DE102012108859A1 - Assembly device for electronic module for assembly of electric unit, has frame contact that is arranged on the frame, and is in electrical contact with board contact of circuit board - Google Patents

Abstract

The assembly device (10) has a frame (20) for mounting a printed circuit board, and a frame contact (30) for electrical contacting of board contact of circuit board. The frame contact is arranged on the frame and is provided with U-shaped spring portion. The printed circuit board is designed for a direct connection with frame through associated board contact and frame contact. The frame is provided with a stop portion that is pressed against the circuit board. Independent claims are included for the following: (1) electronic module; and (2) method for manufacturing electronic module.

Description

The present invention relates to a mounting device, an electronic module for mounting in an electronics unit and a method for producing an electronic module.

Electronic modules and mounting devices for mounting an electronic module in an electronics unit are known in principle. For example, the shows DE 100 48 377 A1 such a technical solution. In known electronic modules mounting devices are used, which often have a frame-like structure. This frame-like structure serves to fix a printed circuit board in a desired position on this frame. To contact printed circuit boards located on the circuit board and electrical components with contacts outside the circuit board, frame contacts are provided in known mounting devices. These frame contacts are connected via a separate connection method with corresponding contact areas or contact portions of the circuit board. The common and known method for this is the so-called (wire) bonding. In this case, a liquid metal drop is applied to one of the two contacts, and then a bonding wire or a bonding tape is led to the second contact. At the second contact also takes place again melting, creating a firm connection to two electrical contacts. The two contacts are electrically connected to each other via this bonding wire or the bonding tape.

The disadvantage is that the effort for the above-described (wire) bonding method is relatively high. So it is relatively time-consuming, since usually only a single (wire) bonding step for the connection of two associated contacts can be performed. For a large number of contacts, this corresponds to a large number of successive individual steps, so that a high amount of time is required. It is likewise disadvantageous that particularly stringent environmental conditions are required for the (wire) bonding process.

In particular, a clean room situation under defined temperature conditions is required to perform such a (wire) bonding process. Another disadvantage is the high space requirement for the bonding wire and the corresponding distance between the associated contacts, which is bridged by the bonding wire.

It is an object of the present invention to at least partially overcome the disadvantages described above. In particular, it is an object of the present invention to provide a mounting device, an electronic module and a method for producing an electronic module are available, which allow in a cost effective and simple manner a mounting in particular small space.

The above object is achieved by a mounting device having the features of claim 1, an electronic module having the features of claim 6 and by a method having the features of claim 10. Further features and details of the invention will become apparent from the dependent claims, the description and the drawings , In this case, features and details that are described in connection with the mounting device according to the invention apply, of course, in connection with the inventive method and the electronic module according to the invention and in each case vice versa, so that with respect. The disclosure of the individual aspects of the invention is always reciprocally referred to or can be ,

A mounting device according to the invention has a frame for the attachment or assembly of a printed circuit board. Furthermore, at least one frame contact is provided for the electrical contacting of at least one plate contact of the printed circuit board. A mounting device according to the invention is characterized in that the at least one frame contact is arranged on the frame in such a way that, when the circuit board is fastened or assembled to the frame, it is designed for a direct connection to the associated at least one plate contact. According to the invention can be dispensed with a complicated (wire) bonding method. A direct connection between the frame contact and the plate contact can be carried out in different ways. So it is z. B. possible that comes for the direct connection only a touching contact in question. Also, further connection steps, such. As soldering or welding, are conceivable in the context of the present invention for a direct connection.

A frame of the mounting device according to the invention z. B. made of a particularly inexpensive material. In particular, a plastic (eg polyethylene or polystyrene) is used for this purpose. In a plastic version, moreover, an electrical insulation between the individual frame contacts relative to one another can be provided in a particularly cost-effective and simple manner. The frame is also preferably designed to have sufficient mechanical rigidity to allow attachment of the circuit board.

The attachment or assembly of the circuit board to the frame can be carried out in various ways. So z. B. a pure Hininklemmen about snap-locking or clamping connections conceivable. Also, a fastening by means of rivet or screw is possible. Complete bonding to the frame can also be carried out in the context of the present invention.

The plate contacts may be separately formed contacts or individual electrically conductive portions of the circuit board. Each printed circuit board can be designed in many different ways. So z. B. so-called PCBs (Printed circuid boards) possible. Also so-called DCBs having a structure with at least one ceramic layer are conceivable within the scope of the present invention.

Decisive advantages of a mounting device according to the invention are firstly the cost-effective and rapid production and secondly the small footprint.

Due to the direct connection between the frame contacts and the associated plate contacts the space for the entire mounting device can be reduced. Due to the fact that no (wire) bonding process has to be used, the cost and material cost of this direct connection is also reduced. Last but not least, depending on the connection method, for establishing the direct connection, a method can be selected which z. B. by soldering or welding significantly cheaper environmental conditions, as compared to complex (wire) bonding method.

• – Lötverfahren
• – Schweißverfahren (Zum Beispiel: Laser, Ultraschall, ...)
• – Einpressverfahren
• – Kontaktieren

It may be advantageous if, in a mounting device according to the invention, the at least one frame contact is designed for connection to the associated at least one plate contact by at least one of the following connection methods:

• - Soldering
• - welding process (for example: laser, ultrasound, ...)
• - Press-fitting process
• - To contact

Compared to direct connections, which are based solely on touching contact between the frame contact and the plate contact, by an additional connection method, as z. As listed in the above, non-exhaustive list, achieved an increased life of this direct connection. Also, the mechanical strength of this direct connection is improved. Preferably, the connection methods are designed such that they can be carried out particularly inexpensively and above all quickly. In particular, the methods can be performed parallel to one another for a plurality of frame contacts simultaneously, in particular for all frame contacts simultaneously. In addition to the reduction of the time required, a reduction of the environmental conditions in carrying out such connection methods is thus achieved.

It is also advantageous if, in a mounting device according to the invention, the at least one frame contact has at least one spring section. In particular, this spring section has a spring action in the direction or substantially in the direction opposite to a receiving direction of the printed circuit board in the frame. Is the frame z. B. fully closed, the circuit board can be used in this context. This insertion direction indicates a receiving direction of the circuit board in the frame. If a spring section with an opposite or essentially opposite spring action is provided for the frame contact, then the frame contacts are bent against this spring effect by inserting the printed circuit board into the frame. In other words, the spring effect generated after insertion of the circuit board in this way a back pressure against the circuit board. If the circuit board is fixed in this position, z. As by gluing, screws, rivets or other connection methods, so this contact remains maintained reinforced between the frame contact and the plate contact by the spring action. Thus, even without additional connection method, this contacting contact can be sufficient as an electrically conductive direct connection. For possible subsequent joining methods, such as soldering or welding, the bias is advantageous by the spring action, since no additional Ausrichtbemühungen or positioning steps for the frame contact relative to the plate contact are necessary. The spring section can, for. B. U-shaped, so that the spring effect can be provided only by the structure of a preferably metallic frame contact. By the spring effect, the longevity of a mounting device according to the invention is improved. In particular, in applications where must be expected with vibration and / or thermal expansion, wear of the circuit board by bending or twisting can be reduced by the spring effect. In particular, in motor vehicles in which a vehicle is to be used in temperature ranges between -40 ° C and + 125 ° C, such an embodiment is therefore of great advantage.

It is also advantageous if in a mounting device according to the invention the frame has at least one stop portion. This abutment portion defines a position of the circuit board relative to the frame by abutting the circuit board to the abutment portion for attaching the circuit board to the frame. Thus, the assembly of a mounting device according to the invention is improved. If the printed circuit board is inserted into the mounting device, then a defined position is predetermined by the geometric correlation between the printed circuit board and the frame. The abutment portion is preferably a flat or slightly bevelled portion, which in particular additionally provides a centering effect by centering or centering sections, which guide the circuit board in the final defined position. Preferably, such a stop portion is at least partially, preferably completely, circumferentially provided inside a closed frame of the mounting device.

It is also advantageous if, in a mounting device according to the invention, at least one external contact is provided for electrical contacting with an electrical connection. In this case, the external contact is in electrically conductive connection with the frame contact, and in particular is formed integrally with the frame contact. This external contact is preferably made relatively stiff, so that it allows a bending or twisting only against large forces. He serves z. B. for putting on an additional circuit board or plug contacts. If the mounting device with the printed circuit board inserted is fastened as an electronic module in an electronics unit, the external contact can serve to provide the further connections in an electronic unit. So plug-shaped plug contacts can be placed on these external contacts as well as additional circuit boards, z. B. PCBs.

Likewise provided by the present invention is an electronic module for mounting an electronics unit, comprising at least one printed circuit board and at least one mounting device with a frame and at least one frame contact. An inventive electronic module is characterized in that the circuit board is attached or assembled to the frame and the at least one frame contact is electrically connected directly to an associated at least one plate contact. The attachment of the circuit board to a frame can, for. B. with the help of fasteners. The clamping or latching by means of clamping or snap-locking devices is conceivable within the scope of the present invention. Such an electronic module is used in particular in electronic units of vehicles and machines or other control devices. An inventive electronic module is formed in particular with a mounting device according to the present invention. Accordingly, an electronic module according to the invention brings the same advantages as have been explained in detail with reference to a mounting device according to the invention.

In the case of an electronic module according to the invention, it can be advantageous if at least the connection region of the at least one frame contact and the at least one plate contact or another sensitive connection of the electronic module (for example: Mosfets, connecting sections,...) With a protective layer, in particular a synthetic resin layer, is covered. This synthetic resin layer, which is referred to in particular as globtop, serves for additional protection of the contacts. Of course, it is also possible that this protective layer at least partially secures the connection of the contacts with each other. Unlike bonding methods such as soldering or welding, however, no electrical conductivity is provided by the material of the applied protective layer. Rather, it may be advantageous if the protective layer is formed electrically insulating. In comparison to known electronic modules, in which an entire interior of the mounting device must be completely potted, a targeted application of the protective layer, preferably in liquid form, can bring a significantly lower material consumption. The curing of a liquid applied resin is carried out in a known manner. Preferably, in addition to the connecting region of the contacts, the section of the printed circuit board is also covered with the protective layer, which has electrically conductive components and conductor tracks.

An electronic module according to the invention can be further developed such that the printed circuit board is substantially completely covered by the protective layer, wherein the frame of the mounting device limits the protective layer, in particular circumferentially. In this way, in comparison to known electronic modules and known electronic units, a significantly reduced amount of material for the protective layer, in particular less resin necessary. In addition to the material weight in the entire device can be saved in this way.

• – Zur-Verfügung-Stellen einer Montagevorrichtung mit einem Rahmen und zumindest einem Rahmenkontakt,
• – Befestigen einer Leiterplatte an dem Rahmen,
• – direktes Verbinden des zumindest einen Rahmenkontaktes mit einem zugehörigen wenigstens einen Plattenkontakt der Leiterplatte.

Another object of the present invention is a method for producing an electronic module, in particular comprising the features of an electronic module according to the invention. Such a method is characterized by the following steps:

• Providing a mounting device with a frame and at least one frame contact,
• Attaching a circuit board to the frame,
• - Direct connection of the at least one frame contact with an associated at least one plate contact of the circuit board.

Due to the fact that, in particular, the mounting device is designed according to the invention, a method according to the invention brings about the same advantages as have been described in detail with reference to a mounting device according to the invention or with reference to an electronic module according to the invention.

• – Abdecken zumindest des Verbindungsbereichs des zumindest einen Rahmenkontaktes und des wenigstens einen Plattenkontaktes oder einer anderen sensiblen Verbindung des Elektronikmoduls (zum Beispiel: Mosfets, Verbindungsabschnitte, ...) mit einer Schutzschicht, insbesondere einer Kunstharzschicht.

A method according to the invention can be developed such that after the direct connection at least the following step is carried out:

• - Covering at least the connection region of the at least one frame contact and the at least one plate contact or other sensitive connection of the electronic module (for example: Mosfets, connecting sections, ...) with a protective layer, in particular a synthetic resin layer.

The layer is preferably applied in liquid form and then cured. In addition to the connection region, the further electrically active part of the printed circuit board, in particular electrical components and / or printed conductors of the printed circuit board, can also be covered by such a protective layer.

The present invention will be explained in more detail with reference to the accompanying drawing figures. The terms "left", "right", "top" and "bottom" used herein refer to an alignment of the drawing figures with normally readable reference numerals. They show schematically:

1a a first embodiment of a mounting device according to the invention,

1b another embodiment of a mounting device according to the invention,

2 the embodiment of the 1a in side view,

3 an embodiment of an electronic module according to the invention,

4 an embodiment of a mounting device according to the invention in a schematic partial side view,

5 a further embodiment of an electronic module according to the invention in the partial side view and

6 An embodiment of electronic modules according to the invention in an electronic unit.

The 1a and 2 show a possibility of an embodiment of a mounting device according to the invention 10 , This has a frame 20 on, which is designed substantially fully rotating. The frame 20 is made of a plastic, preferably by means of an injection molding process. As part of 20 embedded are frame contacts 30 , These frame contacts 30 extend completely into the interior, which of the frame 20 is surrounded. At the same time are external contacts 40 provided, which are outward outside the frame 20 extend. So are left below and top right external contacts 40 to recognize which extend substantially radially outward. At the rear upper end of the frame 20 are also external contacts 40 shown, which allow a contact to the top. 1b shows the possibility of another embodiment of the mounting device 10 , Such a mounting device 10 has a frame 20 made of plastic. Some frame contacts 30 are embedded in the frame. external contacts 40 are also provided. Another frame 20 framed the protective layer.

In the embodiment of the 1a and 2 becomes the mounting device 10 used a printed circuit board 110 use. The inserted state is z. B. the 3 refer to. So z. B. the circuit board 110 in 2 from below against the frame 20 and then an additional connection method between the plate contacts 120 and the frame contacts 30 carried out. In 4 the situation is shown after such an insertion. In a schematic partial view can be clearly seen that a frame contact 30 with a substantially U-shaped spring section 32 is trained. From below is the circuit board 110 in the frame 20 used and attached to this. To a well-defined position of the circuit board 110 to provide, the frame points 20 a stopper section 22 on, against which the circuit board 110 is pressed. In this position is by the spring section 32 preferably a downward force, ie against the insertion direction of the circuit board 110 applied. In this position can additionally for the direct connection between the frame contact 20 and the plate contact 120 a connection procedure be carried out. So it is possible that a soldering or welding process is used to make a material-locking connection as a direct connection between the frame contact 30 and the panel Contact 120 manufacture. In this case, additional material may be used or part of the plate contact 120 and / or a portion of the material of the frame contact 30 be melted.

In 5 the situation is shown, which is even more accurate the orientation of the stopper section 22 shows. In addition, here is good to see that the connection area 140 between the frame contact 30 and the plate contact 120 with a protective layer 150 is covered. This protective layer 150 was applied liquid and cured in the form of synthetic resin. This protective layer 150 is preferably formed electrically insulating.

The 6 shows an application situation for inventive mounting device or inventive electronic modules 100 , This is a control unit as an electronic unit 200 into which three electronic modules 100 are used. With regard to the assembly steps, the individual assembly of the printed circuit boards takes place first 110 in the respective mounting device 10 , Then, if necessary, one or more additional connection steps for the direct connection between the frame contacts 30 and the plate contacts 120 be performed. When this is done, the finished connected fixtures 10 as electronic modules 100 in the electronics unit 200 used. For full functionality, the external contacts 40 for further external contacts of the electronic modules 100 serve. In this embodiment, a pouring of the individual electronic modules 100 separately with a protective layer 150 , for example with resin. The frames 20 the mounting devices 10 limit this protective layer 150 so that the remaining interior space of the electronics unit 200 in contrast to known electronic units with bonding wires no longer needs to be filled. In this way, a lot of material of the protective layer 150 and at the same time weight of the electronics unit 200 saved.

The above explanation of the embodiments describes the present invention solely by way of example. Of course, individual features of the embodiment, if technically feasible, can be combined freely with one another without departing from the scope of the present invention.

LIST OF REFERENCE NUMBERS

10

mounter

20

frame

22

stop section

30

frame Contact

32

spring section

40

outside Contact

100

electronic module

110

circuit board

120

panel Contact

140

connecting area

150

protective layer

200

electronics unit

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 10048377 A1 [0002]

Claims (11)

Mounting device ( 10 ) comprising a frame ( 20 ) for the attachment or assembly of a printed circuit board ( 110 ) and at least one frame contact ( 30 ) for the electrical contacting of at least one plate contact ( 120 ) of the printed circuit board ( 110 ), characterized in that the at least one frame contact ( 30 ) on the frame ( 20 ) is arranged, that this at on the frame ( 20 ) mounted or assembled circuit board ( 110 ) for a direct connection to the associated at least one plate contact ( 120 ) is trained. Mounting device ( 10 ) according to claim 1, characterized in that the at least one frame contact ( 30 ) for connection to the associated at least one plate contact ( 120 ) is formed by at least one of the following joining methods: - soldering method - welding method (for example: laser, ultrasonic, ...) - press-in method - contacting Mounting device ( 10 ) according to one of the preceding claims, characterized in that the at least one frame contact ( 30 ) at least one spring section ( 32 ), which in particular a spring action in the direction or substantially in the direction opposite to a receiving direction or assembly direction of the printed circuit board ( 110 ) as part of ( 20 ) having. Mounting device ( 10 ) according to one of the preceding claims, characterized in that the frame ( 20 ) at least one stop section ( 22 ) having a position of the printed circuit board ( 110 ) relative to the frame ( 20 ) by abutment of the printed circuit board ( 110 ) at the stop section ( 22 ) for the attachment of the printed circuit board ( 110 ) on the frame ( 20 ) Are defined. Mounting device ( 10 ) according to one of the preceding claims, characterized in that at least one external contact ( 40 ) is provided for an electrical contact with an electrical connection, wherein the external contact ( 40 ) with the frame contact ( 30 ) is in electrically conductive connection, in particular integrally with the frame contact ( 30 ) is trained. Electronic module ( 100 ) for mounting in an electronics unit ( 200 ), comprising at least one printed circuit board ( 110 ) and at least one mounting device ( 10 ) with a frame ( 20 ) and at least one frame contact ( 30 ), characterized in that the printed circuit board ( 110 ) on the frame ( 20 ) is attached or assembled and the at least one frame contact ( 30 ) directly with an associated at least one plate contact ( 120 ) is connected electrically contacting. Electronic module ( 100 ) according to claim 6, characterized in that the mounting device ( 10 ) has the features of one of claims 1 to 5. Electronic module ( 100 ) according to one of claims 6 or 7, characterized in that at least the connecting region ( 140 ) of the at least one frame contact ( 30 ) and the at least one disk contact ( 120 ) with a protective layer ( 150 ), in particular a synthetic resin layer is covered. Electronic module ( 100 ) according to claim 8, characterized in that the printed circuit board ( 110 ) substantially completely from the protective layer ( 150 ), the framework ( 20 ) of the mounting device ( 10 ) the protective layer ( 150 ), in particular circumferential. Method for producing an electronic module ( 100 ), in particular having the features of one of claims 6 to 9, characterized by the following steps: - providing a mounting device ( 10 ) with a frame ( 20 ) and at least one frame contact ( 30 ), - fixing a printed circuit board ( 110 ) on the frame ( 20 ), - directly connecting the at least one frame contact ( 30 ) with an associated at least one plate contact ( 120 ) of the printed circuit board ( 110 ). A method according to claim 10, characterized in that after the direct connection at least the following step is performed: - covering at least the connection area ( 140 ) of the at least one frame contact ( 30 ) and the at least one disk contact ( 120 ) with a protective layer ( 150 ), in particular a synthetic resin layer.

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