EP3072994A1 - Überflutungsvorrichtung für eine horizontale galvanische oder nasschemische prozesslinie zur metallabscheidung auf einem substrat - Google Patents

Überflutungsvorrichtung für eine horizontale galvanische oder nasschemische prozesslinie zur metallabscheidung auf einem substrat Download PDF

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Publication number
EP3072994A1
EP3072994A1 EP15161394.0A EP15161394A EP3072994A1 EP 3072994 A1 EP3072994 A1 EP 3072994A1 EP 15161394 A EP15161394 A EP 15161394A EP 3072994 A1 EP3072994 A1 EP 3072994A1
Authority
EP
European Patent Office
Prior art keywords
flooding
guiding element
substrate
substrate guiding
treated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15161394.0A
Other languages
English (en)
French (fr)
Other versions
EP3072994B1 (de
Inventor
Stefan Grüßner
Wolfgang Richert
Christian Thein
Norbert Walliser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Priority to EP15161394.0A priority Critical patent/EP3072994B1/de
Priority to CN201680018314.1A priority patent/CN107636210B/zh
Priority to KR1020177030116A priority patent/KR102056528B1/ko
Priority to JP2017550763A priority patent/JP6748106B2/ja
Priority to PCT/EP2016/055971 priority patent/WO2016156067A1/en
Priority to TW105109546A priority patent/TWI685589B/zh
Publication of EP3072994A1 publication Critical patent/EP3072994A1/de
Application granted granted Critical
Publication of EP3072994B1 publication Critical patent/EP3072994B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
EP15161394.0A 2015-03-27 2015-03-27 Überflutungsvorrichtung für eine horizontale galvanische oder nasschemische prozesslinie zur metallabscheidung auf einem substrat Active EP3072994B1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP15161394.0A EP3072994B1 (de) 2015-03-27 2015-03-27 Überflutungsvorrichtung für eine horizontale galvanische oder nasschemische prozesslinie zur metallabscheidung auf einem substrat
CN201680018314.1A CN107636210B (zh) 2015-03-27 2016-03-18 用于在衬底上进行金属沉积的水平电流或湿式化学工艺线的放流装置
KR1020177030116A KR102056528B1 (ko) 2015-03-27 2016-03-18 기판에서 금속 디포지션을 위한 수평 갈바닉 또는 습식-화학 프로세스 라인용 플러딩 디바이스
JP2017550763A JP6748106B2 (ja) 2015-03-27 2016-03-18 基板への金属付着のための水平方向のガルバニックまたは湿式化学プロセスラインのためのフラッディング装置
PCT/EP2016/055971 WO2016156067A1 (en) 2015-03-27 2016-03-18 Flooding device for a horizontal galvanic or wet-chemical process line for metal deposition on a substrate
TW105109546A TWI685589B (zh) 2015-03-27 2016-03-25 用於基板上金屬沉積之水平電流或濕式化學生產線之放流裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15161394.0A EP3072994B1 (de) 2015-03-27 2015-03-27 Überflutungsvorrichtung für eine horizontale galvanische oder nasschemische prozesslinie zur metallabscheidung auf einem substrat

Publications (2)

Publication Number Publication Date
EP3072994A1 true EP3072994A1 (de) 2016-09-28
EP3072994B1 EP3072994B1 (de) 2018-08-08

Family

ID=52737006

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15161394.0A Active EP3072994B1 (de) 2015-03-27 2015-03-27 Überflutungsvorrichtung für eine horizontale galvanische oder nasschemische prozesslinie zur metallabscheidung auf einem substrat

Country Status (6)

Country Link
EP (1) EP3072994B1 (de)
JP (1) JP6748106B2 (de)
KR (1) KR102056528B1 (de)
CN (1) CN107636210B (de)
TW (1) TWI685589B (de)
WO (1) WO2016156067A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3375911A1 (de) * 2017-03-16 2018-09-19 ATOTECH Deutschland GmbH Galvanisierungsmodul einer horizontalen galvanisierungsanlage zur galvanischen metallabscheidung auf einem substrat

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0054302A1 (de) * 1980-12-16 1982-06-23 Nippon Steel Corporation Verfahren und Vorrichtung zur kontinuierlichen elektrolytischen Behandlung eines Metallbandes unter Verwendung unlöslicher horizontaler Elektroden
EP0520324A1 (de) * 1991-06-26 1992-12-30 Gebr. Schmid GmbH & Co. Vorrichtung zum Behandeln von plattenförmigen Gegenständen, insbesondere Leiterplatten
DE19717511A1 (de) * 1997-04-25 1998-10-29 Atotech Deutschland Gmbh Verfahren zur spezifischen naßchemischen Behandlung von flachem Behandlungsgut in Durchlaufanlagen
EP0894561A2 (de) * 1997-07-31 1999-02-03 Teledyne Industries, Inc. Waagrechtes Lötungsystem mit Öldecke

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5718172B2 (ja) * 2011-06-15 2015-05-13 丸仲工業株式会社 表面処理装置における薄板状被処理物の水平搬送装置、及びこの水平搬送装置のクランプ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0054302A1 (de) * 1980-12-16 1982-06-23 Nippon Steel Corporation Verfahren und Vorrichtung zur kontinuierlichen elektrolytischen Behandlung eines Metallbandes unter Verwendung unlöslicher horizontaler Elektroden
EP0520324A1 (de) * 1991-06-26 1992-12-30 Gebr. Schmid GmbH & Co. Vorrichtung zum Behandeln von plattenförmigen Gegenständen, insbesondere Leiterplatten
DE19717511A1 (de) * 1997-04-25 1998-10-29 Atotech Deutschland Gmbh Verfahren zur spezifischen naßchemischen Behandlung von flachem Behandlungsgut in Durchlaufanlagen
EP0894561A2 (de) * 1997-07-31 1999-02-03 Teledyne Industries, Inc. Waagrechtes Lötungsystem mit Öldecke

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3375911A1 (de) * 2017-03-16 2018-09-19 ATOTECH Deutschland GmbH Galvanisierungsmodul einer horizontalen galvanisierungsanlage zur galvanischen metallabscheidung auf einem substrat

Also Published As

Publication number Publication date
JP2018511703A (ja) 2018-04-26
CN107636210B (zh) 2019-11-12
KR20170131518A (ko) 2017-11-29
EP3072994B1 (de) 2018-08-08
TWI685589B (zh) 2020-02-21
KR102056528B1 (ko) 2019-12-16
WO2016156067A1 (en) 2016-10-06
CN107636210A (zh) 2018-01-26
TW201706462A (zh) 2017-02-16
JP6748106B2 (ja) 2020-08-26

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