EP2900849A1 - Élément de contact électrique - Google Patents

Élément de contact électrique

Info

Publication number
EP2900849A1
EP2900849A1 EP13756807.7A EP13756807A EP2900849A1 EP 2900849 A1 EP2900849 A1 EP 2900849A1 EP 13756807 A EP13756807 A EP 13756807A EP 2900849 A1 EP2900849 A1 EP 2900849A1
Authority
EP
European Patent Office
Prior art keywords
layer
contact element
nickel
electrical contact
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13756807.7A
Other languages
German (de)
English (en)
Inventor
Alexander Meyerovich
Frank Brode
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harting Stiftung and Co KG
Original Assignee
Harting AG and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harting AG and Co KG filed Critical Harting AG and Co KG
Publication of EP2900849A1 publication Critical patent/EP2900849A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel

Definitions

  • the invention relates to an electrical contact element according to the
  • Such contact elements are often in insulators of
  • Contact elements can be designed as pin or socket contacts.
  • DE 699 17 7620 T2 shows an aqueous electrolyte bath for the electrolytic deposition of a metal-ion tungsten alloy.
  • gold or a gold alloy can be deposited on such an alloy.
  • Gold coating of pretreated metal bodies In the method, a pulse current is used to prevent the formation of passive layers on the metal bodies.
  • a galvanic process with pulse current is very complicated to control and has a high source of error. Under certain circumstances, a lot of waste can be produced.
  • the object of the invention is to provide a galvanic
  • Contact elements consist of a metallic base body, which can either be milled out of solid material or punched out of a flat metal sheet in punching technology.
  • the basic bodies are often present either as bulk material or strip material.
  • brass or bronze as a base material is particularly advantageous and can be deposited on these bodies well different layers.
  • the base bodies are degreased.
  • an electrolytic degreasing is advantageously selected.
  • a cold degreasing, a hot degreasing or a combination of different degreasing methods can be selected.
  • the electrolytically defatted main body preferably with distilled water, rinsed to remove any existing chemical residues.
  • step (d) is galvanically a
  • Nickel layer deposited In a following process step (e), the first coated base body is rinsed again.
  • step (f) is galvanically a
  • Nickel alloy deposited on the nickel layer is a nickel-tungsten or nickel-molybdenum or nickel-cobalt or nickel-tin alloy. These nickel alloys are particularly suitable for depositing gold or a gold alloy. Subsequently, the base body thus treated is rinsed again in a subsequent process step (g).
  • Pulse current method is applied.
  • gold alloy surfaces with an average roughness of less than 0.1 micrometer ( ⁇ ) can be achieved.
  • Contact elements with a low surface roughness enable a high number of mating cycles.
  • the low roughness reduces the friction and thereby slows the wear of the contact surface (gold layer or gold alloy layer).
  • the finished contact element produced in the above method consists of a metallic base body, which is preferably formed from brass or bronze. On the body is a nickel layer
  • ⁇ 0.2 microns
  • ⁇ a thickness of 0.2 microns ( ⁇ ) to a maximum of 3 microns ( ⁇ ), more preferably, however, a thickness of 0.2 ⁇ to a maximum of 1 ⁇ owns.
  • This nickel layer is in turn coated by a nickel alloy, which also has a thickness of 1 micron ( ⁇ ) to a maximum of 3 microns ( ⁇ ).
  • a gold layer or gold alloy layer is applied, which is about 1 micron ( ⁇ ) strong and has an average roughness Ra of 0.1 microns ( ⁇ ) or less.
  • the hardness of the nickel alloy layer (second layer) is greater than the hardness of the base body material and / or the nickel layer (first layer) applied thereon.
  • a very thin gold or gold alloy layer is sufficient.
  • the electrical resistance of the second layer is less than the electrical resistance of the
  • Base body and / or the first layer This is only a very thin and smooth galvanic gold deposition or
  • the electrical resistance of the second layer is between 15 and 30 milliohms ( ⁇ ⁇ ).
  • FIG. 1 shows a sketch of a body provided with different galvanic layers.
  • the main body 1 is made of steel, brass or bronze.
  • the shape of the main body 1 already corresponds substantially to the shape of a finished contact element.
  • the contact elements may be pin or socket contacts, but also insulation displacement terminals.
  • a first layer 2 is galvanically deposited on the base body. It is a nickel layer. The first layer has a layer thickness between one and three microns (0.2-3 ⁇ ). On this first layer 2, a second layer 3 is deposited. This is a nickel alloy. The nickel alloy has a thickness between one and three microns (1 -3 ⁇ ). Finally, a gold layer or gold alloy layer 4 is deposited on the nickel alloy layer. This final coating has a thickness between 0.1 -2 microns (0.1 -2 ⁇ ) or less and an average roughness Ra of 0.1 micrometers (0.1 ⁇ ) or less.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Contacts (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un élément de contact électrique essentiellement constitué d'un corps de base, comprenant les étapes suivantes, dans l'ordre indiqué : a) un dégraissage de la surface, par exemple un dégraissage à froid et/ou un dégraissage à chaud et/ou un dégraissage électrolytique, b) un rinçage pour éliminer les résidus chimiques éventuellement présents, c) une activation de la surface, d) un dépôt d'une couche de nickel, e) un autre rinçage pour éliminer les résidus chimiques éventuellement présents, f) un dépôt d'un alliage de nickel, g) un autre rinçage pour éliminer les résidus chimiques éventuellement présents, h) un dépôt d'une couche d'or ou d'un alliage d'or.
EP13756807.7A 2012-09-26 2013-07-31 Élément de contact électrique Withdrawn EP2900849A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012109057A DE102012109057B3 (de) 2012-09-26 2012-09-26 Verfahren zur Herstellung eines elektrischen Kontaktelements und elektrisches Kontaktelement
PCT/DE2013/100280 WO2014048414A1 (fr) 2012-09-26 2013-07-31 Élément de contact électrique

Publications (1)

Publication Number Publication Date
EP2900849A1 true EP2900849A1 (fr) 2015-08-05

Family

ID=49115333

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13756807.7A Withdrawn EP2900849A1 (fr) 2012-09-26 2013-07-31 Élément de contact électrique

Country Status (5)

Country Link
US (1) US20150284866A1 (fr)
EP (1) EP2900849A1 (fr)
CN (1) CN104662207A (fr)
DE (1) DE102012109057B3 (fr)
WO (1) WO2014048414A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013109400A1 (de) * 2013-08-29 2015-03-05 Harting Kgaa Kontaktelement mit Goldbeschichtung
DE102014118593A1 (de) 2014-12-15 2016-06-16 Harting Kgaa Nickel-Wolfram-Legierung
WO2016095895A1 (fr) 2014-12-15 2016-06-23 Harting Ag & Co. Kg Procédé de dépôt d'un alliage nickel-tungstène sur un élément de contact électrique
DE102014019751A1 (de) 2014-12-15 2016-06-16 Harting Kgaa Nickel-Wolfram-Legierung
CN105984177B (zh) * 2015-02-17 2019-01-22 西门子公司 复合镀膜、其制备方法和电子元件
DE102015206314B4 (de) 2015-04-09 2018-06-28 Il-Metronic Sensortechnik Gmbh Verfahren zur Herstellung einer Glasdurchführung mit Kontaktstiften und Kontaktstifte für Glasdurchführungen
EP3322542A4 (fr) * 2015-07-15 2019-05-08 Xtalic Corporation Procédés de dépôt électrolytique et composants revêtus
CN107447237B (zh) * 2016-05-30 2021-04-20 史莱福灵有限公司 具有降低的接触噪声的滑环
DE102017002150A1 (de) * 2017-03-06 2018-09-06 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Elektrisches Kontaktelement

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DE2939496A1 (de) * 1979-09-28 1981-04-16 Nakagawa Corp., Tokyo Verfahren zur herstellung eines federrings
JPH03191084A (ja) * 1989-12-19 1991-08-21 Nippon Mining Co Ltd 耐摩耗性に優れた金めっき材
DE4118416A1 (de) * 1990-06-11 1991-12-12 Feinmetall Gmbh Verfahren und vorrichtung zum beschichten von teilen, insbesondere metallteilen
DE4119102A1 (de) * 1991-06-10 1992-12-17 Henkel Kgaa Verfahren zur vorbehandlung von buntmetall-oberflaechen vor einer galvanischen metallbeschichtung
DE19617488C2 (de) * 1996-05-02 2002-03-07 Gustav Krueger Kontaktelement für lösbare elektrische Verbindungen
US6045682A (en) * 1998-03-24 2000-04-04 Enthone-Omi, Inc. Ductility agents for nickel-tungsten alloys
US6872470B2 (en) * 2000-02-24 2005-03-29 Ibiden Co., Ltd. Nickel-gold plating exhibiting high resistance to corrosion
DE10138204B4 (de) * 2001-08-03 2004-04-22 Ami Doduco Gmbh Elektrischer Kontakt
JP4362599B2 (ja) * 2004-03-05 2009-11-11 Ｄｏｗａメタルテック株式会社 金属部材およびそれを用いた電気接点
EP2103712B1 (fr) * 2008-03-20 2019-02-13 ATOTECH Deutschland GmbH Système de couche Ni-P et son processus de préparation

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Title
None *
See also references of WO2014048414A1 *

Also Published As

Publication number Publication date
CN104662207A (zh) 2015-05-27
DE102012109057B3 (de) 2013-11-07
WO2014048414A1 (fr) 2014-04-03
US20150284866A1 (en) 2015-10-08

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