WO2002005351A1 - Source lumineuse del - Google Patents

Source lumineuse del Download PDF

Info

Publication number
WO2002005351A1
WO2002005351A1 PCT/AT2001/000224 AT0100224W WO0205351A1 WO 2002005351 A1 WO2002005351 A1 WO 2002005351A1 AT 0100224 W AT0100224 W AT 0100224W WO 0205351 A1 WO0205351 A1 WO 0205351A1
Authority
WO
WIPO (PCT)
Prior art keywords
reflector
light source
led light
circuit board
source according
Prior art date
Application number
PCT/AT2001/000224
Other languages
German (de)
English (en)
Inventor
Stefan Tasch
Peter Pachler
Hans Christian Hoschopf
Original Assignee
Tridonic Optoelectronics Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tridonic Optoelectronics Gmbh filed Critical Tridonic Optoelectronics Gmbh
Priority to AU2002218796A priority Critical patent/AU2002218796A1/en
Publication of WO2002005351A1 publication Critical patent/WO2002005351A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an LED light source in which a plurality of unhoused LEDs are assembled directly on a printed circuit board, the LEDs are cast using a highly transparent polymer to protect the LEDs from mechanical damage, and in which a reflector is parabolic around each LED is formed, is placed on the circuit board from above.
  • LEDs in chip-on-board technology By processing LEDs in chip-on-board technology (COBT), efficient, bright and small-area lighting units can be manufactured. Due to the high luminous flux values that can be achieved, these are not only interesting as signal and backlighting, but can also be used directly as lamps.
  • LED arrays in COBT technology in which the LEDs are assembled directly on the circuit board without imaging optics, have a wide beam angle, which is determined by the beam characteristics of the LED die.
  • a polymer layer which is applied to protect against mechanical damage to the LED array, this is influenced in accordance with the shape of the protective layer.
  • LED dice in general and those with a transparent substrate in particular have a considerable emission through the side surface of the LED dice. Without imaging optics, this portion of the emitted light is lost, especially as is the case with parallel encapsulation. Therefore, it is also in applications where a broad emission distribution is required, it is advantageous to use imaging optics.
  • An essential aspect of an imaging optical system is therefore that the light which is emitted from the side surfaces which are arranged perpendicular to the printed circuit board is imaged by the imaging optical system in the half space in front of the printed circuit board.
  • Mirrors can be used for this.
  • An LED light source of the type mentioned is known from US-4603496-A. It has an imaging optic that fulfills this aspect.
  • Each LED die is first cast with a protective layer.
  • the diameter of the protective layer is slightly larger than the inner diameter of the reflector, which is then put on.
  • the reflector is therefore not on the circuit board, but on the protective layer.
  • the reflector is poured out and an approximately spherical lens is pressed into this casting compound.
  • the protective layer, casting compound and lens should have a refractive index that is as similar as possible (see column 3, lines 13-16). Thus only the top of the lens is optically active.
  • a disadvantage of this design is that the reflector is placed on the protective layer. If this is not carried out precisely, this affects the position of the reflector, so that the imaging geometry is changed.
  • an LED light source of the type mentioned at the outset in that the diameter of the casting compound is at most equal to the inside diameter of the reflector, so that the reflector lies directly on the printed circuit board, and in that the surface of the casting compound borders on air, the Interface is convex.
  • the reflectors sit directly on the circuit board and are therefore always exactly positioned in the vertical direction.
  • the sealing compound borders on air, so that the surface is a breaking surface. In order to keep losses through reflection low, it should be convex.
  • the circuit board is made of thermally highly conductive material and if the back of the circuit board is coupled to a heat sink.
  • This is known per se from US-5936353-A.
  • the density of the LED dies and the current through them can be chosen to be relatively high. So that no short circuits can occur, it is expedient if the reflector consists of a highly reflective, metallic material which is insulated on the underside, or if the reflector consists of a plastic, the inside of which is mirrored.
  • the arrangement of the optical components can either take place in the immediate vicinity of the LED dice (individual optics), or as a common optic around several LEDs (overall optics). From the point of view of mapping effectiveness, both approaches are comparable.
  • the LEDs are mounted face down and there is a die in each reflector, or else the LEDs are face up mounted and up to 4 dice are arranged in each reflector.
  • a reflector plate which has a large number of parabolically shaped reflectors. This means that not every reflector needs to be positioned individually.
  • Fresnel lenses or Gaussian lenses in the form of a lens plate are positioned centrally over each reflector and glued to the side. This means that the lenses can also be easily installed.
  • the heat sink is thermally coupled on the one hand to transmit the heat to a housing or a light source holder thereon and for the electrical connection.
  • tacting is designed as a thread for screwing into a socket analogous to the incandescent lamp.
  • the LED light source can thus be used directly as a replacement for an incandescent lamp.
  • the cooling takes place via the thread.
  • the LED light source it is possible for the LED light source to be designed as a traffic light module, the LED circuit board being thermally coupled to the traffic light housing and a lens plate being arranged in front of the LED light source. So here the traffic light housing takes over the cooling function.
  • FIG. 1 shows a section through the first embodiment of the present invention
  • FIG. 2 shows a section through a second embodiment of the present invention.
  • LED dice 1 are attached to a conductor track 5.
  • Each LED die 1 is cast in a casting compound 2, which is strongly convex (e.g. hemispherical).
  • a reflector 3 is arranged around each LED die 1 or each potting compound 2, which is seated directly on the base plate body 6 and is therefore precisely positioned.
  • the reflectors 3 can be attached either individually or in assembled matrices.
  • a reflector 3 is placed over each die 1 with an assembly system.
  • the underside of the reflector 3 uss be non-conductive, otherwise a short circuit between the conductor tracks over which the reflector is placed arises.
  • the inside of the reflector should be highly reflective.
  • a plastic mirrored on the inside can be used.
  • an optic array consisting of individual elements, which is positioned exactly above the LED dice 1, is used.
  • the casting compound 2 should have the following properties: highly transparent, softening point> 100 ° C., linear thermal expansion coefficients as low as possible. To achieve good decoupling of the light generated in the LED die, the potting compound must be dome-shaped.
  • a reflector array can be used, which e.g. consists of a thin plastic plate, into which parabolic or funnel-shaped openings with a defined shape and mirrored on the inside are made.
  • a mirror array must be specially matched to the respective LED array and is placed on it in one process step.
  • the reason for this lies in the bond wires, which have a typical length between 0.5 and 2 mm and lead from the electrical contact on the LED die to a conductor track.
  • the diameter: LED radius + 2 x length of the bonding wire must be provided for the reflector. (The LED-Die should sit in the middle of the reflector if possible.)
  • the packing density is significantly loosened compared to the possible density, which is not desirable for many applications. It therefore proves to be advantageous in the case of LED dice, processed by means of die and wire bonding, to use an optical system for several LED dice, since this enables a higher packing density to be achieved (see FIG. 2).
  • a number of between 2 and 5 LED dice is preferably arranged within an optical system. This is also important for traffic light applications.
  • a light pane eg Fresnel lens
  • the LED light source according to the invention has high luminous intensity, defined radiation characteristics and a low overall height
  • At least part of the housing in which the LED array is fastened is preferably used as the heat sink, which is to be used in the case of highly loaded LEDs.
  • this is at least partially metallic.
  • the housing of the reflector can also be used as a heat sink.
  • Certain colors cannot be generated by a single LED due to the fact that LEDs generally only have a narrow-band emission spectrum.
  • Options for realizing white light are e.g. in US-5851905-A, in WO-00/02262-A and in US-5836676-A.
  • the generation of white emissions is particularly important for lighting technology.
  • the color rendering is also of great importance. Since no intrinsically white-emitting LEDs have been able to be produced to date, this color must be produced by a special arrangement or by a special structure, as described as follows:
  • Color conversion by arranging at least one lumino phosphor directly above the LED dice, which absorbs the emission of the dice and subsequently emits photoluminescent light in a different emission color.
  • the luminophore is arranged in layers above the LED array or mixed into the lens. This approach has the disadvantage that the emission color is not constant over the radiation angle, since the path through the color conversion layer changes with the radiation angle. In order to obtain a relatively constant emission color, the path of the emitted light through the color conversion medium must therefore be kept constant. This cannot be done by a layered Medium - as a rule - can be achieved through the shape of the lens, but must be realized through a spherical or elliptical shape.
  • White emission can be generated by mixing the emission colors of suitable differently colored LEDs. This approach is particularly attractive for LEDs, processed in COBT (chip-on-board technology), since the local distances between the LED dice can be selected to be very small. With a view to good color rendering, the color mixture must be generated using red, green and blue emitting LED dice (three-band white). These are arranged in a special ratio on a circuit board, and the emission color to be generated is set by defined setting of the operating conditions for the respective die type.
  • the LEDs are electrically connected in a combined parallel and series connection and operated together with control electronics.
  • the operating voltage of the LED array can be adapted to the available voltage.
  • optimal power efficiencies can be achieved since only low voltages drop on the electronics. This also minimizes the thermal load on the arrangement.
  • these are preferably operated with a current specification. Furthermore, they are provided with reverse polarity protection.
  • a clocked or linear current regulator is preferably provided for the operation of the LEDs. It is expedient if the control electronics are arranged on a separate circuit board and are electrically connected to the LED circuit board.

Abstract

Plusieurs diodes électroluminescentes (DEL) (1) sans boîtier sont assemblées directement sur une carte de circuits imprimés (6). Les DEL (1) sont scellées au moyen d'un polymère hautement transparent (2) afin d'être protégées de tout dommage mécanique. Un réflecteur (3) est posé sur la carte à circuits imprimés (6) autour de chaque DEL (1). Selon l'invention, le diamètre de la masse de scellement (2) est au maximum égale au diamètre interne du réflecteur (3), de telle façon que le réflecteur (3) repose directement sur la carte de circuits imprimés (6) et que la surface de la masse de scellement (2) est conçue sous forme de surface de lentille optiquement active. La carte de circuits imprimés (6) peut être constituée d'un matériau bon conducteur thermique et la face arrière de la carte de circuits imprimés (6) peut être couplée à un corps dissipateur thermique (7) pour que la chaleur de dissipation soit bien évacuée.
PCT/AT2001/000224 2000-07-12 2001-07-06 Source lumineuse del WO2002005351A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002218796A AU2002218796A1 (en) 2000-07-12 2001-07-06 Led light source

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT12042000 2000-07-12
ATA1204/2000 2000-07-12

Publications (1)

Publication Number Publication Date
WO2002005351A1 true WO2002005351A1 (fr) 2002-01-17

Family

ID=3687107

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AT2001/000224 WO2002005351A1 (fr) 2000-07-12 2001-07-06 Source lumineuse del

Country Status (2)

Country Link
AU (1) AU2002218796A1 (fr)
WO (1) WO2002005351A1 (fr)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004032235A2 (fr) * 2002-09-30 2004-04-15 Siemens Aktiengesellschaft Dispositif pour produire un faisceau lumineux
WO2006058481A1 (fr) * 2004-12-02 2006-06-08 Simon Mo Chan Ho Voyant a led et son support, et deux autres voyants a led
WO2006016327A3 (fr) * 2004-08-06 2006-09-08 Philips Intellectual Property Systeme d'eclairage a del
EP1710846A1 (fr) * 2005-04-08 2006-10-11 Sharp Kabushiki Kaisha Diode électroluminescente
EP1767849A1 (fr) * 2005-09-23 2007-03-28 Alcan Technology & Management Ltd. Dispositif d'éclairage
EP1814165A1 (fr) * 2006-01-30 2007-08-01 Shinko Electric Industries Co., Ltd. Dispositif semi-conducteur et procédé de fabrication d'un dispositif semi-conducteur
DE102006004581A1 (de) * 2006-02-01 2007-08-09 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Licht-Modul, Licht-Mehrfachmodul und Verwendung eines Licht-Moduls oder Licht-Mehrfachmoduls zur Beleuchtung oder Hinterleuchtung
DE102008033385A1 (de) * 2008-07-16 2010-02-18 Osram Gesellschaft mit beschränkter Haftung Beleuchtungsvorrichtung und Serie von Beleuchtungsvorrichtungen
DE102011107966A1 (de) 2010-07-30 2012-06-21 Dominant Semiconductors Sdn.Bhd. LED-Leuchtmodul
DE102012006924A1 (de) 2011-04-06 2012-10-11 Tek Beng Low LED-Beleuchtungsmodul mit gleichförmiger Lichtabgabe
WO2013010634A1 (fr) * 2011-07-18 2013-01-24 Heraeus Noblelight Gmbh Module optoélectronique à optique améliorée
US8421088B2 (en) 2007-02-22 2013-04-16 Sharp Kabushiki Kaisha Surface mounting type light emitting diode
DE102012202102A1 (de) * 2012-02-13 2013-08-14 Osram Gmbh Leuchtvorrichtung mit Volumenstrahler-LED-Chips auf einem gemeinsamen Substrat
US8524161B2 (en) 2007-08-31 2013-09-03 Unifrax I Llc Multiple layer substrate support and exhaust gas treatment device
US8604506B2 (en) 2007-02-22 2013-12-10 Sharp Kabushiki Kaisha Surface mounting type light emitting diode and method for manufacturing the same
CN104396012A (zh) * 2012-05-02 2015-03-04 贺利氏特种光源有限责任公司 具有led和圆柱形透镜的发光体

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DE2315709A1 (de) * 1973-03-29 1974-10-10 Licentia Gmbh Strahlung abgebende halbleiteranordnung mit hoher strahlungsleistung
US3875456A (en) * 1972-04-04 1975-04-01 Hitachi Ltd Multi-color semiconductor lamp
JPS55113387A (en) * 1979-02-22 1980-09-01 Sanyo Electric Co Ltd Light emitting diode indicator
EP0127239A1 (fr) * 1983-05-30 1984-12-05 Rtc-Compelec Elément de panneau d'affichage à cristaux semi-conducteurs et panneau comportant ledit élément
JPS6182486A (ja) * 1984-09-29 1986-04-26 Sharp Corp 固体発光表示装置
EP0303741A1 (fr) * 1987-08-12 1989-02-22 Shen-Yuan Chen Dispositif d'affichage à diodes émettrices de lumière formable rapidement et sa méthode de fabrication
GB2276032A (en) * 1993-03-08 1994-09-14 Prp Optoelectronics Limited A Radiation source
WO1997048134A1 (fr) * 1996-06-13 1997-12-18 Gentex Corporation Ensemble d'eclairage comportant des diodes electroluminescentes

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US3875456A (en) * 1972-04-04 1975-04-01 Hitachi Ltd Multi-color semiconductor lamp
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JPS55113387A (en) * 1979-02-22 1980-09-01 Sanyo Electric Co Ltd Light emitting diode indicator
EP0127239A1 (fr) * 1983-05-30 1984-12-05 Rtc-Compelec Elément de panneau d'affichage à cristaux semi-conducteurs et panneau comportant ledit élément
JPS6182486A (ja) * 1984-09-29 1986-04-26 Sharp Corp 固体発光表示装置
EP0303741A1 (fr) * 1987-08-12 1989-02-22 Shen-Yuan Chen Dispositif d'affichage à diodes émettrices de lumière formable rapidement et sa méthode de fabrication
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WO1997048134A1 (fr) * 1996-06-13 1997-12-18 Gentex Corporation Ensemble d'eclairage comportant des diodes electroluminescentes

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Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7312927B2 (en) 2002-09-30 2007-12-25 Siemens Aktiengesellschaft Head-up display
WO2004032235A3 (fr) * 2002-09-30 2004-10-14 Siemens Ag Dispositif pour produire un faisceau lumineux
WO2004032235A2 (fr) * 2002-09-30 2004-04-15 Siemens Aktiengesellschaft Dispositif pour produire un faisceau lumineux
DE10245933B4 (de) * 2002-09-30 2013-10-10 Osram Opto Semiconductors Gmbh Einrichtung zur Erzeugung eines gebündelten Lichtstroms
CN100426503C (zh) * 2002-09-30 2008-10-15 奥斯兰姆奥普托半导体有限责任公司 具有用于产生一个成束光流的装置的仰视显示器
WO2006016327A3 (fr) * 2004-08-06 2006-09-08 Philips Intellectual Property Systeme d'eclairage a del
US7566155B2 (en) 2004-08-06 2009-07-28 Koninklijke Philips Electronics N.V. LED light system
WO2006058481A1 (fr) * 2004-12-02 2006-06-08 Simon Mo Chan Ho Voyant a led et son support, et deux autres voyants a led
EP1710846A1 (fr) * 2005-04-08 2006-10-11 Sharp Kabushiki Kaisha Diode électroluminescente
US7598532B2 (en) 2005-04-08 2009-10-06 Sharp Kabushiki Kaisha Light-emitting diode
JP2006294804A (ja) * 2005-04-08 2006-10-26 Sharp Corp 発光ダイオード
US7964886B2 (en) 2005-04-08 2011-06-21 Sharp Kabushiki Kaisha Light emitting diode
JP4744178B2 (ja) * 2005-04-08 2011-08-10 シャープ株式会社 発光ダイオード
WO2007036301A1 (fr) * 2005-09-23 2007-04-05 Alcan Technology & Management Ltd. Dispositif d'eclairage
EP1767849A1 (fr) * 2005-09-23 2007-03-28 Alcan Technology & Management Ltd. Dispositif d'éclairage
EP1814165A1 (fr) * 2006-01-30 2007-08-01 Shinko Electric Industries Co., Ltd. Dispositif semi-conducteur et procédé de fabrication d'un dispositif semi-conducteur
DE102006004581A1 (de) * 2006-02-01 2007-08-09 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Licht-Modul, Licht-Mehrfachmodul und Verwendung eines Licht-Moduls oder Licht-Mehrfachmoduls zur Beleuchtung oder Hinterleuchtung
US8421088B2 (en) 2007-02-22 2013-04-16 Sharp Kabushiki Kaisha Surface mounting type light emitting diode
US8604506B2 (en) 2007-02-22 2013-12-10 Sharp Kabushiki Kaisha Surface mounting type light emitting diode and method for manufacturing the same
US8524161B2 (en) 2007-08-31 2013-09-03 Unifrax I Llc Multiple layer substrate support and exhaust gas treatment device
DE102008033385A1 (de) * 2008-07-16 2010-02-18 Osram Gesellschaft mit beschränkter Haftung Beleuchtungsvorrichtung und Serie von Beleuchtungsvorrichtungen
DE102011107966A1 (de) 2010-07-30 2012-06-21 Dominant Semiconductors Sdn.Bhd. LED-Leuchtmodul
DE102012006924A1 (de) 2011-04-06 2012-10-11 Tek Beng Low LED-Beleuchtungsmodul mit gleichförmiger Lichtabgabe
WO2013010634A1 (fr) * 2011-07-18 2013-01-24 Heraeus Noblelight Gmbh Module optoélectronique à optique améliorée
DE102011107893A1 (de) * 2011-07-18 2013-01-24 Heraeus Noblelight Gmbh Optoelektronisches Modul mit verbesserter Optik
CN103828042A (zh) * 2011-07-18 2014-05-28 贺利氏特种光源有限责任公司 具有改进的光学系统的光电子模块
US9593823B2 (en) 2011-07-18 2017-03-14 Heraeus Noblelight Gmbh Optoelectronic module with improved optical system
CN103828042B (zh) * 2011-07-18 2018-07-06 贺利氏特种光源有限责任公司 光电子模块及其制造方法和应用、光电子设备
DE102012202102A1 (de) * 2012-02-13 2013-08-14 Osram Gmbh Leuchtvorrichtung mit Volumenstrahler-LED-Chips auf einem gemeinsamen Substrat
CN104396012A (zh) * 2012-05-02 2015-03-04 贺利氏特种光源有限责任公司 具有led和圆柱形透镜的发光体

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