EP2897449A4 - Work system for substrate, work-sequence-optimizing program, and workbench-quantity-determining program - Google Patents

Work system for substrate, work-sequence-optimizing program, and workbench-quantity-determining program

Info

Publication number
EP2897449A4
EP2897449A4 EP12884411.5A EP12884411A EP2897449A4 EP 2897449 A4 EP2897449 A4 EP 2897449A4 EP 12884411 A EP12884411 A EP 12884411A EP 2897449 A4 EP2897449 A4 EP 2897449A4
Authority
EP
European Patent Office
Prior art keywords
work
program
workbench
sequence
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12884411.5A
Other languages
German (de)
French (fr)
Other versions
EP2897449B1 (en
EP2897449A1 (en
Inventor
Mitsuo Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Publication of EP2897449A1 publication Critical patent/EP2897449A1/en
Publication of EP2897449A4 publication Critical patent/EP2897449A4/en
Application granted granted Critical
Publication of EP2897449B1 publication Critical patent/EP2897449B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
EP12884411.5A 2012-09-12 2012-09-12 Work system for substrate and workbench-quantity-determining program Active EP2897449B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/073278 WO2014041624A1 (en) 2012-09-12 2012-09-12 Work system for substrate, work-sequence-optimizing program, and workbench-quantity-determining program

Publications (3)

Publication Number Publication Date
EP2897449A1 EP2897449A1 (en) 2015-07-22
EP2897449A4 true EP2897449A4 (en) 2016-10-12
EP2897449B1 EP2897449B1 (en) 2024-01-24

Family

ID=50277782

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12884411.5A Active EP2897449B1 (en) 2012-09-12 2012-09-12 Work system for substrate and workbench-quantity-determining program

Country Status (5)

Country Link
US (1) US10123469B2 (en)
EP (1) EP2897449B1 (en)
JP (1) JP6147750B2 (en)
CN (1) CN104620690A (en)
WO (1) WO2014041624A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107079620B (en) * 2014-11-13 2020-03-31 株式会社富士 Mounting machine and method for inspecting suction posture of electronic component using mounting machine
CN105744824A (en) * 2014-12-10 2016-07-06 安徽海创自动控制设备有限公司 Automatic paster mounting device
JP6792638B2 (en) * 2016-12-09 2020-11-25 株式会社Ｆｕｊｉ Installation job data creation method and creation device
CN110226139B (en) * 2017-02-09 2022-05-27 株式会社富士 Optimization device for production line

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060229758A1 (en) * 2003-09-01 2006-10-12 Yasuhiro Maenishi Method for optimization of an order for component mounting and apparatus for optimization of an order for component mounting
US20100152877A1 (en) * 2007-05-24 2010-06-17 Yasuhiro Maenishi Component mounting method, component mounting apparatus, method for determining mounting conditions, and apparatus and program for determining mounting conditions
US20100189340A1 (en) * 2009-01-29 2010-07-29 Panasonic Corporation Mounted component inspection apparatus, component mounting machine comprising the mounted component inspection apparatus, and mounted component inspection method

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001028500A (en) * 1999-07-15 2001-01-30 Juki Corp Electronic part mounting device
JP2001111300A (en) * 1999-08-04 2001-04-20 Sony Corp Component-mounting system line
CN1258962C (en) * 2000-08-04 2006-06-07 松下电器产业株式会社 Method for optimization of an order of component mounting, apparatus using the same and mounter
JP4090705B2 (en) 2001-05-14 2008-05-28 松下電器産業株式会社 Mounting board appearance inspection system and appearance inspection method
US6999835B2 (en) * 2001-07-23 2006-02-14 Fuji Machine Mfg. Co., Ltd. Circuit-substrate working system and electronic-circuit fabricating process
JP2003110288A (en) * 2001-07-23 2003-04-11 Fuji Mach Mfg Co Ltd Circuit board operation system and electronic circuit manufacturing method
JP4045838B2 (en) * 2002-04-12 2008-02-13 松下電器産業株式会社 Component mounting management method
JP4322092B2 (en) * 2002-11-13 2009-08-26 富士機械製造株式会社 Calibration method and apparatus for electronic component mounting apparatus
JP4481192B2 (en) * 2005-02-24 2010-06-16 ヤマハ発動機株式会社 Inspection condition management system and component mounting system
JP4946544B2 (en) * 2007-03-14 2012-06-06 オムロン株式会社 Image generation method for measurement processing and substrate visual inspection apparatus using this method
JP4917071B2 (en) * 2007-07-12 2012-04-18 パナソニック株式会社 Head arrangement determining method and program
JP4852516B2 (en) 2007-11-22 2012-01-11 パナソニック株式会社 Substrate inspection method and substrate inspection apparatus
WO2009093446A1 (en) 2008-01-23 2009-07-30 Panasonic Corporation Component mounting condition determination method
JP5009939B2 (en) * 2008-02-25 2012-08-29 パナソニック株式会社 Mounting condition determination method
JP4996634B2 (en) * 2008-02-27 2012-08-08 パナソニック株式会社 Mounting condition determining method and mounting condition determining apparatus
JP2009206354A (en) * 2008-02-28 2009-09-10 Fuji Mach Mfg Co Ltd Image recognition apparatus and image recognition method of electronic component mounting machine
JP5354978B2 (en) * 2008-07-02 2013-11-27 パナソニック株式会社 Inspection condition determination method
JP5083158B2 (en) * 2008-10-03 2012-11-28 パナソニック株式会社 Electronic component mounting apparatus and operation instruction method in electronic component mounting apparatus
JP2011119430A (en) 2009-12-03 2011-06-16 Panasonic Corp Component mounting system, and method of mounting the component
JP5686555B2 (en) * 2010-09-08 2015-03-18 富士機械製造株式会社 Manufacturing system construction method
JP6075932B2 (en) * 2010-09-17 2017-02-08 富士機械製造株式会社 Substrate inspection management method and apparatus
JP2012124350A (en) * 2010-12-09 2012-06-28 Panasonic Corp Electronic component packaging system and electronic component packaging method
JP2012129434A (en) * 2010-12-17 2012-07-05 Fuji Mach Mfg Co Ltd Work machine for board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060229758A1 (en) * 2003-09-01 2006-10-12 Yasuhiro Maenishi Method for optimization of an order for component mounting and apparatus for optimization of an order for component mounting
US20100152877A1 (en) * 2007-05-24 2010-06-17 Yasuhiro Maenishi Component mounting method, component mounting apparatus, method for determining mounting conditions, and apparatus and program for determining mounting conditions
US20100189340A1 (en) * 2009-01-29 2010-07-29 Panasonic Corporation Mounted component inspection apparatus, component mounting machine comprising the mounted component inspection apparatus, and mounted component inspection method

Also Published As

Publication number Publication date
EP2897449B1 (en) 2024-01-24
US10123469B2 (en) 2018-11-06
JP6147750B2 (en) 2017-06-14
EP2897449A1 (en) 2015-07-22
WO2014041624A1 (en) 2014-03-20
CN104620690A (en) 2015-05-13
JPWO2014041624A1 (en) 2016-08-12
US20150216093A1 (en) 2015-07-30

Similar Documents

Publication Publication Date Title
EP2926642A4 (en) Autonomous-travel work system
EP2779523A4 (en) Re-encryption system, re-encryption device, and program
EP2920742A4 (en) Devices, systems, and methods for visual-attribute refinement
SG11201405091TA (en) Polishing agent, polishing agent set, and substrate polishing method
EP2883637A4 (en) Coated tool
EP2900175A4 (en) Methods, systems and devices for treating hypertension
SG10201801324WA (en) Tool arrangement
HK1210302A1 (en) Novel systems and processes for enhanced microlending
EP2797486A4 (en) Stereo-endoscope device, stereo-endoscope system, and stereo-endoscope robot
EP2889791A4 (en) Compound design device, compound design method, and computer program
GB201309878D0 (en) Tool
EP2902767A4 (en) Leakage determination method, leakage determination system, and program
GB201415655D0 (en) System, method, and interfaces for work product management
IL232151A0 (en) Tool system
EP2840879A4 (en) Robot system
EP2839936A4 (en) Edged tool, manufacturing method therefor, and plasma device for manufacturing same
EP2869195A4 (en) Application coordination system, application coordination method, and application coordination program
EP2890230A4 (en) Optimization program and substrate processing system
EP2849113A4 (en) Software distribution system, software distribution method
GB201205150D0 (en) Tool handling system
EP2821920A4 (en) Image-transmission method, program, and device
EP2821177A4 (en) Robot system
EP2876990A4 (en) Work system and work machines for substrates
EP2823390A4 (en) Job processing system, job processing method, and program
PL2931080T3 (en) Application tool

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20150312

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20160912

RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 13/00 20060101ALI20160906BHEP

Ipc: H05K 13/08 20060101AFI20160906BHEP

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: FUJI CORPORATION

RIN1 Information on inventor provided before grant (corrected)

Inventor name: IMAI, MITSUO

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20201012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230328

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20231016

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602012080508

Country of ref document: DE

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20240124

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240124