EP2735023A1 - Module optoélectronique à optique améliorée - Google Patents

Module optoélectronique à optique améliorée

Info

Publication number
EP2735023A1
EP2735023A1 EP12735783.8A EP12735783A EP2735023A1 EP 2735023 A1 EP2735023 A1 EP 2735023A1 EP 12735783 A EP12735783 A EP 12735783A EP 2735023 A1 EP2735023 A1 EP 2735023A1
Authority
EP
European Patent Office
Prior art keywords
optoelectronic
optics
primary
module
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12735783.8A
Other languages
German (de)
English (en)
Inventor
Susanne SCHAD
Michael Peil
Harald Maiweg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heraeus Noblelight GmbH
Original Assignee
Heraeus Noblelight GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Noblelight GmbH filed Critical Heraeus Noblelight GmbH
Publication of EP2735023A1 publication Critical patent/EP2735023A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B29D11/00807—Producing lenses combined with electronics, e.g. chips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0083—Array of reflectors for a cluster of light sources, e.g. arrangement of multiple light sources in one plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
    • B29K2083/005—LSR, i.e. liquid silicone rubbers, or derivatives thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/52—PV systems with concentrators

Definitions

  • the invention relates to an optoelectronic module, an optoelectronic device, a method for producing an optoelectronic module and a use of an optoelectronic module.
  • Such optoelectronic modules, optoelectronic devices, methods and uses can be used in various ways in the natural sciences, engineering, medicine and daily life.
  • an important field of use, to which the invention is not limited, is the use in the field of process technology, for example for the purpose of drying and / or hardening of materials and / or articles or for the purpose of a photochemical modification of workpieces.
  • optoelectronic modules and optoelectronic devices of the type described below can also be used for example in the field of lighting, for example in traffic engineering and / or in building services.
  • the invention relates to optoelectronic modules which are wholly or partly designed as so-called chip-on-board modules.
  • chip-on-board modules are modules which can be produced in whole or in part by the so-called chip-on-board technology (CoB).
  • Chip-on-board technology one or more bare semiconductor devices (semiconductor chips) are mounted directly on a carrier, such as a printed circuit board or other type of circuit carrier.
  • the term chip-on-board module thus relates to an electronic assembly which includes at least one carrier and at least one unhoused (bare) semiconductor component mounted on the carrier.
  • Such chip-on-board modules are used, for example, as luminous bodies, as high-power lamps (for example as high-power UV LED lamps), as photovoltaic modules, as sensors or in other ways.
  • the proposed optoelectronic modules are optoelectronic chip-on-board modules with a plurality of optoelectronic components.
  • the optoelectronic components used in this case may be, for example, but not exclusively, light-emitting diodes (LEDs) and / or photodiodes, in particular in the form of
  • CONFIRMATION COPY of chips or other components which in the chip-on-board module on a flat support, in particular a metal, ceramic or silicon substrate, a metal core or FR4 circuit board, a glass substrate, a plastic carrier, a metal matrix composite material, or are arranged similar carriers.
  • chip-on-board modules must be protected against mechanical damage and corrosion. For this purpose, the most compact and lightweight solutions are sought.
  • a directional characteristic of the optoelectronic modules plays a decisive role for many applications.
  • a directional characteristic generally describes for optoelectronic components an angular dependence of the strength of received or transmitted waves, which is usually related to a sensitivity and / or intensity in a main direction, that is to say along an optical axis of the optoelectronic components.
  • optoelectronic modules which comprise one or more light-emitting diodes as optoelectronic components, as a rule an irradiation intensity and / or a radiation characteristic of the optoelectronic module plays a decisive role.
  • This radiation characteristic as a special form of the directional characteristic describes in this case the angular dependence of the electromagnetic field and / or the intensity of the emitted electromagnetic waves, in particular in the form of infrared, ultraviolet or visible light.
  • Chip-on-board modules have the advantage that light-emitting diodes can be applied to the carrier in high packing density, which increases the irradiance.
  • an additional optics is used to influence the emission characteristics of the optoelectronic modules.
  • this optics both for light-emitting optoelectronic modules and for photosensitive optoelectronic modules, can be one or more lens systems, for example so-called microlens systems.
  • the lens systems may comprise one or more beam-shaping elements, the lateral extent of which may range from the sub-millimeter range to the decimeter range.
  • the lateral extent of which may range from the sub-millimeter range to the decimeter range.
  • structures in the sub-millimeter range can be present within the optically effective regions.
  • a transparent, UV and temperature-resistant coating of one or more silicones is used.
  • the support to be coated is preheated to a first temperature.
  • a dam is applied, which encloses a surface or partial surface of the carrier to be coated.
  • This dam is wholly or partially composed of a first thermosetting, highly reactive silicone which cures at a first temperature.
  • This first silicone is applied to the preheated carrier.
  • the area enclosed by the dam or surface of the carrier is filled with a liquid second silicone, and the second silicone is cured.
  • fast-curing lenses can be applied to individual components of the carrier. In this way, micro-lens systems are also malleable.
  • the optoelectronic chip-on-board module comprises a planar carrier which is equipped with one or more optoelectronic components and has a transparent, UV-resistant and temperature-resistant coating of a silicone.
  • the method comprises a step of pouring a liquid silicone into an upwardly open mold having external dimensions equal to or exceeding the outer dimensions of the carrier.
  • the carrier is introduced into the mold, with the optoelectronic component or the optoelectronic components completely immersed in the silicone.
  • the Si Ii kon is cured and crosslinked, with the optoelectronic components and the carrier. WEI terhin the carrier with the coating of the cured silicone is removed from the mold.
  • US Pat. No. 7,819,550 B2 discloses an LED array which comprises a lens array for collecting divergent light from each LED.
  • the lenses each include a planar portion and two curved portions. Above the LEDs, the lenses are not curved.
  • US 2007/0045761 A1 discloses a method for producing a white-light LED. It uses an LED that emits blue light and uses phosphors that convert the light. Among other things, the shaping of optics over the light-emitting diodes is described, which are produced by means of a casting process that is atmospherically sealed.
  • US 2010/0065983 A1 also discloses a method for encapsulating light-emitting diodes by means of a compression casting method. In this case, a tape is used to seal during the casting process.
  • High irradiances for example, as a rule irradiances of more than 100 mW / cm 2 , typically 1-20 W / cm 2 , up to 100 W / cm 2 , are usually necessary to high process speeds with the most compact and energy-efficient light sources to reach.
  • an optoelectronic module which at least largely avoids the disadvantages of known methods and which at least largely fulfills the abovementioned requirements.
  • an optoelectronic module is to be provided which, in one embodiment as a light-emitting module, has high efficiency and irradiance, which can be used as a rowable light source and which has an illumination profile with high homogeneity and preferably a sufficiently steep drop in an edge region.
  • an optoelectronic module is proposed.
  • An optoelectronic module is generally understood to mean an assembly which can be handled as a unit and which has at least one optoelectronic component, that is to say, for example, a light-emitting electronic component and / or a light-sensitive electronic component.
  • the optoelectronic module can in particular be designed as an optoelectronic chip-on-board module according to the above-mentioned definition.
  • the optoelectronic module comprises a carrier, which is designed flat.
  • a carrier is generally to be understood as an element which is set up to accommodate one or more electronic, in particular one or more optoelectronic, components.
  • the carrier can be designed according to the type described above with respect to the prior art and can comprise one or more circuit carriers, in particular according to the cited type.
  • a flat configuration is to be understood as an embodiment in which at least one with the optoelectronic component, is provided in particular an unhoused chip, foggable surface, for example, a flat or slightly curved surface, on which one or more optoelectronic components, in particular one or more optoelectronic chips without housing, can be applied.
  • the planar design carrier may be designed completely or partially planar, for example as a printed circuit board.
  • the optoelectronic module comprises a plurality of optoelectronic components arranged on the carrier. These optoelectronic components can be arranged in particular on the carrier in chip-on-board technology. As described above, optoelectronic components are to be understood as meaning components which fulfill at least one optoelectronic function, for example a light-emitting and / or a light-sensitive function. In particular, the optoelectronic components can be selected from the group consisting of light-emitting diodes and photodiodes. The optoelectronic components may in particular comprise one or more inaccurate chips.
  • the plurality of optoelectronic components may in particular comprise an array of optoelectronic components, that is to say an arrangement in which a plurality of optoelectronic components are applied to the carrier in one or more rows.
  • the array may comprise, for example, a rectangular matrix with at least one row and / or at least one column or with a plurality of rows and columns.
  • a row and / or a column is to be understood as a linear arrangement of at least two, preferably at least three, four or more optoelectronic components.
  • the plurality of optoelectronic components can thus preferably have a rectangular matrix of light-emitting diodes and / or photodiodes.
  • other embodiments are also possible in principle, for example embodiments in which the plurality of optoelectronic components is arranged irregularly on the carrier and / or arranged in a non-rectangular matrix on the carrier.
  • the optoelectronic module furthermore has at least one optical system applied to the carrier.
  • the optic may comprise one or more optical elements. In particular, it may be a micro-optics with a plurality of micro-optical elements.
  • the optical elements can generally have lateral dimensions from the sub-millimeter range to the decimeter range.
  • the entire optic which may comprise a plurality of optical elements to a plurality of such optical elements, may have a lateral dimension, such as a diameter or equivalent diameter in a plane of the support, from the sub-millimeter range to the range of one or more several meters point.
  • the optical system has at least one primary optic adjacent to the optoelectronic components and at least one secondary optic.
  • optics is generally understood to mean an element which has a collecting and / or collimating and / or scattering effect on a light bundle.
  • This at least one element of the optics is also referred to as an optical element.
  • an optical system may comprise at least one lens, for example at least one microlens.
  • the lens can generally have lateral dimensions, for example, from the sub-inchimeter range to the decimeter range.
  • the at least one lens may have, for example, at least one converging lens and / or at least one scattering lens and / or at least one reflector, for example a mirror, with a collecting and / or scattering effect.
  • a primary optic is to be understood as an optic which directly adjoins the at least one optoelectronic component on an optical path, so that light emerging from the optoelectronic component enters the primary optic directly, or so that light entering the optical component immediately before entering in the optoelectronic component the primary optics happens.
  • the primary optic may include one or more primary optic elements.
  • the primary optics may have one or more lenses, in particular microlenses, which sit directly on the at least one optoelectronic component or in which the optoelectronic component is completely or partially embedded.
  • the primary optics may have one or more reflectors, at which the light emerging from the optoelectronic component is reflected and thereby focused or scattered, or at which the light entering the optoelectronic component is focused or scattered.
  • the term primary optics thus characterizes at least one beam-shaping element which is adjacent to a light path of the optoelectronic component without further optical components being arranged between the primary optics and the optoelectronic component, the term primary optics being used independently of whether further optics, especially a secondary optic, are present or not.
  • a secondary optic is understood to mean an optic which is arranged in the optoelectronic chip-on-board module such that the light has at least one further optic, ie at least one further optical path, on an optical path between the secondary optics and the at least one optoelectronic component Element, must happen.
  • light emerging from the optoelectronic component can first pass through a primary optic before the light passes through a secondary optic.
  • light entering the optoelectronic component can first pass through the secondary optics, then the primary optics, before the light finally enters the optoelectronic component.
  • the secondary optics may comprise one or more secondary optic elements, for example one or more reflectors and / or one or more lenses.
  • the at least one primary optic can have, for example, at least one lens, in particular a plurality of lenses, in particular microlenses.
  • the optoelectronic chip-on-board module can have a plurality of optoelectronic components which are arranged in a matrix and / or an array, for example a light-emitting diode array and / or a photodiode array.
  • a plurality of elements of a primary optics may be assigned to this plurality of optoelectronic components, for example such that exactly one component of the primary optics and / or one defined group of components is assigned to the primary optics in each case of an optoelectronic component or a group of optoelectronic components.
  • exactly one lens can rest on each optoelectronic component, or a common lens for this group can rest on a group of optoelectronic components, or a group of lenses can be assigned to an optoelectronic component. Examples are explained in more detail below.
  • the at least one secondary optics may have, for example, at least one reflector and / or at least one lens.
  • an assignment of elements of the secondary optics to optoelectronic components can take place, for example, in turn, in that each element or group of elements of an array of the optoelectronic components is assigned one or more elements of the secondary optics.
  • the secondary optics may comprise at least one lens and / or at least one reflector, for example a plurality of concave mirrors, which may for example be arranged in a matrix and / or an array.
  • an optoelectronic component and / or a group of optoelectronic components can be assigned to each concave mirror, for example by the optoelectronic component being arranged wholly or partially within the concave mirror. Examples are explained in more detail below.
  • the primary optic is selected from the group consisting of: a lens system, in particular a microlens system and particularly preferred kart a lens array; a reflector system, in particular a microreflector system and particularly preferably a reflector system having a plurality of recesses with reflective surfaces, wherein in the recesses in each case one or more of the optoelectronic components are introduced.
  • the term "micro" is used for elements which have one or more optically effective regions, for example light-diffracting, scattering, collimating, collecting or diffusing regions whose lateral extent lies in the sub-millimeter range however, the total lateral extent of the elements may be from the sub-millimeter range to the meter range, and in particular the secondary optics may comprise one or more secondary optic elements, which may be selected from the group consisting of a reflector and a lens If a plurality of secondary-optical elements are provided, these can be arranged in particular in an array
  • the term array and the term matrix are used at least largely synonymously in the context of the present invention, at least one secondary-optic element can be an opto-electronic component a group e optoelectronic components assigned.
  • an assignment of an optical element to an optoelectronic component or vice versa is generally understood to mean a spatial arrangement which is such that light emerging from the optoelectronic component passes through the associated optical element or that into the optoelectronic element Component entering light passes before entering the optical element.
  • this assignment can be configured spatially in such a way that the optical element is arranged above or below the associated optoelectronic component.
  • the secondary optics may comprise a secondary optic element which is assigned to a plurality of optoelectronic components, in particular a plurality of optoelectronic components and associated primary optic components.
  • a reflector and / or a lens of secondary optics may be associated with a plurality of optoelectronic components.
  • the optoelectronic module can comprise a plurality of such secondary optical elements, to each of which a plurality of optoelectronic components are assigned. These secondary optic elements may, for example, be arranged in an array.
  • the at least one secondary optical element may comprise a reflector with a recess having reflective surfaces, wherein the at least one optoelectronic component assigned to the secondary optical element is or are completely or partially introduced into the recess.
  • at least one primary optic element associated with the optoelectronic components can be incorporated completely or partially into the recess.
  • the optoelectronic components may each comprise one or more lenses as primary optic elements, wherein the group of optoelectronic components and the associated primary optic elements is incorporated, for example, in the recess of the secondary optic element.
  • Several such secondary optical elements can be provided on the optoelectronic module, for example in the form of an array of a plurality of such depressions.
  • the at least one secondary optic element may comprise a lens.
  • the lens can cover the associated optoelectronic components.
  • at least one of the optoelectronic components associated primary optic element can be covered by the lens.
  • the optoelectronic module can be configured in such a way that the optoelectronic components are arranged in a one-dimensional or two-dimensional array.
  • the optical elements of the primary optics and / or optical elements of the secondary optics can also be arranged in a one-dimensional or two-dimensional array.
  • this array may have the same pitch in one or two dimensions as the array of optoelectronic components.
  • a pitch is understood in one dimension to be a distance between centers of adjacent cells of the array, for example a distance between centers of adjacent optoelectronic components.
  • the pitch of the array of the optical elements of the primary optics and / or the secondary optics can also be in one or two dimensions, for example an integer multiple or an integral divisor of the pitch of the array of the optoelectronic components be.
  • the primary optics may, in particular, have a plurality of primary-optic elements, wherein in each case one opto-electronic component or a group of opto-electronic components of the array is assigned to a primary optic element or a group of primary optic elements.
  • each optoelectronic component can be assigned a primary optic element.
  • the optoelectronic component and the primary optic element may each have an optical axis, wherein the optical axes may be aligned with each other in a manner selected from the group consisting of: the optical axes coincide; the optical axes are shifted parallel to each other; the optical axes are tilted against each other.
  • the alignment of the optical axes may in particular vary within the array, so that, for example, within an array pairs of optoelectronic components and associated primary optic elements are provided, wherein in at least a first pair a first alignment of the optical axes is present and in at least a second pair a second Orientation, which is different from the first orientation.
  • a directional characteristic of the primary-optical elements within the array can be constant or even vary.
  • a directional characteristic can generally be understood to mean an angular dependence of received or transmitted electromagnetic waves, in particular light in the visible and / or infrared and / or ultraviolet spectral range.
  • This angular dependence can relate, for example, to the electromagnetic field of the electromagnetic waves.
  • the angle dependence may also relate, for example, to an intensity and / or an energy density and / or another physical quantity characterizing the strength of the electromagnetic waves.
  • the directional characteristic can be specified, for example, with respect to a strength in a main direction which is, for example, parallel to an optical axis of the optoelectronic component, for example an axis which penetrates a sensitive and / or emitting active surface of the optoelectronic component vertically centered.
  • the directional characteristic may comprise a radiation characteristic if the optoelectronic module comprises one or more optoelectronic components in the form of light-emitting components, for example light-emitting diodes.
  • the emission characteristic can be measured, for example, by means of a corresponding sensor which is arranged at a variable distance at a predetermined distance in front of the optical element and / or the optoelectronic component, wherein measurements of a magnitude of the emission, for example measurements of an intensity, can be made continuously or discontinuously. angles are made. In this way, directivity characteristics can be detected, for example by means of appropriate polar diagrams of the measurements.
  • Such measuring methods are known to those skilled in the field of lighting technology. Basically, the precise configuration of the method used for the present invention is not important, since only a comparison of the directional characteristics of the microlenses.
  • a directional characteristic of an optical element for example a lens, in particular a microlens, can be understood in particular to be a directional characteristic of the optical element in cooperation with an optoelectronic component assigned to the optical element, for example a light emitting diode.
  • the optical elements can each be assigned to one or more optoelectronic components of the plurality of optoelectronic components, so that exactly one lens of the primary optics is arranged, for example, above each optoelectronic component. Accordingly, a directional characteristic of the primary-optic element is then understood to be the directional characteristic of the group, which is composed of the opto-electronic component and the associated primary-optic element.
  • the directional characteristics of the primary optic elements may differ, for example, with respect to an opening angle, for example with regard to an emission angle.
  • an angle of radiation can be understood to mean an angle which is enclosed by the lateral points with half maximum light intensity.
  • other characteristics of the directional characteristic can be used for the comparison of the directional characteristics.
  • the array of primary optic elements may have at least two primary optic elements whose directional characteristics differ from each other.
  • the at least two primary optic elements whose directional characteristics differ from one another may, for example, be arranged in an interior of the array, for example a lens array of the primary optics, and on an edge of the array, for example of the lens array.
  • the primary optics may comprise a lens array and in particular a microlens array in the form of a one-dimensional or two-dimensional matrix of lenses, for example microlenses.
  • lenses arranged on an edge of the lens array may have a different directional characteristic than lenses arranged in an interior of the lens array.
  • this edge can be made from the consist of extreme lenses.
  • the edge may comprise a line or frame of lenses which are arranged on the edge of the lens array.
  • the lenses of the lens array can be configured such that at least two groups of lenses are provided, wherein the lenses of at least one first group have a first directional characteristic and wherein the lenses of the at least one second group have at least one second directional characteristic, wherein the first directional characteristic and the second directional characteristic differ.
  • the lens system can have a stepwise change in the directional characteristics, so that the directional characteristics, for example, change continuously or discontinuously from an interior of the lens system to an edge of the lens system. There may be two or more stages of change.
  • the primary optics has a plurality of reflectors, for example microreflectors, an analog configuration of the directional characteristics is possible.
  • the primary optics in turn, for example, may have at least two reflectors with different directional characteristics.
  • the optoelectronic module can in particular be designed such that the optoelectronic components, in particular an array of the optoelectronic components, are spaced apart from an edge of the carrier by not more than 10 mm, in particular by not more than 5 mm and particularly preferably not more than 3 mm.
  • the same applies to the optical elements of the optics for example for the optical elements of the primary optics and / or the at least one optical element of the secondary optics.
  • These optical elements can also preferably be spaced no more than 10 mm from the edge of the carrier, in particular not more than 5 mm and particularly preferably not more than 3 mm.
  • This spacing makes it possible, for example, to line up a plurality of optoelectronic modules to form an optoelectronic device, for example in one or two dimensions, so that no or only a slight gap arises between the optoelectronic components of adjacent modules at the transition between the optoelectronic modules.
  • an optoelectronic device comprises a plurality inventive optoelectronic modules, which are lined up in one or two spatial directions. For example, this juxtaposition can take place in one plane, so that, for example, the carriers of the optoelectronic modules are arranged in one plane, wherein, for example, a radiation of light can take place in the same emission direction.
  • the optoelectronic device may be wholly or partially designed as a light source. Other embodiments are possible.
  • the optoelectronic device may further comprise one or more additional components, for example a control and / or a housing, wherein the housing, for example, completely or partially encloses the optoelectronic modules.
  • additional components for example a control and / or a housing, wherein the housing, for example, completely or partially encloses the optoelectronic modules.
  • the optics is at least partially produced in such a way, in particular using a casting method, that at least one deformable starting material of the optics is brought into contact, shaped and cured with the optoelectronic components.
  • the at least one primary optics and / or the at least one secondary optics can be wholly or partly produced by means of the at least one deformable starting material.
  • a lens array of the primary optics and / or one or more lenses for example, again a lens array, the secondary optics by means of the deformable starting material.
  • one or more pressureless or pressurized casting methods can be used, in particular by means of at least one mold, which forms the optics, for example the primary optics and / or the secondary optics.
  • one or more plastics which are transparent, for example, and which can be cured, can be used as the deformable starting material. Examples are epoxides and / or silicones. However, other materials are basically used.
  • the proposed method for producing the optoelectronic module basically known methods can be used to produce the optoelectronic module or parts thereof, for example the optics or parts thereof.
  • the methods described above, known from the prior art can be used to produce the primary optics and / or the secondary optics.
  • a method can be used in which first the carrier is preheated to a first temperature. Subsequently, at least one dam made of a first, thermally curing, highly reactive silicone which cures at the first temperature can be applied to the preheated support, the dam completely or partially enclosing a surface or partial surface of the support to be coated. Subsequently, the area enclosed by the dam or surface of the carrier can be completely or partially filled with a liquid second silicone, and the second silicone can be cured.
  • the first silicone and / or the second silicone one, several or all parts of the optics, for example lenses of a lens system of primary optics and / or secondary optics, can be produced. For further embodiments, reference may be made to DE 10 2010 044 470.
  • the optoelectronic module and / or parts thereof for example the optics and in particular the primary optics and / or the secondary optics, can be produced wholly or partly in accordance with the method described in DE 10 2010 044 471.
  • a pouring of a liquid silicone into an upwardly open mold takes place, which, in particular in at least one mold cavity, has external dimensions which correspond to or exceed the external dimensions of the substrate.
  • the carrier can be introduced into the mold, wherein at least one of the optoelectronic components or preferably all of the optoelectronic components are completely immersed in the silicone and a surface of the carrier touches the silicone over the entire surface, or the carrier at least partially immersed in full surface of the silicone.
  • the silicone can be cured and crosslinked, with the optoelectronic components and the carrier.
  • the carrier with the coating of the cured silicone can be removed from the mold.
  • the mold can in particular be designed such that by means of the mold, for example at least one mold cavity of the mold, the optics or parts thereof, in particular the primary optics and / or the secondary optics, is wholly or partly formed from the silicone.
  • a method can be used in which the optics or parts thereof are manufactured such that at least one deformable starting material of the optic, for example at least one silicone, with the optoelectronic components and preferably also the carrier is brought into contact, molded and cured.
  • this method reference may be made to the above description and in particular to the abovementioned prior art.
  • an optoelectronic module according to the invention for an exposure application and / or for a radiation application.
  • this application may be an application for irradiation with ultraviolet and / or visible and / or infrared light.
  • at least one workpiece which may be a starting material and / or an already formed workpiece, is irradiated with electromagnetic radiation emitted by the optoelectronic module.
  • electromagnetic radiation may include, for example, light in the ultraviolet and / or visible and / or infrared spectral range.
  • this irradiation may be for the purpose of drying and / or curing and / or for the purpose of photochemical modification of the workpiece or parts thereof.
  • the proposed method, the optoelectronic chip-on-board module and the optoelectronic device can be used advantageously in numerous ways.
  • irradiation devices with high irradiance in chip-on-board technology can be realized in this way. Due to the typically necessary small distances between the LEDs (so-called pitch), only a few methods are known from the prior art with which any beam-forming microlenses over the individual LEDs of an LED array can be realized by a potting material. Likewise, a targeted influencing by a position-dependent adaptation of a directional characteristic, in particular a radiation characteristic of the individual optical elements, for example, the individual Microlenses and / or micro-optics, in an array arrangement in front of the optoelectronic components, for example in front of the LED emitter, and optionally also virtually impossible in the edge region with previous methods.
  • microlens primary optics and / or microlens secondary optics for LED arrays can be realized, wherein the secondary optics can be optimally matched to the primary optics.
  • the combination of this primary optics approach and one or more secondary optics opens up new concepts for increasing the irradiance at significant working distances of> 10 mm with respect to the light emission window of the LED spotlights.
  • an individual shaping of individual lenses, in particular microlenses, over one, several or all optoelectronic components, in particular the LEDs of an LED array configuration is possible. In this way, for example, a radiation characteristic of an entire LED array can be selectively influenced, for example for the purpose of homogenization and / or beam focusing.
  • the proposed method can be used in particular for the production of optoelectronic chip-on-board modules and systems which have at least one primary optics and at least one secondary optics.
  • the primary optics and / or the secondary optics can be completely or partially produced according to the invention by forming the primary optics and / or the secondary optics in the silicone or the coating.
  • the optical functionality of the package includes only a beam-shaping optical variant, either a reflector realized by a recess into which the LED is placed, or a lens, with the LED typically being placed on a flat substrate ,
  • a further secondary optics (lens or reflector, or a combination of both) on the gehausten LEDs mounted.
  • microreflectors For LED arrays, the use of microreflectors is described, for example, in the above-mentioned US Pat. No. 7,638,808. In this case, a substrate is used which has cavities in which LEDs are used. Side walls of these individual cavities serve as a reflector, which can be customized.
  • concepts can be realized with primary optics and secondary optics, in which one or more secondary optics are used, which further bundle the light, for example, from a plurality of light-emitting diodes each having associated micro-primary optics.
  • These optics can be placed, for example, on LED arrays, segments of LED arrays, photo diode arrays or segments of photodiode arrays, so that, for example, a secondary optics includes a plurality of LEDs of an LED array with micro-optics.
  • the invention can be used in particular in the field of radiation technology and the exposure technique, for example in industrial processes.
  • industrial processes there are a variety of LED exposure and radiation applications, especially in the ultraviolet and infrared spectral range. Numerous examples may be mentioned here, such as, for example, drying of inks, application of irradiation in the field of UV curing, for example, adhesives, inks, paints, varnishes and potting materials, as well as use in exposure applications.
  • the requirements typically applicable for irradiation applications can be realized well.
  • the basic requirements are usually that in the wavelength range used, a high or an adapted to the particular application irradiance is feasible, typically irradiation strengths of some 10 ⁇ W / cm 2 to several tens or a few hundred W / cm 2 at an adjustable distance of typically a few millimeters to a meter or more are feasible.
  • certain light distributions necessary for the respective process should typically be achievable.
  • the light distribution can, for example, a homogeneous field distribution in a particular process window or a be narrow line.
  • current applications in the printing industry include ink jet, sheet offset, screen printing, gravure and flexographic printing.
  • high irradiance levels of 2-20 W / cm 2 at intervals of 20-200 mm are generally required for ultraviolet LED light in the range of 360-420 nm.
  • the minimum requirement for the irradiance required for the respective process is generally also material-dependent.
  • photoinitiators are used, which usually allow a sufficiently rapid reaction to chain the monomers (polymerization) only when a threshold value of the irradiance is exceeded, so that a good curing result is achieved.
  • inhibition by oxygen also plays a part in the polymerization.
  • Efficient and compact spotlights have emission areas of a few cm 2 up to a few hundred cm 2 .
  • typically high packing densities are required which, for example, can be up to 80 pieces per cm 2 for LED chips with areas of 1 mm 2 , but are in particular typically less than 40 per cm 2 and usually up to 25 pieces per cm 2 .
  • optoelectronic chip-on-board modules according to the invention and inventive devices can be used optoelectronic devices with several optoelectronic chip on
  • chip-on-board modules are currently being developed with optoelectronic components in the form of chips with an area of 1, 3x1, 3 mm 2 . Future developments can expect modules with chips up to several mm 2 chip area.
  • Light emitted by light-emitting diodes is generally divergent due to the LED-typical radiation characteristic. Modern LEDs are typically surface emitters that radiate into the half-space and usually have the Abstrahiungs characterizing a Lambertian radiator. This divergent abstraction characteristic results in a strong dependence of the irradiance on the working distance, ie, for example, at a distance between radiating object and the optoelectronic chip-on-board module, in particular the LED spotlight.
  • the emitted light of LEDs in an LED array configuration can be used efficiently and realize a high irradiance even at large working distances.
  • adapted optics can be realized which on the one hand can maximize the coupling out of the light from the optoelectronic chip-on-board modules, in particular the LED chips, and on the other hand can generate a high irradiance and a defined field distribution at a specific working distance.
  • the emitted light can be strongly collimated.
  • the use of primary optics without further optics usually reaches its limits, since the LED can not be regarded as a point light source in the case of microlens optics. This is due in particular to the fact that the size of the lens, which typically has a diameter of 1 to 10 mm, and the size of the LED, which typically has an edge length of 1 mm, are comparable. Therefore, as a rule the light can not be completely collimated, and with increasing col- lection the lens's efficiency decreases due to reflection losses in the lens.
  • At least one additional secondary optics can be realized to achieve high collimation or even focusing of the light and to maximize system efficiency ,
  • At least one secondary optic realized in the form of a reflector optic having at least one reflector or in the form of a combination of at least one reflector optic and at least one lens optic can be realized.
  • the light which can not be directed directly into the irradiation field by the primary optics can be "collected" by the reflector and redirected into an irradiation field, for example that a bilateral adaptation of primary and secondary optics is possible.
  • the optoelectronic chip on-board module according to the invention and / or the system according to the invention can comprise at least one Optics, where a distinction between a primary optics and a secondary optics.
  • the primary optics may comprise a lens array of a transparent potting material, which, for example by means of a method according to the invention, can be applied directly to the carrier equipped with the optoelectronic components, for example the LEDs, so that the primary optics, for example, firmly engage with the LED chips - can be tied.
  • ком ⁇ онент can be used as a starting material for the production of primary optics and / or secondary optics or parts of these optics, for example, for UV LEDs, a UV-stable, thermosetting silicone.
  • other materials for example the use of light-curing acrylates, PMMA, polycarbonate or other materials or of combinations of the stated and / or other materials.
  • optically functional geometries can be realized as optical elements of primary optics and / or secondary optics, for example lens shapes and / or scattering forms. These geometries can be adapted to the radiation intensity profiles that are necessary for the application. Only molds with a significant undercut are usually difficult to realize with casting methods, since these processes are usually casting processes.
  • molds selected from: spherical lens optics, in particular in the form of cylindrical and / or rotationally symmetrical optics, both symmetrical and asymmetrical in shape can be easily implemented and used according to the invention; Aspherical optics, in particular in the form of cylindrical and / or rotationally symmetrical optics, both symmetrical and asymmetric shape; Free-form optics, in particular in the form of cylindrical and / or rotationally symmetrical optics, both symmetrical and asymmetrical in shape; Fresnel optics, in particular in the form of cylindrical and / or rotationally symmetrical optics, both symmetrical and asymmetrical shape; polygonal and / or faceted optics, in particular in the form of cylindrical and / or rotationally symmetrical optics, both symmetrical and asymmetrical shape; rough structures, for example for light scattering or for randomly distributed light diffraction; Structures with a structured surface. Combinations of the mentioned forms and / or other shapes are possible
  • At least one lens can be positioned directly above an optoelectronic component, for example directly above an LED.
  • the lens in contrast to a lens in the usual sense, only one exit side and no inlet side, since that from the LED light can enter directly into the material of the lens. This leads to an increase in the outcoupling efficiency of the light from the LED or from the system, since the light has to pass through an interface less and the refractive index adjustment between LED and potting leads to a reduction of total internal reflection within the LED, but also in comparison to the total reflection at a Pianverguss.
  • a beam shaping adapted to the target specifications can be generated by using a corresponding primary optics and / or secondary optics, so that both an optimization of the geometry of the optics, for example the lens geometry, taking into account the direct steering of Light can be performed in the target irradiation area, as well as in terms of Auskopplungseffizi- enz and also on the adaptation to the properties of a secondary optics.
  • lens surfaces spatially seen very close, for example, at a distance of less than 1 mm, to the optoelectronic components, such as the LEDs are arranged.
  • the light of a large solid angle range, in particular up to a solid angle range of more than 70 °, can be exploited, which can increase efficiency and enable high power densities.
  • the encapsulation or the coating, in particular the silicone encapsulation protects the optoelectronic components, in particular the LEDs, from external influences such as dirt, moisture and mechanical influences.
  • the potting material usually has a higher refractive index than air.
  • this results in a refractive index adaptation between the semiconductor material of the optoelectronic components, in particular of the LED chip, whose refractive index is typically n 3-4, and the potting material. This will be the Improved light extraction from the optoelectronic chip-on-board module and positively influenced the overall efficiency.
  • the primary optic may further include one or more reflectors.
  • the primary optics can have a microreflector array in which, for example, each optoelectronic component, for example each LED, can be arranged in a small cavity whose reflective walls form the microreflector.
  • Array primary optics including, for example, a combination of at least one microlens and at least one microreflector, is also possible.
  • the at least one secondary optics can also be realized, for example, in the form of one or more refractive elements, for example one or more lens elements, and / or in the form of one or more reflective elements.
  • the requirements for the emitted light can also vary. If, for example, an arrangement of substrates or carriers is used in a continuous process, then it is generally important to realize a homogeneous and intensive irradiation intensity transversely to the direction of travel, while in the direction of travel, a maximization of the dose rate to be introduced is generally important.
  • a uniform distribution of the optoelectronic components for example, a uniform LED distribution, usually for the realization of a surface radiator, which is to illuminate a surface homogeneous, be favorable.
  • the primary optics and / or the secondary optics can be realized.
  • distances between the optoelectronic components, for example the LEDs, and / or the microlenses can be realized in one or both spatial directions within an array.
  • a distribution of the optoelectronic components and / or a distribution of the elements of the primary optics and / or secondary optics, for example a microlens distribution are considered and used in the development of an efficient component, for example an efficient LED emitter.
  • a structure size of the primary optics and / or the secondary optics can be variably adjusted, for example to the respective application. Different possibilities can be realized individually or in any combination.
  • the optoelectronic components, for example the LEDs, and components of the primary optics and / or secondary optics, for example the lenses can have comparable structural sizes. This may mean, for example, that each optoelectronic component, for example each LED, has an associated element of primary optics and / or secondary optics, for example an associated lens.
  • the maximum structure size of the elements of the primary optics or the secondary optics is generally limited by the pitch of the optoelectronic components, for example the LEDs.
  • embodiments can also be realized in which the structure size of individual, several or all of the optoelectronic components is smaller than the structure size of the optics, for example the primary optics.
  • embodiments can be realized in which the structure size of the LED is smaller than that of the associated lens. This can then mean, for example, that a lens and / or another component of the primary optics and / or the secondary optics extend over a plurality of optoelectronic components, for example via a plurality of LEDs.
  • the structure size of individual, several or all optoelectronic components is greater than the structure size of the optics, for example, the primary optics and / or the secondary optics.
  • embodiments can be realized in which the structure size of the LED is greater than that of the lens.
  • This can then mean, for example, that several elements of the primary optics and / or the secondary optics, for example a plurality of lenses or a lens array, are located in front of an optoelectronic component, for example in front of an LED.
  • the ratios of the structure sizes of the optoelectronic components and / or the optics can also vary in one or both spatial directions.
  • the conditions in both spatial directions can be the same or different or even change over time.
  • the optics may have scattering, collimating or focusing functions.
  • a lens function of the primary optics can be provided, which is designed to be scattering, collimating or focusing. If only one primary optic is used, then it is generally advantageous if it is designed to be collimating or focusing.
  • a reflector as a secondary optics, however, it may be useful, for example, in terms of efficiency and functionality of the overall system to interpret the primary optics scattering so as to make the best possible use of the reflector.
  • a distance between the optoelectronic component, for example the LED, and the primary optics usually also determines which portion of the light, for example the light emitted by the LEDs, can be influenced by primary optics, in particular the lenses, and how the effect on this light is. The distance can also decide whether the light is scattering or collimating.
  • the distance between the optoelectronic component, such as the LED, and the lens may be the same or vary.
  • an acceptance angle also referred to as numerical aperture NA, may depend on the distance from the lens to the optoelectronic component, for example LED.
  • the distance between the optoelectronic component, for example the LED, and the surface of the primary optics can be relevant.
  • the size of the solid angle in which the primary optics and / or the secondary optics can exert influence on the beam path of the emitted or incident light, for example of the light emitted by the LEDs in the half-space is usually a relevant measure of the efficiency the optics. In order to improve this efficiency, therefore, the available optically effective surface area of the optic should usually be maximized.
  • a measure which can be implemented according to the invention may consist of taking into account rectangular or polygonal basic and sectional surfaces instead of easily formed, round base surfaces and rotationally symmetrical horizontal cutting surfaces. make maximum use of the areas between adjacent optoelectronic components, for example between adjacent LEDs. For an array with the same pitch in both spatial directions, this corresponds, for example, to a square basic form. With maximum utilization of, for example, square footprint, the optically active area can be maximized, which can translate into an increase or even maximization of efficiency.
  • the surface of the primary optics may be smooth, roughened or otherwise structured, wherein in the latter case, for example, the surface may also be provided with Fresnel optics. With a smooth surface, for example, as a rule, the actual lens effect is not influenced. In a targeted shaping, such as collimation, can be achieved with this surface in many cases, the greatest efficiency. With a roughened and / or microstructured structure, an additional scattering effect is usually added to the actual lens effect.
  • lenses are used in optics, for example primary optics, they can be aligned in various ways with the associated optoelectronic components.
  • a lens center of a lens of the primary optics can be aligned centrally or decentrally to an associated optoelectronic component, for example to an LED.
  • Decentration for example in the micrometer range to millimeter range or greater, can be specifically or even slidably shifted for all lenses.
  • a light cone shaped by the primary optics can for example be tilted.
  • a so-called squint effect for increasing the irradiance in the center in front of the LED array can be achieved by, for example, directing the light cones of the LEDs located at the edge to the center by such a relative displacement.
  • a statistically distributed relative shift within an LED array can also be used to homogenize the light.
  • the optics have at least one primary optic and at least one secondary optic.
  • the secondary optics may for example comprise at least one reflector and / or at least one lens, wherein said elements may be arranged individually or in an array.
  • the secondary optics may include, for example, a reflector array and / or a lens array.
  • a reflector array and / or a lens array Especially at long intervals usually contributes to the use of primary optics only the light of a relatively small solid angle range for lighting.
  • the secondary optics the light of an enlarged Solid angle range made available, which can increase the efficiency of the overall system. This allows two effects or a blending effect of both effects to be achieved.
  • the secondary optics a focusing of the light can be significantly improved.
  • the primary optics can also be combined, for example, with at least one reflector and / or at least one further lens array as secondary optics.
  • the secondary optics can also be designed in such a way that they act in one or both spatial directions.
  • this can mean that the secondary optics can be arranged orthogonal to the direction of rotation and can serve to increase the dose rate and the maximum irradiance in the direction of travel.
  • the primary optics in a surface radiator can also be designed as a grid, or be formed in a line emitter as parallel line (reflector) profiles. This may mean that the structure size of the secondary optics can also be variably adjusted.
  • Primary and secondary optics have comparable structure sizes.
  • the structure size of the primary optics is smaller than that of the secondary optics.
  • the structure size of the primary optics is larger than that of the secondary optics.
  • the ratios of the feature sizes in both spatial directions may be the same or different or may change over time.
  • one or more optoelectronic chip-on-board modules and / or their carriers and / or one or more devices according to the invention can also be arranged on one or more heat sinks, or an optoelectronic chip on-board module and / or one Device according to the invention may comprise one or more cooling bodies.
  • one or more chip-on-board substrates with LEDs may be on a heat sink carrier.
  • at least one heat sink can be provided with a potting, so that, for example, all the carriers located thereon can be potted simultaneously.
  • a simultaneous joint encapsulation of several heatsinks, which can act as a module base, is also conceivable.
  • a modularity of the secondary optics can generally also correspond to a modularity of the optoelectronic components, for example a modularity of the LED array, so that, for example, an array of optoelectronic components, for example an LED array, contains a secondary optics module.
  • one or more secondary optics modules may be larger or smaller than an array of the optoelectronic components, for example as an LED array, so that, for example, a secondary optics module has two, three or more arrays of optoelectronic components, for example LEDs, arranged next to each other Arrays, can be positioned.
  • two, three or more secondary optics modules per array of the optoelectronic components, for example per LED array may be required.
  • An optional arrangement of optoelectronic chip-on-board modules and / or carriers of the same, for example in a system according to the invention, and / or a juxtaposition of secondary optics can, based on the distance of the optoelectronic see components, pitch-preserving, that can be arranged directly, or non-pitcherhaltend, so be aligned with spacing.
  • an optoelectronic chip-on-board module or a system for example within an LED emitter, differently shaped secondary optics can be used.
  • reflectors can be used which, for example, reflect the light at an angle to a center in front of the spotlight, for example similar to the "squinting "Primary optics, where the central reflectors can also reflect the light to the center in front of the spotlight.
  • secondary optics can be used, for example at least one reflector, at least one lens or at least one combination of at least one reflector of at least one lens.
  • secondary optics can also be dispensed with entirely depending on position.
  • optoelectronic chip-on-board modules which preferably have at least one primary optic which has only one exit side. Reflection losses at an entrance side can be avoided in this way. Furthermore, a shaping, for example a use of an optical form of a lens can take place, which can reduce reflection losses.
  • a beam shaping adapted to the target specifications can be generated. Due to the possibility of a spatial proximity of the optics to the optoelectronic components, for example the lenses to the LEDs, the light of a large solid angle range can be used.
  • the optoelectronic components for example the LEDs, can receive a protective [010], transparent, UV and temperature-stable encapsulation.
  • a protective [010] transparent, UV and temperature-stable encapsulation.
  • the available light output can continue to be tailored precisely to the respective requirements. be fit. For example, many LEDs can be arranged in a small space, or comparatively fewer LEDs can be arranged in order to generate space for a specific optic.
  • a lens function of the primary optics can be designed to be scattering, collimating or focusing as required.
  • the surface of the primary optics can be designed, for example, smooth, roughened or otherwise structured as needed.
  • a beam cone can be inclined (squint).
  • the efficiency of the optoelectronic chip-on-board module and / or the efficiency of the system can be significantly increased.
  • a "recycling" of divergent light can be achieved in this way, which, for example, enables higher irradiation intensities to be achieved and / or optoelectronic components, in particular LEDs, can be saved.
  • optoelectronic chip-on-board modules can be implemented with one or more one-dimensional or two-dimensional arrays of optoelectronic components, wherein these arrays can be configured identically.
  • optoelectronic chip-on-board modules in particular with identical arrays of the optoelectronic components, can be connected to one another in one or two spatial directions.
  • the identity of the arrays of the optoelectronic components, for example the LED arrays can be advantageous for a simple and cost-efficient production process. Overall, advantages in terms of adaptation to different process geometries can be achieved in this way.
  • FIGS. 1A and 1B embodiments of optoelectronic modules according to the invention
  • FIGS. 2A and 2B show modifications of exemplary embodiments of optoelectronic modules with a primary optics, in which case a plurality of optoelectronic components are assigned to primary-optic elements, again without representation of secondary optics;
  • FIG. 3 shows a further modification of an exemplary embodiment of an optoelectronic module having a plurality of primary optical elements per optoelectronic component, again without depiction of secondary optical elements;
  • FIGS 4A and 4B show different orientations of the primary optic elements
  • Figure 5 shows a possible embodiment of an optoelectronic module with lenticular primary optic elements and a reflector as a secondary optical element;
  • FIG. 6 shows an exemplary embodiment of an optoelectronic module having lenticular primary optic elements and a lenticular secondary optical element
  • FIG. 7 shows an exemplary embodiment of a schematic beam path of the arrangement according to FIG. 5;
  • FIG. 8 shows an exemplary embodiment of an optoelectronic module having lenticular primary optic elements and a plurality of secondary optical elements in the form of reflectors and lens elements; and FIGS. 9 to 11 show various configurations of a surface structure of optical elements in optoelectronic modules according to the invention.
  • FIG. 1 shows a first embodiment of an optoelectronic module is shown in a schematic sectional view from the side. Furthermore, a plurality of the optoelectronic modules 110 shown can be arranged side by side, which is not shown in FIG. 1A, so that an optoelectronic device 112 is produced.
  • the optoelectronic module 1 10 has a carrier 114, which is planar, for example flat, designed.
  • this carrier 114 may comprise a printed circuit board.
  • Optoelectronic components 116 for example light-emitting diodes and / or photodiodes, are applied to the carrier, preferably in a chip-on-board technology. These are preferably arranged in an array 118, for example in a one-dimensional or two-dimensional arrangement.
  • the optoelectronic module 110 has an optical system 120 with a plurality of optical elements 122.
  • the optic 120 comprises a primary optic 124 having a plurality of primary optic elements 126, which are shown in the FIG.
  • the optic 120 includes at least one secondary optic, which is not shown in FIG. 1A.
  • this secondary optics reference may be made by way of example to the exemplary embodiments in FIGS. 5 to 8.
  • the primary-optic elements 126 are applied to the carrier 114, for example, in a casting process as encapsulation. For possible embodiments of this method, reference may be made to the above description.
  • the primary optic elements 126 are configured in the form of an array 130.
  • FIG. 1A shows an exemplary embodiment in which each optoelectronic component 16 is assigned a primary optic element 126.
  • the optoelectronic components 116 and the primary optics 124 have comparable structure sizes, and the arrays 118, 130 preferably have the same pitches, that is, equal distances between the centers of these elements.
  • FIG. 1B shows a modification of the exemplary embodiment according to FIG. 1A.
  • an opto-electronic module 110 is shown, which may be part of an optoelectronic device 12.
  • the optoelectronic module 110 comprises a plurality of optoelectronic components 116 which, for example, can be arranged again in an array 118.
  • the optoelectronic module 110 in turn comprises an optic 120 with a primary optic 124 and a plurality of primary optic elements 126.
  • Primary optic elements 126 include a plurality of reflectors 132, wherein in the illustrated embodiment, the reflectors 132 are configured in the form of recesses with reflective sidewalls. The depressions can be formed, for example, in the carrier 114 and / or in at least one coating applied to the carrier 114.
  • a reflector 132 is assigned to each optoelectronic component 116 in FIG. 1B.
  • the reflectors 132 can thus also be arranged in the form of an array 130.
  • the feature size of the primary optic 124, as in FIG. 1A may be comparable to the size of the optoelectronic components 116.
  • FIG. 1A While in the exemplary embodiments according to FIG. 1A, an assignment takes place in which the structure size of the primary-optic elements 186 and thus the pitch of the arrays 130 are at least Approximately the structure size of the optoelectronic components 1 16 and corresponds to the pitch of the array 118, embodiments are shown in Figures 2A and 2B, in which the structure size of the optoelectronic components 116 is smaller than the respective feature size of the primary optics 126 of a primary optics 124th Die Representation of these exemplary embodiments in FIGS. 2A and 2B otherwise corresponds to the illustration in FIGS. 1A and 1B. In this case, an embodiment is shown in FIG.
  • FIG. 2A in which the array 118 of the optoelectronic components 116 has a constant pitch, wherein three optoelectronic Components 118 in the plane shown in Figure 2A a primary optic element 126 is associated in the form of a lens 128.
  • the pitch of the array 130 of the primary optic elements 126 is thus one third of the pitch of the array 118 of the optoelectronic components 116.
  • the embodiment in FIG. 2A can therefore also be referred to as a pitch-conserving embodiment.
  • FIG. 2B shows a modification of this exemplary embodiment, in which a greater spacing between the optoelectronic components 116 occurs in the middle of the optoelectronic module 110, so that a pitch-varying embodiment can be used here.
  • FIG. 3 shows a further modification of the exemplary embodiment according to FIG. 1A.
  • each optoelectronic component 116 is associated with a plurality of primary optics 126 in the form of lenses 128. Accordingly, the structure size of the optoelectronic components 116, for example of the light-emitting diodes, is greater than that of the lenses 128 of the array 130 of primary optic elements 126.
  • FIGS. 4A and 4B sections of further exemplary embodiments of optoelectronic modules 110 and optoelectronic devices 112 are shown.
  • the exemplary embodiments in FIGS. 4A and 4B show different possibilities of aligning the optoelectronic components 116 relative to the associated primary optic elements 126.
  • each optoelectronic component 116 may be assigned an optical axis 134, and each optical element 126 may be assigned an optical axis 136.
  • FIG. 4A an embodiment is shown in which the optical axes 134, 136 coincide.
  • FIG. 4B shows an embodiment in which the optical axes 134 and 136 are offset from one another. In this case, as shown in Figure 4B, a parallel offset occur.
  • the optical axes 134, 136 but also be tilted to each other.
  • the relative orientation of the optical axes 134, 136 to each other along the arrays 118 and 130 can also be configured varying. Due to the different configuration of the alignment of the optical axes 134, 136, a directional characteristic of the primary optics 124 can also be dependent on a location on the array 130.
  • FIG. 5 shows a first possible exemplary embodiment of an optoelectronic module 110 according to the invention.
  • this optoelectronic module 110 initially comprises a structure analogous to the structure according to FIG. 1A, with a plurality of optoelectronic components 116 and a primary optics 124.
  • Several such optoelectronic modules 110 can in turn be arranged next to one another to form an optoelectronic device 12.
  • This structure can initially be largely referred to the description of the embodiment of FIG 1A.
  • the primary optic 124 has a plurality of primary optic elements 126 in the form of an array 130 of lenses 128.
  • primary optic elements 126 may also be provided in the form of reflectors 132, for example analogous to the exemplary embodiment according to FIG. 1 B.
  • the optics 120 has secondary optics 138 in the exemplary embodiment shown.
  • this secondary optics 138 comprises a secondary-optic element 140 in the form of a reflector 132.
  • FIG. 6 shows an exemplary embodiment of an optoelectronic module 110 or a section of an optoelectronic device 112, which is initially configured with respect to the primary optics 124 analogously to the exemplary embodiment in FIG. 5 or to the exemplary embodiment in FIG. 1A can be.
  • a secondary optic 138 is provided with a secondary optic element 140, however, in contrast to the embodiment according to FIG. 5, the secondary optic element 140 is configured as a plano-convex lens 128 in the exemplary embodiment shown.
  • this secondary optical element 140 in the form of the lens 128 is indicated as a curved line on which the reference line ends. This line represents an interface at which the refraction of light can take place.
  • the material of the lens 128 of the secondary optic element 140 may be above this line.
  • at least one intermediate material may be located between the secondary optic element 140 and the primary optic 124 with the primary optic elements 126, for example selected from air, a liquid, a gas, a solid, a gel with another Index of refraction as the refractive indices of the primary optics 124 and the secondary optics 138, or a combination of the mentioned and / or other materials.
  • another embodiment 1230 is possible in which the secondary optics 138, for example, rests directly on the primary optics 124.
  • the at least one lens 128 of the secondary optics 38 may also comprise a plurality of lenses 128, which in turn may be arranged in an array, for example.
  • the light emanating from the optoelectronic components 116 initially passes, as defined above, the primary optic elements 126 of the primary optics 124, before this light then passes through the secondary optic elements 140.
  • the secondary optics 138 can increase a usable solid angle range. This is illustrated by way of example on a schematically indicated beam path in FIG. 7.
  • FIG. 7 Shown in FIG. 7 are the beams of a light emitted by the optoelectronic components 16. These rays, shown here as an example of a marginal optoelectronic component, first pass through the primary optic
  • first optoelectronic components 16 are again shown, which are applied to the carrier 14 in one or more arrays 1 18.
  • two arrays 1 18 are provided by way of example.
  • another embodiment is possible in principle.
  • first of all each optoelectronic component 165 is assigned a primary optic element 126 in the form of a lens.
  • a secondary optics 138 is provided, which comprises a plurality of secondary optics 140 in the illustrated embodiment.
  • a secondary optical element 140 in the form of a reflector 132 is provided per array.
  • an additional secondary optical element 140 in the form of a lens 128 is provided per array 1 18.
  • an optical path is further shown by way of example.
  • Light rays emitted by the optoelectronic components 16 are first refracted at the primary optic elements 126.
  • these one or two secondary optic ele- For example, by these rays are first reflected at the reflector 132 and then refracted at the lens 128, or by being refracted directly to the lens 128 of the secondary optics 138.
  • bundling in a radiation direction 142 of the optoelectronic module 110 can be achieved for each of the arrays 1 18.
  • these elements 126 and 140 can be designed to be identical or even different.
  • these elements 126, 140 may have a surface structure.
  • Such a surface structure can be produced, for example, by means of a corresponding casting process, for example by using at least one mold which produces this surface structure in the casting process. For example, as stated above, this can be realized in the context of a silicone potting process.
  • FIGS. 9, 10 and 11 show various exemplary embodiments of surface structuring.
  • optoelectronic modules 110 with primary optic elements 126 with respect to the design of such optoelectronic modules 110 reference being made to the above description, for example, of FIG. 1A.
  • the other embodiments of the present invention can in principle be provided on the primary optics 124 and / or the secondary optics 138 with a corresponding surface structuring.
  • FIG. 9 shows an exemplary embodiment in which similar lenses 128 are provided as primary optic elements 126.
  • These lenses 128 may, for example, be of spherical design and, for example, may have a smooth surface.
  • FIG. 10 shows by way of example an exemplary embodiment in which, in turn, primary optic elements 126 in the form of lenses 128 are provided.
  • the lenses 128 do not necessarily have to have a spherical surface and that, for example, non-spherical surfaces with variously curved areas can also occur.
  • primary optic elements 126 and / or secondary optic elements 140 may also include lenses 128 having different curved regions, wherein, for example, a combination of one or more convexly curved regions and one or more concavely curved regions may also be used.
  • all the lenses 128 of the primary optics 124 or of the secondary optics 138 can be designed to be curved in the same way or, as shown by way of example in FIG.
  • FIG. 11 shows, by way of example as a modification of the exemplary embodiment according to FIG. 10, that, in addition to a correspondingly designed surface curvature, surface tanning or surface structuring may also be provided.
  • a roughening of the surface of the lenses 128 of the primary optics 124 and / or the secondary optics 138 may be provided. These roughenings can, for example, provide for scattering effects and / or can help to compensate for inhomogeneities in an irradiation.
  • secondary optics 138 can also be designed with corresponding smooth surfaces, curved surfaces or surfaces provided with a structuring.

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  • Physics & Mathematics (AREA)
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Abstract

L'invention concerne un module optoélectronique (112), en particulier un module optoélectronique de type à montage direct des puces (114). Ledit module optoélectronique (112) comprend un support (116), ledit support (116) étant conçu plan. Ledit module optoélectronique (112) comprend également une pluralité de composants optoélectroniques (118) disposés sur le support (116). Ledit module optoélectronique (110) présente en outre au moins une optique (120) montée sur le support (114), en particulier une micro-optique dotée d'une pluralité d'éléments micro-optiques. Ladite optique (120) présente au moins une optique primaire (124) située à proximité des composants optoélectroniques (116) et une optique secondaire (138).
EP12735783.8A 2011-07-18 2012-07-05 Module optoélectronique à optique améliorée Withdrawn EP2735023A1 (fr)

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DE102011107893A DE102011107893A1 (de) 2011-07-18 2011-07-18 Optoelektronisches Modul mit verbesserter Optik
PCT/EP2012/002819 WO2013010634A1 (fr) 2011-07-18 2012-07-05 Module optoélectronique à optique améliorée

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JP (1) JP6355558B2 (fr)
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CN (1) CN103828042B (fr)
CA (1) CA2842148A1 (fr)
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WO2013010634A1 (fr) 2013-01-24
US9593823B2 (en) 2017-03-14
KR20160130867A (ko) 2016-11-14
CN103828042B (zh) 2018-07-06
CN103828042A (zh) 2014-05-28
KR20140058562A (ko) 2014-05-14
CA2842148A1 (fr) 2013-01-24
JP2014521227A (ja) 2014-08-25
US20150036114A1 (en) 2015-02-05
KR101748106B1 (ko) 2017-06-15
DE102011107893A1 (de) 2013-01-24
JP6355558B2 (ja) 2018-07-11

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