EP2989230A2 - Procede de vernissage de pieces metallisees - Google Patents
Procede de vernissage de pieces metalliseesInfo
- Publication number
- EP2989230A2 EP2989230A2 EP14722291.3A EP14722291A EP2989230A2 EP 2989230 A2 EP2989230 A2 EP 2989230A2 EP 14722291 A EP14722291 A EP 14722291A EP 2989230 A2 EP2989230 A2 EP 2989230A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- nickel
- varnish
- metallic support
- chromium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000002966 varnish Substances 0.000 claims abstract description 37
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 27
- 238000001035 drying Methods 0.000 claims abstract description 13
- 230000005855 radiation Effects 0.000 claims abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 120
- 229910052759 nickel Inorganic materials 0.000 claims description 59
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 26
- 229910052804 chromium Inorganic materials 0.000 claims description 26
- 239000011651 chromium Substances 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 239000004922 lacquer Substances 0.000 claims description 12
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 10
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 10
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 10
- 230000008021 deposition Effects 0.000 claims description 9
- 239000004952 Polyamide Substances 0.000 claims description 8
- 229920002647 polyamide Polymers 0.000 claims description 8
- 239000004743 Polypropylene Substances 0.000 claims description 4
- -1 polypropylene Polymers 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 230000004913 activation Effects 0.000 claims description 3
- 238000003486 chemical etching Methods 0.000 claims description 2
- 229910052755 nonmetal Inorganic materials 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 1
- 238000000151 deposition Methods 0.000 description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- 238000001465 metallisation Methods 0.000 description 8
- 230000002787 reinforcement Effects 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 3
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 238000002715 modification method Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 231100000481 chemical toxicant Toxicity 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/22—Servicing or operating apparatus or multistep processes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/623—Porosity of the layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/625—Discontinuous layers, e.g. microcracked layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Definitions
- the present invention relates to the field of metallization processes of parts, and in particular non-metallic supports. Different ways are known to achieve a metallization of a non-metallic support.
- Electrolytic metallization processes in which a layer of chromium is deposited are also known.
- An advantage of this type of process is the production of metallized parts having a metallic appearance. These parts are used in particular in the automotive field.
- chromium and in particular hexavalent chromium, used in the context of metallization, has the disadvantage of being a toxic product for the environment.
- Hexavalent chromium requires sewage treatment plants to reduce its impact on the environment. It therefore represents a significant cost in the production of metallized parts.
- Trivalent chromium is also a toxic chemical. Trivalent chromium poses the same problems as hexavalent chromium.
- An object of the invention is to provide a method overcoming the aforementioned drawbacks.
- the invention relates to a metallization process of a non-metallic support for obtaining a metallized piece devoid of chromium, in which: A non-metallic support having a surface is provided;
- a layer of hook on said surface is made
- At least one reinforcing layer is made on the hooked layer
- a drying step is carried out of the varnish layer during which the varnish layer is exposed to ultraviolet radiation.
- At least one layer of lacquer is produced above the reinforcing layer.
- At least one layer of nickel is produced on the reinforcing layer and in which said at least one layer of varnish is made on the nickel layer.
- the metal appearance is given by the presence of at least one layer of nickel that is available on the reinforcing layer.
- the lacquer layer is deposited on the reinforcing layer or on the nickel layer to protect the reinforcing layer or the nickel layer and the lower layers from the risk of corrosion and shocks from the environment in which the piece is used.
- the varnish layer may comprise several layers of varnish obtained by successive deposits of varnished layers.
- the varnish layer covers the reinforcing layer or the nickel layer in order to improve the resistance of the piece to impact and corrosion.
- the part obtained by the implementation of the method thus has a metallic appearance while being robust.
- the varnish deposited is dried by a device emitting ultraviolet rays which will allow the crosslinking of the varnish.
- the drying step is therefore a crosslinking step.
- the ultraviolet drying step is preferably carried out over a range of 150 nm to 400 nm.
- the drying step is carried out at a temperature below 60 ° C.
- the ultraviolet drying step has an operating temperature lower than a more conventional thermal drying temperature whose temperature is above 120 ° C.
- the non-metallic support is subjected to a lower temperature range in which the risk of degradation of said non-metallic support is decreased.
- the step of drying the lacquer layer is performed by means of a device that draws hot air on the lacquer layer at temperatures below 120 ° C.
- a device that draws hot air on the lacquer layer at temperatures below 120 ° C.
- the lacquer layer is transparent or colored.
- the transparent varnish layer reveals the natural color of the reinforcing layer or the nickel layer located under the varnish layer.
- the varnish layer may have a colored hue in order to obtain a colored metallized part.
- the piece adapts to the aesthetic environment in which said piece is integrated.
- the lacquer layer is an electrolytic lacquer layer. It is understood that the varnish layer is deposited chemically. The parts are arranged to be immersed in an electrolytic bath through which the layer of varnish is deposited on the reinforcing layer or on the nickel layer.
- the lacquer layer comprises a succession of layers of varnish. It is understood that the varnish layer thus obtained has a transparency or a hue that vary according to the number and thickness of successive varnish layers.
- the non-metallic support consists of acrylonitrile butadiene styrene.
- the non-metallic support is a copolymer of acrylonitrile, butadiene and styrene. It has the advantage of having properties high physical and chemical properties such as stiffness, impact resistance, heat resistance.
- the non-metallic support is made of polyamide or polypropylene.
- non-metallic support is made of polyamide homopolymer.
- polyamides have good mechanical strength.
- the non-metallic support may consist of a copolymer comprising acrylonitrile butadiene styrene associated with a polycarbonate.
- This polymer blend has better low temperature impact strength than acrylonitrile butadiene styrene or polycarbonate alone.
- the non-metallic support comprises a polymer of the polypropylene type.
- the non-metallic support has good fatigue resistance and has the advantage of being recyclable.
- the hook layer is obtained by successively performing a chemical etching of the surface of the non-metallic support, an activation of said chemically etched surface, and a deposition of a first layer of nickel or copper on the activated surface.
- the surface is first etched, for example by means of an acid in the case of a non-metallic support comprising acrylonitrile butadiene styrene, or a base in the case of a support. comprising a polyamide.
- the activation step is performed by depositing a catalyst compatible with the material of said surface. In this way, a deposition layer is deposited on the activated surface in order to improve the adhesion of the reinforcing layer.
- the reinforcing layer comprises at least one layer of copper.
- the nickel layer comprises a microporous or microcracked nickel layer.
- the nickel layer can be subdivided into three successive layers of a semi-gloss nickel, a bright nickel and a microporous nickel.
- the metallized part obtained by the implementation of the method is advantageously free of chromium.
- the invention also relates to a metallized part that can be obtained by implementing the metallization process according to the invention.
- the metallized part according to the invention is devoid of chromium. Moreover, it preferably comprises, successively, a non-metallic support having a surface, a first layer made of copper or nickel disposed on the surface, a layer of copper disposed on the first layer, at least one second layer of nickel disposed on the layer of copper, and a layer of varnish disposed on the second layer of nickel.
- the second nickel layer gives the metallic appearance while the layer of varnish disposed on the second nickel layer makes it possible to protect the metallized part from corrosion and the various attacks of the environment in which the metal part is arranged. .
- the invention finally relates to a method for modifying a metallized part in which a metallized piece is provided comprising a non-metallic support successively having a hook layer, a reinforcing layer, a nickel layer, and a chromium layer.
- the chromium layer is removed, then a layer of varnish is deposited on the nickel layer.
- the removal of the chromium layer is carried out by immersing the metallized part in an electrolytic bath for a predetermined time.
- the nickel layer comprises a microporous or microcracked nickel layer.
- the hook layer is a nickel layer.
- the reinforcing layer is a copper layer.
- One of the advantages of this modification process is to decompose existing parts inventories in order to improve their environmental impact while preserving their metallic appearance.
- FIG. 1 schematically illustrates a metallized part according to the invention which is devoid of chromium and which comprises a non-metallic support and different successive layers arranged on the non-metallic support;
- FIG. 2 illustrates the various steps of the metallization process according to the invention making it possible to produce a metallized piece devoid of chromium
- FIG. 3 schematically illustrates the modification method according to the invention in which an existing metallized part is decreed.
- FIG. 1 diagrammatically shows a chromium-free metallized piece 10 according to the invention.
- This part comprises a non-metallic support S on which the layers C1 to C4 will be deposited.
- the non-metallic support S has a surface 11.
- the non-metallic support S is a plastic part.
- the support consists of ABS (Acrylonitrile Butadiene Styrene) which has good mechanical resistance and corrosion.
- ABS Acrylonitrile Butadiene Styrene
- a copolymer comprising acrylonitrile butadiene styrene and a polycarbonate is used.
- the metal support may be composed of polyamide.
- a first step S100 is the step during which the plastic support S receives a chemical treatment on its surface 11 so as to obtain a roughness of said surface 11.
- the etching of the surface 11 of a part, comprising an acrylonitrile butadiene styrene polymer is carried out by immersing the pieces in a bath comprising sulfuric acid which oxidizes the butadiene present on the surface of the support S.
- the bath is thermostated at a temperature of 65 ° C which oscillates by plus or minus 5 ° C.
- the surface has a roughness.
- a step S102 for activating the etched surface 11 of said support S is carried out so as to deposit a catalyst based on tin and palladium.
- the part comprises a polyamide-type polymer
- the part is immersed in a bath comprising a solvent-based base and thermostatically controlled at a temperature of 40 ° C. plus or minus 5 ° C.
- a roughness of the surface 11 is obtained.
- the step S102 of activating the surface of said support S is carried out by depositing a palladium catalyst on the surface 11 of the support S which has been previously activated.
- a deposition step S104 of a hooking layer is then performed. It can be seen in FIG. 1 that a first layer C1 is deposited on the surface 11 of the non-metallic support S.
- the first layer C1 is a hook layer which comprises a nickel layer or a copper layer.
- the cling layer C1 is made by immersing the non-metallic support S, whose surface is activated, in a nickel bath.
- the hook layer C1 preferably has a thickness of between 0.15 micrometer and 0.25 micrometer.
- Said nickel is catalyzed by palladium and tin in the example where the non-metallic support comprises acrylonitrile.
- the nickel is catalyzed by palladium.
- a deposition step S106 of a reinforcement layer C2 is made to reinforce the hooked layer C1 so as to obtain a homogeneous metal layer.
- said reinforcing layer C2 is composed of copper.
- This deposition step S106 of the reinforcing layer makes it possible to deposit said layer C2 by immersing the non-metallic support S in a copper bath.
- the reinforcement layer C2 is disposed on the hook layer C1.
- the reinforcing layer C2 has a thickness of between 0.45 micrometer and 0.55 micrometer.
- said reinforcing layer C2 is composed of nickel. In the same way, the reinforcement layer C2 is deposited on the hook layer C1.
- a step S108 deposition of a layer of nickel C3 deposited on the reinforcement layer C2 is then carried out.
- the nickel layer C3 has a thickness of between 10 micrometers and 20 microns.
- the C3 nickel layer is subdivided into three layers of nickel:
- a deposition step SI10 of a layer of varnish C4 is then performed on the nickel layer C3.
- the layer of varnish C4 is preferably deposited by immersing the metallized part in a bath containing said varnish.
- a drying step S112 comprising a step of crosslinking the varnish layer C4 is performed by means of an ultraviolet radiation device which comprises a series of ultra violet lamps ⁇ that will expose the metallized part comprising the layer C4 varnish, ultraviolet radiation for a predetermined time so that the varnish layer is completely dry.
- an ultraviolet radiation device which comprises a series of ultra violet lamps ⁇ that will expose the metallized part comprising the layer C4 varnish, ultraviolet radiation for a predetermined time so that the varnish layer is completely dry.
- a metallized piece without chromium comprising the non-metallic support S made of polyamide or acrylonitrile butadiene styrene, the hook layer C1 comprising nickel, the reinforcement layer C2 comprising copper, the nickel layer C3 comprising three shapes. of nickel, and the layer of varnish C4.
- a chromed piece 100 comprising a non-metallic support S, a cling layer C1 deposited on the surface of the non-metallic support S, a reinforcement layer C2 deposited on the cling layer C1, the nickel layer C3 deposited on the reinforcing layer C2 and a chromium layer C4 '.
- the chromed piece comprising the chromium layer C4 ' is immersed in a bath in which the chromium layer will be removed, so as to obtain a part 102 comprising the non-metallic support S, the hook layer Cl, the reinforcing layer C2 and the nickel layer C3.
- This step therefore has the effect of removing the chromium layer.
- a layer of varnish C4 is deposited on the nickel layer C3 which becomes the upper layer of the part from which the chromium layer C4 'has been removed.
- the layer of varnish C4 deposited on the nickel layer undergoes the drying step S112 in order to fix the layer of varnish C4 on said nickel layer C3.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Chemically Coating (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1353686A FR3004735B1 (fr) | 2013-04-23 | 2013-04-23 | Procede de vernissage de pieces metallisees |
PCT/FR2014/050948 WO2014174189A2 (fr) | 2013-04-23 | 2014-04-18 | Procede de vernissage de pieces metallisees |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2989230A2 true EP2989230A2 (fr) | 2016-03-02 |
EP2989230B1 EP2989230B1 (fr) | 2022-02-23 |
Family
ID=48906312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14722291.3A Active EP2989230B1 (fr) | 2013-04-23 | 2014-04-18 | Procédé de vernissage de pièces métallisées |
Country Status (5)
Country | Link |
---|---|
US (1) | US20160122893A1 (fr) |
EP (1) | EP2989230B1 (fr) |
CN (1) | CN105324514B (fr) |
FR (2) | FR3004735B1 (fr) |
WO (1) | WO2014174189A2 (fr) |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0416338A (ja) * | 1990-05-09 | 1992-01-21 | C Uyemura & Co Ltd | 電磁波シールド層の形成方法 |
US5510173A (en) * | 1993-08-20 | 1996-04-23 | Southwall Technologies Inc. | Multiple layer thin films with improved corrosion resistance |
JPH08512171A (ja) * | 1994-04-28 | 1996-12-17 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | 電気的絶縁材料の板上に銅パターンをフォトリソグラフ的に作製する方法 |
DE59605676D1 (de) * | 1996-04-17 | 2000-09-07 | Atotech Deutschland Gmbh | Verfahren zur Herstellung von induktiv arbeitenden Zählsystemen |
DE19735123A1 (de) * | 1997-08-13 | 1999-02-18 | Alfred R Franz Fa | Verfahren zur galvanischen Wiederaufbereitung von schwarzverchromten Spritzgußteilen aus Magnesiumlegierungen und zur anschließenden Veredelung der wiederaufbereiteten Spritzgußteile in der Galvanik |
US6872294B2 (en) * | 2002-04-30 | 2005-03-29 | General Motors Corporation | Metallization of polymer composite parts for painting |
EP1761660A1 (fr) * | 2004-06-30 | 2007-03-14 | Siemens Aktiengesellschaft | Procede pour enlever un revetement applique sur une piece |
US7384532B2 (en) * | 2004-11-16 | 2008-06-10 | Lacks Enterprises, Inc. | Platable coating and plating process |
ATE394526T1 (de) * | 2005-10-20 | 2008-05-15 | Wolf-Dieter Franz | Herstellung seidenmatter metalloberflächen |
CN101613862B (zh) * | 2008-06-27 | 2011-07-27 | 深圳富泰宏精密工业有限公司 | 塑料表面处理方法 |
CN101845663B (zh) * | 2009-03-27 | 2012-03-07 | 比亚迪股份有限公司 | 一种电解退镀液及退镀方法 |
ES2338627B1 (es) * | 2009-08-28 | 2011-06-08 | Zanini Auto Grup S.A. | Tratamiento de piezas con zonas de acabado metalizado de aspecto diferenciado. |
CN102602110B (zh) * | 2012-03-21 | 2015-03-11 | 苏州东亚欣业节能照明有限公司 | 覆铜板的制备方法 |
-
2013
- 2013-04-23 FR FR1353686A patent/FR3004735B1/fr active Active
-
2014
- 2014-04-18 WO PCT/FR2014/050948 patent/WO2014174189A2/fr active Application Filing
- 2014-04-18 CN CN201480035769.5A patent/CN105324514B/zh active Active
- 2014-04-18 US US14/786,806 patent/US20160122893A1/en not_active Abandoned
- 2014-04-18 EP EP14722291.3A patent/EP2989230B1/fr active Active
-
2015
- 2015-03-19 FR FR1552273A patent/FR3018827B1/fr active Active
Non-Patent Citations (1)
Title |
---|
See references of WO2014174189A2 * |
Also Published As
Publication number | Publication date |
---|---|
FR3004735A1 (fr) | 2014-10-24 |
CN105324514A (zh) | 2016-02-10 |
US20160122893A1 (en) | 2016-05-05 |
EP2989230B1 (fr) | 2022-02-23 |
CN105324514B (zh) | 2018-03-27 |
FR3004735B1 (fr) | 2015-07-03 |
WO2014174189A2 (fr) | 2014-10-30 |
WO2014174189A3 (fr) | 2014-12-31 |
FR3018827B1 (fr) | 2016-12-09 |
FR3018827A1 (fr) | 2015-09-25 |
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