JP6792638B2 - Installation job data creation method and creation device - Google Patents

Description

The present invention relates to a method of creating mounting job data used in an electronic component mounting machine in the process of producing a finished product substrate, and a device for creating mounting job data.

There are a solder printing machine, an electronic component mounting machine, a reflow machine, a board inspection machine, and the like as a board producing machine for producing a finished product board in which electronic parts are mounted on a raw board. It has become common to connect these board production machines to construct a board production line. Of these, the electronic component mounting machine operates based on the mounting job data, and is in charge of the mounting process of mounting the electronic component on the original board. The mounting job data includes information on component data including position coordinate values when electronic components are mounted on the original board and information on the type and shape of the electronic components. The mounting job data generally includes information such as the mounting order of a plurality of electronic components, the type of nozzle tool for sucking and mounting the electronic components, and the component supply position.

In many cases, the mounting job data is created based on the CAD data obtained by CAD-designing the finished product substrate and the performance data of the electronic component mounting machine. Further, in many cases, the inspection job data used in the appearance board inspection machine arranged in the subsequent process of the electronic component mounting machine is also created based on the same CAD data and the performance data of the appearance board inspection machine. Patent Documents 1 to 3 disclose technical examples relating to the creation of mounting job data and inspection job data.

The mounting data creation method of Patent Document 1 is to read the original board having lands with an image scanner, acquire land data such as the shape, size, and center position of each land from the image data, and search the component library. Then, the mounting data (mounting job data) is created by selecting the electronic component corresponding to the land data. According to this, the mounting data required for mounting parts can be easily and quickly created with high accuracy without individual differences among workers, which contributes to the provision of high-quality finished product boards. ..

Further, the mounting line of Patent Document 2 includes an electronic component mounting machine, a substrate appearance inspection machine, a means for controlling the electronic component mounting machine based on production data (mounting job data), and inspection data (inspection job data). ) Is provided, and a means for controlling the substrate appearance inspection machine and a means for acquiring data necessary for inspection from production data and creating inspection data are provided. According to this, inspection data can be automatically created, and the work of creating inspection data can be easily performed.

Further, Patent Document 3 discloses a processing execution method in a component mounting system including an electronic component mounting machine and a substrate appearance inspection machine. In this processing execution method, an implementation library consisting of implementation-specific data used only for implementation, inspection-specific data used only for inspection, and common data used for both implementation and inspection is provided, and the implementation library is referred to. Execute implementation processing and inspection processing. According to this, it is possible to avoid duplication of data management in the electronic component mounting machine and the substrate appearance inspection machine.

Japanese Unexamined Patent Publication No. 9-190531 Japanese Unexamined Patent Publication No. 2006-339260 Japanese Unexamined Patent Publication No. 2006-261601

By the way, in the technique of Patent Document 1, the mounting job data is created from the image data of the original substrate having the land, but the mounting job data may not be determined. For example, not all lands are always used, and electronic components may or may not be attached to a specific land depending on whether or not an option is specified. Further, for example, four lands may be arranged at the apex positions of the quadrangle. In this case, it may be unclear whether two electronic components having two connecting parts are mounted or one component having four connecting parts is mounted. Then, in order to determine the mounting job data, it is preferable to image the finished product board on which the electronic components are mounted, rather than to image the original board.

In addition, there are cases where the actual finished product board is supplied from the client and the CAD data is not provided. In this case, conventionally, it is necessary to create mounting job data while measuring the arrangement of electronic components mounted on the finished product board with a coordinate measuring machine or the like, which imposes a heavy burden on the operator. Further, it may be preferable to create mounting job data based on the actual finished product substrate or original substrate rather than CAD data. For example, when the actual position of the land on the original board has an error with respect to the CAD data, the accuracy of specifying the mounting position is improved by creating the mounting job data based on the finished product board or the original board.

The present invention has been made in view of the above-mentioned problems of the background technology, and is a method of creating mounting job data that can reduce the burden on the operator when creating mounting job data using a finished product substrate as a sample. , And the provision of a production device is an issue to be solved.

The mounting job data creation method disclosed in the present specification is to acquire the finished product image data by imaging the finished product board on which the electronic components are mounted on the original board by using the image image acquisition device, and the above-mentioned completion. The product image data is image-processed to obtain shape information representing the shape and size of the original board and the electronic component, and position information of the electronic component represented by using the coordinate system set on the original board. It is a method of creating mounting job data for creating mounting job data used in an electronic component mounting machine in the process of producing the finished product substrate based on the extracted shape information and the position information. A substrate production line for producing the finished product substrate is configured including the electronic component mounting machine and a plurality of substrate visual inspection machines, and the mounting job data includes the electronic component mounting machine for the electronic component. The position coordinate value specified when mounting on the original board, which is the position coordinate value represented by using the coordinate system, and the component data including the type of the electronic component and the information group including the shape information. A plurality of all the electronic components extracted based on the shape information and the position information extracted by acquiring the finished product image data by using the image image acquisition device included in the substrate visual inspection machine. The processing time required for inspection is distributed among the board appearance inspection machines of the table so as to be equalized, each inspection job data is created, and each board appearance inspection is performed based on each inspection job data. When the mounting job data of each electronic component mounting machine arranged in the previous process of the machine is created and the mounting job data is created, the shape information of one electronic component extracted from the finished product image data is used. , When the component data of a plurality of types of the electronic component is queried in a pre-registered component library, and the shape information of one electronic component is not registered in the component library even if an error in image processing is taken into consideration. In addition, one electronic component is newly registered in the component library.

Further, the mounting job data creation device disclosed in the present specification uses an image image acquisition device to image a finished product board on which electronic components are mounted on the original board to acquire finished product image data. The acquisition unit and the finished product image data are image-processed and represented by using shape information representing at least the shape and size of the original substrate and the electronic component, and a coordinate system set on the original substrate. Data creation that creates mounting job data used in the electronic component mounting machine in the process of producing the finished product substrate based on the image processing unit that extracts the position information of the electronic component and the extracted shape information and the position information. It is a mounting job data creation device including a unit, and includes a plurality of the electronic component mounting machines and a plurality of board visual inspection machines to form a board production line for producing the finished product board. The mounting job data is a position coordinate value designated when the electronic component mounting machine mounts the electronic component on the original substrate, and is a position coordinate value represented by using the coordinate system, and the above. The image acquisition unit acquires the finished product image data by using the image image acquisition device of the substrate appearance inspection machine, which includes component data including a type of electronic component and an information group including the shape information. Based on the shape information and the position information extracted by the image processing unit, the data creating unit performs processing necessary for inspection of all the extracted electronic components among a plurality of the substrate appearance inspection machines. Each inspection job data is created by distributing the time so as to be equalized, and further, each electronic component mounting machine arranged in the previous step of each of the substrate appearance inspection machines based on the inspection job data. When the mounting job data of the above is created and the mounting job data is created, the shape information of one electronic component extracted from the finished product image data is obtained in advance by the component data of a plurality of types of the electronic component. When the shape information of one electronic component is not registered in the component library even if the registered parts library is queried and the error of image processing is taken into consideration, one electronic component is newly added to the component library. to register.

According to the mounting job data creation method disclosed in the present specification, the finished product image data is acquired by using the finished product substrate as a sample, and the shape information of the original substrate and the electronic component and the position information of the electronic component are extracted. , Create mounting job data used for electronic component mounting machines. Since all or most of this data creation procedure can be automated, the burden on the operator can be reduced as compared with the conventional case. Further, since the image image acquisition device of the substrate appearance inspection machine is used, no new capital investment is required and it is economical. In addition, the inspection job data is created in advance so as to equalize the processing time of each substrate appearance inspection machine, and the mounting job data of each electronic component mounting machine is created based on the inspection job data, so that the throughput at the time of production is reduced. Can be suppressed.

Further, according to the mounting job data creation device disclosed in the present specification, the same procedure as the mounting job data creation method described above can be executed. Therefore, all or most of the procedures can be automated, and the burden on the operator can be reduced as compared with the conventional case. Further, as in the above-mentioned method for creating mounting job data, no new capital investment is required, and in addition, a decrease in throughput during production can be suppressed.

It is a figure which showed typically the substrate production line which carries out the method of creating the mounting job data of an embodiment. It is a figure which shows typically the example of the data structure of a component library. It is a procedure diagram of the method of creating the attachment job data of an embodiment. It is an image diagram which shows an example of the finished product image data acquired by the image image acquisition apparatus by imaging the finished product substrate. It is a figure which showed an example of inspection job data. It is a figure which showed an example of the attachment job data. It is a top view explaining the amount of eccentricity of the suction position of a transistor component.

(1. Substrate production line 1 for implementing the method of creating mounting job data of the embodiment)
The method of creating the mounting job data of the embodiment will be described with reference to FIGS. 1 to 7. FIG. 1 is a diagram schematically showing a substrate production line 1 that implements the method of creating mounting job data of the embodiment. The board production line 1 is composed of a solder printing machine 2, a solder printing inspection machine 3, an electronic component mounting machine 4, a board appearance inspection machine 5, a reflow machine 6, and a line management device 7. The solder printing machine 2 to the reflow machine 6 are arranged in a row in the order described.

The solder printing machine 2 prints paste-like solder on the original substrate in a predetermined pattern shape. The solder printing machine 2 and the solder printing inspection machine 3 are connected by a substrate transfer device 81. The solder printing inspection machine 3 inspects the solder printing state of the conveyed substrate. The solder printing inspection machine 3 and the electronic component mounting machine 4 are connected by a substrate transfer device 82. The electronic component mounting machine 4 mounts the electronic component on the solder of the conveyed substrate. The electronic component mounting machine 4 has a suction nozzle 41 that sucks electronic components and mounts them on a substrate. In order to mount a large number of electronic components accurately and efficiently, the electronic component mounting machine 4 operates based on the mounting job data. The electronic component mounting machine 4 and the board appearance inspection machine 5 are connected by a board transfer device 83.

The substrate appearance inspection machine 5 inspects the appearance state of the electronic components mounted on the conveyed substrate. The substrate appearance inspection machine 5 includes an image image acquisition device 51 that captures the appearance of the substrate. In order to accurately and efficiently inspect a large number of electronic components, the substrate appearance inspection machine 5 operates based on the inspection job data. The board appearance inspection machine 5 and the reflow machine 6 are connected by a board transfer device 84. The reflow machine 6 remelts the solder of the substrate determined to be normal by the substrate appearance inspection machine 5 and then solidifies it to stabilize the connected state. As a result, the production of the finished product substrate is completed.

The line management device 7 is configured by using a computer having a built-in CPU and operating by software. The line management device 7 has a display device 71 and an input device 72. The line management device 7 is communication-connected to the solder printing machine 2, the solder printing inspection machine 3, the electronic component mounting machine 4, the board appearance inspection machine 5, and the reflow machine 6 by using the communication line 73. The line management device 7 is further connected to the component library 75 stored in the external storage device by using the communication line 73. The parts library 75 is also shared with other board production lines. A wireless communication means may be used instead of the communication line 73. The configuration of the substrate production line 1 shown in FIG. 1 is an example, and may be a line configuration of various known forms, for example, a line configuration including a plurality of electronic component mounting machines.

(2. Parts library 75)
Here, the parts library 75 will be described. FIG. 2 is a diagram schematically showing an example of a data structure of the component library 75. Parts data of various types of electronic parts are registered in advance in the parts library 75. In the example shown in FIG. 2, the parts library 75 is organized in the form of a list. That is, the component library 75 has columns such as a registration number, an electronic component type, shape information, an eccentric amount of suction positions, and surface brightness or color. A registration number is assigned to each type of electronic component, and registration information is set in each column of one line.

For example, the electronic component of registration number 1 shown in the first line is a chip resistor and the characteristic value is the resistance value R1. Further, the shape information of the electronic component of registration number 1 has a vertical dimension of X1 and a horizontal dimension of Y1. The vertical dimension and the horizontal dimension indicate the existence range of the electronic component placed horizontally in two horizontal directions (see Xi and Yi in FIG. 7), and satisfy the relationship of vertical dimension ≥ horizontal dimension. It is possible to register the height and weight of the electronic component as the shape information. Further, the amount of eccentricity of the suction position of the electronic component of registration number 1 is (0, 0). This indicates that when the suction nozzle 41 of the electronic component mounting machine 4 sucks the electronic component, the center position of the upper surface is sucked. Further, the brightness or color information on the surface of the electronic component is reflected in the determination value when the outer shape of the electronic component is distinguished from the ground color of the substrate by the substrate appearance inspection machine 5.

The three types of electronic components, the registration number 1, the registration number 2, and the registration number 3, registered in the first to third lines differ only in the characteristic values, and the other information matches each other. Further, the three types of electronic components, registration number 1, registration number 4, and registration number 5, have the same characteristic value and different shape information from each other. Further, registration number 1 is a chip resistor and registration number 101 is a chip capacitor, but the shape information matches each other. As a result, it is not possible to specify the type of electronic component based only on the shape information.

(3. Method of creating mounting job data of the embodiment)
The description of the method of creating the mounting job data of the embodiment will be started. In the method of creating the mounting job data of the embodiment, the mounting job data is created by using the image image acquisition device 51 of the board appearance inspection machine 5 as a sample of the finished product board. This creation method is mainly realized by the function of the attachment job data creation device of the embodiment of the line management device 7. The line management device 7 has functions of an image acquisition unit, an image processing unit, an inspection job data creation unit, and a mounting job data creation unit. Further, this production method is carried out between the operations of the substrate production line 1. Not limited to this, another computer device connected to the line management device 7 may have the function of the attachment job data creation device.

FIG. 3 is a procedure diagram of a method of creating mounting job data according to the embodiment. In step J1 of FIG. 3, the image acquisition unit of the line management device 7 acquires the finished product image data by using the image image acquisition device 51 of the substrate appearance inspection machine 5. As a premise of this, the operator carries the finished product substrate K on which the electronic components are mounted on the original substrate into the substrate appearance inspection machine 5. FIG. 4 is an image diagram showing an example of finished product image data acquired by the image image acquisition device 51 taking an image of the finished product substrate K.

According to the finished product image data shown in FIG. 4, the barcode BCD is printed along one short side (right side of FIG. 4) of the rectangular finished product substrate K. The barcode BCD includes information such as a job name for specifying the type of the finished product substrate K and a revision number indicating the number of update histories. Further, the position mark Mp is printed on the upper left corner and the lower right corner of the finished product substrate K in the drawing. The position mark Mp serves as a reference for the xy coordinate system set on the finished product substrate K. In the example of FIG. 4, the length direction of the finished product substrate K is the x-axis direction, and the width direction is the y-axis direction. As a matter of course, the xy coordinate system is common even in the original board before the electronic components are mounted.

A large number of electronic components are mounted on the finished product substrate K. Specifically, three capacitor components B1 are mounted so as to be arranged in the width direction substantially at the center of the finished product substrate K. A large LSI component B2 having 24 lead portions is mounted at a position closer to the other short side (left side in FIG. 4) from the center of the finished product substrate K. Three IC components B3 having eight lead portions are mounted at positions closer to one short side from the center of the finished product substrate K. Further, three IC components B4 having six lead portions are mounted so as to be arranged in the x-axis direction from the vicinity of the LSI component B2 to approach the capacitor component B1.

Further, three transistor components B5 having three lead portions are mounted on one long side side (upper side in FIG. 4) of the IC component B3 of the finished product substrate K. Two transistor components B6 having three lead portions are mounted on one short side side of the LSI component B2. Five chip components B7 are mounted between the LSI component B2 and one long side of the finished product substrate K. Eight chip components B8 are mounted near the lower right corner of the finished product substrate K. Further, the connector component C1 is mounted so as to project from one long side of the finished product substrate K to the outside of the substrate. Further, the connector component C2 is mounted on the left side of the other long side (lower side of FIG. 4) of the finished product substrate K. Two connector parts C3 and C4 are mounted along the other short side of the finished product substrate K.

Returning to FIG. 3, in step J2, the image processing unit of the line management device 7 performs image processing on the finished product image data, and shape information indicating the shape and size of the original substrate and the electronic component, and xy coordinates. The position information of the electronic component represented by the system is extracted. First, the image processing unit extracts the length dimension KX in the length direction and the width dimension KY in the width direction of the finished product substrate K. The image processing unit then extracts two position marks Mp and calibrates the xy coordinate system based on the extracted positions.

Further, the image processing unit extracts shape information of each electronic component, specifically, vertical and horizontal dimensions. Regardless of the direction of the rotation angle Q on which the electronic component is mounted, the larger side of the two extracted dimensions is the X dimension, and the smaller side is the Y dimension. In parallel with this, the image processing unit extracts the position information of each electronic component. The position information is represented by the x-coordinate value and the y-coordinate value occupied by the central position of the electronic component. Further, the position information includes information on the rotation angle Q of the electronic component. The rotation angle Q is represented by an angle formed by the X-dimensional direction and the x-axis direction of the electronic component. For example, the rotation angle Q of the chip component B7 is extracted as 90 °, and the rotation angle Q of the connector component C2 is extracted as 0 °.

In the next step J3, the inspection job data creation unit of the line management device 7 creates inspection job data. FIG. 5 is a diagram showing an example of inspection job data. First, the inspection job data creation unit queries the extracted X dimension and Y dimension to the component library 75 to try to identify the electronic component. When there is only one type of electronic component having vertical and horizontal dimensions matching the X and Y dimensions, the inspection job data creation unit can immediately identify the electronic component and determine its registration number.

However, there are cases where the type of electronic component cannot be specified only by inquiring the dimensions. For example, when the chip component B7 has the X dimension X1 and the Y dimension Y1, the registration number of the chip component B7 is one of 1, 2, 3, 101, and 102. At this time, the inspection job data creation unit requests the worker to perform a selection operation. For example, the inspection job data creation unit displays the corresponding five lines of the parts library 75 on the display device 71 and waits for the operator's selection operation. When the operator selects and operates one of the registration numbers on the input device 72, the inspection job data creation unit can determine the registration number of the chip component B7. That is, the inspection job data creation unit can correctly identify the type of the chip component B7.

Further, as a result of inquiring to the component library 75, it may occur that there is no electronic component having the vertical dimension and the horizontal dimension matching the X dimension and the Y dimension even if the error of the image processing is taken into consideration. That is, the electronic component having the X dimension and the Y dimension is a new electronic component that has not been used and is not registered in the component library 75. In this case, the inspection job data creation unit requests the worker to perform a new registration operation. For example, the inspection job data creation unit puts only the shape information in an empty line of the parts library 75 and displays it on the display device 71, and asks the operator to perform an input operation in another column.

The operator investigates catalog information, specifications, and the like regarding the new electronic component, and performs an input operation from the input device 72. As a result, the new registration operation for the new electronic component is completed, and the component library 75 is updated. In addition, the inspection job data creation unit can determine the registration number of the new electronic component.

The inspection job data creation unit determines the registration number for all the electronic parts extracted from the finished product image data. As a result, the registration numbers of all the electronic components are lined up in the inspection job data shown in FIG. At the beginning of the inspection job data, the job name, revision number, and board dimensions of the finished product board K are shown. The job name "JOB-K" and the revision number "01" are information extracted from the barcode BCD. Further, the substrate dimensions "KX, KY" are the length dimension KX and the width dimension KY extracted by the image processing unit.

Secondly, the inspection job data creation unit associates the extracted position information with the electronic component of each registration number. As a result, for example, as shown in FIG. 5, the x-coordinate value x1, the y-coordinate value y1, and the rotation angle Q1 are associated with the electronic component having the registration number 1.

Thirdly, the inspection job data creation unit sets the items required for inspection for the electronic component of each registration number. Examples of items required for inspection include imaging order, margin of error, and external shape determination conditions. The imaging order represents the order in which the image image acquisition device 51 images images when the finished product substrate K is divided into a plurality of imaging regions for imaging. In the example of FIG. 5, the electronic components of registration number 1 and registration number 101 are imaged for the first time. The electronic component with registration number 4 is imaged a second time. Further, the permissible error E1, the permissible error E2, and the permissible error E3 represent a limit in which the actual mounting position of the electronic component may deviate from the designated position information. The outer shape determination condition Z1, the outer shape judgment condition Z2, and the outer shape judgment condition Z3 represent judgment values for distinguishing the outer shape of the electronic component from the ground color of the substrate. It is preferable that the items required for the inspection are automatically set by an optimization program or the like. The inspection job data is completed by the above procedure.

In the next step J4, the mounting job data creation unit of the line management device 7 creates mounting job data based on the inspection job data. FIG. 6 is a diagram showing an example of mounting job data. First, the mounting job data creation unit copies the job name, revision number, board dimensions, registration numbers and position information of all electronic components of the inspection job data to the mounting job data as they are.

Secondly, the mounting job data creation unit sets the items required for mounting for the electronic component of each registration number. The items required for mounting include the mounting order, the nozzle tool, and the component supply position. The mounting order represents the order in which the electronic components are mounted on the original substrate. Also, the nozzle tool may be replaced depending on the type of electronic component. In the example of FIG. 5, the electronic components of registration number 1 and registration number 101 are first mounted using the multi-nozzle tool Tm having a plurality of suction nozzles 41. The electronic component of registration number 4 is mounted a second time using a single nozzle tool Ts having one suction nozzle 41. The component supply position specifies one of a plurality of component supply devices mounted on the electronic component mounting machine 4. It is preferable that the items required for mounting are automatically set by an optimization program or the like. The mounting job data is completed by the above procedure.

The inspection job data is transferred to the substrate appearance inspection machine 5 and stored. Further, the mounting job data is transferred to and stored in the electronic component mounting machine 4. As a result, the job data for producing the finished product substrate K is ready. After that, in the substrate production line 1, setup work for supplying members such as original substrates and electronic components is performed, and production is started.

Here, the eccentricity (ΔX, ΔY) of the suction position of the transistor component registered in the registration number i in FIG. 2 will be additionally described. FIG. 7 is a plan view illustrating the amount of eccentricity (ΔX, ΔY) of the suction position of the transistor component. ΔX represents the amount of eccentricity in the x-axis direction, and ΔY represents the amount of eccentricity in the y-axis direction. As shown, the transistor component includes a main body 90, a first lead 91, a second lead 92, and a third lead 93. The first lead portion 91 projects small from one long side of the rectangular main body portion 90. On the other hand, the second lead portion 92 and the third lead portion 93 greatly extend from the other long side of the main body portion 90. The vertical dimension Xi and the horizontal dimension Yi of the transistor component. The center of gravity is eccentric with respect to the center position C of the transistor component.

When the transistor component is sucked by the suction nozzle 41, the suction posture can be stabilized by eccentricizing the suction position G not at the center position C but at the vicinity of the center of gravity position. Therefore, the amount of eccentricity (ΔX, ΔY) of the suction position G with respect to the center position C is registered in the component library 75. When the mounting job data includes the registration number i, the electronic component mounting machine 4 refers to the component library 75 to grasp the amount of eccentricity (ΔX, ΔY), and corrects the position control at the time of suction and mounting of the suction nozzle 41. it can. As a result, the electronic component mounting machine 4 can stably attract and mount the transistor component. As described above, the mounting job data includes information on the eccentricity (ΔX, ΔY) of the suction position G of the component library 75 associated with the registration number i.

(4. Aspects and effects of the method of creating the mounting job data of the embodiment)
The method of creating the mounting job data of the embodiment is to acquire the finished product image data by imaging the finished product board K on which the electronic components are mounted on the original board by using the image image acquisition device 51, and obtain the finished product image. The data is image-processed to display shape information (length dimension KX, width dimension KY, X dimension X1, Y dimension Y1) indicating the shape and size of the original substrate and electronic components, and x-set on the original substrate. In the process of extracting the position information (x coordinate value, y coordinate value, rotation angle Q) of the electronic component represented by using the y coordinate system, and producing the finished product substrate K based on the extracted shape information and position information. The mounting job data used for the electronic component mounting machine 4 is created.

According to this, the finished product image data is acquired by using the finished product substrate K as a sample, the shape information of the original substrate and the electronic component, and the position information of the electronic component are extracted, and the mounting used in the electronic component mounting machine 4 is performed. Create job data. Since all or most of this data creation procedure can be automated, the burden on the operator can be reduced as compared with the conventional case. In addition, the time required for data creation is also reduced as compared with the conventional case. Further, since the finished product substrate K is used as a sample instead of the original substrate, even if there is an unused land, electronic components are not erroneously assigned.

Further, the mounting job data is a position coordinate value specified when the electronic component mounting machine 4 mounts the electronic component on the original board, and is an x-coordinate value and a y-coordinate value represented by using the xy coordinate system. , And the rotation angle Q, and the component data including the information group including the type and shape information of the electronic component. According to this, the mounting position of the electronic component is specified by the mounting job data, and the type and shape information of the electronic component are also clarified, so that accurate mounting is performed. Further, since the finished product substrate K is used as a sample, even if the actual position of the land of the original substrate has an error with respect to the CAD data, no error occurs at the designated mounting position.

Further, when creating the mounting job data, the component library 75 in which component data of a plurality of types of electronic components are registered in advance is referred to. According to this, since the parts library 75 can be used efficiently, the burden on the operator is further significantly reduced, and the time required for data creation is also significantly reduced.

Further, when the shape information of one electronic component extracted from the finished product image data is not registered in the component library 75, one electronic component is newly registered in the component library 75. According to this, when a new electronic component having no usage record is mounted on the finished product substrate K, new registration can be performed each time, and the component library 75 can be enhanced. Therefore, the burden on the operator is reduced in the second and subsequent uses of this electronic component.

Further, when referring to the parts library 75, a selection operation by an operator is also used. According to this, even if the type of the electronic component cannot be specified only by inquiring the X dimension and the Y dimension, the type of the electronic component can be correctly specified by the operator's selection operation. Furthermore, when newly registering a new electronic component that has not been used in the component library, an input operation by an operator is also used. According to this, catalog information and specifications regarding new electronic components are accurately reflected. Therefore, the accuracy of the component data of this electronic component is improved.

Further, when the suction position G to be sucked by the suction nozzle 41 of the electronic component mounting machine 4 is eccentric with respect to the center position C of the electronic component (transistor component), the mounting job data is the suction position G with respect to the center position C. Contains information on the amount of eccentricity (ΔX, ΔY). According to this, the electronic component mounting machine 4 can grasp the eccentricity amount (ΔX, ΔY) and correct the position control at the time of suction and mounting of the suction nozzle 41, so that stable suction and mounting becomes possible. ..

Further, a substrate production line 1 for producing the finished product substrate K is configured including the electronic component mounting machine 4 and the substrate appearance inspection machine 5, and the image image acquisition device 51 included in the substrate appearance inspection machine 5 is used. The finished product image data is acquired, the inspection job data used for the substrate appearance inspection machine 5 is created based on the extracted shape information and the position information, and the mounting job data is created based on the inspection job data. According to this, since the image image acquisition device 51 of the substrate appearance inspection machine 5 is used, no new capital investment is required and it is economical.

Further, the line management device 7 has a function of a device for creating mounting job data of the embodiment. That is, the line management device 7 has an image acquisition unit that acquires finished product image data by imaging the finished product substrate K on which electronic components are mounted on the original substrate using the image image acquisition device 51, and a finished product. Image data is image-processed to extract shape information representing at least the shape and size of the original board and electronic components, and position information of electronic components represented using the xy coordinate system set on the original board. Inspection job data creation unit and mounting job data creation unit that create mounting job data used in the electronic component mounting machine 4 in the process of producing the finished product substrate K based on the image processing unit to be processed and the extracted shape information and position information. And.

According to this, the line management device 7 can execute the method of creating the mounting job data of the embodiment. Therefore, all or most of the procedures can be automated, and the burden on the operator can be reduced as compared with the conventional case.

(5. Application and modification of the embodiment)
It should be noted that there is an appropriate application example for a line configuration in which a plurality of board appearance inspection machines are arranged on a substrate production line and an electronic component mounting machine is arranged in a pre-process of each substrate appearance inspection machine. More specifically, all the electronic components extracted from the finished product image data are distributed to a plurality of substrate visual inspection machines to create inspection job data for each. The distribution process is performed using an optimization program, and the process time required for the inspection is equalized among the plurality of substrate appearance inspection machines. Based on the inspection job data created in this way, the mounting job data of the electronic component mounting machines arranged in the previous process of each board appearance inspection machine is created.

Usually, the processing time of the substrate appearance inspection device tends to be longer than the processing time of the electronic component mounting machine. Therefore, if the mounting job data is created first and the inspection job data is created based on the above line configuration, the processing time of a plurality of board appearance inspection machines is not equalized, and the throughput during production is reduced. There is a risk. According to this application example, the inspection job data is created first so as to equalize the processing time of the substrate appearance inspection machine, and the mounting job data of the electronic component mounting machine is created based on the inspection job data. Therefore, the throughput at the time of production is increased. Does not decrease.

It can also be used to create only one of the inspection job data and the mounting job data. Further, instead of the image image acquisition device 51 and the line management device 7 of the substrate appearance inspection machine 5, another image image acquisition device and a computer device unrelated to the substrate production line 1 can be used. In this case, even if the mounting job data creation method is implemented, the operation of the board production line 1 is not affected. The present invention has various other applications and modifications.

1: Substrate production line 4: Electronic component mounting machine 41: Adsorption nozzle 5: Substrate appearance inspection machine 51: Image image acquisition device 7: Line management device 75: Parts library K: Finished product board Mp: Position mark KX: Length dimension KY: Width dimension B7: Chip part X1: X dimension Y1: Y dimension (ΔX, ΔY): Eccentricity C: Center position G: Adsorption position

Claims (4)

By using an image image acquisition device to image a finished product board on which electronic components are mounted on the original board, the finished product image data is acquired.
The finished product image data is image-processed, and the shape information indicating the shape and size of the original substrate and the electronic component and the position of the electronic component represented by using the coordinate system set on the original substrate are used. Extract information,
It is a method of creating mounting job data for creating mounting job data used in an electronic component mounting machine in the process of producing the finished product substrate based on the extracted shape information and the position information.
A substrate production line for producing the finished product substrate is configured including a plurality of the electronic component mounting machines and a plurality of substrate visual inspection machines.
The mounting job data is a position coordinate value designated when the electronic component mounting machine mounts the electronic component on the original substrate, and is a position coordinate value represented by using the coordinate system, and the electron. Includes component data consisting of information groups including component types and shape information.
Using the image image acquisition device of the substrate appearance inspection machine, the finished product image data is acquired.
Based on the extracted shape information and the position information, all the extracted electronic components are distributed among a plurality of the substrate visual inspection machines so that the processing time required for inspection is equalized. Create each inspection job data and
Based on the above test job data, to create a mounting job data of each of the electronic component mounting apparatus disposed in front step of the said substrate appearance inspection machine respectively,
When creating the mounting job data, the shape information of one electronic component extracted from the finished product image data is queried to a component library in which the component data of a plurality of types of the electronic components are registered in advance. When the shape information of one electronic component is not registered in the component library even in consideration of an error in image processing, one electronic component is newly registered in the component library.
How to create mounting job data. When queried before SL component library, or, when registering a new one of the electronic component, a combination of operation by the operator, how to create a mounting job data according to claim 1. When the suction position sucked by the suction nozzle of the electronic component mounting machine is eccentric with respect to the center position of the electronic component.
The method for creating mounting job data according to claim 1 or 2 , wherein the mounting job data includes information on the amount of eccentricity of the suction position with respect to the center position. An image acquisition unit that acquires image data of the finished product by imaging the finished product board on which electronic components are mounted on the original substrate using an image image acquisition device.
The finished product image data is image-processed, and the shape information representing at least the shape and size of the original substrate and the electronic component, and the electronic component represented by using the coordinate system set on the original substrate are used. An image processing unit that extracts position information and
A data creation unit that creates mounting job data used in an electronic component mounting machine in the process of producing the finished product substrate based on the extracted shape information and the position information.
It is a mounting job data creation device equipped with
A substrate production line for producing the finished product substrate is configured including a plurality of the electronic component mounting machines and a plurality of substrate visual inspection machines.
The mounting job data is a position coordinate value designated when the electronic component mounting machine mounts the electronic component on the original substrate, and is a position coordinate value represented by using the coordinate system, and the electron. Includes component data consisting of information groups including component types and shape information.
The image acquisition unit acquires the finished product image data by using the image image acquisition device of the substrate appearance inspection machine.
The data creation unit
Based on the shape information and the position information extracted by the image processing unit, the processing time required for inspection of all the extracted electronic components is equalized among a plurality of the substrate appearance inspection machines. To create each inspection job data, and further, based on each of the inspection job data, the mounting job data of each of the electronic component mounting machines arranged in the previous process of each of the board appearance inspection machines is obtained. Create and
When creating the mounting job data, the shape information of one electronic component extracted from the finished product image data is queried to a component library in which the component data of a plurality of types of the electronic components are registered in advance. When the shape information of one electronic component is not registered in the component library even when the error of image processing is taken into consideration, one electronic component is newly registered in the component library.
Installation job data creation device.

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