JP2011119430A - Component mounting system, and method of mounting the component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To quickly collect a faulty substrate from a component mounting line without degrading productivity. <P>SOLUTION: A component mounting system including the component mounting line L having a plurality of work areas S in which the substrate W is mounted with a component or the substrate W is inspected includes: a substrate carrier conveying the substrate W to pass the plurality of work areas S in order while supporting the substrate W by only first both ends in a direction Y perpendicular to a carrying direction X; a mounting device 10 provided in the work area S and mounting the component on the substrate on the substrate carrier; an inspection device 10 provided in the work area S and inspecting the substrate W on the substrate carrier; and a faulty-substrate take-out device taking out the substrate W determined to be faulty as a result of the inspection by the inspection device 10 from the substrate carrier in the work area S in the direction Y perpendicular to the carrying direction X of the substrate carrier by gripping second both ends in the carrying direction X. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a component mounting system and a component mounting method for mounting components on a board.

  2. Description of the Related Art Conventionally, a component mounting method using a component mounting line for transporting a substrate so as to pass through a plurality of work areas in order and mounting components on the substrate in each work area is known. In such a component mounting line, in addition to mounting components on a board, various operations are performed in a work area. For example, cream solder is applied to a predetermined portion of the substrate.

  Further, in such a component mounting line, various inspections are performed on the board in the work area. For example, an inspection for a component mounting failure is performed. Also, for example, as described in Patent Document 1, a defective application of cream solder to the substrate is inspected.

  The cream solder application defect determination described in Patent Document 1 is performed based on a comparison between an image of a substrate captured by a camera and an image of a substrate in a preferable application state. In addition, in this application failure determination, if a component can be mounted in a later process that is not in a preferable application state, the application state is not determined to be defective (a failure that requires the line to be stopped and collected from the line). I have to. As a result, the number of times of stopping the line and collecting the substrate that has been poorly coated from the line is reduced, and the production efficiency of the component mounting line is kept constant.

JP 2000-124599 A

  However, it is difficult to set a defect determination criterion for determining whether or not the application state is such that components can be mounted in a subsequent process. In addition, a defective substrate is not generated only due to defective application of cream solder. Further, any failure determination criteria may cause a failure to occur suddenly and continuously.

  Therefore, it is better to consider a method of recovering the defective board from the component mounting line immediately after the occurrence of the defect, without greatly reducing the production efficiency of the component mounting line, rather than considering the defect determination criteria. It is effective and necessary to keep the production efficiency of the component mounting line constant.

  Accordingly, an object of the present invention is to collect a defective board from a component mounting line while suppressing a decrease in production efficiency of the component mounting line.

In order to solve the above-mentioned problem, the invention according to claim 1 is a component mounting system including a component mounting line including a plurality of work areas on which a substrate is mounted or a substrate is inspected.
A substrate transfer device that supports the substrate only at the first ends in the direction orthogonal to the transfer direction, and transfers the substrate so as to sequentially pass through the plurality of work areas;
A mounting device that is provided in a work area and mounts components on a substrate on the substrate transfer device;
An inspection device provided in a work area, for inspecting a substrate on the substrate transfer device;
A defect in which a substrate whose inspection result by the inspection apparatus is defective is taken out from the substrate conveyance apparatus in a work area by gripping the second ends in the conveyance direction in a direction orthogonal to the conveyance direction of the substrate conveyance apparatus. And a substrate take-out device.

  The invention described in claim 2 is characterized in that the defective substrate take-out apparatus is configured so that a substrate can be put into a work area.

  Further, the invention described in claim 3 is characterized in that it has a take-out substrate rotating device that rotates the substrate taken out by the defective substrate take-out device so that the first both end directions coincide with the transport direction.

  Furthermore, the invention described in claim 4 is characterized in that it includes a substrate stocking device that stocks the substrate taken out by the defective substrate takeout device while supporting the substrate at the first ends.

In addition, the invention according to claim 5 is a component mounting method in a component mounting line including a plurality of work areas in which a substrate is mounted with a component or a substrate is inspected.
A transport step of transporting the substrate by a substrate transport device that transports the plurality of work areas in order while supporting the substrate at the first ends of the substrate in a direction orthogonal to the transport direction;
A mounting step of mounting components on a board on the board transfer device in a work area;
An inspection process for inspecting the substrate on the substrate transfer device in a work area;
A defect in which a substrate whose inspection result in the inspection process is defective is taken out from the substrate transport apparatus in a work area by gripping the second ends in the transport direction in a direction orthogonal to the transport direction of the substrate transport apparatus. And a substrate removing step.

  According to the present invention, the defective substrate take-out device takes out a substrate having a defective inspection result by the inspection device from the substrate carrying device in a direction perpendicular to the carrying direction. As a result, the defective substrate can be taken out without stopping the work on the other substrate.

  Further, since the substrate transfer device supports the substrate only at the first ends in the direction orthogonal to the transfer direction, the defective substrate take-out device can hold the second ends in the transfer direction. And a defective board | substrate can be taken out from a board | substrate conveyance apparatus.

  Furthermore, since the defective board is taken out from the work area in the orthogonal direction rather than the non-orthogonal direction with respect to the transport direction, there is no need to extend the component mounting line for taking out the defective board.

  As a result, a defective board can be recovered from the component mounting line without reducing the production efficiency of the component mounting line.

It is a figure which shows the component mounting line of the component mounting system seen from upper direction (viewed in the Z-axis direction) based on one Embodiment of this invention. It is a figure which shows the component mounting apparatus seen in the conveyance direction (X-axis direction) of a board | substrate. It is a figure which shows the component mounting apparatus seen in the Y-axis direction orthogonal to an X-axis and a Z-axis. It is a figure which shows the component mounting apparatus seen in the Z-axis direction. It is a figure which shows several types of working heads. It is the figure which looked at the board | substrate conveyance mechanism in the X-axis direction. It is a figure which shows multiple types of cart. It is a figure for demonstrating the taking-out procedure of a board | substrate. FIG. 9 is a diagram for explaining a substrate removal procedure subsequent to the procedure illustrated in FIG. 8. It is a Y-axis direction view of an elevating shelf. It is a figure which shows the control system of a component mounting system. It is a figure which shows the flow of collection | recovery of a defect board | substrate.

  FIG. 1 is a view of a component mounting line L included in a component mounting system according to an embodiment of the present invention as viewed from above (viewed in the Z-axis direction).

  The component mounting system includes a component mounting line L including a plurality of work areas S for mounting components on a substrate W by a plurality of component mounting apparatuses 10 connected in the X-axis direction (axial direction orthogonal to the Z-axis). Yes. A component is mounted on the substrate W inside the component mounting apparatus 10 (the component mounting apparatus 10 secures a work area S inside). In the drawing, a passage R extending in parallel with the component mounting line L through which an operator and a cart described later move is shown.

  First, the structural configuration of the component mounting apparatus 10 will be described. 2 to 4 are schematic views of the component mounting apparatus 10, FIG. 2 is a view seen in the X-axis direction, and FIG. 3 is a view seen in the Y-axis direction (axial direction orthogonal to the X-axis and Z-axis). FIG. 4 and FIG. 4 are views seen in the Z-axis direction.

  The component mounting apparatus 10 is configured to perform various operations on the substrate W in addition to mounting components on the substrate W.

  For this purpose, as shown in FIGS. 1 to 4, the component mounting apparatus 10 includes two head holders 12 a and 12 b equipped with a tool head T for performing work on the substrate W, and the head holders 12 a and 12 b as X Two X-axis feed mechanisms 14a and 14b that move in the axial direction, a Y-axis feed mechanism 16 that moves the two X-axis feed mechanisms 14a and 14b in the Y-axis direction, and a base 18 that supports the Y-axis feed mechanism 16 A substrate transport mechanism 20 that transports the substrate W in the X-axis direction, component recognition cameras 22a and 22b, and a main body cover (dashed line) 24.

Further, as shown in FIG. 1, the component mounting apparatus 10 selectively includes any one of a feeder cart C ₁ , an inspection cart C ₂ , a stock cart C ₃ , and a cover C ₄ .

The head holders 12a and 12b are equipped with a plurality of types of tool heads T for exchanging work on the substrate W, and perform work other than component mounting in addition to the tool head for mounting parts. The tool head is configured to be replaceable. In this embodiment, the head holder 12a, 12b, as shown in FIG. 5, the mounting head T ₁ for mounting components on a substrate W, a test head T ₂ for inspecting a substrate W, a cream solder on the substrate W coating and it is configured to equip a coating head T ₃ to.

Mounting head T ₁ has a nozzle 30 for mounting a component received from the feeder cart C ₁ to the substrate W, and a feed mechanism 32 for moving the nozzle 30 in the Z-axis direction.

Inspection head T ₂ are, are equipped with a camera 34 for imaging a target portion of the substrate W across or substrate W. Image data captured by the camera 34 is transmitted to the inspection cart C < _b > ₂ via the component mounting apparatus 10.

Coating head T ₃ has a dispenser 36 for applying the cream solder on the substrate W, and a feed mechanism 38 for moving the dispenser 36 in the Z-axis direction.

These mounting head T ₁ , inspection head T ₂ , and coating head T ₃ receive power from the component mounting apparatus 10 and transmit / receive signals and data to / from the component mounting apparatus 10. A connector 40 connected to the component mounting apparatus 10 is provided. The connector 40 is configured to be connected to a connector 42 provided on the head holders 12a and 12b.

  The head holders 12a and 12b are supported by the X-axis feed mechanisms 14a and 14b and are moved in the X-axis direction by the X-axis feed mechanisms 14a and 14b. The two X-axis feed mechanisms 14 a and 14 b are supported by the Y-axis feed mechanism 16 and are moved in the Y-axis direction by the Y-axis feed mechanism 16. Thereby, the tool head T supported by the head holders 12a and 12b can move on the base 18 in the X-axis direction and the Y-axis direction.

  As described above, the head holders 12a and 12b are provided with a plurality of types of tool heads T so that the head holders 12a and 12b can be exchanged. Can be changed.

For example, when there is a component mounting apparatus 10 (working area S) that performs component mounting with a high occurrence rate of defects, an inspection head is provided in one of the head holders 12a and 12b of the component mounting apparatus 10 on the downstream side. installing a T _2. Thereby, when a defect occurs, the defect can be found immediately.

  A work area S where work on the substrate W is performed is secured on the base 18 (that is, a space in which the head holders 12a and 12b equipped with the tool head T are movable is secured).

  A substrate transport mechanism 20 that transports the substrate W in the X-axis direction is provided on the base 18. The board transport mechanism 20 is configured to be connected to the board transport mechanism 20 of the upstream and downstream component mounting apparatuses 10. Thus, the substrate W sequentially passes through the plurality of work areas S and receives various work in each work area S.

  Further, as shown in FIG. 6 as viewed in the X-axis direction, the substrate transport mechanism 20 has both ends in the direction (Y-axis direction) orthogonal to the transport direction of the substrate W (ends not blackened in FIGS. 1 and 4). (Hereinafter, referred to as “first both ends”), and two belt conveyors 50a and 50b that support the belt from below and convey it in the X-axis direction. Further, the substrate transport mechanism 20 fixes (clamps) the substrate W in the Z-axis direction in cooperation with the belt conveyors 50a and 50b in the work area S, and presses that contact the upper surfaces of the first ends of the substrate W. A plate 52 is provided.

  Furthermore, the board | substrate conveyance mechanism 20 is comprised so that change of the distance (Y-axis direction distance) between the two belt conveyors 50a and 50b is possible. For example, the support member 54 a that supports the belt conveyor 50 a and the support member 54 b that supports the belt conveyor 50 b are configured to be sent in a direction away or approached by the rotation of the ball screw 56. The ball screw 56 is rotated by a motor 58.

  The pressing plate 52 is fixed to the support members 54a and 54b. Therefore, when the substrate W is taken out from the substrate transport mechanism 20 as will be described later, the support members 54a and 54b are separated as shown in FIG. 6B by rotating the ball screw 56.

  Furthermore, the substrate transport mechanism 20 includes a support mechanism 60 that partially supports the lower surface of the substrate W from below in the work area S. The support mechanism 60 includes a plurality of support pins 62 that support the substrate W from below and a support pin lifting mechanism 64 that lifts and lowers the support pins 62. When the substrate W arrives at the work area S, the plurality of support pins 62 rise and their tips abut against the lower surface of the substrate W. When the work (such as component mounting) on the substrate W in the work area S is completed, the support pins 62 are lowered. This suppresses the substrate W from being bent during work.

Returning to FIGS. 1 to 4, the component recognition cameras 22 a and 22 b are arranged on the base 18 so as to be adjacent to the board W arranged in the work area S on the Y axis direction side. The component recognition camera 22a, 22b, prior to mounting components on the substrate W, to make sure that the nozzle 30 of the mounting head T ₁ is being picked up parts in the correct orientation.

FIG. 7 shows a feeder cart C ₁ , an inspection cart C ₂ , a stock cart C ₃ , and a cover C ₄ that are selectively used. As shown in FIG. 7 and FIG. 1 showing the installation state, these are configured to be arranged on both sides of the base 18 so as to be adjacent to the work area S in the Y-axis direction. As described above, each of the feeder cart C ₁ , the inspection cart C ₂ , the stock cart C ₃ , and the cover C ₄ is configured to be disposed in a common place, so that it is necessary to provide a dedicated arrangement space for each. Disappear.

Feeder cart C _1, as shown in FIG. 1, a cart for use in mounting head T ₁ and pair mounted component mounting head T ₁ is mounted on the substrate W, parts mounting head T ₁ Is configured to supply. The feeder cart C ₁ shown in FIG. 7 has a tape feeder 70 mounted thereon, and the mounting head T ₁ picks up the components held on the tape 74 drawn from the reel 72 by the tape feeder 70.

The feeder cart C ₁ has a connector 76 that is connected to the component mounting apparatus 10, and a connector 78 that is connected to the connector 76 is provided on the base 18 of the component mounting apparatus 10. By connecting the connectors 76 and 78 to the feeder cart C ₁ from the component mounting apparatus 10, power (for example, electric power) and a control signal (for example, a signal for instructing the feed timing of the tape 74) to the tape feeder 70. Is transmitted. Further, a signal (for example, a signal indicating that the remaining number of components is small) is transmitted from the feed cart C ₁ to the component mounting apparatus 10.

Inspection cart C _2, as shown in FIG. 1, a cart for use in the inspection head T ₂ pairs, based on the image by the camera 34 of the inspection head T ₂ is captured, the captured substrate W A failure determination device 80 configured by, for example, a computer, which determines whether or not the failure is present is mounted. For example, the determination of the failure is performed based on a comparison with an image of the substrate W in a preferable state.

The inspection cart C _2, when the camera 34 of the inspection head T ₂ determines the that the defect determination unit 80 defective substrate W imaged, the substrate was taken out arm (robot taking out the defective substrate W _E from the substrate transfer mechanism 20 Arm) 82 is mounted.

Substrate was taken out arm 82, as shown in FIG. 8 (A), at the end that is the transport direction of the both ends (black defective substrates W _E of the substrate transfer mechanism 20 proceeds from the inspection cart C ₂ in the Y-axis direction there is hereinafter referred to as "second ends") gripping the, then without changing the attitude of the defective substrate W _E back to the Y-axis direction, the mounting on the turntable 84 as shown in FIG. 8 (B) is configured to location (defective substrate W _E is moved parallel to the Y-axis direction).

Arm 82 is taken out the substrate from the inspection cart C ₂ adjacent to the thus work area S and Y-axis direction, grips the defective substrate W _E in the work area S proceeds in the Y-axis direction, since then returns to the Y-axis direction , there is no need to extend the component mounting line L for removal of the defective substrate W _E.

More specifically, when taking out the transporting direction (X axis direction) non-orthogonal direction with respect to (e.g., X-axis and Y direction forming an angle of 45 degrees with respect to axis) defective substrate W _E from the work area S to , it is necessary to secure a space to the destination of the extracted defective substrate W _E. For example, it is necessary to secure a space for placing the extracted defective substrate W _E. Therefore, it is necessary to increase the interval between the plurality of work areas S of the component mounting line L. That is, it is necessary to increase the arrangement interval of the plurality of component mounting apparatuses 10 shown in FIG. Naturally, this takes time to move the substrate W between the work areas S (component mounting apparatus 10), and the production efficiency of the component mounting line L decreases.

The turntable 84 is configured as shown in FIG. 7, only the first ends of the defective substrate W _E (non-black edge) so as to support from below. That is, the turntable 84 supports the portion that was supported by the belt conveyors 50 a and 50 b of the substrate transport mechanism 20.

  As a result, the substrate W can ensure a large mounting area. That is, the non-mounting part of the component is held by the common first ends (non-blackened ends) supported by the belt conveyors 50a and 50b and the turntable 84 of the board transport mechanism 20 and the board take-out arm 82. Only the second ends (blacked ends) are sufficient.

Further, the turntable 84, the turntable 84 placed on the defective substrate W _E on is configured to horizontally move the second ends (closed end) direction. That is, the turntable 84 does not have a portion for restricting movement of the second ends direction defective substrate W _E. Because, as described later, in order to accommodate a defective substrate W _E stock carts C _3.

Further, the turntable 84 is configured to rotate 90 degrees around a rotation center line extending in the Z-axis direction. From the state of FIG. 8 showing the right after defective substrate W _E is placed (B), when the turntable 84 is rotated 90 degrees, as shown in FIG. 9 (A), on the turntable 84 of the defective substrate W _E The direction of the second end (blacked end) coincides with the Y-axis direction.

These operator who is on the other side of the passage on the R of the component mounting apparatus 10 across the inspection cart C ₂ is, one second at both ends by the turntable 84 is not supported in the (closed end), i.e. the operator can be drawn of the defective substrate W _E from the turntable 84 by grasping the side present at the front (when there is no stock cart C _3).

As shown in FIG. 7, the inspection cart C < _b > ₂ also has a connector 86 that is connected to the connector 78 of the component mounting apparatus 10, similarly to the feeder cart C < _b > ₁ . By this connector 86 is connected to the connector 78, the inspection cart C ₂ from the component mounting apparatus 10, the defect determination unit 80, the power and control signals for operating the substrate was taken out arm 82 and the turntable 84, it is transmitted, also board image camera 34 of the inspection head T ₂ has been captured is transmitted. On the other hand, the component mounting apparatus 10 from the defect determination unit 80 of the inspection cart C _2, the signal for notifying the occurrence of the defective substrate W _E is transmitted.

1, stock cart C ₃ shown in FIG. 7 is a cart that can stock a plurality of defective substrates W _E, use is configured to be coupled to counter-component mounting device 10 side portion of the test cart C ₂ ing. This stock cart C ₃ is equipped with a lift rack 88 that can stock a plurality of defective substrates W _E in the Z-axis direction.

Elevating shelf stock cart C ₃ 88, as shown in FIG. 10 as viewed in the Y-axis direction, a frame in which the inspection cart C ₂ side and the opposite side (passage R side) thereof is open. Thus, with the defective substrate W _E can accommodate is moved in the Y-axis direction to lift the shelf 88 from the turntable 84 of the inspection cart C _2, defects contained in the elevating rack 88 from the opposite side (passage R side) the substrate W _E can be taken in the Y-axis direction.

Accommodation of defective substrate W _E from the turntable 84 of the inspection cart C ₂ to lift shelf 88, as shown in FIG. 9 (B), a substrate feed mechanism 90 mounted on the inspection cart C _2, the turntable 84 It is performed by pressing a defective substrate W _E, which is placed on the Y-axis direction. Defective substrate W _E is accommodated in FIG as shown in 10, lift the shelf 88 in a state in which the first ends (non-black end) is supported on the projecting portion 92 provided on the inner surface of the side wall of the elevator shelf 88 . Thus, an operator who is in the passage R may be taken out first ends defective substrate W _E from the lifting shelf 88 grip the (closed end) of the substrate was taken out arm 82 grips.

Also, stock cart C _3, as shown in FIG. 7, via a connector 94 for connecting the inspection cart C _2, control for elevating the power and該昇Futana 88 for elevating the elevating shelf 88 from the inspection cart C ₂ Configured to receive a signal.

The cover C ₄ is used when the feed cart C ₁ and the inspection cart C ₂ are not connected to the component mounting apparatus 10. The cover C ₄ is fixed to the base 18 by the attachment portion 96 engaging with the connector 78, thereby preventing foreign matter from entering the work area S and the worker's access.

  Next, a control system of the component mounting system 1 will be described with reference to FIG.

As shown in FIG. 11, the component mounting system 1 includes a host computer 2, a plurality of component mounting apparatuses 10, and a plurality of types of carts C _{1 to} C ₃ .

  First, the component mounting apparatus 10 will be described.

The component mounting apparatus 10 includes a communication unit 100 that transmits and receives signals and data to and from the host computer 2 and the carts C _{1 to} C ₂ , a storage unit 102 that stores various data, and a display unit that displays information. 104, an operation unit 106 for operator operation, a substrate recognition unit 108 for recognizing a substrate W existing in the apparatus (work area S), and a work head T mounted on the head holders 12a and 12b. The work head recognizing unit 110, the cart recognizing unit 112 for recognizing a connected cart, and a work executing unit 114 for performing work on the substrate W are provided.

The communication unit 100 is configured to transmit and receive signals and data to and from the host computer 2 and carts C _{1 to} C ₃ .

  The storage unit 102 stores, for example, data related to work on the substrate W and data such as history.

  The display unit 104 is configured by a display, for example. The display unit 104 displays, for example, information on the substrate W existing in the work area S, information on the content of work performed on the substrate W, and the like.

  The operation unit 106 includes a plurality of switches operated by an operator, for example.

  The board recognition unit 108 is configured to recognize the board W existing in the component mounting apparatus 10 (work area S) (the presence or absence of the board and the type of board). For example, the substrate W existing in the work area S is recognized based on a substrate image captured by a camera (not shown) arranged on the base 18.

  The work head recognition unit 110 is configured to recognize the work head T equipped in the head holders 12a and 12b. For example, the type of the work head T mounted on the head holder T is recognized by the identification signal from the work head T.

The cart recognition unit 112 is configured to recognize a cart connected to the component mounting apparatus 10. For example, the type of cart connected to the component mounting apparatus 10 is recognized by identification signals from various carts C _{1 to} C ₃ .

  The work execution unit 114 controls the X-axis feed mechanisms 14a and 14b, the Y-axis feed mechanism 16, the work head T, and the cart on the basis of the program stored in the storage unit 102. Configured to perform work. When the operation on the substrate W is completed, the substrate transfer mechanism 20 is controlled to transfer the completed substrate W from the work area S to the component mounting apparatus 10 on the downstream side and to the component mounting apparatus 10 on the upstream side. The new substrate W is received in the work area S.

The feeder cart C ₁ includes a communication unit 200 that transmits and receives signals to and from the component mounting apparatus 10 and a control unit 202 that controls the tape feeder 70.

The inspection cart C ₂ controls the communication unit 204 that transmits and receives signals to and from the component mounting apparatus 10 and the stock cart C ₃ , the defect determination apparatus 80, the board take-out arm 82, the turntable 84, and the board feeding mechanism 90. And a control unit 206.

The stock cart C ₃ includes a communication unit 208 that transmits and receives signals to and from the inspection cart C _2, and a control unit 210 that controls the lifting shelf 88.

The host computer 2 is a computer that controls the entire component mounting system 1 and is configured to control a plurality of component mounting apparatuses 10 in an integrated manner. For this purpose, for example, information data such as the work being executed and the board W of the work target is acquired from the component mounting apparatus 10. Further, when the defective substrate W _E occurs, in order to recover the defective substrate W _E from the component mounting line L, and is configured to control the plurality of component mounting device 10.

Defective substrate W _E is the flow recovered from the component mounting line L, it will be described with reference to FIG.

Testing the defect determination unit 80 of the camera 34 of the head T ₂ is inspected substrate W imaged cart C ₂ is determined to be defective (the defective substrate W _E occurs), defective substrate occurrence signal from the defective determination device 80 is a component mounting It is transmitted to the host computer 2 via the device 10.

The host computer 2 receives the defective substrate generation signal, prohibiting transfer of the substrate W to the work area S (the component mounting apparatus 10) for the defective substrate W _E (S1). During this prohibition, the upstream component mounting apparatus 10 of the component mounting apparatus 10 to defective substrate W _E occurs, when it is completed, without transporting the substrate W that is done on the downstream side waits. In addition, the work currently performed with respect to the other board | substrate W in the other work area S is stopped only by conveying the board | substrate W to the work area S where the defective board | substrate WE generate _| occur _| produced temporarily. Do not mean.

Then, the substrate was taken out arm 82 of the inspection cart C ₂ to defective substrate W _E is connected to the component mounting apparatus 10 that occurred, as shown in FIG. 8 (A), the second ends of the defective substrate W _E ( A black edge is gripped (S2).

When gripping of the defective substrate _{W E} of the substrate was taken out arm 82 is completed, the substrate transfer mechanism 20, to unclamp the defective substrate _{W E} (S3). Specifically, as shown in FIG. 6 (B), the ball screw 50f is rotated by the motor 50 g, conveyor 50a, and the 50b and the pressing plate 52 away from the defective substrate _{W E.} Thus, defective substrate W _E is the state removed from the substrate transfer mechanism 20.

When defective substrate W _E is removable from the substrate transfer mechanism 20, FIG. 8 (B), the turntable 84 the substrate was taken out arm 82 is defective substrate W _E of the inspection cart C ₂ is taken out from the substrate transfer mechanism 20 (S4). When taken out of the defective substrate W _E is completed, the host computer 2, the conveyance of the substrate W is allowed (prohibited is released) to a defective substrate W _E is retrieved work area S (the component mounting apparatus 10) (S5).

When the substrate was taken out arm 82 is placed a defective substrate _{W E} turntable 84 release the the defective substrate _{W E,} the turntable 84 as shown in FIG. 9 (A) is rotated 90 degrees (S6).

When the rotation of the turntable 84 is completed, as shown in FIG. 9 (B), by being pushed by the substrate feed mechanism 90 of the inspection cart C _2, defective substrate W _E on the turntable 84, the stock cart C ₃ Is stored in the lifting shelf 88. Thus, the recovery is complete from the work area S of the defective substrate W _E.

According to this embodiment, the substrate was taken out arm 82 of the inspection cart C _2, test results of failure determination device 80 via the test head T ₂ is defective substrate W _E conveying direction from the working area S (X axis direction) Is taken out in a direction (Y-axis direction) orthogonal to Thus, without stopping the work on another substrate W that is running in another work area S (the other of the component mounting apparatus 10) can be taken out defective substrate W _E.

Further, since the substrate transport mechanism 20 supports the substrate W only at the first ends in the direction (Y-axis direction) orthogonal to the transport direction (X-axis direction), the substrate take-out arm 82 is the second in the transport direction. Both ends can be gripped. Then, it is possible to take out the defective substrate W _E from the substrate transfer mechanism 20.

Further, since the transport direction (X axis direction) perpendicular to the direction (Y axis direction) to the defective substrate W _E is taken from the work area S, necessary to extend the component mounting line L for removal of the defective substrate W _E is Absent.

These result, without reducing the production efficiency of the component mounting line L, the defective substrate W _E can be promptly recovered from the component mounting line L immediately after generation.

  While the present invention has been described with reference to the above-described embodiment, the present invention is not limited to this embodiment.

  For example, in the case of the above-described embodiment, the defective substrate extraction apparatus that extracts a defective substrate from the work area is a substrate extraction arm that grips both ends of the defective substrate in the transport direction. However, the present invention is not limited to this. For example, an arm that can rotate a gripped defective substrate by 90 degrees, such as a turntable, may be used. In this case, the turntable can be omitted.

  In the case of the above-described embodiment, as shown in FIG. 6B, the substrate transport mechanism 20 that transports the substrate is arranged in a direction orthogonal to the substrate transport direction so that various sizes of substrates can be transported. Although the distance between the two conveyors 50a and 50b supporting both ends can be changed, it may not be changed. However, when there is a clamp device that fixes the substrate in the work area, such as the holding plate 52, the clamp device is placed in an unclamped state when the defective substrate is collected so that the defective substrate takeout device can take out the defective substrate from the substrate transport mechanism. There is a need to.

  Furthermore, in the case of the above-described embodiment, the inspection of the substrate is an inspection performed based on the image captured by the camera of the inspection head, but the present invention does not limit the content and method of the inspection. According to the present invention, a board that is determined to be defective by inspection is taken out from the component mounting line while suppressing a decrease in production efficiency of the component mounting line. The inspection for the substrate may be, for example, an inspection for energization of the substrate. In this case, for example, the inspection head has a terminal that contacts a current-carrying inspection electrode provided on the substrate and flows current to the electrode.

Furthermore, in the case of the above-described embodiment, the inspection cart C ₂ for taking out defective substrates and the stock cart C ₃ for stocking a plurality of defective substrates include a plurality of defective substrates collected from the component mounting line L at different locations. They are separate so that they can be checked, but they may be integrated. In addition, when it is not necessary to stock a plurality of defective substrates, such as when an operator can confirm the defective substrate immediately after the occurrence of the defective substrate, the number of defective substrates may be one.

In addition, in the case of the above-described embodiment, the feeder cart C ₁ , the inspection cart C ₂ , and the stock cart C ₃ are separate carts. For example, the wheel portions of each cart are configured to be separable, and the wheels Parts may be shared by multiple types of carts.

Additionally Also, when the component mounting system of the embodiment described above, the failure determination device (computer) 80 to determine the defects of the substrate which is captured on the basis of the image by the camera of the inspection head is captured, mounted on the inspection cart C ₂ However, it is not limited to this. For example, the host computer may similarly determine the defect of the imaged substrate based on the image captured by the inspection head camera.

  In addition, a board that has been determined to be defective and has been collected from the component mounting line may be allowed to be put into the work area by a defective board take-out device, such as when the operator confirms that there is no problem. May be)

In this case, the component mounting system 1 of the embodiment described above, for example, is placed the substrate did not have to check a problem with the turntable 84 of the inspection cart C ₂ by an operator, and the inspection cart C ₂ is connected When a loading operation is performed on the component mounting apparatus 10, the board take-out arm 82 of the inspection cart C ₂ is configured to load the board into the work area S of the component mounting apparatus 10.

  As a result, a board that has been determined to be defective by the inspection but has been confirmed as having no problem by the operator can be returned to the component mounting line again, and various operations can be subsequently performed on the board. Can do.

W substrate S work area L component mounting line T ₁ mounting head T ₂ inspection head 10 mounting device, inspection device (component mounting device)

Claims (5)

A component mounting system comprising a component mounting line comprising a plurality of work areas on which a substrate is mounted or a substrate is inspected,
A substrate transfer device that supports the substrate only at the first ends in the direction orthogonal to the transfer direction, and transfers the substrate so as to sequentially pass through the plurality of work areas;
A mounting device that is provided in a work area and mounts components on a substrate on the substrate transfer device;
An inspection device provided in a work area, for inspecting a substrate on the substrate transfer device;
A defect in which a substrate whose inspection result by the inspection apparatus is defective is taken out from the substrate conveyance apparatus in a work area by gripping the second ends in the conveyance direction in a direction orthogonal to the conveyance direction of the substrate conveyance apparatus. A component mounting system comprising: a board take-out device.   The component mounting system according to claim 1, wherein the defective board removing device is configured to be able to put a board into a work area.   3. The component mounting system according to claim 1, further comprising: a take-out substrate rotating device that rotates the substrate taken out by the defective substrate take-out device so that the first both end directions coincide with the transport direction.   4. The component mounting system according to claim 1, further comprising a substrate stock device that stocks the substrate taken out by the defective substrate take-out device while supporting the substrate at the first both ends. 5. A component mounting method in a component mounting line comprising a plurality of work areas in which a substrate is mounted with a component or a substrate is inspected,
A transport step of transporting the substrate by a substrate transport device that transports the plurality of work areas in order while supporting the substrate at the first ends of the substrate in a direction orthogonal to the transport direction;
A mounting step of mounting components on a board on the board transfer device in a work area;
An inspection process for inspecting the substrate on the substrate transfer device in a work area;
A defect in which a substrate whose inspection result in the inspection process is defective is taken out from the substrate transport apparatus in a work area by gripping the second ends in the transport direction in a direction orthogonal to the transport direction of the substrate transport apparatus. A component mounting method comprising: a substrate removing step.

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