EP2954539A1 - Verfahren zur herstellung eines leadframes mit einen federelement als schaltersicherungsanordnung - Google Patents
Verfahren zur herstellung eines leadframes mit einen federelement als schaltersicherungsanordnungInfo
- Publication number
- EP2954539A1 EP2954539A1 EP14703569.5A EP14703569A EP2954539A1 EP 2954539 A1 EP2954539 A1 EP 2954539A1 EP 14703569 A EP14703569 A EP 14703569A EP 2954539 A1 EP2954539 A1 EP 2954539A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- parts
- sheet
- leadframe
- sheet metal
- spring element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 18
- 238000004080 punching Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 238000012545 processing Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003546 flue gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/12—Overvoltage protection resistors
- H01C7/126—Means for protecting against excessive pressure or for disconnecting in case of failure
Definitions
- the invention relates to a method for producing a leadframe.
- a reduced component insulation strength of a damaged electrical component leads to an increased power conversion, which in turn can cause an inadmissible heating. Such warming can create significant risks to the immediate environment,
- the triggering of the respective property takes place thermally, e.g. by a softening solder.
- Thermosensitive connection is generally via a solder joint.
- the contact element is preloaded or the force applied to the contact element is a second biased element, e.g. a spring.
- the spring force exceeds the holding force of the thermosensitive
- Contact point e.g. Solder
- Solder opens the contact and the monitored component is turned off.
- the invention is based on the object, a
- the object is achieved according to the invention by a method for producing a leadframe for a
- the method comprises a step of forming a
- Plates are arranged one above the other, and a step of connecting the superposed parts by means of a thermally softenable means, wherein a
- Variants are manufactured, which ensure safe irreversible switching in each case with small space requirements.
- the method further comprises the step of inserting an electrical component.
- the method further comprises the step of separating parts of the pre-cut sheet metal.
- the pre-punching of the sheet is also
- thermally softenable agent soldering or gluing on.
- the method further comprises the step of folding a further part of the sheet, so that this further part is arranged over the connected superposed parts of the sheet and spaced therefrom.
- Design variant can be produced without the need for a completely new design.
- Fig. 1 is a raw form of a leadframe in plan view according to a first preferred embodiment of
- FIG. 5 is a raw form of a leadframe in plan view according to a second preferred embodiment of the
- FIG. 6 shows a leadframe according to a second preferred embodiment
- thermal switching elements for the protection of electrical components.
- FIG. 1 shows a plan view of a leadframe 1 in a plan view according to a first preferred embodiment of FIG
- Sheet metal strip KB may already be missing from the raw form or may be additionally separated in one of the steps of the process.
- the raw form of the leadframe 1 has a substantially planar structure and has pre-punched areas, which are subsequently processed by forming.
- a spring element FE can be formed.
- the sheet metal strip FE is formed from Figure 1 by forming into a bracket, as shown in Figure 2b in a side view.
- the holding element HE marked with a hatching from bottom left to top right.
- the broadening of the sheet metal part arranged on the right in FIG. 1 forms a nose.
- the sheet metal part FE is brought by bending in a U-shape.
- a holding element HE is formed. This is reshaped so that a receptacle is formed, so that the spring element FE can be held here later.
- the sheet metal strip in FIG. 1 the sheet metal strip in FIG. 1
- Spring element FE are activated by introducing the nose formed on the spring element FE in the holding element HE. This can be the one during the rest
- Processing step also one or more terminal contacts KK are formed from parts of the pre-punched sheet B.
- the part of the sheet which forms a clamping contact KK is marked with hatching from bottom right to top left.
- At least one further part HSi of the prepunched sheet B is folded so that parts HE, KK of the prepunched sheet B are arranged one above the other. Other parts of the sheet are as needed
- a thermally softenable means L e.g. a suitable adhesive or a suitable solder
- thermally softenable agent L is exemplified as a black filled ellipse.
- This now prefabricated leadframe 1 can now in a further processing step with a suitable
- Components are thermally sensitive components
- the equipment can e.g. have a pressing in molded as cutting contacts contact elements KK.
- Other joining techniques in particular
- FIGS. 4a and 4b Supervision shown in Figure 4a, at least part of the pre-punched sheet B separated.
- the holding strip HSi is removed from FIGS. 1 to 3b in FIGS. 4a and 4b, since it is no longer needed due to the connection made by the holding element HE and the contact strip KK.
- the retaining strip HS 2 of Figure 1 to 3b in Figures 3a and 3b removed because now the contact elements KK on the assembled electrical
- Component EB are connected.
- only one raw mold is provided for different embodiments of the leadframe according to FIG. 1 and FIG. 5, so that the raw form of the leadframe is made
- Figure 5 can be created by separating the sheet metal part KB. This allows a cost-effective large-scale production of a single raw form, which can then be easily converted into another embodiment. The exact arrangement of the individual steps is to the respective
- Customizable process conditions so that no additional processing step is necessary, but can be inserted into an existing step, whereby the processing time is not adversely affected.
- a fully integrated process approach can be followed, which also provides for the corresponding preparation of the raw forms of the sheet B according to the exemplary Figures 1 and 5 by punching from a sheet.
- FIGS. 1 to 4b differs from the embodiment of FIGS. 5 and 6 in that a further sheet-metal strip KB is provided. While in Figures 5 and 6, an arrangement is shown, which acts in a thermal softening of the connection L as an opener and thus a flow of current through the
- Embodiment of Figures 1 to 4b provided that a short circuit is generated.
- a further part KB of the sheet B is folded, so that this further part KB is spaced above the connected parts of the sheet B, in particular HE and KK
- the spring element FE now acts as a closer with respect to the strip KB disposed thereover, so that a current flow is conducted past the electrical component EB.
- softenable means L can act fast switching times and a secure connection to the electrical component EB be guaranteed. Since the thermal activatable switching element is part of the leadframe, the necessary space is minimized.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Fuses (AREA)
- Manufacture Of Switches (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013201899.1A DE102013201899A1 (de) | 2013-02-06 | 2013-02-06 | Verfahren zur Herstellung eines Leadframes |
PCT/EP2014/052104 WO2014122110A1 (de) | 2013-02-06 | 2014-02-04 | Verfahren zur herstellung eines leadframes mit einen federelement als schaltersicherungsanordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2954539A1 true EP2954539A1 (de) | 2015-12-16 |
EP2954539B1 EP2954539B1 (de) | 2018-08-01 |
Family
ID=50071602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14703569.5A Active EP2954539B1 (de) | 2013-02-06 | 2014-02-04 | Verfahren zur herstellung eines leadframes mit einen federelement als schaltersicherungsanordnung |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2954539B1 (de) |
CN (1) | CN104995695B (de) |
DE (1) | DE102013201899A1 (de) |
WO (1) | WO2014122110A1 (de) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4219304C2 (de) * | 1992-06-12 | 1994-03-31 | Roederstein Kondensatoren | Zuverlässiges Überstrom-Schutzbauteil mit geringem Platzbedarf und einfachem Aufbau |
US5277356A (en) * | 1992-06-17 | 1994-01-11 | Rohm Co., Ltd. | Wire bonding method |
US6104591A (en) * | 1998-03-09 | 2000-08-15 | Teccor Electronics, Inc. | Telephone line protection element |
EP1150307B1 (de) * | 2000-04-26 | 2008-10-22 | Littelfuse Ireland Development Company Limited | Thermisch geschützter Varistor auf Basis eines Metalloxids |
US8717777B2 (en) * | 2005-11-17 | 2014-05-06 | Avx Corporation | Electrolytic capacitor with a thin film fuse |
DE102006001876A1 (de) * | 2006-01-13 | 2007-11-08 | Siemens Ag | Bauteil mit einer elektrischen Flachbaugruppe |
DE102009048045B4 (de) * | 2009-10-02 | 2011-06-01 | Phoenix Contact Gmbh & Co. Kg | Überspannungsschutzelement |
CN101741081A (zh) * | 2010-01-12 | 2010-06-16 | 佛山市浦斯电子有限公司 | 具有热保护功能的电涌抑制器 |
EP2511915B1 (de) * | 2011-04-13 | 2016-07-06 | Epcos Ag | Elektrisches Gerät |
-
2013
- 2013-02-06 DE DE102013201899.1A patent/DE102013201899A1/de not_active Ceased
-
2014
- 2014-02-04 EP EP14703569.5A patent/EP2954539B1/de active Active
- 2014-02-04 WO PCT/EP2014/052104 patent/WO2014122110A1/de active Application Filing
- 2014-02-04 CN CN201480004470.3A patent/CN104995695B/zh active Active
Non-Patent Citations (1)
Title |
---|
See references of WO2014122110A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE102013201899A1 (de) | 2014-08-07 |
CN104995695B (zh) | 2018-06-05 |
WO2014122110A1 (de) | 2014-08-14 |
EP2954539B1 (de) | 2018-08-01 |
CN104995695A (zh) | 2015-10-21 |
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