DE102012108859B4 - Electronics module - Google Patents

Abstract

Electronic module (100) for mounting in an electronic unit (200), comprising at least one circuit board (110) and at least one mounting device (10) with a frame (20) made of plastic and at least one frame contact (30) embedded in the frame, the circuit board (110) is fastened or assembled on the frame (20) and the at least one frame contact (30) is connected directly to an associated at least one plate contact (120) on the circuit board (110) in an electrically contacting manner, at least one external contact (40) of the A mounting device (10) is provided for making electrical contact with an electrical connection, the external contact (40) being in an electrically conductive connection with the frame contact (30) and being integrally formed with the frame contact (30), the at least one frame contact (30 ) has at least one spring section (32) which has a spring action in the direction or essentially in the direction opposite to an A. Has the receiving direction or assembly direction of the circuit board (110) in the frame (20).

Description

The present invention relates to an electronics module for assembly in an electronics unit, the electronics module having at least one printed circuit board and at least one assembly device.

Electronic modules and mounting devices for mounting an electronic module in an electronic unit are known in principle. For example, the DE 100 48 377 A1 such a technical solution. In known electronic modules, assembly devices are used which often have a frame-like structure. This frame-like structure is used to fasten a circuit board in a desired position on this frame. In order to contact conductor tracks and electrical components located on the circuit board with contacts outside the circuit board, frame contacts are provided in known assembly devices. These frame contacts are connected to corresponding contact areas or contact sections of the circuit board using a separate connection method. The common and well-known method for this is so-called (wire) bonding. A liquid metal drop is applied to one of the two contacts and then a bonding wire or tape is fed to the second contact. The second contact is also melted again, creating a firm connection to both electrical contacts. The two contacts are connected to one another in an electrically conductive manner via this bonding wire or the bonding tape.

It is disadvantageous that the expenditure for the (wire) bonding method described above is relatively high. It is relatively time-consuming, since usually only a single (wire) bonding step can be carried out to connect two associated contacts. For a large number of contacts, this corresponds to a large number of successive individual steps, so that a large amount of time is required. It is also disadvantageous that the (wire) bonding process has particularly high demands on the ambient conditions. In particular, a clean room situation with defined temperature conditions is necessary in order to carry out such a (wire) bonding process. Another disadvantage is the large amount of space required for the bonding wire and the corresponding distance between the associated contacts, which is bridged by the bonding wire.

In addition, from the DE 10 2011 080 811 A1 an electronic module with a frame made of metal (spring steel) is known. There, frame contacts made of metal are also arranged on the frame, which frame contacts are produced from the frame itself using the stamping and bending process. The frame is electrically connected to the frame contacts and serves to connect a circuit board on the ground side to the housing base / frame of a shielded housing.

Furthermore, from the DE 10 2006 025 977 B4 an electronic module is known in which contact surfaces are formed on the face of the circuit board. In this case, contact springs are formed on the inside of a housing wall, which rest against assigned contact surfaces of the circuit board by spring force, so that the contact spring generates a force directed in the direction of the plane of the circuit board.

It is the object of the present invention to at least partially remedy the disadvantages described above. In particular, it is the object of the present invention to provide an electronics module which enables assembly in a cost-effective and simple manner with, in particular, a small installation space.

The above object is achieved by an electronics module with the features of claim 1. Further features and details of the invention emerge from the subclaims, the description and the drawings.

A mounting device according to the invention of the electronic module according to the invention has a frame for fastening or assembling a circuit board. Furthermore, at least one frame contact is provided for the electrical contacting of at least one plate contact of the circuit board. A mounting device according to the invention is characterized in that the at least one frame contact is arranged on the frame in such a way that it is designed for a direct connection to the associated at least one plate contact when the printed circuit board is attached to or assembled on the frame.

According to the invention, an expensive (wire) bonding process can be dispensed with. A direct connection between the frame contact and the plate contact can be implemented in the most varied of ways. So it is e.g. B. possible that only a touching contact is possible for the direct connection. Further connection steps, such as B. soldering or welding are conceivable within the scope of the present invention for a direct connection.

A frame of the mounting device is according to the invention, for. B. made of a particularly inexpensive material. In particular, a plastic (e.g. polyethylene or polystyrene) is used for this. In the case of a plastic version, it can also be particularly inexpensive and electrical insulation between the individual frame contacts can simply be made available to one another. In addition, the frame is preferably designed in such a way that it has sufficient mechanical rigidity to enable the circuit board to be attached.

The mounting or assembly of the circuit board on the frame can be carried out in the most varied of ways. So is z. B. pure clamping is conceivable via snap-lock or clamp connections. Fastening with the aid of rivets or screw connections is also possible. Complete gluing to the frame can also be carried out within the scope of the present invention.

The plate contacts can be separately formed contacts or individual electrically conductive sections of the circuit board. Each circuit board can be designed in the most varied of ways. So are z. B. so-called PCBs (printed circuid boards) possible. So-called DCBs with a structure with at least one ceramic layer are also conceivable within the scope of the present invention.

Decisive advantages of an assembly device according to the invention are, on the one hand, the cost-effective and quick production and, on the other hand, the small space requirement. Due to the direct connection between the frame contacts and the associated plate contacts, the installation space for the entire assembly device can be reduced. Due to the fact that no (wire) bonding process has to be used, the costs and the material expenditure for this direct connection are also reduced. Last but not least, depending on the connection method, a method can be selected for establishing the direct connection, which z. B. by soldering or welding allows significantly more cost-effective environmental conditions than in comparison to complex (wire) bonding processes.

• - Lötverfahren
• - Schweißverfahren (Zum Beispiel: Laser, Ultraschall,...)
• - Einpressverfahren
• - Kontaktieren

It can be advantageous if, in a mounting device according to the invention, the at least one frame contact is designed for connection to the associated at least one plate contact by at least one of the following connection methods:

• - soldering process
• - welding process (for example: laser, ultrasound, ...)
• - Press-in process
• - To contact

In comparison to direct connections, which are based exclusively on touching contact between the frame contact and the plate contact, an additional connection method, as it is e.g. B. in the preceding, non-exhaustive list, an increased service life of this direct connection is achieved. The mechanical strength of this direct connection is also improved. The connection methods are preferably designed in such a way that they can be carried out particularly inexpensively and, above all, quickly. In particular, the methods can be carried out in parallel with one another for several frame contacts at the same time, in particular for all frame contacts simultaneously. In addition to reducing the time required, this also results in a reduction in the requirements for the environmental conditions when carrying out such connection methods.

It is also advantageous if, in an assembly device according to the invention, the at least one frame contact has at least one spring section. This spring section has, in particular, a spring effect in the direction of or essentially in the direction opposite to a receiving direction of the printed circuit board in the frame. Is the frame z. B. fully closed, the circuit board can be used in this frame. This direction of insertion specifies a receiving direction of the circuit board in the frame. If a spring section with an opposite or essentially opposite spring action is provided for the frame contact, the frame contacts are bent against this spring action when the circuit board is inserted into the frame. In other words, after the circuit board has been inserted, the spring action generates a counterpressure against the circuit board in this way. If the circuit board is fixed in this position, e.g. B. by gluing, screwing, riveting or other connection methods, this touching contact, which is maintained between the frame contact and the plate contact by the spring action, is maintained. This touching contact can be sufficient as an electrically conductive direct connection without additional connection methods. For possible subsequent connection processes, such as soldering or welding, the preload due to the spring effect is advantageous, since no additional alignment efforts or positioning steps are necessary for the frame contact relative to the plate contact. The spring portion can, for. B. U-shaped, so that the spring effect can be provided solely by the structure of a preferably metallic frame contact. The longevity of an assembly device according to the invention is improved by the spring action. In particular in applications where vibrations and / or thermal expansion must be expected, the spring action can reduce wear on the circuit board due to bending or twisting. In particular with motor vehicles, In which a vehicle should be usable in temperature ranges between -40 ° C and +125 ° C, such an embodiment is therefore of great advantage.

It is also advantageous if, in an assembly device according to the invention, the frame has at least one stop section. This stop section defines a position of the circuit board relative to the frame by abutting the circuit board on the stop section for fastening the circuit board to the frame. This improves the assembly of an assembly device according to the invention. If the circuit board is inserted into the assembly device, a defined position is specified by the geometric correlation between the circuit board and the frame. The stop section is preferably a flat or slightly beveled section, which in particular additionally provides a centering effect through centering areas or centering sections which guide the circuit board into the final defined position. Such a stop section is preferably provided at least partially, preferably completely, circumferentially inside a closed frame of the assembly device.

It is also advantageous if, in a mounting device according to the invention, at least one external contact is provided for electrical contact with an electrical connection. The external contact is in an electrically conductive connection with the frame contact and is in particular formed integrally with the frame contact. This external contact is preferably designed to be relatively stiff, so that it only allows bending or twisting against great forces. He serves z. B. to put on an additional circuit board or plug contacts. If the assembly device with the inserted printed circuit board is fastened as an electronic module in an electronic unit, the external contact can serve to provide the further connections in an electronic unit. So plug-in contacts can be placed on these external contacts as well as additional circuit boards, such. B. PCBs.

The present invention also relates to an electronic module for the assembly of an electronic unit, having at least one printed circuit board and at least one assembly device with a frame and at least one frame contact. An electronic module according to the invention is characterized in that the circuit board is fastened or assembled to the frame and the at least one frame contact is electrically connected directly to an associated at least one plate contact. The attachment of the circuit board to a frame can, for. B. be done with the help of fasteners. Clamping or locking with the aid of clamping or snap-locking devices is also conceivable within the scope of the present invention. Such an electronic module is used in particular in electronic units of vehicles and machines or other control devices. An electronic module according to the invention is designed in particular with a mounting device according to the present invention. Accordingly, an electronic module according to the invention brings with it the same advantages as have been explained in detail with reference to an assembly device according to the invention.

In an electronic module according to the invention, it can be advantageous if at least the connection area of the at least one frame contact and the at least one plate contact or another sensitive connection of the electronic module (for example: Mosfets, connection sections, ...) with a protective layer, in particular a synthetic resin layer, is covered. This synthetic resin layer, which is referred to in particular as a glob top, provides additional protection for the contacts. It is of course also possible that this protective layer at least partially secures the connection of the contacts to one another. In contrast to connection methods such as soldering or welding, however, the material of the applied protective layer does not provide any electrical conductivity. Rather, it can be advantageous if the protective layer is designed to be electrically insulating. Compared to known electronic modules, in which an entire interior of the assembly device has to be completely encapsulated, a targeted application of the protective layer, preferably in liquid form, can result in significantly lower material consumption. The curing of a liquid applied synthetic resin is carried out in a known manner. In addition to the connection area of the contacts, the section of the printed circuit board which has electrically conductive components and conductor tracks is preferably also covered with the protective layer.

An electronic module according to the invention can be developed in such a way that the printed circuit board is essentially completely covered by the protective layer, the frame of the assembly device delimiting the protective layer, in particular circumferentially. In this way, compared to known electronic modules and known electronic units, a significantly reduced amount of material is required for the protective layer, in particular less resin. In addition to the material, weight can also be saved in this way for the entire device.

• - Zur-Verfügung-Stellen einer Montagevorrichtung mit einem Rahmen und zumindest einem Rahmenkontakt,
• - Befestigen einer Leiterplatte an dem Rahmen,
• - direktes Verbinden des zumindest einen Rahmenkontaktes mit einem zugehörigen wenigstens einen Plattenkontakt der Leiterplatte.

A method for producing an electronic module according to the invention is characterized by the following steps:

• - Providing a mounting device with a frame and at least one frame contact,
• - attaching a circuit board to the frame,
• - Direct connection of the at least one frame contact with an associated at least one plate contact of the circuit board.

Because the assembly device in particular is designed according to the invention, such a method has the same advantages as have been carried out in detail with reference to an assembly device according to the invention or with reference to an electronic module according to the invention.

• - Abdecken zumindest des Verbindungsbereichs des zumindest einen Rahmenkontaktes und des wenigstens einen Plattenkontaktes oder einer anderen sensiblen Verbindung des Elektronikmoduls (zum Beispiel: Mosfets, Verbindungsabschnitte,...) mit einer Schutzschicht, insbesondere einer Kunstharzschicht.

The method can be developed in such a way that at least the following step is carried out after the direct connection:

• - Covering at least the connection area of the at least one frame contact and the at least one plate contact or another sensitive connection of the electronic module (for example: Mosfets, connection sections, ...) with a protective layer, in particular a synthetic resin layer.

The layer is preferably applied in liquid form and then cured. In addition to the connection area, the further electrically active part of the circuit board, in particular electrical components and / or conductor tracks of the circuit board, can also be covered by such a protective layer.

• 1a eine erste Ausführungsform einer erfindungsgemäßen Montagevorrichtung,
• 1 b eine andere Ausführungsform einer erfindungsgemäßen Montagevorrichtung,
• 2 die Ausführungsform der 1a in Seitenansicht,
• 3 eine Ausführungsform eines erfindungsgemäßen Elektronikmoduls,
• 4 eine Ausführungsform einer erfindungsgemäßen Montagevorrichtung in schematischer Teilseitenansicht,
• 5 eine weitere Ausführungsform eines erfindungsgemäßen Elektronikmoduls in der Teilseitenansicht und
• 6 eine Ausführungsform erfindungsgemäßer Elektronikmodule in einer Elektronikeinheit.

The present invention is explained in more detail with reference to the accompanying drawings. The terms “left”, “right”, “top” and “bottom” used here relate to an alignment of the drawing figures with normally legible reference symbols. They show schematically:

• 1a a first embodiment of an assembly device according to the invention,
• 1 b another embodiment of an assembly device according to the invention,
• 2 the embodiment of the 1a in side view,
• 3 an embodiment of an electronic module according to the invention,
• 4th an embodiment of an assembly device according to the invention in a schematic partial side view,
• 5 a further embodiment of an electronic module according to the invention in the partial side view and
• 6th an embodiment of electronic modules according to the invention in an electronic unit.

The 1a and 2 show one possibility of an embodiment of a mounting device according to the invention 10 . This has a frame 20th on, which is formed substantially all the way around. The frame 20th is made of a plastic, preferably with the help of an injection molding process. As part of 20th frame contacts are embedded 30th . These frame contacts 30th extend completely into the interior space of the frame 20th is surrounded. At the same time there are external contacts 40 provided, which is outwardly outside the frame 20th extend. So there are external contacts on the bottom left and top right 40 to see which extend essentially radially outward. At the rear upper end of the frame 20th are also external contacts 40 shown, which allow a contact to the top. 1b shows the possibility of another embodiment of the mounting device 10 . Such a mounting device 10 has a frame 20th made of plastic. Some frame contacts 30th are embedded in the frame. External contacts 40 are also provided. Another framework 20th frames the protective layer.

In the embodiment of 1a and 2 becomes the assembly jig 10 used to be a circuit board 110 to use. The state used is z. B. the 3 refer to. So was z. B. the circuit board 110 in 2 from below against the frame 20th pressed and then an additional connection process between the plate contacts 120 and the frame contacts 30th carried out. In 4th shows the situation after such an onset. A schematic partial view clearly shows that a frame contact 30th with a substantially U-shaped spring section 32 is trained. From below is the circuit board 110 in the frame 20th used and attached to this. To a precisely defined position of the circuit board 110 to be able to provide, the framework 20th a stop section 22nd on against which the circuit board 110 is pressed. In this position, the spring section 32 preferably a force effect downwards, i.e. against the direction of insertion of the circuit board 110 upset. In this position can also be used for the direct connection between the frame contact 20th and the plate contact 120 a connection procedure can be carried out. It is possible, for example, to use a soldering process or a welding process to create a material-locking connection as a direct connection between the frame contact 30th and the plate contact 120 to manufacture. Additional material or part of the plate contact can be used 120 and / or part of the material of the frame contact 30th be melted.

In 5 the situation is shown, which more exactly the alignment of the stop section 22nd shows. In addition, it is easy to see here that the connection area 140 between the frame contact 30th and the plate contact 120 with a protective layer 150 is covered. This protective layer 150 was applied in liquid form and cured in the form of synthetic resin. This protective layer 150 is preferably designed to be electrically insulating.

The 6th shows an application situation for assembly device according to the invention or electronic modules according to the invention 100 . This is a control unit as an electronic unit 200 , in which three electronic modules 100 are used. With regard to the assembly steps, the individual assembly of the circuit boards takes place first 110 in the respective assembly device 10 . If necessary, one or more additional connection steps for the direct connection between the frame contacts can then be performed 30th and the plate contacts 120 be performed. Once this has been done, the assembly devices are connected 10 as electronic modules 100 into the electronics unit 200 used. For full functionality, the external contacts 40 for further external contacts of the electronic modules 100 serve. In this embodiment, the individual electronic modules can be poured out 100 separately with a protective layer 150 , for example with resin. The frames 20th the assembly devices 10 limit this protective layer 150 so that the rest of the interior space of the electronics unit 200 In contrast to known electronic units with bonding wires no longer has to be filled out. In this way a lot of material becomes the protective layer 150 and thus also the weight of the electronics unit 200 saved.

List of reference symbols

10

Assembly device

20th

frame

22nd

Stop section

30th

Frame contact

32

Spring section

40

Outside contact

100

Electronics module

110

Circuit board

120

Plate contact

140

Connection area

150

Protective layer

200

Electronics unit

Claims (6)

Electronic module (100) for mounting in an electronic unit (200), comprising at least one circuit board (110) and at least one mounting device (10) with a frame (20) made of plastic and at least one frame contact (30) embedded in the frame, the circuit board (110) is fastened or assembled on the frame (20) and the at least one frame contact (30) is connected directly to an associated at least one plate contact (120) on the circuit board (110) in an electrically contacting manner, at least one external contact (40) of the A mounting device (10) is provided for making electrical contact with an electrical connection, the external contact (40) being in an electrically conductive connection with the frame contact (30) and being integrally formed with the frame contact (30), the at least one frame contact (30 ) has at least one spring section (32) which has a spring action in the direction or essentially in the direction opposite to an A. Has the receiving direction or assembly direction of the circuit board (110) in the frame (20). Electronics module after Claim 1 , characterized in that the at least one frame contact (30) is designed for a connection to the associated at least one plate contact (120) by at least one of the following connection methods: - soldering method - welding method - press-fit method - contacting. Electronics module after Claim 1 or 2 , characterized in that the frame (20) has at least one stop section (22) which determines a position of the circuit board (110) relative to the frame (20) by stopping the circuit board (110) on the stop section (22) for fastening the circuit board (110) defined on the frame (20). Electronic module (100) according to one of the Claims 1 to 3 characterized in that at least the connection area (140) of the at least one frame contact (30) and of the at least one plate contact (120) is covered with an electrically insulating protective layer (150). Electronics module (100) Claim 4 , characterized in that the circuit board (110) is substantially completely covered by the protective layer (150), the frame (20) of the Mounting device (10) limits the protective layer (150) circumferentially. Electronic module according to one of the Claims 4 or 5 , characterized in that the protective layer is a synthetic resin layer.

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