tube with an anode which, during operation, carries a high voltage, preferably more than 120 kV, particularly preferably more than 300 kV, and which heats up.
- the invention relates to an X-ray tube with a heat sink which is suitable for cooling the high-voltage anode when space is limited.
- X-ray tubes as an example of a device for generating X-rays (X-ray generator) are known.
- X-ray generator X-ray generator
- DD 139 327 A suggests, for example, that to increase the dielectric strength in a housing of an X-ray tube, a sleeve made of a dielectric material such as epoxy resin with quartz powder, ceramic or PTFE, which essentially accommodates a glass bulb of the X-ray tube inserted therein and covers the X-ray tube radially opposite a housing, is proposed . Due to the additional dielectric material, the anode of the tube is better electrically shielded or insulated from the environment.
- DE 10 2008 006 620 A1 shows an X-ray tube in which the tubular housing of the tube is made of a ceramic. The assemblies for generating the X-rays are arranged in the housing. The anode of an X-ray tube heats up during operation; to avoid damage from overheating, the heat from the anode is usually dissipated via a heat sink.
- Passive heat sinks enlarge the heat-emitting surface of a heat-producing component and are generally known; for example from the DE 20 2007 007 568 U1 .
- Known heat sinks usually consist of a metal with good thermal conductivity, for example aluminum or copper.
- a metal heat sink on the part of the anode located outside the housing of the X-ray tube there is a minimum distance between the heat sink and other components or housing parts that have a reference potential (e.g. ground, GND, etc.) must be observed in order to prevent voltage flashovers. If the X-ray tube is to be operated with higher voltages, this safety distance must be increased accordingly. This can require an enlargement of the outer housing of a system in which the X-ray tube is arranged.
- An insulation sleeve, as with the DD 139 327 A would affect the heat dissipation.
- a heat sink made of a ceramic with good thermal conductivity properties such as aluminum oxide or aluminum nitride, could be used.
- a ceramic heat sink is expensive to manufacture because special shapes must be used.
- the metal of the anode - usually copper - has a higher coefficient of thermal expansion than the ceramic heat sink attached to the outside. This makes the heat transfer between the anode and the heat sink problematic: On the one hand, the heat sink should be in the best possible thermal conduction contact with the anode in order to achieve the highest possible heat transfer coefficient. On the other hand, the heat sink must not be damaged or even blown off by the anode that expands when it is heated.
- the design requirement is "as compact as possible”.
- the size of an X-ray generator is limited by the fact that certain components have to be integrated and the distances between the components, which are at different electrical potentials, have to be chosen so that the dielectric strength of the insulation media is not exceeded at any point.
- JP 2009 164038 A shows as the closest prior art an X-ray tube with an anode heat sink according to the preamble of claim 1. A similar arrangement is shown in FIG WO 2013/021794 A1 .
- US 2003/221816 A1 shows a heat sink with a metallic base body and ceramic plate-shaped heat dissipation elements. Similar arrangements are shown in CN 202 221 659 U , pin-shaped heat emitting elements are also shown there.
- WO 2012/031943 A1 shows, inter alia, cylindrical heat sinks in which a metallic base body is cast onto ceramic plate-shaped heat dissipation elements.
- a core idea of the invention is to use a base body of a heat sink as an interface to the anode to be cooled, which is preferably made of metal, made of a metal that conducts heat well, such as. B. aluminum (Al) or copper (Cu), and on the base body to increase the surface area as heat transfer to the environment heat dissipation elements such. B. cooling pins and / or cooling fins made of a heat conductive, but electrically insulating ceramic, such. B. aluminum nitride (AIN) or silicon carbide (SiC) to be arranged.
- AIN aluminum nitride
- SiC silicon carbide
- This special structure of the heat sink can advantageously meet three requirements: (i) the component to which the heat sink is attached can be cooled by thermal radiation and, above all, convection; (ii) The insulation distance is compared to neighboring components that have different electrical potentials - in comparison z. B. with a conventional all-metal or all-metal heat sink - increased; and (iii) stress problems that would result from different coefficients of thermal expansion between the component to be cooled and the ceramic can be compensated for by the base body as a transition piece.
- the combination of inexpensive components and the additional function of electrical insulation makes the heat sink according to the invention superior to known heat sinks made of aluminum or ceramic.
- the base body can consist of a metal with good thermal conductivity properties.
- the base body preferably consists of a metal or a metal alloy with a coefficient of thermal conductivity of at least 100 W / (m K), preferably more than 200 W / (m K).
- aluminum (Al), copper (Cu), silver (Ag) or an alloy of these metals are suitable as metal.
- the material of the electrically insulating heat dissipation elements preferably has a coefficient of thermal conductivity of more than 100 W / (m K). Electrically insulating here means that the material has a specific resistance of at least 10 12 ⁇ * m / mm 2 and more.
- the heat dissipating elements are preferably made of a ceramic. For example, silicon carbide (SiC) or aluminum nitride (AlN) are suitable as ceramic.
- Suitable combinations with regard to the choice of material for the base body and the heat dissipating elements are, for example, copper / silicon carbide or aluminum / aluminum nitride.
- the heat dissipation elements are plate-shaped. That is to say, the heat-emitting elements have the shape of plates.
- the base body has a corresponding receptacle or recess for each heat dissipation element.
- the respective receptacle or recess is dimensioned in accordance with the shape of a connecting section of a heat dissipating element to be inserted.
- the heat dissipating elements, d. H. the connecting sections are non-positively connected to the base body.
- the respective connecting section is fastened in the associated receptacle by means of a press fit or clamping.
- the base body can be heated.
- the press connection is formed, as it were, by shrinking the base body onto the connecting section of the heat dissipating element. Since ceramics can absorb compressive forces very well, this connection complies with the strength properties of ceramics.
- the main body of the heat sink can basically be a CNC-manufactured metal part.
- the base body of the cooling body for the anode can be tubular, in particular cylindrical. If the base body is essentially a cylinder, it can be manufactured as a rotating body.
- the heat absorption surface is formed by an inner surface of a recess running axially in the base body. The shape of the recess is adapted for coupling with the anode as a heat source.
- the remaining surface of the base body is again part of the heat release surface in which the receptacles for the heat release elements are formed. In each of these receptacles, a heat-emitting element is preferably inserted and fastened in a manner that conducts heat well.
- the recesses are designed as axially extending slots or grooves in the outer surface of the base body.
- the plate-shaped ceramic elements are inserted into these recesses as heat dissipation elements in a form-fitting and force-fitting manner.
- the X-ray tube with the heat sink according to the invention is an electrical device which has a component which carries a high voltage during operation and which heats up, the heat sink being connected to this component in a thermally conductive manner.
- the X-ray tube has the anode as a component that carries a high voltage and warms up during operation.
- a heat sink is connected to the anode in a thermally conductive manner.
- the heat dissipation elements preferably have a height starting from the base body of the cooling body. In the X-ray tube according to the invention, the height is dimensioned such that, taking into account the high voltage and possibly an insulation medium surrounding the heat dissipating elements, a predetermined sufficient dielectric strength with respect to the surroundings is achieved or ensured.
- the size of the X-ray tube is limited by the fact that certain components have to be integrated and the distances between the components, which are at different electrical potentials, have to be selected so that the dielectric strength of the insulation medium arranged in between is not exceeded.
- the component to be cooled is essentially the anode of the X-ray tube.
- the main body of the heat sink serves particularly advantageously as a transition piece between the Operation of the heating anode (as a heat-generating component) and the ceramic heat-dissipating elements, which act as cooling fins.
- the base body of the cooling body can be manufactured particularly easily as a rotating body.
- slots or grooves can be machined into the base body by means of a CNC machine.
- the slots or grooves are matched to the dimensions of the connecting sections of the heat dissipating elements in accordance with the joining technique selected.
- Ceramic plates are particularly suitable as heat dissipation elements, since they are available as inexpensive mass-produced items.
- the Figures 1a to 3b show three examples of heat sinks 1, 2 and 3, each with a base body 10.1, 10.2, 10.3 made of metal.
- the base body each has a heat absorption surface 12.1, 12.2, 12.3 for coupling to a heat source.
- the heat source can be a component that is heated or warmed up during operation. During operation, heat is conducted in a known manner by conduction into the base body of the heat sink. In other words, the heat absorption area essentially corresponds to the contact area with the heat source.
- the base body 10.1, 10.2, 10.3 can use its outer surfaces, which are not in contact with the heat source, as a heat release surface to transfer the heat to an insulating medium surrounding the heat release surfaces (usually a fluid, such as, for example, in the simplest case the ambient air) by conduction, Emit heat radiation and convection.
- the part of the outer surface of the base body 10.1, 10.2, 10.3 which is opposite the heat absorption surface 12.1, 12.2, 12.3 essentially forms the heat release surface 14.1, 14.2, 14.3 of the base body 10.1, 10.2, 10.3.
- heat emission elements 16.1, 16.2, 16.3 are arranged on the base body 10.1, 10.2, 10.3 in the area of the heat emission surface 14.1, 14.2, 14.3 and are connected to the base body 10.1, 10.2, 10.3 in a heat-conducting manner.
- the heat release surface 14.1, 14.2, 14.3 of the base body 10.1, 10.2, 10.3 is increased by the surfaces of the heat release elements 16.1, 16.2, 16.3.
- the heat dissipation elements 16.1, 16.2, 16.3 are made of an electrically insulating material, which preferably has a thermal conductivity in the order of magnitude of the metal Has base body 10.1, 10.2, 10.3.
- the heat dissipation elements 16.1, 16.2, 16.3 are inserted into correspondingly shaped receptacles 18.1, 18.2, 18.3, which are formed in the base body 10.1, 10.2, 10.3, with respective connecting sections 20.1, 20.2, 20.3 in the base body 10.1, 10.2, 10.3 in a heat-conducting manner.
- Figure 1a shows the first example of the heat sink 1 with plate-shaped heat dissipation elements 16.1.
- Figure 1b shows one of the heat dissipation elements 16.1 of FIG Figure 1a in isolation.
- the heat dissipation element 16.1 has the shape of a plate, ie it is plate-shaped.
- Plate-shaped means that the heat dissipating element 16.1 has substantially larger dimensions in length and height compared to the width.
- the plate-shaped heat dissipation element 16.1 has a width B and a height which is composed of a height h of the connecting section 20.1 and the rest of this protruding section with the length H after insertion into the base body 10.1.
- the longitudinal extension of the heat dissipation element 16.1 is marked with L. Since B ⁇ L and B ⁇ (h + H), the heat emitting element is plate-shaped.
- the heat dissipation element 16.1 is inserted into the base body 10.1 in the recesses 18.1 appropriately machined or formed there and fastened in it in a thermally conductive manner using one of the measures to be discussed further below.
- FIG 2a shows the second example of the heat sink 2.
- the heat dissipation elements 16.2 are made of an electrically insulating material, pins or rods which again have a thermal conductivity in the order of magnitude of the metal of the base body 10.2. Similar to the Figure 1a the pin-shaped or rod-shaped heat dissipation elements 16.2 with a respective connecting section 20.2 are inserted into correspondingly machined or shaped recesses 18.2 in the base body 10.2 and fastened there with good thermal conductivity.
- the heat dissipation element 16.2 is essentially cylindrical and has a length L and a diameter D.
- the length L is made up of the connecting section 20.2, which is similar to FIG Figure 1a or 1b has the length h, which corresponds to the depth of one of the receptacles 18.2 in the base body 10 corresponds to.
- the remaining part of the pin-shaped heat dissipation element 16.2 has the length H, which protrudes from the base body 10.2 when the heat dissipation element 16.2 is inserted into the base body 10.2; that is, L is here (h + H).
- Figure 3a shows the third example of the heat sink 3.
- receptacles 18.3 are formed in the heat dissipation surface 14.3 of the base body 10.3 (as in the first and second exemplary embodiments), into which the tubular heat dissipation elements 16.3 are inserted and fastened.
- the tubular heat dissipation elements 16.3 again consist of an electrically insulating material which has a thermal conductivity in the order of magnitude of the metal of the base body 10.3.
- the tubular heat dissipation elements 16.3 have the shape of a hollow cylinder with an outside diameter D and an inside diameter d as well as a length L.
- the length of the heat dissipation element 16.3 is again divided into the connecting section 20.3 with a length h, which is inserted into the correspondingly designed receptacles 18.3 of the Base body 10.3 are inserted with a depth h.
- the remaining section of the heat dissipation element 16.3, which protrudes from the base body 10.3 when the heat dissipation element 16.3 is inserted into the base body 10.3, has the length H; ie, here is L - similar to in the Figures 2a, 2b - equal (h + H).
- the base body 10.1, 10.2, 10.3 made of a highly thermally conductive metal, preferably with a coefficient of thermal conductivity of 100 W / (m K) or more.
- a highly thermally conductive metal preferably with a coefficient of thermal conductivity of 100 W / (m K) or more.
- aluminum with a coefficient of thermal conductivity of approx. 240 W / (m K) or copper with a coefficient of thermal conductivity of approx. 400 W / (m K) was used.
- the base body 10.1, 10.2, 10.3 can also consist of another metal or a metal alloy.
- the heat dissipation elements 16.1, 16.2 and 16.3 are made of a ceramic which has a coefficient of thermal conductivity that is of the same order of magnitude as that of the metal of the base body 10.1, 10.2, 10.3.
- the ceramic thus preferably also has a coefficient of thermal conductivity of more than 100 W / (m K).
- aluminum nitride with a coefficient of thermal conductivity of approx. 180 to 220 W / (mK) or silicon carbide with a coefficient of thermal conductivity of approx. 350 W / (mK) was used.
- the heat dissipation elements 16.1, 16.2 and 16.3 are each inserted into corresponding receptacles 18.1, 18.2 and 18.3 which are incorporated into the base body 10.1, 10.2, 10.3.
- various joining techniques can be used.
- the respective heat dissipation element 16.1 or 16.2 can be positively and / or non-positively connected to the base body 10.1, 10.2 in that the respective use section 20.1, 20.2 is fastened in the associated receptacle 18.1, 18.2 by means of a press fit or clamping.
- the base body 10.1, 10.2 can be heated accordingly, for example, so that the base body 10.1, 10.2 expands.
- the ceramic heat dissipation elements 16.1, 16.2 can be inserted into the respective receptacles 18.1, 18.2.
- the heat dissipation elements 16.1, 16.2 are firmly connected to the base body 10.1, 10.2. It is only necessary to ensure that the dimensions of the recesses 18.1, 18.2 are dimensioned so that the heat dissipation elements 16.1, 16.2 cannot loosen at the temperatures reached during normal operation due to the expansion of the metal of the base body 10.1, 10.2.
- a first thread can be incorporated or formed on the heat dissipation elements 16.2, 16.3, at least in the area of the respective connecting section 20.2, 20.3 (not shown).
- Corresponding second threads can then be incorporated into the corresponding receptacles 18.2, 18.3 in the base body 10.2, 10.3, which are then shaped as holes.
- the heat dissipating elements 16.2, 16.3 can be connected to the base body 10.2, 10.3 by screwing the respective connecting sections 20.2, 20.3 into the respective receptacle 18.2, 18.3.
- the ceramic heat dissipation elements 16.2, 16.3 are only under pressure loaded, whereby the heat transfer resistance between the base body and the heat dissipation elements is additionally reduced.
- the heat dissipating elements 16.1, 16.2 or 16.3 of the examples of FIG Figures 1a to 3a are connected in the respective base body 10.1, 10.2, 10.3 by casting.
- the receptacles 18.1, 18.2, 18.3 incorporated in the base body 10.1, 10.2, 10.3 and / or the dimensions of the respective connecting section 20.1, 20.2, 20.3 are dimensioned in such a way that between the base body 10.1, 10.2, 10.3 and the heat dissipation element 16.1, 16.2, 16.3 according to a space is formed upon insertion.
- This intermediate space between the respective connecting section 20.1, 20.2, 20.3 and the respective receptacle 18.1, 18.2, 18.3 can be filled or filled with a potting compound that conducts heat well and that solidifies, preferably hardening. After the potting compound has solidified or hardened, the respective heat dissipation element is firmly connected to the base body 10.1, 10.2, 10.3.
- Another alternative of fastening the heat dissipating elements 16.1, 16.2, 16.3 in the respective receptacles 18.1, 18.2, 18.3 provided in the base bodies 10.1, 10.2, 10.3 can be achieved by gluing or gluing in with a suitable adhesive.
- Another connection possibility between the heat dissipating elements 16.1, 16.2, 16.3 in the receptacles 18.1, 18.2, 18.3 incorporated in the respective base body 10.1, 10.2, 10.3 is soldering.
- the respective heat dissipation element 16.1, 16.2, 16.3 is soldered to the base body 10.1, 10.2, 10.3 in a manner known per se with a suitable solder after it has been inserted into the corresponding receptacle 18.1, 18.2, 18.3 in the base body 10.1, 10.2, 10.3.
- FIG. 4a shows an exemplary embodiment of a heat sink 4 according to the invention.
- the above applies to the examples of FIG Figures 1a to 3b What has been said for the exemplary embodiment accordingly.
- the base body 10.4 of the exemplary embodiment is rotationally symmetrical in comparison to the base bodies 10.1, 10.2, 10.3 of the preceding examples.
- the Base body 10.4 can be produced as a rotating body or by means of a CNC machine.
- the base body 10.4 has an inner surface 12.4 of a recess 22 running axially in the base body 10.4.
- the inner surface 12.4 is again used for coupling to a heat source from which heat is to be dissipated via the cooling body.
- the outer surface 14.4 of the base body 10.4 is part of the heat release surface into which receptacles 18.4 for heat release elements 16.4 are incorporated.
- the receptacles 18.4 are incorporated into the base body 10.4 as axially extending slots, for example by milling.
- Plate-shaped ceramic elements are inserted into the axially extending slots as the heat dissipation elements 16.4 in order to enlarge the effective heat dissipation area.
- the heat dissipation elements 16.4 are arranged in a star shape and evenly spaced over the entire circumference of the base body 10.4. A uniform enlargement of the effective heat dissipation surface is thus achieved over the entire circumferential area of the base body 10.4.
- FIG. 11 shows a cross-sectional view of an example of an X-ray tube 30 which has an anode 36 as a component that carries high voltage and warms up during operation.
- the heat sink 4 which is in the Figures 4a and 4b is shown, attached to the part of the anode 36 led out of the X-ray tube 30 in a heat-conducting manner.
- the X-ray tube is located in a tank (not shown) which is filled with oil as an insulating medium.
- oil as an insulating medium.
- the high heat capacity of the oil makes it possible with the oil, for example via a heat exchanger, to transport the heat away from the heat sink.
- air could also be used as the insulation medium. However, air has poorer cooling properties.
- the structure of the X-ray tube 30 is essentially known, the details of which are also not relevant for an understanding of the cooling body 4.
- the X-ray tube 30 essentially has an evacuated cylindrical housing 32, which also consists of a ceramic.
- a heated cathode 34 which can be contacted from the outside via corresponding bushings in the housing 32 by means of corresponding lines 37.
- the cathode 34 Opposite the cathode 34 is the anode 36, which, when the X-ray tube 30 is in operation, has a corresponding high voltage applied to it in order to accelerate the electrons emitted by the cathode 34.
- a target 38 for example made of tungsten, which is customary for generating the X-ray radiation, is located on the anode 36.
- X-rays which are generated by the electrons penetrating into the target 38 and braked by it, leave the X-ray tube 30 through a radiation window 40 in the housing 32.
- a titanium foil 42 can be arranged in the beam path for hardening the X-rays.
- connection end of the cathode 34 is led out at the front end 43 of the housing 32.
- the heat sink 4 is connected to the anode 36 in order to dissipate the heat during operation with good thermal conductivity.
- FIG. 9 shows, in addition and for better illustration, a perspective view of the X-ray tube 30 of FIG Figure 5a .
Landscapes
- X-Ray Techniques (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Claims (5)
- Tube à rayons X (30) ayant une anode (36) qui, pendant son fonctionnement, conduit une haute tension et se réchauffe,
cependant qu'un corps refroidissant (4) est relié de manière conductrice de chaleur avec l'anode et comporte un corps de base (10.4) en un métal ayant une surface d'absorption de chaleur (12.4) pour le couplage avec l'anode (36) en tant que source de chaleur (36) et une surface de dissipation de chaleur (14.4) agrandie par des éléments de dissipation de chaleur (16.4) reliés au corps de base (10.4),
cependant que les éléments de dissipation de chaleur (16.4) consistent en un matériau électriquement isolant ayant une conductivité de chaleur de l'ordre de grandeur du métal du corps de base (10.4), cependant que le tube à rayons X comporte un moyen isolant entourant les éléments de dissipation de chaleur (16.4),
cependant que les éléments de dissipation de chaleur (16.4) présentent, à partir du corps de base (10.4) du corps refroidissant (4), une hauteur (H), de telle sorte que, en tenant compte de la haute tension du moyen isolant entourant les éléments de dissipation de chaleur (16.4), il y a une rigidité diélectrique suffisante par rapport à l'environnement du tube à rayons X (30),
cependant que le corps de base (10.4) est un corps rotatif ayant une surface intérieure (12.4) d'un évidement (22) axial adapté au couplage avec l'anode en tant que la source de chaleur (36),
cependant que les éléments de dissipation de chaleur (16.4) sont des éléments céramiques en forme de plaques, caractérisé en ce que
le corps de base (10.4) comporte pour chaque élément de dissipation de chaleur (16.4) un logement (18.4) dimensionné pour le logement (18.4) d'une partie jonction (20.4) d'au moins un des éléments de dissipation de chaleur (16.4),
le corps de base (10.4) a une surface extérieure (14.4) en tant que partie de la surface de dissipation de chaleur qui comporte des logements (18.4) pour les éléments de dissipation de chaleur (16.4), et que, dans chacun des logements (18.4), un élément de dissipation de chaleur (16.4) est inséré.
les logements (18.4) sont des fentes ou des rainures axiales dans lesquelles les éléments céramiques en forme de plaques sont insérés en tant que les éléments de dissipation de chaleur (16.4),
les éléments de dissipation de chaleur (16.4) sont joints au corps de base (10.4), ce qui est obtenu en ce que la partie respective de jonction (20.4) est fixée au moyen d'un ajustement serré ou d'un serrage dans le logement (18.4) associé. - Tube à rayons X (30) selon la revendication 1, cependant que le corps de base (10.4) consiste en un métal ou en un alliage métallique.
- Tube à rayons X (30) selon la revendication 2, cependant que le corps de base (10.4) consiste en un métal et que le métal est de l'aluminium, de cuivre ou d'argent, et/ou que le métal ou l'alliage métallique présente un coefficient de conductivité thermique compris entre 100 et 450 W/ (mK).
- Tube à rayons X (30) selon une des revendications précédentes de 1 à 3, cependant que les éléments de dissipation de chaleur (16.4) consistent en une céramique.
- Tube à rayons X (30) selon la revendication 4, cependant que les éléments de dissipation de chaleur (16.4) consistent en une céramique et que la céramique est du carbure de silicium ou du nitrure d'aluminium, et/ou que la céramique présente un coefficient de conductivité thermique compris entre 100 et 350 W/(mK).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014222164.1A DE102014222164A1 (de) | 2014-10-30 | 2014-10-30 | Kühlkörper, insbesondere für die Anode eines Röntgenstrahlungserzeugers |
PCT/EP2015/075271 WO2016066810A1 (fr) | 2014-10-30 | 2015-10-30 | Générateur de rayons x |
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Publication Number | Publication Date |
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EP3213338A1 EP3213338A1 (fr) | 2017-09-06 |
EP3213338B1 true EP3213338B1 (fr) | 2021-03-31 |
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EP15825793.1A Active EP3213338B1 (fr) | 2014-10-30 | 2015-10-30 | Générateur de rayons x |
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US (1) | US10522317B2 (fr) |
EP (1) | EP3213338B1 (fr) |
DE (1) | DE102014222164A1 (fr) |
WO (1) | WO2016066810A1 (fr) |
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Publication number | Priority date | Publication date | Assignee | Title |
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US10182490B2 (en) * | 2015-09-25 | 2019-01-15 | Moxtek, Inc. | X-ray tube integral heatsink |
US10178748B1 (en) * | 2016-06-20 | 2019-01-08 | Moxtek, Inc. | X-ray spot stability |
TWI755319B (zh) * | 2020-12-30 | 2022-02-11 | 立錡科技股份有限公司 | 晶片封裝結構 |
CN115410882A (zh) * | 2021-05-28 | 2022-11-29 | 上海超群检测科技股份有限公司 | 一种x射线源绝缘散热装置及其制作方法 |
CN115175548B (zh) * | 2022-09-07 | 2022-11-18 | 国家不锈钢制品质量监督检验中心(兴化) | 一种不锈钢制品成分分析用x荧光光谱仪 |
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DE139327C (fr) | ||||
DE1100057B (de) * | 1958-01-29 | 1961-02-23 | Siemens Ag | Waermeabgebender metallischer Koerper mit vergroesserter Oberflaeche |
DD139327A1 (de) | 1978-09-26 | 1979-12-19 | Heinz Hocke | Strahlenschutzgehaeuse fuer roentgenroehren |
US6807059B1 (en) * | 1998-12-28 | 2004-10-19 | James L. Dale | Stud welded pin fin heat sink |
GB0008897D0 (en) * | 2000-04-12 | 2000-05-31 | Cheiros Technology Ltd | Improvements relating to heat transfer |
US6918438B2 (en) * | 2002-06-04 | 2005-07-19 | International Business Machines Corporation | Finned heat sink |
US20060191675A1 (en) * | 2003-09-22 | 2006-08-31 | Coolhead Technologies, Inc. | Apparatus and methods for warming and cooling bodies |
US7396160B2 (en) * | 2004-07-30 | 2008-07-08 | Neurologica Corp. | Computerized tomography (CT) imaging system with monoblock X-ray tube assembly |
DE202007007568U1 (de) | 2007-05-25 | 2007-09-20 | Boston Cool Tec Corporation, Wilmington | Eine flache Heatpipe (Wärmeleitrohr) und Kühlkörper welche diese verwenden |
JP2009164038A (ja) | 2008-01-09 | 2009-07-23 | Toshiba Corp | 固定陽極型x線管および一体型x線発生装置 |
DE102008006620A1 (de) | 2008-01-29 | 2009-08-06 | Smiths Heimann Gmbh | Röntgenstrahlerzeuger sowie dessen Verwendung in einem Röntgenuntersuchungs- oder Röntgenprüfgerät |
CN102401358B (zh) | 2010-09-10 | 2016-08-03 | 欧司朗股份有限公司 | 冷却体的制造方法、冷却体以及具有该冷却体的照明装置 |
EP2740331B1 (fr) | 2011-08-05 | 2018-05-30 | Canon Kabushiki Kaisha | Appareil de génération de rayonnement et appareil d'imagerie par rayonnement |
CN202221659U (zh) | 2011-08-09 | 2012-05-16 | 莫卓荣 | 分体式陶瓷散热器 |
DE202012010600U1 (de) * | 2012-10-27 | 2012-12-06 | Asia Vital Components Co., Ltd. | Kühlkörper |
US10182490B2 (en) * | 2015-09-25 | 2019-01-15 | Moxtek, Inc. | X-ray tube integral heatsink |
-
2014
- 2014-10-30 DE DE102014222164.1A patent/DE102014222164A1/de not_active Ceased
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2015
- 2015-10-30 US US15/522,909 patent/US10522317B2/en active Active
- 2015-10-30 WO PCT/EP2015/075271 patent/WO2016066810A1/fr active Application Filing
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US20170338076A1 (en) | 2017-11-23 |
EP3213338A1 (fr) | 2017-09-06 |
US10522317B2 (en) | 2019-12-31 |
WO2016066810A1 (fr) | 2016-05-06 |
DE102014222164A1 (de) | 2016-05-04 |
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