EP3074479B1 - Adhesive for insulative articles - Google Patents
Adhesive for insulative articles Download PDFInfo
- Publication number
- EP3074479B1 EP3074479B1 EP14865840.4A EP14865840A EP3074479B1 EP 3074479 B1 EP3074479 B1 EP 3074479B1 EP 14865840 A EP14865840 A EP 14865840A EP 3074479 B1 EP3074479 B1 EP 3074479B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- adhesive
- water
- polyvinyl acetate
- composition
- based polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 239000000853 adhesive Substances 0.000 title claims description 139
- 230000001070 adhesive effect Effects 0.000 title claims description 138
- 239000000203 mixture Substances 0.000 claims description 100
- 239000000758 substrate Substances 0.000 claims description 63
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 39
- 229920000103 Expandable microsphere Polymers 0.000 claims description 35
- 239000011118 polyvinyl acetate Substances 0.000 claims description 33
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 33
- 229920000642 polymer Polymers 0.000 claims description 31
- 239000000123 paper Substances 0.000 claims description 28
- HDERJYVLTPVNRI-UHFFFAOYSA-N ethene;ethenyl acetate Chemical group C=C.CC(=O)OC=C HDERJYVLTPVNRI-UHFFFAOYSA-N 0.000 claims description 18
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 10
- 238000007720 emulsion polymerization reaction Methods 0.000 claims description 10
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 9
- 239000006185 dispersion Substances 0.000 claims description 9
- 229920001353 Dextrin Polymers 0.000 claims description 8
- 239000004375 Dextrin Substances 0.000 claims description 8
- 229920005549 butyl rubber Polymers 0.000 claims description 8
- 235000019425 dextrin Nutrition 0.000 claims description 8
- 229920001038 ethylene copolymer Polymers 0.000 claims description 8
- 238000005259 measurement Methods 0.000 claims description 8
- 239000004014 plasticizer Substances 0.000 claims description 8
- 239000004814 polyurethane Substances 0.000 claims description 8
- 229920002635 polyurethane Polymers 0.000 claims description 8
- 229920001909 styrene-acrylic polymer Polymers 0.000 claims description 8
- 239000003755 preservative agent Substances 0.000 claims description 7
- 239000000654 additive Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 239000011087 paperboard Substances 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 5
- 239000004971 Cross linker Substances 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 4
- 235000013305 food Nutrition 0.000 claims description 4
- 239000003906 humectant Substances 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- DUFCMRCMPHIFTR-UHFFFAOYSA-N 5-(dimethylsulfamoyl)-2-methylfuran-3-carboxylic acid Chemical compound CN(C)S(=O)(=O)C1=CC(C(O)=O)=C(C)O1 DUFCMRCMPHIFTR-UHFFFAOYSA-N 0.000 claims description 2
- 239000013530 defoamer Substances 0.000 claims description 2
- 239000000975 dye Substances 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- 230000002335 preservative effect Effects 0.000 claims description 2
- 239000006254 rheological additive Substances 0.000 claims description 2
- 239000003381 stabilizer Substances 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- KAHROJAJXYSFOD-UHFFFAOYSA-J triazanium;zirconium(4+);tricarbonate;hydroxide Chemical compound [NH4+].[NH4+].[NH4+].[OH-].[Zr+4].[O-]C([O-])=O.[O-]C([O-])=O.[O-]C([O-])=O KAHROJAJXYSFOD-UHFFFAOYSA-J 0.000 claims description 2
- 239000002023 wood Substances 0.000 claims description 2
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 claims 1
- 239000004005 microsphere Substances 0.000 description 39
- 239000002131 composite material Substances 0.000 description 25
- 238000009413 insulation Methods 0.000 description 12
- 230000005855 radiation Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 10
- 239000004908 Emulsion polymer Substances 0.000 description 9
- 239000000839 emulsion Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000004821 Contact adhesive Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
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- 239000007787 solid Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000011324 bead Substances 0.000 description 3
- 238000004581 coalescence Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- NXQMCAOPTPLPRL-UHFFFAOYSA-N 2-(2-benzoyloxyethoxy)ethyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCCOCCOC(=O)C1=CC=CC=C1 NXQMCAOPTPLPRL-UHFFFAOYSA-N 0.000 description 2
- 229940100484 5-chloro-2-methyl-4-isothiazolin-3-one Drugs 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 2
- -1 and optionally Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000012669 compression test Methods 0.000 description 2
- 230000035622 drinking Effects 0.000 description 2
- 229910000267 dualite Inorganic materials 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003278 mimic effect Effects 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011099 solid bleached board Substances 0.000 description 2
- 239000011100 solid unbleached board Substances 0.000 description 2
- 239000011098 white lined chipboard Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- CVPZXHCZKMFVOZ-UHFFFAOYSA-N [4-(benzoyloxymethyl)cyclohexyl]methyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OCC(CC1)CCC1COC(=O)C1=CC=CC=C1 CVPZXHCZKMFVOZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- JLDSOYXADOWAKB-UHFFFAOYSA-N aluminium nitrate Chemical compound [Al+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O JLDSOYXADOWAKB-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- DMSMPAJRVJJAGA-UHFFFAOYSA-N benzo[d]isothiazol-3-one Chemical compound C1=CC=C2C(=O)NSC2=C1 DMSMPAJRVJJAGA-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000003115 biocidal effect Effects 0.000 description 1
- 239000003139 biocide Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011111 cardboard Substances 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000011093 chipboard Substances 0.000 description 1
- DHNRXBZYEKSXIM-UHFFFAOYSA-N chloromethylisothiazolinone Chemical compound CN1SC(Cl)=CC1=O DHNRXBZYEKSXIM-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 235000021270 cold food Nutrition 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 235000021268 hot food Nutrition 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- BEGLCMHJXHIJLR-UHFFFAOYSA-N methylisothiazolinone Chemical compound CN1SC=CC1=O BEGLCMHJXHIJLR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920006327 polystyrene foam Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical compound [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 1
- PZTAGFCBNDBBFZ-UHFFFAOYSA-N tert-butyl 2-(hydroxymethyl)piperidine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCCCC1CO PZTAGFCBNDBBFZ-UHFFFAOYSA-N 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B29/00—Layered products comprising a layer of paper or cardboard
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- B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/06—Copolymers with styrene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C—CHEMISTRY; METALLURGY
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- C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
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-
- C—CHEMISTRY; METALLURGY
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- C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- D21H21/00—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties
- D21H21/50—Non-fibrous material added to the pulp, characterised by its function, form or properties; Paper-impregnating or coating material, characterised by its function, form or properties characterised by form
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2439/00—Containers; Receptacles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2439/00—Containers; Receptacles
- B32B2439/70—Food packaging
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/582—Recycling of unreacted starting or intermediate materials
Definitions
- the present invention relates to an adhesive composition for insulative articles.
- the invention includes an adhesive composition and an article that comprises the adhesive for providing insulation and structural integrity.
- a more environmentally sound alternative food packages are made from a more renewable substrate, such as cellulosic sheet, e.g., paperboard, cardboard, paper, coated paper, films, bonded together with an adhesive.
- the alternative packages typically comprise at least two cellulosic substrates with an air gap interposed between the two substrates. As the package is handled and flexed, the air gap between the two substrates become compressed and the insulation is decreased in those compressed areas.
- a divider e.g., medium
- the aforementioned solutions increase cost and also increase carbon footprint.
- US 2013/303351 A1 discloses a method for utilizing microwave energy to heat, activate and expand heat-expandable adhesives and coatings, which can be either onto and/or within a substrate material used to subsequently be converted to a product, or placed directly onto or within a packaging product during its manufacturing processes.
- the substrate material can be either monolayer or multilayer in the form of rolls, sheet or blanks made of materials such as paper, paperboard, coated paper, fluted board material, plastic film, woven material, textile, nonwoven material, and/or metalized substrates, or any combination of these materials.
- US Patent No. 5 264 467 discloses an aqueous contact adhesive composition consisting essentially of a) an aqueous emulsion containing a contact adhesive polymer which is a vinyl acetate-ethylene, acrylic or neoprene polymer, b) 0-50 wt % plasticizer, based on contact adhesive polymer, c) 0.5-10 wt % thermoplastic hollow microspheres, based on contact adhesive polymer, and d) 0-4.5 wt % polyethylenimine, based on contact adhesive polymer, the adhesive composition demonstrating less than one pound per linear inch adhesion to stainless steel by PSTC-1 method, and a method for laminating two substrates using the aqueous contact adhesive.
- a contact adhesive polymer which is a vinyl acetate-ethylene, acrylic or neoprene polymer
- plasticizer based on contact adhesive polymer
- c) 0.5-10 wt % thermoplastic hollow microspheres based on contact adhesive polymer
- the present invention seeks to improve insulating cellulosic sheet, through the use of an adhesive composition that adds insulative properties and structural integrity to the cellulosic sheet.
- the present invention provides an environmentally and economically sound package that provides thermal insulation and structural integrity.
- the present invention relates to a waterborne adhesive composition as defined in the claims that provides insulation and structural integrity when the adhesive is applied to a cellulosic substrate.
- the present invention further provides a multilayer-substrate article that comprises the adhesive interposed between the substrates.
- the adhesive provides insulative properties and structural integrity to the article.
- an adhesive composition comprising (a) a water-based polymer prepared by emulsion polymerization; (b) a plurality of expandable microspheres; and optionally (c) additive.
- the water-based polymer has (i) an elastic modulus greater than 0.5MPa in the range temperature range of 70°C to 110°C; (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70°C to 110°C; and (iii) a tan d value less than 0.6 at 90°C, wherein the modulus measurements are conducted in accordance with ASTM D5026, and is selected from the group consisting of vinyl acetate ethylene dispersion, polyvinyl acetate, polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, polyvinyl acetate copolymers, vinyl acetate ethylene copolymers, vinylacrylic, styrene acrylic, acrylic, st
- Another embodiment provides process for forming an article comprising the steps, (1) preparing a composition comprising a water-based polymer prepared by emulsion polymerization and a plurality of expandable microspheres; (2) applying the composition onto a substrate, which is a paper, paperboard, or wood; (3) drying the composition to substantially remove the water; and (4) expanding the composition.
- the water-based polymer has (i) an elastic modulus greater than 0.5MPa in the range temperature range of 70°C to 110°C; (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70°C to 110°C; and (iii) a tan d value less than 0.6 at 90°C, wherein the modulus measurements are conducted in accordance with ASTM D5026, and is selected from the group consisting of vinyl acetate ethylene dispersion, polyvinyl acetate, polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, polyvinyl acetate copolymers, vinyl acetate ethylene copolymers, vinylacrylic, styrene acrylic, acrylic, styrene butyl rubber, polyurethane and mixtures thereof.
- the expandable microspheres begin to expand at a temperature of 80°C to 100°C and have a maximum expansion temperature of 120°C to 130
- Yet another embodiment is directed to an article comprising a cellulosic substrate and a composition comprising a water-based polymer prepared by emulsion polymerization and a plurality of expandable microspheres.
- the polymer has (i) an elastic modulus greater than 0.5MPa in the range temperature range of 70°C to 110°C; (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70°C to 110°C; and (iii) a tan d value less than 0.6 at 90°C, wherein the modulus measurements are conducted in accordance with ASTM D5026, and is selected from the group consisting of vinyl acetate ethylene dispersion, polyvinyl acetate, polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, polyvinyl acetate copolymers, vinyl acetate ethylene copolymers, vinylacrylic, styrene acrylic, acrylic, styren
- the present invention provides an adhesive composition that provides insulation and structural integrity upon heating or applying radiation to the adhesive.
- the adhesive and the article made with the adhesive is more environmentally sound, e.g., biodegradable, than conventional closed-cell extruded polystyrene containers.
- the present invention is based on the discovery that an adhesive composition comprising a water-based polymer prepared by emulsion polymerization and a plurality of expandable microspheres provide improved structural integrity and thermal insulation.
- the adhesive compositions described herein may be useful in multilayer substrates, particularly for cellulosic substrates. Through the use of the inventive adhesive composition, a greater insulation space may be provided between the two substrates, which it is attached at the point of adhesion. Such article containing multilayer substrates avoids the need for a divider, and thus, it is a more environmentally conscious product.
- the insulating products useful herein include paper products for consumer use, such as for hot drinking cups and lids, cold drinking cups and lids, hot food containers and lids, cold food containers and lids, freezer cartons and cases, and the like.
- the adhesive composition may be made from any number of materials. Desirably, the adhesive composition includes an emulsion polymer component, a plurality of microspheres, and optionally, plasticizer and water. The adhesive composition may further include one or more preservatives, tackifiers or fillers. Other materials that do not adversely affect the adhesive and insulating properties of the adhesive composition may be used as desired.
- the adhesive composition includes a water-based polymer prepared by emulsion polymerization.
- the emulsion polymer may be present in the adhesive composition in any amount, and desirably is present in an amount of from about 50% to about 99.5 wt%, preferably from about 50% to about 70 wt%, by weight of the adhesive composition prior to setting of the composition.
- the solid levels vary from about 40 wt% to about 60 wt%, based on the emulsion polymer.
- the water-based polymer may be selected so that it can be highly plasticized by water. This allows efficient expansion for the microspheres during heating.
- the emulsion polymer is stabilized by hydrophilic protective colloids.
- the water-based polymer prepared by emulsion polymerization may be a single grade or a mixture of synthetic emulsion polymer or polymers of a natural origin.
- the water-based polymer prepared by emulsion polymerization may include any desired polymer components, being selected from the group consisting of vinyl acetate ethylene dispersion, polyvinyl acetate, polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, polyvinyl acetate copolymers, vinyl acetate ethylene copolymers, vinylacrylic, styrene acrylic, acrylic, styrene butyl rubber, polyurethane and mixtures thereof.
- Particularly preferred emulsion polymer components are vinyl acetate ethylene dispersion and polyvinyl acetate.
- the water-based polymer has an elastic modulus greater than 0.5MPa in the range temperature range of 70°C to 110°C. All reported modulus measurements, unless otherwise stated, were conducted in accordance with ASTM D5026. In another embodiment, the water-based polymer has an elastic modulus greater than 5MPa in the range temperature range of 85°C to 100°. Yet in another embodiment, the water-based polymer has an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70°C to 110°C. In another embodiment, the water-based polymer has an absolute log(E)/T slope of less than 0.008 in the range temperature range of 85°C to 100°C. Still in another embodiment, the water-based polymer has a tan d value less than 0.6 at 90°C.
- the adhesive composition further includes a plurality of pre-expanded or expandable microspheres.
- the pre-expanded microspheres are fully expanded and do not need to undergo further expansion.
- the expandable microspheres useful in the present invention should be capable of expanding in size in the presence of heat and/or radiation energy (including, for example, microwave, infrared, radiofrequency, and/or ultrasonic energy).
- the microspheres useful in the present invention include, for example, heat expandable polymeric microspheres, including those having a hydrocarbon core and a polyacrylonitrile shell (such as those sold under the trade name DUALITE®) and other similar microspheres (such as those sold under the trade name EXPANCEL®).
- the expandable microspheres may have any unexpanded size, including from about 12 microns to about 30 microns in diameter. In the presence of heat, the expandable microspheres of the present invention may be capable of increasing in diameter by about 3 times to about 10 times.
- the adhesive composition becomes a foam-like material, which has improved insulation properties. It may be desired, as will be explained below, that the expansion of the microspheres takes place in a partially set adhesive composition.
- the expandable microspheres have a particular temperature at which they begin to expand and a second temperature at which they have reached maximum expansion. Different grades of microspheres have different expansion temperature (Texp) and maximum expansion temperature (Tmax). The expandable microsphere has a Texp of 80°C to 100°C. While any particular grade of microspheres may be used in the present invention, the Texp and Tmax of the microspheres should be taken into account when formulating and processing.
- the temperature at which the microspheres have reached maximum expansion (Tmax) is from 120°C to 130°C.
- the processing temperatures may be modified depending upon these temperatures.
- these microspheres are able to move within the composition and are able to expand. Once the adhesive composition is fully dry, however, the microspheres are substantially locked in place, making expansion thereof difficult, if not impossible.
- the expandable microspheres be present in the adhesive composition in an amount of from about 0.1% to about 10% by weight of the adhesive composition prior to setting of the composition, and more desirably from about 0.5% to about 7% by weight of the adhesive composition prior to setting of the composition, and most desirably at about 1% to about 5 % by weight of the adhesive composition prior to setting of the composition.
- the expansion ratio of the expandable microspheres and the loading level of the microspheres will be related to each other.
- the amount of the expandable microspheres in the adhesive can be adjusted.
- the desired amount of the microspheres in the composition may be modified.
- the adhesive composition includes too high a concentration of expandable microspheres, there will be insufficient adhesion and strength upon expansion of the microspheres, and thereby weakening the structural integrity of the composite.
- the expanded adhesive has a greater than 150%, preferably greater than 200%, total volume expansion from a wet or partially-dry adhesive coating. As shown in Figure 2 , the adhesive provides about 75% height separation of the composite (paper substrates held together with the adhesive) even when compressed at 191°F with a force of 2psi for 2 minutes. Thus, the adhesive provides structural integrity to the multilayer substrates even after exposure to hot compression.
- the adhesive composition optionally includes a plasticizer.
- plasticizers are dibenzoates available as BENZOFLEX®, such as diethylene glycol dibenzoate, dipropylene glycol dibenzoate, and the like.
- the adhesive composition may optionally include any polar solvent, particularly water, in the formulation.
- the adhesive composition optionally further includes any tackifiers, humectants, crosslinkers, preservatives, e.g., antioxidant, biocide; filler, pigment, dye, stabilizer, rheology modifier, polyvinyl alcohol, and mixtures thereof.
- preservatives e.g., antioxidant, biocide
- filler pigment, dye, stabilizer, rheology modifier, polyvinyl alcohol, and mixtures thereof.
- exemplary preservatives include 1,2-benzisothiazolin-3-one, 5-chloro-2-methyl-4-isothiazolin-3-one and 2-Methyl-4-isothiazolin-3-one.
- preservatives may be used in the amount of from about 0.05% to about 0.5% by weight of the adhesive composition prior to setting of the composition.
- crosslinker will further increase the structural integrity of the adhesive after the microspheres are expanded.
- the adhesive composition may further include an accelerator.
- the accelerator is a multivalent cation from water-soluble salts, including commonly available aluminum nitrate (Al(NO 3 ) 3 ), zirconium acetate, ammonium zirconyl carbonate (available as Bacote 20 from Zirconium Chemicals).
- Al(NO 3 ) 3 aluminum nitrate
- zirconium acetate zirconium acetate
- ammonium zirconyl carbonate available as Bacote 20 from Zirconium Chemicals.
- the addition of a multivalent water-soluble salt shortens the time required for radiation during the expansion of the adhesive composition. When added, from about 0.05 to about 1, preferably from about 0.1 to 0.3 wt% based on the total weight of the adhesive composition, may be used.
- the adhesive can start to coalesce at room temperature, the adhesive composition may still have high moisture content and will be substantially fluid.
- a form of energy may be introduced to the adhesive to expand the microspheres before fully drying the adhesive.
- the form of energy is typically heat from conduction, induction or radiation.
- no additional form of energy is necessary.
- the adhesive composition may be applied to the surface (or surfaces) of a substrate and subjected to heat sufficient to coalesce the adhesive. At the onset of adhesive coalescence and while the adhesive is still substantially fluid-like, the adhesive may aid in holding the adhesive and microspheres in place, but will allow the microspheres the freedom to expand. In one embodiment, the heat may then be raised to a temperature sufficient to expand the microspheres. It is preferable for the heater to be set to a temperature range between the Texp and Tmax of the microspheres.
- the heat may be raised again to a temperature sufficient to fully drive the water off the adhesive composition.
- Heat may be applied by any desired method, including in an oven or through the use of heated rollers.
- the various stages onset of setting, expansion of the microspheres, and fully drying the adhesive
- induction heating method may be used in the process.
- the process may include any combination of heat application and radiation application.
- the initial coalescence of the adhesive may be achieved through direct heat, while the expansion of the microspheres may be achieved through application of radiation energy.
- additives may be included in the composition to increase the coalescence of the adhesive, is desired.
- the inventive adhesive is particularly suitable for insulative packages that are typically directed for use at elevated and/or reduced temperatures and requires thermal insulation.
- Another embodiment provides a method of preparing an article having improved structural integrity and insulative properties, including the steps of: (a) providing a first substrate having a first side and second side; (b) providing a second substrate having a first side and second side; (c) preparing an adhesive composition by combining (i) an emulsion-based polymer selected from the group consisting of vinyl acetate ethylene dispersion, polyvinyl acetate, polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, polyvinyl acetate copolymers, vinyl acetate - ethylene copolymers, vinylacrylic, styrene acrylic, acrylic, styrene butyl rubber, polyurethane and mixtures thereof; (ii) a plurality of expandable microspheres, and optionally (iii) a plasticizer and (iv) water to form an adhesive; (d) applying the adhesive either (i) to a surface of the first side of the first substrate
- the adhesives may be formed immediately prior to applying onto a substrate or pre-made in advance and stored until needed.
- Another embodiment is directed to insulated packages and a method for forming insulated packages.
- the packages include cups, food containers, cases, cartons, bags, lids, boxes, envelopes, wraps, clamshells, and the like. It is preferred that the substrates of the packages have a reduced basis weight, caliper, and fiber content as compared to traditional substrates used for the same packages.
- the substrates include fibreboards, chipboards, corrugated boards, corrugated mediums, solid bleached boards (SBB), solid bleached sulphite boards (SBS), solid unbleached board (SLB), white lined chipboards (WLC), kraft papers, kraft boards, coated papers, binder boards, and reduced basis weight substrates.
- SBB solid bleached boards
- SBS solid bleached sulphite boards
- SLB solid unbleached board
- WLC white lined chipboards
- kraft papers kraft boards, coated papers, binder boards, and reduced basis weight substrates.
- an insulating sheet including a substantially flat paper having a first side and a second side.
- the first side of the paper includes a plurality of expandable microspheres secured thereto in an adhesive composition, where the plurality of expandable microspheres has been expanded and the adhesive composition has been dried.
- the product includes a paper having an adhered, foam-like composition on the first side thereof.
- the expandable microspheres include those described above, and the adhesive composition includes the components described above, including the emulsion polymer, and optional polar solvent, plasticizer, humectants, preservatives, or fillers.
- the adhesive composition may be applied to the first surface of the paper in any configuration desired, including in a series of dots, stripes, waves, checkerboard patterns, any general polyhedron shapes that have substantially flat bases, and combinations thereof. Application of these patterns decreases the amount of adhesive in the packages. Further, the adhesive composition may be applied to the first surface in a series of cylinders. In addition, if desired, the adhesive composition may be applied to the first surface as a substantially flat sheet of adhesive covering the entire first surface (full lamination) or covering a portion of the first surface. The adhesive composition may be applied in the presence of heat if desired; however, it is important that the heat at application not be so high as to fully set the adhesive composition before expanding the expandable microspheres.
- a second paper may be applied to the top surface of the adhesive composition, forming a sandwiched configuration of: first paper-adhesive with expanded microspheres - second paper.
- the paper with wet adhesive thereon may be exposed to heat and/or radiation energy to coalesce the adhesive composition.
- the adhesive composition therefore locks in the components, including the plurality of microspheres, in place and adheres them to the surface of the paper. It may be desired to only partially dry the adhesive composition, to the point that the composition locks in the components and maintains them sticking to the surface of the paper, but is not completely dry. A skilled artisan can determine state without undue experimentation. As explained above, only partially drying the adhesive composition (i.e., leaving a higher amount of moisture in the adhesive, such as at least 10% moisture content) allows the expandable microspheres to expand.
- the paper is then exposed to heat and/or radiation energy sufficient to expand the plurality of microspheres.
- the paper with wet adhesive thereon is exposed to heat at a temperature sufficient to expand at least a majority of the microspheres, in between the ranges of Texp and Tmax.
- the paper with wet adhesive thereon is exposed to microwave or infrared energy sufficient to expand at least a majority of the expandable microspheres.
- the resulting product is a paper having an adhesive having expanded microspheres therein.
- the adhesive composition may then be exposed to heat and/or radiation energy sufficient to fully set the adhesive composition.
- a second paper having a first side and second side may be provided and the first side of the second paper applied to the surface of the applied adhesive composition, forming a sandwich configuration. Thereafter, expansion of the microspheres and setting of the adhesive may take place as explained above.
- Multilayer substrate packages formed with the inventive adhesives containing microspheres improve the ability of the package to withstand strain under a constant stress at elevated and/or reduced temperatures. It is expected to those skilled in the art that the strain of the adhesive increases with the addition of microspheres at elevated temperature.
- the inventive adhesive is particularly suitable for consumer packages that are typically directed for use at elevated temperatures.
- the inventive adhesive provides structural support in between the paper boards of the package, and this maintains the structural integrity of the package, and thereby insulation is improved for the package.
- a multilayer substrate that contains two substrates and the adhesive, without any further substrates, e.g., a divider.
- the adhesive may be applied to completely coat the two substrates or in a selected or a random pattern.
- the insulated article with patterned adhesive allows for gaps within the two substrates.
- the insulated article comprises a substantially flat substrate and a non-flat, rounded substrate.
- the adhesive is applied either to the substantially flat substrate, the non-flat substrate, or to both substrates, to form the insulated article.
- the adhesive may be applied to completely coat the surface of the substrate(s) or to selectively coat portions of the surface of the substrate(s).
- the pattern can be random or various ordered designs.
- the resulting article thus has an insulating space between the liner surfaces.
- the articles with patterned adhesives mimic a divider interposed between the two substrates. The space between the two substrates are generated and maintained by the adhesive.
- Another exemplary consumer package is a corrugated box package formed with lower basis weight substrates and a lower basis weight divider.
- the substrates and divider are made of paper that has a reduced basis weight when compared to traditional insulating corrugated boards.
- Example 1 Elastic modulus, absolute (log(E) / T) slope and tan delta of water-based resin emulsions
- Adhesive compositions were prepared having the following composition. Table 1. Component Component A (wt%) B (wt%) Comparison (wt%) Water-based resin emulsion 1 (i) an elastic modulus greater than 0.5MPa in the range temperature range of 70°C to 110°C; 90.7 88.00 (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70°C to 110°C; and (iii) a tan d value less than 0.6 at 90°C Comparison Water-based resin emulsion (i) an elastic modulus greater than 0.5MPa in the range temperature range of 70°C to 90.7 85°C and lower than 0.5MPa in the range temperature range temperature range of 85°C to 110°C; (ii) an absolute log(E)/T slope as 0.0177 in the range temperature range of 70°C to 110°C; and (iii) a tan d value as 0.6140 Expandable microspheres DUALITE® U020-125W 4.0
- thermocouples Digi-Sense, Type J
- Two compressible foams were also placed on the other side of the thermocouple to mimic pressure on the point of contact.
- Water at 190.25°F, was poured into the composite cup and the thermocouple temperatures were recorded.
- An average of the thermocouple readings, at 5 second intervals are shown Table 2, and the entire temperature plot against time is shown in Figure 1 .
- Table 2 The entire temperature plot against time is shown in Figure 1 . Table 2.
- the composite cup had lower temperatures than the comparative composite temperatures, indicating that heat was better insulated in the composite cup.
- the measured composite temperature stabilized 14-15°F lower than the temperature of the comparative composite.
- the composite with the adhesive is able to maintain greater than 70%, and even greater than 75% of the original height (separation) during the hot compression test. Furthermore, the adhesive can provides this structural integrity to the composite throughout the entire two minutes.
- Hot creep test was conducted on a composite made with Sample A adhesive and two substrates. On a solid bleached sulfite board, five 1 ⁇ 2" array dots of Sample A were placed, and then covered with a second solid bleached sulfite board. This composite was then placed in a TA Instruments DMA Q-800, heated on a hot plate setting at 191°F (88.3°C), and then tested in accordance with ASTM D 5024 (0.25 inch 2 ). Once the force of 300g was reached, the strain percent was measured (as time 0). The same hot creep test was conducted with a composite made with Comparison adhesive and the same substrates, and the strain percents are listed in Table 4. Table 4.
- Sample adhesives A (without accelerator) and B (with accelerator) were expanded in a microwave.
- wet dots of samples were placed on a substrate and then expanded in the microwave for the same amount of time.
- the expansion ratios of dry to wet and dry to dry of the samples are listed in Table 5.
- Table 5. Wet Dot (mg) Expansion Ratio (dry/wet) Expansion Ratio (dry/dry) Sample A 4.1 6.5 11.6 Sample B 4.1 9.8 17.5 Sample A 3.4 7.7 13.8 Sample B 3.4 9.4 16.8
- Sample B (with accelerator) had higher volumetric expansion ratios than Sample A for both dry/wet and dry/dry. It was observed that Sample B expanded earlier than Sample A in the microwave. It was also observed that Sample B required less time than Sample A to reach the same volumetric expansion in the microwave.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Paper (AREA)
- Compositions Of Macromolecular Compounds (AREA)
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US201361909723P | 2013-11-27 | 2013-11-27 | |
PCT/US2014/067408 WO2015081097A1 (en) | 2013-11-27 | 2014-11-25 | Adhesive for insulative articles |
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JP (1) | JP6445013B2 (tr) |
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ES (1) | ES2720513T3 (tr) |
HU (1) | HUE043062T2 (tr) |
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EP3527361A1 (de) | 2018-02-16 | 2019-08-21 | Henkel AG & Co. KGaA | Verfahren zur herstellung eines mehrschichtigen substrats |
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RU2016125132A (ru) | 2017-12-28 |
WO2015081097A1 (en) | 2015-06-04 |
TR201907884T4 (tr) | 2019-06-21 |
RU2659965C1 (ru) | 2018-07-04 |
HUE043062T2 (hu) | 2019-07-29 |
BR112016011948B1 (pt) | 2022-02-22 |
MX2016006085A (es) | 2016-08-12 |
US10099459B2 (en) | 2018-10-16 |
CN105765023A (zh) | 2016-07-13 |
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EP3074479A1 (en) | 2016-10-05 |
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PL3074479T3 (pl) | 2019-10-31 |
JP2017503039A (ja) | 2017-01-26 |
ES2720513T3 (es) | 2019-07-22 |
JP6445013B2 (ja) | 2018-12-26 |
US9849655B2 (en) | 2017-12-26 |
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