EP2689305A1 - Verfahren zum betrieb eines automatisierungssystems - Google Patents

Verfahren zum betrieb eines automatisierungssystems

Info

Publication number
EP2689305A1
EP2689305A1 EP11723353.6A EP11723353A EP2689305A1 EP 2689305 A1 EP2689305 A1 EP 2689305A1 EP 11723353 A EP11723353 A EP 11723353A EP 2689305 A1 EP2689305 A1 EP 2689305A1
Authority
EP
European Patent Office
Prior art keywords
link
modular
subunits
link device
automatically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11723353.6A
Other languages
German (de)
English (en)
French (fr)
Inventor
Herbert Weiss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP2689305A1 publication Critical patent/EP2689305A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4185—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the network communication
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G05B19/0423—Input/output
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G05B19/0426—Programming the control sequence
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L65/00—Network arrangements, protocols or services for supporting real-time applications in data packet communication
    • H04L65/40—Support for services or applications
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31134—PCD profinet component description, field device description module
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32144—Define device description using dd files

Definitions

  • the invention relates to a method for operating a car ⁇ matleiterssystems, specifically an automation system with IO-Link devices, and a method for handling such IO-Link, in particular in terms of configuration and parameterization.
  • IO-Link Under the registered trademark IO-Link for the PROFIBUS user organization eV, a concept for the uniform connection of sensors and actuators (eg switching devices) to a control level by means of a cost-effective point-to-point connection is known. This communication standard below the fieldbus level enables central fault diagnostics and location up to the sensor / actuator level. As an open interface, IO-Link can be in all common fieldbus and integrated automation ⁇ insurance systems. In the following, the above-mentioned communication system will be briefly referred to as IO-Link.
  • the IO-Link specification (current version: V1.0, 2008/2009) describes how IO-Link devices (IO-Link devices) from different device manufacturers can be connected to a point-to-point connection. According to the specification, parameters, diagnostics, etc. can be transferred from and to a so-called IO-Link master as the higher-level IO-Link unit for these devices.
  • diagnosis means here and below one hand Diagnoseinforma- tion as a result of a review or a status inquiry of each device and also a description ei ⁇ ner nature and / or scope of such a review or status inquiry. But measured values (currents, voltages, Tem ⁇ temperatures, etc.), statistics (operating hours, etc.) logbooks, etc ..
  • IO-Link devices especially the respective parameters, diagnostics, etc.
  • IODD dedicated device description file
  • modular IO-Link devices such as those offered by the applicant, so-called compact starters with the designation "SIRIUS 3RA6" dellieren to mo ⁇ . Only compact IO-Link devices can be described. Modularity information is hidden as it were in device-specific, unused or less relevant parameters or diagnostic information (eg error messages, lifetime, end position, etc.).
  • This restriction modular IO-Link devices can Engineering software (eg SIMATIC Step7) are shown only as a compact device with universal ⁇ seller configuration, diagnostics, etc. in the configuration and diagnostics of an IO-Link. Sol ⁇ che representations are thus often misleading or even wrong. For example, a central collect error LED does not provide information about which of several subunits of a modular IO-Link device is disturbed.
  • a further disadvantage is that always two different development tools are required for the IO-Link engineering, namely a first development tool, eg the applicant's engineering software known under the name STEP7, for the configuration of the IO-Link master in the automation system and a second development tool for the configuration of the IO-Link master itself and the communicatively linked IO-Link devices.
  • a first development tool eg the applicant's engineering software known under the name STEP7
  • STEP7 the configuration of the IO-Link master in the automation system
  • a second development tool for the configuration of the IO-Link master itself and the communicatively linked IO-Link devices.
  • IO-Link devices Configuration of the IO-Link devices in the second development tool by calling the second development tool, eg directly from the first development tool, and by so-called drag & drop of the IO-Link devices into a port configuration included in the second development tool.
  • IO-Link devices if available, can be integrated with a device description file.
  • the configuration of comprehensive subunits "hidden" is entered in the device parameters.
  • the individual modules / devices of the modular IO-Link device - here and below referred to as a subunit or IO-Link SubDevice - can not be selected in the hardware selection catalog.
  • a graphical configuration using drag & drop of the individual subunits is also not possible.
  • the parameters are chert tospei ⁇ in the data management of the first development tool.
  • the device parameters are loaded onto a central unit of an automation device, which then transmits them to the IO-Link master and the IO-Link devices during startup.
  • Diagnosis of the IO-Link system in the first development tool by reading and displaying the system diagnosis Informatio ⁇ nen of all available modules.
  • IO-Link master When IO-Link master is this is the group diagnostic information of the master (which corresponds to the status of a dedicated LED of the IO-Link master) and the diagnostic information of the ports / IO-Link devices. In modular IO-Link devices, these individual diagnostic information can not possibly different sta- ti of the LEDs of the individual IO-Link subdevices; represent (Scheinhei ⁇ th branches).
  • a first task of the approach presented here is to facilitate the handling of modular IO-Link devices and their use in an automation system.
  • a method for operating an automation system wherein the automation system communicatively connected to a higher-level IO-Link unit, eg an IO-Link master, and at least one modular IO-Link device with a device-internal bus and responsive, from the modular IO If the device comprises subunits, it is provided that one of its subunits is selected for communication with the modular IO-Link device and that communication takes place only with it directly and indirectly via this with the other subunits of the modular IO-Link device.
  • a further object of the approach presented here is based on the complexity and complexity of the previously required process steps in the configuration and parametrization of modular IO-Link devices therein, their handling during configuration, parameterization and / or diagnostics.
  • a modular IO-Link device is a "pseudo-modular compact device", i. It includes several modules (IO-Link SubDevices) referred to here as subunits or branches, which are connected via a device-internal bus.
  • IO-Link SubDevices modules
  • subunits or branches which are connected via a device-internal bus.
  • SIRIUS 3RA6 compact starter As an example, reference may be made to the device offered by the applicant under the name "SIRIUS 3RA6 compact starter”. So far, however, the individual subunits are not visible to the outside and can not be directly addressed, namely because they have no address, do not occupy a port in the IO-Link model, do not provide diagnostic information, etc.
  • the following technical features can be used to eliminate the problems outlined above:
  • a first object for representing the modular IO-Link device a first object for representing the modular IO-Link device, a second object for representing ⁇ tion in the modular IO-Link device, the subunits comprehensive or receiving IO-Link module frame, a third object to represent the selected and as an IO-Link head assembly functioning subunit and Minim ⁇ least a fourth object for each additional subunit of the mo ⁇ dularen IO-link device is created.
  • the creation of an object for the representation of the modular IO-Link device and possible further objects takes place with the development tool for an automation ⁇ s istswishing for controlling and / or monitoring a technical process.
  • the automation solution includes the automation system and, to that extent, the IO-Link system as part of the automation system with at least one IO-Link master and a modular IO-Link device as well
  • the solution proposed here is based on the fact that one of the subunits takes over the communication via IO-Link to the outside and thus acts as a proxy for the entire modular IO-Link device.
  • This subunit is referred to below as a head assembly for distinction.
  • the head assembly may be a predetermined subunit, such as a communication module, or any Unterein ⁇ standardize the modular IO-Link device that takes the kommunikati ⁇ ve connect the modular IO-Link device and there ⁇ with works as head assembly. Only this head assembly Need Beer ⁇ Untitled information regarding the internal structure of the IO-Link device. On this basis, the sub-assemblies included in the IO-Link device are addressed by the head assembly through a completely internal mechanism.
  • the presence of the subunits has an effect only on the technological functions of the modular IO-Link device, in that the functions of these subunits (through parameters, diagnostics, process images, etc.) are enabled or otherwise activated.
  • the extended object model on the surface of exactly one development tool allows a modular IO-Link device as a modular device with a majority to be able to handle subunits.
  • all subunits included in the modular IO-Link device can be selected in the device catalog and added to the modular IO-Link device in the device view, eg by drag & drop.
  • a modular IO-Link device will always be modeled by a together ⁇ men
  • the following items a (first) object for an IO-Link device, a (second) object for an IO-Link assembly frame, a ( third) Object for an IO-Link head module and at least one (fourth) object for a subunit of the modular IO-Link device.
  • the following does not always refer to an object as a representative of a physi ⁇ cal unit, so that, for example, instead of per se complete terms such as "object for modeling the IO-Link device” briefly only "IO-Link device” is written. From the context, it follows in each case whether an object as a representative of the physical unit or physi ⁇ cal unit itself is meant.
  • the object for modeling the IO-Link device is the object that is used in a master view (IO-Link master view) for the Display of the IO-Link device is displayed.
  • the object for modeling the IO-Link module frame is a container for the subunits included in the modular IO-Link device, which can thus be configured in the device view of the development tool.
  • the relations of the object for modeling the IO-Link module frame to the or each subunit represent first slot rules, namely slot rules that can already be checked when combining an object for modeling a subunit with the IO-Link subrack.
  • the object for modeling the head module functions as a proxy for a modular IO-Link device. It represents the actual technological functionality of the modular IO-Link device and supports most device properties (device parameters, length of the input and output address, device diagnostics, etc.).
  • a modular IO-Link device is a pseudo modular system, ie it can be configured with Untereinhei ⁇ th. Unlike real modular sys- tems, however, they do not have their own parameters and accordingly no startup data of their own. Instead, a subunit changes the properties of the modular IO-Link device and the characteristics of the modular IO-Link device model ⁇ lierenden object, eg the visibility of parameters. For this, the head module must have information about which subunits are currently configured.
  • the head assembly is the only object for which there is a physical correspondence in each case.
  • the head module represents the modular IO-Link device on the surface of the development tool. Therefore, it is also the object that has a purchase order number (MLFB) of an IO-Link device, for example, and can therefore be generated by the user via the hardware catalog. All other objects (IO-Link module frame, IO-Link device, IO-Link subunit) are then additionally generated implicitly.
  • the parameter setting, diagnostics, address allocation, etc. rele ⁇ vant actions and dialogues are on the head assembly, NaEM ⁇ Lich the head assemblies premises, available.
  • the head module object includes the functionality for integrating one or more subunits and the functionality for connection to the IO-Link master, ie an IO-Link port (node) provided for this purpose.
  • Objects for managing address information (address objects) and the IO-Link port (Node) are standard objects and are generated automatically if the device description contains corresponding attributes, as well as the link to the IO-Link master system.
  • a subunit of a modular IO-Link device does except an icon in the device view and the standard dialogs for project Informa ⁇ tions not have its own surface, no own device parameters and no relations with the IO-Link system.
  • the method is accordingly seen ⁇ seen that when creating an object for a modular IO-Link device automatically an object for the selected and acting as an IO-Link head assembly subunit of modu ⁇ lar IO-Link device and / or an object For the IO-Link module frame of the modular IO-Link device, especially and also automatically an interconnection between these objects is created.
  • ⁇ Text id "TI DS130 BGID DS _032- 125"
  • ⁇ Text id "TI DS130 BGID DS _100- 400"
  • ⁇ Text id "TI DS130 BGID DS _300- 1200"
  • ⁇ Text id "TI DS130 BGID DS _800- 3200"
  • ⁇ Text id "TI DS130 BGID RS_032- 125"
  • ⁇ Text id "TI DS130 BGID RS _100- 400"
  • ⁇ Text id "TI DS130 BGID RS _300-1200"
  • ⁇ Text id "TI DS130 BGID RS _800- 3200"
  • IO-Link device IO-Link module frame
  • IO-Link head module IO-Link subunit
  • Description of the device configuration Number of slots, pluggable device types, etc.
  • slot rules it is possible to cover only so-called hard slot rules, whereby hard in this context means that a selection of an IO-Link subunit and its combination with the modular IO-Link device is prevented from the hardware catalog.
  • SIRIUS_3RA6 unique object number, constant
  • a modular IO-Link device with all its subunits can be displayed in the development tool.
  • the display includes at least one option for diagnosing individual IO-Link subunits with the display of the results of the diagnosis.
  • the representation then includes an indication of a configuration and / or a configuration of the modular IO-Link device with its subunits, in tabular form and / or graphically.
  • the presentation also includes a support of the hardware catalog in the device selection.
  • All IO-Link masters available from the applicant are already included in the hardware selection catalog.
  • a selection of a specific IO-Link master occurs e.g. by dragging and dropping the selected device into the hardware configuration.
  • the parameters of the IO-Link master can then be set in the development tool via a property window of the object representing the IO-Link master.
  • the parameters of the IO-Link device can then be set in the development tool via a property window of the object representing the IO-Link device. 3) Configuration of the IO-Link subunits
  • IO-Link subunits (subdevices, branches) can be selected in the hardware selection catalog.
  • a graphic projek ⁇ tation by dragging and dropping the individual IO-Link subunits is now possible.
  • Modular IO-Link devices are configured in the device view of the hard ⁇ ware configuration. Since the number and type of IO-Link devices and subunits used are known, a start and a length of a data area with I / O addresses can be determined automatically.
  • the parameters of each IO-Link subunit can be set in the development tool via a property window of the object representing the IO-Link subunit.
  • the diagnostic information of all modules is read out and displayed. With diagnostics information retrieved for an IO-Link master, this is the group diagnostics of the master (the diagnostic information corresponds to the status of an LED on the IO-Link master) or diagnostic information regarding the IO-Link devices that can be reached for the IO-Link master.
  • a respective status of the device LEDs with the corresponding covered by the Diagno ⁇ seinformation data corresponds (Group fault, Group warning, etc.).
  • the diagnostic information and status of the on / off ⁇ transitions of the individual subunits are visible.
  • FIG. 2 shows an IO-Link device in one embodiment as a modular IO-Link device
  • FIG. 3 shows a representation of IO-Link devices by a development tool
  • FIG. 4 shows a flow chart for illustrating a method for creating objects in the development tool for IO-Link devices.
  • the automation system 10 includes at least one automation s réelles réelle 14, for example, a programmable Steue ⁇ tion.
  • IO-Link master 16 for connecting sensors and / or actuators via the communication standard known as IO-Link.
  • IO-Link master 16 for connecting sensors and / or actuators via the communication standard known as IO-Link.
  • point-to-point connections are IO-Link Devices 18, 20, 22 connected.
  • IO-Link 20 In at least one of the connected IO-Link 18, 20, 22 is a modular unit IO-Link 20, which - as FIG 2 schematically shows schematically simplified ⁇ - a plurality of IO-Link subunits comprises.
  • the IO-Link device 20 can include one or more IO-Link subunits 24, 26, 28, of which exactly one functions as a head assembly 24.
  • the IO-Link device has 20 slots and within the module frame 30 to each slot, a device-internal bus 32 extends within the IO-Link device 20, so that all of an IO-Link device 20 included Subunits communicatively connected and are specifically available for the head assembly.
  • the IO-Link master 16, the IO-Link devices 18, 20, 22 and the point-to-point connections provided for communicative connection of these units together form the IO-Link system (FIG. 1) in which the IO-Link master 16 acts as the parent unit.
  • one of the subunits 24, 26, 28 of the modular IO-Link device 20 is selected as the head module 24.
  • the communi ⁇ cation to the IO-Link Master 16 is only with this head assembly 24 directly.
  • All subunits 24, 26, 28 encompassed by the modular IO-Link device 20 can be reached indirectly in the IO-Link system via this head assembly 24, namely, starting from the head assembly 24 via the device-internal bus 32.
  • a software development tool 34 (FIG. 1) is used.
  • This software runs on a per ⁇ programming device 36 (FIG 1) or the like are executed, that is, at least temporarily, directly or indirectly, for example via Inter- net, to the automation system 10 can be connected.
  • the programming device 36 eg a personal computer, has for this purpose in a manner known per se a memory 38 and a processing unit in the manner of a microprocessor (not shown).
  • the development tool 34 When the development tool 34 is loaded into the memory 38, it may be executed by the processing unit.
  • FIG. 3 shows a simplified schematic representation to a possible Dar ⁇ position of the IO-Link object model. It is shown that when creating a modular IO-Link device 20 with the development tool 34, a first object 40 for representing the modular IO-Link device 20, a second object 42 for rep ⁇ presentation of in the modular IO-Link device 20, the subunits 24,26, 28 or comprehensive receiving IO-link module frame 30, a third object 44 to repre ⁇ on the selected and as an IO-link head assembly 24 Fungie ⁇ leaders subunit and at least a fourth object 46 for every other subunit 26, 28 of the modular IO-Link Gerä ⁇ tes is applied 20th
  • connection of the modular IO-Link device 20 to the IO-Link system is only via the head module 24, which represents the modular IO-Link device 20 to the outside, namely that for the IO Link head assembly 24 generated third object 44 takes place.
  • a fifth object 48 represents a point-to-point connection between the IO-Link master and the modular IO-Link device 20.
  • the IO-Link master 16 is represented by a sixth object 50.
  • the representation by the development tool 34 and the links underlying the representation of the individual objects causes the communicative accessibility of the IO-Link head module 24 in the IO-Link system and especially by the IO-Link Master 16.
  • a complex IO-Link system A plurality of IO-Link devices 18, 20, 22 and also a plurality of modular IO-Link devices 20.
  • its representation by the development tool 34 refers to a corresponding plurality of the respective ones objects.
  • the object 44 for the IO-Link head assembly 24 and / or the object 42 for the IO-Link assembly frame 30 are created automatically when creating an object 40 for a modular IO-Link device 20.
  • the application of an object 40 for a modular IO-Link device 20 is effected for example by the user of the software tool the respective modular IO-Link device 20 selects a hardware catalog and placed by means of hay ⁇ te conventional control actions as drag and drop, in the automation solution.
  • the software tool 34 in such or another embodiment, not shown separately after it so far is only additional or alternative software ⁇ functionality of the software tool 34th
  • the software tool 34 is provided see that when automatically creating an object 42 for the IO-Link module frame 30, objects 46 are automatically applied to the sub-units 26, 28 that can be accommodated by the IO-Link module frame 30.
  • the functionality of the software tool 34 that automatic connection of the objects 42, 44, 46 automatically takes place between the automatically created objects 42, 44, 46.
  • the far-scale interconnection corresponds to the schematically dargestell- th interconnection in FIG 3, and makes, for example, starting from the Whether ⁇ ject 44 to represent the head assembly 24, the object 42 to represent the IO-Link module frame 30 and ⁇ telbar the objects 40, 46 for representing the modular IO-Link device 20 and / or for representing the subunits 26, 28 that can be accommodated by the IO-Link module frame 30 or can be accommodated by the IO-Link module frame 30.
  • FIG 4 makes this aspect, so the related func- tionality of the software tool 34, a simplified schematic representation of ⁇ significantly hand of a flow chart:
  • objects first function block 52
  • the software tool 34 is checked whether it is at the preferential unit object or the object type selected to create an object is an object 40 representing a modular IO-Link device 20. If this is the case, a branch is made to a second function block 54, with which object 42 is automatically created for the IO-Link module frame 30.
  • the software tool 34 is a software tool 34 in the particular embodiment already described above, it is checked in an optional fourth function block 56 as to what kind of IO-Link module frame 30 for which the object 42 has been created as a representative Then, objects (46) for subunits 26, 28 that can be accommodated by the IO-Link module frame 30 or that can be picked up by the IO-Link module frame 30 are automatically applied (fifth function block 58).
  • the automatically generated objects can be generated with respect to the actually inserted sub-units 26, 28 by, for example, taking over data from the respective device description.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Multimedia (AREA)
  • Programmable Controllers (AREA)
EP11723353.6A 2011-05-13 2011-05-13 Verfahren zum betrieb eines automatisierungssystems Withdrawn EP2689305A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2011/057769 WO2012155949A1 (de) 2011-05-13 2011-05-13 Verfahren zum betrieb eines automatisierungssystems

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EP (1) EP2689305A1 (ko)
KR (1) KR101883731B1 (ko)
CN (1) CN103518164B (ko)
BR (1) BR112013029063B1 (ko)
CA (1) CA2835535C (ko)
WO (1) WO2012155949A1 (ko)

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BR112013029063A2 (pt) 2017-02-07
KR101883731B1 (ko) 2018-08-01
KR20140026556A (ko) 2014-03-05
CA2835535C (en) 2018-12-11
CA2835535A1 (en) 2012-11-22
CN103518164B (zh) 2016-08-17
CN103518164A (zh) 2014-01-15
BR112013029063B1 (pt) 2020-12-22
WO2012155949A1 (de) 2012-11-22

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