EP3072994B1 - Flooding device for a horizontal galvanic or wet-chemical process line for metal deposition on a substrate - Google Patents

Flooding device for a horizontal galvanic or wet-chemical process line for metal deposition on a substrate Download PDF

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Publication number
EP3072994B1
EP3072994B1 EP15161394.0A EP15161394A EP3072994B1 EP 3072994 B1 EP3072994 B1 EP 3072994B1 EP 15161394 A EP15161394 A EP 15161394A EP 3072994 B1 EP3072994 B1 EP 3072994B1
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EP
European Patent Office
Prior art keywords
flooding
substrate
guiding element
substrate guiding
treated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP15161394.0A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3072994A1 (en
Inventor
Stefan Grüßner
Wolfgang Richert
Christian Thein
Norbert Walliser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Priority to EP15161394.0A priority Critical patent/EP3072994B1/en
Priority to JP2017550763A priority patent/JP6748106B2/ja
Priority to PCT/EP2016/055971 priority patent/WO2016156067A1/en
Priority to CN201680018314.1A priority patent/CN107636210B/zh
Priority to KR1020177030116A priority patent/KR102056528B1/ko
Priority to TW105109546A priority patent/TWI685589B/zh
Publication of EP3072994A1 publication Critical patent/EP3072994A1/en
Application granted granted Critical
Publication of EP3072994B1 publication Critical patent/EP3072994B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing

Definitions

  • the present invention relates to a flooding device for a horizontal galvanic or wet-chemical process line for metal, in particular copper, deposition on a substrate to be treated.
  • the present invention is further directed to a treating module of a horizontal galvanic or wet-chemical process line for metal, in particular copper, deposition on a substrate to be treated.
  • EP 0 054 302 A1 discloses a method for the continuous electrolytic treatment of a rnetal strip with an electrolytic treating liquid using horizontal electrodes substantially insoluble in said electrolytic treating liquid comprising the steps of:
  • EP 0 520 324 A1 discloses an apparatus for treating board-like articles, particularly printed circuit boards, with a fluid treatment medium, particularly a cleansing, etching, metallizing or rinsing liquid with a conveying device for conveying the board-like articles along an optionally substantially horizontal conveying path and at least one applicator, such as a spray or swell nozzle or a device which produces a stationary wave, wherein means are provided, through which a surface area of the board, which at a particular time is in contact with the treatment medium is predefinable and limitable in its extension along the conveying direction.
  • a fluid treatment medium particularly a cleansing, etching, metallizing or rinsing liquid
  • a conveying device for conveying the board-like articles along an optionally substantially horizontal conveying path and at least one applicator, such as a spray or swell nozzle or a device which produces a stationary wave, wherein means are provided, through which a surface area of the board, which at a particular time is
  • DE 197 17 51141 discloses a method concerns specific treatment of flat products in the framework of wet chemical and/or electrochemical treatment, as well as rinsing in a continuous installation with nozzles, nozzle blocks or flooding nozzles. It is characterised by the following steps: a) loading of the installation with products of different thickness in an arbitrary sequence; b) determination of the dimensions of the products before the first nozzle arrangement; c) tracking of the position of the products from the instant at which their dimensions were determined to the end to the last treatment and rinsing section; d) adjustment of the hydrodynamic conditions of the nozzle arrangements along the transport path to the requirements of the products in each particular nozzle zone.
  • EP 0 894 561 A2 discloses an apparatus for soldering printed circuit boards comprising a plurality of stations through which the printed circuit boards are conveyed in line, through a horizontal path, the stations including a preheat station having heating means and means for conveying the panels through the preheat station to elevate the temperature of the panels, a flux station for coating the panels with a flux and including means for conveying the panels through the flux station, a soldering station including at least one solder immersion chamber through which said printed circuit board panels may be horizontally conveyed for coating the printed circuit boards with molten solder, the improvement wherein the solder immersion chamber comprises a solder manifold having upper and lower solder chambers, from which solder is directed onto the top and bottom surfaces of printed circuit boards conveyed in a substantially horizontal path there between, said solder immersion chamber further comprising a pair of driven rollers at either end thereof for conveying the printed circuit boards through the solder immersion chamber and for damming and holding the molten solder within the solder immersion chamber, means in
  • the substrates to be treated have been relatively thick, stiff and heavy compared to the presence.
  • the market requires more and more in consequence of the on-going worldwide technical miniaturization in the printed circuit board area devices and process lines, which can also safely treat substrates to be treated, which are much thinner than anything, which has been processed up to now.
  • the weight of each individual substrate to be treated is largely reduced while the flexibility of the substrate to be treated is largely increased.
  • a flooding device having all features of claim 1.
  • inventive device having all features of claim 1.
  • inventive device comprises a treating module of a horizontal galvanic or wet-chemical process line for metal, in particular copper, deposition on a substrate to be treated comprising at least one pair of oppositely arranged such flooding devices.
  • inventive treating module are protected in dependent claims 8 to 10.
  • the present invention accordingly provides a flooding device for a horizontal galvanic or wet-chemical process line for metal, in particular copper, deposition on a substrate to be treated, wherein the flooding device comprises at least a flooding element and at least a first substrate guiding element, wherein said flooding element is mechanically connected to the at least first substrate guiding element, and wherein the first substrate guiding element is spatially arranged on the entry side of the flooding element, wherein the flooding device further comprises at least a second substrate guiding element, wherein the flooding element is mechanically connected to the at least second substrate guiding element, and wherein the second substrate guiding element is spatially arranged on the exit side of the flooding element, wherein the flooding device provides a transport direction of the substrates to be treated, wherein the flooding device provides an entry side and an exit side, wherein the term "entry side” refers to the side of a flooding device of a horizontal process line, wherein a substrate to be treated will arrive in transport direction in the transportation area at the flooding device before entering the flooding device through which the substrate to be
  • the inventive flooding device avoids that at the most dangerous site, namely around the flooding device itself, the flexible thin substrates to be treated will flow upwards or downwards between the individual transport elements directly after having passed the flooding devices.
  • inventive device can be easily installed in already existing process lines without any large effort or cost.
  • substrate guiding element refers to an element, which is required, intended or supposed to support the transportation of a substrate to be treated in such a way that the substrate to be treated will not run between two adjacent individual transport elements of the horizontal process line. Conclusively, such a substrate guiding element serves the purpose of avoiding damages of the substrates to be treated during passing the horizontal process line.
  • exit side refers to said side of a flooding device of a horizontal process line, wherein a substrate to be treated will arrive in transport direction in the transportation area at the flooding device after leaving the flooding device through which the substrate to be treated has been run before.
  • the plurality of protrusions can be extending in axial direction in a strictly linear manner or more or less bent up in order to simplify the substrates to be treated to enter or to pass, in particular to enter, the respective flooding device and flooding element.
  • the plurality of protrusions of the first substrate guiding element have longer axial dimensions against the transport direction of the substrate to be treated than the plurality of protrusions of the second substrate guiding element in transport direction of the substrate to be treated.
  • the plurality of protrusions on both sides of the flooding element can be of the same length or other spoken of the same axial dimension.
  • Entering or leaving of the flooding elements in the sense of the present invention means of course the entering of the substrate to be treated into the area between the oppositely arranged two individual flooding elements of a treating module as it can be seen exemplary in the enclosed Figures 1 , 2 , 3 , 6 , 7 , 9 , and 10 .
  • each individual protrusion of the plurality of protrusions of the first substrate guiding element and of the second substrate guiding element is directly connected to the flooding element and works independently from the adjacent protrusions.
  • the first substrate guiding element comprises at least one section of at least two adjacent protrusions, which are mechanically connected by at least a mechanical connecting element
  • the second substrate guiding element comprises at least one section of at least two adjacent protrusions, which are mechanically connected by at least a mechanical connecting element
  • the first substrate guiding element and the second substrate guiding element each comprises at least one section of at least two adjacent protrusions, which are mechanically connected by at least a mechanical connecting element.
  • all protrusions of the first substrate guiding element are mechanically connected by at least a mechanical connecting element and/or all protrusions of the second substrate guiding element are mechanically connected by at least a mechanical connecting element on the respective side of the flooding element.
  • such a case will offer on at least one side of the flooding element a kind of grating structure of the respective first and/or second substrate guiding element.
  • the first and/or second substrate guiding element can be easily adapted to existing flooding elements of already running process lines, which are making use of wheel axis as transport elements. An expensive modification of the transport system can be thereby avoided.
  • the sole requirement is the adaption of the free space between the adjacent protrusions of the first and/or second substrate guiding element to the size of the wheels of the wheel axis.
  • Wheel axis and rollers are both well-known individual transport elements of the prior art, which are commonly arranged in form of at least a lower series of transport elements below the transportation level of the substrates to be treated. Very often an analogues upper series of such individual transport elements is also arranged above the transportation level of the substrates to be treated.
  • the flooding element further comprises at least a third substrate guiding element, which is connecting the first substrate guiding element from the entry side of the flooding element with the second substrate guiding element of the exit side of the flooding element; wherein the first, second and third substrate guiding element form an attachment part, which is mechanically connected in one piece to the flooding element.
  • the flooding element comprises at least a first step and a second step on the flooding element surface, which is directed to the transport pathway of the substrate to be treated, and wherein the process liquid flows out of said flooding element surface.
  • the first substrate guiding element and/or the second substrate guiding element is/are a continuous piece, such as a sheet or plate, wherein the first substrate guiding element is extending in axial direction from the flooding element against the transport direction of the substrates to be treated, and wherein the second substrate guiding element is extending in axial direction from the flooding element in transport direction of the substrates to be treated.
  • the first substrate guiding element has longer axial dimensions against the transport direction of the substrate to be treated than the second substrate guiding element in transport direction of the substrate to be treated.
  • Such a pair of flooding devices generates a defined flow of treatment liquid, which enters the respective treating module thereby.
  • Said flow of treatment liquid can cause problems if the substrate to be treated is thin and flexible.
  • the substrates to be treated will be influenced by the generated treatment liquid flow and will leave the desired transportation level by running between the first transport elements, which are in front of or behind the respective flooding device. This problem of the prior art can be solved by said treating module.
  • each flooding device further comprises at least a second substrate guiding element, wherein the flooding element is mechanically connected to the at least second substrate guiding element, and wherein the second substrate guiding element is spatially arranged on the exit side of the flooding element; and wherein each flooding element further comprises at least a third substrate guiding element, which is connecting the first substrate guiding element from the entry side of the flooding element with the second substrate guiding element of the exit side of the flooding element; wherein the first, second and third substrate guiding element form an attachment part, which is mechanically connected in one piece to the flooding element.
  • the present invention thus addresses the problem of transporting thin (down to 25 micrometers) and flexible substrates to be treated through a horizontal process line without damaging them.
  • the flexible thin substrates to be treated cannot more flow upwards or downwards between the individual transport elements directly after having passed the flooding devices.
  • a first embodiment is shown in the following Figures 1 to 5 .
  • each of the two shown flooding devices comprises a flooding element 2 and a first substrate guiding element 5, wherein said flooding element 2 is mechanically connected to the first substrate guiding element 5, and wherein the first substrate guiding element 5 is spatially arranged on the entry side 8 of the flooding element 2.
  • Each shown flooding device further comprises a second substrate guiding element 6, wherein the flooding element 2 is mechanically connected to the second substrate guiding element 6, and wherein the second substrate guiding element 6 is spatially arranged on the exit side 9 of the flooding element 2.
  • first substrate guiding element 5 and the second substrate guiding element 6 comprise each a plurality of protrusions, wherein the protrusions of the first substrate guiding element 5 are extending in axial direction from the flooding element 2 against the transport direction of the substrates to be treated.
  • the protrusions of the second substrate guiding element 6 are extending in axial direction from the flooding element 2 in transport direction of the substrates to be treated.
  • each individual protrusion of the plurality of protrusions of the second substrate guiding element 6 is directly connected to the flooding element 2 and works independently from the adjacent protrusions.
  • Figure 2 shows a schematic perspective side view of the inventive treating module comprising one pair of oppositely arranged inventive flooding devices in accordance with the first embodiment of the present invention shown in Figure 1 .
  • a fastening element 10 which serves the purpose of detachably connecting the attachment part comprising the first 5, second 6, and third 4 substrate guiding element to the respective flooding element 2.
  • an attachment part can be also used as reinforcement for providing an increased overall stiffness of the flooding device, if the flooding element is manufactured of polymeric material, such as polypropylene, polyvinylchloride or polyethylene.
  • the attachment part would be made of metal or metal alloys, such as stainless steel, titanium, or nickel alloys.
  • Such a combination of a plastic flooding element 2 and an attachment part of metal is exemplarily advantageous in rinsing modules of a horizontal process line.
  • Figure 3 shows another schematic perspective side view of the inventive treating module comprising one pair of oppositely arranged inventive flooding devices in accordance with the first embodiment of the present invention shown in Figure 1 .
  • Figure 3 is basically identical to Figure 2 besides the fact that herein now all transport elements 3 are now shown.
  • Figure 4 shows a schematic perspective top view of an individual inventive flooding device in accordance with the first embodiment of the present invention shown in Figure 1 .
  • FIGs 4 and 5 serve both the purpose of individual illustration of a single attachment part comprising the first 5, second 6, and third 4 substrate guiding element.
  • FIG 4 there is still included the respective flooding element 2, while in Figure 5 said flooding element 2 has been removed for illustration purposes.
  • Figure 6 shows a schematic side view of the inventive treating module 1' of a horizontal galvanic or wet-chemical process line for metal, in particular copper, deposition on a substrate to be treated wherein the treating module 1' comprises one pair of oppositely arranged such inventive flooding devices in accordance with a second embodiment of the present invention.
  • each of the two shown flooding devices comprises a flooding element 2' and a first substrate guiding element 5', wherein said flooding element 2' is mechanically connected to the first substrate guiding element 5', and wherein the first substrate guiding element 5' is spatially arranged on the entry side 8' of the flooding element 2'.
  • Each shown flooding device further comprises a second substrate guiding element 6', wherein the flooding element 2' is mechanically connected to the second substrate guiding element 6', and wherein the second substrate guiding element 6' is spatially arranged on the exit side 9' of the flooding element 2'.
  • first substrate guiding element 5' and the second substrate guiding element 6' comprise each a plurality of protrusions, wherein the protrusions of the first substrate guiding element 5' are extending in axial direction from the flooding element 2' against the transport direction of the substrates to be treated.
  • the protrusions of the second substrate guiding element 6' are extending in axial direction from the flooding element 2' in transport direction of the substrates to be treated.
  • the transport elements 3' of the second preferred embodiment are wheel axis.
  • this second embodiment is preferably used, if the treating module 1' requires the application of higher temperatures inside of the respective treating module 1' or if it requires the application of aggressive or oxidizing chemicals, such as permanganate.
  • the entire flooding device will be made of metal, preferably of stainless steel, in order to provide on the one hand a good chemical resistance of the material of the flooding device and on the other hand a sufficient mechanical stiffness to avoid material distortions. Such distortions are exemplarily taking place if flooding devices made of plastic materials are getting used at higher process liquid temperatures.
  • Figure 7 shows a schematic perspective side view of the inventive treating module 1' comprising one pair of oppositely arranged inventive flooding devices in accordance with the second embodiment of the present invention shown in Figure 6 .
  • Figure 8 shows a schematic perspective top view of an individual inventive flooding device in accordance with the second embodiment of the present invention shown in Figure 6 .
  • Figure 9 shows a schematic side view of the inventive treating module 1" of a horizontal galvanic or wet-chemical process line for metal, in particular copper, deposition on a substrate to be treated wherein the treating module 1 comprises one pair of oppositely arranged such inventive flooding devices in accordance with a third embodiment of the present invention.
  • each of the two shown flooding devices comprises a flooding element 2" and a first substrate guiding element 5", wherein said flooding element 2" is mechanically connected to the first substrate guiding element 5", and wherein the first substrate guiding element 5" is spatially arranged on the entry side 8" of the flooding element 2".
  • Each shown flooding device further comprises a second substrate guiding element 6", wherein the flooding element 2" is mechanically connected to the second substrate guiding element 6", and wherein the second substrate guiding element 6" is spatially arranged on the exit side 9" of the flooding element 2".
  • first substrate guiding element 5" and the second substrate guiding element 6" comprise each a plurality of protrusions, wherein the protrusions of the first substrate guiding element 5" are extending in axial direction from the flooding element 2" against the transport direction of the substrates to be treated.
  • the protrusions of the second substrate guiding element 6" are extending in axial direction from the flooding element 2" in transport direction of the substrates to be treated.
  • the flooding element 2" comprises a first step 7a' and a second step 7b' on the flooding element 2" surface, which is directed to the transport pathway of the substrate to be treated, and wherein the process liquid flows out of said flooding element 2" surface.
  • the flooding device provides a reinforcement element 12 for the flooding element 2", which can be necessary to increase the stiffness, if the flooding element 2" is made of plastics.
  • a dam roller 14 is also shown for illustrative purposes.
  • Figure 10 shows a schematic perspective side view of the inventive treating module comprising one pair of oppositely arranged inventive flooding devices in accordance with the third embodiment of the present invention shown in Figure 9 .
  • each individual protrusion of the plurality of protrusions of the first substrate guiding element 5" and of the second substrate guiding element 6" is directly connected to the flooding element 2" and works independently from the adjacent protrusions.
  • Figure 11 shows a schematic perspective top view of an individual inventive flooding device in accordance with the third embodiment of the present invention shown in Figure 9 .

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Chemically Coating (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP15161394.0A 2015-03-27 2015-03-27 Flooding device for a horizontal galvanic or wet-chemical process line for metal deposition on a substrate Active EP3072994B1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP15161394.0A EP3072994B1 (en) 2015-03-27 2015-03-27 Flooding device for a horizontal galvanic or wet-chemical process line for metal deposition on a substrate
JP2017550763A JP6748106B2 (ja) 2015-03-27 2016-03-18 基板への金属付着のための水平方向のガルバニックまたは湿式化学プロセスラインのためのフラッディング装置
PCT/EP2016/055971 WO2016156067A1 (en) 2015-03-27 2016-03-18 Flooding device for a horizontal galvanic or wet-chemical process line for metal deposition on a substrate
CN201680018314.1A CN107636210B (zh) 2015-03-27 2016-03-18 用于在衬底上进行金属沉积的水平电流或湿式化学工艺线的放流装置
KR1020177030116A KR102056528B1 (ko) 2015-03-27 2016-03-18 기판에서 금속 디포지션을 위한 수평 갈바닉 또는 습식-화학 프로세스 라인용 플러딩 디바이스
TW105109546A TWI685589B (zh) 2015-03-27 2016-03-25 用於基板上金屬沉積之水平電流或濕式化學生產線之放流裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15161394.0A EP3072994B1 (en) 2015-03-27 2015-03-27 Flooding device for a horizontal galvanic or wet-chemical process line for metal deposition on a substrate

Publications (2)

Publication Number Publication Date
EP3072994A1 EP3072994A1 (en) 2016-09-28
EP3072994B1 true EP3072994B1 (en) 2018-08-08

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EP15161394.0A Active EP3072994B1 (en) 2015-03-27 2015-03-27 Flooding device for a horizontal galvanic or wet-chemical process line for metal deposition on a substrate

Country Status (6)

Country Link
EP (1) EP3072994B1 (ko)
JP (1) JP6748106B2 (ko)
KR (1) KR102056528B1 (ko)
CN (1) CN107636210B (ko)
TW (1) TWI685589B (ko)
WO (1) WO2016156067A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3375911A1 (en) * 2017-03-16 2018-09-19 ATOTECH Deutschland GmbH Galvanic plating module of a horizontal galvanic plating line for galvanic metal deposition on a substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57101692A (en) * 1980-12-16 1982-06-24 Nippon Steel Corp Horizontal electroplating method by insoluble electrode
DE4121032A1 (de) * 1991-06-26 1993-01-07 Schmid Gmbh & Co Geb Vorrichtung zum behandeln von plattenfoermigen gegenstaenden, insbesondere leiterplatten
DE19717511C2 (de) * 1997-04-25 2000-09-14 Atotech Deutschland Gmbh Verfahren zur spezifischen naßchemischen Behandlung von flachem Behandlungsgut in Durchlaufanlagen
US5934540A (en) * 1997-07-31 1999-08-10 Teledyne Industries, Inc. Horizontal soldering system with oil blanket
JP5718172B2 (ja) * 2011-06-15 2015-05-13 丸仲工業株式会社 表面処理装置における薄板状被処理物の水平搬送装置、及びこの水平搬送装置のクランプ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
JP6748106B2 (ja) 2020-08-26
KR102056528B1 (ko) 2019-12-16
TW201706462A (zh) 2017-02-16
EP3072994A1 (en) 2016-09-28
WO2016156067A1 (en) 2016-10-06
KR20170131518A (ko) 2017-11-29
JP2018511703A (ja) 2018-04-26
CN107636210A (zh) 2018-01-26
CN107636210B (zh) 2019-11-12
TWI685589B (zh) 2020-02-21

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