EP3108323A4 - Vorrichtung, system und verfahren zur bereitstellung einer plattformunterstützung für mehrere speichertechnologien - Google Patents

Vorrichtung, system und verfahren zur bereitstellung einer plattformunterstützung für mehrere speichertechnologien Download PDF

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Publication number
EP3108323A4
EP3108323A4 EP15752538.7A EP15752538A EP3108323A4 EP 3108323 A4 EP3108323 A4 EP 3108323A4 EP 15752538 A EP15752538 A EP 15752538A EP 3108323 A4 EP3108323 A4 EP 3108323A4
Authority
EP
European Patent Office
Prior art keywords
multiple memory
platform support
memory technologies
provide platform
technologies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15752538.7A
Other languages
English (en)
French (fr)
Other versions
EP3108323B1 (de
EP3108323A1 (de
Inventor
Brian P. Moran
Konika Ganguly
Rebecca Z. LOOP
Xiang Li
Christopher E. Cox
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of EP3108323A1 publication Critical patent/EP3108323A1/de
Publication of EP3108323A4 publication Critical patent/EP3108323A4/de
Application granted granted Critical
Publication of EP3108323B1 publication Critical patent/EP3108323B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/4068—Electrical coupling
    • G06F13/4081—Live connection to bus, e.g. hot-plugging
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/14—Handling requests for interconnection or transfer
    • G06F13/16—Handling requests for interconnection or transfer for access to memory bus
    • G06F13/1668—Details of memory controller
    • G06F13/1694—Configuration of memory controller to different memory types
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Sources (AREA)
  • Memory System (AREA)
  • Computing Systems (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
  • Mathematical Physics (AREA)
  • Quality & Reliability (AREA)
EP15752538.7A 2014-02-19 2015-01-21 Vorrichtung, system und verfahren zur bereitstellung einer plattformunterstützung für mehrere speichertechnologien Active EP3108323B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461941687P 2014-02-19 2014-02-19
US14/578,191 US20150234726A1 (en) 2014-02-19 2014-12-19 Apparatus, system and method to provide platform support for multiple memory technologies
PCT/US2015/012279 WO2015126559A1 (en) 2014-02-19 2015-01-21 Apparatus, system and method to provide platform support for multiple memory technologies

Publications (3)

Publication Number Publication Date
EP3108323A1 EP3108323A1 (de) 2016-12-28
EP3108323A4 true EP3108323A4 (de) 2017-10-25
EP3108323B1 EP3108323B1 (de) 2020-02-26

Family

ID=53798223

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15752538.7A Active EP3108323B1 (de) 2014-02-19 2015-01-21 Vorrichtung, system und verfahren zur bereitstellung einer plattformunterstützung für mehrere speichertechnologien

Country Status (7)

Country Link
US (1) US20150234726A1 (de)
EP (1) EP3108323B1 (de)
JP (1) JP6501086B2 (de)
KR (1) KR20160098444A (de)
CN (1) CN105900039B (de)
TW (1) TWI515570B (de)
WO (1) WO2015126559A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105843326A (zh) * 2015-01-15 2016-08-10 华硕电脑股份有限公司 具有双规格内存插槽的电脑主板及电脑系统
KR101728864B1 (ko) 2015-10-30 2017-04-20 (주)에프씨아이 플래시 메모리 관리 방법, 장치 및 컴퓨터 프로그램
US10051729B2 (en) 2016-09-21 2018-08-14 Seagate Technology Llc Configuration element for printed circuit board assemblies
US9818457B1 (en) * 2016-09-30 2017-11-14 Intel Corporation Extended platform with additional memory module slots per CPU socket
US10120749B2 (en) * 2016-09-30 2018-11-06 Intel Corporation Extended application of error checking and correction code in memory
EP3370152B1 (de) 2017-03-02 2019-12-25 INTEL Corporation Integrierte fehlerprüfung und -korrektur in speichervorrichtungen mit festen bandbreitenschnittstellen
CN107507637B (zh) * 2017-09-18 2024-02-27 深圳市江波龙电子股份有限公司 一种低功耗双列直插式存储器及其增强驱动方法
US10468088B2 (en) 2017-12-15 2019-11-05 International Business Machines Corporation Redundant voltage regulator for memory devices
JP2021189785A (ja) 2020-05-29 2021-12-13 キオクシア株式会社 メモリシステム、メモリチップ、およびコントローラ
CN114384841B (zh) * 2021-12-31 2024-04-30 江苏天芯微半导体设备有限公司 一种用于衬底处理设备的信号调制模组

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100042778A1 (en) * 2008-08-18 2010-02-18 Advanced Micro Devices, Inc. Memory System Such as a Dual-Inline Memory Module (DIMm) and Computer System Using the Memory System
US20130054949A1 (en) * 2011-08-31 2013-02-28 Dell Products L.P. Memory compatibility system and method

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TW493119B (en) * 2001-03-28 2002-07-01 Via Tech Inc Method for automatically identifying the type of memory and motherboard using the same
JP2004213337A (ja) * 2002-12-27 2004-07-29 Nec Computertechno Ltd 半導体記憶装置及び実装型半導体装置
TWI229386B (en) * 2003-07-01 2005-03-11 Au Optronics Corp Method for manufacturing polysilicon film on substrate
TW200506733A (en) * 2003-08-15 2005-02-16 Via Tech Inc Apparatus and method for the co-simulation of CPU and DUT modules
US7327612B2 (en) * 2005-01-31 2008-02-05 Hewlett-Packard Development Company, L.P. Method and apparatus for providing the proper voltage to a memory
CN101174195B (zh) * 2006-11-01 2010-05-26 鸿富锦精密工业（深圳）有限公司 支持混合式存储器的主板
JP2008293096A (ja) * 2007-05-22 2008-12-04 Shinko Electric Ind Co Ltd メモリインタフェースおよびメモリシステム
US7623365B2 (en) * 2007-08-29 2009-11-24 Micron Technology, Inc. Memory device interface methods, apparatus, and systems
JP2010267096A (ja) * 2009-05-15 2010-11-25 Sharp Corp 情報処理装置
WO2011148484A1 (ja) * 2010-05-27 2011-12-01 富士通株式会社 メモリシステム、メモリ装置及びメモリインターフェース装置
US8527692B2 (en) * 2011-08-26 2013-09-03 Hewlett-Packard Development Company, L.P. Data storage apparatus with a HDD and a removable solid state device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100042778A1 (en) * 2008-08-18 2010-02-18 Advanced Micro Devices, Inc. Memory System Such as a Dual-Inline Memory Module (DIMm) and Computer System Using the Memory System
US20130054949A1 (en) * 2011-08-31 2013-02-28 Dell Products L.P. Memory compatibility system and method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2015126559A1 *

Also Published As

Publication number Publication date
JP2017512326A (ja) 2017-05-18
TWI515570B (zh) 2016-01-01
JP6501086B2 (ja) 2019-04-17
CN105900039B (zh) 2019-05-28
TW201535122A (zh) 2015-09-16
CN105900039A (zh) 2016-08-24
EP3108323B1 (de) 2020-02-26
EP3108323A1 (de) 2016-12-28
WO2015126559A1 (en) 2015-08-27
KR20160098444A (ko) 2016-08-18
US20150234726A1 (en) 2015-08-20

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