EP2923536A1 - Potential equalization in a control device for a motor vehicle - Google Patents

Potential equalization in a control device for a motor vehicle

Info

Publication number
EP2923536A1
EP2923536A1 EP13779122.4A EP13779122A EP2923536A1 EP 2923536 A1 EP2923536 A1 EP 2923536A1 EP 13779122 A EP13779122 A EP 13779122A EP 2923536 A1 EP2923536 A1 EP 2923536A1
Authority
EP
European Patent Office
Prior art keywords
contacting element
circuit carrier
arrangement according
surface coating
motor vehicle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP13779122.4A
Other languages
German (de)
French (fr)
Inventor
Nikolaus Taschner
Bernhard Schuch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of EP2923536A1 publication Critical patent/EP2923536A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49224—Contact or terminal manufacturing with coating

Definitions

  • the invention relates to an arrangement for equipotential bonding in a control device for a motor vehicle, a method for producing a potential equalization in a control device and a control device with a corresponding arrangement.
  • a Massebond is required mainly for reasons of electromagnetic compatibility to the mass offset between the gear housing, d. H. balance the mass of the vehicle and the control unit.
  • ground denotes the electrical reference potential for signal and operating voltages in the vehicle or control unit. So far, this is usually a direct bond from the circuit board provided on a base plate of the control unit made of aluminum.
  • the bonding surface must be machined. This causes additional production costs, as otherwise no further processing is necessary here.
  • One difficulty is that the bonding surface may be contaminated or that the bonding surface does not meet the surface roughness requirements with regard to roughness, and thus no secure bond connection is ensured, which may entail repairs.
  • the ground bond is placed directly on the die-cast aluminum baseplate.
  • a machined surface is required, for example, a milled surface.
  • the base plate must be washed, for example, with perchlorethylene, in particular degreased to the strict cleanliness and Surface requirements to meet. This is an expensive and, in particular, environmentally damaging process.
  • the invention is therefore based on the object to provide a control device for a motor vehicle and a method for its production, in which the Potentiaiausrete Sammlung the circuit substrate is simplified to the transmission housing.
  • the core of the arrangement according to the invention consists in that at least one contacting element, which electrically connects the circuit carrier to the carrier structure by means of a connecting element in order to produce a potential equalization, has a bondable surface coating.
  • this surface coating on the contacting element of galvanically or chemically deposited.
  • the contacting element can be completely or even partially coated, whereby advantageously one or more defined bondable surfaces can arise.
  • the coated contacting element which is non-positively or positively connected to the support structure, for. B. designed as a screw or rivet, a screw can be very easily mounted.
  • the support structure is formed at least as a part, in particular as a base plate of the control unit housing, for example made of aluminum.
  • the circuit carrier comprises a printed circuit board, in particular with a ceramic substrate, wherein in particular the connecting element between see circuit carrier and carrier structure can be designed specifically as a ground bond.
  • the method according to the invention enables a particularly simple establishment of a potential equalization between a circuit carrier of a control device and its housing.
  • a control device with a circuit carrier and a carrier structure or base plate together with a connecting element and a contacting element are provided, wherein the contacting element has a bondable surface coating.
  • this compound is also electrically conductive.
  • a screw with a corresponding surface coating is screwed into a corresponding threaded opening of a housing base plate.
  • an electrically conductive connection between the contacting element and the circuit carrier mitteis of the connecting element for.
  • a Dickdrahtbond made of aluminum.
  • a control device 1 for a motor vehicle in particular a transmission control device comprises a housing for receiving an electrical component 6, a support structure 2, at least one side wall 8 and a lid, not shown here.
  • the base plate 2 may also be formed integrally with the side wall 8.
  • the electrical component 6 is mounted on a circuit carrier 4, z.
  • a circuit carrier 4 As a circuit board, arranged, for example, glued or soldered.
  • the circuit carrier 4 again rum is on the support structure, in particular a dimensionally stable Gmndplatte 2 Aiuminiumdruckguss arranged, in particular glued.
  • the contacting element is designed in this case as a screw, in particular an external hex screw with a screw head with several different defined surfaces.
  • a screw in particular an external hex screw with a screw head with several different defined surfaces.
  • only the top of the screw head is provided with a bondable surface coating 5.
  • the coated screw 7 is here screwed non-positively and electrically conductive in a corresponding threaded opening of the base plate 2.
  • the screw 7 is screwed into the threaded opening of the base plate 2 such that after production of the frictional connection of the screw head complains to the base plate 2 is.
  • the screw head could also be completely screwed into the base plate 2, whereby the electrically conductive surface between the screw 7 and base plate 2 would be increased.
  • connection element 7 is electrically conductively connected to the bondable surface coating 5 of the screw 7 by means of the connecting element 3.
  • the connecting element is designed as a thick-wire bond 3 made of aluminum.
  • any other type of wire or ribbon connection would be possible, e.g. as aluminum thin wire, gold wire, copper wire, copper tapes or aluminum tapes possible.
  • metallic or non-metallic and hitherto non-bondable materials which have an electrical conductivity can also be connected to each other in a process-reliable or process-reliable manner with a defined potential and a low contact resistance. Material differences in the housing components to be connected have a significantly lower influence on the bonding process.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Power Steering Mechanism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

An arrangement for potential equalization in a control device (1) for a motor vehicle comprises at least one electrical component (6) on a circuit carrier (4), a carrier structure (2) on which the circuit carrier (4) is arranged, and at least one contacting element (7) that electroconductively connects the circuit carrier (4) to the carrier structure (2) by means of a connecting element (3) in order to form a potential equalization, the contacting element (7) having a bondable surface coating (5).

Description

Potentialausgieich in einem Steuergerät für ein Kraftfahrzeug  Potential equalization in a control unit for a motor vehicle
Die Erfindung betrifft eine Anordnung zum Potentialausgleich in einem Steuergerät für ein Kraftfahrzeug, ein Verfahren zur Herstellung eines Potentialaus- gleichs in einem Steuergerät sowie ein Steuergerät mit einer entsprechenden Anordnung. The invention relates to an arrangement for equipotential bonding in a control device for a motor vehicle, a method for producing a potential equalization in a control device and a control device with a corresponding arrangement.
Für ein Steuergerät in einem Kraftfahrzeug ist aus Gründen der elektromagnetischen Verträglichkeit insbesondere eine Masseanbindung des Schaltungsträgers des Steuergeräts zum Steuergerätgehäuse, bzw. zur Steuergerätgrundplatte, welche üblicherweise aus Aluminium ist, notwendig. For reasons of electromagnetic compatibility, a ground connection of the circuit carrier of the control device to the control device housing, or to the control device base plate, which is usually made of aluminum, is necessary for a control device in a motor vehicle.
Ein Massebond ist vor allem aus Gründen der elektromagnetischen Verträglichkeit erforderlich, um den Masseversatz zwischen dem Getriebegehäuse, d. h. der Masse am Fahrzeug und dem Steuergerät auszugleichen. Masse bezeichnet hierbei das elektrische Bezugspotential für Signal- und Betriebsspannungen im Fahrzeug bzw. Steuergerät. Bisher ist hierzu in der Regel eine direkte Bondverbindung vom Schaltungsträger auf eine Grundplatte des Steuergeräts aus Aluminium vorgesehen. Hierzu muss die Bondfläche mechanisch bearbeitet sein. Dies verur- sacht zusätzliche Herstellungskosten, da hier sonst keine weitere Bearbeitung notwendig ist. Eine Schwierigkeit besteht darin, dass die Bondfläche Verschmutzungen aufweisen kann oder die Bondfläche die Anforderungen an die Oberrlä- chenbeschaffenheit bzgl. Rauigkeit nicht erfüllt, und somit keine sichere Bondverbindung gewährleistet ist, was Reparaturen nach sich ziehen kann. A Massebond is required mainly for reasons of electromagnetic compatibility to the mass offset between the gear housing, d. H. balance the mass of the vehicle and the control unit. In this case, ground denotes the electrical reference potential for signal and operating voltages in the vehicle or control unit. So far, this is usually a direct bond from the circuit board provided on a base plate of the control unit made of aluminum. For this purpose, the bonding surface must be machined. This causes additional production costs, as otherwise no further processing is necessary here. One difficulty is that the bonding surface may be contaminated or that the bonding surface does not meet the surface roughness requirements with regard to roughness, and thus no secure bond connection is ensured, which may entail repairs.
Üblicherweise wird der Massebond direkt auf die Aluminium-Druckguss- Grundplatte gesetzt. Um die Bondbarkeit auf der Grundplatte zu gewährleisten, ist eine mechanisch bearbeitete Fläche erforderlich, zum Beispiel eine gefräste Fläche. Insbesondere muss die Grundplatte zum Beispiel mit Perchlorethylen gewaschen, insbesondere entfettet werden, um den strengen Sauberkeits- und Oberflächenanforderungen zu genügen. Dies ist ein teures und insbesondere um- weltschädiiches Verfahren. Typically, the ground bond is placed directly on the die-cast aluminum baseplate. To ensure the bondability to the base plate, a machined surface is required, for example, a milled surface. In particular, the base plate must be washed, for example, with perchlorethylene, in particular degreased to the strict cleanliness and Surface requirements to meet. This is an expensive and, in particular, environmentally damaging process.
Der Erfindung liegt daher die Aufgabe zugrunde, ein Steuergerät für ein Kraft- fahrzeug und ein Verfahren zu dessen Herstellung zu schaffen, bei welchem der Potentiaiausgleich des Schaltungsträgers zum Getriebegehäuse vereinfacht ist. The invention is therefore based on the object to provide a control device for a motor vehicle and a method for its production, in which the Potentiaiausgleich the circuit substrate is simplified to the transmission housing.
Diese Aufgabe wird durch die Merkmaie der Ansprüche 1, 9 und 11 gelöst. Der Kern der erfindungsgemäßen Anordnung besteht darin, dass mindestens ein Kontaktierungselement , das zum Herstellen eines Potentialausgleichs den Schal- tungsträger mit der Trägerstruktur mittels eines Verbindungselements elektrisch leitend verbindet, eine bondbare Oberflächenbeschichtung aufweist. Insbesondere besteht diese Oberflächenbeschichtung auf dem Kontaktierungselement aus galvanisch oder chemisch abgeschiedenem. Material aus Aluminium., Kupfer, Silber, oder einer Verbindung wie Nickel/Gold, Nickel/Silber, Nickel/Palladium/Gold oder Nickel/Palladium/Silber. Dabei kann das Kontaktierungselement ganz oder auch nur teilweise beschichtet sein, wodurch vorteilhaft- erweise eine oder auch mehrere definierte bondbare Oberfl ächen entstehen können. This object is solved by the Merkmaie of claims 1, 9 and 11. The core of the arrangement according to the invention consists in that at least one contacting element, which electrically connects the circuit carrier to the carrier structure by means of a connecting element in order to produce a potential equalization, has a bondable surface coating. In particular, this surface coating on the contacting element of galvanically or chemically deposited. Material of aluminum., Copper, silver, or a compound such as nickel / gold, nickel / silver, nickel / palladium / gold or nickel / palladium / silver. In this case, the contacting element can be completely or even partially coated, whereby advantageously one or more defined bondable surfaces can arise.
Der Einfachheit halber ist das beschichtete Kontaktierungselement, das mit der Trägerstruktur kraft- oder formschlüssig verbunden ist, z. B. als Schraube oder Niet ausgeführt, wobei eine Schraube besonders einfach montiert werden kann. For the sake of simplicity, the coated contacting element, which is non-positively or positively connected to the support structure, for. B. designed as a screw or rivet, a screw can be very easily mounted.
Vorzugsweise ist die Trägerstruktur zumindest als Teil, insbesondere als Grundplatte des Steuergerätgehäuses, beispielsweise aus Aluminium, ausgebildet. Vortelhafterweise umfasst der Schaltungsträger eine Leiterplatte, insbesondere mit einem Keramiksubstrat, wobei insbesondere das Verbindungselement zwi- sehen Schaltungsträger und Trägerstruktur speziell als Massebond ausgeführt sein kann. Preferably, the support structure is formed at least as a part, in particular as a base plate of the control unit housing, for example made of aluminum. Advantageously, the circuit carrier comprises a printed circuit board, in particular with a ceramic substrate, wherein in particular the connecting element between see circuit carrier and carrier structure can be designed specifically as a ground bond.
Das erfindungsgemäße Verfahren ermöglicht ein besonders einfaches Herstellen eines Potentialausgleichs zwischen einem Schaltungsträger eines Steuergeräts und dessen Gehäuse. Zunächst werden insbesondere ein Steuergerät mit einem Schaltungsträger und einer Trägerstruktur bzw. Grundplatte nebst einem Verbindungselement und einem Kontaktierungselement bereit gestellt, wobei das Kontaktierungselement eine bondbare Oberflächenbeschichtung aufweist . The method according to the invention enables a particularly simple establishment of a potential equalization between a circuit carrier of a control device and its housing. First of all, in particular a control device with a circuit carrier and a carrier structure or base plate together with a connecting element and a contacting element are provided, wherein the contacting element has a bondable surface coating.
Anschließend wird eine insbesondere kraft- oder formschlüssigen Verbindung zwischen dem Kontaktierungselement mit der Trägerstruktur hergesteilt, wobei diese Verbindung auch elektrisch leitend ist. Beispielsweise wird dabei eine Schraube mit einer entsprechenden Oberflächenbeschichtung in eine entspre- chende Gewindeöffnung einer Gehäusegrundplatte eingeschraubt. Subsequently, a particular non-positive or positive connection between the contacting element with the support structure is made, this compound is also electrically conductive. For example, a screw with a corresponding surface coating is screwed into a corresponding threaded opening of a housing base plate.
Abschließend wird dann eine elektrisch leitende Verbindung zwischen dem Kontaktierungselement und dem Schaltungsträger mitteis des Verbindungselements, z. B. einem Dickdrahtbond aus Aluminium, hergestellt . Finally, an electrically conductive connection between the contacting element and the circuit carrier mitteis of the connecting element, for. As a Dickdrahtbond made of aluminum.
Zusätzliche Merkmale und Einzelheiten der Erfindung ergeben sich aus der Beschreibung von Ausführungsbeispielen anhand der Zeichnung. Die einzige Figur zeigt einen Teilquerschnitt einer erfindungsgemäßen Anordnung. Ein Steuergerät 1 für ein Kraftfahrzeug, insbesondere ein Getriebesteuergerät umfasst ein Gehäuse zur Aufnahme eines elektrischen Bauteils 6 eine Trägerstruktur 2, mindestens eine Seitenwand 8 und einen, hier nicht gezeigten Deckel. Die Grundplatte 2 kann auch einteilig mit der Seitenwand 8 ausgebildet sein. Additional features and details of the invention will become apparent from the description of embodiments with reference to the drawings. The single FIGURE shows a partial cross section of an arrangement according to the invention. A control device 1 for a motor vehicle, in particular a transmission control device comprises a housing for receiving an electrical component 6, a support structure 2, at least one side wall 8 and a lid, not shown here. The base plate 2 may also be formed integrally with the side wall 8.
Das elektrische Bauteil 6 ist auf einem Schaltungsträger 4, z. B. einer Leiterplatte, angeordnet, beispielsweise geklebt oder gelötet. Der Schaltungsträger 4 wiede rum ist auf der Trägerstruktur , insbesondere einer formstabilen Gmndplatte 2 aus Aiuminiumdruckguss, angeordnet, insbesondere geklebt. The electrical component 6 is mounted on a circuit carrier 4, z. As a circuit board, arranged, for example, glued or soldered. The circuit carrier 4 again rum is on the support structure, in particular a dimensionally stable Gmndplatte 2 Aiuminiumdruckguss arranged, in particular glued.
Das Kontaktierungselement ist in diesem Fall als Schraube?, insbesondere eine Außensechskantschraube mit einem Schraubenkopf mit mehreren verschiedenen definierten Oberflächen ausgeführt. In der Figur ist nur die Oberseite des Schraubenkopfs mit einer bondbaren Oberflächenbeschichtung 5 versehen. Die beschichtete Schraube 7 ist hier kraftschlüssig und elektrisch leitend in eine entsprechende Gewindeöffnung der Grundplatte 2 eingeschraubt. In der Figur ist die Schraube 7 derart in die Gewindeöffnung der Grundplatte 2 eingeschraubt, dass nach Herstellung der kraftschlüssigen Verbindung der Schraubenkopf beanstandet zur Grundplatte 2 ist. Der Schraubenkopf könnte jedoch auch ganz in die Grundplatte 2 eingeschraubt sein, wodurch die elektrisch leitende Oberfläche zwischen Schraube 7 und Grundplatte 2 noch erhöht werden würde. The contacting element is designed in this case as a screw, in particular an external hex screw with a screw head with several different defined surfaces. In the figure, only the top of the screw head is provided with a bondable surface coating 5. The coated screw 7 is here screwed non-positively and electrically conductive in a corresponding threaded opening of the base plate 2. In the figure, the screw 7 is screwed into the threaded opening of the base plate 2 such that after production of the frictional connection of the screw head complains to the base plate 2 is. However, the screw head could also be completely screwed into the base plate 2, whereby the electrically conductive surface between the screw 7 and base plate 2 would be increased.
Eine alternative Art des Verbindens des Kontaktierungselements 7 mit der Grundplatte 2 zum Schrauben, wäre beispielsweise Nieten, Löten, Schweißen oder Kleben. Der Schaltungsträger 4 ist mit der bondbaren Oberflächenbeschichtung 5 der Schraube 7 mittels des Verbindungselements 3 elektrisch leitend verbunden. Insbesondere ist das Verbindungselement als Dickdrahtbond 3 aus Aluminium ausgeführt. Als Verbindungselement 3 wäre aber auch jede andere Art von Draht- oder Bandverbindung möglich, z.B. als Aluminiumdünndraht, Golddraht, Kupferdraht, Kupferbändchen oder Aluminiumbändchen möglich. An alternative way of connecting the contacting element 7 with the base plate 2 for screwing would be, for example, riveting, soldering, welding or gluing. The circuit carrier 4 is electrically conductively connected to the bondable surface coating 5 of the screw 7 by means of the connecting element 3. In particular, the connecting element is designed as a thick-wire bond 3 made of aluminum. As connecting element 3 but any other type of wire or ribbon connection would be possible, e.g. as aluminum thin wire, gold wire, copper wire, copper tapes or aluminum tapes possible.
Erfindungsgemäß können auch metallische oder nichtmetallische und bisher nicht bondbare Materialien, welche eine elektrische Leitfähigkeit aufweisen, prozesssicher bzw. prozesssicherer mit einem definierten Potenzial und einem niedrigen Übergangswiderstand miteinander verbunden werden. Materialunterschiede bei zu verbindendenen Gehäusekomponenten haben dabei einen deutlich geringeren Einfluss auf den Bondprozess. According to the invention, metallic or non-metallic and hitherto non-bondable materials which have an electrical conductivity can also be connected to each other in a process-reliable or process-reliable manner with a defined potential and a low contact resistance. Material differences in the housing components to be connected have a significantly lower influence on the bonding process.
Es muss kein Bereich einer Gehäusekomponente in einem extra Schritt speziell mechanisch bearbeitet, z. B. gefräst, werden, um auf diesen direkt bonden zu können. Auch ist eine Potenzialanbindung bzw. ein Potenzialausgleich durch mehrere dieser ontaktierungselemente an verschiedenen Stellen des Gehäuses möglich. There is no area of a housing component in an extra step specially machined, z. B. milled, to be able to directly bond to this. A potential connection or a potential equalization by a plurality of these ontaktierungselemente at different points of the housing is possible.

Claims

Patentansprüche claims
1. Anordnung zum Potentialausgleich in einem Steuergerät (1) für ein Kraftfahrzeug, umfassend  1. Arrangement for equipotential bonding in a control unit (1) for a motor vehicle, comprising
a. mindestens ein elektrisches Bauteil (6) auf einem Schaltungsträger (4), b. eine Trägerstruktur (2), auf dem der Schaltungsträger (4) angeordnet ist, und  a. at least one electrical component (6) on a circuit carrier (4), b. a support structure (2) on which the circuit carrier (4) is arranged, and
c. mindestens ein Kontaktierungselement (7), das zum Herstellen eines Potentialausgleichs den Schaltungsträger (4) mit der Trägerstruktur (2) mittels eines Verbindungselements (3) elektrisch leitend verbindet, wo- bei das Kontaktierungselement (7) eine bondbare Oberflächenbeschich- tung (5) aufweist.  c. at least one contacting element (7) which electrically connects the circuit carrier (4) to the carrier structure (2) by means of a connecting element (3) to produce a potential equalization, the contacting element (7) having a bondable surface coating (5) ,
2. Anordnung gemäß Anspruch 1 , dadurch gekennzeichnet, dass die Oberflä- chenbeschichtung (5) auf dem Kontaktierungselement (7) galvanisch oder chemisch abgeschieden ist. 2. Arrangement according to claim 1, characterized in that the surface coating (5) on the contacting element (7) is deposited galvanically or chemically.
3. Anordnung gemäß Anspruch 2, dadurch gekennzeichnet, dass die Oberflä- chenbeschichtung (5) aus Aluminium, Kupfer, Silber, oder einer Verbindung wie Nickel/Gold, Nickel/Silber, Nickel/Palladium/Gold oder Ni- ckel/Palladium/Silber besteht. 3. Arrangement according to claim 2, characterized in that the surface coating (5) made of aluminum, copper, silver, or a compound such as nickel / gold, nickel / silver, nickel / palladium / gold or nickel / palladium / silver consists.
4. Anordnung gemäß einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Kontaktierungselement (7) mit der Trägerstruktur (2) kraft- oder formschlüssig mittels einer Schraub- oder Nietverbindung ver- bunden ist. 4. Arrangement according to one of the preceding claims, characterized in that the contacting element (7) with the support structure (2) non-positively or positively by means of a screw or riveted connection is connected.
5. Anordnung gemäß einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Trägerstruktur (2) zumindest als Teil eines Steuergerätgehäuses , insbesondere als Grundplatte desselben ausgebildet ist. 5. Arrangement according to one of the preceding claims, characterized in that the support structure (2) is formed at least as part of a control unit housing, in particular as the base plate thereof.
6. Anordnung gemäß einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Schaltungsträger (4) eine Leiterplatte, insbesondere mit einem Keramiksubstrat umfasst. 6. Arrangement according to one of the preceding claims, characterized in that the circuit carrier (4) comprises a printed circuit board, in particular with a ceramic substrate.
7. Anordnung gemäß einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Verbindungselements (3) als Drahtbond ausgeführt ist. 7. Arrangement according to one of the preceding claims, characterized in that the connecting element (3) is designed as a wire bond.
8. Anordnung gemäß Anspruch 7, dadurch gekennzeichnet, dass der Drahtbond als Massebond ausgeführt ist 8. Arrangement according to claim 7, characterized in that the wire bond is designed as a ground bond
9. Verfahren zur Herstellung einer Anordnung zum Potentialausgleichs in einem Steuergerät (1) für ein Kraftfahrzeug umfassend die folgenden Schritte: 9. A method for producing an arrangement for equipotential bonding in a control unit (1) for a motor vehicle, comprising the following steps:
a. Bereitstellen eines Steuergeräts mit einem Schaltungsträger (4) und einer Trägerstruktur (2),  a. Providing a control device with a circuit carrier (4) and a carrier structure (2),
b. Bereitstellen eines elektrisch leitenden Verbindungselements (3) und eines Kontaktierungselements (7), wobei das Kontaktierungselement (7) eine bondbare Oberflächenbeschichtung (5) aufweist,  b. Providing an electrically conductive connecting element (3) and a contacting element (7), wherein the contacting element (7) has a bondable surface coating (5),
c. Herstellen einer kraft- oder formschlüssigen Verbindung zwischen dem Kontaktierungselement (7) mit der Trägerstruktur (2), wobei die hergestellte Verbindung auch elektrisch leitend ist, und  c. Producing a non-positive or positive connection between the contacting element (7) with the support structure (2), wherein the compound produced is also electrically conductive, and
d. Herstellen einer elektrisch leitenden Verbindung zwischen dem Kontaktierungselement (7) und dem Schaltungsträger (4) mittels des Verbindungselements (3).  d. Producing an electrically conductive connection between the contacting element (7) and the circuit carrier (4) by means of the connecting element (3).
10. Verfahren gemäß Anspruch 8, dadurch gekennzeichnet, dass die Oberflächenbeschichtung (5) auf dem Kontaktierungselement (7) galvanisch oder chemisch abgeschieden ist. 10. The method according to claim 8, characterized in that the surface coating (5) on the contacting element (7) is deposited galvanically or chemically.
11. Steuergerät für ein Kraftfahrzeug mit einer Anordnung zum Potentialausgleich gemäß Anspruch 1. 11. Control device for a motor vehicle with an arrangement for equipotential bonding according to claim 1.
EP13779122.4A 2012-11-23 2013-09-26 Potential equalization in a control device for a motor vehicle Ceased EP2923536A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012111334.3A DE102012111334A1 (en) 2012-11-23 2012-11-23 Equipotential bonding in a control unit for a motor vehicle
PCT/DE2013/200188 WO2014079421A1 (en) 2012-11-23 2013-09-26 Potential equalization in a control device for a motor vehicle

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EP2923536A1 true EP2923536A1 (en) 2015-09-30

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US (1) US10010017B2 (en)
EP (1) EP2923536A1 (en)
JP (1) JP2016506615A (en)
DE (2) DE102012111334A1 (en)
WO (1) WO2014079421A1 (en)

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KR20170106055A (en) 2016-03-11 2017-09-20 삼성전자주식회사 Appratus and method for providing graphical user interface for providing service

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DE102012111334A1 (en) 2014-05-28
DE112013005638A5 (en) 2015-08-06
US10010017B2 (en) 2018-06-26
JP2016506615A (en) 2016-03-03
WO2014079421A1 (en) 2014-05-30
US20150289422A1 (en) 2015-10-08

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