WO2014079421A1 - Potentialausgleich in einem steuergerät für ein kraftfahrzeug - Google Patents
Potentialausgleich in einem steuergerät für ein kraftfahrzeug Download PDFInfo
- Publication number
- WO2014079421A1 WO2014079421A1 PCT/DE2013/200188 DE2013200188W WO2014079421A1 WO 2014079421 A1 WO2014079421 A1 WO 2014079421A1 DE 2013200188 W DE2013200188 W DE 2013200188W WO 2014079421 A1 WO2014079421 A1 WO 2014079421A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- contacting element
- circuit carrier
- arrangement according
- surface coating
- motor vehicle
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0064—Earth or grounding circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49224—Contact or terminal manufacturing with coating
Definitions
- the invention relates to an arrangement for equipotential bonding in a control device for a motor vehicle, a method for producing a potential equalization in a control device and a control device with a corresponding arrangement.
- a Massebond is required mainly for reasons of electromagnetic compatibility to the mass offset between the gear housing, d. H. balance the mass of the vehicle and the control unit.
- ground denotes the electrical reference potential for signal and operating voltages in the vehicle or control unit. So far, this is usually a direct bond from the circuit board provided on a base plate of the control unit made of aluminum.
- the bonding surface must be machined. This causes additional production costs, as otherwise no further processing is necessary here.
- One difficulty is that the bonding surface may be contaminated or that the bonding surface does not meet the surface roughness requirements with regard to roughness, and thus no secure bond connection is ensured, which may entail repairs.
- the ground bond is placed directly on the die-cast aluminum baseplate.
- a machined surface is required, for example, a milled surface.
- the base plate must be washed, for example, with perchlorethylene, in particular degreased to the strict cleanliness and Surface requirements to meet. This is an expensive and, in particular, environmentally damaging process.
- the invention is therefore based on the object to provide a control device for a motor vehicle and a method for its production, in which the Potentiaiausrete Sammlung the circuit substrate is simplified to the transmission housing.
- the core of the arrangement according to the invention consists in that at least one contacting element, which electrically connects the circuit carrier to the carrier structure by means of a connecting element in order to produce a potential equalization, has a bondable surface coating.
- this surface coating on the contacting element of galvanically or chemically deposited.
- the contacting element can be completely or even partially coated, whereby advantageously one or more defined bondable surfaces can arise.
- the coated contacting element which is non-positively or positively connected to the support structure, for. B. designed as a screw or rivet, a screw can be very easily mounted.
- the support structure is formed at least as a part, in particular as a base plate of the control unit housing, for example made of aluminum.
- the circuit carrier comprises a printed circuit board, in particular with a ceramic substrate, wherein in particular the connecting element between see circuit carrier and carrier structure can be designed specifically as a ground bond.
- the method according to the invention enables a particularly simple establishment of a potential equalization between a circuit carrier of a control device and its housing.
- a control device with a circuit carrier and a carrier structure or base plate together with a connecting element and a contacting element are provided, wherein the contacting element has a bondable surface coating.
- this compound is also electrically conductive.
- a screw with a corresponding surface coating is screwed into a corresponding threaded opening of a housing base plate.
- an electrically conductive connection between the contacting element and the circuit carrier mitteis of the connecting element for.
- a Dickdrahtbond made of aluminum.
- a control device 1 for a motor vehicle in particular a transmission control device comprises a housing for receiving an electrical component 6, a support structure 2, at least one side wall 8 and a lid, not shown here.
- the base plate 2 may also be formed integrally with the side wall 8.
- the electrical component 6 is mounted on a circuit carrier 4, z.
- a circuit carrier 4 As a circuit board, arranged, for example, glued or soldered.
- the circuit carrier 4 again rum is on the support structure, in particular a dimensionally stable Gmndplatte 2 Aiuminiumdruckguss arranged, in particular glued.
- the contacting element is designed in this case as a screw, in particular an external hex screw with a screw head with several different defined surfaces.
- a screw in particular an external hex screw with a screw head with several different defined surfaces.
- only the top of the screw head is provided with a bondable surface coating 5.
- the coated screw 7 is here screwed non-positively and electrically conductive in a corresponding threaded opening of the base plate 2.
- the screw 7 is screwed into the threaded opening of the base plate 2 such that after production of the frictional connection of the screw head complains to the base plate 2 is.
- the screw head could also be completely screwed into the base plate 2, whereby the electrically conductive surface between the screw 7 and base plate 2 would be increased.
- connection element 7 is electrically conductively connected to the bondable surface coating 5 of the screw 7 by means of the connecting element 3.
- the connecting element is designed as a thick-wire bond 3 made of aluminum.
- any other type of wire or ribbon connection would be possible, e.g. as aluminum thin wire, gold wire, copper wire, copper tapes or aluminum tapes possible.
- metallic or non-metallic and hitherto non-bondable materials which have an electrical conductivity can also be connected to each other in a process-reliable or process-reliable manner with a defined potential and a low contact resistance. Material differences in the housing components to be connected have a significantly lower influence on the bonding process.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Power Steering Mechanism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/646,776 US10010017B2 (en) | 2012-11-23 | 2013-09-26 | Potential equalization in a control device for a motor vehicle |
DE112013005638.0T DE112013005638A5 (de) | 2012-11-23 | 2013-09-26 | Potentialausgleich in einem Steuergerät für ein Kraftfahrzeug |
JP2015543324A JP2016506615A (ja) | 2012-11-23 | 2013-09-26 | 自動車用の制御機器における等電位化 |
EP13779122.4A EP2923536A1 (de) | 2012-11-23 | 2013-09-26 | Potentialausgleich in einem steuergerät für ein kraftfahrzeug |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012111334.3 | 2012-11-23 | ||
DE102012111334.3A DE102012111334A1 (de) | 2012-11-23 | 2012-11-23 | Potentialausgleich in einem Steuergerät für ein Kraftfahrzeug |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014079421A1 true WO2014079421A1 (de) | 2014-05-30 |
Family
ID=49385073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2013/200188 WO2014079421A1 (de) | 2012-11-23 | 2013-09-26 | Potentialausgleich in einem steuergerät für ein kraftfahrzeug |
Country Status (5)
Country | Link |
---|---|
US (1) | US10010017B2 (de) |
EP (1) | EP2923536A1 (de) |
JP (1) | JP2016506615A (de) |
DE (2) | DE102012111334A1 (de) |
WO (1) | WO2014079421A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017146161A1 (ja) | 2016-02-26 | 2017-08-31 | 日本電気株式会社 | 顔照合システム、顔照合装置、顔照合方法、及び記録媒体 |
KR20170106055A (ko) | 2016-03-11 | 2017-09-20 | 삼성전자주식회사 | 서비스를 제공하기 위한 gui를 제공하는 영상 출력 장치 및 영상 출력 방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050079748A1 (en) * | 2003-10-10 | 2005-04-14 | Myoung-Kon Kim | Structures for coupling and grounding a circuit board in a plasma display device |
EP2073261A1 (de) * | 2006-09-26 | 2009-06-24 | Hitachi Metals, Ltd. | Keramiksubstratkomponente und elektronische komponente damit |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63195977A (ja) * | 1987-02-10 | 1988-08-15 | 株式会社東芝 | 電気回路ユニットの接地機構 |
DE4428319C2 (de) * | 1994-08-10 | 1996-08-14 | Duerrwaechter E Dr Doduco | Träger aus einem Kunststoff für eine elektronische Schaltung mit bondbaren Kontaktstiften |
JP3508692B2 (ja) * | 2000-04-28 | 2004-03-22 | アイシン・エィ・ダブリュ株式会社 | 電子装置のアース接続装置 |
WO2008113323A1 (de) * | 2007-03-19 | 2008-09-25 | Conti Temic Microelectronic Gmbh | Massebondverbindung |
DE202008002149U1 (de) * | 2008-02-16 | 2008-04-30 | Harting Electronics Gmbh & Co. Kg | Leiterkarten-Steckverbinder mit Masseanschluss |
US8889995B2 (en) * | 2011-03-03 | 2014-11-18 | Skyworks Solutions, Inc. | Wire bond pad system and method |
-
2012
- 2012-11-23 DE DE102012111334.3A patent/DE102012111334A1/de not_active Withdrawn
-
2013
- 2013-09-26 EP EP13779122.4A patent/EP2923536A1/de not_active Ceased
- 2013-09-26 US US14/646,776 patent/US10010017B2/en active Active
- 2013-09-26 JP JP2015543324A patent/JP2016506615A/ja active Pending
- 2013-09-26 DE DE112013005638.0T patent/DE112013005638A5/de not_active Withdrawn
- 2013-09-26 WO PCT/DE2013/200188 patent/WO2014079421A1/de active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050079748A1 (en) * | 2003-10-10 | 2005-04-14 | Myoung-Kon Kim | Structures for coupling and grounding a circuit board in a plasma display device |
EP2073261A1 (de) * | 2006-09-26 | 2009-06-24 | Hitachi Metals, Ltd. | Keramiksubstratkomponente und elektronische komponente damit |
Non-Patent Citations (1)
Title |
---|
ILME GMBH: "AP- und AC-Gehäuse aus Aluminiumdruckguss", 1 April 2009 (2009-04-01), XP055108580, Retrieved from the Internet <URL:http://modularsteckverbinder.de/fileadmin/pdf/DE_AC-AP.pdf> [retrieved on 20140318] * |
Also Published As
Publication number | Publication date |
---|---|
US10010017B2 (en) | 2018-06-26 |
JP2016506615A (ja) | 2016-03-03 |
EP2923536A1 (de) | 2015-09-30 |
DE112013005638A5 (de) | 2015-08-06 |
US20150289422A1 (en) | 2015-10-08 |
DE102012111334A1 (de) | 2014-05-28 |
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