EP3210230B1 - Commutateur microelectromecanique robuste - Google Patents

Commutateur microelectromecanique robuste Download PDF

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Publication number
EP3210230B1
EP3210230B1 EP15805568.1A EP15805568A EP3210230B1 EP 3210230 B1 EP3210230 B1 EP 3210230B1 EP 15805568 A EP15805568 A EP 15805568A EP 3210230 B1 EP3210230 B1 EP 3210230B1
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EP
European Patent Office
Prior art keywords
conducting membrane
deformable conducting
deformable
supply line
membrane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
EP15805568.1A
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German (de)
English (en)
French (fr)
Other versions
EP3210230A1 (fr
Inventor
Pierre Blondy
Romain STEFANINI
Ling Yan ZHANG
Abedel Halim ZAHR
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Airmems
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Airmems
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H51/00—Electromagnetic relays
    • H01H51/22—Polarised relays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H01H2059/0072—Electrostatic relays; Electro-adhesion relays making use of micromechanics with stoppers or protrusions for maintaining a gap, reducing the contact area or for preventing stiction between the movable and the fixed electrode in the attracted position

Definitions

  • the present invention relates to the field of microelectromechanical systems (MEMS) and relates in particular to a microelectromechanical switch.
  • MEMS microelectromechanical systems
  • Radio frequency microelectromechanical systems allow switching operations for applications addressing a wide range of frequencies (DC-100 GHz). Their competitive advantage in terms of performance and low power consumption compared to their size make them a very popular component for system manufacturers.
  • the present invention relates to a robust microelectromechanical switch, the structure of which guarantees reduced temperature sensitivity and allows stable electrical contact with limited sticking phenomena, while guaranteeing the performance inherent in RF MEMS technology.
  • the end of the signal supply line is to the right of the contact pad means that the signal supply line extends slightly under the deformable conductive membrane, beyond the contact pad so that the latter can enter in contact with the signal supply line when the deformable conductive membrane deforms.
  • the activation electrode and the deformable conductive membrane have the same or substantially the same shape means that the projection of the shape of the deformable conductive membrane in the plane of the substrate is the same or almost identical to that of the d electrode. 'activation, with adjustments due to the fact that the activation electrode must not come into contact with the anchors or the signal supply line.
  • the acute radial opening formed in the deformable conductive membrane makes it possible to have the minimum surface area of the signal supply line opposite the deformable conductive membrane, which makes it possible to reduce the electrical capacitance between the supply line of signal and the deformable conductive membrane, thus ensuring good isolation of the switch.
  • the acute angle may for example be between 5 ° and 135 °, preferably 50 °, without these values being limiting.
  • the deformable conductive membrane thus has the shape of a circular diagram with an acute sector representing the radial opening and a complementary sector representing the deformable conductive membrane.
  • the activation electrode and the deformable conductive membrane have substantially the same shape and are located one above the other makes it possible to generate a maximum of attraction force.
  • the contact area "contact pad / signal supply line” is surrounded by the activation electrode through the radial opening, which allows the generation of a high localized contact force and ensures stability of the contact resistance during activation.
  • the shape of the deformable conductive membrane and its thickness with regard to the maximum displacement limit the permanent deformations thereof and ensure better thermal stability.
  • the surface surrounding the contact pad facing the signal supply line is larger and therefore the surface attracted by the activation electrode is larger. This feature confers a greater activation force and ensures better stability of the electrical contact when the switch is activated.
  • an anchor is formed in the median axis of the radial opening.
  • two anchors are formed symmetrically with respect to the median axis of the radial opening, on a circle with the same center as the circle circumscribing the deformable conductive membrane, the angle formed on the circle with the same center that the circle circumscribing the deformable conductive membrane between each anchoring and the median axis of the radial opening being at most 30 °.
  • the other anchors are formed symmetrically with respect to this median axis.
  • This alignment makes it possible to concentrate the mechanically weakest zone in the vicinity of the contact pad.
  • At least one opening is formed on the deformable conductive membrane between two diametrically opposed anchors on a circle of the same center as the circle circumscribing the deformable conductive membrane.
  • louvers make it possible to accommodate the deformation of the component at high temperature during packaging for example, but also to reduce the activation voltage of the component.
  • a louver is formed on the deformable conductive membrane in the vicinity of each anchorage, the louvers being formed on the contour of a circle with the same center as the circle circumscribed on the deformable conductive membrane and, preferably, of lower radius at least the width of the hearing.
  • the orifice (s) can pass through the thickness of the deformable conductive membrane.
  • the contact pad is slightly eccentric from the weakest mechanical part of the deformable conductive membrane (that is to say located at a distance from the center of the deformable conductive membrane of less than 30% of the radius of the deformable conductive membrane). This slightly eccentric position of the contact pad limits sticking phenomena.
  • through holes are formed on a circle with the same center as the circle circumscribed on the deformable conductive membrane.
  • the hole or holes pass through the thickness of the deformable conductive membrane and promote the release process during the manufacturing step, without modifying the electrical and mechanical properties of the component.
  • one or more stop pads are formed on the lower surface of the deformable conductive membrane, each stop pad facing a metal island electrically isolated from the activation electrode.
  • the stop pads make it possible to limit the deformation of the deformable conductive membrane and to ensure electrical insulation between the deformable conductive membrane and the activation electrode, which ensures greater longevity of the component, and also prevents sticking of the deformable conductive membrane on the activation electrode.
  • the contact pad and where appropriate the stop pads, are made of a metal from the platinum group or their oxides or both.
  • a metal from the platinum group makes it possible to obtain a contact pad, if necessary stop pads, of high hardness, capable of withstanding mechanical shocks due to the closing of the switch. Also, they ensure better temperature resistance of the microelectromechanical switch of the invention during the passage of high currents in the contact pad for example.
  • the deformable conductive membrane is made of a multi-layer combining dielectric layers and metal layers.
  • the deformable conductive membrane is made of gold, or is a metal alloy or a set of layers comprising at least one conductor.
  • the activation electrode is made of gold or any other conductive or semiconductor material.
  • MEMS microelectromechanical switch
  • the microelectromechanical switch 1 is formed on a substrate S, and mainly comprises a deformable conductive membrane 2, an activation electrode 3, a signal supply line 4 and a signal output line 5.
  • the signal supply line 4, the signal output line 5 and the activation electrode are formed on the substrate S.
  • the deformable conductive membrane 2 is planar, generally round in shape, with a radial opening 2a in the direction of the signal feed line 4, tapering from the periphery towards the center of the deformable conductive membrane 2.
  • the conductive membrane deformable 2 is formed suspended above the activation electrode 3, by means of anchors 6, distributed around its periphery, so as to concentrate the zone of lowest stiffness of the deformable conductive membrane 2 at the level of the pad contact with the signal supply line 4 (described below) located at a distance from the top of the radial opening less than 30% of the radius of the deformable conductive membrane 2.
  • One of the anchors 6 is located in the extension of the signal supply line 4, and allows a conductive connection to be made between the deformable conductive membrane 2 and the signal output line 5.
  • the other anchors 6 are distributed in pairs, opposite with respect to the center of the circle circumscribing the deformable conductive membrane 2. It should be noted that, although the embodiment shown has five anchors 6, the invention is not limited in this regard within the scope of the present invention.
  • the number of anchors is odd, one of the anchors 6 therefore being located on the median axis of the radial opening 2a, in the extension of the signal supply line 4.
  • Each anchor 6 is constituted by a tab extending perpendicularly to the surface of the deformable conductive membrane 2, towards the substrate S, said tab extending along two tabs 6a, framing a block 6b integral with the substrate S, the two tabs 6a being suspended in the same plane as the deformable conductive membrane 2, ensuring optimum distribution of stresses during the rise in temperature.
  • Louvers 7 are formed on the deformable conductive membrane 2, in front of each anchor 6, the louvers 7 being aligned on a circle with the same center as the circle circumscribing the deformable conductive membrane 2.
  • holes 8 are formed on a smaller circle, having the same center as the circle circumscribing the deformable conductive membrane 2. These holes are optional in the context of the invention.
  • the lower surface of the deformable conductive membrane 2, facing the activation electrode 3, carries a contact pad 9, near the top of the opening 2a, intended, under deformation of the membrane deformable conductor 2 by the activation electrode 3, to come into contact with the end of the signal supply line 4.
  • Stop pads 10, formed on substantially the same circles as the holes 8 and the openings 7, are formed on the lower surface of the conductive membrane deformable 2, their role being described in more detail below.
  • the activation electrode 3 has substantially the same shape as the deformable conductive membrane 2, and surrounds the end of the signal supply line 4.
  • stop pads 10 and the islands 3a The role of the stop pads 10 and the islands 3a is to allow, during the deformation of the deformable conductive membrane 2 attracted by the activation electrode, to limit the deformation of the deformable conductive membrane 2 by contact with the pads d. 'stop 10 on islets 3a. Although the presence of islands 3a and stop pads 10 is preferred, since it limits the deformation of the deformable conductive membrane 2 and enables them to be electrically isolated, a switch not having these also comes within the scope of the present invention. invention, which is not limited in this regard.
  • the substantially identical shapes of the deformable conductive membrane 2 and of the activation electrode 3 make it possible to guarantee a homogeneous and uniform deformation while ensuring the generation of a high electrostatic force.
  • the general shape of the microelectromechanical switch 1 according to the invention, round with an opening 2a on the signal supply line 4, makes it possible to guarantee a significant contact force, located in the center of the circle due to the position of the anchors and of the shape of the membrane, which guarantees an electrically stable contact with the end of the signal supply line 4.
  • the opening 2a also makes it possible to limit the surface of the deformable conductive membrane 2, facing the current supply line 4, which reduces the electrical couplings between them.
  • FIGS 3 and 4 illustrate the two positions, respectively open and closed, of the microelectromechanical switch 1 according to the invention.
  • the contact pad 9 is in contact with the end of the signal supply line 4, the stop pads 10 being in contact with the islands 3a.
  • the microelectromechanical switch 1 is closed, the signal passes between the signal input line 4 and the signal output line 5.
  • the substrate is advantageously silicon.
  • the activation electrode is advantageously made of gold, but can also be any other conductive or semiconductor material.
  • the deformable conductive membrane 2 is advantageously made of gold, but can also be a metal alloy or a set of layers comprising at least one conductor.
  • the contact pads 9 and stop 10 are formed integrally with the deformable conductive membrane 2. They can advantageously be covered with a harder material to increase their resistance.
  • a switch according to the invention is inscribed in a circle with a radius of 140 ⁇ m.
  • the thickness of the switch is 7 ⁇ m, its pull-down voltage is 55V, its restoring force is 1.8 mN, and its contact force is between 2 and 4 mN at 70 V .

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Micromachines (AREA)
EP15805568.1A 2014-10-21 2015-10-19 Commutateur microelectromecanique robuste Active EP3210230B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1460104A FR3027448B1 (fr) 2014-10-21 2014-10-21 Commutateur microelectromecanique robuste
PCT/FR2015/052802 WO2016062956A1 (fr) 2014-10-21 2015-10-19 Commutateur microelectromecanique robuste

Publications (2)

Publication Number Publication Date
EP3210230A1 EP3210230A1 (fr) 2017-08-30
EP3210230B1 true EP3210230B1 (fr) 2020-12-30

Family

ID=52627301

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15805568.1A Active EP3210230B1 (fr) 2014-10-21 2015-10-19 Commutateur microelectromecanique robuste

Country Status (7)

Country Link
US (1) US10121623B2 (es)
EP (1) EP3210230B1 (es)
CN (1) CN107078000B (es)
ES (1) ES2863098T3 (es)
FR (1) FR3027448B1 (es)
IL (1) IL251793B (es)
WO (1) WO2016062956A1 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3051784B1 (fr) 2016-05-24 2018-05-25 Airmems Membrane mems a ligne de transmission integree
FR3074793B1 (fr) * 2017-12-12 2021-07-16 Commissariat Energie Atomique Dispositif microelectromecanique et/ou nanoelectromecanique offrant une robustesse augmentee
FR3098340B1 (fr) 2019-07-03 2022-03-25 Airmems Commutateur de puissance, large bande hautes frequences et dispositif integrant des commutateurs de puissance

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US5619061A (en) * 1993-07-27 1997-04-08 Texas Instruments Incorporated Micromechanical microwave switching
US6707355B1 (en) * 2001-06-29 2004-03-16 Teravicta Technologies, Inc. Gradually-actuating micromechanical device
WO2003028059A1 (en) * 2001-09-21 2003-04-03 Hrl Laboratories, Llc Mems switches and methods of making same
US6717496B2 (en) * 2001-11-13 2004-04-06 The Board Of Trustees Of The University Of Illinois Electromagnetic energy controlled low actuation voltage microelectromechanical switch
US6876282B2 (en) * 2002-05-17 2005-04-05 International Business Machines Corporation Micro-electro-mechanical RF switch
US6639494B1 (en) * 2002-12-18 2003-10-28 Northrop Grumman Corporation Microelectromechanical RF switch
KR100554468B1 (ko) * 2003-12-26 2006-03-03 한국전자통신연구원 자기유지 중앙지지대를 갖는 미세 전자기계적 스위치 및그의 제조방법
US7373717B2 (en) * 2004-03-16 2008-05-20 Electronics And Telecommunications Research Institute Method of manufacturing a self-sustaining center-anchor microelectromechanical switch
US20050225412A1 (en) * 2004-03-31 2005-10-13 Limcangco Naomi O Microelectromechanical switch with an arc reduction environment
US20050248424A1 (en) * 2004-05-07 2005-11-10 Tsung-Kuan Chou Composite beam microelectromechanical system switch
FR2871950B1 (fr) * 2004-06-22 2006-08-11 Commissariat Energie Atomique Filtre frequentiel et son procede de realisation.
US7310033B2 (en) * 2004-08-19 2007-12-18 Teravicta Technologies, Inc. MEMS switch electrode configuration to increase signal isolation
US7119943B2 (en) 2004-08-19 2006-10-10 Teravicta Technologies, Inc. Plate-based microelectromechanical switch having a three-fold relative arrangement of contact structures and support arms
US20070040637A1 (en) 2005-08-19 2007-02-22 Yee Ian Y K Microelectromechanical switches having mechanically active components which are electrically isolated from components of the switch used for the transmission of signals
US7528691B2 (en) * 2005-08-26 2009-05-05 Innovative Micro Technology Dual substrate electrostatic MEMS switch with hermetic seal and method of manufacture
KR100837741B1 (ko) * 2006-12-29 2008-06-13 삼성전자주식회사 미세 스위치 소자 및 미세 스위치 소자의 제조방법
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Also Published As

Publication number Publication date
CN107078000A (zh) 2017-08-18
US10121623B2 (en) 2018-11-06
FR3027448A1 (fr) 2016-04-22
US20170316907A1 (en) 2017-11-02
FR3027448B1 (fr) 2016-10-28
IL251793B (en) 2021-02-28
IL251793A0 (en) 2017-06-29
CN107078000B (zh) 2019-06-18
EP3210230A1 (fr) 2017-08-30
ES2863098T3 (es) 2021-10-08
WO2016062956A1 (fr) 2016-04-28

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