EP2923536A1 - Compensation de potentiel dans un appareil de commande pour un véhicule automobile - Google Patents

Compensation de potentiel dans un appareil de commande pour un véhicule automobile

Info

Publication number
EP2923536A1
EP2923536A1 EP13779122.4A EP13779122A EP2923536A1 EP 2923536 A1 EP2923536 A1 EP 2923536A1 EP 13779122 A EP13779122 A EP 13779122A EP 2923536 A1 EP2923536 A1 EP 2923536A1
Authority
EP
European Patent Office
Prior art keywords
contacting element
circuit carrier
arrangement according
surface coating
motor vehicle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP13779122.4A
Other languages
German (de)
English (en)
Inventor
Nikolaus Taschner
Bernhard Schuch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of EP2923536A1 publication Critical patent/EP2923536A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49224—Contact or terminal manufacturing with coating

Definitions

  • the invention relates to an arrangement for equipotential bonding in a control device for a motor vehicle, a method for producing a potential equalization in a control device and a control device with a corresponding arrangement.
  • a Massebond is required mainly for reasons of electromagnetic compatibility to the mass offset between the gear housing, d. H. balance the mass of the vehicle and the control unit.
  • ground denotes the electrical reference potential for signal and operating voltages in the vehicle or control unit. So far, this is usually a direct bond from the circuit board provided on a base plate of the control unit made of aluminum.
  • the bonding surface must be machined. This causes additional production costs, as otherwise no further processing is necessary here.
  • One difficulty is that the bonding surface may be contaminated or that the bonding surface does not meet the surface roughness requirements with regard to roughness, and thus no secure bond connection is ensured, which may entail repairs.
  • the ground bond is placed directly on the die-cast aluminum baseplate.
  • a machined surface is required, for example, a milled surface.
  • the base plate must be washed, for example, with perchlorethylene, in particular degreased to the strict cleanliness and Surface requirements to meet. This is an expensive and, in particular, environmentally damaging process.
  • the invention is therefore based on the object to provide a control device for a motor vehicle and a method for its production, in which the Potentiaiausrete Sammlung the circuit substrate is simplified to the transmission housing.
  • the core of the arrangement according to the invention consists in that at least one contacting element, which electrically connects the circuit carrier to the carrier structure by means of a connecting element in order to produce a potential equalization, has a bondable surface coating.
  • this surface coating on the contacting element of galvanically or chemically deposited.
  • the contacting element can be completely or even partially coated, whereby advantageously one or more defined bondable surfaces can arise.
  • the coated contacting element which is non-positively or positively connected to the support structure, for. B. designed as a screw or rivet, a screw can be very easily mounted.
  • the support structure is formed at least as a part, in particular as a base plate of the control unit housing, for example made of aluminum.
  • the circuit carrier comprises a printed circuit board, in particular with a ceramic substrate, wherein in particular the connecting element between see circuit carrier and carrier structure can be designed specifically as a ground bond.
  • the method according to the invention enables a particularly simple establishment of a potential equalization between a circuit carrier of a control device and its housing.
  • a control device with a circuit carrier and a carrier structure or base plate together with a connecting element and a contacting element are provided, wherein the contacting element has a bondable surface coating.
  • this compound is also electrically conductive.
  • a screw with a corresponding surface coating is screwed into a corresponding threaded opening of a housing base plate.
  • an electrically conductive connection between the contacting element and the circuit carrier mitteis of the connecting element for.
  • a Dickdrahtbond made of aluminum.
  • a control device 1 for a motor vehicle in particular a transmission control device comprises a housing for receiving an electrical component 6, a support structure 2, at least one side wall 8 and a lid, not shown here.
  • the base plate 2 may also be formed integrally with the side wall 8.
  • the electrical component 6 is mounted on a circuit carrier 4, z.
  • a circuit carrier 4 As a circuit board, arranged, for example, glued or soldered.
  • the circuit carrier 4 again rum is on the support structure, in particular a dimensionally stable Gmndplatte 2 Aiuminiumdruckguss arranged, in particular glued.
  • the contacting element is designed in this case as a screw, in particular an external hex screw with a screw head with several different defined surfaces.
  • a screw in particular an external hex screw with a screw head with several different defined surfaces.
  • only the top of the screw head is provided with a bondable surface coating 5.
  • the coated screw 7 is here screwed non-positively and electrically conductive in a corresponding threaded opening of the base plate 2.
  • the screw 7 is screwed into the threaded opening of the base plate 2 such that after production of the frictional connection of the screw head complains to the base plate 2 is.
  • the screw head could also be completely screwed into the base plate 2, whereby the electrically conductive surface between the screw 7 and base plate 2 would be increased.
  • connection element 7 is electrically conductively connected to the bondable surface coating 5 of the screw 7 by means of the connecting element 3.
  • the connecting element is designed as a thick-wire bond 3 made of aluminum.
  • any other type of wire or ribbon connection would be possible, e.g. as aluminum thin wire, gold wire, copper wire, copper tapes or aluminum tapes possible.
  • metallic or non-metallic and hitherto non-bondable materials which have an electrical conductivity can also be connected to each other in a process-reliable or process-reliable manner with a defined potential and a low contact resistance. Material differences in the housing components to be connected have a significantly lower influence on the bonding process.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Power Steering Mechanism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne un dispositif servant à la compensation de potentiel dans un appareil de commande (1) destiné à un véhicule automobile. Ledit dispositif comprend : au moins un composant électrique (6) sur un support de circuit (4), une structure porteuse (2) sur laquelle est disposé le support de circuit (4), et au moins un élément de connexion (7) qui, pour réaliser une compensation de potentiel, établit une liaison électroconductrice entre le support de circuit (4) et la structure porteuse (2) au moyen d'un élément de liaison (3), l'élément de connexion (7) présentant un revêtement de surface (5) pouvant être métallisé.
EP13779122.4A 2012-11-23 2013-09-26 Compensation de potentiel dans un appareil de commande pour un véhicule automobile Ceased EP2923536A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012111334.3A DE102012111334A1 (de) 2012-11-23 2012-11-23 Potentialausgleich in einem Steuergerät für ein Kraftfahrzeug
PCT/DE2013/200188 WO2014079421A1 (fr) 2012-11-23 2013-09-26 Compensation de potentiel dans un appareil de commande pour un véhicule automobile

Publications (1)

Publication Number Publication Date
EP2923536A1 true EP2923536A1 (fr) 2015-09-30

Family

ID=49385073

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13779122.4A Ceased EP2923536A1 (fr) 2012-11-23 2013-09-26 Compensation de potentiel dans un appareil de commande pour un véhicule automobile

Country Status (5)

Country Link
US (1) US10010017B2 (fr)
EP (1) EP2923536A1 (fr)
JP (1) JP2016506615A (fr)
DE (2) DE102012111334A1 (fr)
WO (1) WO2014079421A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017146161A1 (fr) 2016-02-26 2017-08-31 日本電気株式会社 Système de vérification faciale, dispositif de vérification faciale, procédé de vérification faciale et support d'enregistrement
KR20170106055A (ko) 2016-03-11 2017-09-20 삼성전자주식회사 서비스를 제공하기 위한 gui를 제공하는 영상 출력 장치 및 영상 출력 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008113323A1 (fr) * 2007-03-19 2008-09-25 Conti Temic Microelectronic Gmbh Connexion de mise à la masse
US20120222892A1 (en) * 2011-03-03 2012-09-06 Skyworks Solutions, Inc. Wire bond pad system and method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63195977A (ja) * 1987-02-10 1988-08-15 株式会社東芝 電気回路ユニットの接地機構
DE4428319C2 (de) * 1994-08-10 1996-08-14 Duerrwaechter E Dr Doduco Träger aus einem Kunststoff für eine elektronische Schaltung mit bondbaren Kontaktstiften
JP3508692B2 (ja) * 2000-04-28 2004-03-22 アイシン・エィ・ダブリュ株式会社 電子装置のアース接続装置
KR100625971B1 (ko) 2003-10-10 2006-09-20 삼성에스디아이 주식회사 회로기판의 결합구조 및 접지구조가 개선된 플라즈마디스플레이 장치
WO2008038681A1 (fr) * 2006-09-26 2008-04-03 Hitachi Metals, Ltd. Composant de substrat céramique et composant électronique utilisant celui-ci
DE202008002149U1 (de) * 2008-02-16 2008-04-30 Harting Electronics Gmbh & Co. Kg Leiterkarten-Steckverbinder mit Masseanschluss

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008113323A1 (fr) * 2007-03-19 2008-09-25 Conti Temic Microelectronic Gmbh Connexion de mise à la masse
US20120222892A1 (en) * 2011-03-03 2012-09-06 Skyworks Solutions, Inc. Wire bond pad system and method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014079421A1 *

Also Published As

Publication number Publication date
US10010017B2 (en) 2018-06-26
JP2016506615A (ja) 2016-03-03
WO2014079421A1 (fr) 2014-05-30
DE112013005638A5 (de) 2015-08-06
US20150289422A1 (en) 2015-10-08
DE102012111334A1 (de) 2014-05-28

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