EP2947182A1 - Procédé et système de production de feuille de cuivre électrolytique à l'aide d'un écoulement inversé d'une solution de sulfate de cuivre - Google Patents

Procédé et système de production de feuille de cuivre électrolytique à l'aide d'un écoulement inversé d'une solution de sulfate de cuivre Download PDF

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Publication number
EP2947182A1
EP2947182A1 EP13872242.6A EP13872242A EP2947182A1 EP 2947182 A1 EP2947182 A1 EP 2947182A1 EP 13872242 A EP13872242 A EP 13872242A EP 2947182 A1 EP2947182 A1 EP 2947182A1
Authority
EP
European Patent Office
Prior art keywords
sulfate solution
copper sulfate
anode cell
copper
cathode drum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13872242.6A
Other languages
German (de)
English (en)
Other versions
EP2947182A4 (fr
Inventor
Chin Tsai CHENG
Chor Kwan YEUNG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujian Clear View Copper Foils Co Ltd
Original Assignee
Fujian Clear View Copper Foils Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujian Clear View Copper Foils Co Ltd filed Critical Fujian Clear View Copper Foils Co Ltd
Publication of EP2947182A1 publication Critical patent/EP2947182A1/fr
Publication of EP2947182A4 publication Critical patent/EP2947182A4/fr
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Definitions

  • the present invention belongs to the technical field of production of electrolytic copper foils, and more particularly relates to a method and system for producing an electrolytic copper foil by the reverse flow of a copper sulfate solution.
  • a bottom-feed flow of the copper sulfate solution in traditional anode cells is changed into a top-feed flow and the quality of the copper foil is controlled by changing the direction and flow rates of the copper sulfate solution, thus bringing unexpected good effect for the production of copper foils and completely breaking away from the history that the quality of the copper foil can be controlled by additives only.
  • lead anodes that are not environmental-friendly and easy to be corroded have been excluded in the production of electrolytic copper foils, and have been replaced with titanium iridium anodes which have conductive surface coatings.
  • titanium iridium anodes which have conductive surface coatings.
  • the production processes thereof are not changed substantially.
  • the copper sulfate solution in an anode cell is always fed from the bottom of the anode cell, overflowed out of the upper ports of the anode cell and returned to copper dissolving tanks.
  • Copper foil production in the conventional production equipment and processes is as follows: a cathode drum with a surface roughness Ra less than 0.4 ⁇ m is soaked below its axis in an anode cell to which a copper sulfate solution is fed with a copper content of 70-110 g/L, an acid content of 80-130 g/L and the temperature of 40-65°C. Electric current is fed between the cathode drum and the anodes. The part of the cathode drum soaked in the copper sulfate solution is plated with the copper crystals according to the electrochemical principle.
  • the thickness of the copper foil plated on the surface of the cathode drum depends on the electrodepositing time and current density of the cathode drum in the copper sulfate solution.
  • the thickness of the copper foil plated on the surface of the cathode drum can be changed by changing the rotating speeds of the cathode drum.
  • the copper foils of different thicknesses can be obtained by continuously peeling off the copper foil plated on the surface of the cathode drum as the cathode drum rotates.
  • the side of the copper foil against on the surface of the cathode drum is called the shiny side, and the other surface is called the matte side.
  • the flow rate is generally below 0.5 meters per second.
  • the resulting copper foil textures are columnar structure. Although the textures and the physical properties of the copper foi can be changed with brightening additives at ambient, they are very unstable at high temperatures. Their tensile strengths attenuate considerably. Brightners generate many lattice defects, pinholes and curls. Such copper foils are not suitable for manufacturing high-grade circuit boards and lithium ion batteries.
  • bottom feed solutions There are two types of bottom feed solutions, i.e. closed type and open type.
  • the former is a 100% new solution
  • the latter consists of a new solution and an old solution simultaneously.
  • the solution flow of anode between the left and the right side of the anode gap cannot be accurately controlled. It can only be assumed that half of the feed solutions flow on each side. The controllability of each flow on either side is very low.
  • the objective of the present invention is to provide, on the basis of the abovementioned problems, a technical solution, which involves a method and system for producing an electrolytic copper foil by the reverse flow of a copper sulfate solution.
  • a bottom-feed solution flow of the copper sulfate solution in traditional anode cells is changed into a top-feed solution flow with increasing flow rates. It brings unexpected good effects for the production of copper foils and completely breaking away from the history that the quality of the copper foil can be controlled by additives only.
  • a further optimized solution is that: the copper sulfate solution is fed into the anode cell from the upper port of the anode cell at the foil exit side of the cathode drum.
  • a further optimized solution is that: the copper sulfate solution is fed into the anode cell from bot of the upper ports of the anode cell on two side surfaces of the cathode drum and flows out from the bottom of the anode cell, the copper sulfate solution that flows out entrains bubbles generated by electroplating from the bottom of the anode cell.
  • a further optimized solution is that: the method further comprises: when the surface roughness of the copper foil is more than a set value, increasing the flow rate of the copper sulfate solution on the inflow side surface of the cathode drum; and when the surface roughness of the copper foil is less than the set value, decreasing the flow rate of the copper sulfate solution on the inflow side surface of the cathode drum.
  • a further optimized solution is that: under the process conditions of production of the electrolytic copper foil, the flow rate of the copper sulfate solution formed on the surface of the cathode drum is at least 0.5 m/s; the process conditions of production of the electrolytic copper foil comprise that: the copper content of the copper sulfate solution is 70-110 g/L, the acid content is 80-130 g/L, the temperature is 40-65°C, and the anodic current density is 50-85 amperes per square decimeter.
  • a further optimized solution is that: the copper sulfate solution is a mixture of a primary copper sulfate solution and a secondary copper sulfate solution, the primary copper sulfate solution is a source copper sulfate solution directly provided by a copper dissolving tank, and the secondary copper sulfate solution is an electroplated copper sulfate solution that flows out via the anode cell.
  • a further optimized solution is that: the ratio of the primary copper sulfate solution to the secondary copper sulfate solution in the mixture is not less than 1:2.
  • a system for implementing the method for producing an electrolytic copper foil by the reverse flow of a copper sulfate solution comprises a cathode drum, semicircular arc-shaped anodes and copper dissolving tanks.
  • the cathode drum is rotatably arranged in the arc-shaped anodes, an anode cell is formed by a gap arranged between the cathode drum and the arc-shaped anodes, an upper feed box for delivering the copper sulfate solution to the anode cell is arranged above the anodes, upper ports at two sides of the anode cell are located at two sides of the cathode drum respectively, with one side being a foil exit side, the anode cell is provided with a copper sulfate solution inflow port and a copper sulfate solution outflow port, and the copper dissolving tank is connected with a solution inlet of the upper feed box through a delivery pipeline; and wherein the system is also provided with a copper sulfate solution collection tank
  • a further optimized solution is that: a total flow regulating valve is installed in a pipeline connecting the upper feed box and the anode feed box copper sulfate solution inflow port, an anode cell copper sulfate solution flow rate regulating valve is installed in a pipeline connecting the anode cell copper sulfate solution outflow port and the collection tank, and a flow rate regulating valve is installed in a pipeline connecting the copper sulfate solution circulation pump and the upper feed box.
  • a further optimized solution is that: the upper port of the anode cell at one side surface of the cathode drum is an upper port of the anode cell at the foil exit side of the cathode drum.
  • a further optimized solution is that: the solution outlet of the upper feed box is connected with the upper ports of the anode cell at two sides of the cathode drum through the copper sulfate solution delivery pipeline, and the anode cell copper sulfate solution outflow port is arranged at the bottom of the anode cell.
  • a further optimized solution is that: the length of the anode cell copper sulfate solution outflow port at the bottom of the anode cell is the length of the cathode drum, and the width of the outflow port is at least two times of the gap between the cathode drum and the arc-shaped anode.
  • a further optimized solution is that: copper sulfate solution fed diversion port with a width equal to that of the upper port of the anode cell is connected with the upper port of the anode cell, and the diversion port is provided with gate plates capable of adjusting the flow direction of the copper sulfate solution.
  • a method for producing an electrolytic copper foil by the reverse flow of a copper sulfate solution including an anode cell 3 formed by a gap arranged between a cathode drum 1 and curved semicircular arc-shaped anodes 2, the gap between the anode and the cathode drum is usually kept between 8mm to 15mm, the upper ports at two sides of the anode cell are located at two sides of the cathode drum (i.e., two side surfaces of the cathode drum which are vertically separated along a central axis), with one side being a foil exit side.
  • a flowing copper sulfate solution 4 is in the anode cell, the cathode drum rotates in the anode cell, and the outer surface of the cathode drum below its axis is soaked in the anode cell to which the copper sulfate solution having a copper content of 70-110 g/L and an acid content of 80-130 g/L and the temperature of 40-65°C is added.
  • An electric current is fed between the cathode drum and the anode.
  • a copper foil 5 electroplated on the cathode drum is continuously peeled off and wound up by a wind-up roll 7 via a stripper roller 6 by means of electrochemical reaction.
  • the copper sulfate solution is at least fed into the anode cell from the upper port of the anode cell on one side surface of the cathode drum, such that the copper sulfate solution forms a downward flow impulsive force (that is, a certain flow impulse force, which is opposite to a direction in which the copper sulfate solution produces bubbles and which takes away the bubbles downwards, is formed) on the inflow side surface of the cathode drum.
  • a downward flow impulsive force that is, a certain flow impulse force, which is opposite to a direction in which the copper sulfate solution produces bubbles and which takes away the bubbles downwards, is formed
  • the preferred solution 1 of this embodiment is that: the upper port of the anode cell on one side surface is the upper port of the anode cell at the foil exit side of the cathode drum. That is: the copper sulfate solution is fed into the anode cell from the upper port 3-1 of the anode cell at the foil exit side of the cathode drum.
  • the preferred solution 2 of this embodiment is that: since the copper sulfate solution at least flows into the anode cell from the upper port of the anode cell on one side of the cathode drum, the copper sulfate solution can flow out of the anode cell either from the bottom of the anode cell or from the upper port of the anode cell on the other side of the cathode drum.
  • this preferred solution differs from the abovementioned solution is that the copper sulfate solution is fed into the anode cell from the upper ports of the anode cell on two side surfaces of the cathode drum and flows out from the bottom of the anode cell, and the copper sulfate solution that flows out entrains the bubbles generated by electroplating from the bottom of the anode cell.
  • the bubbles are rapidly taken away by the copper sulfate solution that rapidly flows downwardly, thereby reducing and even eliminating the impact of these bubbles on the electrodeposited copper foil.
  • a further method comprises: when the surface roughness of of the copper foil is more than a set value, increasing the speed of the copper sulfate solution flowing out from the bottom of the anode cell, that is, increasing the flow rate of the copper sulfate solution on the surface of the cathode drum; and when the surface roughness of the copper foil is less than the set value, decreasing the speed of the copper sulfate solution flowing out from the bottom of the anode cell, that is, decreasing the flow rate of the copper sulfate solution on the surface of the cathode drum.
  • the set value of the surface roughness of the copper foil i.e. the Rz roughness on a matte side, is typically controlled to be less than 2.5 ⁇ m according to different requirements of different products.
  • the flow rate of the copper sulfate solution formed on the surface of the cathode drum is at least 0.5 m/s and typically within a range from 0.5 to 0.9 m/s;
  • the process conditions of production of the electrolytic copper foil comprise that: the copper content of the copper sulfate solution is 70-110 g/L, the acid content is 80-130 g/L, the temperature is 40-65°C, and the anodic current density is 50-85 amperes per square decimeter.
  • the flow rate of the copper sulfate solution is controlled at 0.7 m/s, so that the bubbles generated are taken
  • the copper sulfate solution in the anode cell is fed from the bottom and overflowed from the top, which keeps the flow rate of the copper sulfate solution formed on the surface of the cathode drum below 0.5 m/s all the time; if the flow rate is more than 0.5 m/s, a large amount of sulfuric acid mists will be taken out from the upper ports of the anode cell and the copper sulfate solution will flow out of the anode cell to produce a series of problems, thus upward adjustment is infeasible; and in this embodiment, the flow rate of the copper sulfate solution formed on the surface of the cathode drum can be at least 0.5 m/s by changing the flow direction of the copper sulfate solution in the anode cell, and the surface roughness of the copper foil is controlled by controlling the flow rate of the copper sulfate solution on the surface of the cathode drum.
  • the speed of the copper sulfate solution flowing out of the anode cell is increased, that is, the flow rate of the copper sulfate solution is increased; and when the surface roughness of the copper foil is less than the set value, the speed of the copper sulfate solution flowing out from the bottom of the anode cell is decreased, that is, the flow rate of the copper sulfate solution is decreased; the set value of the surface roughness of the copper foil, i.e. the Rz roughness on a matte side is typically controlled to be less than 2.5 ⁇ m according to different requirements of different products.
  • the demand on the source copper sulfate solution is raised in order to increase the flow rate of the copper sulfate solution formed on the surface of the cathode drum, which certainly will increase the demand on copper dissolving tanks to result in an increase in equipment investment.
  • the copper sulfate solution is a mixture of a primary copper sulfate solution and a secondary copper sulfate solution
  • the primary copper sulfate solution is a source copper sulfate solution directly provided by the copper dissolving tanks
  • the secondary copper sulfate solution is an electroplated copper sulfate solution that flows out via the anode cell.
  • the ratio of the primary copper sulfate solution to the secondary copper sulfate solution in the mixture in this embodiment is not less than 1:2, and the ratio of 7:3 is an optimum ratio, i.e., in 100% copper sulfate solution, the primary copper sulfate solution accounts for 70% and the secondary copper sulfate solution accounts for 30%.
  • a system for the method for producing an electrolytic copper foil by the reverse flow of a copper sulfate solution comprises a cathode drum 1, a semicircular arc-shaped anode 2 and a copper dissolving tank 12, wherein the cathode drum is rotatably arranged in the arc-shaped anodes, an anode cell 3 is formed by a gap arranged between the cathode drum and the arc-shaped anodes, the gap between the anode and the cathode drum is generally maintained between 8 mm to 15 mm; arranged on the anode cell is an upper feed box 13 for delivering the copper sulfate solution to the anode cell, and upper ports at two sides of the anode cell are respectively located at two radial sides of the cathode drum (i.e., the upper ports of the anode cell at the two side surfaces of the cathode drum vertically separated
  • the copper dissolving tank is a traditional system tank for current copper foil factories, which comprises a copper dissolving pot, a heat exchanger, a filter and a solution reservoir, wherein the copper dissolving tank is connected with the solution inlet of the upper feed box through the delivery pipeline, and specifically, the solution reservoir of the copper dissolving tank is connected with the solution inlet of the upper feed box through pumps and the pipelines.
  • one side surface of the cathode drum in this embodiment refers to the foil exit side of the cathode drum, i.e. the upper port of the anode cell at one side surface of the cathode drum is the upper port of the anode cell at the foil exit side of the cathode drum.
  • the anode cell copper sulfate solution outflow port may be at the bottom of the anode cell, or at the upper port of the anode cell on the other side of the cathode drum.
  • the solution outlet of the upper feed box is connected with the upper ports of the anode cell on two sides of the cathode drum through the copper sulfate solution delivery pipeline, and the anode cell copper sulfate solution outflow port is arranged on the bottom end of the anode cell (i.e.
  • a groove with full-length is axially arranged at the bottom of the arc-shaped anodes), in order to overcome the situation in which during the process of electrodepositing the copper ions in the copper sulfate solution onto the cathode drum, a large amount of bubbles generated due to oxygen evolution are discharged from the upper ports of the anode cell.
  • the length of the anode cell copper sulfate solution outflow port at the bottom of the anode cell is the length of the cathode drum, and the width 19 of the outflow port is at least twice the gap between the cathode drum and the arc-shaped anode.
  • a total flow regulating valve 15 is installed in a pipeline 14 connecting the upper feed box with the anode cell copper sulfate solution inflow port
  • an anode cell copper sulfate solution flow rate regulating valve 11 is installed in a pipeline 10 connecting the anode cell copper sulfate solution outflow port with the collection tank
  • a copper sulfate solution reflux flow regulating valve 17 is installed in a pipeline 16 connecting the copper sulfate solution circulation pump with the upper feed box.
  • This embodiment is an improvement based on embodiment 3.
  • the upper ports of the anode cell are connected with a copper sulfate solution feed diversion port 20 having the same width as that of the upper port of the anode cell, and gate plates 21 capable of adjusting the flow direction of the copper sulfate solution are installed in the diversion port.
  • the thickness uniformity of the cross section of the copper foil can be adjusted by controlling the openings of the gate plates.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
EP13872242.6A 2013-01-21 2013-12-19 Procédé et système de production de feuille de cuivre électrolytique à l'aide d'un écoulement inversé d'une solution de sulfate de cuivre Withdrawn EP2947182A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310021021.7A CN103060882B (zh) 2013-01-21 2013-01-21 一种硫酸铜溶液逆向流动生产电解铜箔的方法及系统
PCT/CN2013/089959 WO2014110958A1 (fr) 2013-01-21 2013-12-19 Procédé et système de production de feuille de cuivre électrolytique à l'aide d'un écoulement inversé d'une solution de sulfate de cuivre

Publications (2)

Publication Number Publication Date
EP2947182A1 true EP2947182A1 (fr) 2015-11-25
EP2947182A4 EP2947182A4 (fr) 2016-09-28

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EP13872242.6A Withdrawn EP2947182A4 (fr) 2013-01-21 2013-12-19 Procédé et système de production de feuille de cuivre électrolytique à l'aide d'un écoulement inversé d'une solution de sulfate de cuivre

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EP (1) EP2947182A4 (fr)
JP (1) JP6165880B2 (fr)
KR (1) KR20150110728A (fr)
CN (1) CN103060882B (fr)
WO (1) WO2014110958A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
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CN110546313A (zh) * 2017-04-25 2019-12-06 古河电气工业株式会社 表面处理铜箔

Families Citing this family (13)

* Cited by examiner, † Cited by third party
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CN103060882B (zh) * 2013-01-21 2015-11-04 福建清景铜箔有限公司 一种硫酸铜溶液逆向流动生产电解铜箔的方法及系统
CN103233249A (zh) * 2013-05-09 2013-08-07 南京顺捷机械设备有限公司 一种上进液式铜箔一体机设备
CN103510106B (zh) * 2013-09-22 2015-10-21 中南大学 一种铜电解添加剂及其使用方法
CN104313668B (zh) * 2014-09-30 2017-03-15 苏州芯航元电子科技有限公司 电子产线用电化学处理槽
KR20180040754A (ko) * 2016-10-12 2018-04-23 케이씨에프테크놀로지스 주식회사 핸들링이 용이한 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
KR102096448B1 (ko) * 2017-01-02 2020-05-28 한양대학교 에리카산학협력단 그래핀 코팅 동박 제조방법 및 제조장치
CN108642780A (zh) * 2018-05-24 2018-10-12 武汉纺织大学 一种以纱线染色辊为阴极的电化学染色装置及方法
CN109440170A (zh) * 2018-11-28 2019-03-08 灵宝华鑫铜箔有限责任公司 一种节能环保的电解铜箔溶铜系统及溶铜工艺
CN112899740B (zh) * 2019-11-15 2022-04-19 源秩科技（上海）有限公司 基于电化学的加工装置和方法
CN113011001B (zh) * 2021-02-20 2021-09-14 广东嘉元科技股份有限公司 水洗流量高值与低值计算方法、存储介质、生箔机
CN113546885A (zh) * 2021-07-23 2021-10-26 江西铜博科技有限公司 一种铜箔电解池自动清理装置
CN113802156B (zh) * 2021-11-05 2022-06-03 广东嘉元科技股份有限公司 一种带有清洁组件的电解铜箔生产设备及其生产工艺
CN115216813B (zh) * 2022-07-15 2024-04-16 福建紫金铜箔科技有限公司 一种铜箔横向厚度的调控方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1555458A (en) * 1976-07-19 1979-11-07 British Steel Corp Method and apparatus for producing metal strip
JPS5339941A (en) * 1976-09-25 1978-04-12 Toppan Printing Co Ltd High speed electrocasting apparatus
JPS6026689A (ja) * 1983-07-26 1985-02-09 Sumitomo Metal Ind Ltd 電析による金属箔の製造方法および装置
DD238707A3 (de) * 1984-02-20 1986-09-03 Lokomotivbau Elektrotech Anodenkorb zur elektrolytfilterung in kupferfolienerzeugungsanlagen
JPS63149390A (ja) * 1986-12-12 1988-06-22 Furukawa Saakitsuto Fuoiru Kk 電解金属箔の製造方法とそれに用いる装置
DD279697A1 (de) * 1989-02-01 1990-06-13 Beimler Lokomotivbau Verfahren und anordnung zur gleichmaessigen abscheidung eines duennen metallbelages
JPH1036991A (ja) * 1996-07-19 1998-02-10 Japan Energy Corp 電解銅箔の製造方法
US5863410A (en) * 1997-06-23 1999-01-26 Circuit Foil Usa, Inc. Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby
MY124018A (en) * 1999-06-08 2006-06-30 Mitsui Mining & Smelting Co Ltd Manufacturing method of electrodeposited copper foil, electrodeposited copper foil, copper-clad laminate and printed wiring board
JP2001011685A (ja) * 1999-06-30 2001-01-16 Mitsui Mining & Smelting Co Ltd 電解銅箔およびその製造方法
JP3794613B2 (ja) * 2000-05-18 2006-07-05 三井金属鉱業株式会社 電解銅箔の電解装置
JP2004325201A (ja) * 2003-04-24 2004-11-18 Mitsui Mining & Smelting Co Ltd 電極電位測定用プローブ及びその電極電位測定用プローブを備えた金属箔の連続電解装置
JP4217786B2 (ja) * 2004-03-12 2009-02-04 古河電気工業株式会社 キャリア付き極薄銅箔、およびキャリア付き極薄銅箔を用いた配線板
US20050158574A1 (en) * 2003-11-11 2005-07-21 Furukawa Circuit Foil Co., Ltd. Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
JP4430020B2 (ja) * 2005-02-21 2010-03-10 古河電気工業株式会社 フレキシブルプリント配線板用銅箔、その製造方法及びフレキシブルプリント配線板
TWI396779B (zh) * 2005-02-21 2013-05-21 Copper foil and its manufacturing method, and flexible printed circuit board
CN102277597B (zh) * 2011-08-12 2013-07-31 合肥铜冠国轩铜材有限公司 特殊锂电池用双面光电解铜箔的制备
CN203049057U (zh) * 2013-01-21 2013-07-10 福建清景铜箔有限公司 一种电解铜箔的生产装置
CN103060882B (zh) * 2013-01-21 2015-11-04 福建清景铜箔有限公司 一种硫酸铜溶液逆向流动生产电解铜箔的方法及系统

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110546313A (zh) * 2017-04-25 2019-12-06 古河电气工业株式会社 表面处理铜箔

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WO2014110958A1 (fr) 2014-07-24
JP2016507652A (ja) 2016-03-10
CN103060882A (zh) 2013-04-24
KR20150110728A (ko) 2015-10-02
EP2947182A4 (fr) 2016-09-28
CN103060882B (zh) 2015-11-04
JP6165880B2 (ja) 2017-07-19

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