JP2006319378A - Electronic component mounting system and method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting system and the method therefor which prevent mounting failures due to misalignment of printed solder in an electronic component mounting process. <P>SOLUTION: In the electronic component mounting system for manufacturing a mounting board by mounting an electronic component on a board by means of solder bonding, the position 6* of the center of gravity of an electrode 6 formed on the board and the position 5* of the center of gravity of solder paste 5 printed on the electrode are detected in advance and outputted as electrode position data and solder position data, and, when the electronic component 7 is mounted on the board, the position control of a mounting head is made using a mounting point PM set at a middle point between the position 6* of the center of gravity of the electrode 6 and the position 5* of the center of gravity of the solder paste 5, as a target. This enables to reduce probability of occurrence of mounting failures due to the misalignment of the printed solder in the electronic component mounting process. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component mounting system and an electronic component mounting method for mounting electronic components on a substrate.

  In recent years, with the miniaturization of electronic components and the advancement of mounting density, the positional accuracy when mounting the electronic components on the electrodes of the substrate has also been advanced. For example, an electronic component having a minute size of about 0.6 mm × 0.3 mm has already been put into practical use, and when mounting such an electronic component, extremely high mounting position accuracy is required. Therefore, when an electronic component is mounted on an electrode formed on a substrate by driving a transfer head, a recognition mark provided on the substrate is used so that the electronic component is correctly aligned with the electrode. By recognizing, the electrode position is specified.

  However, the mounting of the above-described electronic component of a small size has a problem in mounting position accuracy described below, which causes a problem after mounting. Hereinafter, a conventional mounting method for a minute electronic component will be described with reference to the drawings. FIG. 9 is a process explanatory diagram of a conventional electronic component mounting method. In FIG. 9A, the substrate 4 is provided with a number of electrodes 6 to which electronic components are soldered. A solder paste S is printed on the electrode 6 prior to the electronic component mounting process. In the mounting process, each electrode is recognized based on the mounting position data by recognizing the recognition mark 4a provided at the corner portion of the substrate 4. 6 is specified, and an electronic component 7 is mounted on the electrode 6.

  By the way, the printing position of the solder paste S printed on the electrode 6 of the substrate 4 does not necessarily coincide with the position of the electrode 6 due to the time-dependent deformation of the substrate 4 or the screen mask, and is shown in FIG. As shown in FIG. In this state, when the electronic component 7 is mounted on the basis of the position of the electrode 6 as described above, the center line of the terminal 7a of the electronic component 7 corresponds to the printed solder paste S as shown in FIG. Thus, the position is shifted. When the substrate 4 is sent to the reflow process and heated as it is, as shown in FIG. 9C, the “chip standing” in which the electronic component 7 rises due to the surface tension of the molten solder occurs in the melting process of the solder paste S. There is a case.

  Further, for the purpose of avoiding such a defect caused by the positional deviation between the solder paste S and the electronic component 7, the positional deviation of the solder paste S is detected in advance by image recognition, and the electronic position is determined based on the detected position of the solder S. If the method of mounting the component 7 is adopted, the following mounting failure may be caused. That is, in the case of a fine pitch electrode intended for a micro component, the distance between the electrodes is small, and therefore, as shown in FIG. 9D, the molten solder is attracted to the adjacent electrode as shown in FIG. Rotate and move in the θ direction, and “bridges” that are partially soldered to adjacent electrodes are likely to occur. As described above, the conventional electronic component mounting method has a problem in that mounting failure occurs due to a positional shift during solder printing.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting failure caused by a solder printing position shift during electronic component mounting.

The electronic component mounting system according to claim 1 is an electronic component mounting system for manufacturing a mounting substrate by mounting electronic components on a substrate by solder bonding, and the position of an electrode for electronic component bonding formed on the substrate, and An inspection unit that detects the position of the solder printed on the electrode and outputs the position detection result as electrode position data and solder position data; the center of gravity position of the pair of electrodes shown in the electrode position data; and the 1 shown in the solder position data Calculate the midpoint of the center of gravity of the solder printed on the pair of electrodes, and set the position that is biased to either the center of gravity of the electrode or the center of gravity of the solder from this midpoint as the mounting point A mounting position calculation unit, a mounting head for holding and transporting the electronic component to the substrate, a head driving mechanism for moving the mounting head, and controlling the head driving mechanism. And a control unit for controlling the position of the mounting head the mounting point as a target.

  The electronic component mounting method according to claim 2 is an electronic component mounting method for manufacturing a mounting substrate by mounting an electronic component on a substrate by solder bonding, and the position of the electrode for bonding the electronic component formed on the substrate and the electrode A position detection step of detecting the position of solder printed on the substrate and outputting the position detection result as electrode position data and solder position data, and picking up an electronic component from the component supply unit by the mounting head and transferring it to the substrate on which the solder is printed A mounting step of mounting, and in this mounting step, the midpoint between the center of gravity position of the pair of electrodes shown in the electrode position data and the center of gravity position of the solder printed on the pair of electrodes shown in the solder position data Further, a position deviated from the midpoint to either the center of gravity of the electrode or the center of gravity of the solder is set as a mounting point, and the mounting point is set as the target. Controlling the position of the mounting head.

  According to the present invention, in the mounting step of detecting the position of the electrode and the position of the solder printed on the electrode, outputting the position detection result as electrode position data and solder position data, and transporting and mounting the electronic component on the substrate by the mounting head By controlling the head driving mechanism based on both the electrode position data and the solder position data, it is possible to reduce the probability of mounting failure due to a solder printing position shift during electronic component mounting.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram showing the configuration of an electronic component mounting system according to an embodiment of the present invention, FIG. 2 is a block diagram showing the configuration of an appearance inspection apparatus according to an embodiment of the present invention, and FIG. 4 is a block diagram showing a configuration of a screen printing apparatus according to an embodiment, FIG. 4 is a block diagram showing a configuration of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 5 is a diagram of a reflow apparatus according to an embodiment of the present invention. FIG. 6 is a block diagram of the control system of the electronic component mounting system according to the embodiment of the present invention, FIG. 7 is an explanatory diagram of the appearance inspection of the substrate according to the embodiment of the present invention, and FIG. It is explanatory drawing of the mounting position calculation method in the electronic component mounting method of one embodiment of this invention.

  First, an electronic component mounting system will be described with reference to FIG. 1, the electronic component mounting system is a manufacturing system that manufactures a mounting substrate by mounting electronic components on a substrate by solder bonding, and includes a substrate inspection device M1, a printing device M2, a printing inspection device M3, an electronic component mounting device M4, An electronic component mounting line 1 formed by connecting the mounting state inspection device M5, the reflow device M6, and the mounting state inspection device M7 is connected by a communication network 2, and the whole is controlled by a management computer 3.

The board inspection apparatus M1 detects the position of the electrode for joining electronic components formed on the board, and outputs the position detection result as electrode position data. The printing apparatus M2 screen-prints a solder paste for joining electronic components on the electrodes of the substrate. The print inspection apparatus M3 detects the position of the solder paste printed on the electrodes by inspecting the printing state on the printed substrate, and outputs the position detection result as solder position data. The electronic component mounting apparatus M4 mounts an electronic component on a substrate on which a solder paste is printed. The mounting state inspection apparatus M5 inspects the presence / absence of the electronic component and the displacement on the substrate after the electronic component is mounted. The reflow device M6 heats the substrate after the electronic component is mounted, and solders the electronic component to the substrate. The mounting state inspection device M7 inspects the mounting state of the electronic component on the substrate after solder bonding.

  The board inspection apparatus M1 and the print inspection apparatus M3 detect the positions of the electrodes for joining electronic components formed on the board and the positions of the solder printed on the electrodes, and output the position detection results as electrode position data and solder position data. It is an inspection department.

  Next, the configuration of each device will be described. First, with reference to FIG. 2, a board inspection apparatus M1, a print inspection apparatus M3, a mounting state inspection apparatus M5, and an appearance inspection apparatus used as a mounting state inspection apparatus will be described. In FIG. 2, a substrate holder 11 is disposed on the positioning table 10, and the substrate 4 is held on the substrate holder 11. A camera 13 is disposed above the substrate holding unit 11 with the imaging direction facing downward, and the camera 13 images the substrate 4 in a state where the illumination unit 12 provided in the periphery is turned on. At this time, by controlling the table driving unit 14 and driving the positioning table 10, an arbitrary position of the substrate 4 can be positioned immediately below the camera 13 and imaging can be performed.

  Image data acquired by imaging is subjected to image processing by the image recognition unit 17 and a predetermined recognition result is output. The inspection processing unit 16 performs pass / fail determination for each inspection target item based on the recognition result, and outputs a detection value as feedback data and feedforward data for a predetermined item. The output data is transferred to the management computer 3 and other devices via the communication unit 18 and the communication network 2. The inspection control unit 15 controls the inspection operation by controlling the table driving unit 14, the camera 13, and the illumination unit 12.

  Next, the configuration of the printing apparatus M2 will be described with reference to FIG. In FIG. 3, a substrate holder 21 is disposed on the positioning table 20. The substrate holding unit 21 holds the substrate 4 sandwiched from both sides by the clamper 21a. A mask plate 22 is disposed above the substrate holding portion 21, and a pattern hole (not shown) corresponding to the printing portion of the substrate 4 is provided in the mask plate 22. By driving the positioning table 20 by the table driving unit 24, the substrate 4 moves relative to the mask plate 22 in the horizontal direction and the vertical direction.

  A squeegee portion 23 is disposed above the mask plate 22. The squeegee unit 23 includes an elevating and depressing mechanism 23b that elevates and lowers the squeegee 23c relative to the mask plate 22 and presses the mask plate 22 with a predetermined pressing force (printing pressure), and a squeegee moving mechanism 23a that horizontally moves the squeegee 23c. The elevation pressing mechanism 23 b and the squeegee moving mechanism 23 a are driven by the squeegee driving unit 25. With the substrate 4 in contact with the lower surface of the mask plate 22, the solder paste 5 is moved to a pattern (not shown) by horizontally moving the squeegee 23c at a predetermined speed along the surface of the mask plate 22 to which the solder paste 5 is supplied. It is printed on the upper surface of the substrate 4 through the holes.

  This printing operation is performed by controlling the table driving unit 24 and the squeegee driving unit 25 by the printing control unit 27. In this control, the operation of the squeegee 23c and the alignment between the substrate 4 and the mask plate 22 are controlled based on the print data stored in the print data storage unit 26. The display unit 29 displays various types of index data indicating the operating state of the printing apparatus and an abnormality notification indicating an abnormality in the printing operation state. The communication unit 28 exchanges data with the management computer 3 and other devices constituting the electronic component mounting line 1 via the communication network 2.

Next, the configuration of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 4, a substrate holder 31 is disposed on the positioning table 30, and the substrate holder 31 is connected to the printing inspection apparatus M.
The substrate 4 conveyed from 3 is held. A mounting head 32 is disposed above the substrate holding unit 31, and the mounting head 32 is moved between the component supply unit (not shown) and the substrate 4 by the head driving mechanism 33. The mounting head 32 includes a nozzle 32a that sucks an electronic component, and picks up and holds the electronic component supplied from the component supply unit by the nozzle 32a. Then, the mounting head 32 is moved onto the substrate 4 and lowered with respect to the substrate 4, whereby the electronic component held by the nozzle 32 a is transferred and mounted on the substrate 4.

  A control system of the electronic component mounting apparatus M4 will be described. The mounting data storage unit 36 stores electrode position data 36a, solder position data 36b, and mounting position data 36c. The electrode position data 36a is data indicating the electrode position of the board 4 measured and fed forward by the board inspection apparatus M1, and the solder position data 36b is the solder printing position measured and fed forward by the print inspection apparatus M3. It is data. The mounting position data 36c is data indicating mounting coordinates when the electronic component is mounted on the substrate 4 by the mounting head 32. The mounting position calculation unit 37a of the mounting control unit 37 converts the electrode position data 36a and the solder position data. Based on the calculation, it is written in the onboard data storage unit 37. A method of calculating the mounting position data 36c will be described later.

  The head driving mechanism 33 and the positioning table 30 are driven by a mounting head driving unit 35 and a table driving unit 34, respectively. The mounting head driving unit 35 and the table driving unit 34 are controlled by a mounting control unit 37. In this mounting operation, the mounting control unit 37 controls the table driving unit 34 and the mounting head driving unit 35 based on the mounting position data 36 c stored in the mounting data storage unit 26, so that the mounting head 32 applies the substrate 4. The electronic component mounting position can be controlled. That is, the mounting control unit 37 is a control unit that controls the head driving mechanism 33 based on the electrode position data and the solder position data.

  The display unit 39 displays index data indicating various operating states of the electronic component mounting apparatus M4 and an abnormality notification indicating an abnormality in the mounting operation state. The communication unit 38 exchanges data with the management computer 2 and other devices constituting the electronic component mounting line 1 via the communication network 2.

  Next, the configuration of the reflow apparatus will be described with reference to FIG. In FIG. 5, a transport path 41 for transporting the substrate 4 is horizontally disposed in the heating chamber 42 provided on the base 40. The inside of the heating chamber 42 is partitioned into a plurality of heating zones, and each heating zone is provided with heating means 43 having a temperature control function. In a state where each heating zone is heated to a predetermined temperature condition by driving the heating means 43, the substrate 4 on which the electronic component is mounted on the solder paste is sequentially passed through the heating zone from the upstream side, thereby The solder component is melted by heating. As a result, the electronic component is soldered to the substrate 4.

  In this reflow process, each heating means 43 is controlled by the heating control unit 47 based on the heating data stored in the heating data storage unit 46, that is, the temperature command value which is a control parameter for realizing the temperature profile in the reflow process. Thus, a desired temperature profile is set. The display unit 49 displays index data indicating the operating state of the reflow device M6 and abnormality notification indicating that a deviation from a predetermined temperature condition exceeds an allowable range and the heating operation state is abnormal. The communication unit 48 exchanges data with the management computer 3 and other devices constituting the electronic component mounting line 1 via the communication network 2.

Next, the configuration of the control system of the electronic component mounting system will be described with reference to FIG. Here, a data transfer function for the purpose of quality control in the electronic component mounting process will be described. In FIG. 6, the overall control unit 50 is responsible for the quality management function in the control processing range executed by the management computer 3, and is transferred from each device constituting the electronic component mounting line via the communication network 2. Data is received, necessary determination processing is performed based on a predetermined determination algorithm, and the processing result is output as command data to each device via the communication network 2.

  That is, the board inspection processing unit 16A, the printing inspection processing unit 16B, and the mounting included in the board inspection apparatus M1, the printing inspection apparatus M3, the mounting state inspection apparatus M5, and the mounting state inspection apparatus M7 using the appearance inspection apparatus shown in FIG. The state inspection processing unit 16C and the mounting state inspection processing unit 16D are connected to the communication network 2 via the communication units 18A, 18B, 18C, and 18D, respectively. Each unit (see FIGS. 3, 4, and 5) provided in the printing apparatus M2, the electronic component mounting apparatus M4, and the reflow apparatus M6 is connected to the communication network 2 via the communication units 28, 38, and 48, respectively.

  As a result, feedback processing for correcting / updating the control parameters of the upstream device based on data extracted in one of the inspection processes and feedforward processing for correcting and updating the control parameters of the downstream device are performed by each device. The configuration is possible at any time during operation.

  This electronic component mounting system is configured as described above. Hereinafter, calibration performed in the electronic component mounting method and the mounting process, that is, control parameter correction / update processing will be described. First, the substrate 4 supplied from a substrate supply unit (not shown) is carried into the substrate inspection apparatus M1 (see FIG. 2). Here, by imaging the substrate 4 with the camera 13 and recognizing the image, the electrodes 6 formed on the substrate 4 are recognized for each electrode part as shown in FIG. As a result, the position data (electrode position data) indicating the barycentric position 6 * of the pair of electrodes 6 in each electrode part is set as coordinate values xL (i), yL (i) with the recognition mark 4a of the substrate 4 as a reference. It is obtained and sent to the substrate inspection processing unit 16A.

  The board inspection processing unit 16A performs inspection processing based on a plurality of coordinate values obtained for each electrode part. In other words, the coordinate values are statistically processed to determine whether or not the board can be used, and the position deviation amount from the normal position is fed forward to the downstream apparatus as electrode position data. The electrode position data is transferred to the communication network 2 via the communication unit 18A, and is output as a correction command value by the overall control unit 50 to the downstream printing apparatus M2 and electronic component mounting apparatus M4.

  Next, the substrate 4 is carried into the printing apparatus M <b> 2 and held by the substrate holding unit 21. A solder paste 5 is printed on the substrate 4. At this time, the correction command value based on the electrode position data is stored in the print data storage unit 26 by the feedforward process described above, and when the positioning table 20 is driven to align the substrate 4 with the mask plate 22. The movement amount of the positioning table 20 is corrected based on this correction command value. Thereby, even when the electrode is displaced from the normal position with respect to the recognition mark 4a of the substrate 4, the solder paste is printed at the correct position on the electrode 6 in the printing apparatus M2.

  Next, the board 4 after the solder paste printing is carried into the printing inspection apparatus M3. Here, the position data (solder position) indicating the center of gravity position 5 * of the solder paste 5 printed on the pair of electrodes 6 for each electrode part as shown in FIG. Data) is obtained by image recognition as coordinate values xS (i), yS (i) based on the recognition mark 4a. Then, the recognition result is similarly inspected by the print inspection processing unit 16B, and the positional deviation amount from the normal position is fed forward to the downstream apparatus as solder position data together with the pass / fail judgment of the print result. The solder position data is transferred to the communication network 2 via the communication unit 18A, and is fed forward to the electronic component mounting apparatus M4 on the downstream side by the overall control unit 50.

  Next, the board 4 after solder printing is carried into the electronic component mounting apparatus M4, where the electronic component 7 is mounted on the electrode 6 on which the solder paste 5 is printed. At this time, when the electronic component is mounted on the substrate 4 by the mounting head 32, as described above, the mounting is performed based on the mounting position data 36c calculated based on both the electrode position data 36a and the solder position data 36b. The position control of the head 32 is performed.

  A method of calculating the mounting coordinates at this time will be described with reference to FIG. FIG. 8A shows the distance between the barycentric position 6 * of the pair of electrodes 6 obtained in FIGS. 7A and 7B and the barycentric position 5 * of the solder paste 5. When obtaining the coordinates of the mounting position on which the electronic component is mounted, as shown in FIG. 8 (b), the midpoint between the gravity center position 6 * and the gravity center position 5 * is obtained, and this midpoint is used as the mounting point PM. The mounting coordinate values xM (i) and yM (i) shown in FIG. That is, when the electronic component 7 is mounted on the electrode 6, the position of the mounting head 32 is controlled with the mounting point PM calculated in this way as a target.

  By setting the mounting point PM by the method as described above, the following effects can be obtained. That is, in the case where the printing position of the solder paste 5 does not coincide with the position of the electrode 6 and misalignment occurs, when the electronic component 7 is mounted on the basis of the position of the electrode 6 and sent to reflow, “Chip standing” is likely to occur due to uneven surface tension. Further, when the electronic component 7 is mounted on the basis of the detected solder position and sent to the reflow, “bridge” is likely to occur due to the molten solder being sucked to the adjacent electrode.

  On the other hand, by setting the mounting point PM by the above method, it is possible to reduce the probability of mounting defects that are likely to occur in the electrode position reference such as “chip standing” and in the solder position reference such as “bridge”. It is possible to reduce the probability of occurrence of mounting defects that are likely to occur, and to reduce the overall rate of mounting defects.

  In the above embodiment, the mounting point PM is set to the midpoint between the center of gravity position 6 * of the electrode 6 and the center of gravity position 5 * of the solder paste 5. However, the type of substrate, electronic component, and solder paste is shown. Depending on the combination, the mounting point PM may be set to a position biased to either the center of gravity position 6 * of the electrode 6 or the center of gravity position 5 * of the solder paste 5.

  In this case, since the frequency distribution of individual mounting failures varies depending on the combination of the electrode shape of the board, the size and shape of the electronic components, the viscosity of the solder paste, etc., mounting is performed by shifting the mounting point PM in small increments. A trial is performed to obtain a relationship between the position of the mounting point PM and the degree of mounting failure experimentally in advance. The mounting point PM is set at a position where the occurrence of mounting defects as a whole is minimized.

  Thereafter, the substrate 4 on which the electronic component is mounted is carried into the reflow apparatus M6, where the substrate 4 is heated in accordance with a predetermined temperature profile, whereby the solder component in the solder paste 5 is melted, and the electronic component 7 becomes an electrode. 6 is soldered. The substrate 4 after reflow is carried into the mounting state inspection apparatus M7, where the final mounting state of the electronic component is inspected. That is, the presence / absence of the electronic component 7 and the presence / absence of the posture / position are inspected by the appearance inspection. Of the items detected here, those resulting from defective heating conditions in the reflow process are fed back to the reflow device M6, and the control parameters of the heating data storage unit 46 are corrected.

As described above, in the present embodiment, the position of the electrode 6 and the position of the solder paste 5 printed on the electrode 6 are detected, and the position detection result is output as electrode position data and solder position data. 4, the head driving mechanism 33 is controlled based on both the electrode position data and the solder position data. That is, the mounting point PM is set based on the center of gravity position 6 * of the electrode 6 and the center of gravity position 5 * of the solder paste 5 according to the combination of the electrode shape of the substrate, the size / shape of the electronic component, the viscosity of the solder paste, and the like. ing. This reduces the probability of occurrence of specific mounting defects that tend to occur frequently when the mounting point setting is extremely biased to either the electrode position reference or the solder position reference, and keeps the occurrence rate of the overall failure rate low. be able to.

  The electronic component mounting system and the electronic component mounting method of the present invention have the effect of preventing mounting defects due to solder printing misalignment during electronic component mounting, and mounting electronic components on a substrate by solder bonding. It can be used in the field of manufacturing mounting boards.

The block diagram which shows the structure of the electronic component mounting system of one embodiment of this invention The block diagram which shows the structure of the external appearance inspection apparatus of one embodiment of this invention The block diagram which shows the structure of the screen printing apparatus of one embodiment of this invention The block diagram which shows the structure of the electronic component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the reflow apparatus of one embodiment of this invention The block diagram of the control system of the electronic component mounting system of one embodiment of this invention Explanatory drawing of the external appearance inspection of the board | substrate of one embodiment of this invention Explanatory drawing of the position shift detection result in the electronic component mounting method of one embodiment of this invention Process explanatory diagram of conventional electronic component mounting method

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting line 2 Communication network 3 Management computer 4 Board | substrate 36 Mounting data storage part 36a Electrode position data 36b Solder position data 36c Mounting position data 37 Mounting control part 37a Mounting position calculating part M1 Board inspection apparatus M2 Printing apparatus M3 Printing inspection apparatus M4 electronic component mounting device

Claims (2)

  An electronic component mounting system for manufacturing a mounting substrate by mounting electronic components on a substrate by solder bonding, and detecting the positions of electrodes for bonding electronic components formed on the substrate and the positions of solder printed on the electrodes An inspection unit that outputs position detection results as electrode position data and solder position data, and a barycentric position of a pair of electrodes indicated by the electrode position data and a barycenter of solder printed on the pair of electrodes indicated by the solder position data A mounting position calculation unit that performs a calculation to obtain a midpoint of the position, and further sets a position that deviates from the midpoint to either the center of gravity of the electrode or the center of gravity of the solder as a mounting point; and the electronic component A mounting head for holding and transferring and mounting on the substrate, a head driving mechanism for moving the mounting head, and controlling the head driving mechanism to target the mounting point. Electronic component mounting system characterized by comprising a control unit for controlling the position.   An electronic component mounting method for manufacturing a mounting substrate by mounting an electronic component on a substrate by solder bonding, and detecting the position of the electrode for bonding the electronic component formed on the substrate and the position of the solder printed on the electrode Including a position detection step of outputting detection results as electrode position data and solder position data, and a mounting step of picking up an electronic component from a component supply unit by a mounting head and transporting and mounting the electronic component on a printed board. The center of gravity of the pair of electrodes shown in the electrode position data and the center of gravity of the solder printed on the pair of electrodes shown in the solder position data are calculated. The mounting point is set to a position that is biased to either the center of gravity of the electrode or the center of gravity of the solder, and the position of the mounting head is controlled with this mounting point as a target. Electronic component mounting method to be.

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