EP2868775A3 - Galvanisierungsbad und -verfahren - Google Patents
Galvanisierungsbad und -verfahren Download PDFInfo
- Publication number
- EP2868775A3 EP2868775A3 EP14191882.1A EP14191882A EP2868775A3 EP 2868775 A3 EP2868775 A3 EP 2868775A3 EP 14191882 A EP14191882 A EP 14191882A EP 2868775 A3 EP2868775 A3 EP 2868775A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- plating bath
- tin
- combination
- brightening agents
- void formation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/071,677 US20150122661A1 (en) | 2013-11-05 | 2013-11-05 | Plating bath and method |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2868775A2 EP2868775A2 (de) | 2015-05-06 |
EP2868775A3 true EP2868775A3 (de) | 2015-08-12 |
Family
ID=51932182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14191882.1A Withdrawn EP2868775A3 (de) | 2013-11-05 | 2014-11-05 | Galvanisierungsbad und -verfahren |
Country Status (6)
Country | Link |
---|---|
US (1) | US20150122661A1 (de) |
EP (1) | EP2868775A3 (de) |
JP (1) | JP2015092021A (de) |
KR (1) | KR20150051926A (de) |
CN (1) | CN104674312A (de) |
TW (1) | TW201533278A (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5590259B1 (ja) * | 2014-01-28 | 2014-09-17 | 千住金属工業株式会社 | Cu核ボール、はんだペーストおよびはんだ継手 |
EP3417097B1 (de) * | 2016-02-16 | 2021-04-07 | LumiShield Technologies Incorporated | Elektrochemische abscheidung von elementen in wässrigen medien |
US10879156B2 (en) | 2016-03-08 | 2020-12-29 | Washington State University | Mitigation of whisker growth in tin coatings by alloying with indium |
US20170321340A1 (en) * | 2016-03-08 | 2017-11-09 | Washington State University | Method of electroplating tin films with indium using an alkanesulfonic acid based electrolyte |
KR101757192B1 (ko) * | 2016-03-30 | 2017-07-12 | 주식회사 호진플라텍 | 웨이퍼 범프 도금을 위한 주석-은 합금 전기도금액 |
JP6818520B2 (ja) * | 2016-11-11 | 2021-01-20 | ローム・アンド・ハース電子材料株式会社 | 中性スズめっき液を用いたバレルめっきまたは高速回転めっき方法 |
JP6620859B2 (ja) * | 2017-10-24 | 2019-12-18 | 三菱マテリアル株式会社 | 錫又は錫合金めっき堆積層の形成方法 |
US11268203B2 (en) * | 2017-10-24 | 2022-03-08 | Mitsubishi Materials Corporation | Tin or tin alloy plating solution |
JP2021508359A (ja) * | 2017-12-20 | 2021-03-04 | ビーエイエスエフ・ソシエタス・エウロパエアBasf Se | 抑制剤を含むスズまたはスズ合金電気めっき用組成物 |
US20190259722A1 (en) * | 2018-02-21 | 2019-08-22 | Rohm And Haas Electronic Materials Llc | Copper pillars having improved integrity and methods of making the same |
EP3781729A1 (de) | 2018-04-20 | 2021-02-24 | Basf Se | Zusammensetzung zur galvanisierung von zinn oder zinnlegierungen mit einem unterdrückungsmittel |
KR102634250B1 (ko) * | 2018-12-27 | 2024-02-07 | 솔브레인 주식회사 | 도금 조성물 및 솔더 범프 형성 방법 |
WO2021193696A1 (ja) * | 2020-03-27 | 2021-09-30 | 三菱マテリアル株式会社 | 電解めっき液及び電解めっき方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4582576A (en) * | 1985-03-26 | 1986-04-15 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
US5061351A (en) * | 1990-07-23 | 1991-10-29 | Enthone-Omi, Inc. | Bright tin electrodeposition composition |
JP4362568B2 (ja) * | 2000-06-02 | 2009-11-11 | 奥野製薬工業株式会社 | 錫−銅合金電気めっき液 |
US20110189848A1 (en) * | 2008-10-21 | 2011-08-04 | Ingo Ewert | Method to form solder deposits on substrates |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL151449B (nl) * | 1966-09-14 | 1976-11-15 | Philips Nv | Werkwijze voor de bereiding van een zuur bad voor het elektrolytisch neerslaan van tin. |
US4384930A (en) * | 1981-08-21 | 1983-05-24 | Mcgean-Rohco, Inc. | Electroplating baths, additives therefor and methods for the electrodeposition of metals |
US4871429A (en) | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
JPH0233795B2 (ja) * | 1983-05-16 | 1990-07-30 | Matsugiin Rooko Inc | Metsukyokusoseibutsu |
US5174887A (en) | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
JP2001181889A (ja) * | 1999-12-22 | 2001-07-03 | Nippon Macdermid Kk | 光沢錫−銅合金電気めっき浴 |
US6578754B1 (en) * | 2000-04-27 | 2003-06-17 | Advanpack Solutions Pte. Ltd. | Pillar connections for semiconductor chips and method of manufacture |
US6818545B2 (en) | 2001-03-05 | 2004-11-16 | Megic Corporation | Low fabrication cost, fine pitch and high reliability solder bump |
TWI245402B (en) | 2002-01-07 | 2005-12-11 | Megic Corp | Rod soldering structure and manufacturing process thereof |
TWI240979B (en) | 2004-10-28 | 2005-10-01 | Advanced Semiconductor Eng | Bumping process |
KR100921919B1 (ko) | 2007-11-16 | 2009-10-16 | (주)화백엔지니어링 | 반도체 칩에 형성되는 구리기둥-주석범프 및 그의 형성방법 |
JP5554718B2 (ja) * | 2007-12-11 | 2014-07-23 | エンソン インコーポレイテッド | ナノ粒子を含む金属系複合コーティングの電解デポジット |
JP5583894B2 (ja) * | 2008-06-12 | 2014-09-03 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 電気錫めっき液および電気錫めっき方法 |
JP5033979B1 (ja) * | 2011-09-29 | 2012-09-26 | ユケン工業株式会社 | スズからなるめっき用酸性水系組成物 |
US8888984B2 (en) * | 2012-02-09 | 2014-11-18 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
-
2013
- 2013-11-05 US US14/071,677 patent/US20150122661A1/en not_active Abandoned
-
2014
- 2014-11-05 KR KR1020140153138A patent/KR20150051926A/ko not_active Application Discontinuation
- 2014-11-05 TW TW103138319A patent/TW201533278A/zh unknown
- 2014-11-05 CN CN201410858388.9A patent/CN104674312A/zh active Pending
- 2014-11-05 JP JP2014224805A patent/JP2015092021A/ja active Pending
- 2014-11-05 EP EP14191882.1A patent/EP2868775A3/de not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4582576A (en) * | 1985-03-26 | 1986-04-15 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
US5061351A (en) * | 1990-07-23 | 1991-10-29 | Enthone-Omi, Inc. | Bright tin electrodeposition composition |
JP4362568B2 (ja) * | 2000-06-02 | 2009-11-11 | 奥野製薬工業株式会社 | 錫−銅合金電気めっき液 |
US20110189848A1 (en) * | 2008-10-21 | 2011-08-04 | Ingo Ewert | Method to form solder deposits on substrates |
Also Published As
Publication number | Publication date |
---|---|
JP2015092021A (ja) | 2015-05-14 |
TW201533278A (zh) | 2015-09-01 |
CN104674312A (zh) | 2015-06-03 |
US20150122661A1 (en) | 2015-05-07 |
KR20150051926A (ko) | 2015-05-13 |
EP2868775A2 (de) | 2015-05-06 |
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Legal Events
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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Effective date: 20141105 |
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Extension state: BA ME |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: C25D 3/32 20060101AFI20150703BHEP Ipc: C25D 3/60 20060101ALI20150703BHEP Ipc: C25D 7/12 20060101ALI20150703BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Effective date: 20151221 |