WO2018026237A1 - Device for inspecting and correcting defects of printed circuit board and method therefor - Google Patents

Abstract

A device and a method for inspecting and correcting defects of a printed circuit board are disclosed. The device for inspecting and correcting defects of a printed circuit board inspects a printed circuit board having components arranged therein before a reflow process and detects a defect present on the substrate. The device for inspecting and correcting defects of a printed circuit board separates components associated with the detected defect from the substrate and can rearrange new components. The device for inspecting and correcting defects of a printed circuit board can store a solder or store the solder again after removing residual solder, in the process of separating and rearranging the components.

Description

Inspection and defect correction device of printed circuit board and its method

The present invention relates to an apparatus and method for inspecting whether a component mounted on a printed circuit board is defective and correcting the detected defect.

The component mounting process of the printed circuit board mounted in an electronic device is as follows. First, solder paste is printed on a pad portion for connecting a component to a circuit on a substrate. The component is mounted on the printed solder paste, and the terminal of the component mounted on the solder paste is electrically connected to the pad part by heat-treating the solder paste through a reflow process.

In the component mounting process of the printed circuit board as described above, a defect may occur in the component or component mounting for various reasons. For example, with respect to the mounting of components, there may be a problem that components other than the one originally designed to be mounted on a substrate are mounted, the designed component is not mounted, or a defect occurs in the mounted component. As another example, a reflow process may be performed on a substrate in a position or orientation different from the position or orientation in which the component is to be mounted, or in a state in which the component does not sufficiently contact the solder paste, thereby providing Poor electrical connections may occur. As another example, a failure in mounting a part may occur due to an error generated in the printing process of the solder paste on the substrate. That is, solder is not soldered on the substrate, resulting in poor contact between the component and the pad portion, solder is over-charged, or solder is not printed correctly at the designed location on the substrate, resulting in components or solders mounted on the substrate. Short may occur.

As a method for detecting various types of defects existing on the substrate as described above, automatic optical inspection (AOI) technology is utilized. The AOI technology obtains a two-dimensional or three-dimensional image of a component (for example, a component mounted on a substrate) through optical technology, and recognizes the appearance or state of the component from the acquired image, thereby determining whether the component is defective. It is a skill to judge. The component whose defect is confirmed through optical inspection or the board on which the component is mounted is discarded by an operator or subjected to proper defect correction before being transferred for further processing.

The present invention provides a system and method for correcting a defect in component mounting on a solder prior to mounting (or placing) the component on a solder printed on a printed circuit board and securing the component to the solder through a reflow process. It aims to do it.

In addition, the present invention can provide a system and method for removing or correcting a badly mounted component or solder in a printed circuit board having dense components, while minimizing the effect on components having a normal component mounting state on the solder. .

An inspection and failure correcting apparatus for a printed circuit board according to an embodiment of the present invention is an apparatus for inspecting and defect correcting a printed circuit board including a component disposed on a solder paste. An inspection unit for determining the position and type of the defect with respect to the component on the printed circuit board, and based on the position and type of the defect received from the inspection unit, removal of the component for the correction of the defect, direction adjustment of the component, and the component Removing a part on a printed circuit board by using a control unit for generating a control signal relating to at least one calibration operation of the arrangement of parts and a part operating means capable of temporarily holding the part according to the control signal Or a part calibration unit for adjusting the direction of the parts or placing the parts on the printed circuit board. Shall be.

According to another embodiment of the present invention, an inspection and failure correcting apparatus of a printed circuit board may include at least one of the type of the defect including component misalignment, component lifting, component position misalignment, component misalignment, solder nonpayment, and solder overpayment. It features.

The inspection and failure correction apparatus of a printed circuit board according to an embodiment of the present invention is characterized in that the component realignment unit separates from the substrate by fixing, adsorbing or adhering the parts associated with the failure according to the control signal. do.

The inspection and failure correction apparatus of a printed circuit board according to an exemplary embodiment of the present invention may further include a solder removing unit which removes solder remaining in a region where components are separated on the printed circuit board, and wherein the controller controls the residual solder. And further generating a control signal relating to the removing operation and separating the component associated with the defect from the substrate according to the control signal relating to the operation of removing the residual solder. It is characterized by removing the solder remaining in the area where the associated component is removed.

An inspection and failure correcting apparatus for a printed circuit board according to an exemplary embodiment of the present invention may further include a solder soldering part for soldering a solder to a region in which parts are separated on the printed circuit board, and the controller is configured to hold solder. Further generating a control signal relating to the operation and according to the control signal relating to the operation of replenishing the solder, after the component realignment separates the component associated with the defect from the substrate, the solder payment unit is associated with the defect. It is characterized by soldering solder to this separated region.

According to an embodiment of the present invention, an inspection and failure correcting apparatus of a printed circuit board may include a component associated with the failure at a position where the component realignment is separated from the component associated with the failure on the printed circuit board according to the control signal. It is characterized by relocating or placing new parts.

According to an embodiment of the present invention, an inspection and failure correcting apparatus of a printed circuit board may include, when the type of the defect is a component misalignment or a component position defect, the component realignment unit, according to the control signal, to determine a component associated with the defect. Separation from the printed circuit board by fixation, adsorption or adhesion, then repositioning the component to a location where the component associated with the defect is separated, or changing the placement direction after fixing, adsorption or bonding the component associated with the defect It features.

The inspection and failure correction method of a printed circuit board according to an embodiment of the present invention includes a inspection and failure correction of a printed circuit board performed by an inspection and failure correction apparatus of a printed circuit board including an inspection unit, a part correction unit, and a control unit. A method, comprising: inspecting a printed circuit board comprising a component disposed on solder paste to detect a location and type of a defect with respect to the component on the printed circuit board; Based on the location and type of the defect received from the controller, controlling the component correction to separate the component associated with the defect from the printed circuit board; The component to place a new component in a location where the component associated with the failure is removed from the substrate Characterized by including the step of controlling the government.

According to another embodiment of the present invention, a method for inspecting and fixing a printed circuit board may include a solder removing unit including the solder removing unit. And separating the solder from the printed circuit board, and removing the solder remaining in the region where the component associated with the defect is removed on the printed circuit board.

According to another embodiment of the present invention, a method for inspecting and fixing a printed circuit board may include: a solder tester for inspecting and inspecting a printed circuit board further comprising a solder soldering unit, wherein the control unit is configured to associate the defect with the defect. After separating the component from the printed circuit board, the solder holding unit further comprises controlling the solder to be soldered to a region in which the component associated with the defect is removed on the substrate.

A computer readable storage medium according to an embodiment of the present invention is characterized by including instructions for performing each step of the method according to the embodiments of the present invention.

The inspection and defect correction apparatus of the printed circuit board according to the present invention can automatically execute the correction operation of the defect when the arrangement state of the components on the substrate or the defect of the solder joint occurs.

In addition, the inspection and defect correction apparatus of the printed circuit board according to the present invention automatically detects and corrects defects, thereby improving the efficiency of the manufacturing process of the printed circuit board and the electronic device including the substrate and increasing the yield. Can be.

In addition, the inspection and failure correcting apparatus for a printed circuit board according to the present invention automatically removes the solder and resends the solder joint on the solder joint on the substrate, whereby the quality of the solder joint on the substrate is automatically reduced. Can be improved.

The inspection and defect correction apparatus of the printed circuit board according to the present invention automatically removes and replenishes the defective solder on the substrate, thereby preventing direct damage to the operator when the operator directly executes the defect correction operation. You can prevent it.

The apparatus for inspecting and defect correcting substrates according to the present invention is an environmental pollutant that may occur in solder-related operations by automating the removal and retention of solder during the removal of defective parts on the substrate, thereby performing more accurate solder removal and retention. It reduces the occurrence of, and reduces the capital investment cost to prevent environmental pollution.

1 is a perspective view of an inspection and defect correction apparatus of a substrate according to an embodiment of the present invention.

2 is a block diagram illustrating an apparatus for inspecting and correcting a substrate according to another exemplary embodiment of the present invention.

3 is a block diagram illustrating a device for inspecting and correcting a substrate according to another exemplary embodiment of the present invention.

Figure 4 is a block diagram showing the inspection and failure correction apparatus of the substrate according to another embodiment of the present invention.

5 is a block diagram illustrating an inspection and failure correcting apparatus for a substrate according to another exemplary embodiment of the present invention.

Figure 6 shows some examples of printing error forms of the solder to be corrected in the present invention.

7 is a flowchart illustrating a method of inspecting and inspecting a defect of a substrate according to an exemplary embodiment of the present invention.

8 is a flowchart illustrating a method of inspecting and correcting a substrate according to another embodiment of the present invention.

Embodiments of the present invention are illustrated for the purpose of illustrating the present invention. Embodiments of the invention may be implemented in various forms, it should not be construed that the invention is limited to the embodiments set forth below or the specific description of these embodiments.

As used herein, the term “unit” means software, hardware, or a combination of software and hardware implemented to perform a specific function. Functions provided within a component and "part" may be combined into a smaller number of components and "parts" or further separated into additional components and "parts".

All technical and scientific terms used herein have the meanings that are commonly understood by one of ordinary skill in the art unless otherwise defined. All terms used herein are selected for the purpose of more clearly describing the present invention and are not selected to limit the scope of the present invention.

As used herein, the singular forms "a", "an", and "the" also include the plural unless the context clearly dictates otherwise.

Expressions such as "first" and "second" used in various embodiments of the present invention are used to distinguish the elements, and do not limit the order, importance, etc. of the elements.

As used herein, "comprising" and "having" should be understood in open-ended terms unless specifically stated in the text.

The phrase "based on" is used herein to describe one or more factors that influence the decision, which term does not exclude additional factors used in the decision.

When a component is said to be "connected" or "connected" to another component, the component may or may not be directly connected to or connected to the other component. It is to be understood that there may be new other components between the other components.

As used herein, the term "substrate" may refer to a substrate on which electrical and electronic circuits are formed that may be used in an electronic device or an electromechanical device, which includes various kinds of components for constructing the electrical and electronic circuits. Can be mounted by soldering. As used herein, a "substrate" may include a printed circuit board that includes a two-dimensional or three-dimensional array of components that make up electrical and electronic circuits. To describe various embodiments of the present invention, "substrate", "circuit board" and "printed circuit board" may be used interchangeably with each other to have the same or similar meanings.

As used herein, the term "solder" refers to a material called solder paste, solder cream or cream solder prior to the reflow process, unless the context clearly or explicitly means otherwise.

In addition, as used herein, the term "batch" or "mount" refers to a state in which a component is seated, landed, or landed on solder printed on a substrate that has passed through a mounter, and through a reflow process for such a substrate. It refers to a state before the component and the pad on the substrate are fixedly bonded by the metal component of the solder.

The term "defect" as used herein may refer to various kinds of defects related to the placement of a component disposed on a substrate or a component on the substrate. As will be described in detail below, such defects may include uninserted defects, misalignment defects, lifting defects, position defects, component defects, and the like as defects related to components disposed on a substrate. In addition, as defects related to solder printing on a substrate, defects such as misplacement of solder, unsold solder, solder or overpayment, short circuit of circuit due to solder defect, and solder balls may be included. As used herein, the term “defect” is not limited to the above definitions and examples, and may refer to various types of defects generated in a process of mounting a component on a substrate.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The same reference numerals are used for the same elements in the drawings, and duplicate descriptions of the same elements are omitted.

Figure 1 shows a perspective view of the inspection and failure correction apparatus 10 of the substrate according to an embodiment of the present invention. As shown, the inspection and failure correction apparatus 10 of the substrate, the inspection unit for inspecting the substrate 450 on the transfer unit 900, the transfer unit 900 for transferring the substrate on which the component is placed (or mounted) after solder printing. (100), a part corrector 200 for correcting a defect of a component arrangement detected by the inspector 100, and a control unit for controlling operations of the transfer unit 900, the inspector 100, and the component corrector 200 ( 300).

The transfer unit 900 may move the one or more substrates to the inspection position below the inspection unit 100 or the calibration position below the component realignment 200 based on the control signal of the controller 300.

The inspection unit 100 may inspect the substrate 450 at the inspection position below based on the control signal of the control unit 300. When a defect is detected in the arrangement state of the component or the component on the substrate 450 by the inspection unit 100, the inspection unit 100 may transmit the defect detection result to the controller 300 and / or the component realignment 200. .

On the other hand, the transfer part 900 can transfer the board | substrate with which the defect was detected based on the control signal of the control part 300 to the correction position below the part aligning part 200. FIG.

The parts proofing unit 200 corrects the defects on the substrate transferred to the correction position below the parts proofing unit 200 based on the result of the defect detection from the inspection unit 100 or the control signal of the control unit 300. You can run

The transfer unit 900 may transfer the substrate whose defect is not detected or the substrate whose defect has been corrected by the component realignment 200 to a standby position for a subsequent process including a reflow process.

According to one embodiment, the inspection and failure correction apparatus 10 of the substrate may further include a solder removing unit 400 and the solder holding unit 500 for removing and retaining the solder on the substrate. According to another embodiment, the inspection and failure correction apparatus 10 of the substrate may omit the solder removing portion 400 and the solder holding portion 500 for removing and retaining the solder on the substrate.

2 shows a block diagram of an inspection and failure correction apparatus 20 of a substrate according to an embodiment of the invention. The apparatus 20 illustrated in FIG. 2 may include an inspection unit 100, a part realignment unit 200, and a control unit 300. In addition, the device 20 may be connected to the component placement equipment 800 and the reflow equipment 850, respectively. The apparatus 20 having such a configuration inspects the printed circuit board on which the component is placed by the component placement equipment 800 and corrects the defect on the substrate after the defect is detected. 850). The reflow equipment 850 performs heat treatment on the substrate on which the defect has been corrected, so that the terminal of the component on the substrate is connected to the pad.

More specifically, the inspection unit 100 performs an inspection on the substrate to determine whether there is a component disposed on the substrate or a defect in the component arrangement. For the inspection of the substrate, the inspection unit 100 may include a substrate automatic optical inspection (AOI) equipment, and may acquire a two-dimensional optical image or a three-dimensional optical image of the substrate through the AOI equipment. When the AOI equipment acquires the 3D image, the pattern object is irradiated to the inspection object (for example, the substrate on which the component is disposed), the substrate to which the pattern light is irradiated, and the photographed image is processed to process the inspection object. 3D image can be generated. According to one embodiment, the AOI equipment may be installed inside the inspection unit 100. According to another embodiment, the AOI equipment may be installed outside the inspection unit 100 and connected to the inspection unit 100 through wired or wireless communication. In this case, the inspection unit 100 may receive a 2D or 3D image of the substrate from the AOI equipment. For convenience of explanation, hereinafter, it is assumed that the inspection unit 100 acquires a 2D image of the substrate for inspection of the substrate.

The inspection unit 100 may examine an image of the substrate to determine a location of a component having a poor arrangement state and a type of the defect on the substrate. For example, the type of failure may include uninserted defects in which no component is placed on the substrate, misalignment defects that are displaced in a direction different from the direction in which the component placement on the substrate is designed, and a component placed on the substrate without being held in contact with the solder. One or more of various types of components or component placement defects, such as lifting defects, position defects that are placed in a different position from where the component is designed, substrate defects such as cracks in the components themselves placed on the substrate, It may include, but is not limited to. The inspection unit 100 may store a predetermined tolerance value used to determine whether or not a component or a component is disposed on the substrate. The inspection unit 100 compares the arrangement state of the components or components arranged on the substrate with the design criteria, and determines that the arrangement state of the components or components is poor when the comparison result deviates from the tolerance value. For example, if the tolerance value used at the time of determination of a distortion defect is set to 0.1 degree, the inspection part 100 compares the arrangement direction of the components on a board | substrate with the direction based on a design standard, and the difference exceeded 0.1 degree. In this case, it can be determined that a misalignment has occurred for the component.

In an embodiment, the inspection unit 100 may store CAD data corresponding to the design drawing or the design drawing indicating the arrangement (or layout) of the components on the substrate as a design criterion for determining a failure. In another embodiment, the inspection unit 100 may store image data photographing that the component or the arrangement state of the components is good as a design reference for determining a defect. The inspection unit 100 may receive the design criteria from an external computer device through wired or wireless communication.

In addition to the defects regarding the arrangement of components on the substrate, the inspection unit 100 may also determine the defects regarding the printing state of the solder on the substrate. The defects related to the printing state of the solder may include, but are not limited to, a printing position defect that is not printed at the position where the solder is designed, unpaid or soldered or overpaid solder, short between solders, solder balls, and the like. .

After determining that a failure has occurred on the substrate, the inspection unit 100 may generate data regarding the location and type of the failure on the substrate. The inspection unit 100 may transmit data regarding the location and type of the failure to the controller 300. If no defect is found in the substrate as a result of the inspection of the inspection unit 100, the apparatus 20 may transfer the substrate to the equipment 800 that performs a subsequent process, for example, a reflow process.

The part corrector 200 may perform a function of correcting a defect detected by the inspection unit 100 under control from the controller 300. The part realignment 200 may include a part manipulation means 210 that performs a corrective operation for correcting a defect, such as adjusting an arrangement state such as a position and a direction of a component associated with a defect or removing or removing a component from a board. It may include.

Based on the video image of the substrate received from the control unit 300 and the data on the position and type of the defect, the component corrector 200 temporarily holds the component in which the defect occurs using the component manipulation unit 210. holding to separate from the substrate. The component manipulation means 210 may be implemented using a negative pressure end portion that adsorbs the component at a negative pressure, such as a nozzle. In this case, the component operating means 210 may detach the component from the substrate by pulling the component after absorbing the component by the negative pressure type end portion. Alternatively, the part manipulation means 210 may be implemented using a mechanical fixture of the type, such as tweezers or forceps. In this case, the mechanical fixing part of the component operating means 210 may have a sufficiently fine structure so that the mechanical parts of the component operating means 210 do not affect other parts of the surroundings when the defective parts are separated on the substrate on which the minute parts are integrated. Alternatively, the part manipulation means 210 may be configured to separate the parts by means of an adhesive method. In this case, the component operating means 210 has an adhesive end portion with an adhesive layer formed thereon, and the adhesive layer of the adhesive end portion can be brought into close contact with the component, and the component adhered to the adhesive layer can be separated from the substrate while moving the adhesive end portion in a direction away from the substrate. have. The specific configuration of the component operating means 210 is not limited to the above listed means, and may be implemented by appropriately selecting any one of known electrical, chemical, and mechanical means used to separate the component from the substrate. .

When the control unit 300 controls the component realignment 200 to separate the component from the substrate, the control unit 300 precisely performs detailed operations of the component realignment 200 based on the image image of the substrate received from the inspection unit 100. Can be controlled. For example, when the component manipulation means 210 of the component corrector 200 is implemented using a negative pressure end portion, a mechanical fixed portion or an adhesive end portion, the controller 300 may be configured based on a three-dimensional image of the substrate. After confirming the position and direction of the part to be separated from the board, and the part realignment unit 200 moves the part operation means 210 according to the position or direction of the part, the part is moved to the negative pressure end portion, the mechanical high. It can be controlled to separate parts by adsorbing to the positive or adhesive end portion.

After the component associated with the defect is removed, the controller 300 may control the component realignment 200 to arrange a new component at a position where the component is removed on the substrate. The component realignment 200 may receive a new component from the buffer using the component manipulation unit 210 and arrange the component at a position where the component associated with the defect is separated on the substrate. At this time, the controller 300 may control the parts realignment 200 using data on the location and type of the defect received from the inspection unit 100.

On the other hand, for types of defects such as misalignment defects, the defects can be corrected by correcting only the arrangement direction of the components associated with the defects, instead of removing the components related to the defects and placing new components on the substrate. In one embodiment, if the type of the defect detected by the inspection unit 100 is a misalignment failure, the control unit 300 separates the component associated with the defect from the substrate, and then the direction of the corresponding component. It can be controlled to relocate by changing to the designed direction. In another embodiment, the controller 300 may control the component realignment 200 to change only the arrangement direction of the corresponding component using the component manipulation unit 210 without separating the component associated with the defect from the substrate. Using this calibration method, it is possible to efficiently correct defects in terms of cost and time as compared with taking new parts out of a buffer and placing them in a new place.

As described above, after the part corrector 200 corrects the part associated with the defect in the substrate, the apparatus 20 transfers the substrate back to the inspection unit 100 or executes the retest for retesting the substrate. Rather, it can be transferred to the next equipment, for example reflow equipment 850, for later processing.

In the above embodiments, it has been described that the part corrector 200 performs a work of correcting defects using a single part operating means 210. However, the inspection and failure correction apparatus of the substrate according to the present invention is not limited to the embodiments described above, and may include a part correction unit having other various functions and structures.

3 shows an apparatus 30 for inspection and failure correction of a substrate according to another embodiment of the present invention. The apparatus 30 may include an inspection unit 100, a part corrector 200, and a controller 300. In addition, the device 30 may be connected to the component placement equipment 800 and the reflow equipment 850, respectively. The apparatus 30 having such a configuration inspects the printed circuit board on which the component is placed by the component placement equipment 800, and when the defect is detected, corrects the defect on the substrate, and then reflows the substrate onto the substrate. 850). The reflow equipment 850 performs heat treatment on the substrate on which the defect has been corrected, so that the terminal of the component on the substrate is connected to the pad. Among the components of the apparatus 30 illustrated in FIG. 3, those indicated by the same reference numerals as the components of the apparatus 20 illustrated in FIG. 2 may have mutually similar or identical functions and configurations, and corresponding functions and Some description about a structure is abbreviate | omitted for convenience of description of this invention.

Parts repositioning 200 of the device 30, unlike the parts repositioning 200 of Fig. 2 includes a single component operating means 210, separating means 220, which can separate components from the substrate, And component repositioning means 230 capable of relocating the component or other component after the component is removed from the substrate. In the present embodiment, the part corrector 200 separates the part associated with the defect from the substrate using the part separating means 220 under the control of the controller 300, and uses the part rearranging means 230. New components can be placed on the substrate. For example, the component separating means 220 and the component rearranging means 230 each have a negative pressure end, such as a nozzle used in chip mount equipment, a mechanical end such as a tweezers or tongs, or a separating means using an adhesive end. And chip arrangement means, but is not limited thereto, and may be implemented by appropriately selecting any one of known electrical, chemical, and mechanical means used to separate a component from a substrate or to place a component on a substrate. Can be.

4 illustrates a substrate inspection and failure correction apparatus 40 according to another embodiment of the present invention. The apparatus 40 may include an inspection unit 100, a part corrector 200, and a controller 300. In addition, the device 40 may be connected to the component placement equipment 800 and the reflow equipment 850, respectively. On the other hand, the part realignment 200 of the device 40, unlike the part realignment 200 of FIG. 3, may not include the component rearrangement device 230, it may include only the component separation device 210. In addition, the device 40 or parts realignment 200 may be connected to the component placement equipment 800 via a buffer conveyor 700.

The device 40 having such a configuration inspects the printed circuit board on which the component is placed by the component placement equipment 800 and corrects the defect on the substrate after the failure is detected. 850). The reflow equipment 850 performs heat treatment on the substrate on which the defect has been corrected, so that the terminal of the component on the substrate is connected to the pad. Among the components of the apparatus 40 shown in FIG. 4, those indicated by the same reference numerals as the components of the apparatuses 20 and 30 shown in FIGS. 2 and 3 may have similar or identical functions and configurations. In addition, some description regarding the said function and a structure is abbreviate | omitted for convenience of description of this invention.

In the present embodiment having the above configuration, after the component realignment 200 separates the parts related to the defect from the substrate by using the component separating means 220, the device 40 removes the substrate from the buffer conveyor 700. It can be transferred back to the component placement equipment 800 through. If the component placement equipment 800 is currently processing a process of placing a component on another substrate, the device 40 may include a buffer conveyor so that the substrate from which the component associated with the defect is removed remains on the buffer conveyor 700. 700 can be controlled. In this case, the buffer conveyor 700 may transfer the substrate from which the component related to the defect is removed to the component placement equipment 800 after the component placement equipment 800 completes the current work. If necessary, the control unit 300 may transmit data on the location and type of the defect to the component arrangement apparatus 800 together. The component placement apparatus 800 may rearrange the components on the substrate transmitted from the component realignment 200, and then transfer the substrate to the inspection unit 100 of the apparatus 40, or to proceed with a subsequent process. Can be transferred to the next piece of equipment.

The inspection and failure correction apparatus of the printed circuit board of the present invention described through the above embodiments, when the failure is detected by inspecting the arrangement of the components on the substrate before performing the reflow process for the substrate on which the components are disposed You can do this automatically. Through this, it is possible to lower the defective rate of products including substrates, such as a printed circuit board, and to automate the removal of defective parts of the substrate, which has been performed by hand, to streamline the process and improve the working speed to increase the yield. .

5 shows an apparatus 50 for inspection and failure correction of a substrate according to another embodiment of the present invention. The apparatus 50 may include an inspection unit 100, a part corrector 200, and a controller 300. In addition, the device 50 may be connected to the component placement equipment 800 and the reflow equipment 850, respectively. On the other hand, the device 50, after the component realignment 200 separates the component from the substrate is detected defective, the solder removal unit 400 and the solder holding unit 500 to perform the solder removal and storage of the substrate. ) May be further included.

The apparatus 50 having such a configuration inspects the printed circuit board on which the component is placed by the component placement equipment 850 and corrects the defect on the substrate after the failure is detected. 850). The reflow equipment 850 performs heat treatment on the substrate on which the defect has been corrected, so that the terminal of the component on the substrate is connected to the pad. Among the components of the apparatus 50 shown in FIG. 5, those denoted by the same reference numerals as the components of the apparatuses 20, 30, and 40 shown in FIGS. 2 to 4 are similar to each other or have the same function and configuration. Some description of the function and configuration is omitted for convenience of description of the present invention.

FIG. 6 illustrates examples of printing error forms of the solder to be corrected in the present invention. In one example, as shown in FIG. 6, when the component 610 is separated from the substrate 650, the solder 612. May remain on the substrate 650 as it is. In this case, no special processing needs to be performed on the solder 612, and according to the control of the controller 300, the component corrector 200 rearranges the components on the solder 612 of the substrate 650, or the apparatus 50. The substrate may be transferred to the component placement apparatus 800 such that the component placement apparatus 800 may rearrange the components over the solder 612 of the substrate 650.

In another example, as with solder 622 of FIG. 6, after component 620 is separated from substrate 650, a portion of solder 622 is attached to separated component 620 and substrate 650. And the remaining portion of solder 622 may remain on substrate 650. In this case, in order to reposition the component 620 to the solder 622 on the substrate 650, it is necessary to hold the solder. Alternatively, even when the type of the defect detected by the inspection unit 100 is a defect of the solder instead of a defect of the component, the soldering of the solder is similarly necessary. That is, even when solder according to the design is unpaid or sintered on the substrate, it is necessary to correct such defects by separating the related components from the substrate and then storing the solder having the defects.

In order to correct the solder defects as described above, the solder soldering unit 500, after the component corrector 200 separates the component from the substrate, solder solder to the solder 622 under the control of the control unit 300. You can run In another example, the solder holding part 500 may store solder when the entire solder is removed while the component is separated from the substrate 650, or when a defect of the type such as non-payment of solder is detected on the substrate 650. Solder can also be retained. The solder holding part 500 may be implemented by using a conventional technique such as a solder dispenser used to apply solder to a substrate to hold solder.

On the other hand, if the solder 622 remains after removing the component 520 from the substrate 650, or if the defect type of solder is soldered, depending on the current state of the solder on the substrate 650, the solder to be retained The amount of may be inconsistent. In another example, as in the solder 632 of FIG. 6, the shape of the solder 632 may be changed in the process of separating the component 630 from the substrate 650. In another example, the solder defect detected by the inspection unit 100 may include a solder ball or a short due to over soldering or over soldering. In such a case, it is difficult to completely correct a defect only by supplying solder to the substrate 650.

In order to correct the solder defects as described above, the solder removing unit 400, after the component corrector 200 separates the component from the substrate, before the soldering unit 500 is performed by the solder holding unit 500, the control unit 300 ), The remaining solder printed on the separated position of the components on the substrate or the defective solder can be removed. The solder removing unit 400 may be implemented using an inhaler or solder wick, which is conventionally used to remove solder. For the substrate from which the solder has been removed, the solder storage unit 500 may perform solder storage.

7 is a flowchart illustrating a defect inspection and calibration method of a substrate according to an exemplary embodiment of the present invention. The method illustrated in FIG. 7 may be performed by any one of the defect inspection and correction apparatuses 20, 30, and 40 of the substrate described with reference to FIGS. 2 to 4.

First, in step S710, the inspection unit of the defect inspection and correction apparatus inspects the substrate on which the component is placed and detects a defect on the substrate from the inspection result. For example, as described with reference to FIGS. 2 to 4, the inspection unit 100 may acquire an image image of a substrate, and detect a defect regarding a component or an arrangement state of the component on the substrate from the obtained image image. have. In one embodiment, the inspection unit 100 receives an image image of the substrate photographed by the AOI equipment mounted therein or installed externally, and detects a defect regarding the component or the arrangement state of the component on the substrate from the received image image. Can

Next, in step S720, the control unit of the defect inspection and correction apparatus controls the part realignment to separate the component associated with the detected defect from the substrate. For example, as described with reference to FIGS. 2 to 4, the component corrector 200 may remove a component related to the defect on the substrate based on the location and type of the defect received from the inspection unit 100. have.

In step S730, the control unit of the defect inspection and correction device controls the part realignment to place a new part in the position where the parts are separated on the substrate. For example, as described with reference to FIGS. 2 to 5, the component realignment 200 may arrange a new component or relocate the removed component at a position where a component related to a defect is removed on the substrate. In another example, component placement equipment instead of component realignment 200 may relocate the product to a location where the component associated with the defect has been removed from the substrate.

8 illustrates a defect inspection and correction method of a substrate according to another embodiment of the present invention. The method illustrated in FIG. 8 may be performed by, for example, the defect inspection and correction apparatus 50 of the substrate described with reference to FIG. 5.

First, in step S810, the inspection unit of the defect inspection and correction apparatus inspects a substrate on which a component is placed and detects a defect on the substrate from the inspection result. Next, in step S820, the control unit of the defect inspection and correction apparatus controls the part calibration, and separates the component associated with the detected defect from the substrate.

After executing step S820, in step S830, the controller of the defect inspection and correction apparatus controls the solder removing unit to remove the solder remaining in the region where the component associated with the defect is removed. For example, as described with reference to FIGS. 5 and 6, when the shape of the solder 632 is changed in the process of separating the component 630 from the substrate 650, a short due to over or over solder, Alternatively, in order to correct solder defects such as solder balls, the solder removing unit 400 may include a control unit (B) after the component corrector 200 separates the component from the substrate and before the soldering unit 500 performs the soldering. According to the control of 300, the remaining solder printed on the position where the components on the substrate are separated or the solder in which the defect occurs may be removed.

Next, in step S840, the control unit of the defect inspection and correction device controls the solder holding unit, so that the solder is stored in the region where the component associated with the defect is removed. After the solder is replenished, in step S850, a step of relocating an existing or new component to a position where components on the substrate are separated may be performed. However, as described above, although the placement of the new component may be performed after the removal and retention process of the solder, depending on the state of the solder at the removed position of the component on the substrate, there is no solder removal process and the retention process after removing the component from the substrate. Placement of new parts may be performed. In addition, depending on the type of defect detected on the substrate, only soldering in accordance with step S840 may be performed without performing step S830.

While the invention has been described and illustrated by way of preferred embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the appended claims.

[Description of the code]

10, 20, 30, 40, 50: board inspection and defect correction device

100: inspection unit

200: parts correction

300: control unit

400: solder removal part

500: solder joint

Claims (18)

1. An apparatus for inspecting and calibrating a printed circuit board including a component disposed on a solder paste, the apparatus comprising:

   An inspection unit for inspecting the printed circuit board to determine the location and type of the defect with respect to the component on the printed circuit board;

   A controller configured to generate a control signal for at least one calibration operation of removing a part, adjusting a part's direction, and arranging the part for correcting the defect based on the position and type of the defect received from the inspecting unit; And

   According to the control signal, by using a component operating means capable of temporarily holding a component, the component on the printed circuit board is removed, the component is oriented, or the component is placed on the printed circuit board. Posted by

   Including,

   Device for inspection and defect correction of printed circuit boards.
2. The method of claim 1,

   The type of failure includes at least one of component misalignment, component lifting, component location failure, component misplacement, solder non-lead, solder solder, solder solder,

   Device for inspection and defect correction of printed circuit boards.
3. The method of claim 1,

   The component realignment unit, according to the control signal, to fix, attract or bond the components associated with the failure to separate from the printed circuit board,

   Device for inspection and defect correction of printed circuit boards.
4. The method of claim 3,

   Further comprising a solder removal portion for removing the solder remaining in the region separated parts on the printed circuit board,

   The control unit further generates a control signal for the operation of removing the residual solder,

   According to a control signal relating to the operation of removing the residual solder, after the component realignment separates the component associated with the defect from the printed circuit board, the solder removal unit removes the component associated with the defect on the printed circuit board. To remove the solder remaining in the area,

   Device for inspection and defect correction of printed circuit boards.
5. The method of claim 3,

   Further comprising a solder soldering portion for soldering the solder to the separated region on the printed circuit board,

   The control unit further generates a control signal for the operation of soldering solder,

   According to a control signal relating to the operation of holding the solder, after the component realignment separates the component associated with the defect from the printed circuit board, the solder holding unit delivers the solder to an area where the component associated with the defect is separated. doing,

   Device for inspection and defect correction of printed circuit boards.
6. The method of claim 1,

   The component manipulation means includes a negative pressure end portion for adsorbing the component associated with the defect at negative pressure to separate the component associated with the defect from the printed circuit board.

   Device for inspection and defect correction of printed circuit boards.
7. The method of claim 1,

   The component operating means includes a mechanical fixing portion for fixing the component associated with the defect to the tweezers or tongs to separate the component associated with the defect from the printed circuit board,

   Device for inspection and defect correction of printed circuit boards.
8. The method of claim 1,

   The component manipulation means comprises an adhesive end portion which adheres the adhesive layer to the component associated with the defect and separates the component associated with the defect from the printed circuit board,

   Device for inspection and defect correction of printed circuit boards.
9. The method of claim 1,

   According to the control signal, the component realignment may relocate a component associated with the defect or place a new component in a position where the component associated with the defect is separated on the printed circuit board.

   Device for inspection and defect correction of printed circuit boards.
10. The method of claim 1,

    When the type of the defect is a component misalignment or a component position defect, the component corrector, according to the control signal, separates from the printed circuit board by fixing, adsorbing or adhering the component associated with the defect, and then associated with the defect. Relocating the part to a location where the part is separated, or fixing, adsorbing, or gluing the part associated with the defect, and then changing the placement direction,

    Device for inspection and defect correction of printed circuit boards.
11. An inspection and failure correction method of a printed circuit board performed by an inspection and failure correction apparatus of a printed circuit board including an inspection unit, a part correction unit, and a control unit,

    Inspecting, by the inspection unit, a printed circuit board comprising a component disposed on solder paste to determine a location and type of a defect with respect to the component on the printed circuit board;

    The control unit generates a control signal for at least one calibration operation of removing a part, adjusting a part's direction, and arranging a part to correct the defect, based on the position and type of the defect received from the inspecting unit. step;

    The component corrector removes the component on the printed circuit board, adjusts the direction of the component, or uses the component operating means capable of temporarily holding the component according to the control signal. Steps to Place Parts

    Including,

    Method of inspection and bad calibration of printed circuit boards.
12. The method of claim 11,

    The type of failure includes at least one of component misalignment, component lifting, component placement failure, component misplacement, solder non-lead, solder solder, solder over solder,

    Method of inspection and bad calibration of printed circuit boards.
13. The method of claim 11,

    Removing the component on the printed circuit board, or adjusting the orientation of the component, or placing the component on the printed circuit board, the component realignment, in accordance with the control signal, to fix the component associated with the failure, Adsorbing or adhering to separate from the printed circuit board,

    Method of inspection and bad calibration of printed circuit boards.
14. The method of claim 11,

    The inspection and failure correction apparatus of the printed circuit board further includes a solder removal portion,

    The method,

    Generating, by the control unit, a control signal relating to an operation of removing residual solder; And

    According to a control signal relating to the operation of removing the residual solder, after the component realignment separates the component associated with the defect from the printed circuit board, the solder removal unit removes the component associated with the defect on the printed circuit board. Further comprising removing solder remaining in the region,

    Method of inspection and bad calibration of printed circuit boards.
15. The method of claim 11,

    The inspection and failure correction apparatus of the printed circuit board further includes a solder holding portion,

    The method,

    Generating, by the control unit, a control signal relating to an operation of holding solder; And

    According to a control signal relating to the operation of soldering the solder, after the component realignment separates the component associated with the defect from the printed circuit board, the solder holder is removed from the component associated with the defect on the printed circuit board. Further comprising soldering the region to the region,

    Method of inspection and bad calibration of printed circuit boards.
16. The method of claim 11,

    Removing a component on the printed circuit board, adjusting a direction of the component, or arranging the component on the printed circuit board may include the component realignment on the printed circuit board according to the control signal. Relocating the part associated with the defect or placing a new part at a location where an associated part is separated;

    Method of inspection and bad calibration of printed circuit boards.
17. The method of claim 11,

    Removing the component on the printed circuit board, orienting the component, or arranging the component on the printed circuit board may include: when the type of the defect is component misalignment or component position defect, According to the control signal, after fixing the component associated with the defect, by adsorbing or adhering to remove it from the printed circuit board, repositioning the component in a position where the component associated with the defect is separated, or fixing the component associated with the defect Changing the placement direction after adsorption or adhesion,

    Method of inspection and bad calibration of printed circuit boards.
18. A computer readable storage medium comprising instructions for performing each step of a method for inspecting and calibrating a printed circuit board according to any one of claims 11 to 17.

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